Relevant bibliographies by topics / Nanoporous Copper

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Nanoporous Copper'

Author: Grafiati
Published: 28 May 2022
Last updated: 31 July 2025

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Journal articles on the topic "Nanoporous Copper"

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Wang, Xiu Li, and Qiu Ming Gao. "Synthesis of Copper(0) Nanoparticles in Nanoporous Nickel Phosphate VSB-1." Solid State Phenomena 121-123 (March 2007): 479–82. http://dx.doi.org/10.4028/www.scientific.net/ssp.121-123.479.

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Copper(0) nanoparticles in nanoporous nickel phosphate VSB-1 were prepared by the methods of ion exchange and hydrogen reduction. X-ray powder diffraction (XRD) results show that the crystal structure of VSB-1 was well retained after the encapsulation of copper nanoparticles and no apparent evidence of crystalline copper was observed. The Cu 2p core level binding energies were consistent with elemental Cu(0) appear in the X-ray photoelectron spectroscopy (XPS) data. Room temperature ultra violet visible (UV-Vis) absorption spectrum is characteristic of Cu(0) nanoparticles [1, 2]. Nanoporous ma
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Lan, Guo, Zhiqiang Xie, Zhenwei Huang, et al. "Amorphous Alloy: Promising Precursor to Form Nanoflowerpot." Advances in Materials Science and Engineering 2014 (2014): 1–5. http://dx.doi.org/10.1155/2014/263681.

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Nanoporous copper is fabricated by dealloying the amorphous Ti2Cu alloy in 0.03 M HF electrolyte. The pore and ligament sizes of the nanoporous copper can be readily tailored by controlling the dealloying time. The as-prepared nanoporous copper provides fine and uniform nanoflowerpots to grow highly dispersed Au nanoflowers. The blooming Au nanoflowers in the nanoporous copper flowerpots exhibit both high catalytic activity and stability towards the oxidation of glucose, indicating that the amorphous alloys are ideal precursors to form nanoflowerpot which can grow functional nanoflowers.
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Zhang, Wen, Li Jun Li, Gan Jia, et al. "Fabrication of Nanoporous Copper Electrodes for Electrocatalytic Oxidation of Methanol." Advanced Materials Research 705 (June 2013): 60–65. http://dx.doi.org/10.4028/www.scientific.net/amr.705.60.

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Nanoporous copper film (NPCF) electrode was fabricated by applying multicyclic potential scans on a polished copper electrode in an electrolyte composed of ZnCl2 and benzyl alcohol. Scanning electron microscopy (SEM), Energy-dispersive spectroscopy (EDS), Cyclic voltammetry (CV) and chronoamperometric (CA) were employed to characterize copper chloride modified copper electrode. The Eonset on the copper chloride modified nanoporous copper electrode was 0.5038 V, which was 46 mV lower than that on copper chloride modified copper electrode; Epeak on the copper chloride modified nanoporous copper
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Сидоров, А. И., В. А. Санина, О. С. Кудаев та И. Н. Анфимова. "Оптические поглотители для термоэлектрических преобразователей излучения Солнца на основе композитов с наночастицами металлов и полупроводников". Журнал технической физики 128, № 11 (2020): 1747. http://dx.doi.org/10.21883/os.2020.11.50180.103-20.

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Spectra of optical density jf solid and nanoporous glasses with silver nanoparticles, nanoporous glasses with silver and copper nanowires, and nanoporous glasses with silver sulphide and copper oxide nanoparticles are presented..Comparative analysis of the possibility of their application as absorbers of Sun radiation in thermoelectric comverters of Sun energy.is performed.
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Wei, Si Yu, Chang Wei Yao, Lei Wang, and Dong Hui Yang. "Mechanical Response of Nano-Porous Copper under Different Temperature and Strain Rate through Molecular Dynamics Simulations." Materials Science Forum 933 (October 2018): 297–303. http://dx.doi.org/10.4028/www.scientific.net/msf.933.297.

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As a type of nanostructured material with nanosized porosity and ultrahigh specific surface area, nanoporous metals attract much attention in both industrial and theoretical fields. Through molecular dynamics simulations, the strain energy of nanoporous copper is investigated with special consideration on the effect of temperature and strain rate. First, with the variation of temperature and strain rate, the change of both stress and strain energy is plotted. Dislocation movement and structural response of nanoporous copper are explored in different stages of strain. Secondly, yield points und
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Gerke, Sebastian, Xiaoyu Chen, Luca Del Carro, Jonas Zuercher, and Thomas Brunschwiler. "Electromigration in sintered nanoporous copper." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–47. http://dx.doi.org/10.4071/2017dpc-wp1_presentation4.

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The current feed capacity of electrical interconnects is mainly limited by the poor electromigration (EM) resistance of lead free-solder interconnects. Thus, the community investigates alternative interconnect approaches and materials, e.g. all-copper interconnects using copper pastes. EM is an electron scattering based transport of metal atoms, occurring at high current densities, resulting in voids and thus finally leads to an open interconnect. For all-copper interconnects, it is expected that the maximum current density could be increased, while power losses can be mitigated, due to the hi
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Murzin, Serguei P., Alexander A. Igolkin, and Luiza F. Musaakhunova. "Creation of Submicroporous and Nanoporous Structures in Metallic Materials by Laser Thermocycling as Eutectic Is Reached." Advanced Materials Research 1088 (February 2015): 245–49. http://dx.doi.org/10.4028/www.scientific.net/amr.1088.245.

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The possibilities of forming submicroporous and nanoporous structures in metallic materials by laser thermocycling as eutecticis reached were determined. With the implementation of the selected modes of laser treatment on L62 brass samples with a thickness of 50 µm leads to the formation of wrinkled relief, which indicates an increment of alloy volume in this area, that is, a porosity increment in the metallic material. Submicroporous and nanoporous structures are formed in the copper-zinc L62 alloy sample, which appear on the surface of the sample. Nanopores have a shape similar to equiaxial.
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Dan, Zhen Hua, Feng Xiang Qin, and Nobuyoshi Hara. "The Refinement of the Nanoporous Copper by Adding Third Elements." Materials Science Forum 783-786 (May 2014): 1986–89. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.1986.

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Fine nanoporous copper was fabricated from the amorphous Ti-Cu alloys with a minor addition of silver in 10 mM HF solutions. The pore sizes decreased from 100 nm to 12 nm with the increase of the Ag contents in comparison of Ti60Cu40 ribbons free of Ag. With increasing of the dealloying time, the sizes of the nanopores and ligaments increased for the nanostrucutres on Ti60Cu38Ag2 ribbons since the segregation of the Ag phase which triggered the galvanic dissolution of the adjacent Cu matrix in form of micro-couplings to further coarsen the nanoporous Cu. On the contrary, the trace formation of
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Lakiss, L., J. Kecht, V. de Waele, and S. Mintova. "Copper-containing nanoporous films." Superlattices and Microstructures 44, no. 4-5 (2008): 617–25. http://dx.doi.org/10.1016/j.spmi.2007.10.009.

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Ben Mbarek, Wael, Eloi Pineda, Lluïsa Escoda, Joan Suñol, and Mohamed Khitouni. "Dealloying of Cu-Mg-Ca Alloys." Metals 8, no. 11 (2018): 919. http://dx.doi.org/10.3390/met8110919.

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The chemical dealloying of Cu-Mg-Ca alloys in free corrosion conditions was investigated for different alloy compositions and different leaching solutions. For some of the precursor alloys, a continuous, pure fcc copper with nanoporous structure can be obtained by dealloying in 0.04 M H2SO4 solution. Superficial nanoporous copper structures with extremely fine porous size were also obtained by dealloying in pure water and 0.1 M NaOH solutions. The dealloying of both amorphous and partially crystalline alloys was investigated obtaining bi-phase nanoporous/crystal composites with microstructures
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Dissertations / Theses on the topic "Nanoporous Copper"

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Cantrell, Charles (Charles G. ). "Molecular dynamics simulation of mechanical behavior of nanoporous copper foams." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/35073.

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Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.<br>Includes bibliographical references (leaves 43-44).<br>Metallic foams have a variety of unique mechanical properties that make them prime candidates for many different applications. Recent developments in manufacturing have allowed for the creation of nanoporous foams but still relatively little is known about foam behavior on the nano-scale. To determine if macro-scale metallic foam theory scaled appropriately to nanoporous foams, the mechanical behavior of nanoporous copper was simulate
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Liu, W. B., S. C. Zhang, and X. X. Lu. "On the Benign One-Pot Preparation of Nanoporous Copper Thin Films with Bimodal Chan-nel Size Distributions by Chemical Dealloying in an Alkaline Solution." Thesis, Sumy State University, 2013. http://essuir.sumdu.edu.ua/handle/123456789/35204.

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Nanoporous copper (NPC) thin films with bimodal channel size distributions can be benignly fabricated by one-pot chemical dealloying of dual-phase Al 27 at  Cu alloy with hypereutectic structure in the NaOH solution. The microstructure of these NPC thin films was characterized using X-ray diffraction, scanning electron microscopy, energy dispersive X-ray analysis. The results show that these NPC thin films are composed of interconnected large-sized channels (100s of nm) with highly porous channel walls (10s of nm), in which large-sized channels resulting from entire dissolution of solid solut
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Chachay, Lucas. "Elaboration de films de cuivre nanoporeux et thermocompression pour l'assemblage en électronique de puissance." Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALI001.

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Afin de diminuer l’émission de gaz à effet de serre dans le domaine de l’aéronautique, les constructeurs cherchent à électrifier les différentes motorisations utilisées dans les avions, et notamment dans un premier temps les motorisations secondaires (train d’atterrissage, …). Cet objectif nécessite d’augmenter les performances des modules électroniques de puissance, en particulier en améliorant la qualité des assemblages entres les différents composants et substrats.C'est dans ce contexte que se situent ces travaux de thèse. Nous proposons une technique d'assemblage innovante avec des connexi
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Shiue, Wen-Jing, and 薛文菁. "Determination of trace copper by underpotentialdeposition-stripping voltammetry at nanoporous gold electrode." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/66025223582450798875.

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碩士<br>國立成功大學<br>化學系專班<br>95<br>High surface area nanoporous gold electrodes with different roughness factors were prepared by alloy/dealloying process in room temperature ionic liquid. The underpotential deposition of copper ion at such electrode was examined and compared to other kind of gold electrodes. Application of nanoporous gold for the determination of trace copper ion by anodic stripping voltammetry (ASV) and square wave anodic stripping voltametry (SWASV), using underpotential deposition as the deposition step has been examined and optimized. For ASV, the calibration graphs were line
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Lee, Yu-Zhen, and 李宇蓁. "Synthesis and Characterization of Nanoporous Copper Thin Films by Magnetron Sputtering and Subsequent Dealloying." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/6m79zm.

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碩士<br>國立臺灣大學<br>機械工程學研究所<br>107<br>Recently, nanoporous metals (NPMs) have raised increasing attentions due to their high surface, low relative density, excellent electrical and thermal conductivity which broader their applications in many fields such as catalysis, sensing, battery and so on. Up till now, researches upon the synthesis of NPM films via magnetron sputtering mostly focus on noble elements (e.g. Au, Ag, Pd, etc.). In comparison, nanoporous copper (NPC) can attract much more interests because of its huge cost saving in practical use, while maintain high functionality at the meantim
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Lin, Yi-Wen, and 林憶雯. "Fabrication of nanoporous copper by selective dealloying of CuZn surface alloy in room temperature ionic liquids." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/08069054469705792996.

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碩士<br>國立成功大學<br>化學系碩博士班<br>94<br>Formation of porous copper surface by a convenient two-step process involving electrochemical formation of a binary copper-zinc alloy film on copper surface followed by electrochemical etching of the zinc from the alloy. Both of the deposition and dealloying steps were performed in a single bath of low-temperature zinc chloride-1- ethyl-3-methylimidazolium chloride ionic liquid at 120 oC without using any other corrosive acids or bases. The effects of the deposited zinc quantity, deposition potential, current, and temperature on the structures, morphologies and
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Su, Yan-Rung, та 蘇彥融. "Effect of Intermetallic Compound on Synthesis of Nanoporous Structure with the Focus on θ and η Phases of Copper-Aluminum Alloy". Thesis, 2019. http://ndltd.ncl.edu.tw/handle/4jwjr5.

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碩士<br>國立臺灣大學<br>機械工程學研究所<br>107<br>In this study, nanoporous copper with ligament sizes ranging from 29 to 174 nm was successfully synthesized by dealloying Cu18Al82, Cu30Al70, Cu33Al67, and Cu37Al63 alloys. The purpose of this study is to investigate the effect of the intermetallic compound on the synthesis of nanoporous structure, and the θ and η phases of copper-aluminum alloy are focused. Nanoporous copper has the advantages of light in weight, high surface area, good electrical and thermal conductivity, and wonderful electrochemical stability. It can be applied in sensing, catalyst, lith
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Lin, Bo-Tsuen, and 林柏村. "Application of Self-Assembled Monolayer of (3-Mercaptopropyl) sulfonate on Nanoporous Gold for the Sensitive Electrochemical Detection of Copper via Anodic Stripping of Underpotential Deposited." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/36665927633646704850.

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碩士<br>國立中興大學<br>化學系所<br>97<br>It has described a new alternative mercury-free electrode material, nano- porous gold (NPG), was applied to improve the performance for detectionof trace metal in stripping voltammetry . The NPG electrode was obtained by the dealloying of Zn from AuxZn1-x in a 40-60 mol % zinc chloride -l-ethyl-3-methylimidazolium chloride(ZnCl2-EMIC) ionic liquid. To prevent electrode fouling from surfactant adsorption, the short carbon -chain organ- othiol molecule, (3-Mercaptopropyl)sulfonate (MPS), was selected to mod- ify on NPG electrode through the formation of self-assembl
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Das, Mahua. "Thin Films Of A Carbonaceous Copper Oxide, Li Doped Cobalt Oxide And Li At Nanometric Dimension : Synthesis Through CVD, Solgel And Electromagnetic Irradiation And Characterisation." Thesis, 2007. https://etd.iisc.ac.in/handle/2005/619.

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Thin film nanostructures may be defined as assemblies, arrays, or randomly distributed nanoparticles, nanowires, or nanotubes, which together form a layer of materials supported on a substrate surface. Because such nanostructures are supported on a substrate surface, their potential applications cover a wide area in optical, magnetic, electrochemical, electromagnetic, and optoelectronic devices. The focus of the present thesis is the development of methodologies to grow certain thin film nanostructures of some transition metal oxides (TMOs), including copper oxides and LixCoO2, through CVD,
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Das, Mahua. "Thin Films Of A Carbonaceous Copper Oxide, Li Doped Cobalt Oxide And Li At Nanometric Dimension : Synthesis Through CVD, Solgel And Electromagnetic Irradiation And Characterisation." Thesis, 2007. http://hdl.handle.net/2005/619.

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Thin film nanostructures may be defined as assemblies, arrays, or randomly distributed nanoparticles, nanowires, or nanotubes, which together form a layer of materials supported on a substrate surface. Because such nanostructures are supported on a substrate surface, their potential applications cover a wide area in optical, magnetic, electrochemical, electromagnetic, and optoelectronic devices. The focus of the present thesis is the development of methodologies to grow certain thin film nanostructures of some transition metal oxides (TMOs), including copper oxides and LixCoO2, through CVD, s
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Book chapters on the topic "Nanoporous Copper"

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Huang, Xiaoming, Tamás I. Korányi, and Emiel J. M. Hensen. "Lignin Depolymerization Over Porous Copper-Based Mixed-Oxide Catalysts in Supercritical Ethanol." In Nanoporous Catalysts for Biomass Conversion. John Wiley & Sons, Ltd, 2017. http://dx.doi.org/10.1002/9781119128113.ch10.

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Wang, Xiu Li, and Qiu Ming Gao. "Synthesis of Copper(0) Nanoparticles in Nanoporous Nickel Phosphate VSB-1." In Solid State Phenomena. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-30-2.479.

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Wang, Jinyi, Yi Yang, Mingrui Zhang, and Sen Yang. "Microstructure Evolution of Nanoporous Copper Fabricated by Electrochemical Dealloying Mn–Cu Alloy." In Advanced Functional Materials. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-0110-0_99.

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Yan, Mei. "Nanoporous Copper Metal Catalyst in Click Chemistry: Nanoporosity Dependent Activity Without Supports and Bases." In Development of New Catalytic Performance of Nanoporous Metals for Organic Reactions. Springer Japan, 2014. http://dx.doi.org/10.1007/978-4-431-54931-4_2.

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Ma, Hailan, Bingge Zhao, Kai Ding, and Yulai Gao. "Fabrication of Bilayer Nanoporous Copper from Rapidly Solidified Al70Cu30 Ribbons by Chemical Dealloying Technique." In TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-36296-6_142.

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Wang, Shujuan, Xingli Zou, Xueliang Xie, et al. "Electrochemical Fabrication of Micro/Nanoporous Copper by Electrosynthesis-Dealloying of Cu–Zn Alloy in Deep Eutectic Solvent." In TMS 2018 147th Annual Meeting & Exhibition Supplemental Proceedings. Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-72526-0_2.

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Petranovskii, Vitalii, and Nina Bogdanchikova. "Reduction of binary silver–copper ion mixture in mordenite: an example of synergetic behavior." In Nanoporous Materials III, Proceedings of the 3rdInternational Symposium on Nanoporous Materials. Elsevier, 2002. http://dx.doi.org/10.1016/s0167-2991(02)80591-2.

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Dan, Zhenhua, Fengxiang Qin, Izumi Muto, Nobuyoshi Hara, and Hui Chang. "Elaboration of Nanoporous Copper via Chemical Composition Design of Amorphous Precursor Alloys." In New Uses of Micro and Nanomaterials. InTech, 2018. http://dx.doi.org/10.5772/intechopen.77222.

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Conference papers on the topic "Nanoporous Copper"

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Barako, Michael T., Jeffrey M. Weisse, Shilpi Roy, et al. "Thermal conduction in nanoporous copper inverse opal films." In 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2014. http://dx.doi.org/10.1109/itherm.2014.6892354.

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Li, Chao, Xiaogang Liu, Kecheng Li, and Mingxiang Chen. "Research on low temperature bonding using nanoporous copper." In 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2015. http://dx.doi.org/10.1109/icept.2015.7236754.

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Tegg, Levi, Jiangtao Qu, and Julie M. Cairney. "Morphology, Composition, and Surface Plasmons of Dealloyed Nanoporous Copper." In 13th Asia Pacific Microscopy Congress 2025. ScienceOpen, 2025. https://doi.org/10.14293/apmc13-2025-0264.

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Yide, Kan, Zhong Minlin, Liu Wenjin, et al. "Nanostructural features in nanoporous copper coatings fabricated by laser deposition." In ICALEO® 2008: 27th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Laser Institute of America, 2008. http://dx.doi.org/10.2351/1.5061415.

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Li, Kecheng, Xiaogang Liu, Mingxiang Chen, and Sheng Liu. "Preparation and performances of nanoporous copper for low temperature bonding." In 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM). IEEE, 2014. http://dx.doi.org/10.1109/isaf.2014.6917803.

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Li, Kecheng, Xiaogang Liu, Mingxiang Chen, and Sheng Liu. "Preparation and performances of nanoporous copper for low temperature bonding." In 2014 15th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2014. http://dx.doi.org/10.1109/icept.2014.6922561.

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Liu, Luyang, Natalya Kublik, Bruno Azeredo, and Xiangfan Chen. "Rapid 3D Printing of Nanoporous Copper Powders via Micro-Clip." In ASME 2023 18th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2023. http://dx.doi.org/10.1115/msec2023-104610.

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Abstract Three-dimensional (3D) printing of metal components through powder bed fusion, material extrusion, and vat photopolymerization, has attracted interest continuously. Particularly, extrusion-based and photopolymerization-based processes employ metal particle-reinforced polymer matrix composites (PMCs) as raw materials. However, the resolution for extrusion-based printing is limited by the speed-accuracy tradeoff. In contrast, photopolymerization-based processes can significantly improve the printing resolution, but the filler loading of the PMC is typically low due to the critical requi
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Amaya, Miguel, Sang M. Kwark, Ajay Gurung, and Seung M. You. "Pool Boiling Heat Transfer of Borated (H3BO3) Water on a Nanoporous Surface." In ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/mnhmt2012-75041.

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With regard to potential application in pressurized water reactors (PWRs), a nanoporous heated surface was tested in pool boiling of an aqueous solution of boric acid (H3BO3), or borated water (1% volume concentration). The effect of different system pressures and different surface orientations on pool boiling heat transfer was studied. The nanoporous surface consisted of a coating of alumina nanoparticles applied on a 1 cm2 flat copper surface through nanofluid boiling. An uncoated surface in borated water was similarly tested, and due to boric acid deposition, the boiling heat transfer (BHT)
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Li, Kecheng, Xiaogang Liu, Mingxiang Chen, and Sheng Liu. "Research on nano-thermocompression bonding process using nanoporous copper as bonding layer." In 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM). IEEE, 2014. http://dx.doi.org/10.1109/isaf.2014.6917804.

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Li, Kecheng, Xiaogang Liu, Mingxiang Chen, and Sheng Liu. "Research on nano-thermocompression bonding process using nanoporous copper as bonding layer." In 2014 15th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2014. http://dx.doi.org/10.1109/icept.2014.6922562.

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