Dissertations / Theses on the topic 'Photonic Crystal Integrated Circuits'
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Chong, Harold Meng Hoon. "Photonic crystal and photonic wire structures for photonic integrated circuits." Thesis, University of Glasgow, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.407719.
Full textZhu, Rui. "Integrated nano-optomechanics in photonic crystal." Thesis, Université Paris-Saclay (ComUE), 2019. http://www.theses.fr/2019SACLS258/document.
Full textHigh purity reference oscillators are currently used in a wide variety of frequency control and timing applications including radar, GPS, space... Current trends in such fields call for miniaturized architectures with direct signal generation in the frequency range of interest, around few GHz. Recently, novel optomechanically-enhanced architectures have emerged with this purpose. Such optomechanically-driven oscillators not only generate microwave signals directly in the GHz frequency range with possibly low phase noise but also are amenable to a high degree of integration on single chip settings. This PhD work falls within this scope. The optomechanically-driven oscillator under study consists of suspended photonic crystal cavities coupled to integrated silicon-on-insulator waveguides in a three-dimensional architecture. These cavities harbor highly-confined optical modes around 1,55 µm and mechanical modes in the GHz and most importantly, feature a high phonon-photon spatial overlap, all resulting in an enhanced optomechanical coupling. This enhanced optomechanical coupling strength is here probed optically on photonic crystal structures with optimized design. These cavities are hosted in III-V semiconductor materials whose piezoelectricity enable us to integrate additional tools for probing and controlling mechanical vibrations via capacitive, piezoelectric or acoustic driving. This full control over the mechanical modes and optomechanical interaction, paves the way towards the implementation of integrated injection locking circuits of feedback loops for reducing the phase noise of the oscillator
Mekis, Attila 1972. "Theoretical design of photonic crystal devices for integrated optical circuits." Thesis, Massachusetts Institute of Technology, 2000. http://hdl.handle.net/1721.1/9125.
Full textIncludes bibliographical references (p. 139-143).
In this thesis we investigate novel photonic crystal devices that can be used as building blocks of all-optical circuits. We contrast the behavior of light in photonic crystal systems and in their traditional counterparts. We exhibit that bends in photonic crystals are able to transmit light with over 90% efficiency for large bandwidths and with 100% efficiency for specific frequencies. In contrast to traditional waveguides, bound states in photonic crystal waveguides can also exist in constrictions and above the cutoff frequency. We discuss how to lower reflections encountered when photonic crystal waveguides are terminated, both in an experimental setup as well as in numerical simulations. We show that light can be very efficiently coupled into and out of photonic crystal waveguides using tapered dielectric waveguides. In time-domain simulations of photonic crystal waveguides, spurious reflections from cell edges can be eliminated by terminating the waveguide with a Bragg reflector waveguide. We demonstrate novel lasing action in two-dimensional photonic crystal slabs with gain media, where lasing occurs at saddle points in the band structure, in contrast to one-dimensional photonic crystals. We also design a photonic crystal slab with organic gain media that has a TE-like pseudogap. We demonstrate that such a slab can support a high-Q defect mode, enabling low threshold lasing, and we discuss how the quality factor depends on the design parameters. We also propose to use two dimensional photonic crystal slabs as directionally efficient free-space couplers. We draft methods to calculate the coupling constant both numerically and analytically, using a finite-difference time-domain method and the volume current method with a Green's function approach, respectively.
by Attila Mekis.
Ph.D.
Schillinger, Matthias. "Maximally localized photonic Wannier functions for the highly efficient description of integrated Photonic Crystal circuits." [S.l. : s.n.], 2006. http://digbib.ubka.uni-karlsruhe.de/volltexte/1000007183.
Full textLin, Chunchen. "Semiconductor-based nanophotonic and terahertz devices for integrated circuits applications." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file 7.48 Mb., 180 p, 2006. http://wwwlib.umi.com/dissertations/fullcit/3221130.
Full textReinke, Charles M. "Design, simulation, and characterization toolset for nano-scale photonic crystal devices." Diss., Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/33932.
Full textMulot, Mikaël. "Two-Dimensional Photonic Crystals in InP-based Materials." Doctoral thesis, KTH, Microelectronics and Information Technology, IMIT, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3751.
Full textPhotonic crystals (PhCs) are structures periodic in thedielectric constant. They exhibit a photonic bandgap, i.e., arange of wavelengths for which light propagation is forbidden.Engineering of defects in the PhC lattice offers new ways toconfine and guide light. PhCs have been manufactured usingsemiconductors and other material technologies. This thesisfocuses on two-dimensional PhCs etched in InP-based materials.Only recently, such structures were identified as promisingcandidates for the realization of novel and advanced functionsfor optical communication applications.
The primary focus was on fabrication and characterization ofPhC structures in the InP/GaInAsP/InP material system. Thedemands on fabrication are very high: holes as small as100-300nm in diameter have to be etched at least as deep as 2µm. Thus, different etch processes had to be explored andspecifically developed for InP. We have implemented an etchingprocess based on Ar/Cl2chemically assisted ion beam etching (CAIBE), thatrepresents the state of the art PhC etching in InP.
Different building blocks were manufactured using thisprocess. A transmission loss of 10dB/mm for a PhC waveguide, areflection of 96.5% for a 4-row mirror and a record qualityfactor of 310 for a 1D cavity were achieved for this materialsystem. With an etch depth of 4.5 µm, optical loss wasfound to be close to the intrinsic limit. PhC-based opticalfilters were demonstrated using (a) a Fabry-Pérot cavityinserted in a PhC waveguide and (b) a contra-directionalcoupler. Lag effect in CAIBE was utilized positively to realizehigh quality PhC taper sections. Using a PhC taper, a couplingefficiency of 70% was demonstrated from a standard ridgewaveguide to a single line defect PhC waveguide.
During the course of this work, InP membrane technology wasdeveloped and a Fabry-Pérot cavity with a quality factorof 3200 was demonstrated.
Keywords:photonic crystals, photonic bandgap materials,indium phosphide, dry etching, chemically assisted ion beametching, reactive ion etching, electron beam lithography,photonic integrated circuits, optical waveguides, resonantcavities, optical filtering, finite difference time domain,plane wave expansion.
Nagy, Jonathan Tyler. "Periodic Poling of Lithium Niobate Thin Films for Integrated Nonlinear Optics." The Ohio State University, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=osu1587673156665861.
Full textLou, Fei. "Design, fabrication and characterization of plasmonic components based on silicon nanowire platform." Doctoral thesis, KTH, Optik och Fotonik, OFO, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-143953.
Full textQC 20140404
Neto, Hugo Daniel Barbosa. "Packaging of photonic integrated circuits." Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23552.
Full textWith the continuous evolution of optical communication systems, emerged a need for high-performance optoelectronic elements at lower costs. Photonic packaging plays a key role for the next-generation of optical devices. In this work a standard packaging design rules is described, covering both the electrical and optical-packaging exploring both active and passive adjusting techniques, as well as the thermal management of the photonic integrated circuit (PIC). First a process for fiber-to-chip coupling with custom made ball-lensed fibers, is performed and tested initially in a testing-chip and thereafter in a manufactured practical study-case composed by a silicon holder with an InP distributed feedback (DFB) laser. The process of manufacturing etched V-grooves for fiber alignment is approached in detail. After this, for electrical interconnects and radio frequency (RF) packaging, both wire-bonding and flip-chip technique are discussed, and a characterization of the s-parameters in a PIC with wire-bonding is presented. A technique based on ruthenium-based sensors and platinum and titanium-based sensors for thermal control of the PIC is studied and the tested using a custom made PCB designed exclusively for that purpose.
Com a constante evolução dos sistemas de comunicação óticos veio a necessidade de componentes optoelectrónicos de elevada performance a custos relativamente baixos. O encapsulamento ótico tem um papel chave nos dispositivos óticos de última geração. Neste trabalho são descritas as regras de um processo de encapsulamento padrão, que abrange tanto o encapsulamento elétrico e ótico onde são exploradas técnicas de ajustamento ativas e passivas bem como o controlo térmico do circuito ótico integrado (PIC). No início foi efetuado um processo de acoplamento da fibra ao chip com fibras de lente esférica personalizadas, numa primeira usando um chip de teste e de seguida num caso de estudo prático que consiste numa estrutura composta por um holder de silício com um laser de realimentação distribuída (DFB). É abordado em detalhe o processo de fabricação de V-grooves para o alinhamento da fibra com o chip. De seguida são apresentadas e discutidas as técnicas de wire-bonding e flip-chip para o encapsulamento elétrico e ligação dos conectores de radiofrequência (RF), é feito um estudo onde são apresentados os resultados da caraterização dos parâmetros S de um PIC com wire-bonding. Para o controlo térmico do módulo é apresentada uma técnica baseada em sensores de temperatura de ruténio e sensores de Platina e titânio testada numa PCB personalizada
Yang, Gang. "Compact Photonic Integrated Passive Circuits." Thesis, The University of Sydney, 2021. https://hdl.handle.net/2123/26958.
Full textTai, Chao-Yi. "Tantalum pentoxide waveguides for photonic crystal circuits." Thesis, University of Southampton, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.409900.
Full textMarinins, Aleksandrs. "Polymer Components for Photonic Integrated Circuits." Doctoral thesis, KTH, Skolan för teknikvetenskap (SCI), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-219556.
Full textQC 20171207
Alipour, Motaallem Seyed Payam. "Reconfigurable integrated photonic circuits on silicon." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/51792.
Full textRodrigues, Carla Iolanda Costa. "Photonic integrated circuits for NG-EPON." Master's thesis, Universidade de Aveiro, 2016. http://hdl.handle.net/10773/22732.
Full textAlong with privacy and security, the growth of demand from the consumer for higher bandwidth presents one of the most important modern challenges in telecommunications infrastructures. The researchers were encouraged to nd not only e cient but also the economically viable solutions capable of meeting the growing needs of the consumer. Optical communications are the way that can accompany this growth. The Passive Optical Network (PON) is an architecture that shares the ber bandwidth among several users. There has been a constant study under this topic for the purpose of using all the ber abilities and to nd new solutions to keep the access network simple. Photonic Integrated Circuits (PICs) are a technology that emerged to help the complexity of the hardware that exists nowadays. It is a single chip capable of integrating numerous optical components, which leads to a reduced complexity, size and power consumption. These are the important characteristics that make the PICs a powerful tool to use in several applications. This dissertation presents a monolithic PIC transceiver in the context of Next Generation of Ethernet Passive Optical Network (NG-EPON) which aims to design and implement integrated optical circuits for future access networks. The transceiver architecture is able to be used as an Optical Network Unit (ONU) with a 4 channels approach for 100 Gb/s solutions. The present work contributed for the FUTPON project supported by P2020.
Em par com a privacidade e segurança, a crescente procura do consumidor por maiores larguras de banda apresenta um dos mais importantes desafios modernos das infraestruturas de telecomunicações. Esta procura incentiva assim a investigação de novas soluções não são eficientes, mas também economicamente viáveis, capazes de satisfazer as crescentes necessidades do consumidor. As comunicações óticas apresentam ser o meio apropriado para acompanhar este crescimento. A Rede Óptica Passiva (PON) e uma arquitectura usada para distribuição de fibra ótica ate ao consumidor final. Esta tecnologia permite dividir a largura de banda de uma única fibra por diferentes clientes. Tem havido um estudo constante no âmbito deste tópico para conseguir tirar máximo partido das capacidades da fibra e de modo a encontrar novas soluções para tornar este método mais simples. Os Circuitos Oticos Integrados (PIC) sao uma tecnologia que surge para ajudar na complexidade do hardware existente hoje em dia. Consiste num único chip capaz de integrar vários componentes óticos, o que leva a uma diminuição da complexidade, tamanho e redução do consumo de energia. Estas características fazem com que seja uma tecnologia vantajosa para uso em diferentes aplicações. O desenho e a implementação da arquitectura do transrecetor em formato PIC no contexto da Next Generation of Ethernet Passive Optical Network (NG-EPON), e o principal objectivo desta dissertação onde visa o desenvolvimento circuitos óticos integrados para redes oticas de acesso futuras. Esta arquitectura devera ser utilizada como Optical Network Unit (ONU) contendo 4 canais para atingir 100 Gb/s. Este trabalho contribuiu para o projecto FUTPON suportado pelo P2020.
Liu, Weilin. "Ultra-Fast Photonic Signal Processors Based on Photonic Integrated Circuits." Thesis, Université d'Ottawa / University of Ottawa, 2017. http://hdl.handle.net/10393/36446.
Full textWilliams, Ryan Daniel. "Photonic integrated circuits for optical logic applications." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/42025.
Full textThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Includes bibliographical references.
The optical logic unit cell is the photonic analog to transistor-transistor logic in electronic devices. Active devices such as InP-based semiconductor optical amplifiers (SOA) emitting at 1550 nm are vertically integrated with passive waveguides using the asymmetric twin waveguide technique and the SOAs are placed in a Mach-Zehnder interferometer (MZI) configuration. By sending in high-intensity pulses, the gain characteristics, phase-shifting, and refractive indices of the SOA can be altered, creating constructive or deconstructive interference at the MZI output. Boolean logic and wavelength conversion can be achieved using this technique, building blocks for optical switching and signal regeneration. The fabrication of these devices is complex and the fabrication of two generations of devices is described in this thesis, including optimization of the mask design, photolithography, etching, and backside processing techniques. Testing and characterization of the active and passive components is also reported, confirming gain and emission at 1550 nm for the SOAs, as well as verifying evanescent coupling between the active and passive waveguides. In addition to the vertical integration of photonic waveguides, Esaki tunnel junctions are investigated for vertical electronic integration. Quantum dot formation and growth via molecular beam epitaxy is investigated for emission at the technologically important wavelength of 1310 nm. The effect of indium incorporation on tunnel junctions is investigated. The tunnel junctions are used to epitaxially link multiple quantum dot active regions in series and lasers are designed, fabricated, and tested.
by Ryan Daniel Williams.
Ph.D.
Franco, Eduardo Vala. "Photonic integrated circuits for next generation PONs." Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23473.
Full textWe are living in a time where communications became essential for most of our lives, whether it's in the business world, or in our own homes. The increasing need of higher bandwidth inhibits other networks other than optical ber based ones. Nowadays communications are responsible for a substantial percentage of our energetic footprint, hence Passive Optical Network(PON) are a strong contender for the next step of network implementation. These networks present a low energy consumption because between the transmitter and the receiver the signal stays in the optical domain. Although the increasing needs of bandwidth is almost across the communication world, certain services/identities need more bandwidth whether is download or upload. It's easy to understand that di erent consumers have unique needs. It's necessary to develop an architecture that serves all the costumers, in other words, there is a need for a network that provides high bitrate tra c to the users that needs it but also a network that serves the low end user that is not interested in this increase of bandwidth and therefore price in ation. There is today technologies yet to be widely implemented like NG-PON2 that were not implemented in a large scale because they dont represent a nancial return to the telecom operators simply because there is not enough user that requires the high bandwidth delivered by NG-PON2. It's necessary to nd a solution that includes not only the modern technologies but also the already implemented ones. With the objective of nding a solution for the problems mentioned before, this dissertation has the objective of designing a Photonic Integrated Circuit(PIC) that aims to be a transceiver of a Multitech Network that will be composed by the following technologies: Video-Overlay, XG-PON e NG-PON2. This dissertation presents an approach on Passive Optical Networks( PON) and the standards of the said technologies as well as a study of the components needed to assemble the transceiver using the programs ASPIC and VPI Photonics . In the end, there will be presented an architecture for the transceiver to be used in a Optical Network Unit(ONU), and the respective mask Layout.
Vivemos numa época em que as comunicações se tornaram essenciais para grande parte da nossa vida, seja no mundo empresarial, seja nas nossas habitações. A crescente necessidade de aumento de largura de banda inviabiliza outras redes que não baseadas em braotica. Actualmente as comunicações são responsáveis por uma percentagem substancial dos nossos gastos energéticos, justamente por este facto Passive Optical Networks(PON) sao as principais candidatas ao próximo passo no desenvolvimento de redes. Estas apresentam menor consumo energético, pois entre o emissor e o receptor todo o sinal permanece no domínio óptico. Apesar da necessidade de largura de banda estar a aumentar de um modo transversal no mundo das telecomunicações, certos serviços/entidades necessitam de maiores velocidades tanto em termos de download como em termos de upload. E então fácil de perceber que consumidores diferentes têm necessidades diferentes. E necessário encontrar uma arquitectura que agrade a quem necessita de maiores larguras de banda mas também a quem não necessita de um aumento significativo e que, não está disposto a pagar por este. Existem neste momento tecnologias que ainda não foram implementadas em grandes escalas, como o caso de Next Generation Passive Optical Network (NG-PON2), porque não simbolizam um retorno financeiro para as grande operadores, uma vez que o número de potenciais consumidores de tais velocidades ainda não e substancialmente grande. E necessário encontrar uma solução que não so englobe as novas tecnologias como também as já existentes. Com o objectivo de se encontrar um solução para os problemas acima referidos, este trabalho assenta na elaboração de um Circuito integrado fotonico que visa ser um transrecetor de uma arquitetura multi-tecnologia em que irão ser incorporadas tecnologias como Video-Overlay, 10 Gigabit-capable Passive Optical Network (XG-PON) e NG-PON2. Esta dissertação apresenta uma abordagem as Redes Oticas Passivas e também um estudo feito aos componentes usados no transreceptor usando os programas Aspic e VPI Photonics . Porém ser a apresentado o desenho final do transreceptor que ser a usado numa Optical Network Unit(ONU).
Mahendra, Andri. "Electronic Photonic Integrated Circuits and Control Systems." Thesis, The University of Sydney, 2017. http://hdl.handle.net/2123/17806.
Full textSun, Xiaolan. "Quantum Well Intermixing For Photonic Integrated Circuits." Diss., The University of Arizona, 2007. http://hdl.handle.net/10150/194900.
Full textMöller, Anton. "Piezoelectric tuning of integrated photonic delay circuits." Thesis, KTH, Tillämpad fysik, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-260415.
Full textCantarella, Giuseppe. "Design, microfabrication and characterisation of Photonic Integrated Circuits." Thesis, University of Strathclyde, 2017. http://digitool.lib.strath.ac.uk:80/R/?func=dbin-jump-full&object_id=28500.
Full textKAPLAN, ALI EMRE. "APPLICATIONS OF COUPLED RESONATORS IN PHOTONIC INTEGRATED CIRCUITS." Doctoral thesis, Università degli studi di Ferrara, 2020. http://hdl.handle.net/11392/2487877.
Full textI continui progressi dell’ottica integrata e della fotonica consentono soluzioni alla avanguardia in campi di applicazione sempre più vasti. Le funzionalità dei Circuiti Fotonici Integrati (PIC) si arricchiscono continuamente grazie all'introduzione di nuovi elementi circuitali realizzati mediante dispositivi fotonici. Tra questi, i Risonatori ad Anello (Micro Ring Resonator - MMR) stanno suscitando un interesse particolare grazie alla loro vasta gamma di proprietà funzionali che possono servire per implementare, ad esempio, router, laser e sensori. L'interazione di queste funzionalità, ottenibile mediante la disposizione in cascata di più risonatori, porta ad applicazioni sempre più sofisticate, che sfruttano la manipolazione delle risonanze e la conseguente modifica flessibile dello spettro di trasmissione dei dispositivi così realizzati. Questa tesi propone un dispositivo innovativo basato su una particolare configurazione di risonatori accoppiati e ne analizza i potenziali benefici. Il dispositivo proposto può agire, a seconda della configurazione, come elemento di commutazione, come riflettore e come sensore. A differenza dei dispositivi proposti in letteratura basati su risonatori accoppiati direttamente, quello che viene presentato in questa tesi è costituito da una coppia di risuonatori interagenti in modo indiretto attraverso una guida d'onda. Questa topologia, definita come “Risonatori ad accoppiamento indiretto (Indirectly Coupled Resonators - ICR)”, grazie alla sua versatilità può svolgere funzionalità differenti, la cui indagine costituisce il tema portante di questa tesi. I dispositivi sviluppati in questi anni sono stati fabbricati utilizzando due piattaforme tecnologiche: InP-membrane-on-silicon (IMOS) e Silicon-On-Insulator (SOI). Il dispositivo proposto viene inizialmente analizzato quando configurato come router per reti ottiche flessibili (reti elastiche), in cui può essere impiegato come add/drop multiplexer riconfigurabile (ROADM). Grazie al comportamento non reciproco in lunghezza d’onda, questo dispositivo può combinare le funzioni di Add/Drop in un unico aggregatore bidirezionale. Viene poi presentata l’analisi della scalabilità e definita una tipologia di router per applicazioni nelle Network-on-chip ottiche. Secondo l'analisi topologica svolta in questa tesi, i router basati su topologie ICR possono ridurre fino al ∼ 50% il numero di risonatori necessari, a parità di numero di porte. Viene poi proposto l’utilizzo di tale dispositivo come riflettore ottenibile, a parità di topologia, eseguendo la sincronizzazione dei due risonatori. Le misure sono state effettuate con dispositivi fabbricati in tecnologia SOI e mostrano la possibilità di sintonizzare il riflettore in un range di lunghezze d’onda di 37 nm. Le riflessioni possono avere larghezze di banda molto strette (∼ 50 pm), corrispondenti ad un fattore di qualità di ∼ 30.000. La possibilità di ottenere riflessioni su lunghezze d’onda multiple è stata invece verificata utilizzando risonatori racetrack con raggi identici e fabbricati in tecnologia IMOS. Nell’ultima parte della tesi viene invece analizzato, attraverso l’utilizzo di modelli matematici, l’impiego di tale dispositivo in ambito sensoristico. Viene proposto uno schema di funzionamento differenziale, interrogabile in lunghezza d’onda ed in intensità. La tecnica differenziale impiegata consente l’esecuzione della calibrazione del dispositivo direttamente su chip, semplificando così la taratura dello stesso. Le prestazioni del sensore sono confrontate, attraverso modellizzazione numerica, con quelle di sensori risonanti convenzionali. I risultati presentati in questa tesi rivelano le molteplici proprietà dei risonatori accoppiati indirettamente, che possono dunque costituire un nuovo blocco funzionale per i circuiti integrati fotonici.
Klinner-Teo, Teresa Deyi Maria. "Photonic circuits for exoplanet detection." Thesis, The University of Sydney, 2022. https://hdl.handle.net/2123/29765.
Full textWang, Ying. "Integrated photonic devices using self-assembled and optically defined photonic crystal superstructures." Connect to online resource, 2007. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:3288723.
Full textDainese, Matteo. "Plasma assisted technology for Si-based photonic integrated circuits." Doctoral thesis, Stockholm, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-148.
Full textCho, Seong-Ho 1966. "Laser micromachining of active and passive photonic integrated circuits." Thesis, Massachusetts Institute of Technology, 2003. http://hdl.handle.net/1721.1/30086.
Full textIncludes bibliographical references (leaves 149-158).
This thesis describes the development of advanced laser resonators and applications of laser-induced micromachining for photonic circuit fabrication. Two major advantages of laser-induced micromachining are direct patterning and writing on large areas of substrates at high speed following the exposure of laser light, without using complicated photomask steps. For passive photonic devices fabrication, a novel femtosecond laser with unprecedented low repetition rates of 4 MHz is demonstrated to generate high intensity pulses, as high as 1.25 MW with 100 nJ pulse energies and 80 fs pulse durations directly from this laser resonator, without using any active devices or amplifiers. These high intensity pulses are applied to transparent glass materials to demonstrate micromachining of waveguides, gratings, couplers, and three dimensional waveguides and their beam couplings. Active and passive semiconductor devices can be monolithically integrated by employing high energy laser pulses to locally disorder quantum well regions. The 45 nm bandgap shifts at 1.55 ptm with a standard Q-switched Nd:YAG laser at 535 nm are realized. Finally, unidirectional semiconductor ring lasers for high-density integration are developed as a potential application to photonic integrated circuits. Hybrid semiconductor S-crossover and retro-reflected ring lasers, as prototypes for unidirectional operation, are built and result in up to 21.5 dB and 24.5 dB of counter-mode suppression ratio, respectively, which is in good agreement with theoretical predictions.
by Seong-Ho Cho.
Ph.D.
Prabhu, Mihika. "Towards optimal capacity-achieving transceivers with photonic integrated circuits." Thesis, Massachusetts Institute of Technology, 2018. http://hdl.handle.net/1721.1/115725.
Full textCataloged from PDF version of thesis.
Includes bibliographical references (pages 63-65).
Optical communication systems have many advantages over communication systems that operate in the radio-frequency range, including decreased size, weight, and power consumption and increased bandwidth. As a result, optical communication systems are emerging as the ideal choice in many resource-constrained links such as those deployed on spacecraft. This thesis presents progress on development of a programmable nanophotonic processor (PNP) for implementing a high-fidelity reconfigurable optical transceiver at the telecommunications wavelength. By encoding information in multiple spatial modes and detecting jointly over the modes using a unitary transform prior to detection, one can in principle attain Holevo-limited channel capacity in the low mean photon number regime. Since the PNP offers dynamic reprogrammability, one can also, in principle, correct for wavefront distortion in the channel. We present a setup, calibration protocols, and preliminary results towards a turbulence-resistant integrated BPSK transmitter and joint detection receiver channel that achieves superadditive channel capacity in the low mean photon number regime.
by Mihika Prabhu.
S.M.
Morgado, Tiago Manuel Coelho. "Photonic integrated circuits for use in NG-PON2 networks." Master's thesis, Universidade de Aveiro, 2016. http://hdl.handle.net/10773/18520.
Full textNos dias que correm com a adoção generalizada de smartphones, conteúdos de vídeo, computação em nuvem e redes sociais, o volume de tráfego não para de aumentar. Assim, existe uma procura constante para melhorar a largura de banda das redes existentes. Neste contexto surgiu a Next Generation Passive Optical Network Phase (NG-PON) 2 a qual é um novo standard que vai permitir um aumento da largura de banda que pode chegar aos 80Gbps. O conhecimento dos requisitos do standard NG-PON 2 é importante, para que se possam produzir equipamentos que possam vir a ser utilizados nestas redes. Atualmente existe uma grande evolução nas comunicações óticas. Esta evolução tecnológica levou ao aparecimento de Photonic Integrated Circuits(PICs). Os PICs permitem a integração no mesmo chip de diversos componentes óticos permitindo assim construir circuitos com maior desempenho e fiabilidade. Cada vez mais, existe um grande investimento nesta área, estão inclusivamente a aparecer softwares cujo propósito é permitir aos utilizadores criar e simular PICs, para que estes possam ser posteriormente construídos. É então importante o conhecimento das caraterísticas mais importantes dos blocos que estes softwares permitem simular. Neste trabalho serão testados alguns blocos do “VPItoolkit PDK HHI” que é um toolkit que quando adicionado no software VPItransmissionMaker™, permite simular os componentes produzidos pelo Heinrich Hertz Institute (HHI). Com estes componentes, serão ainda feitas simulações visando a sua utilização em uma rede NG-PON2. Foi também dada grande atenção ao estudo dos Multimode Interference Devices (MMI) dos quais foi feito um modelo em MATLAB. E ao mach Zehnder Modulator (MZM) do qual foi realizada uma animação a demostrar dinamicamente a propagação da Luz dentro dele. Foram ainda sugeridas duas arquiteturas possíveis para um tranceiver a ser utilizado no Optical Network Unit (ONU) em redes NG-PON 2.
Nowadays with the widespread adoption of smartphones, video content, cloud computing and social networks, the volume of traffic is constantly increasing. Therefore, it exists a constant demand to improve the bandwidth of the existing networks. In this context emerged the Next Generation Passive Optical Network Phase (NG-PON 2), which is a new standard that will allow an increase in the bandwidth up to 80 Gbps. The knowledge of the requirements of the standard NG-PON 2 is important, to allow the production of equipment that can be used in these networks. Currently there is a major evolution in optical communications. This technological evolution has led to the emergence of Photonic Integrated Circuits (PICs). By using PICs various optical components can be integrated on the same chip, allowing to build circuits with higher performance and reliability. Currently there is a large investment in this area, software whose purpose is to allow users to create and simulate PICs are starting to appear, to subsequently allow a correct manufacturing of the PICs. It is important to know the most important features of these software blocks and what do they allow to simulate. During this work some blocks from "VPItoolkit PDK HHI" will be tested. "VPItoolkit PDK HHI" is a toolkit that when added in VPItransmissionMaker ™ software allows the simulation of the components produced by the Heinrich Hertz Institute (HHI). With these components, simulations were made to test their use in a NG-PON2 network. It was also given attention to the study of the Multimode Interference Devices (MMI) from which was created a model in MATLAB. And to the Mach Zehnder Modulator (MZM) from which was made an animation to dynamically demonstrate the propagation of light inside him. It was also suggested two possible architectures for a transceiver to be used on the Optical Network Unit (ONU) in NG-PON 2 networks.
Joshi, Siddharth. "Quantum dash based photonic integrated circuits for optical telecommunications." Thesis, Evry, Institut national des télécommunications, 2014. http://www.theses.fr/2014TELE0031/document.
Full textThis PhD dissertation presents a study on the properties of the novel quantum dash nanostructures and their properties for application in optical telecommunications. Over the last decade, scientific community has gained considerable interest over these nanostructures and several demonstrations have been made on their interesting optical and electronic properties, notably owing to their strong quantum confinement. This dissertation focuses on conception, fabrication and system demonstration of integrated optical transmitters based on quantum dash material. A first part of this work analyses the properties of qdashes theoretically and experimentally for their use as an active material in directly modulated lasers. The dynamic properties of this material are then evaluated leading to an optical transmission distances in range of 0-100km under direct modulation. The transmission is particularly studied with a passive optical filter to enhance the dynamic extinction ratio, the use of such passive filters is studied in detail. An innovative and fully integrated optical transmitter is finally demonstrated by integrating a ring-resonator filter to a distributed feedback laser. The second part of this work focuses on mode locked lasers based on this material and in particular the methods of integration of such devices on InP are explored. Thus an innovative Bragg mirror design is developed leading to a mode locked laser integrated with a semiconductor optical amplifier
Liu, Qiankun. "SiGe photonic integrated circuits for mid-infrared sensing applications." Thesis, Université Paris-Saclay (ComUE), 2019. http://www.theses.fr/2019SACLS166/document.
Full textMid-infrared (mid-IR) spectroscopy is a nearly universal way to identify chemical and biological substances, as most of the molecules have their vibrational and rotational resonances in the mid-IR wavelength range. Commercially available mid-IR systems are based on bulky and expensive equipment, while lots of efforts are now devoted to the reduction of their size down to chip-scale dimensions. The use of silicon photonics for the demonstration of mid-IR photonic circuits will benefit from reliable and high-volume fabrication to offer high performance, low cost, compact, lightweight and power consumption photonic circuits, which is particularly interesting for mid-IR spectroscopic sensing systems that need to be portable and low cost. Among the different materials available in silicon photonics, Germanium (Ge) and Silicon-Germanium (SiGe) alloys with a high Ge concentration are particularly interesting because of the wide transparency window of Ge up to 15 µm. In this context, the objective of this thesis is to investigate a new Ge-rich graded SiGe platform for mid-IR photonic circuits. Such new plateform was expected to benefit from a wide transparency wavelength range and a high versatility in terms of optical engineering (effective index, dispersion, …). During this thesis, different waveguides platforms based on different graded profiles have been investigated. First it has been shown that waveguides with low optical losses of less than 3 dB/cm can be obtained in a wide wavelength range, from 5.5 to 8.5 µm. A proof of concept of sensing based on the absorption of the evanescent component of the optical mode has then been demonstrated. Finally, elementary building blocs have been investigated. The first Bragg mirror-based Fabry Perot cavities and racetrack resonators have been demonstrated around 8 µm wavelength. A broadband dual-polarization MIR integrated spatial heterodyne Fourier-Transform spectrometer has also been obtained. All these results rely on material and device design, clean-room fabrication and experimental characterization. This work was done in the Framework of EU project INsPIRE in collaboration with Pr. Giovanni Isella from Politecnico Di Milano
Jafarpour, Aliakbar. "Ultra Low-Loss and Wideband Photonic Crystal Waveguides for Dense Photonic Integrated Systems." Diss., Georgia Institute of Technology, 2006. http://hdl.handle.net/1853/11598.
Full textItawi, Ahmad. "Dispositifs photoniques hybrides sur Silicium comportant des guides nano-structurés : conception, fabrication et caractérisation." Thesis, Paris 11, 2014. http://www.theses.fr/2014PA112363/document.
Full textThis work contributes to the general context of III-V materials on Silicon hybrid devices for optical integrated functions, mainly emission/amplification at 1.55µm. Devices are considered for operation under electrical injection, reaching performances relevant for data transfer application. The main three contributions of this work concern: (i) bonding InP-based materials on Si, (ii) nanostructuration of the Si guiding layer for spatial and spectral control of the guided mode and (iii) technology of an hybrid electrically injected laser, with a special attention to the thermal budget. Bonding has been investigated following two approaches. The first one we call heterohepitaxial or oxide-free bonding, is performed without any intermediate layer at a temperature ~450°C. This approach has the great advantage allowing electrical transport across the interface, as reported in the literature. We have developed oxide-free surface preparation for both materials, mainly InP-based layers, and established bonding parameter processing. An in-depth STEM and RX structural characterization has demonstrated an oxide-free reconstructed interface without any dislocation except on one or two atomic layers which accommodate the large lattice mismatch (8.1%) between InP and Si. Photoluminescence of quantum wells intentionally grown close to the interface has shown no degradation. We have also developed an oxide-based bonding process operated at 300°C in order to be compatible with CMOS processing. The original ozone activation of the very thin (~5nm) oxide layer we have proposed demonstrates a bonding surface without any unbonded area due to degassing under annealing. We have developed an original method based on nanoindentation characterization in order to obtain a quantitative and local value of the surface bonding energy. Related to the absence or to the very thin intermediate layer between the two materials, our modal design is based on a double core structure, where most of the optical mode is confined in the Si guiding layer, and no taper is required. The Si waveguide on top of the SOI stack is a shallow ridge. A nanostructured material on both sides of the waveguide core ensures the lateral confinement, the nanostructuration geometry being at a sub-wavelength period in order to operate this material well below its photonic gap. It behaves as an uniaxial material with ordinary and extraordinary indices calculated according to the structuration geometry. Such a structuration allows modal and spectral control of the guided mode. 3D modal and spectral simulation have been performed. We have demonstrated, on a double-period structuration, a wavelength selective operation of hybrid optical waveguides. Such a double-period geometry could be included in a laser design for DFB operation. This nanostructuration has larger potential application such as coupled waveguides arrays or selective resonators. We have developed all the technological processing steps for an electrically injected hybrid laser fabrication. Main developments concern dry etching, performed with the Inductive Coupled Plasma Reactive Ion Etching ICP-RIE technique of both the nanostructuration of the Silicon material, and the mesa of the hybrid laser. Efficient electrical contacts fabrication is also a complex step. First lasers operating performances could be improved. We have investigated a specific design in order to overcome the thermal penalty encountered by all the hybrid devices. This penalty is due to the thick buried oxide layer of the SOI stack that prevents heating related to the current flow to be dissipated. Taking advantage of the electrical transport we have shown at the oxide-free interface, we propose a design where the n-contact is defined on the guiding Si layer, suppressing thermal heating under electrical operation. Such an approach is very promising for densely packed hybrid devices integrated with associated electronic driving elements on Si
Korn, Dietmar [Verfasser]. "Silicon-Organic Hybrid Platform for Photonic Integrated Circuits / Dietmar Korn." Karlsruhe : KIT Scientific Publishing, 2015. http://www.ksp.kit.edu.
Full textGreenspan, Jonathan. "Selective area epitaxy for indium phosphide based photonic integrated circuits." Thesis, McGill University, 2002. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=82883.
Full textWe report on a selective area epitaxy (SAE) process suitable for the fabrication of a PIC. The process includes a quantitative model, which for the first time, is capable of predicting the growth rate and composition of thin films selectively deposited by metalorganic chemical vapour deposition in areas close to the dielectric mask as well as areas several microns away. The accuracy of the model is demonstrated by comparing simulation results with experimental measurements of the thickness and composition profiles obtained by surface profilometry and energy dispersed X-ray respectively.
The process is applied to the fabrication of an elecroabsorption modulator and optical mode converter, monolithically integrated on an InP substrate. As part of the fabrication, quantitative modeling of the converter waveguide core deposition is employed to achieve a thickness profile previously designed by beam propagation calculations. Modeling is also used to predict the composition and strain shifts introduced by selective deposition, enabling the composition to be designed such that the maximum strain is minimized. Device measurements demonstrate that SAE is successfully used for the fabrication of a PIC with characteristics superior to those found in conventional devices.
Cemlyn, Benjamin R. "Dynamics of tunable lasers in small-scale photonic integrated circuits." Thesis, University of Essex, 2013. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.605150.
Full textYang, Zhen. "Photonic integrated circuits for high speed sub-terahertz wireless communications." Thesis, University of Cambridge, 2015. https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.708677.
Full textHolzwarth, Charles W. III (Charles Willett). "Material selection and nanofabrication techniques for electronic photonic integrated circuits." Thesis, Massachusetts Institute of Technology, 2009. http://hdl.handle.net/1721.1/53248.
Full textCataloged from PDF version of thesis.
Includes bibliographical references (p. 149-154).
Electronic-photonic integrated circuits have the potential to circumvent many of the performance bottlenecks of electronics. To achieve the full benefits of integrating photonics with electronics it is generally believed that wavelength-division multiplexing is needed; requiring an integrated optical device capable of multiplexing/demultiplexing operations. One such device is a bank of microring-resonator filters with precisely spaced resonant frequencies. In this work, a fabrication strategy based on scanning-electron-beam lithography (SEBL) is presented for precisely controlling the resonant frequency of microring-resonator filters. Using this strategy it is possible to achieve dimensional control, on the tens-of- picometer scale, as required for microring-resonator filter banks. To correct for resonant-frequency errors present after fabrication, two forms of postfabrication tuning, one dynamic and one static, are demonstrated. It is also shown that hydrogen silsesquioxane (HSQ) can be converted into a high-quality overcladding for photonic devices by optimizing the annealing process. Finally, a postfabrication technique of localized substrate removal is presented, enabling the integration of photonics with CMOS electronics. Second-order microring-resonator filter banks were fabricated using SiNx and Si as the high -index core materials. By controlling the electron-beam-exposure dose it is possible to change the average microring-waveguide width to a precision better than 75 pm, despite the 6 nm SEBL address grid. Using postfabrication tuning the remaining resonant-frequency errors can be reduced to less than 1 GHz.
(cont.) By annealing HSQ in a an 02 atmosphere using rapid thermal processing, it is possible to create thick overcladding layers that have essentially the same optical properties as SiO2 with the excellent gap-filling and planarization properties of HSQ. Using XeF2 to locally etch an underlying Si substrate, waveguides with a propagation loss of -10 dB/cm were fabricated out of polysilicon deposited on 50 nm of SiO2.
by Charles W. Holzwarth, Ill.
Ph.D.
Ferreira, Ana Rita Rodrigues. "Photonic integrated circuits development: a universal transceiver for NG-PON2." Master's thesis, Universidade de Aveiro, 2015. http://hdl.handle.net/10773/15974.
Full textIn the last years there has been a clear evolution in the world of telecommunications, which goes from new services that need higher speeds and higher bandwidth, until a role of interactions between people and machines, named by Internet of Things (IoT). So, the only technology able to follow this growth is the optical communications. Currently the solution that enables to overcome the day-by-day needs, like collaborative job, audio and video communications and share of les is based on Gigabit-capable Passive Optical Network (G-PON) with the recently successor named Next Generation Passive Optical Network Phase 2 (NG-PON2). This technology is based on the multiplexing domain wavelength and due to its characteristics and performance becomes the more advantageous technology. A major focus of optical communications are Photonic Integrated Circuits (PICs). These can include various components into a single device, which simpli es the design of the optical system, reducing space and power consumption, and improves reliability. These characteristics make this type of devices useful for several applications, that justi es the investments in the development of the technology into a very high level of performance and reliability in terms of the building blocks. With the goal to develop the optical networks of future generations, this work presents the design and implementation of a PIC, which is intended to be a universal transceiver for applications for NG-PON2. The same PIC will be able to be used as an Optical Line Terminal (OLT) or an Optical Network Unit (ONU) and in both cases as transmitter and receiver. Initially a study is made of Passive Optical Network (PON) and its standards. Therefore it is done a theoretical overview that explores the materials used in the development and production of this PIC, which foundries are available, and focusing in SMART Photonics, the components used in the development of this chip. For the conceptualization of the project di erent architectures are designed and part of the laser cavity is simulated using Aspic™. Through the analysis of advantages and disadvantages of each one, it is chosen the best to be used in the implementation. Moreover, the architecture of the transceiver is simulated block by block through the VPItransmissionMaker™ and it is demonstrated its operating principle. Finally it is presented the PIC implementation.
Nos últimos anos tem existido uma evidente evolução no mundo das telecomunicações, que vai desde novos serviços que requerem maiores velocidades e maior largura de banda, a um role de interações entre pessoas e máquinas, designada por Internet of Things (IoT). Assim, a única tecnologia capaz de acompanhar este crescimento são as comunicações óticas. Atualmente a solução que permite colmatar as necessidades do dia-a-dia, tais como trabalhar colaborativamente, comunicar por áudio e vídeo, e partilhar ficheiros, é baseada no Gigabit-capable Passive Optical Network (G-PON) com a mais recente evolução designada por Next Generation Passive Optical Network Phase 2 (NG-PON2). Esta tecnologia baseia-se na multiplexagem no domínio do comprimento de onda e devido às suas características e desempenho torna-se a tecnologia mais vantajosa. Um dos principais focos das comunicações óticas são os Photonic Integrated Circuits (PICs). Estes conseguem englobar num único dispositivo vários componentes, o que simplifica o desenho do sistema ótico, reduzindo o espaço e o consumo de energia e melhora a confiabilidade. Estas caracteristicas tornam este tipo de dispositivos vantajosos para uma série de aplicações, justificando os investimentos no desenvolvimento da tecnologia para um nível muito elevado de desempenho e fiabilidade ao nível dos blocos de construção. Com o objetivo de desenvolver as redes óticas passivas de futuras gerações, este trabalho apresenta o desenho e a implementação de um PIC que visa ser um transrecetor universal para aplicações para NG-PON2. O mesmo PIC pode ser usado como Optical Line Terminal (OLT) ou como Optical Network Unit (ONU) e em ambos os casos como transmissor e recetor. Inicialmente é feito um estudo das redes óticas passivas e os seus standards. Seguidamente é feita uma abordagem teórica que explora um pouco dos materiais usados no desenvolvimento e produção de um PIC, quais as fábricas existentes, focando na SMART Photonics e os componentes usados no desenvolvimento deste chip. Com vista à concetualização do projeto, diferentes arquiteturas são desenhadas e a parte da cavidade do laser é simulada usando o Aspic™. Partindo da análise das vantagens e desvantagens de cada uma delas, é escolhida a melhor para utilizar na implementação. De seguida, a arquitetura do transrecetor é simulada bloco a bloco através do VPItransmissionMaker™ e é demonstrado o seu princípio de funcionamento. Finalmente é apresentada a implementação do PIC.
Tsvirkun, Viktor. "Optomechanics in hybrid fully-integrated two-dimensional photonic crystal resonators." Thesis, Paris 11, 2015. http://www.theses.fr/2015PA112176/document.
Full textOptomechanical systems, in which the vibrations of a mechanical resonator are coupled to an electromagnetic radiation, have permitted the investigation of a wealth of novel physical effects. To fully exploit these phenomena in realistic circuits and to achieve different functionalities on a single chip, the integration of optomechanical resonators is mandatory. Here, we propose a novel approach to heterogeneously integrated arrays of two-dimensional photonic crystal defect cavities on top of silicon-on-insulator waveguides. The optomechanical response of these devices is investigated and evidences an optomechanical coupling involving both dispersive and dissipative mechanisms. By controlling optical coupling between the waveguide and the photonic crystal, we were able to vary and understand the relative strength of these couplings. This scalable platform allows for unprecedented control on the optomechanical coupling mechanisms, with a potential benefit in cooling experiments, and for the development of multi-element optomechanical circuits in the frame of optomechanically-driven signal-processing applications
Koch, Thomas L., Michael Liehr, Douglas Coolbaugh, John E. Bowers, Rod Alferness, Michael Watts, and Lionel Kimerling. "The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem." SPIE-INT SOC OPTICAL ENGINEERING, 2016. http://hdl.handle.net/10150/621540.
Full textSamadian, Parya. "Photonic Integrated Circuits Challenges & Solutions: Homogenization, Polarization Management and Coupling." Thesis, Université d'Ottawa / University of Ottawa, 2015. http://hdl.handle.net/10393/33352.
Full textCegielski, Piotr [Verfasser]. "Development of Integrated Perovskite Lasers for Dielectric Photonic Circuits / Piotr Cegielski." München : Verlag Dr. Hut, 2019. http://d-nb.info/1198542934/34.
Full textBishop, Zofia Katarzyna. "III-V semiconductor nano-photonic devices for integrated quantum optical circuits." Thesis, University of Sheffield, 2018. http://etheses.whiterose.ac.uk/22613/.
Full textZhu, Di S. M. Massachusetts Institute of Technology. "Superconducting nanowire single-photon detectors on aluminum nitride photonic integrated circuits." Thesis, Massachusetts Institute of Technology, 2017. http://hdl.handle.net/1721.1/108974.
Full textCataloged from PDF version of thesis.
Includes bibliographical references (pages 85-91).
With recent advances in integrated single-photon sources and quantum memories, onchip integration of high-performance single-photon detectors becomes increasingly important. The superconducting nanowire single-photon detector (SNSPD) is the leading single-photon counting technology for quantum information processing. Among various waveguide materials, aluminum nitride (AlN) is a promising candidate because of its exceptionally wide bandgap, and intrinsic piezoelectric and electro-optic properties. In this Master's thesis, we developed a complete fabrication process for making high-performance niobium nitride SNSPDs on AlN, and demonstrated their integration with AlN photonic waveguides. The detectors fabricated on this new substrate material have demonstrated saturated detection efficiency from visible to near-IR, sub-60-ps timing jitter, and ~6 ns reset time. This work will contribute towards building a fully integrated quantum photonic processor.
by Di Zhu.
S.M.
Goldstein, Jordan (Jordan A. ). "Large-scale integration of graphene optoelectronic devices in photonic integrated circuits." Thesis, Massachusetts Institute of Technology, 2016. http://hdl.handle.net/1721.1/106019.
Full textThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (pages 55-59).
Graphene is a 2D material recognized for its extremely high mobility and novel optoelectronic properties. In this thesis, we argue in favor of integrating graphene as an active optoelectronic material alongside optical waveguides on the back-end of CMOS ICs for photonic links in access network and computing applications. We describe a simple fabrication process which can accommodate both graphene modulators and photodetectors on almost any waveguide platform. We use this process to fabricate such devices on silicon waveguides and provide preliminary measurements. Finally, we discuss further research opportunities to improve graphene modulators and detectors to the point of being a competitive technology.
by Jordan Goldstein.
M. Eng.
Gan, Fuwan. "High-speed silicon electro-optic modulator for electronic photonic integrated circuits." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/40498.
Full textIncludes bibliographical references (p. 173-184).
The development of future electronic-photonic integrated circuits (EPIC) based on silicon technology critically depends on the availability of CMOS-compatible high-speed modulators that enable the interaction of electronic and optical signals. This thesis investigates electrically driven Mach-Zehnder modulators based on high-index contrast silicon waveguide technology and electronic carrier injection. Modulators based on four different structures are investigated: the forward-biased PiN diode with and without lifetime reduction, the reverse-biased PIN/PN diode and a metal-oxide-semiconductor (MOS) structure. These devices are compared with each other in terms of achievable performance. A modulator based on the forward-biased PIN diode with lifetime reduction is designed to reach 34GHz bandwidth and a low figure of merit V -. L = 0.6V - cm using a carrier lifetime reduction and a graded doping profile. A bandwidth of 1-2GHz has been demonstrated so far which is considerably smaller than the design bandwidth due to high series resistance. Modulators based on the forward-biased PIN structure without lifetime reduction have a low figure of merit, very low voltage and extremely low power consumption in the low frequency regime.
(cont.) The measurements demonstrate a RF power consumption of 100mW for 25% modulation depth and a figure of merit of V, - L = 0.28V - cm at frequencies up to 10GHz. A pre-compensation technique, using a high pass filter which consists of a parallel resistor and capacitor, extends the modulator bandwidth from 100MHz to 5GHz experimentally. Further it is shown that, modulators based on the reverse-biased structure can in principle reach very high speed, up to 40-80GHz in design but it's difficult to reduce V, - L values close to or even below 1V - cm and the necessary drive voltage is higher than the voltage provided by the CMOS technology. For the measured bandwidth of the fabricated devices so far only 1-2GHz has been demonstrated. This discrepancy is caused by the RC delay due to the experimental setup and high contact resistance. Finally, the performance of the modulator based on the metal-on-semiconductor (MOS) structure is analyzed. Furthermore, an electrically driven Mach-Zehnder waveguide modulator based on a high-index contrast silicon split-ridge waveguide (SRW) technology and electronic carrier injection is proposed.
(cont.) The excellent optical and carrier confinement possible in high-index contrast waveguide devices, together with the forward biased operation and the good thermal heat sinking due to the silicon slab close to the waveguide, enables high speed modulation with small signal modulation bandwidths beyond 20GHz, a V, times length figure of merit of V, - L = 0.5Vcm and an insertion loss of about 5.3 dB. Finally, all-optical switches based on optical carrier-injection in high index contrast Si/Si02 split-ridge-waveguide (SRW) couplers are proposed. The waveguide devices are suitable for the construction of low-loss optical switch matrices as well as fast optical switching. These devices exhibit robustness against fabrication tolerances, improved heat sinking, good carrier confinement and high uniformity in transmission over the entire C-band of optical communications in contrast to comparable devices based on buried or ridge waveguides. A reasonably low electrical switching power of 1-10mW is predicted for switching frequencies in the 1MHz-1GHz range. Faster switching speed can be achieved by carrier lifetime reduction.
by Fuwan Gan.
Ph.D.
Aghajani, Armen. "Waveguide lasers in ytterbium doped tantalum pentoxide for integrated photonic circuits." Thesis, University of Southampton, 2015. https://eprints.soton.ac.uk/388523/.
Full textBurrow, Guy Matthew. "Pattern-integrated interference lithography: single-exposure formation of photonic-crystal lattices with integrated functional elements." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44804.
Full textLiu, Jifeng Ph D. Massachusetts Institute of Technology. "GeSi photodetectors and electro-absorption modulators for Si electronic-photonic integrated circuits." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/38582.
Full textIncludes bibliographical references (p. 185-188).
The silicon electronic-photonic integrated circuit (EPIC) has emerged as a promising technology to break through the interconnect bottlenecks in telecommunications and on-chip interconnects. High performance photonic modulators and photodetectors compatible with Si complimentary metal oxide semiconductor (CMOS) devices are indispensable to achieve this goal. A photonic modulator generates optical "1" and "0" signals by switching the light on and off, while a photodetector converts the optical signals to electrical ones so that they can be processed by a CMOS circuit. Due to its compatibility with Si CMOS processing and adequate optoelectric properties, epitaxial GeSi material has been considered as a promising candidate to achieve this goal. This thesis investigates epitaxial GeSi photodetectors and electro-absorption (EA) modulators integrated with high index contrast Si(core)/Si02(cladding) waveguides to form an EPIC circuit on a Si platform with CMOS compatibility. Tensile strain is introduced into the GeSi material to enhance its optoelectronic properties. The effect of tensile strain on the band structure of Ge is systematically studied, and the deformation potential constants of Ge are derived from the experimental results with relatively high accuracy.
(cont.) Methods to engineer the tensile strain in Ge are demonstrated. Tensile strain in small, selectively grown Ge mesas and stripes with at least one dimension <<10 jim is also investigated. The results are instructive to design selectively grown GeSi EA modulators and photodetectors integrated with Si/SiO2 waveguides. Free-space coupled Ge photodetectors on Si are fabricated with significantly improved performance in the L band (1561-1620nm) of telecommunications as a result of strain engineering. We have demonstrated a selectively grown Ge photodetector on a Si platform with a bandwidth of 8.5 GHz and a high responsivity over a broad wavelength range of 650-1605 nm. Full responsivity was achieved at 0 bias and full bandwidth was obtained at 1 V reverse bias, compatible with the requirement of Si ultra-large scale integrated circuits (ULSI). The GeSi EA modulator is based on Franz-Keldysh (FK) effect, where the electric field shifts the direct band edge of the GeSi material and significantly enhances its absorption coefficient in the weakly absorbing regime. Therefore, by modulating the electric field in the GeSi material, we can modulate the intensity of the light of a certain range of wavelength that passes through the GeSi material. A strain-enhanced FK effect in tensile strained epitaxial Ge material is demonstrated.
(cont.) A waveguide-integrated GeSi EA modulator with 4.8 dB insertion loss, 9.8 dB extinction ratio and a bandwidth >50 GHz has been designed with the material composition and device structure optimized for operations around 1550 nm. The same material and device structure can be also used for waveguide-integrated photodetectors with a responsivity of 1.1 A/W at 1550 nm and a bandwidth >35 GHz. A method to monolithically integrate GeSi modulators, photodetectors and Si/SiO2 waveguides is proposed and the expected performance is evaluated. Waveguide-integrated GeSi photodetectors and EA modulators are fabricated on a standard 180 nm CMOS production line based on the design. We demonstrate a waveguide-integrated GeSi photodetector with a responsivity of 1.0 A/W at 1518 nm and a bandwidth >4.5 GHz, as well as a GeSi EA modulator with an extinction ratio of -0.3 dB. While the device performance of the EA modulator is far from ideal due to fabrication issues, the preliminary results demonstrate the feasibility of the electronic-photonic integration on a Si platform with GeSi modulator and detector devices. The problems in this first device processing are identified, and solutions are proposed and partially tested. The device performance could be greatly enhanced with improved processing technique.
by Jifeng Liu.
Ph.D.