Relevant bibliographies by topics / Packaging matrix

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  1. Dissertations / Theses

Academic literature on the topic 'Packaging matrix'

Author: Grafiati
Published: 26 September 2023

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Dissertations / Theses on the topic "Packaging matrix"

1

Kim, Joong-Ho. "Modeling of package and board power distribution networks using transmission matrix and macro-modeling methods." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/13864.

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2

Sun, Meng. "Retrovirus-Specific Differences in Matrix (MA) and Nucleocapsid (NC) Protein-Nucleic Acid Interactions: Implications for Genomic RNA Packaging." The Ohio State University, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=osu1343844761.

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3

Thomas, Ian MacIntyre. "The blending and permeability of polymers for packaging applications." Thesis, Brunel University, 1995. http://bura.brunel.ac.uk/handle/2438/5504.

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In this study, commercially available isotactic polypropylene (PP) and nylon-6 (PA6) blends and laminates were prepared, to develop a material with optimal water vapour and oxygen barrier properties. The effect of compatibilizers on phase dispersion has been investigated using three commercial Polybond's, PB3002, PB1001, and PB3009. Three compatibilizers prepared in-house were also used as, maleic anhydride(MA) grafted on PP, MA and butyl methacrylate(BMA) co-polymer grafted on PP, and BMA grafted on low density polyethylene. The effect of two silanes( methacrylate functional and vinyl functio
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4

Mossor, Charles W. "Electrical Breakdown of Thermal Spray Alumina Ceramic Applied to AlSiC Baseplates Used in Power Module Packaging." Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/33543.

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Thermal spray coatings offer new alternatives in the production of electronic power modules that use alumina ceramic as an isolation layer. Current processes use direct bond copper (DBC) soldered to a nickel plated copper heat spreader. A coefficient of thermal expansion (CTE) mismatch exists between copper and alumina and leads to reliability issues that arise due to product failure during thermal cycling and lifetime operation. The substitution of an AlSiC metal matrix composite (MMC) heat spreader baseplate addresses the problem of CTE mismatch and will reduce the number of product failu
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5

Penelope, Raphaël. "Développement de filtres solides pour un piégeage irréversible de l'iode gazeux et directement convertibles en matrice de conditionnement." Electronic Thesis or Diss., Montpellier, Ecole nationale supérieure de chimie, 2022. http://www.theses.fr/2022ENCM0020.

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Le projet consiste à développer des filtres à iode à base de phosphates d'argent ou de vanadates de plomb afin de capter et de conditionner des déchets ultimes. Les filtres à iode actuels, à base d'alumine ou de silice, nécessitent en effet des traitements complexes, sources de déchets secondaires, pour assurer une forme compatible avec les conditionnements envisagés. Plutôt que de qualifier de nouveaux matériaux de conditionnement adaptés à ces filtres, une solution pragmatique consiste donc à développer des filtres qui soient, à une étape de traitement thermique près, un précurseur de la mat
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6

Cozzo, Giulia Maria Angela. "Materiali e tecnologie per l'elettronica di potenza." Doctoral thesis, Università di Catania, 2015. http://hdl.handle.net/10761/3824.

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L oggetto della seguente tesi è lo studio e lo sviluppo di materiali nanostrutturati a base polimerica per dispositivi utilizzati nell elettronica di potenza. L obiettivo della tesi è quello di progettare e quindi sviluppare, tramite materiali e tecnologie innovative, nano compositi polimerici da utilizzare come composti di incapsulamento per dispositivi elettronici. Lo scopo della ricerca è riuscire ad ottenere nanocompositi con proprietà confrontabili ai prodotti commerciali o comunque studiare soluzioni innovative da valutare come possibili packaging di dispositivi di potenza. Il lavoro ha
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7

Jones, Christopher P. "Primer tRNA annealing by human immunodeficiency virus type 1." The Ohio State University, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=osu1337962197.

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8

Perron, Christophe. "Définition et mise en oeuvre d'un matériau composite à matrice métallique pour les packagings d'électronique embarquée." Thesis, Bordeaux, 2017. http://www.theses.fr/2017BORD0646/document.

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Les packagings d’électronique embarquée sont actuellement en alliages d’aluminium. A partir d’une étude de sélection des matériaux, complétée par une simulation numérique thermique,nous avons démontré qu’un matériau composite constitué d’une matrice aluminium et de fibres de carbone à forte conductivité thermique, représente un fort potentiel de gain de masse sur ces équipements. Cependant, le couplage de ces deux matériaux génère des problèmes d’élaboration en raison d’incompatibilités fortes parmi lesquelles un mouillage très faible du carbone par l’aluminium liquide et une réactivité chimiq
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9

Foschi, Eleonora <1990&gt. "System innovation and life cycle thinking in packaging value chain: the circularity of plastics." Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2020. http://amsdottorato.unibo.it/9460/1/Foschi_Eleonora_Tesi.pdf.

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Compared to other, plastic materials have registered a strong acceleration in production and consumption during the last years. Despite the existence of waste management systems, plastic_based materials are still a pervasive presence in the environment, with negative consequences on marine ecosystem and human health. The recycling is still challenging due to the growing complexity of product design, the so-called overpackaging, the insufficient and inadequate recycling infrastructure, the weak market of recycled plastics and the high cost of waste treatment and disposal. The Circular economy p
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10

Lemettre, Sylvain. "Encapsulation sous vide de micro-bolomètres à basse température." Thesis, Université Paris-Saclay (ComUE), 2017. http://www.theses.fr/2017SACLS524.

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Plusieurs catégories de MEMS nécessitent un environnement sous vide pour fonctionner de manière optimale, tel le micro-bolomètre. Le fonctionnement optimal de ce détecteur, à la base des imageurs infrarouge non refroidis, nécessite qu’il soit thermiquement isolé, et donc qu’il évolue dans une atmosphère raréfiée (&lt; 10-2 mbar). Le maintien sous vide d’une matrice bolométrique durant la durée de vie d'une dizaine d’années du composant est réalisé par une encapsulation dans un boîtier de très faible volume (de 0,5 à 30 µL).Cette encapsulation sous vide fait appel à deux techniques complémentai
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