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Journal articles on the topic 'Packaging technology'

Author: Grafiati

Published: 4 June 2021

Last updated: 31 January 2023

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1

Pegu, Lukesh, Pankaj Chasta, and Mr Kaushal K. Chandrul. "Pharmaceutical Packaging Technology." International Journal of Trend in Scientific Research and Development Volume-3, Issue-3 (April 30, 2019): 1747–54. http://dx.doi.org/10.31142/ijtsrd23527.

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2

Wilbey, R. Andrew. "Food Packaging Technology." International Journal of Dairy Technology 58, no. 2 (May 2005): 125. http://dx.doi.org/10.1111/j.1471-0307.2005.00157.x.

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3

Tsukada, Yutaka. "SLC/FCA Packaging Technology." Journal of SHM 9, no. 2 (1993): 18–26. http://dx.doi.org/10.5104/jiep1993.9.2_18.

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4

SATO, Shobu. "RF MEMS Packaging Technology." Journal of Japan Institute of Electronics Packaging 7, no. 4 (2004): 299–302. http://dx.doi.org/10.5104/jiep.7.299.

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5

Poradish, Frank. "Modular ICNIA Packaging Technology." IEEE Aerospace and Electronic Systems Magazine 2, no. 6 (June 1987): 20–23. http://dx.doi.org/10.1109/maes.1987.5005417.

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6

Gavrilescu, Dana. "Electronic equipment packaging technology." Microelectronics Reliability 32, no. 12 (December 1992): 1778. http://dx.doi.org/10.1016/0026-2714(92)90275-p.

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7

ISHIWATA, Shuichi. "Packaging Technology of BGA/CSP. Packaging Technology for Small Size FC-PBGA." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 12, no. 3 (1997): 134–38. http://dx.doi.org/10.5104/jiep1995.12.134.

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8

NISHIDA, Hideyuki. "Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology." Circuit Technology 7, no. 1 (1992): 24–33. http://dx.doi.org/10.5104/jiep1986.7.24.

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9

Tenmei, Hiroyuki. "Electronics Packaging Technology and New Energy Technology." Journal of Japan Institute of Electronics Packaging 13, no. 2 (2010): P2. http://dx.doi.org/10.5104/jiep.13.p2.

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10

C., Sanjana M., Hemegowda R., and Sushma R. E. "Aseptic Packaging – A Novel Technology to the Food Industry." International Journal of Trend in Scientific Research and Development Volume-3, Issue-3 (April 30, 2019): 307–10. http://dx.doi.org/10.31142/ijtsrd22779.

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11

Yi Ni, Yi Ni, Xuan Kong Xuan Kong, Xiaofeng Gu Xiaofeng Gu, Xiangfei Chen Xiangfei Chen, Guanghui Zheng Guanghui Zheng, and Jia Luan Jia Luan. "Packaging multi-wavelength DFB laser array using REC technology." Chinese Optics Letters 11, s2 (2013): S20606–320608. http://dx.doi.org/10.3788/col201311.s20606.

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12

Kobayashi, Kazuhiko, and Takahiro Nakamura. "New Trend of Packaging Technology." Seikei-Kakou 26, no. 12 (November 20, 2014): 546–49. http://dx.doi.org/10.4325/seikeikakou.26.546.

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13

NAKAO, Shin. "Trend of VLSI Packaging Technology." Circuit Technology 9, no. 2 (1994): 125–31. http://dx.doi.org/10.5104/jiep1986.9.125.

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14

Ohno, Jun-ichi, and Ryoji Homma. "Packaging Technology for System LSI." Journal of SHM 14, no. 1 (1998): 11–15. http://dx.doi.org/10.5104/jiep1993.14.11.

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15

TSUKADA, Hiroshi. "Inspection Technology for Packaging Parts." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11, no. 1 (1996): 59–62. http://dx.doi.org/10.5104/jiep1995.11.59.

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16

KASHIBA, Yoshihiro. "Packaging Technology for Power Electronics." Journal of Smart Processing 9, no. 6 (2020): 250–54. http://dx.doi.org/10.7791/jspmee.9.250.

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17

Ekawardhani, Y. A., C. Y. Pasaribu, A. N. Rohmah, and O. Salsabila. "Bioplastic Technology as Packaging Innovation." IOP Conference Series: Materials Science and Engineering 1158, no. 1 (June 1, 2021): 012008. http://dx.doi.org/10.1088/1757-899x/1158/1/012008.

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18

Imai, Hideo. "Packaging Technology of Wearable Devices." Journal of Japan Institute of Electronics Packaging 18, no. 6 (2015): 396–99. http://dx.doi.org/10.5104/jiep.18.396.

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19

Dvorscak, Daniel, Dale Becker, Matteo Cocchini, Steven G. Pytel, Isaac Waldron, and Danil Kirsanov. "Packaging in IBIS-AMI Technology." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000601–7. http://dx.doi.org/10.4071/isom-2010-wp2-paper7.

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As serial links become faster and more complex, it is ever more challenging to model the silicon in an accurate and efficient manner. Traditional IBIS package models are simply not accurate enough and lack the bandwidth required for high-speed serial channels. The IBIS Algorithmic Modeling Interface (AMI) is a promising standard that is able to accurately model drivers and receivers that include equalizers and clock data recovery circuits. The introduction of the AMI modeling standard presents the opportunity to combine accurate driver and receiver models with high quality scattering parameter and W-element models of the passive IC, package, and PCB structures. In this paper we explore simulation with AMI models driving accurate high-bandwidth channel models of packages and printed circuit boards for robust simulation of high-speed serial systems. We also use these simulations to investigate the effects of variability in the manufactured channel.

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20

Nakata, Shuji. "Packaging technology of integrated circuit." Journal of the Japan Welding Society 59, no. 6 (1990): 414–20. http://dx.doi.org/10.2207/qjjws1943.59.414.

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21

Jeong, Suyeon, and SeungRan Yoo. "Kimchi Packaging Technology : An Overview." KOREAN JOURNAL OF PACKAGING SCIENCE AND TECHNOLOGY 22, no. 3 (December 31, 2016): 41–47. http://dx.doi.org/10.20909/kopast.2016.22.3.41.

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22

Russell, Pauline. "Paper and Paperboard Packaging Technology." International Journal of Dairy Technology 60, no. 4 (November 2007): 300. http://dx.doi.org/10.1111/j.1471-0307.2007.00322.x.

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23

Rohm, Harald. "Food Packaging Science and Technology." International Journal of Dairy Technology 63, no. 1 (February 2010): 143–45. http://dx.doi.org/10.1111/j.1471-0307.2009.00544.x.

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24

Honma, Hideo. "Plating technology for electronics packaging." Electrochimica Acta 47, no. 1-2 (September 2001): 75–84. http://dx.doi.org/10.1016/s0013-4686(01)00591-6.

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25

Esashi, Masayashi. "Vacum Packaging Technology for Microsensors." IEEJ Transactions on Sensors and Micromachines 120, no. 6 (2000): 310–14. http://dx.doi.org/10.1541/ieejsmas.120.310.

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26

Matsumura, Takeshi, Takayuki Tokuda, Akinobu Tsutinaga, Masafumi Kimata, Hideyuki Abe, and Naotaka Tokashiki. "Vacuum-Packaging Technology for IRFPAs." IEEJ Transactions on Sensors and Micromachines 130, no. 6 (2010): 212–18. http://dx.doi.org/10.1541/ieejsmas.130.212.

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27

Kim, Dong Min, Jin Hwa Ryu, and Myung Yung Jeong. "Optical Packaging and Interconnection Technology." Journal of the Microelectronics and Packaging Society 19, no. 4 (December 30, 2012): 13–18. http://dx.doi.org/10.6117/kmeps.2012.19.4.013.

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28

TANIGUCHI, Yoshikuni. "Special Articles: Theme of Advanced Assembly and Packaging Technology. Next Soldering Technology for Packaging." Circuit Technology 7, no. 1 (1992): 46–47. http://dx.doi.org/10.5104/jiep1986.7.46.

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29

SATOH, Takashi, Yuichi ITOH, Osamu MIKAMI, and Teiji UCHIDA. "Optical Circuit Packaging Technology. 90-Degree Optical Path Conversion Technology in Optical Circuit Packaging." Journal of Japan Institute of Electronics Packaging 2, no. 5 (1999): 368–72. http://dx.doi.org/10.5104/jiep.2.368.

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30

YAMAMOTO, Yuusuke. "Packaging Technology of BGA/CSP. CSP Mounting Technology." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 12, no. 3 (1997): 153–59. http://dx.doi.org/10.5104/jiep1995.12.153.

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31

Whicker, L. R. "Active phased array technology using coplanar packaging technology." IEEE Transactions on Antennas and Propagation 43, no. 9 (1995): 949–52. http://dx.doi.org/10.1109/8.410211.

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32

Perera, Kalpani Y., Jack Prendeville, Amit K. Jaiswal, and Swarna Jaiswal. "Cold Plasma Technology in Food Packaging." Coatings 12, no. 12 (December 5, 2022): 1896. http://dx.doi.org/10.3390/coatings12121896.

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Cold plasma (CP) is an effective strategy to alter the limitations of biopolymer materials for food packaging applications. Biopolymers such as polysaccharides and proteins are known to be sustainable materials with excellent film-forming properties. Bio-based films can be used as an alternative to traditional plastic packaging. There are limitations to biopolymer packaging materials such as hydrophobicity, poor barrier, and thermos-mechanical properties. For this reason, biopolymers must be modified to create a packaging material with the desired applicability. CP is an effective method to enhance the functionality and interfacial features of biopolymers. It etches the film surface allowing for better adhesion between various polymer layers while also improving ink printability. CP facilitates adhesion between two or more hydrophobic materials, resulting in significantly better water vapour permeability (WVP) properties. The sputtering of ionic species by CP results in cross-linkage reactions which improve the mechanical properties of films (tensile strength (TS) and elongation at break (EAB)). Cross-linkage reactions are reported to be responsible for the improved thermal stability of CP-treated biopolymers. CP treatment is known to decrease oxygen permeability (OP) in protein-based biopolymers. CP can also enable the blending of polymers with specific antimicrobial substances to develop active packaging materials. In this review article, we have presented an overview of the recent advancements of CP in the food packaging application. Furthermore, the influence of CP on the properties of packaging materials, and recent advancements in the modification of polymeric food packaging materials have been discussed.

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33

UCHIDA, Sugio, and Shinichi WAKABAYASHI. "Special Articles: The Micro Soldering Technology of Super High Density Packaging. Chip-size Packaging Technology." Circuit Technology 9, no. 7 (1994): 475–78. http://dx.doi.org/10.5104/jiep1986.9.475.

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34

OTSUKA, Kanji. "Electronic Packaging Technology View from System Design. Packaging Technology Made New Capability in Electronics Use." Journal of the Surface Finishing Society of Japan 49, no. 8 (1998): 831–36. http://dx.doi.org/10.4139/sfj.49.831.

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35

Huemoeller, Ron. "Creating Semiconductor Value through Advanced Package Technology." International Symposium on Microelectronics 2016, S1 (October 1, 2016): S1—S46. http://dx.doi.org/10.4071/isom-2016-slide-1.

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Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation. In fact, the overall packaging industry is doing quite well today as a result, with solid growth expected to create a market value in excess of $30B USD by 2020. This is largely due to the technology innovation in the semiconductor industry continuing to march forward at an incredible pace, with silicon advancements in new node technologies continuing on one end of the spectrum and innovative packaging solutions coming forward on the other in a complementary fashion. The pace of innovation has quickened as has the investments required to bring such technologies to production. At the packaging level, the investments required to support the advancements in silicon miniaturization and heterogeneous integration have now reached well beyond $500M USD per year. Why has the investment to support technology innovation in the packaging community grown so much? One needs to look no further than the complexity of the most advanced package technologies being used today and coming into production over the next year. Advanced packaging technologies have increased in complexity over the years, transitioning from single to multi-die packaging, enabled by 3-dimensional integration, system-in-package (SiP), wafer-level packaging (WLP), 2.5D/3D technologies and creative approached to embedding die. These new innovative packaging technologies enable more functionality and offer higher levels of integration within the same package footprint, or even more so, in an intensely reduced footprint. In an industry segment that has grown accustomed to a multitude of package options, technology consolidation seems evident, producing “The Big Five” advanced packaging platforms. These include low-cost flip chip, wafer-level chip-scale package (WLCSP), microelectromechanical systems (MEMS), laminate-based advanced system-in-package (SiP) and wafer-based advanced SiP designs. This presentation will address ‘The Big Five’ packaging platforms and how they are adding value to the Semiconductor Industry.

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36

Xu, Wei, and Zhao Ming Liu. "Research on Green Manufacturing-Oriented Packaging Design Technology." Advanced Materials Research 734-737 (August 2013): 2770–73. http://dx.doi.org/10.4028/www.scientific.net/amr.734-737.2770.

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This paper research the features of green packaging design, and the priority sequence and principles to follow during product design process. Taking the whole product life cycle into consideration , the research endeavors to make the actual product packaging design process, from raw material selection, the production, use, recovery of packaging materials, to waste processing, meet the requirements of environmental protection and human health, so that the rate of reusing waste packaging materials could be greatly increased, and the direct or indirect environmental pollution will be reduced or even eliminated after the packaging materials are abandoned.

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37

Anetta, Barska, and Wyrwa Joanna. "Innovations in the food packaging market – intelligent packaging – a review." Czech Journal of Food Sciences 35, No. 1 (March 3, 2017): 1–6. http://dx.doi.org/10.17221/268/2016-cjfs.

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The manufacturers have to provide modern and safe packaging due to the growing consumer interest in the consumption of fresh products with extended shelf-life and controlled quality. It is a challenge to the food packaging industry and it also acts as a driving force for the development of new and improved concepts of packaging technology. It is in order to meet these needs that intelligent packaging can be applied. This article presents a generation of packaging which allows maintaining and even improving the quality of the packaged product, which is an essential advantage particularly in the food industry. The most important advantage resulting from their use is a reduction in the loss of food products due to the extension of their shelf life.

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38

Feng, Xian Zhang, Liang Ji Chen, and Jun Wei Cheng. "Application and Prospects of Packaging Technology of MEMS." Key Engineering Materials 460-461 (January 2011): 274–79. http://dx.doi.org/10.4028/www.scientific.net/kem.460-461.274.

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Micro-electromechanical systems is called MEMS for short, it is the product of mutual integration for the micro-electronics and micro-mechanics, which covers mechanical, electrical, physical, biological and other modern technology. MEMS packaging is a key technology that has been developed based on electronic package technology. In order to strengthen the development of packaging process of MEMS, in particular, which are low cost, materials and packaging technology and has an ideal effect. The characteristics of MEMS packaging technology based on MEMS technologies are introduced, and the future development tendency and application of MEMS device packaging are previewed in this dissertation.

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39

Li, Meng Xiao, and Shu Bao Zhou. "Research on the Application of 3D Printing Technology in the Field of Packaging." Applied Mechanics and Materials 731 (January 2015): 304–7. http://dx.doi.org/10.4028/www.scientific.net/amm.731.304.

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3D printing technology has brought technology innovations for each industry, there is no exception in the field of packaging. This paper mainly introduces the characteristics and advantages of 3D printing technology, its application progress in products packaging design and packaging material forming, and finally summarizes the application trend of 3D printing technology. 3D printing technology can not only make complex and personalized packaging design possible, but also dig more advanced packaging materials, and make the formation of packaging materials quickly, 3D printing technology has very broad prospects of development in the field of packaging.

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40

SASAKI, Keisuke. "Packaging Technologies of Optical Circuits. Trends of Optoelectronics Circuit Packaging Technology." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, no. 5 (1995): 286–88. http://dx.doi.org/10.5104/jiep1995.10.286.

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41

Pavithra Siva, Mohammad Ali Tareq, and Kamyar Shameli. "Biodegradable Polymers for Packaging : A Bibliometric Overview of the Publication in Web of Science in Year 2012-2021." Journal of Research in Nanoscience and Nanotechnology 5, no. 1 (April 18, 2022): 29–42. http://dx.doi.org/10.37934/jrnn.5.1.2942.

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This is a bibliometric analysis study of biodegradable and packaging by studying the documents related to biodegradable field.The use of polymer packaging increased due to its several desired properties such as softness , lightness ans transparency. However , the non biodegradability of polymer packaging only led to a serious ecological problems.Although complete replacement of polymer packaging with biodegradable packaging is quite impossible , still production of biodegradable packaging will reduce the need for synthetic polymer packaging.A lot of studies has been done regarding to the biodegradable and packaging started to attract people from various counties such as China , India and USA. An analysts has been done in this paper by extracting data from WOS database and visualise through VOSviewer to study the collaboration network, topics of interest and impact of publications. Findings reveals that the collaboration work is strong between China and USA as both countries are successful in scientific knowledge technology. This study expected to have an impact for future environment on biodegradable and packaging field.

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42

Lee, Hwan-Yong, Song-I. Han, and Ki-Ho Han. "Practical Packaging Technology for Microfluidic Systems." Transactions of the Korean Society of Mechanical Engineers B 34, no. 3 (March 1, 2010): 251–58. http://dx.doi.org/10.3795/ksme-b.2010.34.3.251.

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43

Nakatani, Masami, Toshio Katou, Hironari Sano, Atsuhiro Yamakoshi, Takashi Furukawa, and Seiya Mori. "Recycling Technology for Polyolefin Packaging Film." Seikei-Kakou 11, no. 10 (1999): 842–46. http://dx.doi.org/10.4325/seikeikakou.11.842.

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44

Yamada, Toshiki. "Active Barrier Technology for Plastic Packaging." Seikei-Kakou 26, no. 8 (July 20, 2014): 382–85. http://dx.doi.org/10.4325/seikeikakou.26.382.

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45

Sugiura, Noboru, Ryoichi Kobayashi, and Akio Yasukawa. "Packaging Technology for Automotive Power Device." HYBRIDS 7, no. 4 (1991): 26–31. http://dx.doi.org/10.5104/jiep1985.7.4_26.

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46

Ishitsuka, Fuminori. "Packaging Technology for High Frequency Devices." Journal of SHM 13, no. 3 (1997): 34–39. http://dx.doi.org/10.5104/jiep1993.13.3_34.

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47

Minokami, Katsuhiro. "EMC Simulation Technology for Electronics Packaging." Journal of The Japan Institute of Electronics Packaging 25, no. 6 (September 1, 2022): 539–49. http://dx.doi.org/10.5104/jiep.25.539.

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48

Wang, Jun. "On future packaging Technology and Science." Packaging Technology and Science 35, no. 2 (December 28, 2021): 109. http://dx.doi.org/10.1002/pts.2630.

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49

NISHI, Kunihiko. "Recent Activities in Semiconductor Packaging Technology." Journal of Japan Institute of Electronics Packaging 10, no. 5 (2007): 341–43. http://dx.doi.org/10.5104/jiep.10.341.

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50

Utsunomiya, Henry H. "3D Integration Packaging Technology toward 2015." Journal of Japan Institute of Electronics Packaging 15, no. 2 (2012): 126–31. http://dx.doi.org/10.5104/jiep.15.126.

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