Books on the topic 'Packaging engineering'
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Packaging engineering resources: An annotated compendium. Lancaster: Technomic Pub. Co., 1990.
Find full textJ, Kelsey Robert, and Forcinio Hallie E, eds. Handbook of package engineering. 3rd ed. Lancaster, Pa: Technomic Pub. Co., 1998.
Find full textKelsey, Robert J. Handbook of package engineering. 4th ed. Boca Raton, Fla: CRC, 2005.
Find full textTummala, Rao R. Microelectronics Packaging Handbook: Technology Drivers Part I. Boston, MA: Springer US, 1997.
Find full textMatisoff, Bernard S. Handbook Of Electronics Packaging Design and Engineering. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-011-7047-5.
Full textHandbook of electronics packaging design and engineering. 2nd ed. New York: Van Nostrand Reinhold, 1990.
Find full textPackaging of electronic systems: A mechanical engineering approach. New York: McGraw-Hill, 1990.
Find full textKuang, Ken. RF and microwave microelectronics packaging. New York: Springer, 2010.
Find full textLee, Y. C. Manufacturing Challenges in Electronic Packaging. Boston, MA: Springer US, 1998.
Find full textRandy, Lo, ed. Semiconductor packaging: Materials interactions and reliability. Boca Raton, FL: CRC Press, 2011.
Find full textOsborn, Kenton R. Plastic films: Technologyand packaging applications. Lancaster, Penn: Technomic, 1992.
Find full textMcKeown, Stephen A. Mechanical analysis of electronic packaging systems. New York: Marcel Dekker, 1999.
Find full textL, Yam Kit, ed. The Wiley encyclopedia of packaging technology. 3rd ed. Hoboken, N.J: John Wiley & Sons, 2009.
Find full textL, Yam Kit, ed. The Wiley encyclopedia of packaging technology. 3rd ed. Hoboken, N.J: John Wiley & Sons, 2009.
Find full textL, Yam Kit, ed. The Wiley encyclopedia of packaging technology. 3rd ed. Hoboken, N.J: John Wiley & Sons, 2009.
Find full textHarper, John C. d. 1974. and Harper, John C. d. 1974., eds. Elements of food engineering. 2nd ed. New York: Van Nostrand Reinhold, 1988.
Find full textSeok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-77872-3.
Full textA, Jenkins Wilmer, ed. Plastic films: Technology and packaging applications. Lancaster, Penn: Technomic Pub. Co., 1992.
Find full textArvanitoyannis, Ioannis. Modified atmosphere and active packaging technologies. Boca Raton, FL: Taylor & Francis, 2012.
Find full textJin, Yufeng. Introduction to microsystem packaging technology. Boca Raton: Taylor & Francis, 2010.
Find full textMorris, Scott A. Food Packaging Engineering. Blackwell Publishing Professional, 2008.
Find full textMorris, Scott A. Food and Package Engineering. Wiley & Sons, Incorporated, John, 2022.
Find full textMorris, Scott A. Food and Package Engineering. Wiley & Sons, Incorporated, John, 2011.
Find full textMorris, Scott A. Food and Package Engineering. Wiley & Sons, Incorporated, John, 2022.
Find full textMorris, Scott A. Food and Package Engineering. Wiley & Sons, Incorporated, John, 2022.
Find full textMorris, Scott A. Food and Package Engineering. Wiley & Sons, Incorporated, John, 2011.
Find full textMorris, Scott A. Food and Package Engineering. Wiley & Sons, Incorporated, John, 2011.
Find full textLewis, Helen, Karli Verghese, and Leanne Fitzpatrick. Packaging for Sustainability. Springer, 2014.
Find full textLewis, Helen, Karli Verghese, and Leanne Fitzpatrick. Packaging for Sustainability. Springer, 2012.
Find full textKelsey, Robert J., Joseph F. Hanlon, and Hallie Forcinio. Handbook of Package Engineering, Third Edition. Taylor & Francis Group, 2015.
Find full textKlopfenstein, Alan G., Rao R. Tummala, and Eugene J. Pymaszewski. Microelectronics Packaging Handbook: Technologies (Electrical Engineering). Springer, 1996.
Find full textDally, James W. Packaging of Electronic Systems: A Mechanical Engineering Approach (Mcgraw Hill Series in Mechanical Engineering). McGraw-Hill Companies, 1991.
Find full textDally, James W. Packaging of Electronic Systems: A Mechanical Engineering Approach (Mcgraw Hill Series in Mechanical Engineering). McGraw-Hill Companies, 1991.
Find full textPackaging for Food Preservation Food Engineering Series. Springer-Verlag New York Inc., 2013.
Find full textGreig, William J. Integrated Circuit Packaging, Assembly and Interconnections. Springer, 2010.
Find full textGreig, William J. Integrated Circuit Packaging, Assembly and Interconnections. Springer, 2007.
Find full textShakespeare, Walter J., and William R. Heffner. Component Packaging in Optoelectronics (Dekker Mechanical Engineering). CRC, 2006.
Find full textMatisoff, Bernard S. Handbook Of Electronics Packaging Design and Engineering. Springer, 2012.
Find full textMatisoff, Bernard S. Handbook of Electronics Packaging Design and Engineering. Springer London, Limited, 2012.
Find full textMatisoff, Bernard S. Handbook of Electronics Packaging Design and Engineering. Springer London, Limited, 2012.
Find full textElectronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium: Selected, Peer Reviewed Papers from the Electronic Packaging Interconnect Technology Symposium , November 1-2, 2017, Fukuoka, Japan. Trans Tech Publications, Limited, 2018.
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