Academic literature on the topic 'Nickel Reactive Inks'

Direct-write methods, such as the Aerosol Jet® technology, have enabled fabrication of flexible multifunctional 3-D devices by printing electronic circuits on thermoplastic and thermoset polymer materials. Conductive traces printed by additive manufacturing typically start in the form of liquid metal nanoparticle inks. To produce functional circuits, the printed metal nanoparticle ink material must be postprocessed to form conductive metal by sintering at elevated temperature. Metal nanoparticles are widely used in conductive inks because they can be sintered at relatively low temperatures compared with the melting temperature of bulk metal. This is desirable for fabricating circuits on low-cost plastic substrates. To minimize thermal damage to the plastics, while effectively sintering the metal nanoparticle inks, we describe a laser sintering process that generates a localized heat-affected zone (HAZ) when scanning over a printed feature. For sintering metal nanoparticles that are reactive to oxygen, an inert or reducing gas shroud is applied around the laser spot to shield the HAZ from ambient oxygen. With the shroud gas-shielded laser, oxygen-sensitive nanoparticles, such as those made of copper and nickel, can be successfully sintered in open air. With very short heating time and small HAZ, the localized peak sintering temperature can be substantially higher than that of damage threshold for the underlying substrate, for effective metallization of nanoparticle inks. Here, we demonstrate capabilities for producing conductive tracks of silver, copper, and copper–nickel alloys on flexible films as well as fabricating functional thermocouples and strain gauge sensors, with printed metal nanoparticle inks sintered by shroud-gas-shielded laser.

Background: Nickel (Ni) is mostly applied in a number of industrial areas such as printing inks, welding, alloys, electronics and electrical professions. Occupational or environmental exposure to nickel may lead to cancer, allergy reaction, nephrotoxicity, hepatotoxicity, neurotoxicity, as well as cell damage, apoptosis and oxidative stress. Methods: In here, we focused on published studies about cell death, carcinogenicity, allergy reactions and neurotoxicity, and promising agents for the prevention and treatment of the toxicity by Ni. Results: Our review showed that in the last few years, more researches have focused on reactive oxygen species formation, oxidative stress, DNA damages, apoptosis, interaction with involving receptors in allergy and mitochondrial damages in neuron induced by Ni. Conclusion: The collected data in this paper provide useful information about the main toxicities induced by Ni, also, their fundamental mechanisms, and how to discover new ameliorative agents for prevention and treatment by reviewing agents with protective and therapeutic consequences on Ni induced toxicity.

One of the newer tendencies in materials science has been to tailor-make classical products (long associated with old applications) with controlled properties for special uses, especially in high technology. Preparing dispersed systems in which all particles have nearly uniform size (monodisperse solids) is a typical example. This goal can be achieved in some cases through cleverly controlled particle growth from a liquid medium. Examples of such preparations include gold colloids prepared by Zsigmondy and later by Turkevich et al., sulfur sols obtained by LaMer, metal oxides and hydrous oxides prepared by Matijević et al., silica, etc. These dispersions have been used either to check theories of colloid science, or to a lesser extent, for industrial purposes. In the case of fine metal particles, a uniform size distribution associated with a low degree of agglomeration, and sometimes the spherical shape, appear as particularly convenient characteristics for certain applications. The production of conductive inks or pastes for electronic materials and for the preparation of conductive paints are particularly good examples.In so-called thick film technology, conductive inks and pastes are screen printed on a ceramic substrate in order to form, after firing, a conductive film with a thickness less than 10 μm. This technique is, for instance, used to form the network in hybrid integrated circuits or the internal electrodes of multilayer ceramic capacitors.Metallic powders in thick film compositions are usually precious metals (Au, Ag, Pt, Pd), their mixtures, or alloys. Cheaper metals such as copper or nickel are tested and may be potential substitutes for precious metals in different specific applications. Powders for thick film composition are mainly obtained through chemical precipitation from aqueous or organic solutions, which yield high purity powders. Modification of precipitation parameters (such as the nature and the concentration of the starting metallic compound and of the reducing agent, reaction temperature, viscosity of the medium) and the addition of additives and surfactants, can often be used to control particle size and agglomeration.Over the past few years, we have developed a new process for preparing finely divided metal powders of easily reducible metals (such as precious metals and copper) or less reducible metals (such as cobalt, nickel, cadmium, or lead) by precipitation in liquid polyols. This reaction will be used as an example in order to discuss the mechanism of formation of uniform micrometer and submicrometer size metal particles by precipitation reactions.

L’objectif de cette thèse est d’étudier les phases formées lors de la réaction à l’état solide entre un film de Ni et un substrat semi-conducteur de type III-V, par diffusion réactive. A terme, il s’agit de comprendre et prédire les phénomènes mis en jeu dans le contact Ni/In0.53Ga0.47As. En effet, ce dernier présente un intérêt technologique pour la nanoélectronique car In0.53Ga0.47As peut se substituer avantageusement au Si. Pour cela, nous avons étudié la nature et la séquence des phases formées pour les deux systèmes Ni/GaAs et Ni/InAs où Ni est déposé par pulvérisation cathodique. Les phases Ni3GaAs et Ni3InAs sont les premières phases formées, elles sont en épitaxie avec le substrat et ont la même structure hexagonale. Les résultats obtenus montrent que la couche de Ni est en épitaxie avec le substrat GaAs pour de faibles épaisseurs déposées ce qui diffère des plus grandes épaisseurs. Par ailleurs la texture de la phase de Ni3GaAs est différente de la phase Ni3InAs. A haute température (au-delà de 400°C), nous observons pour les deux systèmes la présence des nouvelles phases. Celles-ci sont de structures hexagonale et cubique pour le système Ni/InAs. Nous avons pu aussi observer dans ce travail la cinétique de formation de ces phases Ni3GaAs et Ni3InAs en film mince et conclure que la cinétique de formation de la phase Ni3InAs est plus lente que celle de la phase Ni3GaAs
The aim of this thesis is to study the phases formed during the solid-state reaction between a Ni film and an III-V type semiconductor substrate by reactive-diffusion, in order to understand and predict the phenomena involved in the Ni / In0.53Ga0.47As contact. Indeed, this compound present a technological interest for nanoelectronics because In0.53Ga0.47As can advantageously be substituted for Si. For this, we have studied the nature and the sequence of the phases formed for the two systems Ni / GaAs and Ni / InAs. Where Ni is deposited by sputtering. The Ni3GaAs and Ni3InAs phases are the first phases formed; they are in epitaxy with the substrate and have the same hexagonal structure. The results obtained show that the Ni layer is epitaxial with the GaAs substrate for low-deposited thicknesses, which differs from the greater thicknesses. Moreover, the texture of the Ni3GaAs phase is different from the Ni3InAs phase. At high temperatures (above 400 ° C), we observe for both systems the presence of new phases. These are hexagonal and cubic structures for the Ni / InAs system. We have also observed in this work the formation kinetics of these phases Ni3GaAs and Ni3InAs in thin film. Moreover, conclude that the formation kinetics of the Ni3InAs phase is slower than that of the Ni3GaAs phase

abstract: Reactive inkjet printing (RIJP) is a direct-write deposition technique that synthesizes and patterns functional materials simultaneously. It is a route to cheap fabrication of highly conductive features on a versatile range of substrates. Silver reactive inks have become a staple of conductive inkjet printing for application in printed and flexible electronics, photovoltaic metallization, and more. However, the high cost of silver makes these less effective for disposable and low-cost applications. This work aimed to develop a particle-free formulation for a nickel reactive ink capable of metallizing highly pure nickel at temperatures under 100 °C to facilitate printing on substrates like paper or plastic. Nickel offers a significantly cheaper alternative to silver at slightly reduced bulk conductivity. To meet these aims, three archetypes of inks were formulated. First were a set of glycerol-based inks temperature ink containing nickel acetate, hydrazine, and ammonia in a mixture of water and glycerol. This ink reduced between 115 – 200 °C to produce slightly oxidized deposits of nickel with carbon content around 10 wt %. The high temperature was addressed in a second series, which replaced glycerol with lower boiling glycols and added sodium hydroxide as a strong base to enhance thermodynamics and kinetics of reduction. These inks reduced between 60 and 100 °C but sodium salts contaminated the final deposits. In a third set of inks, sodium hydroxide was replaced with tetramethylammonium hydroxide (TMAH), a strong organic base, to address contamination. These inks also reduced between 60 and 100 °C. Pipetting or printing onto gold coated substrates produce metallic flakes coated in a clear, thick residue. EDS measured carbon and oxygen content up to 70 wt % of deposits. The residue was hypothesized to be a non-volatile byproduct of TMAH and acetate. Recommendations are provided to address the residue. Ultimately the formulated reactive inks did not meet design targets. However, this thesis sets the framework to design an optimal nickel reactive ink in future work.
Dissertation/Thesis
Masters Thesis Chemical Engineering 2019