Dissertations / Theses on the topic 'PCB design'
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Lunde, Vegard. "Design av PCB antenne for 433 MHz." Thesis, Norwegian University of Science and Technology, Department of Electronics and Telecommunications, 2008. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-10486.
Full textI denne oppgaven studerte man design av integrert antenne for 433 MHz. Det ble valgt å designe en invertert-F-antenne for bruk i røykvarsler produsert av ICAS AS. Invertert-F-antenne har den fordelen over monopolen at den tar mindre plass, og den er lettere å tilpasse til 50 ohm enn invertert-L-antenne. Man konsentrerte seg om fire hovedparametere ved tilpassinga av antenna; dimensjonene $h$, $d$, $w$, $l$. Man fant at høyden mellom jordplanet og antenneelementet, $h$, er en vanskelig parameter å bruke til tilpassning og bør bestemmes først. En økning i bredden på antenneelementet, $w$, gir bedring i refleksjonstap og båndbredde, opp til en gitt bredde, før det stabiliserte seg og $w$ bare endret på resonansfrekvensen. De to viktigste tilpassningsparametrene var lengden på antenneelementet, $l$, og avstanden mellom jord- og matebeinet $d$. Begge hadde innvirkning på resonansfrekvens og impedans, men $d$ hadde størst betydning for endring av reaktans, mens $l$ var mest utslagsgivende for resonansfrekvensen. $d$ ble derfor brukt til å tilpasse reaktansen og $l$ til å justere resonansfrekvensen. Siden begge parametrene virket inn på både resonansfrekvens og impedans, måtte man kompensere med den ene dimensjonen ved endring av den andre dimensjonen. Størrelsen på jordplanet er en veldig kritisk faktor ved utvikling av integrerte antenner. Da størrelsen på jordplanet minket, ble antenna mer kapasitiv. En fant at bredden på jordplanet, det vil si lengden på jordplanet som lå parallelt med antenna, var mer kritisk enn høyden. Det viste seg å være en øvre grense i jordplanstørrelsen der impedansen sluttet å endre seg. Hovedproblemet med det lille jordplanet i antennedesignet, var at den høye kapasitansen som oppstod måtte utliknes ved hjelp av en tilsvarende sterk induktans på antenna. Hvis man vurderer vanlig filterteori ser man at store reaktansverdier gir lavere båndbredde. Den største utfordringen i dette arbeidet var å måle på antennene fordi røykvarsleren som antenna ble konstruert for, hadde et elektrisk lite jordplan. For at en monopolantenne skal fungere optimalt må den reflekteres i et uendelig stort jordplan, slik at det ser ut som en dipol i fjernfeltet. Siden jordplanet var lite, ble antenna usymmetrisk og man fikk sterke strømmer i jordplanet. Da ANA ble koblet til for å måle på antenna, fant disse strømmene veien inn i jordkappa på coax-kabelen. Problemet som da oppstod var at antenna så et mye større jordplan, bestående av antennas jordplan, coax-kabelen og ANA. For å blokkere strømmen i jordkappa, og dermed isolere jordplanet for seg selv, prøvde man å koble både feritter og bazookabalun på coax-kabelen. Ferittene viste seg å ha svært liten innvirkning. Ved å legga hånda på coax-kabelen ville man gi utslag på $s_{11}$-målinger hvis det gikk strøm i jordkappa. Det ble store utslag ved målinger med og uten feritter, mens ved bruk av balun var det nært ingen utslag. Målingene med balun ga et akseptabelt avvik fra simuleringene. Bruk av feritter er bare å anbefale på elektrisk store antenner. Da gir kabelen refleksjoner og spredeeffekter som kan hindres ved å koble flere feritter langs kabelen. På antenner med små jordplan er det ikke like enkelt. Da får man en strøm på jordkappa som resultat av lite jordplan. Denne strømmen kan reflekteres ved hjelp av feritter, men det ble funnet at de også vil absorbere en del av energien. Anbefalingen falt derfor på bazookabalun. Balunen vil reflektere all strømmen i jordkappa uten å absorbere. Dimensjonene på balunen er ikke viktig, bortsett fra lengden på røret, som bestemmer senterfrekvensen. Båndbredden til det endelige utkastet ble målt til 6 MHz i fem forskjellige tilstander. Resonansfrekvensen endret seg fra 429 MHz på betong til 433 MHz på treverk. Festet på betong var båndet til røykvarsleren utenfor ETSI-båndet, 433,05 MHz - 434,79 MHz. En økning i resonansfrekvensen med 3 MHz hadde plassert antenna rundt ETSI-båndet for alle tilstander antenna ble målt i. Balunen hadde en båndbredde som lå under resonansfrekvensen til antenna alene, men dekket resonansfrekvens for antenne montert i røykvarsler. Det ble derfor ikke gjort målinger ved resonansfrekvens på antenna, men ved 435 MHz, som lå i balunens bånd. De simulerte strålingsdiagrammene for 433 MHz og antennas simulerte resonansfrekvens, 473 MHz, var svært like så man antok at målinger på 435 MHz ville gi en bedre tilnærming til antennas strålingsdiagram ved resonansfrekvens enn målinger gjort ved resonansfrekvensen uten balun. Den målte strålingen likner lite på simuleringene, men det har i den store sammenhengen lite å si for den endelige løsningen. Strålingen viste seg å være svært avhengig av hva som befant seg innenfor nærfeltet til antenna. Røykvarslerens utforming, samt vegger og tak røykvarsleren festes til, er derfor avgjørende faktorer for røykvarslerens endelige strålingsdiagram. For å være sikker på at båndbredden er god nok, og at rekkevidde og direktivitet er akseptabel, må røykvarsleren ferdigstilles med radiobrikke og måles alene.
Machuca, Julían, and Thomas Tuvesson. "PCB design of Power Distributor Unit (PDU)." Thesis, Uppsala universitet, Institutionen för elektroteknik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-415474.
Full textTirmizi, Syed Muhammad Asad, and Amalachukwu Okeke. "On-PCB Inverted-F Antenna Design For Wireless Sensor NodesOn-PCB Inverted-F Antenna Design For Wireless Sensor Nodes." Thesis, Högskolan i Halmstad, Akademin för informationsteknologi, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-42424.
Full textMabe, Nuala Anne. "Information system design for PCB registration process control." Diss., Online access via UMI:, 2007.
Find full textIncludes bibliographical references.
Shripal, Darshil, and Leza Hlele. "Design six layers of PCB VIA for 2.4 and 5GHz." Thesis, Högskolan i Halmstad, Akademin för informationsteknologi, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-40848.
Full textMenezes, Gary. "Modeling, design, fabrication and characterization of glass package-to-PCB interconnections." Thesis, Georgia Institute of Technology, 2013. http://hdl.handle.net/1853/51781.
Full textKoteich, Mohammad Ali. "Image Processing Module for Autonomous Vehicles : Advanced PCB design, fabrication, and assembly." Thesis, Norges teknisk-naturvitenskapelige universitet, Institutt for teknisk kybernetikk, 2012. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-19238.
Full textCamilo, Edson 1959. "Propostas de design de layout da PCI para redução de curto circuito de solda a onda, para processo de montagem de placa eletrônica = PCB layout design techniques for shortcircuit (bridging) reduction due to wave soldering in electronic board assembly." [s.n.], 2015. http://repositorio.unicamp.br/jspui/handle/REPOSIP/260044.
Full textDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
Made available in DSpace on 2018-08-27T18:51:43Z (GMT). No. of bitstreams: 1 Camilo_Edson_M.pdf: 3518346 bytes, checksum: 0264cd60aaed512cef0dacda58a43540 (MD5) Previous issue date: 2015
Resumo: Este trabalho de Mestrado tem como objetivo contribuir para a área de placa de circuito impresso no que se refere ao projeto de layout focado não só em satisfazer as conexões das trilhas, mas nas regras de projeto com foco na redução de curto circuito de solda para o processo de solda por onda. Projetos de PCB (Printed Circuit Board) ou PCI (Placa de Circuito Impresso) envolvem uma série de conhecimentos no que se refere ao entendimento das funcionalidades dos circuitos e para tanto é importante que se faça o correto posicionamento dos componentes em grupos de circuitos pela funcionalidade; além disso, é importante que se conheça as regras de capacidade de corrente, de distâncias de isolação em função das tensões aplicadas, características de impedância, áreas de restrição mecânica entre outras. O que será visto neste trabalho está focado na aplicação de conceitos e considerações ligadas ao processo de montagem da placa eletrônica por solda a onda. Muitos dos defeitos que ocorrem num processo de montagem da PCB são atribuídos ao processo de montagem da PCB como, por exemplo, a temperatura da solda, o tempo de solda, quantidade de fluxo aplicado na placa, altura da onda de solda, etc. Recomendações sobre posicionamento de componentes PTH (Pin Through Hole) e SMD (Surface Mounting Devise) em relação ao sentido em que a PCB entra em direção à solda a onda, recursos de aplicação de serigrafia, tipos de laminados, de formato das ilhas de solda, adição de técnica de ladrão de solda e as recomendações da IPC (Association Connecting Electronics Industries) serão descritos neste trabalho. O correto entendimento dos defeitos que ocorrem durante o processo de montagem da PCB reflete na constante melhoria e aperfeiçoamento do projeto do layout da placa, que por sua vez resulta num processo de montagem de placa com menos ocorrência de defeitos de fabricação e consequentemente melhor qualidade do produto. Menos retrabalho nas PCBs significa menos custo de produção que reflete em maior lucro para as empresas. As propostas apresentadas neste trabalho são fruto de resultados práticos vivenciados na indústria e de pesquisa em literatura dos assuntos relacionados a defeitos em PCB e processos de solda por onda. O conjunto destas recomendações e seus resultados estão aqui descritos e ilustrados para servirem de referência aos futuros pesquisadores e leitores
Abstract: This work aims to contribute to the area of the printed circuit board in regard to layout design focused not only on satisfying the connections of the tracks but the design rules focused on reducing short- circuit solder for wave solder process . Projects PCB (Printed Circuit Board) involve a lot of knowledge when it comes to understanding the features of both circuit and is important to make the correct positioning of components into groups of circuits for feature addition is important to know the rules of current capacity, isolation distances depending on the applied voltage, impedance characteristics, areas of mechanical restrictions among others. What will be seen in this work is focused on application of concepts and considerations involved in the process of mounting the electronic board by solder wave. Many of the defects which occur in the process of assembling the PCB are assigned to the PCB assembly process such as the temperature of the solder, weld time , amount of flux applied to the board, solder wave height, etc. Recommendations on positioning components PTH( Pin Through Hole) and SMD( Surface Mounting Devise) relative to the direction in which the PCB goes toward the wave solder , screen printing application features , format type of solder lands , techniques of solder thief and the IPC ( Association Connecting Electronics Industries) recommendations will be described on this work . The correct understanding of the defects that occur during the assembly process of the PCB reflects on constant improvement and refinement of the board layout design, which in turn results in a process of mounting plate with fewer occurrences of defects in workmanship and consequently better quality product. Less rework means less PCBs in production cost which reflects in higher profits for companies. The proposals presented in this paper are the result of practical results experienced in industry and research literature on the subjects related to defects in PCB and wave solder processes. All these recommendations and their results are described and illustrated to better serve as reference for future researchers and readers
Mestrado
Telecomunicações e Telemática
Mestre em Engenharia Elétrica
Retianza, Darian Verdy. "Design and Implementation of 4-Stroke Topology in Electric Drives." Thesis, KTH, Skolan för elektroteknik och datavetenskap (EECS), 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-232188.
Full text4-taktsomvandlarens topologi undersöks och implementeras i dennaavhandling som en metod för att dämpa oscillation när reverse recoverysker i slutstegets MOSFET. Syftet är att dämpa elektromagnetiskstörning från kraftomvandlaren. Designprocessen är att analyseralämplig induktans, göra en simulering i LTSPICE och designa ett högpresterande6-lager PCB för kraftiga strömmar. Slutligen testas prototypenmed olika kontrolltider, elektromagnetisk emission och elektromagnetiskkonduktion.
Rashed, Lauk. "Design and construction of a portable wireless module." Thesis, Uppsala universitet, Institutionen för elektroteknik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-414417.
Full textWilcox, Adam C. "ECAD to MCAD Interoperability for Automated Enclosure Design." Diss., CLICK HERE for online access, 2008. http://contentdm.lib.byu.edu/ETD/image/etd2690.pdf.
Full textLindberg, Anton, and Mikael Strid. "Dopplersensor för rörelsedetektering." Thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-177533.
Full textWithin environments with high demands on security like nuclear power plants there is a high demand on a cheap and reliable system for detection of unauthorized individuals of intrusion. This report describes the work on the development of a motion detection system using the doppler effect. The ultimate goal of this work is to design a programmable circuit that works with signals from the motion sensor HB100, which without maintenance can cover large areas. The work has been limited to electronic design, filter design, EMC and programming of the complete circuit.
Aalto, Alve, and Ali Jafari. "Automatic Probing System for PCB : Analysis of an automatic probing system for design verification of printed circuit boards." Thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-174865.
Full textMålet med detta examensarbete är att göra en analys av huruvida Ericssons kretskort kan testas med hjälp av ett automatiskt probe system eller om det kräver stora förändringar i designdelen av kretskorten och om, vad för förändringar det i sådant fall kan vara. Till hjälp att analysera kretskorten har vi haft oscilloskop för att få ut rådata om skillnaderna mellan de teoretiska och verkliga signalerna. För att kunna tyda oscilloskopets samplade signaler har olika programmeringsspråk som Python, Matlab samt Excel använts. En extra via i signalens väg har även simulerats i HFSS och ADS med olika sorts probar för att se hur signalens beteende påverkas. Resultaten extraherades sedan in i olika Excel ark för att få en lätt överskådlig bild av resultaten. Resultatet vi fick visade att utformningen av ett kretskort med ändringarna skulle vara lättare att göra med en ny design istället för en redan existerande då större delar av kortet skulle behöva göras om. Vissa stora komponenter behöver antingen göras om, hitta mindre men likvärdiga eller sättas på ena sidan av kortet där de inte är i vägen för proben. Kretskorten som kommer använda flygande probesystem kommer antagligen bli lite större då viornas placering är mer begränsade än tidigare. Det mest tidskrävande arbetet var att simulera olika placeringar av en extra via i signalens väg. Detta visade att på en single ended signal under två gigahertz så gör det ingen större skillnad vart i signalens väg som den extra vian placeras. Då en högre frekvens används så är själva signalens karaktär det viktigaste än placeringen av en via, men om man inte vet den exakta karaktären så är fyra millimeter bort från mottagarens sida att rekommendera då närmare placering av viorna gör att signalerna börjar störa varandra.
Arnberg, Philip, and Petersson Oscar Barreira. "Design of a Maxwell Fish-Eye Lens in PCB Technology With a Glide-Symmetric Metasurface." Thesis, KTH, Skolan för elektroteknik och datavetenskap (EECS), 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-254263.
Full textFei, Chao. "Optimization of LLC Resonant Converters: State-trajectory Control and PCB based Magnetics." Diss., Virginia Tech, 2018. http://hdl.handle.net/10919/83206.
Full textPh. D.
Deng, Kai, and Minjie Ma. "THE STUDY AND IMPLEMENTATION OF MEANDER-LINE ANTENNA FOR AN INTEGRATED TRANSCEIVER DESIGN." Thesis, University of Gävle, University of Gävle, University of Gävle, University of Gävle, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-6444.
Full textThis thesis focuses on the design and evaluation of the meander-line antenna geometry. One standard meander-line antenna and other two non-standard meander antennas have been studied. These printed antennas are discussed with the goal of identifying which is suitable for use in a miniaturized wireless transceiver design and which is able to provide the better performance using minimal Printed Circuit Board (PCB) space. In a word, the main objective is to characterize tradeoffs and identify which antenna provides the best compromise among volume, bandwidth and efficiency.
The performance of each antenna is evaluated based on return loss, operational bandwidth, and radiation pattern characteristics. During our measurement, return loss is measured by reading the S11-port reflection coefficient on Vector Network Analyzer (VNA). This coefficient can be used to characterize how well the antenna is able to be efficiently fed. Operational bandwidth is measured as the frequency range over which the antenna keeps the value of Voltage Standing Wave Ratio (VSWR) or equivalently has -10dB return loss. Ansoft High Frequency Structure Simulator (HFSS) is used to simulate expected characteristics which are resonant frequency, bandwidth, VSWR, and radiation pattern. HFSS is used to provide a good guide for the antenna design before the actual prototype is manufactured. Simulated results are compared with results of measurement to point out the differences and help demonstrate the practical effects on antenna performance. Radiation pattern are measured to illustrate the effects of antenna miniaturization. All the above measurements are done in the anechoic chamber.
Sandron, Marco. "Mils - Stampante per la creazione di PCB (printed circuit board) con polimero." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2019. http://amslaurea.unibo.it/19757/.
Full textRajagopal, Abhilash. "Printed circuit board (PCB) loss characterization up-to 20 GHz and modeling, analysis and validation." Diss., Rolla, Mo. : University of Missouri-Rolla, 2007. http://scholarsmine.umr.edu/thesis/pdf/Rajagopal_09007dcc803bf920.pdf.
Full textVita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed November 26, 2007) Includes bibliographical references (p. 112-113).
Huang, Xiucheng. "High Frequency GaN Characterization and Design Considerations." Diss., Virginia Tech, 2016. http://hdl.handle.net/10919/73188.
Full textPh. D.
Vidal, Lorbada Ricardo. "Design and implementation of a charge controller with buck converter topology for a Li-ion battery using the component LTC4015." Thesis, Högskolan Dalarna, Energiteknik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:du-24466.
Full textBörjesson, Mandus, and Håkan Gerner. "Design and implementation of a high-speed PCI-Express bridge." Thesis, Linköpings universitet, Fysik, elektroteknik och matematik, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-158169.
Full textAlfredsson, Jon. "Design of a parallel A/D converter system on PCB : For high-speed sampling and timing error correction." Thesis, Linköping University, Department of Electrical Engineering, 2002. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-1201.
Full textThe goals for most of today’s receiver system are sampling at high-speed, with high resolution and with as few errors as possible. This master thesis describes the design of a high-speed sampling system with"state-of-the-art"components available on the market. The system is designed with a parallel Analog-to-digital converter (ADC) architecture, also called time interleaving. It aims to increase the sampling speed of the system. The system described in this report uses four 12-bits ADCs in parallel. Each ADC can sample at 125 MHz and the total sampling speed will then theoretically become 500 Ms/s. The system has been implemented and manufactured on a printed circuit board (PCB). Up to four boards can be connected in parallel to get 2 Gs/s theoretically.
In an approach to increase the systems performance even further, a timing error estimation algorithm will be used on the sampled data. This algorithm estimates the timing errors that occur when sampling with non-uniform time interval between samples. After the estimations, the sampling clocks can be adjusted to correct the errors.
This thesis is concerning some ADC theory, system design and PCB implementation. It also describes how to test and measure the system’s performance. No measurement results are presented in this thesis because measurements will be done after this project. The last part of the thesis discusses future improvementsto achieve even higher performance.
Formánek, Martin. "Výukový model pro mechatroniku: vývoj modelu a rychlé komunikace pomocí USB." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2020. http://www.nusl.cz/ntk/nusl-417789.
Full textMoozhikkal, Rahul. "Design of Resonant Converters using Silicon Carbide Power." Thesis, KTH, Skolan för elektro- och systemteknik (EES), 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-201662.
Full textUtformningen av serie-belastade resonansomvandlare med hjälp av toppmoderna SiC högeffekttransistorernaundersöks i denna avhandlingen. SiC-enheter väljs eftersom de erbjuderlägre switch-förluster jämfört med konventionella Si-baserade enheter.En mycket detaljeradstudie om funktionen och de olika operationella tillstånden hos resonansomvandlare utförs.Avhandlingen förklarar vidare hur förmågan till högfrekvent switchning hos SiC-enheterförblir ofullständigt utnyttjad på grund av förekomsten av ströinduktanser i switch-snubberlayouten.En jämförelse av alla kommersiellt tillgängliga SiC-enheter genomförs för att hittaden mest lämpliga switchen för resonansomvandlaren. Avhandlingen utförs också en mycketdetaljerad steg-för-steg-utformning av resonansomvandlaren kretsschema och kretskortlayout.Två olika layouter föreslås och jämförs därefter utifrån deras ströinduktanser ocheffektförluster. Slutligen, baserat på experimentella resultat bekräftar avhandlingen.Lämpligheten att använda diskreta SiC-effekttransistorer istället för effektmoduler medintegrerade drivarsteg för styrelektroderna.
Asar, Sita Madhu. "An Audio Processing System as an Example of Modern Circuit Board Design." The Ohio State University, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=osu1480588012253634.
Full textCastle, Joshua. "Design of a Printed Circuit Board for a Sensorless Three-Phase Brushless DC Motor Control System." DigitalCommons@CalPoly, 2020. https://digitalcommons.calpoly.edu/theses/2159.
Full textWang, Lei. "Printed Circuit Board Design for Frequency Disturbance Recorder." Thesis, Virginia Tech, 2005. http://hdl.handle.net/10919/30917.
Full textThe FDR (Frequency Disturbance Recorder) is a data acquisition device for the power system. The device is portable and can be used with any residential wall outlet for frequency data collection. Furthermore, the FDR transmits calculated frequency data to the web for access by authorized users via Ethernet connection. As a result, Virginia Tech implemented Frequency Monitoring Network (FNET) with these FDR devices. FNET is a collection of identical FDRs placed in different measurement sites to allow for data integration and comparison. Frequency is an important factor for power system control and stabilization. With funding and support provided by ABB, TVA and NSF the FDRs are placed strategically all over the United States for frequency analysis, power system protection and monitoring.
The purpose of this study is to refine the current FDR hardware design and establish a new design that will physically fit all the components on one Printed Circuit Board (PCB). At the same time, the software that is to be implemented on the new board is to be kept similar if not the same as that of the current design. The current FDR uses the Axiom CME555 development board and it is interfaced to the external devices through its communication ports. Even through the CME555 board is able to meet the demands of the basic FDR operations, there are still several problems associated with this design. This paper will address some of those hardware problems, as well as propose a new board design that is specifically aimed for operations of FDR.
Master of Science
Elmore, Joel D. "Design of an All-In-One Embedded Flight Control System." VCU Scholars Compass, 2015. http://scholarscompass.vcu.edu/etd/3981.
Full textApostolopoulos, Nikolaos. "Design and implementation of an SPB converter for fault tolerant PMSynRel motor control." Thesis, KTH, Elektrisk energiomvandling, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-179141.
Full textI detta examensarbete unders¨ok SPB-omriktartopologin (stacked polyphase bridges converter)i termer av ett feltolerant elektriskt drivsystem f¨or en permamentmagnetassisteradsynkron reluktansmaskin (PMSynRel). SPB-omriktaren best°ar av ett antal seriekoppladetrefasomriktare av tv°aniv°atyp som, var och en, f¨orser effekt till en trefaslindningtillh¨orande en modul¨ar elmaskin av multifastyp. Specifikation, design och konstruktion aven SPB-omriktare med fyra seriekopplade moduler studeras. Designproceduren presenterasi en steg-f¨or-steg-process och de tillverkade kretskorten presenteras utf¨orligt. Kommunikationenmellan de olika kretskorten unders¨oks med s¨arskild tonvikt p°a l°ag elektromagnetiskinterferens vilket ¨ar n¨odv¨andigt om h¨og kommunikationshastighet skall kunnauppn°as. Den f¨ardigst¨allda prototypen har utv¨arderats experimentellt och kapaciteten f¨orfeltolerans har demonstrerats vid drift av en PMSynRel-maskin utrustad med en multifaslindning.
Baker, Victoria Isabelle. "3D Commutation-Loop Design Methodology for a SiC Based Matrix Converter run in Step-up mode with PCB Aluminum Nitride Cooling Inlay." Thesis, Virginia Tech, 2021. http://hdl.handle.net/10919/104361.
Full textMaster of Science
In the United States, 40% primary energy consumption comes from electricity generation, which is the fastest growing form of end-use energy. Industries such as commercial airlines are increasing their use of electric energy, while phasing out the mechanical and pneumatic aircraft components, as they offer better performance and lower cost. Thus, implementation of high efficiency, electrical system can reduce energy consumption, fuel consumption and carbon emissions [1]. As more systems rely on this electric power, the conversion from one level of power (voltage and current) to another, is critical. In the quest to develop high efficiency power converters, wide bandgap semiconductor devices are being turned to. These devices, specifically Silicon Carbide (SiC) devices, offer high temperature and high voltage operation that a traditional Silicon (Si) device cannot. Coupled with fast switching transients, these metal oxide semiconductors field effect transistors (MOSFETs), could provide higher levels of efficiency and power density. This work investigates the benefits of a three-dimensional (3D) printed circuit board (PCB) layout. With this type of layout, a critical parasitic – inductance – can be minimized. As the SiC device can operate at high switching speeds, they incur higher di/dt, and dv/dt slew rates. If trace inductance is not minimal, overshoots and ringing will occur. This can be addressed by stacking PCB traces on top of one another, the induced magnetic field can be reduced. In turn, the system inductance is lowered as well. The reduction of this parameter in the system, reduces the overshoot and ringing. This particular work applies this technique to a 15kW matrix converter. This converter poses a particular design challenge as there are a large number of devices, which can lead to longer, higher inductance PCB traces. The goal of this work is to minimize the parasitic inductance in this converter for high efficiency, high power density operation.
Ruffner, Matt Phillip. "DESIGN OF A MACHINE VISION CAMERA FOR SPATIAL AUGMENTED REALITY." UKnowledge, 2018. https://uknowledge.uky.edu/ece_etds/129.
Full textMartinez, Cano Pablo. "Thermomechanical Design and Analysis of the Lisa Phase Measurement System." Thesis, Luleå tekniska universitet, Institutionen för system- och rymdteknik, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-76509.
Full textPedretti, Andrea. "Design of a thermographic device and of the rugged frame of a radio-frequency spectrum analyzer." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2021. http://amslaurea.unibo.it/24654/.
Full textAbdul, Nazar Mohamed. "Design of a Gysel Combiner at 100 MHz." Thesis, Linköpings universitet, Fysik och elektroteknik, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-162475.
Full textChen, Kuan-Ku, and 陳冠谷. "Temperature Monitoring and Control Design for PCB." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/56373001115742767100.
Full text國立交通大學
電機與控制工程系所
93
With the improvement of process, the volume of chips becomes smaller as time evolves. It directly increases the power density of the electronic component. As a result, the key point of raising the reliability of the whole system and developing high-efficiency chip is how to monitor the temperature IC for real-time protection. In this study, we propose a new method to be able to monitor a point on the PCB board without sensor by using the matrix calculation and mapping of sensors build in other locations of the PCB board. In addition to reduce the amount of sensors by using such an approach, we can monitor the temperature at which it is difficult to put sensor on. With the temperature estimation model, we can turn on the Peltier Module (TE) to set up a temperature control scheme for making the chip to work in the most appropriate temperature with better performance.
Chang, Chih-Ming, and 張智明. "High Speed Signal PCB Design and Verification." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/d58nr8.
Full text國立臺灣科技大學
電子工程系
94
Nowadays, electronic technology has been invented faster and faster, even the new applications are continuous re-evolution. In other words, the faith of new technology is to improve the working frequency performance of production to lead in the market. Therefore, IC designer and systematic development R&D would take the responsibilities and new challenge with risk to catch up the time to market. This paper is based on the systematic analysis to start introducing high speed transaction interfaces. Firstly, according to the many transaction interface specifications, there are three popular interfaces, such as LVDS, HDMI and USB2.0, that are used in the manufacturing. LVDS (Low Voltage Differential Signaling) is an emerging differential digital standard used in several communication and mixed-signal applications. LVDS is often used in the Liquid Crystal Display for high speed data transaction. Besides using in LCD, purchasing the best performance of LVDS is used in the telecommunication application. HDMI is also a new generation of high speed transaction that is applied in high-definition video and audio equipments such supporting the HDTV definition. USB2.0, that takes the responsibilities to link the data communication, is mostly used in the computers and consumer electronic. Secondly, introducing the fundamental of PCB to understand the characteristic is to reach the best impendence in high speed transaction. Moreover, sharing the PCB design skills and experience are helpfulness in the production development. In conclusion, testing and verifying the evaluated PCB then comparing the values of impedance in ideal and real conditions. Moreover, the EMC testing is also an import issue for PCB design. Therefore, the best way to solve the EMC issue is that seriously considering the EMC solution in PCB development process.
"Development of a PCB-integrated micro power generator." 2001. http://library.cuhk.edu.hk/record=b5895873.
Full textThesis (M.Phil.)--Chinese University of Hong Kong, 2001.
Includes bibliographical references (leaves 81-83).
Abstracts in English and Chinese.
Chapter CHAPTER 1 ´ؤ --- INTRODUCTION --- p.1
Chapter 1.1 --- Background on Micro Power Supply --- p.1
Chapter 1.2 --- Literature Survey --- p.3
Chapter 1.2.1 --- Comparison Among Different Power Sources & Transduction Mechanisms --- p.3
Chapter 1.2.2 --- Previous Works in Vibration Based Generator --- p.6
Chapter CHAPTER 2 一 --- DESIGN OF THE MICRO-POWER GENERATOR --- p.8
Chapter 2.1 --- Concept of Power Generation --- p.8
Chapter 2.2 --- Design Objectives of the Micro Power Generation --- p.9
Chapter 2.3 --- System Modelling and Configuration of the Generator --- p.10
Chapter 2.4 --- RESONATING STRUCTURE --- p.13
Chapter 2.4.1 --- Material Selection --- p.13
Chapter 2.4.2 --- Fabrication Method --- p.14
Chapter CHAPTER 3 一 --- INDUCTING STRUCTURE --- p.17
Chapter 3.1 --- Selection of Winding Method --- p.17
Chapter 3.2 --- Solenoid Windings --- p.19
Chapter 3.2.1 --- Fabrication Process --- p.19
Chapter 3.3 --- PCB Windings --- p.20
Chapter 3.3.1 --- Fabrication Process of the Prototype of Six-layer PCB --- p.21
Chapter CHAPTER 4 一 --- EXPERIMENTAL RESULTS --- p.27
Chapter 4.1 --- Experimental Setup --- p.27
Chapter 4.1.1 --- Generator Systems --- p.27
Chapter 4.1.2 --- Measurement of Vibration and Output from the Generator --- p.28
Chapter 4.1.3 --- Observations of Vibration Motions --- p.31
Chapter 4.2 --- SPRING FOR THE MICRO GENERATOR --- p.32
Chapter 4.2.1 --- Spring Micromachining Optimization --- p.32
Chapter 4.2.2 --- Mode Shapes and Spiral-spring Structures --- p.35
Chapter 4.3 --- MAGNET FOR THE MICRO GENEARTOR --- p.37
Chapter 4.3.1 --- Generator Output and Magnetic Dipole Orientation --- p.37
Chapter 4.4 --- HAND-WIRED COIL GENEARTOR --- p.45
Chapter 4.4.1 --- Performance of Different Design of Housings --- p.45
Chapter 4.5 --- PCB COIL GENERATOR --- p.48
Chapter 4.5.1 --- Size of PCB Coils vs. Generator Output --- p.48
Chapter 4.5.2 --- Effect of Number of PCB Layers --- p.54
Chapter 4.5.3 --- Array of Generators --- p.61
Chapter CHAPTER 5 一 --- MODELLING AND COMPUTER SIMULATION --- p.63
Chapter 5.1 --- Modelling the Second-Order System --- p.63
Chapter CHAPTER 6 一 --- APPLICATION DEMONSTRATIONS --- p.69
Chapter 6.1 --- INFRARED SIGNAL TRANSMISSION --- p.69
Chapter 6.2 --- RF WIRELESS TEMPERATURE SENSING SYSTEM --- p.70
Chapter CHAPTER 7 ´ؤ --- CONCLUSION --- p.75
Chapter CHAPTER 8 一 --- FUTURE WORK --- p.77
BIBLIOGRAPHY --- p.81
APPENDIX --- p.84
FAN, YU-WEI, and 范育瑋. "Multi-Layer PCB Routing Design under Cost Consideration." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/hx5vzb.
Full text中華大學
資訊工程學系
106
It is necessary for cost consideration to minimize the number of the used layers in PCB designs. In this thesis, the layer-aware routing process in a PCB design can be divided into layer-aware via minimization and single-layer obstacle-aware routing. In layer-aware via minimization, given a set of available layers and a set of global wires on routing nets in a PCB design, firstly, a fuzzy-clustering-based algorithm is proposed to minimize the number of the used vias in layer-aware topological via minimization. Clearly, there are a subset of complete global wires and a set of partial global wires inside an available layer. In single-layer obstacle-aware routing, given a set of global nets and a set of rectangular obstacles inside a single-layer grid-based routing plane, a heuristic routing algorithm can be further proposed to maximize the number of the routed nets in single-layer obstacle-aware routing. Compared with the combination of Cong’s k-way topological planar routing algorithm and an iterative net post-assignment, NetAssignment, in layer-aware via minimization, the experimental results show that our proposed fuzzy-clustering- based algorithm can use less CPU time to reduce 57.3% of the number of the used vias for 8 tested PCB designs on the average. Additionally, compared with Liu’s modified algorithm and Yan’s flow-based algorithm in single-layer obstacle-aware routing, the experimental results show that our proposed routing algorithm can use less CPU time to increase 3.4% and 1.8% of the routability on the routing nets for 8 tested examples on the average.
Lai, Yu-Ching, and 賴玉菁. "Crosstalk Analysis and Design Technology of PCB layout." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/91752604197127829429.
Full text逢甲大學
產業研發碩士班
98
With the advance of modern technology, functions of all kinds of electronics are continuously upgraded. The design trend is for lighter, thinner, shorter and smaller product. However, to achieve multi-functions, portable size, and high performance in limited space can cause safety concern for user. Electromagnetic interferences (EMI) in various forms have become an important environmental issue. In the past, electromagnetic compatibility (EMC) solutions have relied heavily on the experience of engineer designing the system. In addition, for the lack of simulation software, the root problems can not be found in time. This means that the EMI problem can only be addressed at the final stage of certification test of the finished electronic products. This procedure required repeated test and retest process and will result in an increase in cost production and a prolonged time schedule for a viable product. In this thesis, the main focus is on study of the simulation and verification using the Electrical Interconnect & Packaging (EIP) with the CST software to suppress cross-talk and adapt the best way to resolve the interference problems. Through the time-domain far-field analysis and measurement, the effects of EMI under different layout design applications are examined.
LEE, WEN-CHING, and 李玟靜. "Design of Multi-Chip Probe Card PCB with T5372." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/qujr5p.
Full text聖約翰科技大學
電機工程系碩士在職專班
107
The memory testing machine has various models and specifications on the market. It is the key issue on how to choose the appropriate testing machine, to design the probe card PCB carrier board based on the machine specifications. In addition, another issues including under consideration of the test time and cost spent, how to design a multi-wafer probe card PCB carrier to achieve the lowest cost in the least test time to meet the production efficiency. This paper discusses how to design a 128 (4X32) wafer probe card carrier oard under the specifications of the Advantest Corporation T5372 memory test machine. The feature of the design is under a minimum cost to design the PCB carrier board of 128 probe cards in a minimum number of layers. It meets the test machine specifications used in the thickness and appearance size range of the probe card PCB carrier board. In addition, it is also necessary to meet the PCB manufacturer and probe implant factory production capabilities. The design needs to consider the solder joint size, spacing, the distance between the wafers, and the maximum range of probe needle distance, to consider the wiring method to achieve the minimum number of stacked layers and meet the impedance control requirements.
李柏緯. "EMC Design Rules Analysis and Application for Digital PCB." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/67167411301228138191.
Full text逢甲大學
通訊工程學系
104
In the high-speed digital circuits, the crosstalk between traces is one of the most critical factors affecting the signal integrity. Therefore, in the present work, in accordance with the design rules for signal integrity, the coupling effect between traces will be analyzed using software simulation tool. Such effect includes energy distribution due to near-field coupling. Additionally, the observed signal distortion can also be deduced from the observed eye diagram. The effect of slot structure on the change in the impedance of the signal traces was discussed using TDR. The influence of slot structure on EMI was also studied. Finally, we discuss the material properties through changing the material dielectric constant, conductivity, height and permeability to compare the efficiency of material shielding efficiency.
Chung, Chin-Te, and 仲金德. "Graphics User Interface Design for PCB Manufacturing OSP Process." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/25341636363039918554.
Full text華梵大學
工業設計系碩士班
95
Now PCB (Printed circuit board) manufacture process is tedious, for example, the single or minority manufacture process, already unable to satisfy the board factory’s demands. The more accurate the process is, the more difficult it is to learn and understand. Moreover, the government introduces foreign workers, under the difference of languages, humanity and knowledge standard, the working environment is getting more and more complicated, and it would be a challenge to manage effectively and put in use on apparatus. Nowadays, most machines of PCB manufacturing process are still based on manual operations or operated by Chinese-English computer user interface which is not good enough for the working environment filled with foreign workers. This research mainly probes into the cognitive diverseness of Graphic User Interface operated by different nationalities users and tries to find out the most proper graphic interface. For example, the OSP (Organic Solderability Preservatives) processor of some PCB manufacturing figured out the requirement and practicability in graphic user interface of PCB manufacturing process by beforehand researches and surveys. The research specimens are taken by the graphic user interface of general electric equipments and information appliances. They collect the Graphic User Interfaces operated in the market now and then adjust a suite of graphics user interfaces which fit OSP processors. Compile general icons and then design a suite Graphics User Interface which satisfies different foreign workers. The result of this study working on different foreign users: 1.Graphics User Interface can reduce users’ fears on operating the machinery. 2.No matter what kind of nationality and knowledge level, the recognition and operation of the graphics user interface will be quicker and more effective. 3.According to the cognition of human sense of vision, graphics and icons are easier to be accepted and understood.
Chen, Chao-Yang, and 陳兆陽. "The Design and Implement of a PCB-Based Torque Sensor." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/53452y.
Full text國立交通大學
機械工程系所
107
In modern industry, the monitoring force and torque is an important mission to control the output of machine. However, the measurement system of commercial torque and force sensor is built by wheatstone bridge connected by strain gauges and output to instrumentation amplifier. There are two problems in this system. The first problem is mounting strain gauges. Strain gauges have to mount on system under test. The quality of mounting strain gauges influences the results of measurement very much. The second problem is the flexibility of system design is limited by the wiring of wheatstone bridge connected by strain gauges. The research proposes a novel idea of sensor design to solve the problem of mounting strain gauges. The copper on Printed Circuit Broad (PCB) is used to design the sensing pattern which is able to correspond the direction of applied force. The designed PCB consisted of the sensing pattern, wheatstone bridge and instrumentation amplifier. This proposed design improves traditional measurement system without mounting strain gauges and removing wires from the measurement system. With reducing the influence of signal transmission and wire disturbance in measurement, the flexibility in system design can be improve. The PCB torque sensor can measure 28 Nm with resolution 60 mNm and sensitivity 16.67 k-count/Nm.
Guo, Jian-De, and 郭鑑德. "PCB Antenna Design and Application of ZigBee IOT Wearable Device." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/44gbbs.
Full text亞東技術學院
資訊與通訊工程研究所
104
Nowadays the face of the advent of the aging society, seniors living and physiological signal measurement of care still remain in the paleolithic, there are almost wired devices. When we want to timing measurements on the aged is very troublesome that often define the living scope of seniors. With the Internet of Things technology industry, we are in need of gradually developed a variety of smart wearable devices, so we can simply to access the senior's physiological information in free living environment, such as temperature, humidity, air particulates and other data as well as the elderly physiological signals, such as blood pressure, heart beat rate, blood SPO2. Therefore compact (small) size, low power and wireless communication is an important feature of an intelligent wearable, they meet elderly smart wearable required, but the key is the PCB Antenna design. This paper presents a new design method of ZigBee module, with CC2530 chip as the core, 8051 included in a single chip system. CC2530 comprise analog - digital conversion, which constitute abundant peripheral unit and a wireless transceiver unit, etc. It has QFN40 (6 mm * 6 mm * 1 mm) package conducive to narrowing the area of the module and reduce costs. The new design method: First, (1) Use the 2COMU's GEMS 3D electromagnetic simulation software to simulation S-parameters used herein printed antenna. Then ,(2) using the Agilent ADS software to analysis RF circuit and (3) a CPWG (Coplanar waveguide) characteristic parameters tool obtains the discrete elements , so that the band between 2.4 to 2.5G of PCB Antenna can achieve maximum power output and use the least area. In this method we produced ZigBee-Dongle module and ZigBee Multi-function module. These two modules we measurement and comparison RSSI (Received Signal Strength Indication) and PER (Packet Error Rate), the test results meet the application requirements, suitable for wearable module design and application. After the measuring of receiver strength of the wireless module, this paper also produced an ear thermometer sensing module by a miniaturized CC2530 module, a wearable blood pressure monitor and an aged emergency call module. And then use these three modules to construct an Internet of Things of home care. In addition, many electronic manufacturers have launched their own IOT products, it includes IOT device, gateway, cloud server and APP program for the construction of Internet of Things, a common way. But in this way, it resulting in networking device of A vendor can’t hang on the gateway of B vendor, the APP of B vendor can normal to operation the gateway of B vendor, and vice versa. This will seriously affect the development of the Internet of Things. This paper presents an innovative type of networking integration operation platform, first, (1) build 3D virtual emulation object (the virtual emulation object have the ability to transceiver ZigBee signal through USB interface in this paper) for the objects of Internet of Things, it include 3D design, user interface, reaction and signal handling of design, etc. (2) Transmit/Receive sensors status and signal to/from the main control platform. Main control platform is a PC (or a specific platform), with 3D game engine (or Unity 3D program), it can download 3D virtual emulation objects into map of IOT from a server, it can edited 3D emulation objects becomes the control map (The map which be similar to reality environment), and then it can operate 3D virtual emulation objects on the map and control or sensing object of real Internet of Things, to realize plug and play functionality of objects of IOT. (3) Authorized and sharing this control map with other peoples. This new approach can successfully solve the aforementioned problems, devices of vendor A and vendor B of IOT can be connected to the integrated operation platform, it can be normal to operation by plug and play.
Lee, Chung-Yun, and 李重鋆. "Thermal Analysis and Structural Optimum Design of PCB Bonding Modules." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/13053342030550703478.
Full text國立臺灣大學
機械工程學研究所
98
This paper investigates the thermal behaviors of PCB bonding modules for TFT-LCD panel under non-uniform temperature distribution caused by the heating process. Firstly, solid models of the PCB bonding modules are generated by commercial CAD software and then imported into commercial finite element analysis software for producing finite element meshes. The non-uniform temperature distribution and its thermal deformation in the heating process are analyzed. The results show that the PCB bonding modules would have the thermal deformation because of materials with different coefficients of thermal expansion. Next, this paper proposes a thermal compensated mechanism for the PCB bonding modules. When the SKD61 material is chosen as the bonding head, SUS303 as the parallel head, and Aluminum 6061-T6 as the clipping parts, the thermal deformation would be decreased effectively. Also, this paper adjusts the gap between parallel head and bonding head to decrease the thermal deformation. With a properly chosen gap value, the surface of the PCB bonding modules would be kept on a flat condition. Finally, an integrated optimum design program will be applied to search the best structural design for the PCB bonding modules with heating powers of the six specific locations chosen as design variables. The optimum design result shows that the PCB bonding modules with special designed heaters has more uniformly temperature distribution.
LIN, SIAO-CHIEN, and 林孝謙. "The Study of Line Width Compensation For PCB Layout Design." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/7pgqnf.
Full text國立高雄大學
電機工程學系碩博士班
107
In PCB circuit layout design of small line pitch, line width compensation is necessary to guaranty line width error and resistance value within meet with specification for different copper thickness and dry film thickness. Since that layout design with different thickness of copper line will cause variation of lithography and etching accuracy control. In general, PCB layout design rely on empirical adjustment to achieve the consistency of line width and electrical resistance specification, and it is not reliable to achieve consistent process qualification. In this thesis we mainly focus on the study of the optimization of line width compensation under different copper thick condition
Chang, Wen-hsien, and 張文賢. "The study of PCB delamination and the design improvement methods." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/36684068893664862423.
Full text國立成功大學
工程科學系專班
97
With the demand evolution of electronic products, the printed circuit board (PCB) industry technology has been improved from the previous low-tech single-sided board to the high-tech HDI one. Because Taiwan PCB industry is a customized one, the different layout, drill or stack design will have different production qualities, in which especially the reliability problems caused by delamination obtain the greatest attention. This work is primary to study the effects of PCB layout on delamination, from which the improved methods are brought up. The research is divided into three stages. In the first stage, the influences of drill hole density, board thickness, board frame pattern and drill hole type on delamination are investigated. In the second stage, two improved methods are proposed for the delamination problem, which are copper dots and through holes applied to the board. The former one is to make the heat transfer uniform over the board and the latter one is to enhance the heat transfer. The effects of these methods and their mixed scheme are analyzed in this stage. In the last stage, a feasible way is found from the results of the first two stages. This method is applied to a real PCB product and its effects are checked. From the experimental results, it can be found that the buried hole has the negative effect on the PCB reliability. Enhancing the structural strength of PCB or designing the proper heat dissipating tunnels is helpful to improve the reliability, which is verified by applying the modified method to a practical product.
Wu, Han-Yang, and 吳翰揚. "Integrated PCB Design of UWB Balun and Log-Periodic Antennas." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/31438075509955356894.
Full text國立臺灣大學
電信工程學研究所
97
The log-periodic dipole antenna (LPDA) is categorized as a frequency independent antenna with linear polarization and stable gain patterns; therefore it is suitable for the source antenna in EMI/Antenna measurement. Traditional LPDA is made of metal cylinders fed by coaxial cables making the antenna heavy and difficult to fabricate. Planar printed circuit board (PCB) LPDA was proposed recently; however, its unshielded and unbalanced feeding line may cause the cross-polarization too high to be used for practical applications. In this thesis, we propose a balun-based feeding scheme integrated with the planar LPDA using the multi-layered PCB technology. In the first half of the thesis, we design a Marchand balun in a multi-layered PCB with measured amplitude and phase balance within 1.0 dB and 10 degrees respectively over the 0.66~5.71 GHz band. In the second half of this thesis, we integrate the developed balun with the planar LPDA on the same PCB. Two designs are demonstrated for the 0.8~3.2 GHz and 0.8~6.0 GHz bands respectively. Both designs show good results in the wideband impedance matching, stable broadside gain range 0~6 dBi, and the highly isolated cross-polarization of 20 dB over the entire band.
CHANG, MEI-YU, and 張美玉. "Integration of ECAD and MCAD for PCB Design of Digital Camera." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/50729927062096773322.
Full text國立臺灣科技大學
機械工程系
100
In early days, the design of circuit board of digital cameras takes DXF (Drawing Interchange File Formats) as the metafile of file delivery between electrical and mechanical departmentw. The disadvantage is that the electrical engineers have to re-check whether the electrical part is proper whenever changing the design of products. Besides, during the process of file exchanging, the version chaos would lead to parts interference. In order to solve the problem, this thesis attempts to use the format of IDF 3.0 (International Diabetes Federation 3.0) to replace DXF format as the metafile. The basic mechanism makes use of the geometric checking function of ECAD and MCAD which could decrease errors of man-made check by finding the differences of electrical parts in different versions automatically and adjust in time. On the other hand, this thesis also introduces the function of document comparison with design changing, which could aid engineers to find the changing of circuit board rapidly. It will enhance the working efficiency and abbreviate the complex man-made comparison for the designers.
Hsu, Yao-Wen, and 許耀文. "Design and Implementation of Cylindrical Leaky-wave Antennas with PCB Substrates." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/06960996647430619089.
Full text國立臺灣大學
電信工程學研究所
99
This thesis presents a new type of partially reflective surface (PRS) antennas for high gain applications. This single-fed antenna was designed and fabricated with Printed Circuit Board(PCB) technology. The antenna was fed by a patch and covered by a PRS which consist of periodic partitions in radical and lateral directions. A broadside gain of 14.8dB was obtained at the center frequency 5GHz. Another slightly modified design was fed by a circularly polarized patch generating 11dB broadside gain and 20% axial ratio bandwidth. The antenna could be miniaturized with embedded vertical walls and horizontal pads, the maximum broadside gain was dropped by around 3dB but the size reduction is 60% compared to the original design. Finally, an equivalent circuit model had been proposed by employing cylindrical transmission line equations. The wave number of the cylindrical leaky wave had been calculated and the far field patterns were predicted. The presented model achieved a very good consistency with the full wave simulated results.