Relevant bibliographies by topics / PCB design

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'PCB design'

Author: Grafiati
Published: 4 June 2021
Last updated: 25 April 2022

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Journal articles on the topic "PCB design"

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Thane, Phil. "PCB design for beginners." Electronics Education 2001, no. 1 (2001): 7–10. http://dx.doi.org/10.1049/ee.2001.0007.

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Ward Partners Computer Systems. "PCB design on PC." Computer-Aided Design 17, no. 4 (May 1985): 206. http://dx.doi.org/10.1016/0010-4485(85)90240-4.

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Clarkson, Steve. "Design Tools—PCB Design & Make." Electronics Education 2000, no. 2 (2000): 5. http://dx.doi.org/10.1049/ee.2000.0032.

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Kloeser, J., and W. Scheel. "PCB‐design follows IC‐packaging." Circuit World 26, no. 3 (September 2000): 6–10. http://dx.doi.org/10.1108/03056120010322834.

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Krishna Rao, D. A. V. "PCB Design and Process Techniques." IETE Journal of Education 28, no. 1 (January 1987): 10–21. http://dx.doi.org/10.1080/09747338.1987.11436133.

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Winslow, T. A. "Component modeling for PCB design." IEEE Microwave Magazine 1, no. 1 (March 2000): 61–63. http://dx.doi.org/10.1109/6668.823829.

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Goyal, R. "Managing signal integrity [PCB design]." IEEE Spectrum 31, no. 3 (March 1994): 54–58. http://dx.doi.org/10.1109/6.265411.

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Sukadana, I. Wayan, and I. Made Pande Darma Yuda. "Prototyping PCB Menggunakan Computer-Aided Design." TIERS Information Technology Journal 2, no. 2 (December 29, 2021): 37–43. http://dx.doi.org/10.38043/tiers.v2i2.3310.

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Perkembangan Teknologi yang semakin meningkat dan berkembang dapat memudahkan orang-orang yang kreatif dalam merancang system dan elektronik. Pada elektronik terdapat komponen yang sangat penting untuk menunjang komponen dan memberikan jalur penghubung antar komponen yaitu papan PCB. Sebelum adanya technology CAD untuk membuat PCB para pengembang technology Smart System/Internet of Things masih membuat PCB dengan cara manual namun seiring berjalannya waktu dan dengan berkembangnya teknologi sekarang membuat PCB sudah mudah dengan adanya Computer-Aided Design (CAD). Teknik awal seorang pengembang IoT/Smart System membuat PCB yaitu masih dengan cara membuat tata letak komponen dan menyesuaikan skala dengan komponennya setelah itu baru proses menggambar jalur menggunakan spidol permanen yang dibuat sedemikian rupa dengan apa yang telah digambarkan terlebih dahulu baru dilakukannya proses eatching. Setelah adanya technology CAD terdapat banyak perubahan disetiap tahap pembuatannya jadi tidak perlu menggambar tata letak komponen dan menyesuaikan sklanya dengan CAD itu semua sudah otomatis di tentukan. Pada pembuatan PCB dengan CAD bisa menampilkan bagian silk atau gambar bagian depan sehingga bagian silk tersebut bisa ditempel ke bagian atas PCB untuk memudahkan menentukan tempat komponennya. Proses pembuatannya juga lebih efisien dan lebih teratur dengan menggunakan CAD dari pada membuat secara manual sehingga dengan adanya Computer-Aided Design (CAD) sangat membantu dalam proses pembuatan desain PCB.
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M. Africa, Aaron Don. "PCB/Microstrip Antenna Design and Simulation." International Journal of Emerging Trends in Engineering Research 7, no. 8 (August 25, 2019): 157–62. http://dx.doi.org/10.30534/ijeter/2019/09782019.

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Thane, Phil. "PCB design for beginners. Part II." Electronics Education 2001, no. 2 (2001): 11–14. http://dx.doi.org/10.1049/ee.2001.0028.

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Dissertations / Theses on the topic "PCB design"

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Lunde, Vegard. "Design av PCB antenne for 433 MHz." Thesis, Norwegian University of Science and Technology, Department of Electronics and Telecommunications, 2008. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-10486.

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I denne oppgaven studerte man design av integrert antenne for 433 MHz. Det ble valgt å designe en invertert-F-antenne for bruk i røykvarsler produsert av ICAS AS. Invertert-F-antenne har den fordelen over monopolen at den tar mindre plass, og den er lettere å tilpasse til 50 ohm enn invertert-L-antenne. Man konsentrerte seg om fire hovedparametere ved tilpassinga av antenna; dimensjonene $h$, $d$, $w$, $l$. Man fant at høyden mellom jordplanet og antenneelementet, $h$, er en vanskelig parameter å bruke til tilpassning og bør bestemmes først. En økning i bredden på antenneelementet, $w$, gir bedring i refleksjonstap og båndbredde, opp til en gitt bredde, før det stabiliserte seg og $w$ bare endret på resonansfrekvensen. De to viktigste tilpassningsparametrene var lengden på antenneelementet, $l$, og avstanden mellom jord- og matebeinet $d$. Begge hadde innvirkning på resonansfrekvens og impedans, men $d$ hadde størst betydning for endring av reaktans, mens $l$ var mest utslagsgivende for resonansfrekvensen. $d$ ble derfor brukt til å tilpasse reaktansen og $l$ til å justere resonansfrekvensen. Siden begge parametrene virket inn på både resonansfrekvens og impedans, måtte man kompensere med den ene dimensjonen ved endring av den andre dimensjonen. Størrelsen på jordplanet er en veldig kritisk faktor ved utvikling av integrerte antenner. Da størrelsen på jordplanet minket, ble antenna mer kapasitiv. En fant at bredden på jordplanet, det vil si lengden på jordplanet som lå parallelt med antenna, var mer kritisk enn høyden. Det viste seg å være en øvre grense i jordplanstørrelsen der impedansen sluttet å endre seg. Hovedproblemet med det lille jordplanet i antennedesignet, var at den høye kapasitansen som oppstod måtte utliknes ved hjelp av en tilsvarende sterk induktans på antenna. Hvis man vurderer vanlig filterteori ser man at store reaktansverdier gir lavere båndbredde. Den største utfordringen i dette arbeidet var å måle på antennene fordi røykvarsleren som antenna ble konstruert for, hadde et elektrisk lite jordplan. For at en monopolantenne skal fungere optimalt må den reflekteres i et uendelig stort jordplan, slik at det ser ut som en dipol i fjernfeltet. Siden jordplanet var lite, ble antenna usymmetrisk og man fikk sterke strømmer i jordplanet. Da ANA ble koblet til for å måle på antenna, fant disse strømmene veien inn i jordkappa på coax-kabelen. Problemet som da oppstod var at antenna så et mye større jordplan, bestående av antennas jordplan, coax-kabelen og ANA. For å blokkere strømmen i jordkappa, og dermed isolere jordplanet for seg selv, prøvde man å koble både feritter og bazookabalun på coax-kabelen. Ferittene viste seg å ha svært liten innvirkning. Ved å legga hånda på coax-kabelen ville man gi utslag på $s_{11}$-målinger hvis det gikk strøm i jordkappa. Det ble store utslag ved målinger med og uten feritter, mens ved bruk av balun var det nært ingen utslag. Målingene med balun ga et akseptabelt avvik fra simuleringene. Bruk av feritter er bare å anbefale på elektrisk store antenner. Da gir kabelen refleksjoner og spredeeffekter som kan hindres ved å koble flere feritter langs kabelen. På antenner med små jordplan er det ikke like enkelt. Da får man en strøm på jordkappa som resultat av lite jordplan. Denne strømmen kan reflekteres ved hjelp av feritter, men det ble funnet at de også vil absorbere en del av energien. Anbefalingen falt derfor på bazookabalun. Balunen vil reflektere all strømmen i jordkappa uten å absorbere. Dimensjonene på balunen er ikke viktig, bortsett fra lengden på røret, som bestemmer senterfrekvensen. Båndbredden til det endelige utkastet ble målt til 6 MHz i fem forskjellige tilstander. Resonansfrekvensen endret seg fra 429 MHz på betong til 433 MHz på treverk. Festet på betong var båndet til røykvarsleren utenfor ETSI-båndet, 433,05 MHz - 434,79 MHz. En økning i resonansfrekvensen med 3 MHz hadde plassert antenna rundt ETSI-båndet for alle tilstander antenna ble målt i. Balunen hadde en båndbredde som lå under resonansfrekvensen til antenna alene, men dekket resonansfrekvens for antenne montert i røykvarsler. Det ble derfor ikke gjort målinger ved resonansfrekvens på antenna, men ved 435 MHz, som lå i balunens bånd. De simulerte strålingsdiagrammene for 433 MHz og antennas simulerte resonansfrekvens, 473 MHz, var svært like så man antok at målinger på 435 MHz ville gi en bedre tilnærming til antennas strålingsdiagram ved resonansfrekvens enn målinger gjort ved resonansfrekvensen uten balun. Den målte strålingen likner lite på simuleringene, men det har i den store sammenhengen lite å si for den endelige løsningen. Strålingen viste seg å være svært avhengig av hva som befant seg innenfor nærfeltet til antenna. Røykvarslerens utforming, samt vegger og tak røykvarsleren festes til, er derfor avgjørende faktorer for røykvarslerens endelige strålingsdiagram. For å være sikker på at båndbredden er god nok, og at rekkevidde og direktivitet er akseptabel, må røykvarsleren ferdigstilles med radiobrikke og måles alene.

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Machuca, Julían, and Thomas Tuvesson. "PCB design of Power Distributor Unit (PDU)." Thesis, Uppsala universitet, Institutionen för elektroteknik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-415474.

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The project idea was created from the demand of a renewal for a Power Distributor Unit also known as a PDU. The current product had successively turned in to a cable mess because of short term solutions. This made the product non user friendly, inconvenient and non-agile to handle troubleshooting. To develop this project, a PCB design was created by simplifying and improving circuit diagrams until satisfied. Once the final circuit diagram was obtained, a PCB layout design was created. The result of the project, due to limited time, was only theoretical. The finished product was not tested as there was no time allowing this.
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Tirmizi, Syed Muhammad Asad, and Amalachukwu Okeke. "On-PCB Inverted-F Antenna Design For Wireless Sensor NodesOn-PCB Inverted-F Antenna Design For Wireless Sensor Nodes." Thesis, Högskolan i Halmstad, Akademin för informationsteknologi, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-42424.

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The Internet of things (IoT) is a disruptive innovation which has shown the potential to change the way we live our lives. At the core of the IoT eco systems are the wireless sensor nodes. These are responsible for the sensing of the target environment parameters or situations and communication of such to the desired destinations. For this communication to happen, a good performing antenna is required. This project explores the design of an on-PCB inverted-F antenna for a wireless sensor node. The Literature review and insight into wireless sensor nodes and antenna design are conducted. The designed antenna is stimulated using ADS simulation software and the performance analysis presented. Design description of a wireless sensor node is also made, which includesthe high frequency PCB layout design for the sensor node. The antenna and PCB are both fabricated in the lab, while various antenna performance measurements and evaluation are done. The designed antenna showed good S11 parameter of -43dB on simulation and -20dB when fabricated.
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Mabe, Nuala Anne. "Information system design for PCB registration process control." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.
Includes bibliographical references.
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Shripal, Darshil, and Leza Hlele. "Design six layers of PCB VIA for 2.4 and 5GHz." Thesis, Högskolan i Halmstad, Akademin för informationsteknologi, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-40848.

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Printed circuit boards are getting increasingly more complicated, as the electronics industry seeks methods to stay leading in modern technology. The competition to attain more economical solutions in terms of increasing complexity, integrity, optimum functionality, impose on design engineers to look for new horizons of solutions, then simulating and testing them theoretically and practically, before putting them into the labor market. In multi-layer boards, the issue of maintaining signal quality while transmitting it between different layers arises, it is a big deal, especially when dealing with RF signals, where each component through which the signal passes must be handled and designed with extreme accuracy to be received at output with a maximum matching with the input signal.  Vertical Interconnect Access (VIA) is the purpose of this thesis. The effect of geometrical shape and the dimensions such as pad, hole and clearance on the impedance due to parasitic capacitance and inductance, consequently on the reflection and attenuation of the passing RF signal passing through was investigated. Besides, a minimized reflection and attenuation was the aim of this project when signals with the frequencies of 2.4 and 5 GHz would pass through the VIA.
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Menezes, Gary. "Modeling, design, fabrication and characterization of glass package-to-PCB interconnections." Thesis, Georgia Institute of Technology, 2013. http://hdl.handle.net/1853/51781.

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Emerging I/O density and bandwidth requirements are driving packages to low-CTE silicon, glass and organic substrates for higher wiring density and reliability of interconnections and Cu-low k dielectrics. These are needed for high performance applications as 2.5D packages in large-size, and also as ultra-thin packages for consumer applications that are directly assembled on the board without the need for an intermediate package. The trend to low-CTE packages (CTE of 3-8ppm/°C), however, creates large CTE mismatch with the board on which they are assembled. Interconnection reliability is, therefore, a major concern when low CTE interposers are surface mounted onto organic system boards via solder joints. This reliability concern is further aggravated with large package sizes and finer pitch. For wide acceptance of low CTE packages in high volume production, it is also critical to assemble them on board using standard Surface Mount Technologies (SMT) without the need for under-fill. This research aims to demonstrate reliable 400 micron pitch solder interconnections from low CTE glass interposers directly assembled onto organic boards by overcoming the above challenges using two approaches; 1) Stress-relief dielectric build up layers on the back of the interposer, 2) Polymer collar around the solder bumps for shear stress re-distribution. A comprehensive methodology based on modeling, design, test vehicle fabrication and characterization is employed to study and demonstrate the efficacy of these approaches in meeting the interposer-to-board interconnection requirements. The effect of varying geometrical and material properties of both build-up layers and polymer collar is studied through Finite Element Modeling. Interposers were designed and fabricated with the proposed approaches to demonstrate process feasibility.
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Koteich, Mohammad Ali. "Image Processing Module for Autonomous Vehicles : Advanced PCB design, fabrication, and assembly." Thesis, Norges teknisk-naturvitenskapelige universitet, Institutt for teknisk kybernetikk, 2012. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-19238.

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The aim of this project is to design a small profile, low-power, high performance printed circuit board (PCB) with support for high speed peripherals, while relying on the equipment and facilities of NTNU as much as possible. The intended usage of this module is in image processing applications for autonomous vehicles. The accomplishment of this goal encompasses gaining experience within proficient usage of computer aided design (CAD) tools, implementation of high speed design theory, fabrication of a multilayer PCB, and assembly of advanced components with small footprints and high pin densities, such as ball grid arrays (BGA) and quad flat no leads (QFN) packages. In addition, validation of functionality and testing is also a part of the process.There are several reasons for why such a project is important, and the benefits of carrying out such a project can be leveraged in several areas. First of all, it is desirable to get an overview of the production limitations at the NTNU campus. Where does the limit go for how advanced designs we can produce? What is not possible to do at the NTNU campus? How far can we push our capabilities? Then there is the desire of setting precedence within advanced PCB design and production, in order to build competence at the University that the students and researchers can benefit from in the future. All for the purpose of increasing the quality of their education. Furthermore, low power image processing capabilities with support for high speed peripherals are highly desirable in autonomous vehicles and increase the potential for future research.In order to achieve the goals set for this project, one needs to gain an understanding of what the various components require in terms of design and assembly, and an overview needs to be worked out in order to see how much of these requirements can be met at campus. The process started at finding the correct CAD tool. An attempt was made at using the OrCAD package which The Department of Cybernetics had licenses for. It was discovered that the OrCAD licenses we were in possession of were not suited for the requirements of high-speed bus design. Therefore, an Altium Designer license was borrowed from The Department of Electronics and Telecommunication (IET). Extensive research was done to acquire knowledge about high-speed bus design, which resulted in successful DDR2, Ethernet, and USB bus implementations. The finished design was given the name textit{KybMo}. The workshop at The Department of Engineering cybernetics is in possession of a milling machine for PCB fabrication. However, this machine can only accommodate fabrication of two layer boards, and not 8 layers, as the design required. Thus the fabrication of the board had to be outsourced to an external manufacturer. The department of Engineering Cybernetics recently acquired a re-flow oven that can accommodate assembly of surface mount components such as BGAs and QFNs, but the oven had never been used before, so no one possessed any experience on how to operate it. Gaining this experience was therefore important and the oven was used with successful results. Hand soldering of extremely small discrete components on the bottom side of the board was carried out, as well as successful testing of alternative methods such as using a heating plate and a heat gun with extremely low air pressure in order to avoid blowing the components away. Software packages including stand alone examples, and a Linux system configured for reference designs based on the same System on Chip (SoC) utilized by the KybMo, the OMAP-L138, were modified to fit the configuration of the KybMo and was used for validation of functionality. The project resulted in successful fabrication and assembly of a small, low-power, high performance 8 layer PCB, with over two hundred components. All of the high speed buses were validated and the system was successfully able to boot Linux. This proves that it is definitely possible to design and assemble systems of industrial complexity at the NTNU campus. However, the cost was more than expected. In order for student projects such as this one to be economically supported by the Department, an effort has to be made to push the limits of the design so that less than eight PCB layers are required. Otherwise, an attempt at acquiring external sponsorship is instrumental.
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Camilo, Edson 1959. "Propostas de design de layout da PCI para redução de curto circuito de solda a onda, para processo de montagem de placa eletrônica = PCB layout design techniques for shortcircuit (bridging) reduction due to wave soldering in electronic board assembly." [s.n.], 2015. http://repositorio.unicamp.br/jspui/handle/REPOSIP/260044.

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Orientador: Yuzo Iano
Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
Made available in DSpace on 2018-08-27T18:51:43Z (GMT). No. of bitstreams: 1 Camilo_Edson_M.pdf: 3518346 bytes, checksum: 0264cd60aaed512cef0dacda58a43540 (MD5) Previous issue date: 2015
Resumo: Este trabalho de Mestrado tem como objetivo contribuir para a área de placa de circuito impresso no que se refere ao projeto de layout focado não só em satisfazer as conexões das trilhas, mas nas regras de projeto com foco na redução de curto circuito de solda para o processo de solda por onda. Projetos de PCB (Printed Circuit Board) ou PCI (Placa de Circuito Impresso) envolvem uma série de conhecimentos no que se refere ao entendimento das funcionalidades dos circuitos e para tanto é importante que se faça o correto posicionamento dos componentes em grupos de circuitos pela funcionalidade; além disso, é importante que se conheça as regras de capacidade de corrente, de distâncias de isolação em função das tensões aplicadas, características de impedância, áreas de restrição mecânica entre outras. O que será visto neste trabalho está focado na aplicação de conceitos e considerações ligadas ao processo de montagem da placa eletrônica por solda a onda. Muitos dos defeitos que ocorrem num processo de montagem da PCB são atribuídos ao processo de montagem da PCB como, por exemplo, a temperatura da solda, o tempo de solda, quantidade de fluxo aplicado na placa, altura da onda de solda, etc. Recomendações sobre posicionamento de componentes PTH (Pin Through Hole) e SMD (Surface Mounting Devise) em relação ao sentido em que a PCB entra em direção à solda a onda, recursos de aplicação de serigrafia, tipos de laminados, de formato das ilhas de solda, adição de técnica de ladrão de solda e as recomendações da IPC (Association Connecting Electronics Industries) serão descritos neste trabalho. O correto entendimento dos defeitos que ocorrem durante o processo de montagem da PCB reflete na constante melhoria e aperfeiçoamento do projeto do layout da placa, que por sua vez resulta num processo de montagem de placa com menos ocorrência de defeitos de fabricação e consequentemente melhor qualidade do produto. Menos retrabalho nas PCBs significa menos custo de produção que reflete em maior lucro para as empresas. As propostas apresentadas neste trabalho são fruto de resultados práticos vivenciados na indústria e de pesquisa em literatura dos assuntos relacionados a defeitos em PCB e processos de solda por onda. O conjunto destas recomendações e seus resultados estão aqui descritos e ilustrados para servirem de referência aos futuros pesquisadores e leitores
Abstract: This work aims to contribute to the area of the printed circuit board in regard to layout design focused not only on satisfying the connections of the tracks but the design rules focused on reducing short- circuit solder for wave solder process . Projects PCB (Printed Circuit Board) involve a lot of knowledge when it comes to understanding the features of both circuit and is important to make the correct positioning of components into groups of circuits for feature addition is important to know the rules of current capacity, isolation distances depending on the applied voltage, impedance characteristics, areas of mechanical restrictions among others. What will be seen in this work is focused on application of concepts and considerations involved in the process of mounting the electronic board by solder wave. Many of the defects which occur in the process of assembling the PCB are assigned to the PCB assembly process such as the temperature of the solder, weld time , amount of flux applied to the board, solder wave height, etc. Recommendations on positioning components PTH( Pin Through Hole) and SMD( Surface Mounting Devise) relative to the direction in which the PCB goes toward the wave solder , screen printing application features , format type of solder lands , techniques of solder thief and the IPC ( Association Connecting Electronics Industries) recommendations will be described on this work . The correct understanding of the defects that occur during the assembly process of the PCB reflects on constant improvement and refinement of the board layout design, which in turn results in a process of mounting plate with fewer occurrences of defects in workmanship and consequently better quality product. Less rework means less PCBs in production cost which reflects in higher profits for companies. The proposals presented in this paper are the result of practical results experienced in industry and research literature on the subjects related to defects in PCB and wave solder processes. All these recommendations and their results are described and illustrated to better serve as reference for future researchers and readers
Mestrado
Telecomunicações e Telemática
Mestre em Engenharia Elétrica
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Retianza, Darian Verdy. "Design and Implementation of 4-Stroke Topology in Electric Drives." Thesis, KTH, Skolan för elektroteknik och datavetenskap (EECS), 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-232188.

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The 4-Stroke inverter topology is investigated and implemented in thisthesis as a method to damp the oscillation at the MOSFET drain-sourcevoltage when reverse recovery occurs. The aim is lower ElectromagneticInterference source level from the power inverter. The designprocess is coming from analyzing the appropriate inductor, making asimulation in LTSPICE and making a high-performance six-layer PCBfor the high current application. Finally, the prototype is tested in differentcontrol timing, radiated emission test and conducted emissiontest.
4-taktsomvandlarens topologi undersöks och implementeras i dennaavhandling som en metod för att dämpa oscillation när reverse recoverysker i slutstegets MOSFET. Syftet är att dämpa elektromagnetiskstörning från kraftomvandlaren. Designprocessen är att analyseralämplig induktans, göra en simulering i LTSPICE och designa ett högpresterande6-lager PCB för kraftiga strömmar. Slutligen testas prototypenmed olika kontrolltider, elektromagnetisk emission och elektromagnetiskkonduktion.
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Rashed, Lauk. "Design and construction of a portable wireless module." Thesis, Uppsala universitet, Institutionen för elektroteknik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-414417.

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In this thesis, a wireless module in form of a portable peripheral printed circuit board that can connect to a master device, periodically sending values from a sensor, has been developed to the company Biotage. A literature study has been made on antennas and PCB-design for high frequency applications and a prototype has been designed through CAD software. This thesis handles the design process behind the module which consists of choosing suitable components, measurements/matching of an antenna and design of a suitable rechargeable power supply module. The prototype resulted in a portable, fully wireless device with a long expected battery life with the help of Bluetooth Low Energy technology and low power usage components.
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Books on the topic "PCB design"

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Complete PCB design using OrCAD Capture and PCB editor. Amsterdam: Newnes, 2009.

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Sharma, Parshant. PCB Design for Absolute Beginners. Berkeley, CA: Apress, 2022. http://dx.doi.org/10.1007/978-1-4842-8040-9.

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Shukla, Vikas. Signal integrity for PCB designers. Attleboro, MA: Reference Designer Inc., 2009.

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Archambeault, Bruce R. PCB Design for Real-World EMI Control. Boston, MA: Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-3640-3.

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Archambeault, Bruce. PCB design for real-world EMI control. Boston: Kluwer Academic Publishers, 2002.

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Complete PCB design using OrCad capture and layout. Amsterdam: Elsevier/Newnes, 2007.

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Castellano, Robert N. Electronic design workstations: A user's strategic guide to optimizing IC and PCB design. Cupertino, CA: Electronic Trend Publications, 1986.

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Hossain, Akram. Computer-aided electronic circuit board design and fabrication: Using OrCAD/SDT and OrCAD/PCB software tools. Englewood Cliffs, N.J: Prentice Hall, 1996.

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PCR primer design. New York: Humana Press, 2015.

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Basu, Chhandak, ed. PCR Primer Design. New York, NY: Springer New York, 2015. http://dx.doi.org/10.1007/978-1-4939-2365-6.

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Book chapters on the topic "PCB design"

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Di Paolo Emilio, Maurizio. "Design PCB." In Microelectronics, 55–65. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_5.

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Timmis, Harold. "PCB Design." In Practical Arduino Engineering, 183–263. Berkeley, CA: Apress, 2021. http://dx.doi.org/10.1007/978-1-4842-6852-0_5.

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Zakai, Fatima Mohsin, Muhammad Faizan, and Muhammad Faisal Khan. "PCB Design and Fabrication." In Functional Reverse Engineering of Strategic and Non-Strategic Machine Tools, 79–95. First edition. | Boca Raton : CRC Press, 2021. |: CRC Press, 2021. http://dx.doi.org/10.1201/9780367808235-8.

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Harrold, Christopher. "Your First Good PCB." In Practical Smart Device Design and Construction, 397–426. Berkeley, CA: Apress, 2020. http://dx.doi.org/10.1007/978-1-4842-5614-5_12.

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Di Paolo Emilio, Maurizio. "Design PCB for Embedded System." In Embedded Systems Design for High-Speed Data Acquisition and Control, 119–29. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-06865-7_7.

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Archambeault, Bruce R. "Return Current Design." In PCB Design for Real-World EMI Control, 69–84. Boston, MA: Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-3640-3_5.

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Archambeault, Bruce R. "EMC Filter Design." In PCB Design for Real-World EMI Control, 151–70. Boston, MA: Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-3640-3_9.

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Tran, Thanh T. "Printed Circuit Board (PCB) Layout." In High-Speed DSP and Analog System Design, 187–94. Boston, MA: Springer US, 2010. http://dx.doi.org/10.1007/978-1-4419-6309-3_10.

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Ashton, Robert. "Hard Failures and PCB Protection Devices." In System Level ESD Co-Design, 129–68. Chichester, UK: John Wiley & Sons, Ltd, 2016. http://dx.doi.org/10.1002/9781118861899.ch5.

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Gossner, Harald, and Charvaka Duvvury. "PCB/IC Co-Design Concepts for SEED." In System Level ESD Co-Design, 74–128. Chichester, UK: John Wiley & Sons, Ltd, 2016. http://dx.doi.org/10.1002/9781118861899.ch4.

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Conference papers on the topic "PCB design"

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"PCB Spiral Winding Transformer Design." In The 5th International Conference on Advanced Computer Science Applications and Technologies. Clausius Scientific Press Inc., 2017. http://dx.doi.org/10.23977/acsat.2017.1017.

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Chung, Soonwan, Gyun Heo, Jae Kwak, Seunghee Oh, Yongwon Lee, Changsun Kang, and Tackmo Lee. "Development of PCB design guide and PCB deformation simulation tool for slim PCB quality and reliability." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575879.

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Sterman, Yoav, Erik D. Demaine, and Neri Oxman. "PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices." In ASME 2013 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/detc2013-12497.

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Abstract:
Origami is traditionally implemented in paper of homogeneous material properties. This research explores the use of material with embedded electronics such as PCB (Printed Circuit Boards) as the medium for origami folding in order to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as Light Emitting Diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB Origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process.
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Potts, H. "IC/FPGA package-PCB design collaboration." In 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design (VLSID'06). IEEE, 2006. http://dx.doi.org/10.1109/vlsid.2006.101.

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Tang, Tzu-Chiang, and Chian C. Ho. "EMI suppression for high-speed PCB." In 2009 International Waveform Diversity and Design Conference. IEEE, 2009. http://dx.doi.org/10.1109/wddc.2009.4800338.

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Usman, Mohammad A. U. "Characteristic impedance planning in PCB design." In SOUTHEASTCON 2014. IEEE, 2014. http://dx.doi.org/10.1109/secon.2014.6950703.

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Qin Yin, Bin Chen, Bo Yang, Zhixue Shao, and Bihua Zhou. "Analysis of crosstalk in PCB design." In 2008 8th International Symposium on Antennas, Propagation and EM Theory. IEEE, 2008. http://dx.doi.org/10.1109/isape.2008.4735408.

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Du Meizhu, Li Shufang, and Qiu Xiaofeng. "Via design in multi-layer PCB." In Proceedings. Asia-Pacific Conference on Environmental Electromagnetics. IEEE, 2003. http://dx.doi.org/10.1109/ceem.2003.238594.

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Muller, J., H. Griese, N. F. Nissen, H. Potter, and H. Reichl. "Environmental aspects of PCB microintegration." In Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing. IEEE, 1999. http://dx.doi.org/10.1109/ecodim.1999.747612.

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Ren, Yinglei, Maoxin Yin, Chunfei Ye, and Xiaoning Ye. "Application of hybrid PCB stackup." In 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). IEEE, 2017. http://dx.doi.org/10.1109/edaps.2017.8277046.

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Reports on the topic "PCB design"

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Roberson, G. P., H. E. Martz, D. C. Camp, D. J. Decman, and E. M. Johansson. Preliminary A{ampersand}PCT multiple detector design. Office of Scientific and Technical Information (OSTI), June 1997. http://dx.doi.org/10.2172/567997.

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Keto, E., S. Azevedo, and P. Roberson. Preliminary 2D design study for A&PCT. Office of Scientific and Technical Information (OSTI), March 1995. http://dx.doi.org/10.2172/108092.

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Lebak, J. M. Preliminary Design Review: PCA Integrated Radar-Tracker Application. Fort Belvoir, VA: Defense Technical Information Center, April 2002. http://dx.doi.org/10.21236/ada419901.

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Andrew Seltzer and Zhen Fan. Conceptual Design of Oxygen-Based PC Boiler. Office of Scientific and Technical Information (OSTI), September 2005. http://dx.doi.org/10.2172/861886.

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Spetka, Scott, George Ramseyer, Scot Tucker, Richard Linderman, Dennis Fitzgerald, and Yan Lok-Kwong. Net-Centric Pub/Sub Information Management Design for Command and Control. Fort Belvoir, VA: Defense Technical Information Center, June 2006. http://dx.doi.org/10.21236/ada463204.

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Zhen Fan and Andrew Seltzer. SYSTEM DESIGN AND ANALYSIS FOR CONCEPTUAL DESIGN OF OXYGEN-BASED PC BOILER. Office of Scientific and Technical Information (OSTI), November 2003. http://dx.doi.org/10.2172/825553.

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Andrew Seltzer, Zhen Fan, and Archie Robertson. Conceptual Design of Supercritical O2-Based PC Boiler. Office of Scientific and Technical Information (OSTI), September 2006. http://dx.doi.org/10.2172/914572.

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Reuther, A. I. Preliminary Design Review: GMTI Processing for the PCA Integrated Radar-Tracker Application. Fort Belvoir, VA: Defense Technical Information Center, February 2004. http://dx.doi.org/10.21236/ada419852.

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Coate, W. G. Preliminary Design Review: Kinematic Tracking for the PCA Integrated Radar-Tracker Application. Fort Belvoir, VA: Defense Technical Information Center, February 2004. http://dx.doi.org/10.21236/ada419855.

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Andrew Seltzer. Low NOx Burner Design and Analysis for Conceptual Design of Oxygen-Based PC Boiler. Office of Scientific and Technical Information (OSTI), May 2005. http://dx.doi.org/10.2172/861883.

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