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Journal articles on the topic 'PCB board'

Author: Grafiati

Published: 3 June 2025

Last updated: 1 August 2025

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1

Petkov, Nikolay, and Malinka Ivanova. "Printed circuit board and printed circuit board assembly methods for testing and visual inspection: a review." Bulletin of Electrical Engineering and Informatics 13, no. 4 (2024): 2566–85. http://dx.doi.org/10.11591/eei.v13i4.7601.

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Testing and visual inspection of printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) are important procedures in the manufacturing process of electronic modules and devices related to locating and identifying possible defects and failures. Earlier defects detection leads to decreasing expenses, time and used resources to produce high quality electronics. In this paper an exploration and analysis about the current research regarding methods for PCB and PCBA testing, techniques for defects detection and vusial inspection is performed. The impact of machine and deep learnin

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Sridar, Ratika M., and Dr S. Kanimozhi. "Fuzzy PCA based Image Matching and Flexible Flying Probe are Used in Embedded Based PCB Bare Board Testing Machine." INTERANTIONAL JOURNAL OF SCIENTIFIC RESEARCH IN ENGINEERING AND MANAGEMENT 08, no. 008 (2024): 1–6. http://dx.doi.org/10.55041/ijsrem37349.

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In the conventional approach for test jig is equipped by mounting an insulation material pattern above the flexible conductive screen. This is done by maintaining small distance away from the PCB of same pattern in order to detect particular defect location. It is then done by scanning the pattern with help of the roller which forces these two patterns into making contact by passing current from the screen side to side in the wiring board at scan. Prerequisites are prepared to examine involuntarily X and Y coordinated positions of a fault spot into a register. But it has several disadvantages

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3

Jayasekar, Micheal. "PCB Advanced Via/Holes Technologies." PCB Advanced Via/Holes Technologies 9, no. 2 (2024): 12. https://doi.org/10.5281/zenodo.10656132.

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Printed Circuit Boards (PCBs) Via is the arrangement of different layers to make up a PCB. It involves determining the number of layers, their order, and the materials used for each layer. PCB Via is a plated hole in a circuit board that connects different layers of the board, allowing electrical signals and power to pass between them. They serve as electrical connections between different circuit board layers and help in efficiently routing signals and power. This article provides an in-depth understanding of PCB vias, discussing their types, design considerations, advanced Via technologies,

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Pallavi, A. Gade, D. Wagh Ganesh, N. Sulakhe Vishal, D. Katkade Santosh, and Pravin Joshi Kaustubh. "PCB Cutting Machine." International Journal of Innovative Science and Research Technology 7, no. 9 (2022): 662–67. https://doi.org/10.5281/zenodo.7133876.

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The goal of this paper is about to assemble a printed circuit board-cutting machine. The contemporary evolution in digital technology particularly embedded systems have now enabled us to make designing and implementing an automatic printed circuit board-cutting machine. This machine takes Printed Circuit Board from one side and cut it into two separate pieces, in essential size and shape. This paper presents a simple way that will reduce human work and improves accuracy of cutting the printed circuit board. System will minimize PCB damage chances by blades using the fabrication and covering. C

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Khan, Noor Mohmmed, Shubhangi Patil, Tushar Diggewadi, and Anand Gudnavar. "Cinch and Sterling Analog Circuits for Laboratory." International Journal of Advanced Research in Electrical, Electronics and Instrumentation Engineering 6, no. 01 (2017): 51–58. http://dx.doi.org/10.15662/ijareeie.2017.0601007.

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As we know that there is ever increasing demand for compact circuits and less complex wirings over the board, a technological boon evolved for such demand is Printed Circuit Board (PCB). A PCB will mechanically supports and electrically connects electronic components using conductive tracks, pads. These boards will have minimal chances for short circuits, components on the board are fixed; another advantage is creation of multiple boards using single design. Taking this technology forward to our everyday life, we implemented analog communication laboratory circuit, Schmitt trigger.

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Hsia, Kuo-Hsien, and Jr-Hung Guo. "Estimation of the PCB Production Process Using a Neural Network." Proceedings of Engineering and Technology Innovation 15 (April 27, 2020): 01–07. http://dx.doi.org/10.46604/peti.2020.4265.

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Printed Circuit Boards (PCB) are an integral part of all electronic products, and the production process for printed circuit boards is quite complex. As the life cycle of electronic products becomes shorter and shorter, and the precision and signal bandwidth of electronic products become higher and higher, the manufacturing process of printed circuit boards is further complicated. Therefore, how to pre-evaluate the production difficulty before starting the production will effectively increase the efficiency and quality of printed circuit board production. Gerber file is the most commonly

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Myers, Sharon A., Troy D. Cognata, and Hugh Gotts. "FTIR analysis of printed-circuit board residue." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 264–65. http://dx.doi.org/10.1017/s0424820100163782.

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Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. The failure to boot was originally traced to a suspected bad microcontroller chip. Replacing this chip, or an oscillator tied to the microcontroller circuit, did not consistently solve the boot problem. With further testing, it was found the microcontroller circuit was very sensitive to resistance and was essentially shorted.A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resist

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8

Craven, Jeffery D., Ariel R. Oldag, and Robert N. Dean. "A Technique for Detecting Moisture Absorption in Printed Circuit Boards." Journal of Microelectronics and Electronic Packaging 17, no. 1 (2020): 28–33. http://dx.doi.org/10.4071/imaps.1014123.

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Abstract Most circuit boards operate in environments that have the potential to be exposed to moisture, either in vapor or liquid form. Because low-cost circuit boards can readily absorb moisture, this can lead to performance issues, reliability issues, and even catastrophic failure. However, it is difficult to detect if moisture absorption has occurred before the circuit board suffers a complete failure. To alleviate this issue, a fringing field capacitor was implemented in printed circuit board (PCB) technology and used to detect the absorption of moisture in the circuit board through the ac

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Taufik Alfiansyah and Mustofa Abi Hamid. "Preventive Maintenance Chip Mounter Machine Juki Ke-2070m di PT. Global Jaya Elektronik." Jurnal Sains dan Teknologi 3, no. 2 (2024): 29–36. https://doi.org/10.58169/saintek.v3i2.654.

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SMT (Surface Mount Technology) is an automatic technology used in the installation of electronic components on a PCB (Printed Circuit Board). There are 3 stages in the manufacture of PCB boards with SMD components, namely Solder Paste, Chip Mounter Machine and Reflow Oven. Chip Mounter Machine is equipment used in the installation of SMD components on a PCB board or can be called a Pick and Place machine. This Chip Mounter Machine is an important piece of equipment in the SMT line, because this machine is the axis in the production of PCB board modules. Therefore, maintenance is carried out to

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10

Umbetov, S. V., and S. P. Pronin. "COMPREHENSIVE METHOD FOR MONITORING PCB CORROSION PROCESS." Kontrol'. Diagnostika, no. 309 (March 2024): 50–57. http://dx.doi.org/10.14489/td.2024.03.pp.050-057.

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Experimental studies of corrosion penetration into printed circuit boards of laboratory samples are presented. Conditions similar to those ignited in contact with sea water were recreated and a series of experiments were carried out with each printed circuit board of the device. The results of laboratory studies of the relationship between corrosion of conductive tracks and their resistance according to the ratio of color components in a digital image of the corroded surface of a printed circuit board track are presented. The histogram of the distribution of pixels by color for photographs cle

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11

Wong, E. H. "Dynamics Of Board-Level Drop Impact." Journal of Electronic Packaging 127, no. 3 (2004): 200–207. http://dx.doi.org/10.1115/1.1938987.

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The dynamic response of the printed circuit board (PCB) in a standard board-level drop impact test has been modeled as a spring-mass system, a beam, and a plate. Analytical solutions for the time-response and amplification of the deflection, bending moment, and acceleration at any point on the PCB have been developed and validated with finite element analysis. The analyses have shown that (i) the response of the PCB was dominated by the fundamental mode and (ii) the response of the PCB depends heavily on the ratio between the frequency of the PCB and the input acceleration pulse. The bending m

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Jang, Sung-Cheol, Min-Su Kweon, and Soo-Min Han. "Heat Characteristics Analysis of Radiator for PCB-Board." Journal of the Korea Society For Power System Engineering 20, no. 6 (2016): 20–26. http://dx.doi.org/10.9726/kspse.2016.20.6.020.

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Tan, Cher-Ming, Hsiao-Hi Chen, Jing-Ping Wu, Vivek Sangwan, Kun-Yen Tsai, and Wen-Chun Huang. "Root Cause Analysis of a Printed Circuit Board (PCB) Failure in a Public Transport Communication System." Applied Sciences 12, no. 2 (2022): 640. http://dx.doi.org/10.3390/app12020640.

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A printed circuit board (PCB) is an essential element for practical circuit applications and its failure can inflict large financial costs and even safety concerns, especially if the PCB failure occurs prematurely and unexpectedly. Understanding the failure modes and even the failure mechanisms of a PCB failure are not sufficient to ensure the same failure will not occur again in subsequent operations with different batches of PCBs. The identification of the root cause is crucial to prevent the reoccurrence of the same failure. In this work, a step-by-step approach from customer returned and i

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Alam, Nur, and Taufik Hidayat. "Implementation of a Temperature Measurement System for Transferring Image Patterns to Copper Boards in PCB Making." SAINSTECH: JURNAL PENELITIAN DAN PENGKAJIAN SAINS DAN TEKNOLOGI 31, no. 1 (2021): 8–13. http://dx.doi.org/10.37277/stch.v31i1.1008.

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This research has succeeded in implementing a PLC-Based Temperature Control System for Transferring Image Patterns to Copper Boards in PCB (Printed Circuit Board) Manufacturing. This tool is made to simplify and speed up the process of transferring image patterns to copper boards in PCB manufacture. This Regulatory System consists of HMI, PLC, Thermocouple, Transmitter Thermocouple, Heater, as well as iron coating mechanics. HMI serves to display the settings received by the PLC as well as a second controller. While the PLC functions as a data processing center needed by the system and the mai

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15

Wang, Lance. "System I/O Optimization with SoC, SiP, PCB Co-Design." International Symposium on Microelectronics 2019, no. 1 (2019): 000013–18. http://dx.doi.org/10.4071/2380-4505-2019.1.000013.

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Abstract The increasing complexity of system on chips (SoCs) combined with a new generation of designs that combine multiple chips in a single package is creating new challenges in the design of packages, printed circuit boards (PCBs) and integrated circuits (ICs). The process typically involves three independent design processes – chip, package and PCB – carried out with point tools whose interface requires time-consuming manual processes that are error-prone and limit the potential for reuse. This challenge is being addressed by a new integrated 3D chip/package/board co-design environment th

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Xie, Ling, Zixuan Feng, and Lifei Shen. "Intelligent PCB Surface Defect Detection and Diagnosis based on Improved YOLOv7." Journal of Physics: Conference Series 2999, no. 1 (2025): 012013. https://doi.org/10.1088/1742-6596/2999/1/012013.

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Abstract As the electronics manufacturing industry develops rapidly, the quality control of PCB boards has been increasingly important. Surface defect detection is a key part of PCB board quality control, and the detection speed and accuracy directly affect the quality and production efficiency of products. In view of the shortcomings of the existing PCB surface defect detection methods, we develop an intelligent PCB surface defect detection and diagnosis method by integrating the improved YOLOv7, which, on the basis of maintaining the lightweight and real-time performance of YOLOv7, improves

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17

Noor Yulita Dwi Setyaningsih, Moh Rizal, and Budi Cahyo Wibowo. "CNC Plotter Printed Circuit Board." Jurnal Media Elektrik 21, no. 2 (2024): 116–22. http://dx.doi.org/10.59562/metrik.v21i2.2145.

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Prited Circuit Board is one part of the field of electronics that has many roles and benefits. This automatic PCB path manufacturing will provide many benefits to users that were previously still done manually. In this research, the PCB carving process will be operated using G-Code and GRBL controller to control the machine. The use of 3 stepper motors will provide a good carving composition in terms of x, y and Z axis movements, as well as the use of spindles for drill bit control that functions to carve PCB layouts. From the results, the PCB path manufacturing process is faster and has the a

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18

Paul, Shubhra Deb, and Swarup Bhunia. "SILVerIn: Systematic Integrity Verification of Printed Circuit Board Using JTAG Infrastructure." ACM Journal on Emerging Technologies in Computing Systems 17, no. 3 (2021): 1–28. http://dx.doi.org/10.1145/3460232.

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A printed circuit board (PCB) provides necessary mechanical support to an electronic system and acts as a platform for connecting electronic components. Counterfeiting and in-field tampering of PCBs have become significant security concerns in the semiconductor industry as a result of increasing untrusted entities in the supply chain. These counterfeit components may result in performance degradation, profit reduction, and reputation risk for the manufacturers. While Integrated Circuit (IC) level authentication using physical unclonable functions (PUFs) has been widely investigated, countermea

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Rakov, Aleksei, Vladimir Zhukov, Artem Kukanov, and Vladimir Ukhandeev. "Set of measuring test fixtures for PCB materials research." ITM Web of Conferences 30 (2019): 07003. http://dx.doi.org/10.1051/itmconf/20193007003.

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Designed and manufactured set of measuring test fixtures for printed circuit board (PCB) materials research and characterization is described in this article. Attention is paid to special designed test vehicle “General board” which includes six types of transmission lines that are used for PCB materials characterization by two measurement methods. Measurements of the frequency dependencies of the dielectric constant and dielectric loss for a number of the most widely used PCB substrates are presented. The comparison of the measurement results made by two measurement methods is also shown. The

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20

Lambture, Rahul. "Printed Circuit Board (PCB) Fault Detection." International Journal for Research in Applied Science and Engineering Technology 12, no. 6 (2024): 542–48. http://dx.doi.org/10.22214/ijraset.2024.63142.

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Abstract: Nowadays many industries heavily depend on devices, those, with printed circuit boards (PCBs) to function properly. However issues like connections, damaged components or short circuits can cause malfunctions that result in downtime and financial losses. It is crucial to identify and resolve thesePCB faults to maintain the operation of electronic systems. On average businesses experience a 23% decrease in productivity due to PCB faults. One of the contributors to this problem is the lack of detection and resolution. To tackle this issue we propose an approach using machine learning t

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Alex Thomas, Nikhil, Sanket Dessai, S. G. ShivaPrasad Yadav, and Shilpa Chaudhari. "Design and Development of ARM9 Evaluation Kit for Embedded Applications." International Journal of Reconfigurable and Embedded Systems (IJRES) 3, no. 2 (2014): 62. http://dx.doi.org/10.11591/ijres.v3.i2.pp62-75.

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In contrast with low end microprocessor, ARM9 core is quite a sophisticated processor. The Evaluation kit plays an important role in the prototype development and verification of the system design before taking to its actual system development hence it’s provide better confidence to the designer. In this paper a project for the Evaluation kit has been designed for embedded system engineer to implement and confirm the functionality of their operating systems which could lead to a comfortable deployment. The independent modules for the interfaces of the ARM9 processor have been designed and the

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22

Rindayatno and Agus Nur Fahmi. "Characteristics of Particle Cement Board and Wood Plastic Composite from Oil Palm (Elaeis guineensis Jacq.) Fronds." International Journal of Scientific Multidisciplinary Research 2, no. 5 (2024): 389–400. http://dx.doi.org/10.55927/ijsmr.v2i5.9116.

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The yield of oil palm fronds is 8.4 tons/ha/year [1], a huge potential that has not been used optimally. Particle Cement Board (PCB) is a biocomposite that uses inorganic adhesive, namely cement, to bind biomass particles into a board. Wood Plastic Composite (WPC) is a biocomposite that combines plastic and biomass particles molded into boards. This study used the same biomass particles—oil palm fronds—to analyze the properties of PCBs and WPCs. Characteristics assessment by measuring and testing physical and mechanical properties were density, moisture content, water absorption, thickness swe

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23

Li, Xiaohan, Zhiqiang Zhao, Huafu Xu, Ruoning Kou, and Jingwei Yue. "Design of PCB Defect Detection System Based on PyQt." Journal of Computer Science and Artificial Intelligence 2, no. 3 (2025): 36–39. https://doi.org/10.54097/maar8p27.

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With the rapid development of electronic manufacturing industry, printed Circuit Board (PCB) is the core hub of electronic products, and its quality inspection plays a decisive role in ensuring the performance and reliability of products. In order to overcome the shortcomings of weak interactivity and low visualization of traditional PCB board defect detection methods, this study designed a highly interactive and intuitive PCB board defect detection system based on YOLOv5 with the help of PyQt toolkit. The system has a UI with complete functions and stable performance, which includes three fun

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LENGER, Tomáš, and Alena PIETRIKOVÁ. "OPTIMIZATION OF NFC ANTENNA TO MICROCONTROLLER’S BOARD DIMENSIONS." Acta Electrotechnica et Informatica 1335-8243, no. 1338-3957 (2021): 25–29. http://dx.doi.org/10.15546/aeei-2021-0004.

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This paper is focused on Near-Field Communication (NFC), which is one of the most popular wireless communication. Although the NFC was developed in recent years, it is inseparable part of the everyday activities. NFC antenna is the key element for the realization of the NFC. This paper deals with the design of the miniaturized NFC antenna. Basic equations for coil inductance calculation, which are necessary for the NFC antenna design are presented as well. This paper also focuses on the influence of the coil’s aspect ratio to its inductance. The aim of this paper was the optimization of the NF

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Wong, E. H., Y.-W. Mai, and S. K. W. Seah. "Board Level Drop Impact—Fundamental and Parametric Analysis." Journal of Electronic Packaging 127, no. 4 (2005): 496–502. http://dx.doi.org/10.1115/1.2065747.

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A fundamental understanding of the dynamics of the PCB assembly when subjected to a half-sine acceleration has also been obtained through analyzing the PCB as a spring mass system, a beam, and a plate, respectively. The magnitude of stresses in solder interconnection due to flexing of the PCB is two orders higher than the magnitude of the stresses induced by acceleration and inertia loading the IC package. By ignoring the inertia loading, computational effort to evaluate the interconnection stresses due to PCB flexing can be reduced significantly via a two-step dynamic-static analysis. The dyn

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Schmidt, H., M. Käß, R. Lichtinger, and M. Hülsebrock. "Model updating for the simulation of surface strains on printed circuit boards considering parameter uncertainty." Journal of Physics: Conference Series 2647, no. 21 (2024): 212006. http://dx.doi.org/10.1088/1742-6596/2647/21/212006.

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Abstract The efficient and reliable design of power electronic components plays an important role in the development process of electrically driven vehicles. One key aspect is the reliability of solder joints on printed circuit boards (PCB) that greatly depends on the surface strain at the solder joint locations. It is therefore unavoidable to use precise simulations of surface strains to reliably estimate the solder joint lifetime. This work presents a procedure of model updating of a printed circuit board model that considers the variability of board behavior due to uncertainties in the mate

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Dong, Liangwei, and Yueli Hu. "Microfluidic networks embedded in a printed circuit board." Modern Physics Letters B 31, no. 19-21 (2017): 1740017. http://dx.doi.org/10.1142/s0217984917400176.

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In order to improve the robustness of microfluidic networks in printed circuit board (PCB)-based microfluidic platforms, a new method was presented. A pattern in a PCB was formed using hollowed-out technology. Polydimethylsiloxane was partly filled in the hollowed-out fields after mounting an adhesive tape on the bottom of the PCB, and solidified in an oven. Then, microfluidic networks were built using soft lithography technology. Microfluidic transportation and dilution operations were demonstrated using the fabricated microfluidic platform. Results show that this method can embed microfluidi

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Fidan, Ismail. "CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering." Journal of Electronic Packaging 126, no. 1 (2004): 173–76. http://dx.doi.org/10.1115/1.1646422.

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The trend to high-density packaging in surface mount assembly has highlighted inherent difficulties in the assembly line of these very fine pitch devices. A variety of defects is still common in printed circuit board assembly (PCBA) technology despite all the improvements made, and rework of PCBA is inevitable and performed manually in PCBA manufacturing floors since the cost of each component and PCB itself may be hundreds of dollars. In the last few years, the number of rework stations available on the market has grown considerably including the automated ones, but there has still been no si

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Wang, Qianyue. "A new frontier in electronics manufacturing: Optimized deep learning techniques for PCB image reconstruction." Applied and Computational Engineering 51, no. 1 (2024): 267–73. http://dx.doi.org/10.54254/2755-2721/51/20241591.

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In the rapidly evolving electronics manufacturing sector, maintaining quality control and conducting failure analysis of Printed Circuit Boards (PCBs) are critical yet challenging tasks. This study presents a groundbreaking self-supervised learning framework to address existing gaps in the reconstruction of encoded or blurred Printed Circuit Board images. By leveraging a customized DeepLabV3+ architecture with depth-wise separable convolutions, our model is engineered to autonomously learn intrinsic Printed Circuit Board features, eliminating the need for manual data labeling. This not only al

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Zhang, Kai. "Using deep learning to automatic inspection system of printed circuit board in manufacturing industry under the internet of things." Computer Science and Information Systems, no. 00 (2023): 20. http://dx.doi.org/10.2298/csis220718020z.

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Industry 4.0 is currently the goal of many factories, promoting manufacturing factories and sustainable operation. Automated Optical Inspection (AOI) is a part of automation. Products in the production line are usually inspected visually by operators. Due to human fatigue and inconsistent standards, product inspections still have defects. In this study, the sample component assembly printed circuit board (PCB), PCB provided by the company was tested for surface components. The types of defects on the surface of the PCB include missing parts, multiple parts, and wrong parts. At present, the com

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Jain, Sakait, and Hae Chang Gea. "PCB Layout Design Using a Genetic Algorithm." Journal of Electronic Packaging 118, no. 1 (1996): 11–15. http://dx.doi.org/10.1115/1.2792119.

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This paper presents an approach to find the optimal design layout of chips on a circuit board in a manner that minimizes the area covered on the board and the connections between the various chips. In addition, there are no major heat sources next to each other and certain physical constraints are satisfied while finding a layout design. In this approach, the whole circuit board area is divided into a finite number of cells for mapping it into a Genetic Algorithm (GA) chromosome. The mutation and crossover operators have been modified and are applied in conjunction with connectivity analysis f

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Zhang, Yanfei, Daizheng Hou, and Yafu Zhou. "Research on PCB layout optimization of vehicle controller based on electrothermal hybrid simulation." Journal of Physics: Conference Series 2797, no. 1 (2024): 012043. http://dx.doi.org/10.1088/1742-6596/2797/1/012043.

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Abstract With the rapid development of the electronic industry, electronic equipment is more and more widely used in automobiles. The integration of electronic components on the Printed Circuit board (PCB) is getting higher and higher, the size is getting smaller and smaller, and the power is getting larger and larger, which leads to a sharp increase in the heat flow density of the whole PCB. The surface temperature of the chip is too high when it is working, which leads to a series of thermal failure problems. In order to improve the thermal characteristics between PCB and electronic componen

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Bártová, Blanka, and Vladislav Bína. "A Novel Data Mining Approach for Defect Detection in the Printed Circuit Board Manufacturing Process." Engineering Management in Production and Services 14, no. 2 (2022): 13–25. http://dx.doi.org/10.2478/emj-2022-0013.

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Abstract This research aims to propose an effective model for the detection of defective Printed Circuit Boards (PCBs) in the output stage of the Surface-Mount Technology (SMT) line. The emphasis is placed on increasing the classification accuracy, reducing the algorithm training time, and a further improvement of the final product quality. This approach combines a feature extraction technique, the Principal Component Analysis (PCA), and a classification algorithm, the Support Vector Machine (SVM), with previously applied Automated Optical Inspection (AOI). Different types of SVM algorithms (l

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Park, Pil-Ju, Bo-Sam Lee, and Kun-Mo Lee. "Life Cycle Assessment on Printed Circuit Board." Korean Journal of Life Cycle Assessment 2, no. 1 (2000): 61–68. http://dx.doi.org/10.62765/kjlca.2000.2.1.61.

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Life Cycle Assessment on Printed Circuit Board produced in C Electronics Co. was carried out. The system boundary encompasses raw material acquisition to the manufacturing of PCB(or cradle to gate). The product is FR4 PCB used for a component of HDD. FR is a mixture of glass fiber and epoxy resin. Generally site specific data were applied. However, database were used when it is hard to get site specific data. Impact assessment was carried out consecutively as classification, characterization, normalization and weighting. Considered Impact categories are ARD, GW, OD, POC, Acid, Eut, ET, HT. Sen

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Tang, Hong Qun, Cheng Yong Wang, Bing Wang, F. Su, Ping Ma, and Yue Xian Song. "Module Partition and Application for Printed Circuit Board High Speed Drilling Machine." Advanced Materials Research 188 (March 2011): 104–9. http://dx.doi.org/10.4028/www.scientific.net/amr.188.104.

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The target of this paper is to design a high speed drilling machine suitable for printed circuit board with micro-hole of 0.1 mm diameter, which has drilling force measuring function and rapid change spindle function. Therefore, in this paper, the main principles of module partition for drilling machine were analyzed. Module partition was conducted for high speed drilling machine of Printed Circuit Board (PCB), as well as using modular components combine PCB high speed drilling machine. Then, performance testing and simulation of dynamic modeling were carried out on the modular PCB high speed

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Wu, Xian Zhe, Cheng Zhang, Shuang Fei Yang, and Lian Qing Zhao. "Computerized Simulation of Board-Level EMC in High-Speed PCB." Advanced Materials Research 989-994 (July 2014): 1977–80. http://dx.doi.org/10.4028/www.scientific.net/amr.989-994.1977.

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Aim at the multi-faceted nature and universality of the EMC problems in high-speed PCB, based on a three-line coupling model and considering the influence of via holes caused, board-level EMC problems of PCB were researched on point for point. In this paper, the research and simulation were launched by a kind of software named Hyperlynx, and a 6-layer PCB model was built and used. Our Research was focused on the EMC problems existed in hierarchy and layer medium. On the basis of the simulation results, and combined with previous experience in the PCB design, some effective measures for improvi

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Ibrahim, Zuwairie, Ismail Ibrahim, Kamal Khalil, et al. "Noise Elimination for Image Subtraction in Printed Circuit Board Defect Detection Algorithm." INTERNATIONAL JOURNAL OF COMPUTERS & TECHNOLOGY 10, no. 2 (2013): 1317–29. http://dx.doi.org/10.24297/ijct.v10i2.7000.

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Image subtraction operation has been frequently used for automated visual inspection of printed circuit board (PCB) defects. Even though the image subtraction operation able to detect all defects occurred on PCB, some unwanted noise could be detected as well. Hence, before the image subtraction operation can be applied to real images of PCB, image registration operation should be done to align a defective PCB image against a template PCB image. This study shows how the image registration operation is incorporated with a thresholding algorithm to eliminate unwanted noise. The results show that

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Wardani, Gatut Ari, Rokiy Alfanaar, and Sri Juari Santosa. "Pelarutan Selektif Tembaga dari Limbah Printed Circuit Board dengan Hidrogen Peroksida." ALCHEMY Jurnal Penelitian Kimia 14, no. 1 (2018): 51. http://dx.doi.org/10.20961/alchemy.14.1.11168.51-59.

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<p>Pelarutan selektif tembaga dari limbah <em>printed circuit board</em> (PCB) telah berhasil dilakukan. Logam tembaga yang terkandung di dalam papan PCB dapat dipisahkan menggunakan campuran hidrogen peroksida dan asam sulfat dengan variasi perbandingan volume 0 : 1, 1 : 1, 2 : 1, 3 : 1, 4 : 1, dan 5 : 1. Pemisahan optimal dilakukan dengan sistem perendaman selama 3 hari dengan campuran H<sub>2</sub>O<sub>2</sub>/H<sub>2</sub>SO<sub>4</sub> = 3 : 1 (v/v). Jumlah tembaga yang terkandung di dalam papan PCB dianalisis menggunakan

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Yunardi, Riky Tri, Moh Zakky Zulfiar, Rr Wanda Auruma Putri, and Deny Arifianto. "Design and Implementation of Solder Paste Dispenser Based on Linear Drive System." JEEE-U (Journal of Electrical and Electronic Engineering-UMSIDA) 3, no. 2 (2019): 338. http://dx.doi.org/10.21070/jeee-u.v3i2.2637.

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In the technology to create prototypes for electronic hardware is usually constructed using surface mount device printed circuit board (SMD PCB). In this paper introduces the design and implementation of low-cost electrical solder paste dispenser that supports the PCB solder process. The design consists of a nozzle and linear drive systems based on stepper motors operating with electric power to push the plunger down to drop the solder paste on the board. To test the performance of solder paste that has been designed verified by experiment. Solder paste dispenser design was tested using SMD re

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Pan, Pengfei, Yi Han, Hexin Lv, Guoyong Dai, and Zhiyong Jin. "MGPM Methods for Rectangular Single-Size Printed Circuit Board Orthogonal Packing Problems." Mathematical Problems in Engineering 2022 (October 12, 2022): 1–17. http://dx.doi.org/10.1155/2022/2224820.

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Printed circuit board (PCB) orthogonal packing problems derive from the massive circuit board production process in the electronic industry. In the early stage, it mainly relied on human experiences to make decisions on how to make the most of each sheet while meeting customers’ orders. Up till now, researchers in enterprises and academic circles are still trying to explore effective mathematical models and feasible optimization methods. In most cases, what PCB companies generally face is the orthogonal layout decision, which considers positioning each rectangle PCB piece (PCB-P) on a rectangl

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Babij, Michał, Piotr Bielówka, Szymon Gburek, and Karol Malecha. "A Segmental 2D Readout Board Manufactured in Printed Circuit Board Technology for Gas Electron Multiplier Detectors." Sensors 23, no. 19 (2023): 8095. http://dx.doi.org/10.3390/s23198095.

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The Gas Electron Multiplier (GEM) was introduced by Fabio Sauli in 1997. This technology is broadly used in current and planned High-Energy Physics (HEP) experiments. One of the key components of these detectors is a readout board, which collects charges amplified by GEM foils and transfers them to readout electronics. The commonly used Cartesian XY readout boards are manufactured from the same type of polyamide film used to produce the GEM foils. The manufacturing process utilizes a deep polyimide etching, similar to the Micro Chemical Vias (MCV) etching process, which is protected by patent.

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Zheng, Xiao Hu, Z. Q. Liu, Qing Long An, Ming Chen, and Cheng Yong Wang. "Experimental Research on the High Speed Drilling of PCB Using Microdrill." Advanced Materials Research 426 (January 2012): 223–26. http://dx.doi.org/10.4028/www.scientific.net/amr.426.223.

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Printed circuit board (PCB) composed of glass fiber reinforcement plastic and copper foil is a kind of typical composite material. The cutting process of fiber reinforcement plastic materials such as carbon fiber or glass fiber reinforcement plastic materials have been studied for many years, but the drilling process of printed circuit board using microdrill is more complicated than common carbon fiber reinforcement plastic materials. It is event that the cutting force changed when drill different material. The variation of drilling force may cause some problems such as drill break, board dela

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Psota, Boleslav, Alexandr Otáhal, and Ivan Szendiuch. "Influence of the cavities on the PCB mechanical properties." Circuit World 41, no. 2 (2015): 76–79. http://dx.doi.org/10.1108/cw-10-2014-0048.

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Purpose – The main aim of this paper is to investigate the influence of the cavity coverage on the printed circuit boards (PCB) to the resonant frequency, acceleration and displacement. Design/methodology/approach – Tests were realized on four PCBs with different cavity areas. Frequency range of tests was between 10 and 2,000 Hz with 0.3 g acceleration amplitude. In addition, more simulations were performed to check different setups of the boards. Findings – From the calculated and measured data, it is clear that with the larger cavity area the resonance frequency drops. In case a greater numb

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Huang, Li Xin, Cheng Yong Wang, L. P. Yang, L. J. Zheng, and Yue Xian Song. "Cutting Forces of PCB Supported Hole." Advanced Materials Research 188 (March 2011): 435–40. http://dx.doi.org/10.4028/www.scientific.net/amr.188.435.

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A printed circuit board or PCB consists of conducting layers typically made of thin copper foil and insulating layers laminated together. Holes through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide. This paper focuses on cutting forces of drilling PCB. The influences of cutting speeds, feed rate and drill diameter on thrust force are investigated. Finally the drilling force experimental formula’s mathematical model is derived.

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Nassajfar, Mohammad Naji, Ivan Deviatkin, Ville Leminen, and Mika Horttanainen. "Alternative Materials for Printed Circuit Board Production: An Environmental Perspective." Sustainability 13, no. 21 (2021): 12126. http://dx.doi.org/10.3390/su132112126.

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This article investigates the potential environmental impacts of four-layer printed circuit board (PCB) production from cradle to grave. The study starts with a lifecycle assessment of conventional PCB production. Then, the alternative materials of polyethylene terephthalate (PET), polylactic acid (PLA)/glass fiber composite and paper are investigated for the substrate. A conventional PCB adopts copper as the conductive material and requires an etching process. The environmental impacts of changing the conductive deposition method to an additive method by printing silver nanoparticles is studi

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Kustija, Jaja, Diki Fahrizal, Muhamad Nasir, Andi Adriansyah, and Muhammad Husni Muttaqin. "Object detection in printed circuit board quality control: comparing algorithms faster region-based convolutional neural networks and YOLOv8." International Journal of Electrical and Computer Engineering (IJECE) 15, no. 3 (2025): 2796. https://doi.org/10.11591/ijece.v15i3.pp2796-2808.

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Along with the development of electronic technology, the integration of numerous components on printed circuit board (PCB) boards has resulted in increasingly complex and intricate layouts. Small defects in traces can lead to failures in electronic functions, making the inspection of PCB surface layouts a critical process in quality control. Given the limitations of manual inspection, which struggles to detect such defects due to their size and complexity, there is a growing need for a PCB inspection system that utilizes automated optical inspection (AOI) based on deep learning detection. This

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Łyczek, Mateusz, and Wojciech Skarka. "Review of Methods for PCB Panel Depanelization and Methods for Correct Assembly of Electronic Components on PCB Panels." Electronics 13, no. 7 (2024): 1255. http://dx.doi.org/10.3390/electronics13071255.

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Currently, processes related to PCBs (printed circle board), such as depanelization and checking the correct functioning of the boards, are carried out in separate devices. The purpose of this article is to review the literature and analyze trends related to these aspects of PCB panel manufacturing. The purpose of this analysis is to indicate the currently used depanelization methods and methods for checking the correctness of the assembly of electronic circuits on PCB panels. The publications were found in such knowledge bases as Scopus, IEEE Xplore or Emerald insight. In the following articl

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Chung, Soonwan, and Jae B. Kwak. "Realistic warpage evaluation of printed board assembly during reflow process." Soldering & Surface Mount Technology 27, no. 4 (2015): 137–45. http://dx.doi.org/10.1108/ssmt-12-2014-0023.

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Purpose – This paper aims to develop an estimation tool for warpage behavior of slim printed circuit board (PCB) array while soldering with electronic components by using finite element method. One of the essential requirements for handheld devices, such as smart phone, digital camera, and Note-PC, is the slim design to satisfy the customers’ desires. Accordingly, the printed circuit board (PCB) should be also thinner for a slim appearance, which would result in decreasing the PCB’s bending stiffness. This means that PCB deforms severely during the reflow (soldering) process where the peak tem

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Sharma, M. Dinesh, Kowshick K, Mokesh Prabhu S, Nitin Kumar S, and Pandiya Raj C. "PRINTED CIRCUIT BOARD DEFECT DETECTION USING MACHINE LEARNING." International Journal of Technical Research & Science 9, Spl (2024): 27–35. http://dx.doi.org/10.30780/specialissue-iset-2024/040.

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As technology advances, printed circuit boards (PCBs) add more components and change their layout. One of the most important quality control procedures is PCB surface inspection, as small defects in signal traces can cause major damage to the system. Due to the disadvantages of manual scanning, great efforts have been made to automate scanning using high-resolution CCD or CMOS sensors. In traditional machine vision approaches, it is always difficult to determine pass/fail criteria based on small failure examples. the development of improved sensor technology. To solve this problem, we propose

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Wileman, Andrew, Suresh Perinpanayagam, and Sohaib Aslam. "Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level." Applied Sciences 11, no. 6 (2021): 2679. http://dx.doi.org/10.3390/app11062679.

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This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows, for instance, the prediction of solder fatigue failure due to thermal, mechanical, and manufacturing conditions. The technique allows a life-cycle prognosis of the PCB, taking into account the environmental stresses it will encounter during the pe

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