Relevant bibliographies by topics / Packaged

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Packaged'

Author: Grafiati
Published: 4 June 2021
Last updated: 26 July 2025

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Journal articles on the topic "Packaged"

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Chéron, Jérôme, Michel Campovecchio, Denis Barataud, et al. "Electrical modeling of packaged GaN HEMT dedicated to internal power matching in S-band." International Journal of Microwave and Wireless Technologies 4, no. 5 (2012): 495–503. http://dx.doi.org/10.1017/s1759078712000530.

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The electrical modeling of power packages is a major issue for designers of high-efficiency hybrid power amplifiers. This paper reports the synthesis and the modeling of a packaged Gallium nitride (GaN) High electron mobility transistor (HEMT) associating a nonlinear model of the GaN HEMT die with an equivalent circuit model of the package. The extraction procedure is based on multi-bias S-parameter measurements of both packaged and unpackaged (on-wafer) configurations. Two different designs of 20 W packaged GaN HEMTs illustrate the modeling approach that is validated by time-domain load-pull
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Hadi, R. R. Hanny Advenia, I. Putu Sudana, and Yohanes Kristianto. "PENGEMASAN PAKET WISATA KEBUGARAN DI DESA SAYAN, KECAMATAN UBUD, KABUPATEN GIANYAR." Jurnal IPTA 11, no. 1 (2023): 23. http://dx.doi.org/10.24843/ipta.2023.v11.i01.p04.

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Wellness and village tourism are one of the travel trends that can be done during the pandemic. To increase interest in this tour, the activities are packaged in an attractive manner, in this study referring to the thematic packaging of fitness tour packages. This research was conducted to determine the potential of wellness tourism in Sayan Village, which was then packaged thematically to become a fitness tour package. The package of this tour package can then be used as a tourism product in Sayan Village. Data collection techniques used in this study, namely observation, in-depth interviews,
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Sterken, T., M. Op de Beeck, F. Vermeiren та ін. "High Yield Embedding of 30μm Thin Chips in a Flexible PCB using a Photopatternable Polyimide based Ultra-Thin Chip Package (UTCP)". International Symposium on Microelectronics 2012, № 1 (2012): 000940–45. http://dx.doi.org/10.4071/isom-2012-wp52.

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A thin chip package for off-the-shelf ICs is developed which enables the embedding of these chips into a flexible circuit board. The package consists of a copper fan-out on a polyimide substrate, in which the thinned IC (30μm) is embedded. These packages are subsequently integrated in a standard flexible circuit board (FCB). A microcontroller and a proprietary DSP processor are embedded using this technology. The yield of the Ultra-Thin Chip package (UTCP) was measured before embedding in the circuit board, and reaches up to 87% for the packaged microcontrollers (MSP430 family, known-good dies
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SONG, YOON SEOK, DIANA STEWART, KARL REINEKE, et al. "Effects of Package Atmosphere and Storage Conditions on Minimizing Risk of Escherichia coli O157:H7 in Packaged Fresh Baby Spinach." Journal of Food Protection 82, no. 5 (2019): 844–53. http://dx.doi.org/10.4315/0362-028x.jfp-18-337.

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ABSTRACT Packaged fresh spinach has been associated with outbreaks of illness caused by Escherichia coli O157:H7. The purpose of this study was to assess the behavior of E. coli O157:H7 in packaged baby spinach in response to storage conditions of temperature and package atmosphere and including effects of inoculation level, spinach leaf damage (cut leaves), internalized or leaf surface contamination, exposure to hypochlorite sanitizer, and package size. Behavior of E. coli O157:H7 inoculated at 2 and 4 log CFU/g on spinach packaged in polymer bags composed of a two-layer laminate (polypropyle
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Donato, Carmela, Ada Maria Barone, and Simona Romani. "The satiating power of sustainability: the effect of package sustainability on perceived satiation of healthy food." British Food Journal 123, no. 13 (2021): 162–77. http://dx.doi.org/10.1108/bfj-12-2020-1094.

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PurposeThis research investigates the influence of package sustainability on food satiation perception.Design/methodology/approachResearch hypotheses were tested through three experimental studies.FindingsThree experimental studies show that food quality is associated to higher perceived food satiation (preliminary study); that a food packaged in a sustainable package is perceived as more satiating than the same food packaged in a non-sustainable package and that this effect is explained by the higher perceived quality triggered by the presence of a sustainable package (Study 1); and that the
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Tiffin, Shelley M., and Michael A. Noble. "External Quality Assessment of Transporting Infectious Substances in Canada." Canadian Journal of Infectious Diseases 10, no. 3 (1999): 246–51. http://dx.doi.org/10.1155/1999/658649.

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OBJECTIVE: To determine the degree of compliance with Transport Canada’s Transportation of Dangerous Goods Regulations for transporting infectious substances in Canada.DESIGN: A three-phase study including observation of packages arriving at the British Columbia Centre for Disease Control (BCCDC) provincial laboratory; observation of requested samples of either anEscherichia coliculture or serum, not human immunodeficiency virus (HIV) or HbsAg positive, from laboratories; and a questionnaire concerning training and certification of packers in laboratories.RESULTS: During phase 1, 500 packages
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Anjeli, Valentia, I. Nyoman Sudiarta, and I. Ketut Suwena. "PENGEMBANGAN PAKET WISATA KEBUGARAN DI DESA MAS, UBUD, GIANYAR." Jurnal IPTA 12, no. 1 (2024): 12. https://doi.org/10.24843/ipta.2024.v12.i01.p02.

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Wellness tourism was a type of tourism that was in great demand by local and international tourists. To increase tourist interest, one way was by choosing wellness tourism, and the activities were packaged in a varied and interesting way. This research referred to the development of thematic wellness tourism packages. The research aimed to determine the potential for wellness tourism in Mas Village and then package it thematically into a Mas Village wellness tourism package. This research used data collection techniques, including interviews, observation, documentation, and literature study. T
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Fariz, Aji Muhammad, I. Putu Sudana, and N. G. A. S. Dewi. "POTENSI DAN PENGEMASAN PAKET EKOWISATA DI KABUPATEN BERAU PROVINSI KALIMANTAN TIMUR." Jurnal IPTA 9, no. 1 (2021): 34. http://dx.doi.org/10.24843/ipta.2021.v09.i01.p03.

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This research was conducted to determine the potential of ecotourism in Berau Regency, East Kalimantan Province so that it can be packaged into an ecotourism package that covers the whole area of Berau Regencey starting from the urban zone, the inland zone and the water zone. This Research was conducted in Berau Regency because Berau Regency has 159 tourist attractions and also its location is close to the location of the new capital. The ecotourism package packaging made in this study is based on the lack of variety of products and tour packages circulating in Berau Regency so that this resea
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FRANKLIN, NATHAN B., KAY D. COOKSEY, and KELLY J. K. GETTY. "Inhibition of Listeria monocytogenes on the Surface of Individually Packaged Hot Dogs with a Packaging Film Coating Containing Nisin." Journal of Food Protection 67, no. 3 (2004): 480–85. http://dx.doi.org/10.4315/0362-028x-67.3.480.

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The objective of this study was to determine the effectiveness of packaging films coated with a methylcellulose/hydroxypropyl methylcellulose–based solution containing 10,000, 7,500, 2,500, or 156.3 IU/ml nisin for controlling Listeria monocytogenes on the surfaces of vacuum-packaged hot dogs. Barrier film coated with a methylcellulose/hydroxypropyl methyl-cellulose–based solution containing nisin or no nisin (control) was heat sealed to form individual pouches. Hot dogs were placed in control and nisin-containing pouches and inoculated with a five-strain L. monocytogenes cocktail (approximate
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Synytsia, Olha, and Liudmyla Vinnikova. "POST-PACKAGE PASTEURIZATION OF PACKAGED WHOLE-MUSCLE PRODUCT." Scientific Works 2, no. 85 (2021): 5–10. http://dx.doi.org/10.15673/swonaft.v2i85.2157.

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The study considers a problem of repeated contamination of delicious products, ready for consumption. The aim of the work is to study the repeated thermal processing of a ready vacuum-packed whole-muscular meat product for inhibiting a surface microbiota.
 Today it is urgent for the meat industry, because it influences safety and quality, and also limits a storage term of a product. After bringing a meat product to culinary readiness by thermal processing, it has an unessential amount of microbiota. Microorganisms, including pathogenic and conventionally pathogenic ones, fall on a product
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Dissertations / Theses on the topic "Packaged"

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Goldstein-Gidoni, Ofra. "Packaged weddings, packaged brides : the Japanese ceremonial occasions industry." Thesis, SOAS, University of London, 1993. http://eprints.soas.ac.uk/29283/.

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This thesis is concerned with the Japanese Ceremonial Occasions industry, and in particular with contemporary Japanese weddings which are viewed as commercialized productions for a highly consumerist society. The study is mainly based on anthropological fieldwork conducted in an urban wedding parlour. The perspective offered diverges from those of previous studies in that its focus is on weddings, rather than marriage, and on the activities of the wedding producers, rather than those of its principal actors. The thesis shows how both 'traditional' and 'Western' traits found in commercial weddi
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Covher, Corbin R. "Packaged Little Lives." ScholarWorks@UNO, 2014. http://scholarworks.uno.edu/td/1787.

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This document attempts to capture the main ideas and evolution of my art making process during the three years of graduate studies at the University of New Orleans. My art making practice is an ever-evolving exploration of materials and ideas. Through art processes and experimentations I am able to overcome negative feelings about my role in society. I get lost in my process making things, thinking about things, and trying to come up with new ideas for the world. I am attempting to heighten mundane materials like cardboard, crayons, foams and concrete with intuitive abstract shape making. I am
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Cook, Jason Todd. "Interconnect Thermal Management of High Power Packaged Electronic Architectures." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5013.

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Packaged microelectronic technology provides an efficient means to connecting high performance chips to PCBs. As area array bump density increases, joule heating will play an important role in chip and interconnect reliability. Joule heating, in addition to chip heating can significantly reduce the clock speed and I/O while increasing noise, electromigration, and leakage power. Direct cooling of the solder bumps is a new innovative approach to removing heat from packaged high heat dissipating chips. This could be used in conjunction with top surface mounted thermal management devices to
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CONCEICAO, CAMILA DA SILVA. "CRITICAL ANALYSIS OF PACKAGED ORGANIC FOOD LABELS." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2012. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=22976@1.

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PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO<br>COORDENAÇÃO DE APERFEIÇOAMENTO DO PESSOAL DE ENSINO SUPERIOR<br>PROGRAMA DE SUPORTE À PÓS-GRADUAÇÃO DE INSTS. DE ENSINO<br>O Brasil encontra-se entre os maiores produtores de orgânicos do mundo e o desenvolvimento do mercado de alimentos orgânicos está diretamente relacionado à confiança dos consumidores quanto à origem dos produtos. Nesse contexto, as informações dos rótulos e o selo de garantia de produto orgânico facilitam o consumidor identificar os alimentos que estão em conformidade com os regulamentos e normas técnicas vigentes e cri
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Nadon, Celine Andree. "The quantification of biogenic amines in low-temperature stored vacuum-packaged and carbon dioxide modified atmosphere-packaged fresh pork." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp01/MQ32945.pdf.

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Xie, Bo. "The Law and Practise of Pre-Packaged Administration." Thesis, University of Manchester, 2010. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.532235.

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Huang, Shen S. B. Massachusetts Institute of Technology. "Evaluation of pre-packaged agricultural drip irrigation kits." Thesis, Massachusetts Institute of Technology, 2012. http://hdl.handle.net/1721.1/74494.

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Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (p. 67-69).<br>The purpose of this thesis is to conduct user testing and performance evaluation of two different agricultural pre-packaged drip irrigation kit (PDIK) systems: Chapin Bucket Kit and International Design Enterprises (IDE) drip kit. PDIK systems are a cost-effective type of appropriate technology for the developing world because they reduce agricultural water consumption and can increase crop yield over other m
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Hu, Shuangzeng. "The Use of the Internet in Distributing Packaged Software." Thesis, University of Waterloo, 2006. http://hdl.handle.net/10012/923.

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To reflect common practice in the software industry and extend transaction cost theory, this research developed building on previous research and empirically tested a model based on to identify conditions in which software vendors are likely to sell and distribute their packaged products directly to end-users through the Internet. How software firms distribute their products over the Internet is an important issue because software is a digital product, and the potential for the Internet to transform the distribution channel is considerable. Extant literature shows that Canadian software fi
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Holmström, Helena. "Community-based customer involvement for improving packaged software development /." Göteborg : Department of Informatics, Univ, 2004. http://www.handels.gu.se/epc/archive/00004060/01/Holmstrom.pdf.

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Light, B. "An interpretive field study of packaged software selection processes." Thesis, University of Salford, 2003. http://usir.salford.ac.uk/17470/.

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Packaged software is pre-built with the intention of licensing it to users in domestic settings and work organisations. This thesis focuses upon the work organisation where packaged software has been characterised as one of the latest ‘solutions’ to the problems of information systems. The study investigates the packaged software selection process that has, to date, been largely viewed as objective and rational. In contrast, this interpretive study is based on a 2½ year long field study of organisational experiences with packaged software selection at T.Co, a consultancy organisation based in
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Books on the topic "Packaged"

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Squirrell, Derek. Packaged grocery. Mardek Partnership, 1993.

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Holdsworth, Donald, and Ricardo Simpson. Thermal Processing of Packaged Foods. Springer US, 2007. http://dx.doi.org/10.1007/978-0-387-72250-4.

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Holdsworth, S. Donald, and Ricardo Simpson. Thermal Processing of Packaged Foods. Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-24904-9.

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executive, Health and safety. Storage of packaged dangerous substances. H.M.S.O., 1986.

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plc, Taylor Nelson AGB, ed. Christmas shopping for packaged groceries. Taylor Nelson AGB Publications, 1995.

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Forecasting, Henley Centre for. Inbound tourism: A packaged future? Henley Centre, 1992.

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Holdsworth, S. D. Thermal processing of packaged foods. 2nd ed. Springer, 2008.

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(Firm), Packaged Facts, ed. Packaged and bulk nuts market. Packaged Facts, 1989.

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United States. Forest Service. Pacific Northwest Region, ed. How well are you packaged? Forest Service, Pacific Northwest Region, U.S. Dept. of Agriculture, 1989.

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Hankin, Lester. Analysis of sizes in packaged prunes. Connecticut Agricultural Experiment Station, 1991.

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Book chapters on the topic "Packaged"

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Tollefson, Margot. "Packaged Functions." In R Quick Syntax Reference. Apress, 2014. http://dx.doi.org/10.1007/978-1-4302-6641-9_6.

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Tollefson, Margot. "Packaged Functions." In R Quick Syntax Reference. Apress, 2019. http://dx.doi.org/10.1007/978-1-4842-4405-0_6.

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Tollefson, Margot. "Packaged Functions." In R 4 Quick Syntax Reference. Apress, 2022. http://dx.doi.org/10.1007/978-1-4842-7924-3_6.

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Ginsberg, Gerald L. "Packaged Component Subassemblies." In Electronic Equipment Packaging Technology. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3542-3_5.

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Jones, H. P. "Ambient packaged cakes." In Shelf Life Evaluation of Foods. Springer US, 1994. http://dx.doi.org/10.1007/978-1-4615-2095-5_9.

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Lau, John H. "Co-packaged Optics." In Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-97-2140-5_6.

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Bashir, Omar, Sumira Rashid, Nusrat Jan, et al. "Aseptic Packaged Food." In Shelf Life and Food Safety. CRC Press, 2022. http://dx.doi.org/10.1201/9781003091677-16.

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Bonadio, Enrico, and Andrea Borghini. "Packaged Parma Ham." In Food, Philosophy, and Intellectual Property. Routledge, 2024. http://dx.doi.org/10.4324/9781003433675-26.

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"List of abbreviations." In Packaged Plants. UCL Press, 2024. http://dx.doi.org/10.2307/jj.15454030.5.

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"Post-colonial metabolic rifts." In Packaged Plants. UCL Press, 2024. http://dx.doi.org/10.2307/jj.15454030.10.

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Conference papers on the topic "Packaged"

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O'Brien, Peter. "Photonic and Electronic Co-Packaging Technologies – From Research to Pilot Manufacturing." In Optical Fiber Communication Conference. Optica Publishing Group, 2025. https://doi.org/10.1364/ofc.2025.w4a.1.

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This talk will present developments in co-packaging technologies and the transition from research to pilot-scale manufacturing. Areas to be covered include developments in glass-based electrical interposers, BGA-style photonic-electronic packages, and micro-optics for surface pluggable optical fibre connections. The talk will also review the critical role of packaging equipment in determining package designs to ensure manufacturability and emerging packaging trends in co-packaged optics. Full-text article not available; see video presentation
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Meek, Andrew, Bernard HL Lee, Yang Chen, et al. "Quantum Co-packaged Optical Assembly." In 2024 IEEE CPMT Symposium Japan (ICSJ). IEEE, 2024. https://doi.org/10.1109/icsj62869.2024.10804742.

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Shin, Jongchul, Hamid Eslampour, Sangnam Jeong, et al. "Signal Integrity of Die-to-Die Interface with Advanced Packages for Co-Packaged Optics." In 2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2024. http://dx.doi.org/10.1109/epeps61853.2024.10753887.

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Peng, Yan, Kexin Song, Tiancheng Zhang, Huaguang Bao, Dazhi Ding, and Jian Yang. "Simulation of Thermodynamic Effect for Packaged Enclosures." In 2024 IEEE International Symposium on Antennas and Propagation and INC/USNC‐URSI Radio Science Meeting (AP-S/INC-USNC-URSI). IEEE, 2024. http://dx.doi.org/10.1109/ap-s/inc-usnc-ursi52054.2024.10687133.

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Zheng, Yuxia, Jianxiang Wen, Yongtao Chen, et al. "Laser Performance of DBR Fiber Lasers Packaged." In 2024 22nd International Conference on Optical Communications and Networks (ICOCN). IEEE, 2024. http://dx.doi.org/10.1109/icocn63276.2024.10648524.

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Mauri, Luca, Giovanni Zafarana, Sonja Coulemans, Alessio Corazza, and Enea Rizzi. "Addressing Gaseous Impurities in Packaged Laser Diodes." In 2024 IEEE Sustainable Smart Lighting World Conference & Expo (LS24). IEEE, 2024. https://doi.org/10.1109/ls2463127.2024.10881765.

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Baig, Mirza Imran. "3D Power Module Packages—Failure Analysis Challenges & How to Overcome Them." In ISTFA 2022. ASM International, 2022. http://dx.doi.org/10.31399/asm.cp.istfa2022p0001.

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Abstract 3D package technologies like Multi-Chip Modules (MCM) and System in Package (SIP) have been in the semiconductor package industry for some time now. At the advent these technologies were mostly incorporated for digital solutions, however more recently these packaged solutions have been increasingly used for analog technologies specifically for power applications. With these packaged innovations increasingly adapted, Failure Analysis (FA) takes a central stage not just in supporting customer returned devices but also in root cause investigations leading to new product development, qual
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Goruganthu, Rama R., Shawn McBride, Mike Santana, and Mehrdad Mahanpour. "Microprobing on Sub-Micron Features on ICs Using an AFM Based Technique." In ISTFA 2002. ASM International, 2002. http://dx.doi.org/10.31399/asm.cp.istfa2002p0461.

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Abstract Traditional microprobing on conventional wirebonded packages is difficult on sub-micron feature sizes. The problem becomes even more complex with flip-chip packaged devices as access to circuitry is limited because of the substrate silicon. We describe here an Atomic Force Microscope (AFM) based tool for microprobing that we term “nanoprobing” because of the feature sizes that can be probed with this tool. Three applications have been described here where voltage levels or waveforms are measured. These include probing on: A single metal-layer test chip that is wire-bonded to a 40-pin
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Hensel, Steve J., Lucas L. Kyriazidis, Eric J. Skidmore, and Neal M. Askew. "Evaluation of Polyvinyl Chloride Bags During Plutonium Storage." In ASME 2016 Pressure Vessels and Piping Conference. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/pvp2016-63024.

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This evaluation considers the storage of plutonium materials in 9975 shipping packages at the Savannah River Site (SRS) K-Area Complex (KAC). The materials are packaged in a can – bag – can configuration where the outer can is a screw lid filtered can and the inner can is a slip lid filtered can (filters for both cans are located in the can lid). The inner slip lid can is secured using polyvinyl chloride tape. A filtered plasticized polyvinyl chloride (pPVC) bag is used to bag out the slip lid can from the glove box where the plutonium oxide is packaged. The filtered bag and slip lid can are p
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Liu, Shih-Ting, Tao-Chi Liu, Ming-Lun Chang, and Jandel Lin. "Innovative Methodologies of Circuit Edit on Wafer-Level Chip Scale Package (WLCSP) Devices." In ISTFA 2010. ASM International, 2010. http://dx.doi.org/10.31399/asm.cp.istfa2010p0359.

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Abstract Contrary to traditional packages, packaging and testing of wafer-level chip scale package (WLCSP) are done before wafer dicing. The package can’t be rebuilt on a single chip; therefore, the failure analysis and debug performed by Circuit Edit (CE) on ICs with WLCSP face challenges. In addition, there are route designs on the package level of WLCSP devices, which are unique compared with traditional packages. CE is required on both chip and package level of WLCSP devices. This package technology offers the smallest possible package size; consequently, it has seen wider use lately. Deve
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Reports on the topic "Packaged"

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Lee, T. Y. User Data Package (UDP) for Packaged Cogeneration Systems (PCS). Defense Technical Information Center, 1990. http://dx.doi.org/10.21236/ada226174.

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Cameron, Arthur, Shimshon Ben-Yehoshua, and Rebecca Hernandez. Design and Function of Modified Atmosphere Packaging Systems for Fresh Produce: a Unified Approach for Optimizing Oxygen, Carbon Dioxide and Relative Humidity. United States Department of Agriculture, 1996. http://dx.doi.org/10.32747/1996.7613019.bard.

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Oxygen uptake, CO2 production and respiratory quotient (RQ) of strawberry, raspberry and cherry were measured as functions of temperature and oxygen level. The effect of cultivar was studied in strawberry ('Honey' and 'Allstar'). The effect of harvest date was studied for raspberry. The lower O2 limit increased markedly with incraqsing temperature for all fruits studied. Red bell pepper O2 uptake was measured as a function of O2 at 20o C. Lowering the inpackage humidity using NaCl reduced decay of bell pepper sealed in low-density polyethylene packages when stored at 8o C. Analyses of a model
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Castaldini, Carlo, and Eric Darby. CHP Integrated with Burners for Packaged Boilers. Office of Scientific and Technical Information (OSTI), 2013. http://dx.doi.org/10.2172/1111427.

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Crown, Linda, David Sefcik, and Lisa Warfield. Checking the net contents of packaged goods. National Institute of Standards and Technology, 2017. http://dx.doi.org/10.6028/nist.hb.133-2018.

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Crown, Linda, David Sefcik, and Lisa Warfield. Checking the net contents of packaged goods. National Institute of Standards and Technology, 2018. http://dx.doi.org/10.6028/nist.hb.133-2019.

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Brickenkamp, C. S., S. Hasko, and M. G. Natrella. Checking the net contents of packaged goods. National Bureau of Standards, 1988. http://dx.doi.org/10.6028/nist.hb.133e3.

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Brickenkamp, C. S. Checking the net contents of packaged goods. National Institute of Standards and Technology, 1990. http://dx.doi.org/10.6028/nist.hb.133e3supp1990.

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Brickenkamp, C. S., and Joan A. Koenig. Checking the net contents of packaged goods. National Institute of Standards and Technology, 1991. http://dx.doi.org/10.6028/nist.hb.133e3supp2.

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Butcher, Kenneth S. Checking the net contents of packaged goods. National Institute of Standards and Technology, 1992. http://dx.doi.org/10.6028/nist.hb.133e3supp3.

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10

Brickenkamp, Caroll S., Ken Butcher, and Tom Coleman. Checking the net contents of packaged goods. National Institute of Standards and Technology, 1994. http://dx.doi.org/10.6028/nist.hb.133e3supp4.

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You might also be interested in the extended bibliographies on the topic 'Packaged' for particular source types:
Journal articles Dissertations / Theses Books
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