Academic literature on the topic 'Optical interconnects'

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Journal articles on the topic "Optical interconnects"

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Ro, Yuhwan, Eojin Lee, and Jung Ahn. "Evaluating the Impact of Optical Interconnects on a Multi-Chip Machine-Learning Architecture." Electronics 7, no. 8 (July 27, 2018): 130. http://dx.doi.org/10.3390/electronics7080130.

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Following trends that emphasize neural networks for machine learning, many studies regarding computing systems have focused on accelerating deep neural networks. These studies often propose utilizing the accelerator specialized in a neural network and the cluster architecture composed of interconnected accelerator chips. We observed that inter-accelerator communication within a cluster has a significant impact on the training time of the neural network. In this paper, we show the advantages of optical interconnects for multi-chip machine-learning architecture by demonstrating performance improvements through replacing electrical interconnects with optical ones in an existing multi-chip system. We propose to use highly practical optical interconnect implementation and devise an arithmetic performance model to fairly assess the impact of optical interconnects on a machine-learning accelerator platform. In our evaluation of nine Convolutional Neural Networks with various input sizes, 100 and 400 Gbps optical interconnects reduce the training time by an average of 20.6% and 35.6%, respectively, compared to the baseline system with 25.6 Gbps electrical ones.
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Chen, Ray T., and Chulchae Choi. "Optical Interconnects." Synthesis Lectures on Solid State Materials and Devices 2, no. 1 (January 2007): 1–104. http://dx.doi.org/10.2200/s00029ed1v01y200605ssm002.

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Hinton, H. Scott, and John E. Midwinter. "Optical interconnects." Optical and Quantum Electronics 24, no. 4 (April 1992): iii. http://dx.doi.org/10.1007/bf00619507.

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Mokhtari, Mohammad Reza, Hamed Baghban, and Hadi Soofi. "Multilayer optical interconnects design: switching components and insertion loss reduction approach." Journal of Electrical Engineering 69, no. 3 (June 1, 2018): 226–32. http://dx.doi.org/10.2478/jee-2018-0030.

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Abstract The next generation of chip multi-processors point to the integration of thousands of processing cores, demanding high- performance interconnects, and growing the interest in optically interconnected networks. In this article we report on an interlayer silicon-based switch design that switches two channels simultaneously from an input waveguide into one of the two output ports. The introduced interlayer switch allows to design interconnects with previously unattainable functionality, higher performance and robustness, and smaller footprints with low insertion loss (< 1 dB), and high extinction ratio (> 18 dB). Interlayer switching combined with wavelength-routed and circuit-switched networks yield a low latency and low- loss interconnect architecture. Quantitative comparison between the proposed interconnect architecture and other reported structures in terms of loss, number of wavelengths and microring resonators reveals the proficiency of our design. For a 64-core interconnect implemented in 4 layers, the proposed architecture indicates an average loss reduction up to 42% and 43% with respect to single-layer lambda-router and GWOR.
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Edwards, C. "Optical inclusions [optical interconnects]." Engineering & Technology 6, no. 10 (November 1, 2011): 81–85. http://dx.doi.org/10.1049/et.2011.1013.

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Hesselink, L. "Dynamic optical interconnects." Optics News 15, no. 12 (December 1, 1989): 44. http://dx.doi.org/10.1364/on.15.12.000044.

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Everard, J. K. A., M. Page-Jones, K. Powell, and T. Hall. "Selfrouting optical interconnects." Electronics Letters 28, no. 6 (1992): 556. http://dx.doi.org/10.1049/el:19920351.

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Mekawey, Hosam, Mohamed Elsayed, Yehea Ismail, and Mohamed A. Swillam. "Optical Interconnects Finally Seeing the Light in Silicon Photonics: Past the Hype." Nanomaterials 12, no. 3 (January 29, 2022): 485. http://dx.doi.org/10.3390/nano12030485.

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Electrical interconnects are becoming a bottleneck in the way towards meeting future performance requirements of integrated circuits. Moore’s law, which observes the doubling of the number of transistors in integrated circuits every couple of years, can no longer be maintained due to reaching a physical barrier for scaling down the transistor’s size lower than 5 nm. Heading towards multi-core and many-core chips, to mitigate such a barrier and maintain Moore’s law in the future, is the solution being pursued today. However, such distributed nature requires a large interconnect network that is found to consume more than 80% of the microprocessor power. Optical interconnects represent one of the viable future alternatives that can resolve many of the challenges faced by electrical interconnects. However, reaching a maturity level in optical interconnects that would allow for the transition from electrical to optical interconnects for intra-chip and inter-chip communication is still facing several challenges. A review study is required to compare the recent developments in the optical interconnects with the performance requirements needed to reach the required maturity level for the transition to happen. This review paper dissects the optical interconnect system into its components and explains the foundational concepts behind the various passive and active components along with the performance metrics. The performance of different types of on-chip lasers, grating and edge couplers, modulators, and photodetectors are compared. The potential of a slot waveguide is investigated as a new foundation since it allows for guiding and confining light into low index regions of a few tens of nanometers in cross-section. Additionally, it can be tuned to optimize transmissions over 90° bends. Hence, high-density opto-electronic integrated circuits with optical interconnects reaching the dimensions of their electrical counterparts are becoming a possibility. The latest complete optical interconnect systems realized so far are reviewed as well.
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Anderson, Sean P., Ashutosh R. Shroff, and Philippe M. Fauchet. "Slow Light with Photonic Crystals for On-Chip Optical Interconnects." Advances in Optical Technologies 2008 (July 22, 2008): 1–12. http://dx.doi.org/10.1155/2008/293531.

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Transistor scaling alone can no longer be relied upon to yield the exponential speed increases we have come to expect from the microprocessor industry. The principle reason for this is the interconnect bottleneck, where the electrical connections between and within microprocessors are becoming, and in some cases have already become, the limiting factor in overall microprocessor performance. Optical interconnects have the potential to address this shortcoming directly, by providing an inter- and intrachip communication infrastructure that has both greater bandwidth and lower latency than electrical interconnects, while remaining safely within size and power constraints. In this paper, we review the requirements that a successful optical interconnect must meet, as well as some of the recent work in our group in the area of slow-light photonic crystal devices for on-chip optical interconnects. We show that slow-light interferometric optical modulators in photonic crystal can have not only high bandwidth, but also extremely compact size. We also introduce the first example of a multichannel slow light platform, upon which a new class of ultracompact optical devices can be built.
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Zhou, Zhiping, Xuezhe Zheng, and B. Roe Hemenway. "Guest Editorial Optical Interconnects." Journal of Lightwave Technology 33, no. 4 (February 15, 2015): 725–26. http://dx.doi.org/10.1109/jlt.2015.2394291.

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Dissertations / Theses on the topic "Optical interconnects"

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Kim, Gicherl. "Three-dimensionally interconnected optical backplane for high performance board-to-board interconnects /." Full text (PDF) from UMI/Dissertation Abstracts International, 2000. http://wwwlib.umi.com/cr/utexas/fullcit?p3004304.

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Sam, Shiou Lin 1976. "Characterization of optical interconnects." Thesis, Massachusetts Institute of Technology, 2000. http://hdl.handle.net/1721.1/8738.

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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000.
Includes bibliographical references (p. 72-75).
Interconnect has become a major issue in deep sub-micron technology. Even with copper and low-k dielectrics, parasitic effects of interconnects will eventually impede advances in integrated electronics. One technique that has the potential to provide a paradigm shift is optics. This project evaluates the feasibility of optical interconnects for distributing data and clock signals. In adopting this scheme, variation is introduced by the detector, the waveguides, and the optoelectronic circuit, which includes device, power supply and temperature variations. We attempt to characterize the effects of the aforementioned sources of variation by designing a baseline optoelectronic circuitry and fabricating a test chip which consists of the circuitry and detectors. Simulations are also performed to supplement the effort. The results are compared with the performance of traditional metal interconnects. The feasibility of optical interconnects is found to be sensitive to the optoelectronic circuitry used. Variation effects from the devices and operating conditions have profound impact on the performance of optical interconnects since they introduce substantial skew and delay in the otherwise ideal system.
by Shiou Lin Sam.
S.M.
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Wang, Fengtao. "Optical interconnects on printed circuit boards." Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/37133.

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The ever-increasing need for higher bandwidth and density is one of the motivations for extensive research on planar optoelectronic structures on printed circuit board (PCB) substrates. Among these applications, optical interconnects have received considerable attention in the last decade. Several optical interconnect techniques, such as free space, guided wave, board level and fiber array interconnects, have been introduced for system level applications. In all planar optoelectronic systems, optical waveguides are crucial elements that facilitate signal routing. Low propagation loss, high reliability and manufacturability are among the requirements of polymer optical waveguides and polymer passive devices on PCB substrates for practical applications. Besides fabrication requirements, reliable characterization tools are needed to accurately and nondestructively measure important guiding properties, such as waveguide propagation loss. In three-dimensional (3D) fully embedded board-level optical interconnects, another key challenge is to realize efficient optical coupling between in-plane waveguides and out-of-plane laser/detector devices. Driven by these motivations, the research presented in this thesis focuses on some fundamental studies of optical interconnects for PCB substrates, e.g., developing low-loss optical polymer waveguides with integrated efficient out-of-plane couplers for optical interconnects on printed circuit board substrates, as well as the demonstration of a novel free-space optical interconnect system by using a volume holographic thin film. Firstly, the theoretical and experimental investigations on the limitations of using mercury i-line ultraviolet (UV) proximity photolithography have been carried out, and the metallization techniques for fine copper line formation are explored. Then, a new type of low-loss polymer waveguides (i.e., capped waveguide) is demonstrated by using contact photolithography with considerable performance improvement over the conventional waveguides. To characterize the propagation properties of planar optical waveguides, a reliable, nondestructive, and real-time technique is presented based on accurately imaging the scattered light from the waveguide using a sensitive charge coupled device (CCD) camera that has a built-in integration functionality. To provide surface normal light coupling between waveguides and optoelectronic devices for optical interconnects, a simple method is presented here to integrate 45° total internal reflection micro-mirrors with polymer optical waveguides by an improved tilted beam photolithography (with the aid of de-ionized water) on PCBs. A new technique is developed for a thin layer of metal coating on the micro-mirrors to achieve higher reflection and coupling efficiency (i.e., above 90%). The combination of the capped waveguide technique and the improved tilted UV exposure technique along with a hard reusable metal mask for metal deposition eliminates the usage of the traditional lift-off process, greatly simplifies the process, and reduces fabrication cost without sacrificing the coating quality. For the study of free-space optical interconnects, a simple system is presented by employing a single thin-film polymeric volume holographic element. One 2-spherical-beam hologram is used to link each point light source with the corresponding photodetector. An 8-channel free-space optical interconnect system with high link efficiency is demonstrated by using a single volume holographic element where 8 holograms are recorded.
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Petrovic, Novak S. "Modelling diffraction in optical interconnects /." [St. Lucia, Qld.], 2004. http://adt.library.uq.edu.au/public/adt-QU20050129.135451/index.html.

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Song, Deqiang. "Misalignment corrections in optical interconnects." Connect to a 24 p. preview or request complete full text in PDF format. Access restricted to UC campuses, 2006. http://wwwlib.umi.com/cr/ucsd/fullcit?p3229549.

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Thesis (Ph. D.)--University of California, San Diego, 2006.
Title from first page of PDF file (viewed October 18, 2006). Available via ProQuest Digital Dissertations. Vita. Includes bibliographical references.
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Sinha, Pritam. "Transceiver design for optical interconnects." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk2/tape17/PQDD_0020/MQ37315.pdf.

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Jim, Kalok. "RCLED arrays for optical interconnects." Thesis, University of Oxford, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.403748.

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Henderson, C. J. D. "Free space adaptive optical interconnects." Thesis, University of Cambridge, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.603949.

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Free space optical communications has a number of advantages for the transmission of high bandwidth data. However, for many applications, its use is limited by the precise alignment tolerances required to maintain a reliable link. In this dissertation, the design and construction of a free space adaptive optical interconnect demonstrator system is reported, in which the transmitted beam was actively steered to compensate for misalignment. The target application considered was a board to board interconnect for use within computer systems. Beam steering was performed using binary phase gratings displayed on a Spatial Light Modulator (SLM), for which an ‘off the shelf’ ferroelectric Liquid Crystal on Silicon (LCOS) micro display was used here. The gratings were generated in hardware, as an integrated part of the SLM driver, using a novel and compact implementation for which the details are described. This was capable of generating gratings at high frame rates, and applied a scrolled addressing scheme to ensure DC balance of the pixels whilst maintaining an uninterrupted optical path. Data transmission through a bulk optical relay containing this SLM was successfully demonstrated at 2.5Gbps. The transmitter and receiver modules were custom built for these experiments using an 850nm multi mode VCSEL and PIN photodiode, driven by standard telecommunications components. Losses due to the optical components, SLM, grating diffraction efficiency and scrolled addressing scheme totalled between 15.1 and 17dB. These corresponded well with the values estimated for the components, and with further device optimisation it was expected that they could be substantially reduced. Beam steering at the receiver plane was achieved over a 6.4x6.4mm range with a resolution of 25μm. This was sufficient to track a detector with a coupling loss of no more than 0.05dB. The feasibility of adaptive alignment correction in a free space optical interconnect, using a liquid crystal SLM for beam steering, was demonstrated through a series of experiments. The considerations relevant to extending this system for multiple parallel channels are discussed.
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Twyford, Elizabeth J. "Optical interconnects : systems, devices and fabrication." Diss., Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/13889.

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Villalaz, Ricardo A. "Volume Grating Couplers for Optical Interconnects: Analysis, Design, Fabrication, and Testing." Diss., Available online, Georgia Institute of Technology, 2004:, 2004. http://etd.gatech.edu/theses/available/etd-07102004-165012/unrestricted/villalaz%5Fricardo%5Fa%5F200407%5Fphd.pdf.

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Thesis (Ph. D.)--School of Electrical and Computer Engineering, Georgia Institute of Technology, 2005. Directed by Thomas Gaylord.
Glytsis, Elias, Committee Co-Chair ; Buck, John, Committee Member ; Kohl, Paul, Committee Member ; Adibi, Ali, Committee Member ; Gaylord, Thomas, Committee Chair. Vita. Includes bibliographical references.
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Books on the topic "Optical interconnects"

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Chen, Ray T., and Chulchae Choi. Optical Interconnects. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2.

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Pavesi, Lorenzo, and Gérard Guillot, eds. Optical Interconnects. Berlin, Heidelberg: Springer Berlin Heidelberg, 2006. http://dx.doi.org/10.1007/978-3-540-28912-8.

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1958-, Kawai Shigeru, ed. Handbook of optical interconnects. Boca Raton, FL: Taylor & Francis/CRC Press, 2005.

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Lorenzo, Pavesi, and Guillot G, eds. Optical interconnects: The silicon approach. Berlin: Springer, 2006.

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Lorenzo, Pavesi, and Guillot G, eds. Optical interconnects: The silicon approach. Berlin: Springer, 2006.

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Lorenzo, Pavesi, and Guillot G, eds. Optical interconnects: The silicon approach. Berlin: Springer, 2006.

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Lorenzo, Pavesi, and Guillot G, eds. Optical interconnects: The silicon approach. Berlin: Springer, 2006.

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Lalanne, Philippe, and Pierre Chavel, eds. Perspectives for Parallel Optical Interconnects. Berlin, Heidelberg: Springer Berlin Heidelberg, 1993. http://dx.doi.org/10.1007/978-3-642-49264-8.

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1963-, Lalanne Ph, Chavel P, and Commission of the European Communities., eds. Perspectives for parallel optical interconnects. Berlin: Springer-Verlag, 1993.

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1955-, Marrakchi Abdellatif, ed. Photonic switching and interconnects. New York: M. Dekker, 1994.

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Book chapters on the topic "Optical interconnects"

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Madamopoulos, Nicholas. "Optical Interconnects." In Optical Networks, 235–300. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-1093-5_6.

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Bogaerts, Wim. "Optical Interconnects." In Advanced Interconnects for ULSI Technology, 503–42. Chichester, UK: John Wiley & Sons, Ltd, 2012. http://dx.doi.org/10.1002/9781119963677.ch14.

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Kostuk, R. K., J. W. Goodman, and L. Hesselink. "Optical Interconnects." In Nonlinear Photonics, 61–89. Berlin, Heidelberg: Springer Berlin Heidelberg, 1990. http://dx.doi.org/10.1007/978-3-642-75438-8_3.

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Chen, Ray T., and Chulchae Choi. "Effects of Thermal-Via Structures on Thin Film VCSELs for a Fully Embedded Board-Level Optical Interconnection System." In Optical Interconnects, 75–85. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2_8.

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Chen, Ray T., and Chulchae Choi. "Thinned Vertical Cavity Surface Emitting Laser Fabrication." In Optical Interconnects, 9–21. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2_2.

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Chen, Ray T., and Chulchae Choi. "Optical Interconnection Layer." In Optical Interconnects, 39–64. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2_5.

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Chen, Ray T., and Chulchae Choi. "System Integration." In Optical Interconnects, 65–72. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2_6.

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Chen, Ray T., and Chulchae Choi. "Thermal Management of Embedded VCSEL." In Optical Interconnects, 31–38. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2_4.

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Chen, Ray T., and Chulchae Choi. "VCSEL Characterization." In Optical Interconnects, 23–30. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2_3.

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Chen, Ray T., and Chulchae Choi. "Introduction." In Optical Interconnects, 1–8. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2_1.

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Conference papers on the topic "Optical interconnects"

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Ghosh, Anjan K. "Alignability of optical interconnects." In OSA Annual Meeting. Washington, D.C.: Optica Publishing Group, 1989. http://dx.doi.org/10.1364/oam.1989.mbb4.

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A theory for analyzing the alignability, the degree of difficulty of aligning the devices and light beams, of a given optical interconnection system is developed. From various experiments it has been found that the alignment of a basic optical interconnect consisting of one beam and one device is a random process, N(0,σ). The standard deviation of alignment is inversely proportional to the overall cost measure modeled as a function of the time spent, the skill of operators, positioning devices, degrees of freedom in positioners, etc. In an incoherent interconnect, Pf = prob (alignment with at least f% power coupling) = 1 exp[−(d + s +fs/50)2/2σ2], where d and s are the radii of the device and the spot, respectively, and d ⪰s. The alignability of the interconnect, A = ∫ Pf df. Aincreases with the device size and the overall cost measure indicating that alignment gets better if more money is spent or larger devices are used. Practical optical systems consisting of many optical paths and devices, such as, optical crossbar switches, can be modeled as series and parallel combinations of many independent basic interconnects. Thus, overall alignability of a large interconnect = IIAi, of all the component interconnects. From this concept of alignability guidelines for the design and deployment of optical interconnects can be developed.
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Haugen, P. R., and A. Husain. "Limits and implementation of optical interconnects for computers." In OSA Annual Meeting. Washington, D.C.: Optica Publishing Group, 1986. http://dx.doi.org/10.1364/oam.1986.wq5.

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Optical interconnect technology has demonstrated technical and commercial success for long-haul and local area network communications. Migration of optical interconnects into computing systems is being driven by increasing circuit device speeds and architectural complexity needed to realize high performance computers. For present computing architectures, data and clock distribution are examples of interconnect bottlenecks where there is an immediate payoff from using optical interconnects at the small area, board-to-board and chip-to-chip level. For future systems, hardware density and speed will be enhanced by utilizing the high density potential of optical interconnects. We present potential advantages and limitations that optical interconnects exhibit for computing implementations. In addition, we discuss packaging issues (e.g., reliability, testability, and compatibility) essential for implementing optical interconnect in computing hardware environments and present results of an optical chip-to-chip demonstration.
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Morris, James E., and Michael R. Feldman. "Reconfigurable Interconnects Using Computer Generated Holograms and Spatial Light Modulators." In Optical Computing. Washington, D.C.: Optica Publishing Group, 1991. http://dx.doi.org/10.1364/optcomp.1991.me16.

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An efficient method of implementing programmable optical interconnects is needed for communication between processors in optically interconnected VLSI processor arrays[1,2], between optical logic gates in optical computers[3], and between chips, modules and boards in general purpose VLSI systems[4-6].
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Goodman, Joseph W. "Switching in an Optical Interconnect Environment." In Optical Computing. Washington, D.C.: Optica Publishing Group, 1989. http://dx.doi.org/10.1364/optcomp.1989.waa3.

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Optical interconnects are gaining importance in a wide range of applications, ranging from interconnection of supercomputers and workstations to interconnection of multiple chips on a single board. With the development of any interconnect technology, eventually the need for switching arises. Thus the switching of optical interconnects is a topic of much current interest.
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Camp, Jean, James Morris, and Michael R. Feldman. "Comparison between holographic and guided-wave interconnects for VLSI multiprocessor systems." In OSA Annual Meeting. Washington, D.C.: Optica Publishing Group, 1990. http://dx.doi.org/10.1364/oam.1990.fk3.

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The performance of guided-wave and holographic optical interconnects are compared to each other and to conventional electrical interconnects for use in high-performance very-large-scale integration (VLSI) parallel computing systems. The comparison is based on chip-to-chip communication within and between VLSI thermal-conduction multichip modules. The interconnects are evaluated in terms of maximum data transmission rate, power dissipation, crosstalk, and connection density as a function of the number of processors in the system. Previous comparisons between optical and electrical interconnects1 for intrachip communication neglected transmission line effects. Because of the range of interconnect lengths (1–10 cm), both transmission-line and lumped RC line effects must be taken into account for electrical connections. Also, the light propagation delay for both holographic and guided-wave connections are significant. Owing to the high index of refraction of guided-wave systems, they have a longer propagation delay than do free-space systems. Advantages and disadvantages of multiplexing several signals over the optical connections have been analyzed. Detector circuit amplifiers, optimal in the sense that they minimize total power dissipation, have been designed.
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Pezzaniti, J. Larry, and Russell A. Chipman. "A polarization metrology for optical interconnects which use polarization beam combining." In Optical Computing. Washington, D.C.: Optica Publishing Group, 1991. http://dx.doi.org/10.1364/optcomp.1991.me25.

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Several free space optical interconnects for digital optical computing which use polarization beam combining are currently being implemented 1-5 These architectures interconnect 2-D arrays of optical logic devices by imaging arrays of spots, generated by binary phase gratings, from one logic device to the next. Polarization beam combining addresses the need to combine input beams and separate output beams by using space-variant mirrors in conjunction with polarizing beam splitters and waveplates. The throughput of the interconnect is limited primarily by the polarizing beam splitters and the waveplates.
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"Optical Interconnects." In 6th IEEE Workshop on Signal Propagation on Interconnects. IEEE, 2002. http://dx.doi.org/10.1109/spi.2002.258272.

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Miller, David A. B. "Optical Interconnects." In Optical Fiber Communication Conference. Washington, D.C.: OSA, 2010. http://dx.doi.org/10.1364/ofc.2010.othx1.

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Chen, Ray T. "Optical interconnects." In the 2007 international symposium. New York, New York, USA: ACM Press, 2007. http://dx.doi.org/10.1145/1231996.1232015.

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Majumdar, Arka, and Zhuoran Fang. "NEO-PGA: nonvolatile electro-optically programmable gate array for optical interconnects." In Optical Interconnects XXII, edited by Henning Schröder and Ray T. Chen. SPIE, 2022. http://dx.doi.org/10.1117/12.2605331.

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Reports on the topic "Optical interconnects"

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Laurich, B., I. Campbell, D. Smith, A. Bishop, A. Saxena, T. Hagler, and P. Davids. Polymers for integrated optical interconnects. Office of Scientific and Technical Information (OSTI), March 1996. http://dx.doi.org/10.2172/206601.

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Fainman, Y., and Paul E. Shames. Multistage Optical Interconnects for Parallel Access Optical Memory. Fort Belvoir, VA: Defense Technical Information Center, September 1999. http://dx.doi.org/10.21236/ada371626.

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Haas, Franz, Paul R. Cook, and John E. Malowicki. Optical Interconnects for High Speed Computing. Fort Belvoir, VA: Defense Technical Information Center, September 1999. http://dx.doi.org/10.21236/ada371140.

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4

Feldman, Michael R. Holographic Optical Interconnects for Multichip Modules. Fort Belvoir, VA: Defense Technical Information Center, October 1991. http://dx.doi.org/10.21236/ada253403.

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5

Osman, Joseph, Reinhard Erdmann, Michael Fanto, and Corey Peters. Electro-Optical and Optical Components for Processor to Processor Interconnects. Fort Belvoir, VA: Defense Technical Information Center, April 2013. http://dx.doi.org/10.21236/ada576031.

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6

Marsland, Robert A. High-Optical-Power, Wideband Distributed Photodetectors for Optical RF Interconnects. Fort Belvoir, VA: Defense Technical Information Center, June 1998. http://dx.doi.org/10.21236/ada351603.

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7

Neff, John A., and Charles Stirk. High-Performance and Low-Cost Optical Interconnects. Fort Belvoir, VA: Defense Technical Information Center, August 1995. http://dx.doi.org/10.21236/ada299094.

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8

Murdocca, Miles, Apostolos Gerasoulis, and Saul Levy. Novel Optical Computer Architecture Utilizing Reconfigurable Interconnects. Fort Belvoir, VA: Defense Technical Information Center, October 1991. http://dx.doi.org/10.21236/ada244057.

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9

Rohrbaugh, John. Frequency Discriminating EM Field Sensor Having All Optical Interconnects. Fort Belvoir, VA: Defense Technical Information Center, March 1996. http://dx.doi.org/10.21236/ada310915.

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10

Schaper, Len. 3-D Cryo-Cooled Multi-Chip Modules via Optical Interconnects. Fort Belvoir, VA: Defense Technical Information Center, July 1999. http://dx.doi.org/10.21236/ada398387.

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