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Relevant bibliographies by topics / Packaging engineering

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Journal articles
Dissertations / Theses
Books
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Conference papers
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Academic literature on the topic 'Packaging engineering'

Author: Grafiati

Published: 4 June 2021

Last updated: 6 September 2023

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Journal articles on the topic "Packaging engineering"

1

Oemar, Hirawati, Hilda Farah Safira, Dewi Shofi Mulyati, and Anis Saleh. "REDESIGN ECO-FRIENDLY YOGURT PACKAGING USING KANSEI ENGINEERING METHOD." Journal of Industrial Engineering Management 8, no. 2 (2023): 129–35. http://dx.doi.org/10.33536/jiem.v8i2.1630.

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This research is focused on the desire of companies to change their yogurt packaging from thin plastic pouches to stronger ones. The purpose of packaging redesign is not only to overcome the problem of packaging durability but also to make new packaging more attractive to consumers so that the selling value is higher. Thus, packaging that is technically feasible and represents the customer's preferences for the company's products is needed. In addition, companies must also consider the long-term environmental impact. Redesigning the packaging using the eco-design concept and the Kansei Enginee

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Pratiwi, Kiki, Mohammad Taufan Andreyanto, Muhammad Asrol, and Taufik. "Herbal beverage packaging product design using kansei engineering." JENIUS : Jurnal Terapan Teknik Industri 4, no. 1 (2023): 12–21. http://dx.doi.org/10.37373/jenius.v4i1.365.

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The appearance of the packaging on drinks is a required consumer attraction factor, because the appearance of herbal drinks will compete with manufactured beverage products. This article aims to identify consumer needs in the packaging design of the products, determine the design element in the herbal beverage packaging. This study discusses the design of herbal beverage packaging using the kansei engineering method. The kansei engineering method is a design method using the emotional approach of the respondents. The steps in solving using the kansei method are, the first step is to collect ka

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Wang, Jun, Changfeng Ge, Dong Sun Lee, Michael A. Sek, and Vanee Chonhenchob. "Mathematical Problems in Packaging Engineering." Mathematical Problems in Engineering 2013 (2013): 1–2. http://dx.doi.org/10.1155/2013/691201.

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Lee, Y. C., and Nagesh Basavanhally. "Solder engineering for optoelectronic packaging." JOM 46, no. 6 (1994): 46–50. http://dx.doi.org/10.1007/bf03220719.

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Betanursanti, Ida, and Khoerul Rizal Maldini. "DESAIN KEMASAN JAMUR CRISPY MBAH MAN SNACK MENGGUNAKAN METODE VALUE ENGINEERING (VE)." Jurnal Inovasi Teknik Industri 1, no. 1 (2022): 26. http://dx.doi.org/10.26753/jitin.v1i1.795.

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The packaging used as a silent salesman to attract consumer attention. Mbah Man's UMKM sells various snack products and has not implemented packaging as a silent salesman. This study aims to identify information on the packaging characteristics of Mbah Man's UMKM products, mushrooms crispy and to determine the packaging design that has sale value.The method for packaging design uses value engineering which consists of a five-phase job plan, namely the information stage, the creative stage, the analysis stage, the development stage, and the presentation stage. The information stage is carried o

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Iswahyuni, Anisha Dian. "Analisa Desain Kemasan Stik Sukun (Artocarpus Altili) Menggunakan Metode Value Engineering." Jurnal Teknik 18, no. 2 (2020): 159–70. http://dx.doi.org/10.37031/jt.v18i2.108.

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The packaging design of a product is a special attraction for consumers. The right design would be able to increase sales of a product. The purpose of this research is to get the best packaging by designing or creating a packaging concept according to the needs and desires of consumers based on the packaging analysis used. The packaging development method is carried out with a product development approach and value engineering by improving performance based on consumer desires using the FAST method (Function Analysis System Technique). Based on the results of the identification of consumer nee

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Dermawan, Dedi, Muhammad Qurthuby, Denur Denur, and Hendri Ali Ardi. "Redesign Kemasan Keripik Singkong Menggunakan Kansei Engineering." Jurnal Teknik Industri Terintegrasi 6, no. 1 (2023): 14–26. http://dx.doi.org/10.31004/jutin.v6i1.14071.

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Cassava chips are snacks processed from cassava that is thinly sliced and fried and chip is a snack that is familiar to the public and everyone likes it in the home industry, savory cassava chips cap elang production But in this home industry has several problems, namely how to attract new consumers to buy this savory eagle cap cassava chip product. So one of the efforts that can be done is to innovate the design on the packaging to make it more attractive. The method used in innovating this packaging design is by kansei engineering. The goal to be achieved in this study is to identify the pac

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Coutelieris, Frank A., and Antonis Kanavouras. "Preservation engineering assets developed from an oxidation predictive model." Open Chemistry 14, no. 1 (2016): 357–62. http://dx.doi.org/10.1515/chem-2016-0038.

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AbstractA previously developed model which effectively predicts the probability of olive oil reaching the end of its shelf-life within a certain time frame was tested for its response when the convective diffusion of oxygen through packaging material is taken in account. Darcy’s Law was used to correlate the packaging permeability with the oxygen flow through the packaging materials. Mass transport within the food-packaging system was considered transient and the relative one-dimensional differential equations along with appropriate initial and boundary conditions were numerically solved. When

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Lamatinulu, Muhammad Dahlan, Mardin, Nur Ihwan Saputra, and Irdah. "Design of chocolate processed product packaging with Kansei engineering approach in SME-scale cocoa processing industry in South Sulawesi." World Journal of Advanced Research and Reviews 16, no. 1 (2022): 252–58. http://dx.doi.org/10.30574/wjarr.2022.16.1.1008.

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Packaging is one of the keys to maintaining product quality, packaging involves designing and producing activities, to protect the product. Packaging always involves design so that the product message can be conveyed to consumers, the current function of packaging is to protect the product as well as an effective marketing medium. The method used in this study is the kansei engineering method and the data used were obtained from distributing questionnaires that lasted for 1 month with the aim of the research, namely, to obtain the kansei word used to determine the redesign of the chalodo candy

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Barnes, Cathy, Tom Childs, Brian Henson, and Stephen Lillford. "Kansei engineering toolkit for the packaging industry." TQM Journal 20, no. 4 (2008): 372–88. http://dx.doi.org/10.1108/17542730810881357.

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Dissertations / Theses on the topic "Packaging engineering"

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Pinem, Mekro Permana. "Nanofluid engineering of chitosan-based edible packaging." Thesis, Compiègne, 2021. http://www.theses.fr/2021COMP2585.

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Les exigences en termes de qualité et de sécurité lors de la transformation et de la distribution des produits alimentaires nécessitent l'utilisation d'emballages adaptés pour éviter leur dégradation et prolonger leur durée de conservation ainsi que pour préserver leurs qualités organoleptiques dans le respect des contraintes de sécurité et écologiques. Cependant, actuellement, la plupart de ces emballages plastiques sont fabriqués à partir de dérivés pétrosourcés ce qui a des conséquences délétères sur l‘environnement augmentant la production de déchets et la pollution des écosystèmes. Une ap

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Dahl, Emil. "MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging." Thesis, Linköpings universitet, Elektroniska Kretsar och System, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-165429.

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This thesis studies the options of using PCB embedding bare die power MOSFET and new packaging of MOSFET to increase the power density in a PCB. This is to decrease the winding losses in an isolated DC/DC converter which, according to "Flex Power Modules", can be done by improving the interleaving between the layers of the transformer and/or decreasing the AC loop. To test the MOSFET packaging two layout are made from a reference PCB, one using embedded MOSFET and the other using the new packaging. The leakage induction and winding losses are simulated and if they are lower compared to the ref

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Alkozei, Mirwais, and Dipta Subhra Guha. "Optimizing packaging management." Thesis, KTH, Skolan för industriell teknik och management (ITM), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-302449.

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This project was carried out at Saint Gobain Sekurit AB. The company is a leading manufacturer ofglazing and operates within the automotive industry. The purpose of the project was to create a supply chain model to optimize the packaging management of racks which are customer owned. These are used to transport finished products to the customers of Saint Gobain. When the empty packaging is return it is stored until needed for production. The company needs to optimize the management and tracking of racks for which the company intends to develop a solution model which can provide the company with

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Bridge, David Richard. "Aspects of electronic device packaging." Thesis, University of Warwick, 1986. http://wrap.warwick.ac.uk/58807/.

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For this work cordierite has been investigated as a possible substitute substrate material for alumina, with particular emphasis on its role in multilayer device packaging. By limiting the processing temperatures to below 1000oC, copper could be used as the conductor material. Milled glass powder was made into thin sheet form by a doctor blading technique and, once dried, the copper screen printed on top. After lamination and firing, the conductor was completely encapsulated by the cordierite matrix. Copper diffusion occ~red with metallic copper precipitating out although a small denuded zone

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Zubair, Muhammed 1962. "Aluminoborophosphosilicate glasses for microelectronics packaging." Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/277898.

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Glasses are used in microelectronic packaging for insulation and passivation purposes. To optimize the performance of these packages, it is necessary to investigate new glasses or improve on properties of the glasses in use. The insulating glass should have low dielectric constant, low dissipation factor, low glass transition temperature, high chemical resistivity, and a thermal expansion coefficient matching the substrate. In this study, various aluminoborophosphosilicate glasses containing Ca(Mg)O, Ca(Mg)F₂, and AlF₃ as flux were investigated. Processing temperatures for these glasses range

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Rao, Jayathirtha M. "Viscoelastic behavior of electronic packaging materials /." The Ohio State University, 1996. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487932351058575.

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Williams, Callida A. "Packaging System Redesign: A Study in Designing More Sustainable Product Packaging Systems." The Ohio State University, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=osu1281970963.

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Khurana, Pritha. "Optoelectronic circuit design, packaging and characterization." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape11/PQDD_0026/MQ50630.pdf.

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Tollner, Martin Ernst. "Designing and modelling an automated packaging system." Master's thesis, University of Cape Town, 1997. http://hdl.handle.net/11427/9498.

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Bibliography: leaves 99-102.<br>This thesis describes the design and modelling of an improved materials handling system for a beverage cap production factory called BevCap, located in Epping, Cape Town. The factory consists of twelve production lines, which produce various types of aluminium and metal screw on caps. Each production line is fully automated except for the filling, packaging, labelling and storing procedures at the end of each production line. The finished product is counted electronically and packed into carton boxes, labelled, sealed and palletised manually. The manual materia

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Lomangino, F. Paul. "Grammar- and optimization-based mechanical packaging." Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/15848.

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Books on the topic "Packaging engineering"

1

Verghese, Karli. Packaging for Sustainability. Springer London, 2012.

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Packaging engineering resources: An annotated compendium. Technomic Pub. Co., 1990.

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J, Kelsey Robert, and Forcinio Hallie E, eds. Handbook of package engineering. 3rd ed. Technomic Pub. Co., 1998.

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Kelsey, Robert J. Handbook of package engineering. 4th ed. CRC, 2005.

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Honeybone, Ian. Card engineering. Outline Press, 1990.

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Honeybone, Ian. Card engineering. Nippan Publications, 1990.

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Tummala, Rao R. Microelectronics Packaging Handbook: Technology Drivers Part I. Springer US, 1997.

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8

Matisoff, Bernard S. Handbook Of Electronics Packaging Design and Engineering. Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-011-7047-5.

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Handbook of electronics packaging design and engineering. 2nd ed. Van Nostrand Reinhold, 1990.

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Packaging of electronic systems: A mechanical engineering approach. McGraw-Hill, 1990.

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Book chapters on the topic "Packaging engineering"

1

Selke, Susan E. M. "Green packaging." In Food Engineering Series. Springer US, 2011. http://dx.doi.org/10.1007/978-1-4614-1587-9_16.

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Dash, Sanjaya K., Pitam Chandra, and Abhijit Kar. "Filling and Packaging." In Food Engineering. CRC Press, 2023. http://dx.doi.org/10.1201/9781003285076-34.

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Özdemir, İbrahim Sani. "Intelligent Packaging." In Handbook of Food Safety Engineering. Wiley-Blackwell, 2012. http://dx.doi.org/10.1002/9781444355321.ch29.

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Saravacos, George D., and Athanasios E. Kostaropoulos. "Food Packaging Equipment." In Food Engineering Series. Springer US, 2002. http://dx.doi.org/10.1007/978-1-4615-0725-3_13.

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Saravacos, George, and Athanasios E. Kostaropoulos. "Food Packaging Equipment." In Food Engineering Series. Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-25020-5_13.

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McMillin, Kenneth W. "Modified Atmosphere Packaging." In Food Engineering Series. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-42660-6_26.

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Morello, Lorenzo, Lorenzo Rosti Rossini, Giuseppe Pia, and Andrea Tonoli. "Ergonomics and Packaging." In Mechanical Engineering Series. Springer Netherlands, 2011. http://dx.doi.org/10.1007/978-94-007-0516-6_3.

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Anandharamakrishnan, C., and S. Padma Ishwarya. "Food Packaging." In Essentials and Applications of Food Engineering. CRC Press, 2019. http://dx.doi.org/10.1201/9780429430244-15.

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Matisoff, Bernard S. "Electronics Packaging Design and Engineering." In Handbook Of Electronics Packaging Design and Engineering. Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-011-7047-5_1.

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Artés, Francisco, Perla A. Gómez, Encarna Aguayo, and Francisco Artés-Hernández. "Modified Atmosphere Packaging." In Handbook of Food Safety Engineering. Wiley-Blackwell, 2012. http://dx.doi.org/10.1002/9781444355321.ch22.

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Conference papers on the topic "Packaging engineering"

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Emond, Jean-Pierre. "Packaging for Citrus Juices." In ASME 2004 Citrus Engineering Conference. American Society of Mechanical Engineers, 2004. http://dx.doi.org/10.1115/cec2004-5001.

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Packaging is usually referred to as the container holding a specific product. It is more accurate to refer to a packaging system, since many components are used together to make a package able to meet the needs of a product. A packaging system must meet four specific objectives: • to protect the product • to extend product shelf life • to communicate the product to the customer • to be convenient to the customer A packaging system has many components and several levels of packaging. For example, a packaging system must include a shipping container where inside packaging units are found, which

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Caers, J. F. J. M., X. J. Zhao, J. Mooren, L. Stulens, and E. Eggink. "Design for reliability - a Reliability Engineering Framework." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582735.

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TOMARCHIO, A. "Concurrent engineering - Electronic packaging methodology yields quality improvements." In Aircraft Design and Operations Meeting. American Institute of Aeronautics and Astronautics, 1991. http://dx.doi.org/10.2514/6.1991-3153.

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McCarley, Paul L., and Mickie A. Phipps. "Signal processor packaging design." In Optical Engineering and Photonics in Aerospace Sensing, edited by Lynn E. Garn and Lynda L. Graceffo. SPIE, 1993. http://dx.doi.org/10.1117/12.161436.

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Gehring and Selberherr. "Evolution of current transport models for engineering applications." In Electrical Performance of Electronic Packaging. IEEE, 2004. http://dx.doi.org/10.1109/iwce.2004.1407298.

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Ardiani, Septia, and Nurul Akmalia. "E-exhibition of Packaging Products as An Appreciation and Promotion Media for Packaging Engineering Students." In Proceedings of the First Jakarta International Conference on Multidisciplinary Studies Towards Creative Industries, JICOMS 2022, 16 November 2022, Jakarta, Indonesia. EAI, 2022. http://dx.doi.org/10.4108/eai.16-11-2022.2326062.

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McDonald, John. "Citrus Packaging and the Environment." In ASME 1990 Citrus Engineering Conference. American Society of Mechanical Engineers, 1990. http://dx.doi.org/10.1115/cec1990-3602.

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Say the word “environment” today, and most likely you will generate some sort of a response. It’s one of our society’s hot issues and we have seen Washington, from President Bush on down, and many of our states and cities jumping on the environmental issue because there are real problems that need to be solved and, in addition, it appears to be good politics. Solid waste is part of the environmental issue and packaging is part of solid waste. So, I would like to take you through how we, at Continental Can, are looking at this. We are one of the leading packaging producers with seven domestic d

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Beyler Çiğil, Aslı. "Biobased intelligent packaging application." In 10th International Symposium on Graphic Engineering and Design. University of Novi Sad, Faculty of technical sciences, Department of graphic engineering and design,, 2020. http://dx.doi.org/10.24867/grid-2020-p40.

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Changes in consumer preferences in order to reach safe food have led to innovations in packaging technologies. Intelligent and active packaging is a constantly developed packaging technology that plans to offer safer and higher quality products. Active packaging refers to the inclusion of additives in the package in order to maintain and / or extend shelf life and product quality. Intelligent systems, on the other hand, are systems that monitor the status of packaged food during this entire period to provide information about the quality of the packaged during storage and transportation. The a

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Tan, Qing. "Packaging Technology for MEMS." In ASME 2000 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2000. http://dx.doi.org/10.1115/imece2000-1157.

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Abstract A review is given for MEMS devices fabricated using packaging materials. From reported literatures and patents, a variety of ceramic and plastic materials have been used for many microdevices. The green tape process for ceramic, flexible circuit and printed circuit board process platforms are all found to be suitable for 3-D, complex MEMS devices. In addition, micromolding and laser machining are reported for plastic materials. Devices fabricated from those materials include micromotors, sensors, biomedical chips, fuel cells, microchemical reaction chambers, micromirrors, microlens sy

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Wilkinson III, Frank. "Methodology for packaging reliable scintillation detectors." In Optical Engineering + Applications, edited by F. Patrick Doty, H. Bradford Barber, and Hans Roehrig. SPIE, 2007. http://dx.doi.org/10.1117/12.740809.

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Reports on the topic "Packaging engineering"

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Rivera, Wayne, and Marissa Martinez. DOE Packaging Certification Program Engineering Class Demonstration Tests. Office of Scientific and Technical Information (OSTI), 2022. http://dx.doi.org/10.2172/1886201.

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BRANTLEY, W. M. TRANSPORTATION & PACKAGING ENGINEERING STUDY FOR THE BULK VITRIFICATION CONTAINER. Office of Scientific and Technical Information (OSTI), 2004. http://dx.doi.org/10.2172/833517.

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Stone, Timothy, John Davis, Tristan Karns, Joshua Narlesky, and David Grow. Rules of Use Report Engineering evaluations of nuclear material storage containers against the packaging requirements at TA-55. Office of Scientific and Technical Information (OSTI), 2021. http://dx.doi.org/10.2172/1823726.

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Davis, John. FY22 Rules of Use Report Engineering evaluations of nuclear material storage containers against the packaging requirements at TA-55. Office of Scientific and Technical Information (OSTI), 2022. http://dx.doi.org/10.2172/1889938.

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Havlovick, B. J. Safety analysis report for packaging for the Idaho National Engineering Laboratory TRA Type 1 Shipping Container and TRA Type 2 Shipping Capsule. Office of Scientific and Technical Information (OSTI), 1992. http://dx.doi.org/10.2172/10188485.

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Havlovick, B. Safety analysis report for packaging for the Idaho National Engineering Laboratory TRA Type 1 Shipping Container and TRA Type 2 Shipping Capsule. Office of Scientific and Technical Information (OSTI), 1992. http://dx.doi.org/10.2172/6962232.

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Kimble, Ashley, Derek Muensterman, Liliana Cahuas, et al. Extraction and analysis of per- and polyfluoroalkyl Substances (PFAS) from Meals Ready-to-Eat (MRE) films using GC-MS and LC-MS/MS. Engineer Research and Development Center (U.S.), 2023. http://dx.doi.org/10.21079/11681/47114.

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This work was in response to the Defense Logistic Agency’s (DLA) Subsistence Network Broad Agency Announcement, BAA-0003-16 addressing 2019 NDAA Section 329 that states packaging materials used for Meals Ready-to-Eat (MRE) that contact food products must be free of per- and polyfluoroalkyl substances (PFAS). This was addressed by determining the presence or absence of PFAS on MREs by extraction followed by gas chromatography mass spectrometry (GC-MS) and liquid chromatography tandem mass spectrometry (LC-MS/MS). Any samples positive for PFAS were quantitated using LC triple quadrupole (QqQ) MS

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