Dissertations / Theses: 'Packaging engineering'

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Pinem, Mekro Permana. "Nanofluid engineering of chitosan-based edible packaging." Thesis, Compiègne, 2021. http://www.theses.fr/2021COMP2585.

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Les exigences en termes de qualité et de sécurité lors de la transformation et de la distribution des produits alimentaires nécessitent l'utilisation d'emballages adaptés pour éviter leur dégradation et prolonger leur durée de conservation ainsi que pour préserver leurs qualités organoleptiques dans le respect des contraintes de sécurité et écologiques. Cependant, actuellement, la plupart de ces emballages plastiques sont fabriqués à partir de dérivés pétrosourcés ce qui a des conséquences délétères sur l‘environnement augmentant la production de déchets et la pollution des écosystèmes. Une approche pour surmonter ce problème consiste à remplacer les plastiques conventionnels par des matériaux biosourcés qui peuvent être produits à partir de substances naturelles qui seront dégradées dans la nature. Parmi les divers biopolymères existants, le chitosan apparaît comme un bon candidat en raison de ses propriétés antimicrobiennes et filmogènes connues qui sont favorables à des fins d'emballage. Cependant, les propriétés mécaniques des films plastiques à base de chitosan ne sont pas suffisantes et il est souvent nécessaire d'y ajouter d'autres composants tels que la cellulose pour les améliorer. De plus, récemment, il a également été décrit que l'utilisation de ces biopolymères dans leurs nanoformes pourrait grandement améliorer leurs propriétés. Cependant, l'extraction de ces biopolymères et leur transformation en nanomatériaux impliquent des procédures qui ne respectent pas toujours les principes de la chimie et des procédés verts. Dans ce travail, nous proposons le développement de protocoles plus écoresponsables basés sur les micro-ondes et les ultrasons pour produire de la nanocellulose à partir de cellulose bactérienne ainsi que du chitosan à partir de la chitine. De plus des films bioplastiques à partir de chitosane et de cellulose sont préparés et l‘impact de l'utilisation de nanoformes de ces polymères sur les propriétés du film est évalués. Pour améliorer la résistance à l'eau du film, des émulsions à la cire d'abeille ont été aussi préparées et l'impact de leurs formulations sur les propriétés du film a été étudiée. Enfin, la dynamique d'impact des gouttelettes de cette dernière formulation a été évaluée pour étudier la potentialité de son utilisation pour une application par pulvérisation
The requirements in terms of quality and safety during the processing and distribution of food products require the use of suitable packaging to prevent their degradation and extend their shelf life as well as to preserve their organoleptic qualities while respecting safety and ecological constraints. However, currently, most of these packagings are made from oil-based plastic which has defective consequences on waste generation and ecosystem pollution. One approach to overcome this issue is to replace conventional plastics with bio-based materials which can be produced from natural substances and degraded in nature. Among the various existing biopolymers, chitosan appears to be a good candidate due to its known antimicrobial and filmforming properties which are favorable for packaging purposes. However, the mechanical properties of chitosan-based plastic films are not sufficient and it is often necessary to add other components such as cellulose to them to improve their mechanical properties. Moreover, recently it has also been described that the utilization of these biopolymers in their nanoforms could greatly enhance their properties. However, the extraction of these biopolymers and their transformation into nanomaterials involve procedures that do not always comply with the principles of green chemistry and processes. In this work, we propose the development of ecological protocols based on microwaves and ultrasound to produce nanocellulose from bacterial cellulose as well as chitosan from chitin. Furthermore, we prepared bioplastic films from chitosan and cellulose and evaluated the properties of the film when using nanoforms of these polymers. To improve the water resistanceof the film, emulsions with beeswax were prepared and the impact of their formulations on the properties of the film was studied. Finally, the impact dynamics of the droplets of the latter formulation was evaluated to study the potentiality of its use for application by spraying

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Dahl, Emil. "MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging." Thesis, Linköpings universitet, Elektroniska Kretsar och System, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-165429.

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This thesis studies the options of using PCB embedding bare die power MOSFET and new packaging of MOSFET to increase the power density in a PCB. This is to decrease the winding losses in an isolated DC/DC converter which, according to "Flex Power Modules", can be done by improving the interleaving between the layers of the transformer and/or decreasing the AC loop. To test the MOSFET packaging two layout are made from a reference PCB, one using embedded MOSFET and the other using the new packaging. The leakage induction and winding losses are simulated and if they are lower compared to the reference PCB prototypes are manufactured. The simulated result is that PCB embedded MOSFET decrease the leakage induction but the winding loss is higher. With the new packaging the leakage induction is higher and the winding loss has linear characteristics. Only the PCB with the new MOSFET packaging is made because the MOSFET die gate pad is too small for the PCB manufacturer to make a via connection to it. The PCB is tested that it operates as a DC/DC converter with a 40-60 V input and a 12 V output. The PCB is put on a test board in a wind-tunnel to test its characteristics under different wind speeds, input voltage and loads. The result is that the PCB has a higher efficiency than the reference PCB but it has worse thermal resistance. Further development of the design needs to be made to improve the thermal resistance. Using new packaging is a way to continue the development of power converter with lower efficiency but embedding MOSFET needs a less complicated manufacturing process before there is any widespread usage.

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Alkozei, Mirwais, and Dipta Subhra Guha. "Optimizing packaging management." Thesis, KTH, Skolan för industriell teknik och management (ITM), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-302449.

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This project was carried out at Saint Gobain Sekurit AB. The company is a leading manufacturer ofglazing and operates within the automotive industry. The purpose of the project was to create a supply chain model to optimize the packaging management of racks which are customer owned. These are used to transport finished products to the customers of Saint Gobain. When the empty packaging is return it is stored until needed for production. The company needs to optimize the management and tracking of racks for which the company intends to develop a solution model which can provide the company with the needed information for better management and tracking. The project entailed to define parameters in the company’s IT environment and make sure that they can be used in practice. The cockpit has been categorized into three different hard coded modules which are built in Excel VBA, and an analysis module. The hard coded modules do the following: - Give visual, easy to read, overview of stocks- Generate triggers for operational actions to avoid shortages of racks and to minimize costs- Allow easy reconciliation with movements in customers portal and ease the reclamation process The analysis module of the cockpit functions as a basis for providing input for strategic decisions considering investment, layout of storage, and scrap. The design specification of the cockpit has been based of the needs of the stakeholders in the company and it has been built based on the available reports. Furthermore, user instructions has been developed, and selected personell has been trained in the usage of the implemented cockpit.
Detta projekt genomfördes på Saint Gobain Sekurit AB. Företaget är en ledande tillverkare av glasrutor och verkar inom fordonsindustrin. Syftet var att skapa en leveranskedjemodell för att optimera hanteringen av återanvändbara ställningar som ägs av kunder. Dessa används för att transportera färdiga produkter till Saint Gobains kunder. När en tom ställning returneras lagras den tills den behövs för produktion. Vad företaget behövde var optimering av hantering och spårning av återanvändbara ställningar vilket företaget ville bygga en cockpit för att tillhandahålla nödvändig information. Projektet innebar att definiera parametrar i företagets IT-miljö och se till att dessa kan användas i praktiken. Cockpiten har delats in i tre olika hårdkodade moduler som är byggda i Excel VBA, och en analysmodul. De hårdkodade modulerna gör följande: - ger en visuell, lättläst översikt över lagerstatus- genererar utlösare för operativa åtgärder för att undvika brist och minimera kostnader- möjliggör enkel avstämning med rörelser i kundportalen och underlättar reklamationsprocessen Cockpitens analysmodul fungerar som en grund för att ge input för strategiska beslut med tanke på investeringar, lagerlayout och skrotning. Designspecifikationen för cockpiten har baserats på behoven hos intressenterna i företaget och cockpiten har byggts utifrån tillgängliga rapporter. Dessutom har användarinstruktioner utvecklats och personal på företaget utbildats i användningen av den implementerade cockpiten.

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Bridge, David Richard. "Aspects of electronic device packaging." Thesis, University of Warwick, 1986. http://wrap.warwick.ac.uk/58807/.

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For this work cordierite has been investigated as a possible substitute substrate material for alumina, with particular emphasis on its role in multilayer device packaging. By limiting the processing temperatures to below 1000oC, copper could be used as the conductor material. Milled glass powder was made into thin sheet form by a doctor blading technique and, once dried, the copper screen printed on top. After lamination and firing, the conductor was completely encapsulated by the cordierite matrix. Copper diffusion occ~red with metallic copper precipitating out although a small denuded zone was evident around the periphery of the conductor. This was due to compositional changes occurring there. Experiment showed that the effects of glass particle shape, average size and size distribution lead to deviation in the shrinking of compacts from the theoretical sintering curves. An unstable ~ phase was the first to appear on the glass particle surfaces although another, unidentifiable phase, was also found to exist during the very early stages of crystallization. This was followed shortly after by bulk crystallization of ~ cordierite in the remaining glass, possibly being aided by a prior phase separation. Further heat treatment lead to the transformation to a cordie rite and the formation of enstatite, the exact transformation temperature depending upon the minor oxide additives in the glass. At temperatures above ~10500C protoenstatite formed and lead to a general degradation in material properties. The benefit from having a cordie rite as the principal phase is a low dielectric constant (5.35) and loss angle (5 x 10-4), reasonable strength (130 MPa) and high resistivity (~1015 Qcm). This makes it a suitable replacement for alumina although its low thermal conductivity (~2 Wm-lK-l) is a drawback. By adjusting the MgO/A1203 ratio, the material could be expansion matched to that of silicon.

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Zubair, Muhammed 1962. "Aluminoborophosphosilicate glasses for microelectronics packaging." Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/277898.

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Glasses are used in microelectronic packaging for insulation and passivation purposes. To optimize the performance of these packages, it is necessary to investigate new glasses or improve on properties of the glasses in use. The insulating glass should have low dielectric constant, low dissipation factor, low glass transition temperature, high chemical resistivity, and a thermal expansion coefficient matching the substrate. In this study, various aluminoborophosphosilicate glasses containing Ca(Mg)O, Ca(Mg)F₂, and AlF₃ as flux were investigated. Processing temperatures for these glasses range from 1300°C to 1500°C. The coefficients of thermal expansion range from 4.52 μ/°C to 9.39 μ/°C. The dielectric constant as a function of frequency and composition is in the range of 4.1 to 5.2. The index of refraction for these glasses is in the range of 1.52 to 1.58. Glass transition and softening temperatures as low as 538°C and 622°C, respective, were found. Results of this investigation are discussed in terms of the possible use of aluminoborophosphosilicate glasses in microelectronic packaging.

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Rao, Jayathirtha M. "Viscoelastic behavior of electronic packaging materials /." The Ohio State University, 1996. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487932351058575.

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Williams, Callida A. "Packaging System Redesign: A Study in Designing More Sustainable Product Packaging Systems." The Ohio State University, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=osu1281970963.

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Khurana, Pritha. "Optoelectronic circuit design, packaging and characterization." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape11/PQDD_0026/MQ50630.pdf.

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Tollner, Martin Ernst. "Designing and modelling an automated packaging system." Master's thesis, University of Cape Town, 1997. http://hdl.handle.net/11427/9498.

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Bibliography: leaves 99-102.
This thesis describes the design and modelling of an improved materials handling system for a beverage cap production factory called BevCap, located in Epping, Cape Town. The factory consists of twelve production lines, which produce various types of aluminium and metal screw on caps. Each production line is fully automated except for the filling, packaging, labelling and storing procedures at the end of each production line. The finished product is counted electronically and packed into carton boxes, labelled, sealed and palletised manually. The manual materials handling procedures, at the end of each production line, are causing problems and therefore an improved automated system is required.

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Lomangino, F. Paul. "Grammar- and optimization-based mechanical packaging." Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/15848.

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Palakodety, Ravi (Ravi Kiran). "Investigating packaging effects on bandgap references." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/41665.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007.
Includes bibliographical references (p. 95-96).
This thesis investigates packaging effects on precision bandgap voltage references used in LTC switching regulators. Packaging stress causes a mean offset and room temperature distribution widening of the bandgap reference output voltage, as well as inconsistent temperature characteristics. Bandgap references with and without a proprietary stress-relief mechanism were compared to determine the impact of packaging stress on reference performance. References without stress-relief showed a mean offset of -2.3mV and spread of 10mV, while references with stress-relief showed a mean offset of -2.0mV and spread of 3.6mV. References with stress relief exhibited more consistent temperature coefficients than references without stress relief. A test chip was fabricated to allow measurement of VBE and AVBE within the bandgap reference. Parts with stress-relief showed tighter VBE and AVBE distributions, as well as more favorable temperature characteristics. The experiments in this thesis show that stress-relief is effective at improving bandgap reference performance.
by Ravi Palakodety.
M.Eng.

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Swan, Ian R. "3-D thermal modelling of power device packaging." Thesis, University of Warwick, 2010. http://wrap.warwick.ac.uk/35619/.

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Power converters enable e±cient conversion of electric power, thereby reducing power consumption and cost. The key enabling technologies inside power converters, typically used in hybrid electric vehicles, are the semiconductor devices. Device reliability is of high priority because they generate heat from the dissipation of electric power which can lead to failure if the device maximum junction temperature is exceeded. Furthermore, device temperatures can vary largely in switching applications, leading to thermal-mechanical fatigue failure. As electronic designers are pushed to deliver smaller and more powerful packages, they are finding thermal issues increasingly di±cult to solve. The primary goal of this thesis is to develop a fast and accurate thermal simulation design tool which is capable of simulating realistic power converter operation. Most commercial thermal simulators use finite-element software. Despite their perceived accuracy, they suffer from severe computational requirements and offer limited ability to explore power converter packaging converter designs during realistic converter operation. Traditional approaches using R-C networks as thermal equivalent circuits are of little use as a design tool since for every geometrical layout of the packaging structure which is tested, the designer must return to the starting point which is either a time-consuming FE simulation or a practical experiment. The Fourier thermal model presented in this thesis is a purely conductive model requiring no parameter extraction or use of a FE simulator. The starting point for the Fourier model is the heat equation. The Fourier thermal model yields solutions to the heat equation by carrying out spatial discretisation using a truncated Fourier series and using MATLAB/Simulink to perform temporal discretisation using a dynamic ODE solver. Validation using the finite volume thermal simulator FLOTHERM showed that the transient Fourier model could accurately simulate 3-D heat conduction through a wide range of power converter packaging structures. The Fourier thermal model is an excellent early stage design tool because its simulation speed is far superior to FLOTHERM, even though both models operate with a similar accuracy. The use of MATLAB/Simulink as the simulation environment enabled the Fourier thermal model to operate within the framework of an electro-thermal simulator and therefore simulate realistic load conditions. This is major advantage over existing approaches which fail to simulate electro-thermal interaction. Experimental validation of the fast electro-thermal converter simulator was achieved by utilising an inverter back-to-back rig and recording transient device temperatures using an infrared camera. The similarity between the experimental and simulated results indicated that the Fourier thermal model was sufficiently accurate. The electro-thermal simulator operated at a simulation speed which was ten times real time, which is extremely fast compared to existing approaches which can take up to two days to simulate a 60 second drive cycle. 'Ten times real time' represents a significant step forward for power converter packaging design. In the future device reliability can be accurately predicted if the electro-thermal simulator model is combined with a reliability model. The potential of the Fourier thermal model to aid numerical optimisation of the whole power converter is exciting.

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Malik, Asif. "OPISA optoelectronics packaging interfaces for sub-micron alignment." Thesis, University of Greenwich, 2014. http://gala.gre.ac.uk/18142/.

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For optoelectronic devices submicron precision is required to optimally couple the laser source with the optical fibre. Laser welding is used because of its inherent attributes of accuracy, strength, cleanliness and minimised heat affected zone and structural changes. Due to the rapid solidification of the welded parts post welding residual stresses occur which can lead to a post weld shift between the aligned components and can significantly reduce the light coupling efficiency. Submicron misalignment induced due to the welding process can result in significant power loss. This is a serious and common issue in the manufacture of optoelectronic components and affects production rates. The aim of this work is the development of a methodology that can estimate the residual stresses in the weld piece and to optimise the process by locating the optimal site for micro laser welding. The aim establishes the research question which was addressed by nine objectives. The first eight objectives are elements that comprise the Optoelectronic Packaging Interfaces for Sub-Micron Alignment (OPISA) project. The final objective is the dissemination of this work. Finite element models were developed and used with design of experiments (DoE) statistical technique. This was used to investigate how the key process parameters influence the resultant stress in the optical fibre and to develop a predictive surrogate model. The surrogate model was used with Monte Carlo simulations to determine the fibre stress variation when uncertainty and variation of the design variables are accounted for. The Monte Carlo simulations predicted fibre stress response values which were used to understand how the uncertainties of the input design variables propagate into uncertainty and variation of fibre stress. The surrogate model was used in a sensitivity and risk analysis. The capability analysis of the welding process was also investigated. The original finding of this work is the development of a methodology that fulfils the aim. The work successfully demonstrated that the current industry weld spot location generate 180MPa of post weld stress in the optical fibre. Using the OPISA methodology the optimal weld locations generate 57.6MPa of post weld stress in the optical fibre.

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Dube, Manu. "Constitutive modeling of joining materials in electronic packaging." Diss., The University of Arizona, 2004. http://hdl.handle.net/10150/280470.

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Modeling simplifications for complex material behavior may lead to unanticipated errors under generalized loading conditions, which are difficult to detect in finite element analyses. This work analyzes existing models under simple loading conditions where the nature of the results is known a priori, and proposes new models to overcome the limitations detected. Elastic and elastoplastic formulations for loading-dependent material parameters are generalized, and limitations of the rate-dependent elastoplastic simulation and the Perzyna viscoplastic formulation are discussed. A yield function that provides continuous yielding irrespective of the direction of loading and does not generate spurious plastic strain increments under temperature change is developed. A thermomechanical model based on the concept of superposition of asymptotic phases is also proposed, with generalized stress-strain-temperature relationships that intrinsically predict the variation of the coefficient of thermal expansion and elastic constants with temperature, and is validated for aluminum, lead, tin and solder. A plastic yield criterion shown to be in general agreement with hardening based on dislocation density and a preliminary empirical creep equation for lead-tin eutectic solder are developed as part of the thermomechanical model. Finally an approximate dissipated-work based formulation for the Disturbed State Concept of Desai (2001) is developed and limitations of DSC assumptions are discussed. Validations are conducted for the eutectic lead-tin data of Wang et al. (2001), with prior parameters being shown to require recomputation.

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Kabal, David. "Packaging of surface active optoelectronic device arrays." Thesis, McGill University, 1997. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=20503.

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Requirements of electronic systems are increasing, as the applications for these systems become more complex and require more bandwidth. Optical interconnection can help satisfy these system requirements. In order for an optical interconnect to be successful, system design must satisfy new demands on the packaging of the optically interconnected devices, different from those encountered in packaging electronic interconnects.
This thesis addresses the issues faced in designing the packaging for a two-dimensional array of surface active optoelectronic devices, within the framework of a free-space optically interconnected backplane. Two demonstrator systems' packaging are presented, as well as a general discussion of the issues and constraints involved in the design, assembly and testing of this packaging. These issues include connectivity, bandwidth, thermal management, optomechanical interfacing and space constraints.
The particular optoelectronic devices examined are Quantum Confined Stark Effect (QCSE) modulators and detectors. The impact of temperature sensitivity on these particular devices is examined, and a technique for optimizing their performance at a specific temperature is presented. As a thermal diagnostic aid, as well as a thermal management tool, the design and characterization of an array of temperature sensors integrated into an optoelectronic device array is presented.

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Ho, Duc Hong Linh 1978. "Packaging for a drug delivery microelectromechanical system." Thesis, Massachusetts Institute of Technology, 2005. http://hdl.handle.net/1721.1/30262.

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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2005.
Includes bibliographical references (p. 52-55).
Local drug delivery is a fast expanding field, and has been a center of attention for researchers in medicine in the last decade. Its advantages over systemic drug delivery are clear in cancer therapy, with localized tumors. A silicon microelectromechanical drug delivery device was fabricated for the purpose of delivering chemotherapeutic agents such-as carmustine, a potent brain cancer drug, directly to the site of the tumor. Limitations in the delivery capacity of the device led to the design of a new package. This package is made from thermally bonded Pyrex® 7740 frames that are anodically bonded to the drug delivery chip. It increases the capacity of the chip, is smaller than the previous package and possesses true hermeticity, because of the bonding processes involved. This work describes the fabrication steps of the new package and a problem with the thermal bonding of Pyrex® frames preventing the achievement of a package true to the original design. A temporary solution was devised and the completed package was tested with regards to its intended goals. It managed to increase the load capacity of the chip by a, factor of 10, with potential for more, while decreasing the overall size of the package. Short-term hermeticity was achieved for this package by using a UV-cured epoxy to bond some pieces, which was not in the original design. Future work will focus on finding a permanent solution to the aforementioned problem, and directions for it were suggested.
by Hong Linh Ho Duc.
S.M.

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Lee, Chieh-feng. "Packaging solution for VLSI electronic photonic chips." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/42155.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007.
Includes bibliographical references.
As the demand of information capacity grows, the adoption of optical technology will increase. The issue of resistance and capacitance is limiting the electronic transmission bandwidth while fiber optic delivers data at the speed of light and is only limited by scattering as well as absorption. Electronic-photonic convergence is needed for communication systems to meet the performance requirement. Hence, an increasing number of Very-Large-Scale Integration (VLSI) electronic photonic chips are going to be designed and utilized. However, packaging for the chip is one of the major challenges for optoelectronic industry to overcome due to its high cost and lack of standards. This thesis examines the trend in semiconductor technology and also in the package performance requirement. A transceiver platform to meet the future information capacity demand is proposed by reviewing several materials and devices of current state. Lastly, the package design is demonstrated with the analysis of cost, performance, and materials.
by Chieh-feng Lee.
M.Eng.

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BÄCKSTRÖM, SOFIA. "The road towards anintegrated packaging management strategy : A case study on a packaging networkat a ski brand." Thesis, KTH, Skolan för industriell teknik och management (ITM), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-223888.

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Obatoyinbo, Adesunloye. "Supply chain packaging : packaging for optimal inter-region distribution center operations and damage prevention." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/37238.

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Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2006.
Includes bibliographical references (p. 65).
Honeywell International Corporation is a $27.5 billion [1] conglomerate with a diverse portfolio of businesses covering Aerospace, Automation and Controls, Specialty Materials and Transportation. Honeywell's Automation and Controls Solutions (ACS) business is the second largest business group with $9.4 billion in sales in 2005. This business group is further divided into the following strategic business units: * Security (Facilities) * Life Safety * Building Solutions * Process Solutions * Sensing and Control * Environmental and Combustion Controls The Environmental and Combustion Controls (ECC) business unit of Honeywell ACS maintains a global manufacturing and distribution presence. ECC delivers complex systems that control air, water and combustion for both homes and industrial customers. Historically, ECC plants in the EMEA (Europe, Middle East and Africa) region have either had their own warehouses or had a captive third party provider that provided warehousing services offsite. However, recent initiatives in the region have culminated in the adoption of a regional distribution center model. Essentially, clusters of plants are grouped into regions that are served by the same warehouse or distribution center.
(cont.) The regional warehouse in Heilbronn Germany (ERD) is the pilot for such a system. Plants in Emmen in the Netherlands, Brno in the Czech Republic, Nagykanisza in Hungary and Schoenaich and Mosbach in Germany, as well as some small Low Risk Distribution (LRD) centers - which stock emergency volumes - in western Europe will all be consolidated and served from the distribution center in Heilbronn. This essentially means that instead of storing their own inventory, all the affected plants will truck all production to the Heilbronn warehouse on a daily basis. The Heilbronn warehouse, which commenced operation in May, 2005 subsequently fulfills all customer orders associated with the locations listed above. During the consolidation exercise, while planning for receipt of goods from the different plants, it became clear that there were multiple packaging standards in use throughout Europe. There thus arose the need to consolidate the different standards into a coherent well-defined standard to enable the new distribution center established at Heilbronn, Germany, to properly handle goods from the different plants.
(cont.) Additionally, the newly built ERD had a need for an established set of packing guidelines that may include procedural changes or the establishment of new procedures, changes to the physical setup of the outbound lines (freight and parcel), presentation and replenishment of packaging material and suggestions for improvement for the long term. Receiving guidelines have also been newly instituted for products arriving at the ERD, which also creates a case for compliance for goods being shipped from suppliers including a counterpart warehouse - the Louisville Distribution Center (LDC) - in Louisville, Kentucky. In addition, the LDC had been having difficulty receiving freight from the European plants. The major problems included inadequate labeling, lack of overpacking, inconsistency in packing of mixed pallets and the non-usage of Honeywell 40" X 32" pallets. Since all European plant shipments that formerly shipped directly from each plant would be shipping from ERD in Heilbronn going forward, it became imperative that appropriate packaging standards be developed (in Europe) in order to ensure compliance with receiving guidelines in Louisville at the LDC. Fulfillment through the distribution centers is what drives customer satisfaction.
(cont.) No matter how efficient the plants may be, transit through the distribution centers is the proverbial "last mile" that delivers all the efforts of the firm to the customers. I have developed and recommended a packaging standard, which outlines the levels to which packaged products must be tested in preparation for safe shipping. I analyzed current packing practice at the ERD showing relevant cost drivers and made recommendations on ways to pack in order to improve service to the downstream distribution center while keeping costs contained. I developed a framework to guide warehouse management with regards to pallet shipping decisions between the ERD and LDC. Finally, I developed a carton replenishment framework for the ERD that can be adopted for other appropriate ECC warehouses.
by Adesunloye Obatoyinbo.
S.M.
M.B.A.

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Ayliffe, Michael H. "Alignment and packaging techniques for two-dimensional free-space optical interconnects." Thesis, McGill University, 2001. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=37866.

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Two-dimensional free-space optical interconnects (2D-FSOIs) promise to deliver tremendous gains in bandwidth and architectural freedom for applications such as telecommunication switches and massively parallel computing systems. One major obstacle preventing the commercial deployment of 2D-FSOI systems is the problem of optical alignment, which is further exacerbated by the requirements that these systems be field-serviceable and able to sustain the harsh conditions of industrial environments.
This thesis proposes a broad range of solutions to alleviate this alignment problem. One important aspect of this work concerns the development of a generic packaging strategy, which consists of partitioning an optical system into separate modules in such a way that the loose tolerances are between the modules while the tight tolerances are between the components inside the modules. To accomplish this, novel alignment techniques are designed and demonstrated, including the use of integrated diffractive features, CMOS position detectors, ultrathick photoresist micro-structures, and semi-kinematic fixtures using dowel pins. In all cases, emphasis is placed on approaches that are amenable to low-cost manufacturing and high-volume production.
These techniques were developed in the context of a photonic backplane prototype experiment that demonstrated 1024 free-space interconnections between four optoelectronic-VLSI (OE-VLSI) chips. The design and implementation of a module integrating an OE-VLSI chip, a mini-lens array, a thermoelectric cooler and a heatsink is presented. Optomechanical, electrical and thermal characterization results are reported.
The other aspect of this work aims at identifying the types of optical designs that provide more generous misalignment tolerances. This is done by investigating various optical configurations for the design of the chip module. The central objective is to understand the underlying reasons that make one configuration more misalignment-tolerant than another. A significant outcome of this work is to show that the inherent misalignment tolerances of 2D-FSOI systems translates into an aspect-ratio limitation similar to the one found in electrical interconnects.

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Babader, A. "Effective waste management by enhancing reusable packaging." Thesis, Liverpool John Moores University, 2015. http://researchonline.ljmu.ac.uk/4468/.

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This research aims to propose an integrated method, which combines all the aspects required to reduce environmental impact from waste packaging and to increase knowledge on the best way to enhance reusable packaging. Through a review of the extant literature, a conceptual framework was designed of the most important dimensions to enhance reusable packaging amongst society and industries The main contributions in the research are the development of a Social Behaviour Aspect Model (SBAM) and the creation of reusable packaging attributes checklist. The SBAM can help industries focus on having high knowledge about reuse of packaging and to cooperate with communities to develop personal and social values and norms during the designing of reusable packaging. SBAM is the output from the first phase, which showed the importance of making an effort to develop packaging for consumers to reuse. The reusable packaging attributes checklist can provide a guideline for manufacturers/designers who intend to develop packaging sustainability performance through designing reusable packaging, and contribute to meet and interpret the reuse of packaging requirements and procedures. It also determines the environmental impact of reusable packaging attributes, which many industries are concerned about. The reusable packaging attributes checklist is the output from the second and third phases. The System Dynamic (SD) method was the approach used to determinate the interaction between social aspects and reusable packaging. The Normal Average, Codes and Coding and factor analysis with Principal Component Analysis (PCA) approaches were used to determine the reusable packaging attributes checklist. The last phase of the research was the conduction of a case study of a real company which needs to increase the amount of reusable packaging it uses and which seeks to reduce its environmental impact. All methods used in this research have both a quantitative and a qualitative nature. Data was collected by evaluation of consumers' responses and experts' experiences, as provided in the questionnaires. This research opens up opportunities for improving packaging and meeting sustainable profits and provides valuable information based on social, economic and environmental benefits of reusable packaging. The novelty of this research can help industries to investigate the most important areas for development within communities to enhance the use of reusable packaging and also facilitate the process-based change from one-way packaging to reusable packaging effectively with reduction of environmental impact.

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Müller, Luis Antonio 1969. "Modular semiconductor test, assembly & packaging manufacturing equipment design." Thesis, Massachusetts Institute of Technology, 1998. http://hdl.handle.net/1721.1/9840.

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Nemat, Babak. "Elucidating the Influence of Food Packaging Attributes on Source-separation of Food Packaging Waste at Home." Licentiate thesis, Högskolan i Borås, Akademin för textil, teknik och ekonomi, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:hb:diva-24007.

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The global amount of waste generated by households, including food packaging waste, has been increasing continuously across the world, posing a massive threat to societies and the environment. Proper waste management, therefore, has become a challenging environmental issue and a priority for governments. Along with the technological advances, such as material recovery technologies, more stress has been placed on the strategies for moving away from disposal to waste prevention, separation, and recycling. Considerable efforts are being made to not only limit the overall production and the negative impact of waste on the environment and human health but also to minimize the cost of waste management. Separation of wastes at the source (i.e., source separation) is an integral part of such efforts toward enhancing the purity of collected waste and improving the quality of materials for recycling. Furthermore, sorting of waste as a habitual performance can serve as a practice for improving residents' recycling/sorting behavior. The packaging waste, including food packaging, forms a significant part of the municipal solid waste. The design of food packaging, therefore, has received a lot of attention as a useful tool to influence the consumers' sorting behavior, making it an interesting concept for research related to waste management. Presumably, the design of food packaging can meet consumers' sorting demands while being instructive and facilitating the sorting process, thus enhancing the recycling rate of the food packaging waste. Finding the ideal form of food packaging, however, requires an in-depth understanding of the packaging-consumer interactions throughout the sorting process. Considering the different characteristics of food packaging, it is expected that different food packages tend to influence a consumer in different ways. Nevertheless, the current knowledge is somewhat too general to be used by packaging developers to improve the sorting of the food packaging. Hence, the present thesis aims to provide a more in-depth insight into the influence of food packaging, as a product and service provider, on the consumer's/user's decision-making on sort of food packaging waste. The results assert that packaging to be sorted properly requires proper design to manifest its sorting related abilities such as easy to empty, easy to clean, and easy to fold, for the consumer. Selecting material, visual attributes, form, and function can amplify or reduce these sorting abilities of food packaging.

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Jackson, Kathleen Anne, and Ling Bai Burke. "An assessment of the value of retail ready packaging." Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/45233.

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Thesis (M. Eng. in Logistics)--Massachusetts Institute of Technology, Engineering Systems Division, 2008.
Includes bibliographical references (leaves 78-79).
Use of retail-ready packaging reduces the costs of replenishing store shelves by eliminating the labor of removing packaging materials and stocking individual items on shelves. While reducing costs for retailers, retail-ready packaging formats increase costs for consumer products manufacturers. This research project assesses the use of retail-ready packaging across varying retailer types and products to determine conditions where the value of retail-ready packaging is maximized. Taking into account the supply chain benefits and costs for the retailer, six U.S. retail channels were selected for study: supermarket, wholesale club, limited assortment, super warehouse, drug and supercenter. One retailer from each of these categories was studied. The research found a wide range in opportunity for benefits and costs. The important factors influencing the net value of retail-ready packaging for retailers were product velocity, inventory carrying costs, SKU assortment relative to retail space and store replenishment procedures.
by Kathleen Anne Jackson and Ling Bai Burke.
M.Eng.in Logistics

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Cheng, Karen S. M. Massachusetts Institute of Technology. "Sustainable packaging approaches for current waste challenges." Thesis, Massachusetts Institute of Technology, 2019. https://hdl.handle.net/1721.1/122336.

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Thesis: S.M. in Engineering and Management, Massachusetts Institute of Technology, System Design and Management Program, 2019
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 61-65).
Packaging plays an essential role in protecting a product from damage, attracting consumers to purchase a product, and facilitating storage and consumption. Yet its appreciation and value is quickly eroded once the product is purchased and/or consumed and the package becomes waste. With the passing of China's National Sword policy in 2018, post-consumer materials recycling markets are threatened and resources are not being recovered due to high contamination rates. The development of new packaging material has surged in recent years but has not corresponded with development of the necessary recycling infrastructure. Consumers want to recycle but are confused about how to most effectively do so. Packaging continues to consume our finite resources and pollute our terrestrial and marine environments. This research takes a systems approach to understanding today's emerging waste challenges and identifies key obstacles that society should collectively solve. High impact opportunity areas include alignment amongst all key stakeholders, establishing standardized signage and labels, increasing consumer education, and tackling difficult-to-recycle materials through scaling up technology, enacting policy, providing materials alternatives with corresponding infrastructure, or redesigning packaging.
by Karen Cheng.
S.M. in Engineering and Management
S.M.inEngineeringandManagement Massachusetts Institute of Technology, System Design and Management Program

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Ribas, Garriga Mariona. "Evaluation of natural wax for green packaging applications." Thesis, Luleå tekniska universitet, Institutionen för teknikvetenskap och matematik, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-74848.

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Society has become more aware of the negative environmental impact of the petroleum-based packaging materials (e.g. plastics) used in the food industry. Therefore, cleaner and more sustainable packaging with ecological zero-impact is in demand. One of the solutions for this problem could be the use of natural wax-impregnated paper. It has been recently demonstrated that wax obtained from arctic berries may be a good candidate for this application. This project is intended to define the properties of this wax which are essential for the food-packaging application and evaluate if berry wax can fulfil those requirements. For this reason, physical characterization of different natural waxes has been conducted and compared. On the one hand, it has been concluded that pure arctic berry wax presents similar thermal parameters to commercially available natural waxes. In addition, mechanical testing and barrier properties of paper substrates coated with beeswax and lingonberry have been successfully carried out. During the testing, wax-coated samples showed interesting results in terms of good barrier properties, which is the key factor to be a promising alternative for food packaging applications. Nevertheless, further research should be conducted in order to study other barrier properties and mechanical performance of these natural wax-impregnated papers. In addition, it would be of great interest to investigate more precise coating procedures in order to obtain the optimum way for coating paper substrates with natural waxes.

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Ruddy, Bryan P. (Bryan Paul) 1983. "Design, fabrication and testing of low-cost vacuum insulated packaging." Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/32781.

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Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.
Includes bibliographical references (p. 35).
A design for the use of evacuated Perlite insulation in the shipment of perishable goods was analyzed, implemented, and evaluated, with the goal of replacing or reducing the amount of phase-change materials needed to ship such goods by standard package carriers. The package design makes use of inexpensive materials and relatively simple operations to completely surround perishable items in a layer of evacuated Perlite insulation, bounded by inner and outer bags of high-barrier film. A vacuum chamber and sealing apparatus were constructed in order to fabricate these evacuated Perlite packages, and a microcontroller-based temperature-logging sensor was developed and built for in-situ temperature measurement over several days' time span. Due to problems with the reliability of the fabrication apparatus and the package structure, no experimental data could be obtained to evaluate the performance of the package design with evacuated insulation. Control data validated the function of the temperature sensor, which may have applications to other projects. The package design still appears to be viable, but a more reliable sealing and evacuating apparatus must be constructed and a more robust way to package goods within the insulation layer must be devised.
by Bryan P. Ruddy.
S.B.

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28

Rose, Megan. "Packaging and sustainability : a study of a liquid paperboard pack." Master's thesis, University of Cape Town, 2013. http://hdl.handle.net/11427/5408.

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Includes abstract.
Includes bibliographical references.
The liquid paperboard (LPB) supply chain converts coated paperboard into single-use beveragecartons. The packaging industry claims to have engaged extensively with matters of sustainabilityand that it has taken many steps to improve resource efficiency associated with this type of packaging. Yet, the 2011 recycling rate of used beverage cartons (UBCs) in South Africa was 0.9%,implying that significant volumes are going to landfill disposal. UBCs are a source of high quality fullybleached furnish (paper fibres), which are routinely recovered and recycled in many other countries,and this practice has been shown by multiple life cycle assessments (LCAs) to reduce environmentalimpacts. The sustainability awareness of different actors in the LPB supply chain was assessed as the first objective, including both South African and international actors in the comparison. Similarities in sustainability reporting were determined by a content analysis of the annual reports supported by two analyses principled on multi-criteria analysis (MCA). The purposively chosen actors in the LPB supply chain were grouped into three namely, manufacturers, organisations and ‘retailers and brand owners’. An analysis using the three focal issues of the Nampak 2010 sustainability report, namely carbon footprint, recycling and training, as search terms shows variation in focus amongst manufacturers to be as wide as that in the two other groups though Stora Enso (an international manufacturer) is noted as having the having the most similar focus. PACSA is the organisation that has the most similar focus to the three Nampak-identified criteria. The four-criteria principled MCA with LCA as the fourth criterion indicates that Stora Enso has the most similar focus to that of Nampak; PACSA is the organisation that has the most similar focus to the four criteria and also had the most focus similar focus to Nampak for the single criterion of ‘recycling’. It is concluded that sustainability awareness in the LPB supply chain is more nuanced in the international companies (based on the date of first responding, word counts in the reports and use of LCA) but is similar between the three company groups in the supply chain. An LCA is presented in order to investigate whether policy recommendations for further reducing the environmental impacts pf LPB use in South Africa.

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Hou, Michelle M. (Michelle Ming-Jan). "Low temperature transient liquid phase bonding for electronic packaging." Thesis, Massachusetts Institute of Technology, 1992. http://hdl.handle.net/1721.1/60735.

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30

Wang, Zhichao. "Disturbed state constitutive modeling and testing of solders in electronic packaging." Diss., The University of Arizona, 2001. http://hdl.handle.net/10150/279828.

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Accuracy of fatigue life prediction of solder joint materials using the finite element method (FEM) depends on realistic and reliable constitutive models and the FEM procedure itself. The effectiveness and accuracy of a constitutive model to simulate and predict the behavior of materials strongly depends on consistent, reliable and precise experimental data. In this research, a thermomechanical digital image correlation test device has been developed to investigate solder joint material behavior under thermal mechanical and cyclic loading. The test device is composed of two high precision actuators driven by two brushless servo-motors; a vacuum chamber used to prevent the heating and cooling plate from heating and cooling the air in the vacuum chamber and other components to save the energy needed to heat and cool the specimen; a heating and cooling unit composed of four Peltier devices; a digital correlation deformation and displacement measurement system and various load and displacement sensors. The test device is controlled by Labview. Two closed loop system control programs in Labview were developed to control the device and perform tests under specified loads, displacements and temperature profiles. The temperature, loads, and displacements can be applied manually and automatically. A series of tests such as normal load tests, temperature and rate dependent tests, isothermal mechanical fatigue and thermomechanical fatigue tests have been carried out on 63Sn/37Pb and 60Sn/40Pb solder joint materials. The rate and temperature dependent test results are consistent, which shows that newly developed test device is reliable. Material parameters for the HISS and DSC models were computed from the test data, which can be used to investigate the failure mechanism of solder joints in electronic packaging to improve the reliability of electronic packaging. Disturbed State Concept (DSC) constitutive model is a powerful tool for the simulation and prediction of material damage, failure and fatigue. Strain localization and material softening cause negative-semi definite finite element stiffness-matrix, which create numerical difficulties for the calculation of DSC. A new DSC finite element scheme was proposed and implemented to overcome the numerical difficulties. The finite element thermoplastic formulation was modified and implemented based on Drucker's postulate. Thermoplastic deformation and viscoplastic deformation usually happen sequentially or combined. An alternative finite element computational method for viscoplastic problem was proposed and the FE program is modified. Computational examples show the new procedures produce accurate and consistent results and the program is robust. Material parameters for the HISS and DSC models were used to back predict the rate and temperature dependent test results using the modified finite element program. These back predictions showed that the HISS and DSC constitutive models and the FE program can be used to accurately simulate solder joint material behavior and predict solder joint damage and failure.

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31

Türk, Ferhat, and Roman Zandi. "Circular Economy : Reuse of packaging." Thesis, KTH, Hållbar produktionsutveckling (ML), 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-263323.

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This study is about finding methods for reusing of packaging from Elekta's product "Leksell Gamma Knife ICON" with Circular Economy as the focus. There is no process for this today. The important thing is the analysis of the entire supply chain from Suppliers to customer and then back to Suppliers to get general ideas about what the problems are and then to draw conclusions for the opportunities that exists. The methods used are analyzes if it is cost-effective and environmentally efficient to transport back packaging to the Suppliers who handle these packaging. Costs for the return process have been calculated, which is Supplier work, packaging costs, packaging costs and transport costs. Transport emission in the form of carbon dioxide equivalents have been calculated in the return process. Carbon dioxide equivalents have been calculated for the manufacturing of new packaging and transport by road and ship. The calculated values in the return process are compared with how Elekta is doing today during the process of packing LGK as well as delivering to customers to identify if it is effective to implement a new return process. A solution proposal that fulfils the requirements from an environmental and economic perspective is reported. Environmentally, it is reduced by 459 CO2eq number of carbon dioxide equivalents with transport from the US, 457 CO2eq from China and 1185 CO2eq from Europe. Financially, the company saves 17 190 SEK with transport from the USA, 19327 SEK from China and 18 126 SEK from Europe.
Denna studie handlar att om att hitta metoder för återanvändning av emballagen från Elektasprodukt ”Leksell Gamma Knife ICON” med Cirkulär ekonomi som fokus. Det finns ingen process för detta i dagsläget. Den viktiga är analysen av hela försörjningskedjan från leverantör till kund och sedan tillbaka till leverantörer för att få generella uppfattningar om vad problemen befinner sig och där ifrån dra slutsatser för möjligheterna som finns. De metoder som används är analyser om det är kostnads- och miljöeffektivt att transportera tillbaka emballage till de leverantörer som hanterar dessa emballage. Kostnader för returprocessen har beräknats vilket är leverantörsarbete, emballagekostnader, arbetskostnader och transportkostnader. Transportutsläpp i form av koldioxidekvivalenter har beräknats i returprocessen. Koldioxidekvivalenter har beräknats för tillverkning av nya emballage samt transport med lastbil och fartyg. De beräknade värden i returprocessen jämförs med hur Elekta gör idag under processen att packa LGK samt leverera till kund för att identifiera om det är effektivt att implementera en ny returprocess. Ett lösningsförslag där kraven uppfylls ur ett miljömässigt och ekonomisk perspektiv redovisas. Miljömässigt minskas det med 459 CO2eq antal koldioxidekvivalenter med transport från USA, 457 CO2eq från Kina och 1185 CO2eq från Europa. Ekonomiskt sparar företaget på 17 190 SEK med transport från USA, 19327 SEK från Kina och 18 126 SEK från Europa.

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Jasek, Megan Cathleen. "Building an interactive occupant packaging model with human figure." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/37778.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1995.
Includes bibliographical references (p. 91-93).
by Megan Cathleen Jasek.
M.Eng.

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33

Thorsén, Amanda. "Packaging Design for E-commerce : Development of a secondary packaging with focus on easy handling and creating a positive unboxing experience." Thesis, Luleå tekniska universitet, Institutionen för ekonomi, teknik och samhälle, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-71314.

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The e-commerce is an area that has grown considerably in recent years and continues to grow at a rapid pace. It is thereby becoming more and more important for com-panies to distinguish themselves amongst others, not least when it comes to getting customers to return for a second purchase. A good way to do this is to create a posi-tive experience for consumers. As the interaction with the customers has shifted from physical meetings to a computer screen through the spread of online retail, it is im-portant to nourish the few encounters that remain. An important point of interaction is the receiving of purchased goods. The packaging in which the goods are shipped, is thus an important source of communication to the customer, and a perfect means of displaying the company values. This thesis project aims at examining how an optimal packaging for this area can be created, and this was done in collaboration with Arcwise, a SCA business unit, who works with a special type of corrugated cardboard that allows for the production of rounded shaped packages. During the contextual work of this project, where a basic analysis of the market was made, a number of needs could be established. To be able to create a positive user experience and thus a competitive edge in the market, these needs must be fulfilled by packages made for shipping online-bought items. Following these needs, the project’s design phase was carried out with the aim of creating a packaging solution by using the corrugated board developed by Arcwise. This work was done by using creative methods such as brainstorming, workshop and prototyping. To evaluate the ideas, a weighting against criteria was done, and tests were made when the packaging concepts were shipped from Sundsvall to Luleå, to test their durability. Six concepts were narrowed down to a final package, which clearly exhibits the prop-erties of the material. It was designed with the aim for easy folding and packing, and to create a positive unboxing experience for the end customer.

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Jin, Yi M. Eng Massachusetts Institute of Technology. "Full lead time mapping, analysis and improvement for packaging product manufacturing." Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/46156.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2008.
Includes bibliographical references (leaf 80).
Service level is significant for the customers of a packaging product manufacturing company, especially for the customers with large- volume and high-value orders. To improve the service level will not only provide better service to the customers, but also enhance the relationships to ensure the achievement of the company business. In other words, the company has to fulfill each order quickly and well to obtain and maintain a high service level. A study of the whole supply chain for one specific product from the customer order placement to the customer finished goods (FGs) receipt was performed with the goal of improving the service level by reducing the customer lead time. Specially, the project mapped the customer lead time through studying each process like order handling, production and the FGs delivery. Based on the map, the current performance of the company for this product was known and further improvement opportunities were discussed. Because of the time limitations, general recommendations, like defect reduction in the production and data sharing in order handling, were made to narrow the gap from the company objectives to get things probably improved. This thesis focused on learning of the processes and analysis of the customer lead time for one specific product. However, there should be in-depth study of future work to have things improved. And the same approach might be applied to the products with the same properties in Technological Packaging Singapore's product portfolio.
by Yi Jin.
M.Eng.

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Boisset, Guillaume C. "Optomechanics and optical packaging for free-space optical interconnects." Thesis, McGill University, 1997. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=34916.

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Free-space optical interconnects (FSOIs) promise to deliver tremendous gains in connectivity and architectural freedom in future computing systems, especially at the backplane level. However, a critical hurdle that must be overcome for FSOIs to deliver on their promise is that of optical packaging. The objective of optical packaging in FSOIs is to implement an optical design within the specified alignment budget and support the associated optoelectronics. It is a multidisciplinary field combining aspects of mechanical, optical and electrical engineering. This thesis explores optical packaging issues for FSOIs such as: type of optical interconnect, impact of device technology, environmental effects, and fabrication issues. Approaches taken to address these issues in previous optical systems described in the literature are then studied; key points are the importance of improving diagnostic techniques and the benefits of microoptic/optoelectronic device integration. To further study these aspects, the optical packaging for a four-stage hybrid macrolens/lenslet FSOI backplane is designed, built, and characterized. A non-obtrusive, in-situ alignment diagnostic system which uses dedicated alignment beams running parallel to the main link is also designed, implemented and characterized. An analysis of optical crosstalk and signal-to-crosstalk ratio considerations due to misalignment is then presented and it is shown that crosstalk can be exploited to yield alignment diagnostic information at the expense of few additional components. A novel approach for simplifying prealignment of microoptics and optoelectronics during fabrication is then presented. This consists of using on-die reflective diffractive structures to generate reference marks for use during alignment and fabrication of integrated microoptic/optoelectronic packages. Future avenues of research are then discussed.

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Dishongh, Terrance John 1964. "Disturbed state concept of materials and interfaces with applications in electronic packaging." Diss., The University of Arizona, 1996. http://hdl.handle.net/10150/290652.

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Although a number of idealized constitutive models have been proposed in the past, to include factors such as elastic, plastic and creep strains and microcracking and damage, no unified model has yet been developed to understand and model the behavior of materials and joints in semiconductor chip-subtrate systems and packaging. Such models are important to analyze and predict the response for design and reliability assessments of packaging problems. This dissertation presents formalization and use of the recently developed approach called the disturbed state concept (DSC) for the characterization of the thermo-mechanical behavior of materials and joints. It is a unified approach and allows hierarchical use of the model for factors such as elastic, plastic, and creep strains, microcracking (damage) and softening and stiffening. The DSC model is used here for a number of materials such as ceramics (e.g. Aluminum Nitride), silicon ribbon and silicon doped with oxygen. The joining materials considered are different solders (e.g. 60%Sn-40%Pb, 90%Pb-10%Sn, and 95%Pb-5%Sn). Particular attention is given to solders used in the IBM-604 PowerPC package; which is a ceramic ball grid array (CBGA). A number of mechanical and ultrasonic tests are performed under uniaxial tension and compression loading for aluminum nitride. Test data available from the literature is used for the solders, silicon ribbon and silicon doped with oxygen. The DSC model is calibrated with respect to the test data in which the material parameters are found and affected by factors such as stress, cyclic loading and temperature. Then the incremental constitutive equations are integrated to backpredict the observed behavior for the tests used in the calibration and independent tests not used in the calibration. Overall, the model provides satisfactory correlation with the observed behavior. A nonlinear finite element procedure with the DSC is used to analyze the CBGA package with emphasis on the thermomechanical response of changing the via spacing. It is found that the DSC model predictions provide satisfactory comparison with a previous analysis by others, and with observed laboratory behavior.

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Otazo, Marcos R. (Marcos Rafael). "Packaging of two dimensional optoelectronic device arrays for optical backplanes." Thesis, McGill University, 1996. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=23372.

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The use of existing packaging techniques for microelectronics are studied in terms of their applicability to the packaging of optoelectronic device arrays for photonic inter-connect applications. In particular, the packaging of smart pixel arrays for free-space optical backplanes is quantitatively explored. This assessment is made from three basic perspectives: thermal management capabilities, connectivity and bandwidth, and alignment to a free-space optical system. In the assessment, a smart pixel array design space analysis is derived which shows that, by constraining the smart pixel array characteristics, the use of existing packaging technologies is possible. This leads to the derivation of expressions which relate both system and smart pixel array parameters to representative packaging parameters. It is seen in the analysis that while the thermal management imposes constraints on the window size, smart pixel density and size, the alignment imposes constraints mostly on the window size. The architectural characteristics of the smart pixel array are mostly affected by the connectivity and bandwidth of the packaging technology.
The integration of packaged smart pixel arrays into optical backplane demonstrators is also discussed, and the design and implementation of an optical backplane demonstrator is presented. This is complemented by the design, implementation and characterization of an optomechanical assembly which uses the interface between a single chip carrier and a socket to provide means of alignment in three degrees of freedom. Pre-aligned and modular plug-in device array integration is demonstrated.

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Bennett, Joshua V. (Joshua Victor). "Packaging and interconnection of a black-lit CCD sensor device." Thesis, Massachusetts Institute of Technology, 1997. http://hdl.handle.net/1721.1/46285.

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Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1997.
Includes bibliographical references (leaf 48).
This paper describes the engineering and development of a process to electrically and mechanically bond a large area, backlit charge-coupled device (CCD) sensor to a metallized substrate, using a materials system compatible with a high vacuum tube configuration. The CCD sensor is used in light sensor and digital camera devices. Currently, CCD devices are mechanically bonded to substrates using a variety of polymeric materials. For maximum resolution, however, the device must operate at high vacuum. Polymers release monomer molecules when exposed to a vacuum, since the polymerization reaction is far from equilibrium. Polymers also release retained solvent and binder molecules into a vacuum. This release of gas pollutes the high vacuum environment and degrades the tube perfomance. The CCD chip used in this research is extremely large, compared with standard semiconductor devices. The CCD chip measures 0.4 x 0.5 inches. At this size scale, thermal expansion mismatch stresses between die and carrier become an important design consideration, particularly for a die thinned to 10 micrometers. The proposed process results in a mechanical bond that is compatible with the high vacuum requirement, and is applicable to substrates of four possible materials: silicon, aluminum nitride, Pyrex, and LZS (a zirconia/ silicon nitride composite). The process also allows for two possible electrical connection techniques.
by Joshua V. Bennett.
M.S.

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Santhanam, Venkatesan 1968. "Optimization of the packaging of the Mars oxygen manufacturing plant." Thesis, The University of Arizona, 1992. http://hdl.handle.net/10150/278162.

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A complete analysis of the various energy losses involved in the Mars oxygen manufacturing plant is performed. The various losses considered are the pressure losses and radiation losses in connections between components, radiative heat losses from and between different components of the plant. These, together with the cost and mass of a library of components are used to construct an objective function to optimize the packaging of the plant. A software package has been created to determine component locations in the package such that this objective function is minimized. The package reads input data from a component database system and performs various iterations to arrive at a configuration having the minimum of the energy losses. The steepest descent method is used for minimizing the nonlinear objective functions describing the energy losses. The minimization of the cost and mass factors are performed by a brute search method. The results of the optimization are presented graphically.

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Kurian, Akshay. "The environmental assessment of reusable packaging for Unwrapped's business model and prospects of zero packaging for food stores." Thesis, KTH, Hållbar utveckling, miljövetenskap och teknik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-284239.

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Packaging for food products has impacts on the environment. In particular, single-use packaging have been criticized for the environmental and social impact created along recycling supply-chains in Asia. As a result, reusable packaging for food products started to reappear in Europe. This paper evaluates the environmental impacts of reusable packaging for Unwrapped’s business model using the organisational lifecycle assessment framework. The overall impacts of the organisation and hotspots of reusable packa ging are identified and compared with a reference retail activity using single-use packaging. The upstream processes of production of food products resulted in being the most significant impacts. However, reusable packaging performed worse and better than single-use packaging depending on the number of uses. The identified improvements for reusable packaging materials are proposed by increasing the number of uses. Changes in the upstream mode of transportation are other adopted improvement options for Unwra pped’s business model. The organisational lifecycle assessment framework highlighted issues in the current supply chain system that affect the niche business model in achieving the positive environmental benefits of reusable packaging. However, the reusable packaging business model shows promising aspects in a move towards sustainable businesses.
Matförpackningar påverkar miljön. Särskilt blev engångsförpackningar kritiserad för dessa miljö och sociala påverkan i återvinningsbranschen i Asien. och möjligheter. Återanvändbara förpackningar reintroducerades till marknaden i Europa. Den här avhandlingen kommer att granska och diskutera användning av återvinningsbara förpackningar i Unwrappeds affärsmodell med hjälp av organisationens livscykelanalys. Unwrappeds miljöpåverkan fastställs och jämförs med liknande affärsmodeller för engångsförpackning. Matproduktion innan förpackningen har den mest betydande påverkan. Återvinningsbara förpackningar visade sig vara bättre eller sämre beroende på antal gånger dem används. De fastställda förbättringarna för återanvändbara förpackningsmaterial är att återanvända dem så många gånger som möjligt. Förändringar i transportering är en annan förbättringsalternativ för Unwrappeds affärsmodell. Ramen för organisationens livscykelanalys påpekade problemen i nuvarande försörjningskedjans system som påverkar nischverksamhet för att uppnå miljövänligare återvinnin gsbara förpackningar. Dock, återvinningsbara förpackningars affärsmodeller visar lovande perspektiv på steg mot hållbara affären.

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41

Liu, Ting-Hung. "Testing and Packaging for MEMS Acoustic Emission Sensors." Scholar Commons, 2018. https://scholarcommons.usf.edu/etd/7692.

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The goal of this research is to improve the structure and dimension of the MEMS acoustic emission sensor. Acoustic emission sensor (AE sensor) based on the piezoelectric transducer is a well-developed technology in non-destructive testing that is widely used to determine permanent damage such as cracks and corrosions in buildings and structures. The AE sensor can be used to monitor cracks in structures and to check leakage in pressurized systems. The location of cracks in a structure or system leakage causes a high-frequency surface vibration while releasing ultrasonic energy. The frequency of this energy is typically between 30 kHz to 1MHz. The AE sensor can detect this high frequency transient acoustic wave. By using this AE sensor, the structure and pressurized system can be monitored to generate an evaluation report in order to facilitate maintenance and structure repair. Currently, the commercial AE sensor is bulky because it is made of a piezoelectric transducer. It also needs a lot of wires to connect with the pre-amplifier and signal conditioning systems. Because of the cost, brittleness and the volume of the commercial AE sensor, new affordable AE sensor technology is desired to replace the commercial AE sensor. The new AE sensor should be economical, small, and lightweight. The performance of the output signal should be comparable with the commercial AE sensor in terms of signal strength and signal to noise ratio. The MEMS AE sensors provide the potential solution to this problem. The MEMS AE sensors can overcome the problems of the commercial AE sensor. The MEMS AE sensor combines the pre- amplifier on the chip in a single package. Through the MEMS technology, the AE sensor can be manufactured in mass quantity and high quality. This study focuses on simulating and measuring the performance of the MEMS acoustic emission sensors. Through simulation, the capacitance value is influenced by the gap between the suspended membrane (top perforated metal plate), metal ground, and also influenced by the effective area of the perforated top layer. The perforation is introduced to reduce the squeeze film damping effect. Through measurement verification, the MEMS AE sensors have exhibited comparable performance before and after inclusion of the 3D printed package that serves as the housing for the completed sensor assembly. The C-V measurement is the key method to extract the capacitance value, which is the key parameter to determine the signal strength and signal to noise ratio for capacitive MEMS acoustic emission sensors. The damping coefficient is also the key factor to receive the time domain measurement data in a fashion that resemble the bulky commercial piezoelectric AE transducers.

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Beselin, Hallberg Jacob, and Per Uhrbom. "Volvo Logistics Corporation Returnable Packaging System : a model for analysing cost savings when switching packaging system." Thesis, Jönköping University, JTH, Industrial Engineering and Management, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-1360.

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This thesis is a study for analysing costs affected by packaging in a producing industry. The purpose is to develop a model that will calculate and present possible cost savings for the customer by using Volvo Logistics Corporations, VLC’s, returnable packaging instead of other packaging solutions.

The thesis is based on qualitative data gained from both theoretical and empirical studies. The methodology for gaining information has been to study theoretical sources such as course literature and articles, as well as through interviews and consolidation with staff at Volvo Logistics Corporations office in Gothenburg.

The model is constructed in Microsoft Excel and consists of six different sheets. The first sheet is a front page that summarises the costs calculated in the other sheets and presents the possible cost savings. After the front page there are three sheets with calculations for the costs in different scenarios, Today’s Situation, VLC Packaging Solution (Pre implementation) and VLC Packaging Solution (Post implementation). The first sheet, Today’s Situation, presents the result of the model that will calculate the customers’ current costs that are associated with packaging. The different costs presented in the model are costs for unloading, repacking, today’s cost for an internal packaging solution, quality related costs, one-way packaging costs and the costs for other packaging solutions. The next sheet, VLC Packaging Solution (Pre), presents an estimation of the cost for thecustomer when using VLC’s returnable packaging system. The estimation will serve as an investment tool, for calculating possible cost savings compared to the present situation. The different costs that will be discussed are handling costs, quality related costs, distribution cost, transaction cost, and investment cost. The third and final calculation sheet, VLC Packaging Solution (Post), presents the actual costs for the customer after the implementation. When the costs have been calculated they will be used to evaluate the actual cost savings for the customer. The last two sheets are a data sheet, which consists of data needed for the calculations in the previous sheets, and an instruction sheet where there are instructions to the different calculations in the model.

The conclusion shows that the objective to create a model for calculating the costs for different packaging systems and present possible cost savings is fulfilled.

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Ng, Joshua (Zi Jie Joshua), and Kendall Chow. "Environmental, operational and financial sustainability of packaging methods in delivery businesses." Thesis, Massachusetts Institute of Technology, 2010. http://hdl.handle.net/1721.1/61184.

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Thesis (M. Eng. in Logistics)--Massachusetts Institute of Technology, Engineering Systems Division, 2010.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 143-148).
In retail delivery companies, packaging is used to transport goods to customers while preventing damage, shrinkage and loss of the contents. With consumer preferences reflecting the growing concern for the environment, retail delivery businesses are at the crossroads of implementing a sustainable operational and financial business model of delivering packages to customers. In this thesis, we will address the issue of sustainable packaging in retail delivery companies by evaluating the financial, environmental and operational viability of such strategies. The thesis will be limited to the downstream order fulfillment cycle from the retail delivery company to the customer. We will focus on three areas applicable to sustainable packaging. The first area is materials innovation where we will analyze alternative materials suitable for retail delivery packaging. The second area involves waste elimination through reducing packaging material use and reusing of packaging materials through a returnable tote program. Lastly, we will understand the implementation challenges to increase the success rate of the strategies mentioned earlier.
by Joshua Ng and Kendall Chow.
M.Eng.in Logistics

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Siebert, Wolfgang Peter. "Alternative electronic packaging concepts for high frequency electronics." Doctoral thesis, Stockholm, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-223.

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Lachhman, Shem Benjamin. "Roller-Cast Poly-Dimethylsiloxane as a Non-Hermetic Encapsulant for MEMS Packaging." Case Western Reserve University School of Graduate Studies / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=case1323445335.

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Voranantakul, Suwan. "The effects of losses for electrical interconnections in VLSI packaging environments." Diss., The University of Arizona, 1992. http://hdl.handle.net/10150/185752.

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The effects of losses for electrical interconnections in VLSI packaging environments have been investigated in terms of attenuation, dispersion, propagation delay, reflection, crosstalk, overshoot/undershoot and ground noise resonance. Three types of loss are considered here; they are conductor loss (due to either DC loss or skin effect loss), dielectric loss and insertion loss. The advantages and disadvantages of either conductor loss or dielectric loss in signal propagation are examined. The model for ground noise resonance effect in nonuniformly coupled ribbon cables is first introduced, and then one of the more practical solutions to this problem is demonstrated by applying insertion loss to the cables at the resonant frequency. General design guidelines and parameter trade-off considerations for preserving signal integrity (i.e., less signal distortion and lower coupled noise) during transmission are also included.

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Unander, Tomas. "Characterization of Low Cost Printed Sensors for Smart Packaging." Licentiate thesis, Mid Sweden University, Department of Information Technology and Media, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-7049.

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Currently there are very significant interests in printed electronics in the world. The possibility to produce electronics in a roll to roll printing process will considerably reduce the cost of the electronic devices. However, these new devices will most probably not replace the traditional silicon based electronics, but will be a complement in low cost applications such as in intelligent packages and other printable media. One interesting area is printable low cost sensors that add value to packages. In this thesis a study of the performance of low cost sensors is presented. The sensors were fabricated using commercial printing processes used in the graphical printing business. The sensors were characterized and evaluated for the intended application. The evaluated sensors were moisture sensing sensor solutions and touch sensitive sensor solutions.

A printable touch sensitive sensor solution is presented where the sensor is incorporated into a high quality image such as in point of sales displays. The sensor solution showed good touch sensitivity at a variety of humidity levels. Four printed moisture sensor concepts are presented and characterized. Firstly, a moisture sensor that shows good correlation to the moisture content of cellulose based substrates. Secondly, a sensor that measures the relative humidity in the air, the sensor has a measuring accuracy of 0.22% at high relative humidity levels. Thirdly, a moisture sensor that utilizes unsintered silver nano-particles to measure the relative humidity in the air, the sensor has a linear response at very low relative humidity levels. And fourth, an action activated energy cell that provides power when activated by moisture. A concept of remote moisture sensing that utilizes ordinary low cost RFID tags has also been presented and characterized. The remote sensor solution works both with passive and semi-passive RFID systems. The study shows that it is possible to manufacture low cost sensors in commercial printing processes.

Det är för närvarande ett stort intresse för tryckt elektronik. Att kunna tillverka elektroniska komponenter i en rulle till rulle process möjliggör en reducering av tillverkningskostnaden. Dessa nya komponenter kommer sannolikt inte konkurrera ut den traditionella kiselbaserade elektroniken utan kommer att kunna komplimentera kiselelektronik i segment där kostnaden är väldigt viktig som i intelligenta förpackningar och andra tryckta medier. Ett intressant område är tryckta sensorer som kan addera värde till förpackningar. I denna avhandling presenteras en studie kring tryckta sensorer som kan tillverkas till låg kostnad. Sensorerna är tillverkade i kommersiella grafiska tryckpressar. Sensorerna karakteriseras och utvärderas för de applikationer som de är tänkta för. I denna avhandling har fuktsensorer och beröringskänsliga sensorer undersökts.

Det presenteras en tryckt beröringskänslig sensor som integreras i ett högkvalitativt grafiskt tryck. Denna sensor är tänkt att användas i reklamskyltar för att skapa interaktivitet. Sensorn har en bra känslighet vid varierande fukthalter. Även fyra fuktsensorer presenteras och utvärderas. Den första sensorn mäter fukthalten i cellulosabaserade substrat och visar en bra korrelation till fukthalten i substratet. Den andra sensorn mäter den relativa fukten i luften, denna sensor har en mätnoggrannhet på 0.22% för höga fukthalter. Den tredje sensorn använder partiklar i nanostorlek för att mäta fukthalten i luften. Denna sensor fungerar väldigt bra vid låga fukthalter. Den fjärde sensorn är en energicell som producerar el när den blir fuktig. Även en fuktsensor som kan läsas av på håll utvärderas. Detta sensorkoncept är baserad på vanliga RFID taggar och kan användas med både passiva och semi-passiva taggar. Denna avhandling visar att det är möjligt att tillverka sensorer till en låg kostnad in en traditionell grafisk tryckpress.

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Omer, Ahmed Adan 1964. "Capacitance calculations for three-dimensional VLSI interconnection geometries." Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/291396.

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An integral equation formulation for the calculation of the capacitance of three-dimensional VLSI geometries is presented. A proper combination of 2D and 3D methods is used for efficient numerical computations. The method of moments is used for the solution of the integral equation. In addition, Green's functions that satisfy the boundary conditions at the dielectric interfaces are implemented in order to minimize the number of unknowns involved in the numerical solution. The mathematical formulation presented here and the associated computer program are appropriate for obtaining the capacitance matrix of complex three-dimensional multi-conductor configurations of the microstrip and the stripline type. Finally, numerical results for the per-unit-length capacitance and total capacitance of several interconnections are provided and compared with known results. Applications include the extraction of lumped capacitive elements used in the equivalent circuit representations of coupled conductor bends, vias and crossovers. In addition, calculations of per-unit-length capacitance of coupled flaring lines are performed.

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Zhang, Wu. "Adaptive stochastic finite element procedure of electronic packaging problems using disturbed state concept." Diss., The University of Arizona, 1997. http://hdl.handle.net/10150/282373.

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Complex engineering problems need appropriate constitutive laws such as Disturbed State Concept (DSC), as well as robust accurate computational analysis methods such as adaptive and stochastic finite element methods (FEM). DSC provides a unified basis for constitutive modeling including elastic, plastic and creep deformations, microcracking, damage and softening, stiffening, and cyclic fatigue under thermomechanical loading. It includes intrinsical regularization, localization, characteristic dimension and avoidance of spurious mesh dependence. It also leads to new procedures for adaptive FEM and stochastic FEM. Adaptive FEM is a method to adapt or guide itself to better subsequent computation by use of previous computational information so as to achieve prescribed accuracy. It's a powerful procedure for analyzing deformation of special problems such as interfaces and joints and shear bands, and complex materials with both hardening and softening. An adaptive finite element procedure with combined Disturbance-Hybrid stress error estimator/remeshing indicator is proposed and tested by comparing with some published results, and the corresponding user-interactive unified DSC finite element program with more than 10 options is developed and applied to thermal analysis of electronic packaging problems. Unlike deterministic analysis methods, stochastic FEM approach further considers the random variations of involved parameters to further make the deterministic constitutive and numerical modeling more realistic in a statistical manner. Traditional stochastic FEM is reviewed and a new efficient DSC stochastic FEM is formulated for reliability analysis of electronic packaging problems. The computer visualization and animation are applied to display the computed results for the purpose of easier use and interpretation of the results, which will be one of major trends for engineering application of computational methods. In this dissertation, combined study is carried out from a comprehensive (computational and constitutive) viewpoint, and the practical and academic values of the adaptive and stochastic DSC finite element procedures for electronic packaging problems will be demonstrated.

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Lim, Dan J. "Characterization of thermal dissipation within integrated gate bipolar transistor (IGBT) layered packaging structure." Thesis, University of Hull, 2008. http://hydra.hull.ac.uk/resources/hull:1681.

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Integrated Gate Bipolar Transistors (IGBTs) generally have a high output power and generate significant amounts of heat, which needs to be removed from the chip to ensure continued operation. Since IGBT chips are commonly mounted on a layered assembly structure which is in turn mounted onto a heat sink assembly, the thermal dissipation properties of the layered structure are crucial in keeping temperatures within operational boundaries. Traditionally, the selection of materials for the layered structure has been largely influenced by the thermal conductivity for heat dissipation, the similarity of the coefficient of thermal expansion for physical integrity of the structure and to a lesser extent, the weight of the material. These principles of material selection are indeed adequate for steady state operation of IGBTs. However, IGBTs are often installed in applications where they are subjected to pulsed operation, which is predominantly transient. During transient operation, it was found that thermal conductivity was not necessarily the best criterion to use for material selection within the layered structure. In certain instances, materials that absorbed heat rather than conducting it yielded lower temperatures and higher cooling rates, which in turn resulted in lower start temperatures in the next pulse. This study therefore proposes an additional material selection criterion, one based on the density-specific heat capacity product that should be used in conjunction with thermal conductivity to guide the material selection process, opening the door to material combinations for specific applications that could enhance chip lifespan and reduce deliamination. Materials with high density-specific heat capacity products could also potentially be used to compensate for the thermal "bottlenecking" effect. This study was conducted with numerous simulations based on the well validated Transmission Line Matrix Modelling method.

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Dissertations / Theses on the topic 'Packaging engineering'

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