Log in

Relevant bibliographies by topics / Phenolic molding compound / Journal articles

To see the other types of publications on this topic, follow the link: Phenolic molding compound.

Journal articles on the topic 'Phenolic molding compound'

Author: Grafiati

Published: 4 June 2021

Last updated: 5 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 24 journal articles for your research on the topic 'Phenolic molding compound.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Srebrenkoska, Vineta, Gordana Bogoeva-Gaceva, and Dimko Dimeski. "Composite material based on an ablative phenolic resin and carbon fibers." Journal of the Serbian Chemical Society 74, no. 4 (2009): 441–53. http://dx.doi.org/10.2298/jsc0904441s.

Full text

Abstract:

In this study, a technological procedure for the production of a molding compound based on short carbon fibers and an ablative phenol-formaldehyde resin for high temperature application was optimized. The starting raw materials were characterized and molding compounds with different fiber/ /matrix ratios and different fiber lengths were obtained. From the different laboratory samples, molded parts were made by thermo-compression. The basic mechanical and thermal properties of the composites were determined. From the obtained results, the optimal fiber/matrix ratio was determined for a production of molding compound for high temperature application. The molding process of the composite material was optimized and all the parameters for good mechanical properties and high thermal stability of the composite were obtained. Optimization of the composite molding process was performed by the application of a numerical method for a planned experiment, i.e., a full three-factorial experimental design with variance of all three parameters (fiber length, temperature and time of the press cycle) on two levels. The obtained mechanical properties (flexural strength: 247 MPa, modulus: 27.6 GPa, impact resistance: 110 (for test moldings 10 mm?10 mm) and 91 kJ/m2 (for test moldings 15 mm?15 mm)) justified the application of this composite material in the automotive, leisure, military and other industries where high temperature resistance and high mechanical strength is required.

APA, Harvard, Vancouver, ISO, and other styles

2

Qi-lin, Mei, Yan Shi-lin, and Huang Zhi-xiong. "Numerical simulation of phenolic sheet molding compound in compression molding." Journal of Wuhan University of Technology-Mater. Sci. Ed. 18, no. 2 (June 2003): 79–81. http://dx.doi.org/10.1007/bf02838810.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Guo, Jie, Jia Li, Qunli Rao, and Zhenming Xu. "Phenolic Molding Compound Filled with Nonmetals of Waste PCBs." Environmental Science & Technology 42, no. 2 (January 2008): 624–28. http://dx.doi.org/10.1021/es0712930.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Horie, Masayoshi, Eiji Funatsu, Masahiro Mitsui, and Etsuji Ohno. "High Cycle Injection Molding of Phenolic Compound by Newly Designed Screw." Seikei-Kakou 9, no. 8 (1997): 612–15. http://dx.doi.org/10.4325/seikeikakou.9.612.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Bernardeau, Fabien, Didier Perrin, Anne-Sophie Caro, Jean-Charles Benezet, and Patrick Ienny. "Valorization of waste thermoset material as a filler in thermoplastic: Mechanical properties of phenolic molding compound waste-filled PP composites." Journal of Applied Polymer Science 135, no. 12 (November 27, 2017): 45849. http://dx.doi.org/10.1002/app.45849.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Guo, Jie, Qunli Rao, and Zhenming Xu. "Effects of particle size of fiberglass–resin powder from PCBs on the properties and volatile behavior of phenolic molding compound." Journal of Hazardous Materials 175, no. 1-3 (March 2010): 165–71. http://dx.doi.org/10.1016/j.jhazmat.2009.09.144.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Haberstroh, E., J. Berthold, and T. Jüntgen. "Injection-Compression Molding of Glass-Fiber Filled Phenolic Molding Compounds." Advanced Engineering Materials 2, no. 11 (November 2000): 752–56. http://dx.doi.org/10.1002/1527-2648(200011)2:11<752::aid-adem752>3.0.co;2-m.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Zhou, Wen Fu, Yan Qian He, and Ye Yong Yan. "Study of Mechanical Properties of High Quality Phenolic Molding Compounds." Advanced Materials Research 512-515 (May 2012): 1716–25. http://dx.doi.org/10.4028/www.scientific.net/amr.512-515.1716.

Full text

Abstract:

Currently, there are many unresolved issues to produce high quality phenolic molding compounds (PMC), which are widely used in many industry sectors. In this paper, we design a new approach to resolve some issues, and produce high quality PMC from phenolic resins, fillers, curing agents, and modified fiberglass by silane coupling agents. The preparation processes and the mechanical properties of the newly prepared PMC are studied extensively, and typical composite properties are: volume resistivity of 2.4×1013Ω.cm, surface resistivity of 3.9×1013Ω.cm, impact strength of 2.65KJ/m2, bending strength of 95.9MPa, electric strength of 12.28mv, heat deflection temperature of 240°C, fluidity of 0.26mm, electric strength of 12.28mv, specific gravity of 1.661g/mL. Compared with currently used approaches, our approach can produce PMC with better overall performance and lower costs. This paper has two contributions, one is to propose and test a new approach for producing high quality PMC, and another is that we made a high quality PMC material with low costs.

APA, Harvard, Vancouver, ISO, and other styles

9

Chaiwan, Pattarakamon, and Jantrawan Pumchusak. "The Synergistic Effects of Multi-Filler Addition on the Mechanical and Thermo-Mechanical Properties of Phenolic Resins." Materials Science Forum 940 (December 2018): 23–27. http://dx.doi.org/10.4028/www.scientific.net/msf.940.23.

Full text

Abstract:

The effects of the carbon fiber (CF), carbon black (CB) and nanosilica (SiO2) on the mechanical properties of the phenolic resin (PF) were studied and the optimum composition was selected for the preparation of quaternary composites (CF/CB/SiO2 phenolic composites). The incorporation of poly (acrylonitrile-co-butadiene) rubber (NBR) to strengthen the quaternary composites were also studied. The morphological, mechanical and thermo-mechanical properties of unmodified and NBR modified-quaternary phenolic composites were investigated. The phenolic compounds were mixed by ball milling and the phenolic composites were fabricated by hot compression molding. Scanning electron microscopy images of NBR modified-quaternary phenolic composites show the high fracture surface roughness. The results show that the addition of 5 wt% NBR in the quaternary composites offer the highest tensile strength and Young’s modulus which are significantly improved by 176% and 235%, respectively, and they also offer the high flexural strength, impact strength and flexural modulus which are improved by 79%, 29% and 12%, respectively, compared to neat PF. The glass transition temperature (Tg) of unmodified and NBR modified-quaternary phenolic composites are higher than that of neat PF (107.3 °C). The increase of NBR content does not deteriorate Tg of the quaternary phenolic composites. This study provides a new pathway for making advanced phenolic composites.

APA, Harvard, Vancouver, ISO, and other styles

10

Caro, A. S., F. Bernardeau, D. Perrin, R. Leger, J. C. Benezet, and P. Ienny. "Computational modelling of void growth in Phenolic Molding Compounds filled PolyPropylene from optical measurements." Polymer Testing 71 (October 2018): 209–16. http://dx.doi.org/10.1016/j.polymertesting.2018.09.008.

Full text

APA, Harvard, Vancouver, ISO, and other styles

11

Han, Changgue, Haneol Kim, and Byeonguk Nam. "A Study of the Property Effect of Phenolic Molding Compounds by the Modified Phenol Resins." Transaction of the Korean Society of Automotive Engineers 28, no. 4 (April 1, 2020): 265–70. http://dx.doi.org/10.7467/ksae.2020.28.4.265.

Full text

APA, Harvard, Vancouver, ISO, and other styles

12

Bobrowski, A., S. Żymankowska-Kumon, D. Drożyński, B. Grabowska, and K. Kaczmarska. "TG/DTG/DTA, FTIR and GC/MS Studies of Oil Sand for Artistic and Precision Foundry with the Emission of Gases Assessment." Archives of Foundry Engineering 17, no. 4 (December 20, 2017): 25–30. http://dx.doi.org/10.1515/afe-2017-0125.

Full text

Abstract:

AbstractThe paper presents the results of thermoanalytical studies by TG/DTG/DTA, FTIR and GC/MS for the oil sand used in art and precision foundry. On the basis of course of DTG and DTA curves the characteristic temperature points for thermal effects accompanying the thermal decomposition reactions were determined. This results were linked with structural changes occurred in sample. It has been shown that the highest weight loss of the sample at temperatures of about 320°C is associated with destruction of C-H bonds (FTIR). In addition, a large volume of gases and high amounts of compounds from the BTEX group are generated when liquid metal interacts with oil sand. The results show, that compared to other molding sands used in foundry, this material is characterized by the highest gaseous emissions and the highest harmfulness, because benzene emissions per kilogram of oil sand are more than 7 times higher than molding sand with furan and phenolic binders and green sand with bentonite and lustrous carbon carrier.

APA, Harvard, Vancouver, ISO, and other styles

13

Šahinović, Adis, and Branka Mušič. "Improvement of the Mechanical Properties of Thermosetting-Binding-System-Based Composites by Means of Kneading Procedure Modification and Composite Formulation." Processes 8, no. 5 (May 23, 2020): 625. http://dx.doi.org/10.3390/pr8050625.

Full text

Abstract:

By understanding the effects of the physical properties of individual input materials (e.g., binding system) on the physical and thermal properties of a composite material, the latter can be engineered in advance according to the desired properties and application. Often, a need to replace a specific component in a composite material arises, due to various reasons such as high raw material prices, product price reduction, environmental issues, improvement of properties, and others. In this study, we focused on the substitution of a phenolic novolac resin binding system and the reduction of compounding process temperature in combination with material throughput and screw speed variation of a phenolic-novolac-resin-based composite material, manufactured by kneading process using a co-kneader single screw extruder. Modifications were carried out in the interest of reducing production process cost and positive environmental effect due to reduction of energy consumption in the compounding process. We achieved great success in improvement of mechanical properties with all four substituted phenolic molding compounds (PMCs), while the decrease in thermal stability was the lowest for PMCs prepared at higher screw speeds and material throughput. The results indicated that higher screw speeds produce the best combination of mechanical and thermal properties of PMCs.

APA, Harvard, Vancouver, ISO, and other styles

14

Yang, Ming Shan, Lin Kai Li, and Jian Guo Zhang. "Plasma Surface Modification of Silica and its Application in Epoxy Molding Compounds for Large-Scale Integrated Circuits Packaging." Advanced Materials Research 158 (November 2010): 184–88. http://dx.doi.org/10.4028/www.scientific.net/amr.158.184.

Full text

Abstract:

The surface modification of silica for epoxy molding compounds (EMC) was conducted by plasma polymerization using RF plasma (13.56MPa), and the modification factors such as plasma power, gas pressure and treatment time were investigated systematically in this paper. The monomers utilized for the plasma polymer coatings were pyrrole, 1,3-diaminopropane, acrylic acid and urea. The plasma polymerization coating of silica was characterized by FTIR, contact angle. Using the silica treated by plasma as filler, ortho-cresol novolac epoxy as main resin, novolac phenolic-formaldehyde resin as cross-linking agent and 2-methylmizole as curing accelerating agent, the EMCs used for the packaging of large-scale integrated circuits were prepared by high-speed pre-mixture and twin roller mixing technology. The results have shown that the surface of silica can be coated by plasma polymerization of pyrrole, 1,3-diaminopropane, acrylic acid and urea, and the comprehensive properties of EMC were improved.

APA, Harvard, Vancouver, ISO, and other styles

15

Scheffler, Thomas, Sascha Englich, Ulrich Heyne, and Michael Gehde. "Effects of post-curing on the thermo-mechanical behavior and the chemical structure of highly filled phenolic molding compounds." Materials Testing 58, no. 1 (January 5, 2016): 56–62. http://dx.doi.org/10.3139/120.110810.

Full text

APA, Harvard, Vancouver, ISO, and other styles

16

Landi, V. R., and J. M. Mersereau. "The glass transition in novolac phenolic molding compounds and the kinetics of its development during cure and postcure. I." Advances in Polymer Technology 7, no. 1 (1987): 49–57. http://dx.doi.org/10.1002/adv.1987.060070106.

Full text

APA, Harvard, Vancouver, ISO, and other styles

17

Landi, Vincent R. "The glass transition in novolac phenolic molding compounds and the kinetics of its development during cure and postcure. II." Advances in Polymer Technology 7, no. 2 (1987): 209–18. http://dx.doi.org/10.1002/adv.1987.060070210.

Full text

APA, Harvard, Vancouver, ISO, and other styles

18

Li, Mi Dan, Shou Bin Wei, Huan Niu, and Hong Yang. "Effect of Ratio of Copper Fiber/Copper Powder on Electrical Conductivity and Hardness of Copper/Graphite/Phenolic Resin Composites." Advanced Materials Research 457-458 (January 2012): 11–14. http://dx.doi.org/10.4028/www.scientific.net/amr.457-458.11.

Full text

Abstract:

Composites made of phenolic resin filled with graphite platelets and copper particles (copper powder, copper fiber or both mixture), are fabricated by mechanical mixing, followed by compression molding. SEM micrograph indicates that the fillers are homogenously dispersed in composite. The electrical conductivity of composite composed of 30 wt% resin, 50 wt% graphite and 20 wt% copper particle (10/10 wt/wt copper powder/copper fiber) is up to 65S/cm. The efficiency of copper fiber is compared with copper powder. The results show that copper fiber is more effective than copper powder in improving electrical conductivity for copper homogenously dispersed composite. The particle shape is also a principal factor in influencing hardness. In this study, the hardness of composites tends to increase with decreasing the ratio of copper fiber/copper powder.

APA, Harvard, Vancouver, ISO, and other styles

19

Franieck, Erick, Martin Fleischmann, Ole Hölck, Larysa Kutuzova, and Andreas Kandelbauer. "Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis." Polymers 13, no. 11 (May 26, 2021): 1734. http://dx.doi.org/10.3390/polym13111734.

Full text

Abstract:

We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.

APA, Harvard, Vancouver, ISO, and other styles

20

Velázquez-Contreras, Friné, Nelsy García-Caldera, José Daniel Padilla de la Rosa, Domingo Martínez-Romero, Estrella Núñez-Delicado, and José Antonio Gabaldón. "Effect of PLA Active Packaging Containing Monoterpene-Cyclodextrin Complexes on Berries Preservation." Polymers 13, no. 9 (April 26, 2021): 1399. http://dx.doi.org/10.3390/polym13091399.

Full text

Abstract:

Blackberries and raspberries are highly perishable and fragile products, which limits their shelf life. The effect of biodegradable active packaging of blackberries and raspberries containing 2.5% and 5.0% weight (wt%) of thymol or carvacrol complexed in β-cyclodextrins (β-CDs), successively added to poly (lactic acid) (PLA), and melt-processed by injection molding was evaluated under stored conditions at 4 °C for 21 days, using as reference commercial clamshell and PLA package control samples. Thus, physicochemical, headspace, microbiological, and sensory quality studies were carried out in order to compare the efficacy of the different packages. Concerning weight loss, color, and total phenolic and soluble solids content, significant differences were detected when compared with commercial clamshell packaging. The results show that the PLA packages containing thymol and carvacrol complexes maintained the color, weight, and phenolic content of berries until day 21, with a score up to 45% better compared to commercial clamshell. The headspace analysis detected 101 mg L−1 (ppm) of thymol and 35 ppm of carvacrol on the first day of refrigeration; these concentrations decreased with time. This release mechanism of carvacrol and thymol into the PLA package modified the initial atmosphere composition. After 21 days of storage, the berries had 4.25 degrees of acceptance, without adverse perception of aroma or flavor for both carvacrol and thymol compounds. A general microbial inhibition was observed for yeast and molds, which increased with the concentration of monoterpene in PLA packages, and showed an inhibition of 3.5 log units for PLA packages containing thymol, and of 3 log units for those containing carvacrol. Overall results show that PLA/β-CD-thymol 5.0% packages prolonged raspberries’ and blackberries’ shelf life by one more week at 4 °C, compared with commercial clamshell packaging.

APA, Harvard, Vancouver, ISO, and other styles

21

Dong, Hua, Greg Prokopowicz, Bob Barr, Joe Lachowski, Jeff Calvert, Mike Gallagher, Tina Aoude, et al. "Self Priming Low Stress Aqueous Developable Benzocyclobutene (AD-BCB) Photodielectric Materials for Advanced Wafer Level Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 000679–97. http://dx.doi.org/10.4071/2015dpc-tp26.

Full text

Abstract:

As the semiconductor industry drives to more functionality in smaller and lighter devices, it requires new materials to meet the changing requirements of new and more advanced chip designs and packaging solutions. Photoimagable polymeric dielectric materials are a key building block for wafer level packaging (WLP); these include polyimide (PI), polybenzoxazole (PBO), acrylics, silicones, epoxy-phenolics and benzocyclobutene (BCB). Because of low copper diffusion, low temperature curing, high reliability and low moisture adsorption, BCB was the platform chosen for modification. In this work, we will focus on the development of self priming, low stress, aqueous developable version of BCB, known as AD-BCB. This new photodielectric material has improved mechanical properties of <25MPa film stress value and >28% elongation while maintaining good post develop and post cure adhesion on various substrates including silicon, silicon oxide, silicon nitride, copper, aluminum and epoxy molding compound. Elongation is significantly increased for this positive tone, aqueous developable, photodielectric materials, while film stress and wafer bow are significantly reduced. In addition, this new formulation is self priming and does not require a spin-on adhesion promoter. The material can be cured at as low as 200 °C with lithographic feature size of <10 μm and dielectric constant of 3.0.

APA, Harvard, Vancouver, ISO, and other styles

22

Kumykov, Ruslan M., and Aslan A. Kyarov. "SYNTHESIS AND INVESTIGATION OF PROPERTIES OF POLYETHERNAFLUYLENEBENZIMIDAZOLES USING REACTION OF NUCLEOPHILIC POLYNITRO-SUBSTITUTION." IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA KHIMICHESKAYA TEKHNOLOGIYA 62, no. 10 (October 29, 2019): 61–69. http://dx.doi.org/10.6060/ivkkt.20196210.5994.

Full text

Abstract:

Soluble polyethernaftoylenbenzimidazoles (PENBI) not previously described are obtained by reacting bis (nitronaphthoylenbenzimidazole) arylene with bisphenols using nucleophilic polynitrosubstitution reaction. The synthesis conditions and the influence of the introduced "bridge" flexible ether, dichloroethylene and carbonyl groups between the phenyl cores of the central fragments of macromolecules on the solubility, thermal and strength properties of the synthesized polymers were studied. Improving melting and solubility (PENBI) without a significant effect on the thermal and strength characteristics is achieved by introducing naphthylamide cycles into them, in combination with flexible bridging fragments into macromolecules of target polymers. The initial bis (nitronaphthoylenbenzimidazole) arylenes were obtained on the basis of (3 or 4-nitronaphthalic anhydride) and bis (o-phenylene diamines), which are derivatives of chloral. In this aspect, the bis (o-phenylenediamine) and bis (nitronaphthoylenenbenzimidazole) arylenes synthesized by us are unique, both in terms of availability of raw materials and price. Bis (nitronaphthoylenbenzimidazole) arylenes were obtained by the interaction of two moles (3 or 4-nitronaphthalic anhydride) with one mole of bis (o-phenylenediamine) under conditions of high-temperature catalytic cyclocondensation in organic solvents. All reactions of the synthesis of bis (nitronaphthoylenbenzimidazole) arylene proceeded homogeneously and resulted in well-cyclized dinitro compounds. As a comonomer of bis (nitronaphtho-ylenbenzimidazole) arylenes, bis-phenols containing also flexible “bridge” groups between phenyl nuclei were used in the synthesis of polyethernaphthoylenbenzimidazoles. The synthesis of polyethernaphthoylenebenzimidazoles was carried out by the interaction of bis (3 or 4-nitronaphthylenebenzimidazole) arylenes with bis-phenols under mild conditions in dimethyl sulfoxide or its mixture with toluene at a temperature of 70 ° C for 2 h in an absolutely dry environment. The obtained composite polymers were well soluble in dipolar aprotic solvents and had a rather wide interval between the temperatures of active destruction and softening temperatures (~ 250-260 ° С). Analysis of the primary thermal characteristics of the obtained polymers showed that they are characterized by relatively high temperatures of destruction (510-550 ºС). Polyethernaphthoylenebenzimidazoles are amorphous: this fact, combined with the presence in the macromolecules of a large number of flexible and “hinged” groups, determine their increased solubility in chlorinated and phenolic solvents. The significant difference between the softening temperature and the temperature of active destruction determines the possibility of their processing into products by injection molding. An analysis of the fire resistance of polymers showed that the highest oxygen index is for polymers, where macromolecules contain more dichloroethylene groups (KI = 62), and the lowest - for polymers with a high oxygen content (OI = 38.3).

APA, Harvard, Vancouver, ISO, and other styles

23

"The phenolic molding compound for flashless injection molding Hidemi Yazawa, Masaei Yamada (Sumitomo Bakelite Co., Ltd.)." JSAE Review 17, no. 4 (October 1996): 442. http://dx.doi.org/10.1016/s0389-4304(96)80560-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

24

Maertens, Robert, Annalena Hees, Ludwig Schöttl, Wilfried Liebig, Peter Elsner, and Kay André Weidenmann. "Fiber shortening during injection molding of glass fiber-reinforced phenolic molding compounds: fiber length measurement method development and validation." Polymer-Plastics Technology and Materials, January 4, 2021, 1–14. http://dx.doi.org/10.1080/25740881.2020.1867170.

Full text

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!