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Journal articles on the topic 'PCB design'

Author: Grafiati
Published: 4 June 2021
Last updated: 25 April 2022

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1

Thane, Phil. "PCB design for beginners." Electronics Education 2001, no. 1 (2001): 7–10. http://dx.doi.org/10.1049/ee.2001.0007.

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2

Ward Partners Computer Systems. "PCB design on PC." Computer-Aided Design 17, no. 4 (May 1985): 206. http://dx.doi.org/10.1016/0010-4485(85)90240-4.

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3

Clarkson, Steve. "Design Tools—PCB Design & Make." Electronics Education 2000, no. 2 (2000): 5. http://dx.doi.org/10.1049/ee.2000.0032.

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4

Kloeser, J., and W. Scheel. "PCB‐design follows IC‐packaging." Circuit World 26, no. 3 (September 2000): 6–10. http://dx.doi.org/10.1108/03056120010322834.

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5

Krishna Rao, D. A. V. "PCB Design and Process Techniques." IETE Journal of Education 28, no. 1 (January 1987): 10–21. http://dx.doi.org/10.1080/09747338.1987.11436133.

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6

Winslow, T. A. "Component modeling for PCB design." IEEE Microwave Magazine 1, no. 1 (March 2000): 61–63. http://dx.doi.org/10.1109/6668.823829.

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7

Goyal, R. "Managing signal integrity [PCB design]." IEEE Spectrum 31, no. 3 (March 1994): 54–58. http://dx.doi.org/10.1109/6.265411.

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8

Sukadana, I. Wayan, and I. Made Pande Darma Yuda. "Prototyping PCB Menggunakan Computer-Aided Design." TIERS Information Technology Journal 2, no. 2 (December 29, 2021): 37–43. http://dx.doi.org/10.38043/tiers.v2i2.3310.

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Perkembangan Teknologi yang semakin meningkat dan berkembang dapat memudahkan orang-orang yang kreatif dalam merancang system dan elektronik. Pada elektronik terdapat komponen yang sangat penting untuk menunjang komponen dan memberikan jalur penghubung antar komponen yaitu papan PCB. Sebelum adanya technology CAD untuk membuat PCB para pengembang technology Smart System/Internet of Things masih membuat PCB dengan cara manual namun seiring berjalannya waktu dan dengan berkembangnya teknologi sekarang membuat PCB sudah mudah dengan adanya Computer-Aided Design (CAD). Teknik awal seorang pengembang IoT/Smart System membuat PCB yaitu masih dengan cara membuat tata letak komponen dan menyesuaikan skala dengan komponennya setelah itu baru proses menggambar jalur menggunakan spidol permanen yang dibuat sedemikian rupa dengan apa yang telah digambarkan terlebih dahulu baru dilakukannya proses eatching. Setelah adanya technology CAD terdapat banyak perubahan disetiap tahap pembuatannya jadi tidak perlu menggambar tata letak komponen dan menyesuaikan sklanya dengan CAD itu semua sudah otomatis di tentukan. Pada pembuatan PCB dengan CAD bisa menampilkan bagian silk atau gambar bagian depan sehingga bagian silk tersebut bisa ditempel ke bagian atas PCB untuk memudahkan menentukan tempat komponennya. Proses pembuatannya juga lebih efisien dan lebih teratur dengan menggunakan CAD dari pada membuat secara manual sehingga dengan adanya Computer-Aided Design (CAD) sangat membantu dalam proses pembuatan desain PCB.
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9

M. Africa, Aaron Don. "PCB/Microstrip Antenna Design and Simulation." International Journal of Emerging Trends in Engineering Research 7, no. 8 (August 25, 2019): 157–62. http://dx.doi.org/10.30534/ijeter/2019/09782019.

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10

Thane, Phil. "PCB design for beginners. Part II." Electronics Education 2001, no. 2 (2001): 11–14. http://dx.doi.org/10.1049/ee.2001.0028.

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11

Gu, Chao, and Vincent Fusco. "PCB prism absorber design and characterisation." Journal of Electromagnetic Waves and Applications 35, no. 1 (September 27, 2020): 27–38. http://dx.doi.org/10.1080/09205071.2020.1824691.

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12

Liu, Jing, Bing Chao Chen, Han Hua Ji, and Xiao Jun Jia. "Mechanical Structure Design and Application for PCB Detection System." Applied Mechanics and Materials 670-671 (October 2014): 1416–20. http://dx.doi.org/10.4028/www.scientific.net/amm.670-671.1416.

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PCB defect detection based on AOI is the key technology to realize the automation production of PCB, and the mechanical structure design of the recognition system is one of the most important technologies in the detection system, too. By modeling the main hardware of mechanical structure of the system, we have integrated the whole hardware structure of the detection system. In this paper, we firstly design the general structure of the PCB recognition system. Then, we propose five axis positioning platform and PCB installation device. Finally, the designs of PCB belt conveyor and image acquisition device are completed. By using the integrated hardware structure combined with software control, we can realize intelligent recognition for PCB detection.
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13

Chen, Mao Lin, and Kai Jung Chen. "Embedded System for PCB Soldering Platform Controller Design." Advanced Materials Research 472-475 (February 2012): 2471–75. http://dx.doi.org/10.4028/www.scientific.net/amr.472-475.2471.

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We make use of embedded BASIC Stamp 2 (BS2) microchip controller to design with Hopfield neural network (HNN) as the foundation of sample training, which applies for a soldering platform of mechanical vision and accomplishes PCB soldering positioning technology. The system is verified by Matlab and Simulink to set up the simulation of PCB image soldering positioning. The experiment is proved to improve the traditional low efficiency of PCB soldering technology, to achieve the feasibility of PCB image positioning and to promote the soldering quality.
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14

Auer, David, Stefan Leitner, and Annette Muetze. "PCB motors for sub-fractional HP auxiliary fan drives: a feasibility study." e & i Elektrotechnik und Informationstechnik 139, no. 2 (March 23, 2022): 139–48. http://dx.doi.org/10.1007/s00502-022-01006-3.

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AbstractThis paper investigates the use of PCB motors for sub-fractional HP auxiliary fan drives. First, the basic idea of PCB motors as well as the main advantages and disadvantages are discussed, followed by the description of the design process for a PCB motor for a small automotive fan application. Three different stator designs have been implemented, each on a 4-layer PCB. Finally, the paper gives an overview of the measurements performed and the results obtained for the prototypes of the manufactured PCB motors and suggests design improvements.
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15

Gescom Electronics Ltd. "PCB photoplotter." Computer-Aided Design 17, no. 7 (September 1985): 337. http://dx.doi.org/10.1016/0010-4485(85)90175-7.

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16

Hu, Tao, Ping An Du, John H. L. Ha, and Jian Tao Liu. "Modal Sensitivity Analysis of PCB." Advanced Materials Research 199-200 (February 2011): 1308–13. http://dx.doi.org/10.4028/www.scientific.net/amr.199-200.1308.

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By studying a typical rectangle PCB, the design parameters affecting natural frequency of PCB are found in the paper. By theoretical deduction and finite element analysis, the sensitivity of the natural frequency of PCB with respect to the design parameters is analyzed, the influence of the design parameters on nature frequency is obtained, and some conclusions for structural optimization of PCB are drawn.
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17

Jain, Sakait, and Hae Chang Gea. "PCB Layout Design Using a Genetic Algorithm." Journal of Electronic Packaging 118, no. 1 (March 1, 1996): 11–15. http://dx.doi.org/10.1115/1.2792119.

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This paper presents an approach to find the optimal design layout of chips on a circuit board in a manner that minimizes the area covered on the board and the connections between the various chips. In addition, there are no major heat sources next to each other and certain physical constraints are satisfied while finding a layout design. In this approach, the whole circuit board area is divided into a finite number of cells for mapping it into a Genetic Algorithm (GA) chromosome. The mutation and crossover operators have been modified and are applied in conjunction with connectivity analysis for the chips to reduce the creation of a lot of faulty generations. Examples of GA based chip layout are presented to show how each of the objectives are attained separately followed by examples to arrive at layouts using multiple objectives.
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18

Sharawi, M. S. "Practical issues in high speed PCB design." IEEE Potentials 23, no. 2 (April 2004): 24–32. http://dx.doi.org/10.1109/mp.2004.1289994.

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19

Alexander, M., K. Sr�hari, and C. R. Emerson. "Cost based surface mount PCB design evaluation." Journal of Electronic Testing 5, no. 2-3 (1994): 229–38. http://dx.doi.org/10.1007/bf00972082.

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20

Orosun, R. O., M. M. Orosun, N. B. Salawu, and S. O. Ige. "PCB DESIGN USING LOCAL TECHNOLOGY AND AutoCAD." Journal of Physics: Conference Series 1299 (August 2019): 012063. http://dx.doi.org/10.1088/1742-6596/1299/1/012063.

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21

Razmhosseini, Maryam, Abhijit Bhattacharya, and Rodney G. Vaughan. "Practical Diversity Design for PCB IoT Terminals." IEEE Open Journal of Antennas and Propagation 1 (2020): 627–43. http://dx.doi.org/10.1109/ojap.2020.3035196.

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22

Chen, Xiao Rong, Lin Bai, and Tong Wu. "Analysis and Design of PCB Multistage Process Quality Management Information System." Applied Mechanics and Materials 217-219 (November 2012): 2658–63. http://dx.doi.org/10.4028/www.scientific.net/amm.217-219.2658.

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This paper analyses the actual applications demand of the real-time PCB production quality management information system for the electronic product manufacturing enterprises, has established functional model for the real-time PCB production and quality management information system, and has used of mathematical statistics and mathematical logic principles, methods to analyzed of PCB production quality information, which was collected in real-time, finally, has established a Quality Information System PCB, this system achieves the various production processes and product quality tracking and retroactively for PCB.
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23

Su, Biao, Li Xue Li, Yi Hui Zheng, Xin Wang, Yan Liu, and Chang Li Dang. "Design and Analysis of PCB Rogowski Coil Current Transformer." Applied Mechanics and Materials 672-674 (October 2014): 984–88. http://dx.doi.org/10.4028/www.scientific.net/amm.672-674.984.

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Electronic current transformers are more suitable for the development of power system compared with traditional electromagnetic current transformers. Rogowski coil current transformer is one of three electric current transformers. According to the measurement principle of Rogowski coils, the equivalent circuit of PCB Rogowski coils is analyzed. By using four PCB Rogowski coils combined, a PCB Rogowski coil current transformer is designed and tested. The results show that the designed PCB Rogowski coil transformer has good linearity and high sensitivity and measurement accuracy and it can meet the requirement of power system.
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24

Petricca, Luca, Per Ohlckers, and Geir Morten Mellem. "Ultra Low Weight Spacer for PCB to PCB Interconnections." Journal of Microelectronics and Electronic Packaging 11, no. 1 (January 1, 2014): 42–50. http://dx.doi.org/10.4071/imaps.396.

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Nowadays, in many applications, limited space and weight budgets are two important variables that the designer should handle. Many fields such as aerospace or portable electronics require extremely small interconnection solutions, which go behind standard cables and connectors. To overcome this problem, we present the design, fabrication, and testing of an ultra-low-weight spacer for PCB to PCB interconnections. The novelty of this work is that this paper presents an easy and reliable solution capable of creating strong electrical and mechanical bonding at the same time. The extremely limited weight of the spacer (74 mg) and the relatively small dimension (5 mm × 5 mm) make this system a possible solution for applications requiring minimal space and weight.
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25

Zhang, Wei, Wan-Jun Yin, Xiao-Bo Qiu, Wei He, Yi-Xue Yuan, Jia-Lin Wang, and Tao Wen. "Electromagnetic Compatibility Analysis and Optimization Design of Switching Power Supply Printed Circuit Board." Journal of Nanoelectronics and Optoelectronics 16, no. 4 (April 1, 2021): 552–58. http://dx.doi.org/10.1166/jno.2021.2948.

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Printed Circuit Board (PCB) is not only an important electrical module of information equipment, but also an important source of electromagnetic radiation. Only when PCB works normally and is compatible with other electrical equipment, the whole information equipment can work normally. Because of the complexity of PCB structure and the difficulty of modeling, the EMC (Electromagnetic Compatibility) analysis of PCB is very difficult. For this reason, Taking the widely used full bridge current double rectifier converter as an example, aiming at the electromagnetic compatibility problems caused by the PCB design of the switching power supply, this paper proposes a simulation method based on the electromagnetic field by establishing the near-field radiation model of the PCB, analyzes the areas with high radiation intensity in the PCB layout, by optimizing the layout and wiring of the PCB, the electromagnetic compatibility performance of the switching power supply is improved. The simulation results show that the near-field radiation characteristics of PCB can be predicted by introducing the electromagnetic field simulation method in the design stage, according to the characteristics of the magnetic field, the optimal design is realized, so that the EMC of the switching power supply reaches the standard, and finally the working performance of the switching power supply is improved.
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26

McMillan, J. "Key aspects of internet of things PCB design." ELECTRONICS: Science, Technology, Business 170, no. 9 (2017): 138–44. http://dx.doi.org/10.22184/1992-4178.2017.170.9.138.144.

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27

Deal, William. "Coplanar waveguide basics for MMIC and PCB design." IEEE Microwave Magazine 9, no. 4 (August 2008): 120–33. http://dx.doi.org/10.1109/mmm.2008.924965.

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28

Berzoy, Alberto, A. A. S. Mohamed, and Osama Mohammed. "Optimizing power converter PCB design for lower EMI." COMPEL - The international journal for computation and mathematics in electrical and electronic engineering 34, no. 5 (September 7, 2015): 1364–80. http://dx.doi.org/10.1108/compel-02-2015-0082.

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29

Peltola, Tero, and Pauliina Mansikkamäki. "Formable multilayer PCB structure: design and technology demonstrator." Journal of Engineering, Design and Technology 5, no. 2 (June 5, 2007): 148–58. http://dx.doi.org/10.1108/17260530710833194.

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30

Venkateswaran, R., and P. Mazumder. "Coprocessor design for multilayer surface-mounted PCB routing." IEEE Transactions on Very Large Scale Integration (VLSI) Systems 1, no. 1 (March 1993): 31–45. http://dx.doi.org/10.1109/92.219905.

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31

Kaijian, Shi, and Sun Jian. "A relational graphical editing method for PCB design." Computer-Aided Design 23, no. 1 (January 1991): 92–95. http://dx.doi.org/10.1016/0010-4485(91)90084-a.

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32

Kaijian, Shi, and Sun Jian. "A relational graphical editing method for PCB design." Computer-Aided Design 23, no. 11 (January 1991): 92–95. http://dx.doi.org/10.1016/0010-4485(91)90102-3.

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33

Hong, Jiang, Zhi Wei Tang, and Long Hu Chen. "Some Noteworthy Aspects in Designing High-Speed PCB." Advanced Materials Research 662 (February 2013): 846–50. http://dx.doi.org/10.4028/www.scientific.net/amr.662.846.

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With the increase of integrated circuit switch rate and PCB density, signal integrity has become one of the problems must be concerned in high-speed PCB design. How to fully consider EMC (Electromagnetic compatibility) and take effective measures has been a key factor of a system design. Based on the consideration of EMC, the author put forward some aspects in designing high-speed PCB. The optimized PCB design rules have steady and credible performance, the development period is shortened and the cost is reduced. The conclusions drawn from the dissertation are helpful to the design of high-speed PCB.
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34

Alex Thomas, Nikhil, Sanket Dessai, S. G. ShivaPrasad Yadav, and Shilpa Chaudhari. "Design and Development of ARM9 Evaluation Kit for Embedded Applications." International Journal of Reconfigurable and Embedded Systems (IJRES) 3, no. 2 (July 1, 2014): 62. http://dx.doi.org/10.11591/ijres.v3.i2.pp62-75.

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In contrast with low end microprocessor, ARM9 core is quite a sophisticated processor. The Evaluation kit plays an important role in the prototype development and verification of the system design before taking to its actual system development hence it’s provide better confidence to the designer. In this paper a project for the Evaluation kit has been designed for embedded system engineer to implement and confirm the functionality of their operating systems which could lead to a comfortable deployment. The independent modules for the interfaces of the ARM9 processor have been designed and the schematics have been developed using OrCAD. From the tested schematics designed in OrCAD, the related PCB is designed using CADSTAR. An eight-layer board is designed for its signal integrity and complexity of the schematic designed. The designed PCB layer is then calibrated and Gerber files are then made and passed on the PCB board manufacturer for PCB fabrication. The PCB board made is then tested for interconnection continuity using multi-meter as the components are loaded on to the board.
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35

Yang, Mei, Hong Qiang Sun, Jing Hua Cui, and Yuan Ping Shi. "Design of PCB Engraving Machine System Based on MCU." Advanced Materials Research 490-495 (March 2012): 42–45. http://dx.doi.org/10.4028/www.scientific.net/amr.490-495.42.

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Design a system of PCB engraving machine using MCU. Design in detail mechanical structure and the system scheme of the engraving machine. Write a software which can converse the file of PCB drawing software output to program for SCM and exchange data between PC and SCM. Choose the right step motor and design driven circuit of step motor.
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36

Ganesh Kumar, A. G., G. Ranganath, S. N. Mani Varmaa, S. Shylin H. Jose, and M. Sakthivel. "Design and Fabrication of Riot Shield from E-Waste Printed Circuit Board." Applied Mechanics and Materials 787 (August 2015): 18–21. http://dx.doi.org/10.4028/www.scientific.net/amm.787.18.

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Recycling of Printed Circuit Boards (PCB) has been carried out by powdering it into granular size of less than 10 microns. The properties of PCB reveal that it possesses density of 1.3 g/cm3 and Tensile Strength of 310 MPa which is comparatively high when compared to the Polycarbonate material which is normally used in the fabrication of Riot shield. The PCB material was subjected to SEM and EDAX analysis for determining their structure, porosity and material composition. Riot shield fabricated from PCB reduces the environmental effects of E-waste PCBs by the recycling technique, improves the material strength and reduces the weight and cost to a larger extent.
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37

Su, Te-Jen, Yi-Feng Chen, and Kun-Liang Lo. "Design chip position of printed circuit board based on particle swarm optimization." Modern Physics Letters B 33, no. 14n15 (May 28, 2019): 1940043. http://dx.doi.org/10.1142/s0217984919400438.

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Printed Circuit Board (PCB) is a critical component in the IC packaging process. Manufactured PCBs are typically designed for use by a specific kind of chip and cannot be used for multiple chip types. However, allowing different kinds of chips to be served by a single PCB would greatly improve material preparation and production processes. However, the design and manufacturing of PCB for use in multiple chip types raises issues related to minimizing the use of gold wire. Traditional manual methods rely extensively on experience. This paper applies Particle Swarm Optimization (PSO) methods to identify optimal positioning with experimental results showing a 20% reduction of gold wire in multi-use PCB.
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38

Wu, Xian Zhe, Cheng Zhang, Shuang Fei Yang, and Lian Qing Zhao. "Computerized Simulation of Board-Level EMC in High-Speed PCB." Advanced Materials Research 989-994 (July 2014): 1977–80. http://dx.doi.org/10.4028/www.scientific.net/amr.989-994.1977.

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Aim at the multi-faceted nature and universality of the EMC problems in high-speed PCB, based on a three-line coupling model and considering the influence of via holes caused, board-level EMC problems of PCB were researched on point for point. In this paper, the research and simulation were launched by a kind of software named Hyperlynx, and a 6-layer PCB model was built and used. Our Research was focused on the EMC problems existed in hierarchy and layer medium. On the basis of the simulation results, and combined with previous experience in the PCB design, some effective measures for improving EMC in high-speed PCB design were summarized, which could be taken as a clearly reference in design of high-speed PCB.
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39

Vigneau, Guillaume, Mohamed Cheikh, Rachid Benbouhout, and Alexandru Takacs. "Design and modeling of PCB coils for inductive power charging." Wireless Power Transfer 2, no. 2 (September 2015): 143–52. http://dx.doi.org/10.1017/wpt.2015.17.

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This article presents a modeling and parametric investigation of printed circuit board (PCB) coils used in inductive power charging systems by using intensive full-wave electromagnetic simulations. Low frequencies applications (below 1 MHz) are targeted. The proposed modeling approach and design methodology are validated for wireless power transfer systems including transmitting (Tx) and receiving (Rx) coils. The impact of ferrite materials used for shielding and efficiency improvement is also analyzed. Optimized PCB coils allowing a theoretical efficiency of 88.7% at 100 kHz and 98.5% at 1 MHz confirms that PCB coils are appropriate for wireless power transfer at such frequencies.
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40

Wang, Lance. "System I/O Optimization with SoC, SiP, PCB Co-Design." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000013–18. http://dx.doi.org/10.4071/2380-4505-2019.1.000013.

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Abstract The increasing complexity of system on chips (SoCs) combined with a new generation of designs that combine multiple chips in a single package is creating new challenges in the design of packages, printed circuit boards (PCBs) and integrated circuits (ICs). The process typically involves three independent design processes – chip, package and PCB – carried out with point tools whose interface requires time-consuming manual processes that are error-prone and limit the potential for reuse. This challenge is being addressed by a new integrated 3D chip/package/board co-design environment that makes it possible to holistically optimize the package, board and IC design to a greater degree than was possible in the past by considering the system-level impact of each design decision. The new co-design approach enables designers to optimize routability via pin assignment and I/O placement to achieve minimum layer counts between chip, package and board. The end result is higher performance.
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41

Yao, Zhu Ting, and Jing Jing Ge. "Electromagnetic Compatibility of PCB Based on Electromagnetic Simulation Methods." Applied Mechanics and Materials 556-562 (May 2014): 1794–97. http://dx.doi.org/10.4028/www.scientific.net/amm.556-562.1794.

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With the circuit fabrication technology continues toward high-speed, high-density, low-power direction, modern circuit design techniques have changed radically. The speed improvement of digital system means rise and fall time of signals as short as possible, the improvement of frequency and edge rates will bring a series of high-speed design problems, these problems bring great challenges to the system hardware design, the correct design from logical point of view, if there is improper in the actual PCB design will lead to failure of the entire design. EMI radiation of PCB is analyzed, EMC simulation of PCB and optimizing improved are finished. The PCB electromagnetic compatibility is analyzed by using Protel 99SE and Ansoft Designer 2.2 software, and simulation result indicates optimizing design is correct and effective.
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42

Parvu, Alina Lavinia, and Valer Dolga. "The Influence of PCB Mounting/Interconnection Technologies into the Design of a Part." Applied Mechanics and Materials 809-810 (November 2015): 486–91. http://dx.doi.org/10.4028/www.scientific.net/amm.809-810.486.

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The concepts which go out from the design activity are based on high knowledge [1], rules of designing [2] and previous experience. Until the product is closer to the series and after in the final customer environment, many processes have to be followed. In the development phase (the phase which contains the concept ideas), considering that a separate plastic connector assembled with Aluminum housing has more advantages [4], the current topic which is handled in this paper is to change the material to plastic and establish how the PCB is mounted and positioned inside the housing. More said which the optimal process for this application is. And this is the most challenging step, of choosing the optimal technology for the assembly (in this case 2 assemblies are considered: the PCB with the housing, which is the PCB mounting/ fixation, and the PCB holes with the connector pins, which is the PCB positioning). The material was changed due to higher properties of plastic which in automotive field brings strong added value. As known, in automotive field there are several processes for the mounting of PCB inside the housing like, snapping-on, clamping, screwing and press-fit. To position and to interconnect the PCB holes with the pins, processes like press-fit, spring contact and wave soldering. The selection of the proper process is made by implementing each of the processes requirements into the shape design of the connector, pins and housing.
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43

TARUI, Yuji, Takashi SAKUSABE, Takehiro TAKAHASHI, and Noboru SCHIBUYA. "EMI Simulation and EMC Design. PCB Design Assistant Tool Considering Electromagnetic Compatibility." Journal of Japan Institute of Electronics Packaging 2, no. 7 (1999): 526–30. http://dx.doi.org/10.5104/jiep.2.526.

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44

Hoang, Cong, Elena Avksentieva, and Yuriy Fedosov. "Forming an individual trajectory of teaching computer-aided design by means of an intelligent adaptive system." Ergodesign 2021, no. 1 (March 30, 2021): 41–48. http://dx.doi.org/10.30987/2658-4026-2021-1-41-48.

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The aim of the work is to increase the efficiency of teaching computer-aided design of printed circuit boards of ship integrated control systems (CAD PCB SICS) with forming an individual learning path, in which there is a need to move from traditional teaching to intelligent adaptive training. The research method is to analyze the peculiarities of forming an individual trajectory of teaching CAD PCB. Research results and novelty: an algorithm for implementing the training course at intelligent adaptive teaching CAD PCB SICS is developed; an algorithm for determining the complexity level of educational material for teaching CAD PCB by study priority is developed; Kohonen's algorithm for forming an intelligent adaptive environment of the educational process of teaching CAD PCB SICS is considered; an algorithm for adaptive testing with forming individual trajectories of teaching CAD PCB SICS is developed taking into account the student’s preferences and individual characteristics.
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45

Hoang, K. K., and Yu V. Donetskaya. "Evaluating the effectiveness of using the intelligent adaptive training system for design modules based on printed circuit boards." Herald of Dagestan State Technical University. Technical Sciences 48, no. 4 (February 11, 2022): 139–46. http://dx.doi.org/10.21822/2073-6185-2021-48-4-139-146.

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Objective. The article studies the problem of adequate assessment of the level of acquired knowledge and skills with design of modules based on printed circuit boards (PCB) using CAD PCB. The article considers the issue of assessing the effectiveness of the use of an intelligent adaptive training system, which is the fundamental criterion for the effectiveness of the training process for designing of modules based on PCB. This intelligent adaptive training system of design of modules based PCB enables learners to assess their own performances. The main purpose of the study is to substantiate the algorithm and mathematical models of the developed system for assessing the effectiveness of training using an intelligent adaptive system. Method. The parameters, algorithm and patterns of building intelligent adaptive learning systems for designing modules based on PCB of ship integrated control systems for future specialists are disclosed. Result. The target indicators of the effectiveness of training in the design modules based on PCB are highlighted. A fully functional algorithm for assessing the effectiveness of learning the design modules based on PCB in intelligent adaptive systems is determined by the step of technological operations to ensure the uniformity of the learning quality control. Conclusion. This system can be useful for teachers and specialists-studying the design modules based on PCB. This system can be used at the stage of assessing the achievable characteristics which can significantly speed up the learning process. The research methods are applied in training the design modules based on PCB to the personnel of the shipyard X52 in Vietnam. It is suitable not only for training shipyard personnel to work, for teaching various levels of training of personnel of any industrial enterprise, for example, in aircraft engineering, mechanical engineering or instrument making, and for teaching any CAD system in general.
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Zhang, Kai, Xing Jian Dai, and Xiao Zhang Zhang. "Designs of Eddy Current Sensor Probes Based on Multilayer Printed Circuit Board Technology." Applied Mechanics and Materials 190-191 (July 2012): 801–5. http://dx.doi.org/10.4028/www.scientific.net/amm.190-191.801.

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Probe characteristics are important for eddy current displacement sensors. Probes made by multilayer printed circuit board (PCB) are good at maintaining quality consistency and their axial length was short. As design principles for wired probes were not suitable for PCB probes, an analysis and design method for them was developed. In this paper, PCB probe characteristics were first analyzed with 3D eddy current field FEM software. The process was time-consuming. To increase analysis efficiency, a simplified 2D axial symmetry model was used to replace the 3D model. The analysis results were compared and their difference was small. The probe resister and inductance were compared with measurement result of a test PCB probe and they agreed well. Based on 2D model, a series of analysis was performed and basic design principles for PCB probes were obtained. Based on the principles, a new PCB probe with better performance was designed.
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Raut, Pratik. "Design and Implementation of PCB Prototyping using CNC Machine." International Journal for Research in Applied Science and Engineering Technology 7, no. 5 (May 31, 2019): 4086–90. http://dx.doi.org/10.22214/ijraset.2019.5690.

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Raut, Pratik. "Design and Implementation of PCB Prototyping using CNC Machine." International Journal for Research in Applied Science and Engineering Technology 7, no. 3 (March 31, 2019): 806–11. http://dx.doi.org/10.22214/ijraset.2019.3140.

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Lee, Sang-Hyuk, and Sun-Kyoung Kim. "Optimal Design of Dummy Patterns for Minimizing PCB Warpage." Transactions of the Korean Society of Mechanical Engineers A 33, no. 6 (June 1, 2009): 577–83. http://dx.doi.org/10.3795/ksme-a.2009.33.6.577.

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Shen, Yanfeng, Huai Wang, and Frede Blaabjerg. "Thermal resistance modelling and design optimization of PCB vias." Microelectronics Reliability 88-90 (September 2018): 1118–23. http://dx.doi.org/10.1016/j.microrel.2018.07.028.

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