Relevant bibliographies by topics / Packaging technology

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Packaging technology'

Author: Grafiati
Published: 4 June 2021
Last updated: 31 January 2023

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Journal articles on the topic "Packaging technology"

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Pegu, Lukesh, Pankaj Chasta, and Mr Kaushal K. Chandrul. "Pharmaceutical Packaging Technology." International Journal of Trend in Scientific Research and Development Volume-3, Issue-3 (April 30, 2019): 1747–54. http://dx.doi.org/10.31142/ijtsrd23527.

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Wilbey, R. Andrew. "Food Packaging Technology." International Journal of Dairy Technology 58, no. 2 (May 2005): 125. http://dx.doi.org/10.1111/j.1471-0307.2005.00157.x.

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Tsukada, Yutaka. "SLC/FCA Packaging Technology." Journal of SHM 9, no. 2 (1993): 18–26. http://dx.doi.org/10.5104/jiep1993.9.2_18.

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SATO, Shobu. "RF MEMS Packaging Technology." Journal of Japan Institute of Electronics Packaging 7, no. 4 (2004): 299–302. http://dx.doi.org/10.5104/jiep.7.299.

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Poradish, Frank. "Modular ICNIA Packaging Technology." IEEE Aerospace and Electronic Systems Magazine 2, no. 6 (June 1987): 20–23. http://dx.doi.org/10.1109/maes.1987.5005417.

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Gavrilescu, Dana. "Electronic equipment packaging technology." Microelectronics Reliability 32, no. 12 (December 1992): 1778. http://dx.doi.org/10.1016/0026-2714(92)90275-p.

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ISHIWATA, Shuichi. "Packaging Technology of BGA/CSP. Packaging Technology for Small Size FC-PBGA." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 12, no. 3 (1997): 134–38. http://dx.doi.org/10.5104/jiep1995.12.134.

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NISHIDA, Hideyuki. "Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology." Circuit Technology 7, no. 1 (1992): 24–33. http://dx.doi.org/10.5104/jiep1986.7.24.

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Tenmei, Hiroyuki. "Electronics Packaging Technology and New Energy Technology." Journal of Japan Institute of Electronics Packaging 13, no. 2 (2010): P2. http://dx.doi.org/10.5104/jiep.13.p2.

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C., Sanjana M., Hemegowda R., and Sushma R. E. "Aseptic Packaging – A Novel Technology to the Food Industry." International Journal of Trend in Scientific Research and Development Volume-3, Issue-3 (April 30, 2019): 307–10. http://dx.doi.org/10.31142/ijtsrd22779.

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Dissertations / Theses on the topic "Packaging technology"

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Alkozei, Mirwais, and Dipta Subhra Guha. "Optimizing packaging management." Thesis, KTH, Skolan för industriell teknik och management (ITM), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-302449.

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This project was carried out at Saint Gobain Sekurit AB. The company is a leading manufacturer ofglazing and operates within the automotive industry. The purpose of the project was to create a supply chain model to optimize the packaging management of racks which are customer owned. These are used to transport finished products to the customers of Saint Gobain. When the empty packaging is return it is stored until needed for production. The company needs to optimize the management and tracking of racks for which the company intends to develop a solution model which can provide the company with the needed information for better management and tracking. The project entailed to define parameters in the company’s IT environment and make sure that they can be used in practice. The cockpit has been categorized into three different hard coded modules which are built in Excel VBA, and an analysis module. The hard coded modules do the following: - Give visual, easy to read, overview of stocks- Generate triggers for operational actions to avoid shortages of racks and to minimize costs- Allow easy reconciliation with movements in customers portal and ease the reclamation process The analysis module of the cockpit functions as a basis for providing input for strategic decisions considering investment, layout of storage, and scrap. The design specification of the cockpit has been based of the needs of the stakeholders in the company and it has been built based on the available reports. Furthermore, user instructions has been developed, and selected personell has been trained in the usage of the implemented cockpit.
Detta projekt genomfördes på Saint Gobain Sekurit AB. Företaget är en ledande tillverkare av glasrutor och verkar inom fordonsindustrin. Syftet var att skapa en leveranskedjemodell för att optimera hanteringen av återanvändbara ställningar som ägs av kunder. Dessa används för att transportera färdiga produkter till Saint Gobains kunder. När en tom ställning returneras lagras den tills den behövs för produktion. Vad företaget behövde var optimering av hantering och spårning av återanvändbara ställningar vilket företaget ville bygga en cockpit för att tillhandahålla nödvändig information. Projektet innebar att definiera parametrar i företagets IT-miljö och se till att dessa kan användas i praktiken. Cockpiten har delats in i tre olika hårdkodade moduler som är byggda i Excel VBA, och en analysmodul. De hårdkodade modulerna gör följande: - ger en visuell, lättläst översikt över lagerstatus- genererar utlösare för operativa åtgärder för att undvika brist och minimera kostnader- möjliggör enkel avstämning med rörelser i kundportalen och underlättar reklamationsprocessen Cockpitens analysmodul fungerar som en grund för att ge input för strategiska beslut med tanke på investeringar, lagerlayout och skrotning. Designspecifikationen för cockpiten har baserats på behoven hos intressenterna i företaget och cockpiten har byggts utifrån tillgängliga rapporter. Dessutom har användarinstruktioner utvecklats och personal på företaget utbildats i användningen av den implementerade cockpiten.
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Larcombe, Steven P. "Implementing heterogeneous systems in three-dimensional packaging technology." Thesis, University of Sheffield, 1996. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.389928.

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Ma, Wei. "Low temperature metal-based micro fabrication and packaging technology /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20MA.

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Yip, Jimmy G. M. "W-band waveguide packaging for multi-chip module technology." Thesis, University of Kent, 2003. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.396919.

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Joung, Yeun-Ho. "Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures." Diss., Available online, Georgia Institute of Technology, 2004:, 2003. http://etd.gatech.edu/theses/available/etd-04052004-180025/unrestricted/joung%5Fyeun-ho%5F200312%5Fphd.pdf.

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Wang, Weiyao. "Food packaging design for older consumers." Thesis, Birmingham City University, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.264688.

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This research centres on product package design related to older people's emotional needs. In particular, knowledge concerning the design of packages for transgenerational use linked to background social data has been elicited. The most distinctive accomplishment has been an exploration of the visual appeal of packaging design in relation to age, gender, education and emotional preference of older consumers. Findings are primarily related to the interaction older people in the UK with selected aspects of package design. Three areas of research have been brought together in this thesis: packaging design and multiple choice, emotional/psychological preference for packaging design characteristics and colour appeal associated ..w ith food character in packaging design. Investigations into the 'third age' and classifications beyond utilised a large sample from the 'Thousand Elders' and a range of packaging designs for selected food items. The significant findings indicate that familiarity and emotional response to packaging designs are key determinants in older consumers' intentions to purchase. Design relating to overall perception or technical cognition are shown to correlate with age related emotional feelings of arousal. Specific findings on such correlations are described in detail. A further 'emotional appeal' was found with colour; for example, green, yellow or bright tones were the most popular colour hue and value associated with varied qualities for food packaging design for specific age groups. Differences between ages, gender and education levels (hypothesised variables linked to design choices) are also analysed and correlated; for example, gender and age rather than educational level combinations appeared to significantly influence choice. Males aged between 55 and 64 relied on their experience of functional aspects for packaging design when considering a purchase. Females in the older age group of 65-74 were more emotional and considered visual appeal in a more personal way. However, few distinguishable psychological effects were noted for the over 75 year olds in their relationship with design. Personal characteristics of older people and their choice are presented in a combination of qualitative interpretation and numeric analysis. Key findings relate to the specific nature of older consumers behaviour in their engagement with packaging design.
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Witt, Christopher. "ANALYSIS OF PICKLE PACKAGING EQUIPMENT." Thesis, Kansas State University, 2016. http://hdl.handle.net/2097/35748.

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Master of Agribusiness
Department of Agricultural Economics
Allen M. Featherstone
Best Maid is a middle-sized regionally orientated company, headquartered in Fort Worth, Texas. It is currently owned and operated by the fourth generation of the Dalton family. The company specializes in the production of pickles and condiment products and currently holds the title of #1 retail brand of pickles in the state of Texas. In addition to the Best Maid label, products are also produced under the Del-Dixie label. The objective of this thesis is to analyze a potential capital project: a bucket line replacement. The analysis will be completed by using net present value to determine the cost and benefits of the project. The focus of the project will be the food service bucket line. The current line was designed and installed over 20 years ago. Currently, this line and supporting resources require a staff of 17 employees to operate. The process is looking to be improved through advances in technology including vibratory conveyors, more complex PLC programming, and increased accuracy of scaling equipment. Implementing these advancements has the potential to reduce the employee labor cost as well as decrease over-scaling. The goal of this project is to inform the Best Maid owners of the investment costs, labor savings, benefits, and the financial viability of the proposed capital investment. Best Maid has consistently grown at a high single digit to low double digit rate each year. Businesses must continually identify and react to the needs of tomorrow, today. Formal processes within the business will be established to evaluate and prioritize future potential projects. The conclusion of the analysis resulted in a positive NPV of about $567 thousand and a favorable IRR. The recommendation is to adopt the new technology.
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Viström, Magnus. "Customised information on packaging : driving forces and logistical aspects." Licentiate thesis, KTH, Numerical Analysis and Computer Science, NADA, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-168.

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This thesis work is divided into two parts that relate to each other. The first part investigates driving forces and limiting factors in the customisation of information on packaging and the second part focuses on how the customisation task should be performed in order to obtain high productivity and efficient logistics. Opportunities with hybrid printing solutions where conventional technology is combined with digital printing are discussed.The first of the included papers talks about the driving forces and limiting factors in the customisation of information on packaging and focuses on marketing aspects and consumer value. The second paper investigates the logistical aspects of using digital printing to add information on pre-printed packaging, with the primary focus on the opportunities to reduce changeover time and printing form costs. The third paper investigates how digital printing can be integrated into a packaging line and identifies critical productivity related parameters. These three papers are analysed together in this report, giving input to conclusions about the driving forces and limiting factors in the customisation of information on packaging and how the customisation task should be performed to obtain high productivity and efficient logistics. Hence, this thesis work does not originate solely in one discipline. Digital printing technology, logistics and marketing aspects are all considered to draw conclusions.

It is shown that it is possible to obtain marketing advantages, fulfill market demands better, get increased consumer value and reduced costs by using a hybrid printing solution. There exists at the same time a number of limiting factors, such as print quality demands, additional costs and reliability issues that are crucial to consider before concluding whether or not customisation of information on packaging would be successful in any given business scenario.

Different scenarios for where the customisation task can be inserted into a value chain are defined and discussed. Explicit studies of one of the scenarios are made. This scenario is defined as having a customisation task inline in a packaging line. The other scenarios, customisation at the packaging producer and customisation at the wholesaler/retailer, are not explicitly investigated, but it has been possible to discuss these scenarios as well through the research results obtained. The results show that there are factors that point towards the scenario where digital printing is performed at the producer as being the most beneficial. A number of critical productivity related factors for this scenario are identified in paper III, which gives guidelines on how to obtain high productivity when a digital printing task is integrated into a packaging line. It is finally shown that it is possible to obtain high delivery service and efficient logistics by using a hybrid printing solution. It is, however, of crucial importance that possible drawbacks be considered in order to accurately conclude whether a hybrid printing solution will be successful or not.

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BÄCKSTRÖM, SOFIA. "The road towards anintegrated packaging management strategy : A case study on a packaging networkat a ski brand." Thesis, KTH, Skolan för industriell teknik och management (ITM), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-223888.

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Rashid, Suhail Jeremy. "High voltage packaging technology for wide bandgap power semiconductor devices." Thesis, University of Cambridge, 2008. https://www.repository.cam.ac.uk/handle/1810/252098.

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Books on the topic "Packaging technology"

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W, Brooks David, and Giles Geoff A, eds. PET packaging technology. Sheffield: Sheffield Academic Press, 2002.

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Henyon, DK, ed. Food Packaging Technology. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 1991. http://dx.doi.org/10.1520/stp1113-eb.

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G, Bureau, and Multon J. L. 1938-, eds. Food packaging technology. New York: VCH, 1996.

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Dick, Potter, Peters Laura, and Integrated Circuit Engineering Corporation, eds. Roadmaps of packaging technology. Scottsdale, AZ: Integrated Circuit Engineering, 1997.

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Fundamentals of packaging technology. 3rd ed. Herndon, Va: Institute of Packaging Professionals, 1999.

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Ginsberg, Gerald L. Electronic equipment packaging technology. New York: Van Nostrand Reinhold, 1992.

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Soroka, Walter. Fundamentals of packaging technology. Melton Mowbray: The Institute of Packaging, 1996.

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Soroka, W. Fundamentals of packaging technology. Herndon, Va. (481 Carlisle Dr., Herndon 22070): Institute of Packaging Professionals, 1995.

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Understanding plastics packaging technology. Cincinnati, Ohio: Hanser Gardner Publications, 1997.

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Ginsberg, Gerald L. Electronic Equipment Packaging Technology. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3542-3.

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Book chapters on the topic "Packaging technology"

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Stadler, Frank. "16. Packaging Technology." In A Complete Guide to Maggot Therapy, 349–62. Cambridge, UK: Open Book Publishers, 2022. http://dx.doi.org/10.11647/obp.0300.16.

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Ghosh, Arabinda. "Converting of Polymer Packaging (Composite Packaging)." In Technology of Polymer Packaging, 83–114. München: Carl Hanser Verlag GmbH & Co. KG, 2015. http://dx.doi.org/10.3139/9781569905777.003.

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Ginsberg, Gerald L. "Packaging Implementation." In Electronic Equipment Packaging Technology, 1–28. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3542-3_1.

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Fischer-Hirchert, Ulrich H. P. "Optical Connection Technology." In Photonic Packaging Sourcebook, 149–65. Berlin, Heidelberg: Springer Berlin Heidelberg, 2015. http://dx.doi.org/10.1007/978-3-642-25376-8_7.

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Tsukada, Yutaka. "Substrate Technology." In Advanced Flip Chip Packaging, 263–339. Boston, MA: Springer US, 2013. http://dx.doi.org/10.1007/978-1-4419-5768-9_7.

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Page, Bev, Mike Edwards, and Nick May. "Metal Packaging." In Food and Beverage Packaging Technology, 107–35. Oxford, UK: Wiley-Blackwell, 2011. http://dx.doi.org/10.1002/9781444392180.ch5.

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Day, B. P. F., and L. Potter. "Active Packaging." In Food and Beverage Packaging Technology, 251–62. Oxford, UK: Wiley-Blackwell, 2011. http://dx.doi.org/10.1002/9781444392180.ch9.

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Kazinczi, R., J. R. Mollinger, and A. Bossche. "Inexpensive MEMS Packaging." In Sensor Technology 2001, 59–64. Dordrecht: Springer Netherlands, 2001. http://dx.doi.org/10.1007/978-94-010-0840-2_11.

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Figoli, Alberto, Erika Mascheroni, Sara Limbo, and Enrico Drioli. "Membranes for Food Packaging." In Membrane Technology, 223–40. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2010. http://dx.doi.org/10.1002/9783527631384.ch10.

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Totosaus-Sánchez, Alfonso. "Poultry Packaging." In Handbook of Poultry Science and Technology, 121–29. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470504451.ch9.

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Conference papers on the topic "Packaging technology"

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Maiser, Eric. "Battery packaging - Technology review." In REVIEW ON ELECTROCHEMICAL STORAGE MATERIALS AND TECHNOLOGY: Proceedings of the 1st International Freiberg Conference on Electrochemical Storage Materials. AIP Publishing LLC, 2014. http://dx.doi.org/10.1063/1.4878489.

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Ho, Chung W. "The AFO Packaging Technology." In 2021 IEEE 71st Electronic Components and Technology Conference (ECTC). IEEE, 2021. http://dx.doi.org/10.1109/ectc32696.2021.00323.

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"Microelectronics technology and packaging." In 2017 MIXDES - 24th International Conference "Mixed Design of Integrated Circuits and Systems". IEEE, 2017. http://dx.doi.org/10.23919/mixdes.2017.8005248.

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"Microelectronics Technology and Packaging." In 2018 25th International Conference "Mixed Design of Integrated Circuits and System" (MIXDES). IEEE, 2018. http://dx.doi.org/10.23919/mixdes.2018.8436878.

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"Microelectronics Technology and Packaging." In 2020 27th International Conference on Mixed Design of Integrated Circuits and System (MIXDES). IEEE, 2020. http://dx.doi.org/10.23919/mixdes49814.2020.9155854.

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"Microelectronics technology and packaging." In 2015 MIXDES - 22nd International Conference "Mixed Design of Integrated Circuits & Systems". IEEE, 2015. http://dx.doi.org/10.1109/mixdes.2015.7208573.

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"Microelectronics technology and packaging." In 2016 MIXDES - 23rd International Conference "Mixed Design of Integrated Circuits and Systems". IEEE, 2016. http://dx.doi.org/10.1109/mixdes.2016.7529760.

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Tan, Qing. "Packaging Technology for MEMS." In ASME 2000 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2000. http://dx.doi.org/10.1115/imece2000-1157.

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Abstract A review is given for MEMS devices fabricated using packaging materials. From reported literatures and patents, a variety of ceramic and plastic materials have been used for many microdevices. The green tape process for ceramic, flexible circuit and printed circuit board process platforms are all found to be suitable for 3-D, complex MEMS devices. In addition, micromolding and laser machining are reported for plastic materials. Devices fabricated from those materials include micromotors, sensors, biomedical chips, fuel cells, microchemical reaction chambers, micromirrors, microlens systems, etc. The introduction of packaging material into MEMS fabrication bridged the gap for devices that are 3-D, meso or large scale, have relatively large force and are low cost.
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Saito, Takashi, Tokuyuki Kitajima, Makoto Kawaguchi, Shinya Tajima, and Masashi Okamoto. "New Molding Technology Enabling Advanced Packaging Technology." In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, 2020. http://dx.doi.org/10.1109/ectc32862.2020.00305.

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Katsura, Kohsuke. "Packaging technology for multigigabit optoelectronics." In Optical Fiber Communication Conference. Washington, D.C.: OSA, 1993. http://dx.doi.org/10.1364/ofc.1993.ff1.

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Reports on the topic "Packaging technology"

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Terry, Becky. Special Technology Area Review on Microwave Packaging Technology. Fort Belvoir, VA: Defense Technical Information Center, February 1993. http://dx.doi.org/10.21236/ada261852.

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Hissam, Scott A., Gabriel A. Moreno, Judith Stafford, and Kurt C. LWallnau. Packaging Predictable Assembly with Prediction-Enabled Component Technology. Fort Belvoir, VA: Defense Technical Information Center, November 2001. http://dx.doi.org/10.21236/ada399793.

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Armendariz, M. G., G. R. Hadley, and M. E. Warren. Advanced packaging technology for high frequency photonic applications. Office of Scientific and Technical Information (OSTI), March 1996. http://dx.doi.org/10.2172/211590.

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Bates, J. B., Xioahua Yu, C. F. Luck, and N. J. Dudney. Development of a lithium microbattery packaging technology: ERKTS01. Final report. Office of Scientific and Technical Information (OSTI), October 1995. http://dx.doi.org/10.2172/116577.

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Chang, Charles, Dharmesh Jani, Alfred Yen, and K. C. Yang. High Speed Circuits and Packaging Technology for Advanced Laser Altimeter Systems. Fort Belvoir, VA: Defense Technical Information Center, December 1996. http://dx.doi.org/10.21236/ada323087.

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Chang, Charles, Dharmesh Jani, K. C. Wang, Gerry Sullivan, and Edward Gertner. High Speed Circuits and Packaging Technology for Advanced Laser Altimeter Systems. Fort Belvoir, VA: Defense Technical Information Center, September 1996. http://dx.doi.org/10.21236/ada324731.

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MAR, ALAN, LARRY D. BACON, and GUILLERMO M. LOUBRIEL. Device Technology Investigation: Subsystems Packaging Study: Feasibility of PCSS - Based Pulser for Highly Portable Platforms. Office of Scientific and Technical Information (OSTI), July 2002. http://dx.doi.org/10.2172/801377.

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Bernhard, Jennifer T. Enabling Technology for Multiple Input Multiple Output (MIMO) Systems on Mobile Military Platforms: Antennas, Switches, and Packaging. Fort Belvoir, VA: Defense Technical Information Center, May 2011. http://dx.doi.org/10.21236/ada544844.

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Short, Samuel, Bernhard Strauss, and Pantea Lotfian. Emerging technologies that will impact on the UK Food System. Food Standards Agency, June 2021. http://dx.doi.org/10.46756/sci.fsa.srf852.

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Rapid technological innovation is reshaping the UK food system in many ways. FSA needs to stay abreast of these changes and develop regulatory responses to ensure novel technologies do not compromise food safety and public health. This report presents a rapid evidence assessment of the emerging technologies considered most likely to have a material impact on the UK food system and food safety over the coming decade. Six technology fields were identified and their implications for industry, consumers, food safety and the regulatory framework explored. These fields are: Food Production and Processing (indoor farming, 3D food printing, food side and byproduct use, novel non-thermal processing, and novel pesticides); Novel Sources of Protein, such as insects (for human consumption, and animal feedstock); Synthetic Biology (including lab-grown meat and proteins); Genomics Applications along the value chain (for food safety applications, and personal “nutrigenomics”); Novel Packaging (active, smart, biodegradable, edible, and reusable solutions); and, Digital Technologies in the food sector (supporting analysis, decision making and traceability). The report identifies priority areas for regulatory engagement, and three major areas of emerging technology that are likely to have broad impact across the entire food industry. These areas are synthetic biology, novel food packaging technologies, and digital technologies. FSA will need to take a proactive approach to regulation, based on frequent monitoring and rapid feedback, to manage the challenges these technologies present, and balance increasing technological push and commercial pressures with broader human health and sustainability requirements. It is recommended FSA consider expanding in-house expertise and long-term ties with experts in relevant fields to support policymaking. Recognising the convergence of increasingly sophisticated science and technology applications, alongside wider systemic risks to the environment, human health and society, it is recommended that FSA adopt a complex systems perspective to future food safety regulation, including its wider impact on public health. Finally, the increasing pace of technological
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Rahimipour, Shai, and David Donovan. Renewable, long-term, antimicrobial surface treatments through dopamine-mediated binding of peptidoglycan hydrolases. United States Department of Agriculture, January 2012. http://dx.doi.org/10.32747/2012.7597930.bard.

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There is a need for renewable antimicrobial surface treatments that are semi- permanent, can eradicate both biofilms and planktonic pathogens over long periods of time and that do not select for resistant strains. This proposal describes a dopamine binding technology that is inexpensive, bio-friendly, non-toxic, and uses straight-forward commercially available products. The antimicrobial agents are peptidoglycanhydrolase enzymes that are non-toxic and highly refractory to resistance development. The goal of this project is to create a treatment that will be applicable to a wide variety of surfaces and will convey long-lasting antimicrobial activity. Although the immediate goal is to create staphylolytic surfaces, the technology should be applicable to any pathogen and will thus contribute to no less than 3 BARD priorities: 1) increased animal production by protecting animals from invasive and emerging diseases, 2) Antimicrobial food packaging will improve food safety and security and 3) sustainable bio- energy systems will be supported by coating fermentation vats with antimicrobials that could protect ethanolic fermentations from Lactobacillus contamination that reduces ethanol yields. The dopamine-based modification of surfaces is inspired by the strong adhesion of mussel adhesion proteins to virtually all types of surfaces, including metals, polymers, and inorganic materials. Peptidoglycanhydrolases (PGHs) meet the criteria of a surface bound antimicrobial with their site of action being extracellular peptidoglycan (the structural basis of the bacterial cell wall) that when breached causes osmotic lysis. As a proof of principle, we will develop technology using peptidoglycanhydrolase enzymes that target Staphylococcus aureus, a notoriously contagious and antimicrobial-resistant pathogen. We will test for susceptibility of the coating to a variety of environmental stresses including UV light, abrasive cleaning and dessication. In order to avoid resistance development, we intend to use three unique, synergistic, simultaneous staphylococcal enzyme activities. The hydrolases are modular such that we have created fusion proteins with three lytic activities that are highly refractory to resistance development. It is essential to use multiple simultaneous activities to avoid selecting for antimicrobial resistant strains. This strategy is applicable to both Gram positive and negative pathogens. We anticipate that upon completion of this award the technology will be available for commercialization within the time required to achieve a suitable high volume production scheme for the required enzymes (~1-2 years). We expect the modified surface will remain antimicrobial for several days, and when necessary, the protocol for renewal of the surface will be easily applied in a diverse array of environments, from food processing plants to barnyards.
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