Relevant bibliographies by topics / Photonic integrated circuits

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Photonic integrated circuits'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 June 2024

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Journal articles on the topic "Photonic integrated circuits"

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Dong, Po, Young-Kai Chen, Guang-Hua Duan, and David T. Neilson. "Silicon photonic devices and integrated circuits." Nanophotonics 3, no. 4-5 (August 1, 2014): 215–28. http://dx.doi.org/10.1515/nanoph-2013-0023.

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AbstractSilicon photonic devices and integrated circuits have undergone rapid and significant progresses during the last decade, transitioning from research topics in universities to product development in corporations. Silicon photonics is anticipated to be a disruptive optical technology for data communications, with applications such as intra-chip interconnects, short-reach communications in datacenters and supercomputers, and long-haul optical transmissions. Bell Labs, as the research organization of Alcatel-Lucent, a network system vendor, has an optimal position to identify the full potential of silicon photonics both in the applications and in its technical merits. Additionally it has demonstrated novel and improved high-performance optical devices, and implemented multi-function photonic integrated circuits to fulfill various communication applications. In this paper, we review our silicon photonic programs and main achievements during recent years. For devices, we review high-performance single-drive push-pull silicon Mach-Zehnder modulators, hybrid silicon/III-V lasers and silicon nitride-assisted polarization rotators. For photonic circuits, we review silicon/silicon nitride integration platforms to implement wavelength-division multiplexing receivers and transmitters. In addition, we show silicon photonic circuits are well suited for dual-polarization optical coherent transmitters and receivers, geared for advanced modulation formats. We also discuss various applications in the field of communication which may benefit from implementation in silicon photonics.
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Xiang, Chao, Warren Jin, Osama Terra, Bozhang Dong, Heming Wang, Lue Wu, Joel Guo, et al. "3D integration enables ultralow-noise isolator-free lasers in silicon photonics." Nature 620, no. 7972 (August 2, 2023): 78–85. http://dx.doi.org/10.1038/s41586-023-06251-w.

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AbstractPhotonic integrated circuits are widely used in applications such as telecommunications and data-centre interconnects1–5. However, in optical systems such as microwave synthesizers6, optical gyroscopes7 and atomic clocks8, photonic integrated circuits are still considered inferior solutions despite their advantages in size, weight, power consumption and cost. Such high-precision and highly coherent applications favour ultralow-noise laser sources to be integrated with other photonic components in a compact and robustly aligned format—that is, on a single chip—for photonic integrated circuits to replace bulk optics and fibres. There are two major issues preventing the realization of such envisioned photonic integrated circuits: the high phase noise of semiconductor lasers and the difficulty of integrating optical isolators directly on-chip. Here we challenge this convention by leveraging three-dimensional integration that results in ultralow-noise lasers with isolator-free operation for silicon photonics. Through multiple monolithic and heterogeneous processing sequences, direct on-chip integration of III–V gain medium and ultralow-loss silicon nitride waveguides with optical loss around 0.5 decibels per metre are demonstrated. Consequently, the demonstrated photonic integrated circuit enters a regime that gives rise to ultralow-noise lasers and microwave synthesizers without the need for optical isolators, owing to the ultrahigh-quality-factor cavity. Such photonic integrated circuits also offer superior scalability for complex functionalities and volume production, as well as improved stability and reliability over time. The three-dimensional integration on ultralow-loss photonic integrated circuits thus marks a critical step towards complex systems and networks on silicon.
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Zhang, Chuang, Chang-Ling Zou, Yan Zhao, Chun-Hua Dong, Cong Wei, Hanlin Wang, Yunqi Liu, Guang-Can Guo, Jiannian Yao, and Yong Sheng Zhao. "Organic printed photonics: From microring lasers to integrated circuits." Science Advances 1, no. 8 (September 2015): e1500257. http://dx.doi.org/10.1126/sciadv.1500257.

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A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.
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Yakushenkov, P. O. "Photonic Integrated Circuits." Photonics Russia 68, no. 8 (2017): 58–67. http://dx.doi.org/10.22184/1993-7296.2017.68.8.58.67.

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Koch, Thomas L., and Uziel Koren. "Photonic Integrated Circuits." AT&T Technical Journal 71, no. 1 (January 2, 1992): 63–74. http://dx.doi.org/10.1002/j.1538-7305.1992.tb00148.x.

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Matsuda, Nobuyuki, and Hiroki Takesue. "Generation and manipulation of entangled photons on silicon chips." Nanophotonics 5, no. 3 (August 1, 2016): 440–55. http://dx.doi.org/10.1515/nanoph-2015-0148.

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AbstractIntegrated quantum photonics is now seen as one of the promising approaches to realize scalable quantum information systems. With optical waveguides based on silicon photonics technologies, we can realize quantum optical circuits with a higher degree of integration than with silica waveguides. In addition, thanks to the large nonlinearity observed in silicon nanophotonic waveguides, we can implement active components such as entangled photon sources on a chip. In this paper, we report recent progress in integrated quantum photonic circuits based on silicon photonics. We review our work on correlated and entangled photon-pair sources on silicon chips, using nanoscale silicon waveguides and silicon photonic crystal waveguides. We also describe an on-chip quantum buffer realized using the slow-light effect in a silicon photonic crystal waveguide. As an approach to combine the merits of different waveguide platforms, a hybrid quantum circuit that integrates a silicon-based photon-pair source and a silica-based arrayed waveguide grating is also presented.
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Koch, T. L., and U. Koren. "Semiconductor photonic integrated circuits." IEEE Journal of Quantum Electronics 27, no. 3 (March 1991): 641–53. http://dx.doi.org/10.1109/3.81373.

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Nagarajan, R., M. Kato, J. Pleumeekers, P. Evans, S. Corzine, S. Hurtt, A. Dentai, et al. "InP Photonic Integrated Circuits." IEEE Journal of Selected Topics in Quantum Electronics 16, no. 5 (September 2010): 1113–25. http://dx.doi.org/10.1109/jstqe.2009.2037828.

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Peng, Hsuan-Tung, Mitchell A. Nahmias, Thomas Ferreira de Lima, Alexander N. Tait, and Bhavin J. Shastri. "Neuromorphic Photonic Integrated Circuits." IEEE Journal of Selected Topics in Quantum Electronics 24, no. 6 (November 2018): 1–15. http://dx.doi.org/10.1109/jstqe.2018.2840448.

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Liu, Yang, Zheru Qiu, Xinru Ji, Anton Lukashchuk, Jijun He, Johann Riemensberger, Martin Hafermann, et al. "A photonic integrated circuit–based erbium-doped amplifier." Science 376, no. 6599 (June 17, 2022): 1309–13. http://dx.doi.org/10.1126/science.abo2631.

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Erbium-doped fiber amplifiers revolutionized long-haul optical communications and laser technology. Erbium ions could provide a basis for efficient optical amplification in photonic integrated circuits but their use remains impractical as a result of insufficient output power. We demonstrate a photonic integrated circuit–based erbium amplifier reaching 145 milliwatts of output power and more than 30 decibels of small-signal gain—on par with commercial fiber amplifiers and surpassing state-of-the-art III-V heterogeneously integrated semiconductor amplifiers. We apply ion implantation to ultralow–loss silicon nitride (Si 3 N 4 ) photonic integrated circuits, which are able to increase the soliton microcomb output power by 100 times, achieving power requirements for low-noise photonic microwave generation and wavelength-division multiplexing optical communications. Endowing Si 3 N 4 photonic integrated circuits with gain enables the miniaturization of various fiber-based devices such as high–pulse-energy femtosecond mode-locked lasers.
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Dissertations / Theses on the topic "Photonic integrated circuits"

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Liu, Weilin. "Ultra-Fast Photonic Signal Processors Based on Photonic Integrated Circuits." Thesis, Université d'Ottawa / University of Ottawa, 2017. http://hdl.handle.net/10393/36446.

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Photonic signal processing has been considered a promising solution to overcome the inherent bandwidth limitations of its electronic counterparts. Over the last few years, an impressive range of photonic integrated signal processors have been proposed with the technological advances of III-V and silicon photonics, but the signal processors offer limited tunability or reconfigurability, a feature highly needed for the implementation of programmable photonic signal processors. In this thesis, tunable and reconfigurable photonic signal processors are studied. Specifically, a photonic signal processor based on the III-V material system having a single ring resonator structure for temporal integration and Hilbert transformation with a tunable fractional order and tunable operation wavelength is proposed and experimentally demonstrated. The temporal integrator has an integration time of 6331 ps, which is an order of magnitude longer than that provided by the previously reported photonic integrators. The processor can also provide a continuously tunable fractional order and a tunable operation wavelength. To enable general-purpose signal processing, a reconfigurable photonic signal processor based on the III-V material system having a three-coupled ring resonator structure is proposed and experimentally demonstrated. The reconfigurability of the processor is achieved by forward or reverse biasing the semiconductor optical amplifiers (SOAs) in the ring resonators, to change the optical geometry of the processor which allows the processor to perform different photonic signal processing functions including temporal integration, temporal differentiation, and Hilbert transformation. The integration time of the signal processor is measured to be 10.9 ns, which is largely improved compared with the single ring resonator structure due to a higher Q-factor. In addition, 1st, 2nd, and 3rd of temporal integration operations are demonstrated, as well as a continuously tunable order for differentiation and Hilbert transformation. The tuning range of the operation wavelength is 0.22 nm for the processor to perform the three functions. Compared with the III-V material system, the CMOS compatible SOI material system is more cost effective, and it offers a smaller footprint due to the strong refractive index contrast between silicon and silica. Active components such as phase modulators (PMs) can also be implemented. In this thesis, two photonic temporal differentiators having an interferometer structure to achieve active and passive fractional order tuning are proposed and experimentally demonstrated. For both the active and passive temporal differentiators, the fractional order can be tuned from 0 to 1. For the active temporal differentiator, the tuning range of the operation wavelength is 0.74 nm. The use of the actively tunable temporal differentiator to perform high speed coding with a data rate of 16 Gbps is also experimentally demonstrated.
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Neto, Hugo Daniel Barbosa. "Packaging of photonic integrated circuits." Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23552.

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Mestrado em Engenharia Eletrónica e Telecomunicações
With the continuous evolution of optical communication systems, emerged a need for high-performance optoelectronic elements at lower costs. Photonic packaging plays a key role for the next-generation of optical devices. In this work a standard packaging design rules is described, covering both the electrical and optical-packaging exploring both active and passive adjusting techniques, as well as the thermal management of the photonic integrated circuit (PIC). First a process for fiber-to-chip coupling with custom made ball-lensed fibers, is performed and tested initially in a testing-chip and thereafter in a manufactured practical study-case composed by a silicon holder with an InP distributed feedback (DFB) laser. The process of manufacturing etched V-grooves for fiber alignment is approached in detail. After this, for electrical interconnects and radio frequency (RF) packaging, both wire-bonding and flip-chip technique are discussed, and a characterization of the s-parameters in a PIC with wire-bonding is presented. A technique based on ruthenium-based sensors and platinum and titanium-based sensors for thermal control of the PIC is studied and the tested using a custom made PCB designed exclusively for that purpose.
Com a constante evolução dos sistemas de comunicação óticos veio a necessidade de componentes optoelectrónicos de elevada performance a custos relativamente baixos. O encapsulamento ótico tem um papel chave nos dispositivos óticos de última geração. Neste trabalho são descritas as regras de um processo de encapsulamento padrão, que abrange tanto o encapsulamento elétrico e ótico onde são exploradas técnicas de ajustamento ativas e passivas bem como o controlo térmico do circuito ótico integrado (PIC). No início foi efetuado um processo de acoplamento da fibra ao chip com fibras de lente esférica personalizadas, numa primeira usando um chip de teste e de seguida num caso de estudo prático que consiste numa estrutura composta por um holder de silício com um laser de realimentação distribuída (DFB). É abordado em detalhe o processo de fabricação de V-grooves para o alinhamento da fibra com o chip. De seguida são apresentadas e discutidas as técnicas de wire-bonding e flip-chip para o encapsulamento elétrico e ligação dos conectores de radiofrequência (RF), é feito um estudo onde são apresentados os resultados da caraterização dos parâmetros S de um PIC com wire-bonding. Para o controlo térmico do módulo é apresentada uma técnica baseada em sensores de temperatura de ruténio e sensores de Platina e titânio testada numa PCB personalizada
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Yang, Gang. "Compact Photonic Integrated Passive Circuits." Thesis, The University of Sydney, 2021. https://hdl.handle.net/2123/26958.

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Photonic Integrated Circuits (PICs) based on silicon photonics have received great interest due to the low loss caused by the high-refractive-index contrast and the complementary metal-oxide semiconductor compatibility. The need for high-density, high-yield, low-cost, low-power consumption, and large-scale on-chip photonic integration requires the technologies to further minimize the size while exhibiting high performance. Moreover, the fast development and expansion of silicon photonics devices for different applications and functionalities require effective design approaches to optimize the device performance while reducing the design complexity. In this thesis, several fundamental components for PICs are presented as the building blocks for advanced photonic circuits. To test the effectiveness of the design, Mach–Zehnder interferometers are simulated and fabricated on a Silicon-on-Insulator (SOI) platform, which shows a good agreement between the experimental and simulation results. Moreover, compact vertical grating couplers with broad optical bandwidth are studied. Experimental results show the compact size and the light coupling capabilities. Multimode Interference (MMI) splitter acts as one critical component in PICs. However, the minimum requirement of mid-to-mid channel spacing to avoid crosstalk limits the MMI size to be further reduced and thus limits the component density in the photonic integration. To solve this problem, a compact SOI MMI power splitter based on optical strip barriers is presented to achieve high crosstalk reduction. Three different MMI power splitters are designed and simulated with an ultra-small device footprint, high uniformity, while maintaining a low insertion loss of 0.4dB. Inverse design methods with different optimization algorithms are utilized to design compact and high-performance PIC components. Firstly, a sequential least-squares programming algorithm is introduced to inverse design a waveguide crossing. This gradient-based algorithm is suitable for simple structures with fewer parameters, or a good starting point can be obtained from experience or physical theories. Secondly, a novel dynamic iterative batch optimization method is presented in the thesis to design a high-performance segmented mode expander. In the simulation, the optimized structure achieves a coupling efficiency of 81% for TE polarization at the wavelength of 1550nm. It also shows a simulated transmission loss of lower than -1.137dB within 60nm bandwidth. This approach paves the way for the rapid design of PIC components with a compact footprint. Additionally, a Direct Binary Search (DBS) algorithm is introduced for designing pixel-like structures with binary-value-represented topology patterns, where a 3dB beam splitter is used in the design. DBS algorithm can be utilized to generate a high-quality dataset used for deep learning acceleration methods. To solve the time-efficiency and non-scalable issues of conventional inverse design methods, a neural network-based inverse design approach is presented and applied on the design of a wavelength demultiplexer structure. The method solves the data domain shift problem that existed in the conventional tandem network architecture and improves the prediction accuracy with a 99% validation accuracy. It also shows high stability and robustness to the quantity and quality of training data. The demonstrated wavelength demultiplexer has an ultra-compact footprint of 2.6×2.6μm2, a high transmission efficiency with a transmission loss of -2dB, and a low crosstalk around -7dB simultaneously.
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Chong, Harold Meng Hoon. "Photonic crystal and photonic wire structures for photonic integrated circuits." Thesis, University of Glasgow, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.407719.

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Marinins, Aleksandrs. "Polymer Components for Photonic Integrated Circuits." Doctoral thesis, KTH, Skolan för teknikvetenskap (SCI), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-219556.

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Optical polymers are a subject of research and industry implementation for many decades. Optical polymers are inexpensive, easy to process and flexible enough to meet a broad range of application-specific requirements. These advantages allow a development of cost-efficient polymer photonic integrated circuits for on-chip optical communications. However, low refractive index contrast between core and cladding limits light confinement in a core and, consequently, integrated polymer device miniaturization. Also, polymers lack active functionality like light emission, amplification, modulation, etc. In this work, we improved a performance of integrated polymer waveguides and demonstrated active waveguide devices. Also, we present novel Si QD/polymer optical materials. In the integrated device part, we demonstrate optical waveguides with enhanced performance. Decreased radiation losses in air-suspended curved waveguides allow low-loss bending with radii of only 15 µm, which is far better than >100 µm for typical polymer waveguides. Another study shows a positive effect of thermal treatment on acrylate waveguides. By heating higher than polymer glass transition temperature, surface roughness is reflown, minimizing scattering losses. This treatment method enhances microring resonator Q factor more than 2 times. We also fabricated and evaluated all-optical intensity modulator based on PMMA waveguides doped with Si QDs. We developed novel hybrid optical materials. Si QDs are encapsulated into PMMA and OSTE polymers. Obtained materials show stable photoluminescence with high quantum yield. We achieved the highest up to date ~65% QY for solid-state Si QD composites. Demonstrated materials are a step towards Si light sources and active devices. Integrated devices and materials presented in this work enhance the performance and expand functionality of polymer PICs. The components described here can also serve as building blocks for on-chip sensing applications, microfluidics, etc.

QC 20171207

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Alipour, Motaallem Seyed Payam. "Reconfigurable integrated photonic circuits on silicon." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/51792.

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Integrated optics as a platform for signal processing offers significant benefits such as large bandwidth, low loss, and a potentially high degree of reconfigurability. Silicon (Si) has unique advantages as a material platform for integration, as well as properties such as a strong thermo-optic mechanism that allows for the realization of highly reconfigurable photonic systems. Chapter 1 is devoted to the discussion of these advantages, and Chapter 2 provides the theoretical background for the analysis of integrated Si-photonic devices. The thermo-optic property of Si, while proving extremely useful in facilitating reconfiguration, can turn into a nuisance when there is a need for thermally stable devices on the photonic chip. Chapter 3 presents a technique for resolving this issue without relying on a dynamic temperature stabilization process. Temperature-insensitive (or “athermal”) Si microdisk resonators with low optical loss are realized by using a polymer overlayer whose thermo-optic property is opposite to that of Si, and TiO2 is introduced as an alternative to polymer to deal with potential CMOS-compatibility issues. Chapter 4 demonstrates an ultra-compact, low-loss, fully reconfigurable, and high-finesse integrated photonic filter implemented on a Si chip, which can be used for RF-photonic as well as purely optical signal processing purposes. A novel, thermally reconfigurable reflection suppressor is presented in Chapter 5 for on-chip feedback elimination which can be critical for mitigating spurious interferences and protecting lasers from disturbance. Chapter 6 demonstrates a novel device for on-chip control of optical fiber polarization. Chapter 7 deals with select issues in the implementation of Si integrated photonic circuits. Chapter 8 concludes the dissertation.
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Rodrigues, Carla Iolanda Costa. "Photonic integrated circuits for NG-EPON." Master's thesis, Universidade de Aveiro, 2016. http://hdl.handle.net/10773/22732.

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Mestrado em Engenharia Electrónica e Telecomunicações
Along with privacy and security, the growth of demand from the consumer for higher bandwidth presents one of the most important modern challenges in telecommunications infrastructures. The researchers were encouraged to nd not only e cient but also the economically viable solutions capable of meeting the growing needs of the consumer. Optical communications are the way that can accompany this growth. The Passive Optical Network (PON) is an architecture that shares the ber bandwidth among several users. There has been a constant study under this topic for the purpose of using all the ber abilities and to nd new solutions to keep the access network simple. Photonic Integrated Circuits (PICs) are a technology that emerged to help the complexity of the hardware that exists nowadays. It is a single chip capable of integrating numerous optical components, which leads to a reduced complexity, size and power consumption. These are the important characteristics that make the PICs a powerful tool to use in several applications. This dissertation presents a monolithic PIC transceiver in the context of Next Generation of Ethernet Passive Optical Network (NG-EPON) which aims to design and implement integrated optical circuits for future access networks. The transceiver architecture is able to be used as an Optical Network Unit (ONU) with a 4 channels approach for 100 Gb/s solutions. The present work contributed for the FUTPON project supported by P2020.
Em par com a privacidade e segurança, a crescente procura do consumidor por maiores larguras de banda apresenta um dos mais importantes desafios modernos das infraestruturas de telecomunicações. Esta procura incentiva assim a investigação de novas soluções não são eficientes, mas também economicamente viáveis, capazes de satisfazer as crescentes necessidades do consumidor. As comunicações óticas apresentam ser o meio apropriado para acompanhar este crescimento. A Rede Óptica Passiva (PON) e uma arquitectura usada para distribuição de fibra ótica ate ao consumidor final. Esta tecnologia permite dividir a largura de banda de uma única fibra por diferentes clientes. Tem havido um estudo constante no âmbito deste tópico para conseguir tirar máximo partido das capacidades da fibra e de modo a encontrar novas soluções para tornar este método mais simples. Os Circuitos Oticos Integrados (PIC) sao uma tecnologia que surge para ajudar na complexidade do hardware existente hoje em dia. Consiste num único chip capaz de integrar vários componentes óticos, o que leva a uma diminuição da complexidade, tamanho e redução do consumo de energia. Estas características fazem com que seja uma tecnologia vantajosa para uso em diferentes aplicações. O desenho e a implementação da arquitectura do transrecetor em formato PIC no contexto da Next Generation of Ethernet Passive Optical Network (NG-EPON), e o principal objectivo desta dissertação onde visa o desenvolvimento circuitos óticos integrados para redes oticas de acesso futuras. Esta arquitectura devera ser utilizada como Optical Network Unit (ONU) contendo 4 canais para atingir 100 Gb/s. Este trabalho contribuiu para o projecto FUTPON suportado pelo P2020.
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Koch, Thomas L., Michael Liehr, Douglas Coolbaugh, John E. Bowers, Rod Alferness, Michael Watts, and Lionel Kimerling. "The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem." SPIE-INT SOC OPTICAL ENGINEERING, 2016. http://hdl.handle.net/10150/621540.

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The American Institute for Manufacturing Integrated Photonics (AIM Photonics) is focused on developing an end- to- end integrated photonics ecosystem in the U.S., including domestic foundry access, integrated design tools, automated packaging, assembly and test, and workforce development. This paper describes how the institute has been structured to achieve these goals, with an emphasis on advancing the integrated photonics ecosystem. Additionally, it briefly highlights several of the technological development targets that have been identified to provide enabling advances in the manufacture and application of integrated photonics.
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Williams, Ryan Daniel. "Photonic integrated circuits for optical logic applications." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/42025.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007.
This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Includes bibliographical references.
The optical logic unit cell is the photonic analog to transistor-transistor logic in electronic devices. Active devices such as InP-based semiconductor optical amplifiers (SOA) emitting at 1550 nm are vertically integrated with passive waveguides using the asymmetric twin waveguide technique and the SOAs are placed in a Mach-Zehnder interferometer (MZI) configuration. By sending in high-intensity pulses, the gain characteristics, phase-shifting, and refractive indices of the SOA can be altered, creating constructive or deconstructive interference at the MZI output. Boolean logic and wavelength conversion can be achieved using this technique, building blocks for optical switching and signal regeneration. The fabrication of these devices is complex and the fabrication of two generations of devices is described in this thesis, including optimization of the mask design, photolithography, etching, and backside processing techniques. Testing and characterization of the active and passive components is also reported, confirming gain and emission at 1550 nm for the SOAs, as well as verifying evanescent coupling between the active and passive waveguides. In addition to the vertical integration of photonic waveguides, Esaki tunnel junctions are investigated for vertical electronic integration. Quantum dot formation and growth via molecular beam epitaxy is investigated for emission at the technologically important wavelength of 1310 nm. The effect of indium incorporation on tunnel junctions is investigated. The tunnel junctions are used to epitaxially link multiple quantum dot active regions in series and lasers are designed, fabricated, and tested.
by Ryan Daniel Williams.
Ph.D.
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Franco, Eduardo Vala. "Photonic integrated circuits for next generation PONs." Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23473.

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Mestrado em Engenharia Eletrónica e Telecomunicação
We are living in a time where communications became essential for most of our lives, whether it's in the business world, or in our own homes. The increasing need of higher bandwidth inhibits other networks other than optical ber based ones. Nowadays communications are responsible for a substantial percentage of our energetic footprint, hence Passive Optical Network(PON) are a strong contender for the next step of network implementation. These networks present a low energy consumption because between the transmitter and the receiver the signal stays in the optical domain. Although the increasing needs of bandwidth is almost across the communication world, certain services/identities need more bandwidth whether is download or upload. It's easy to understand that di erent consumers have unique needs. It's necessary to develop an architecture that serves all the costumers, in other words, there is a need for a network that provides high bitrate tra c to the users that needs it but also a network that serves the low end user that is not interested in this increase of bandwidth and therefore price in ation. There is today technologies yet to be widely implemented like NG-PON2 that were not implemented in a large scale because they dont represent a nancial return to the telecom operators simply because there is not enough user that requires the high bandwidth delivered by NG-PON2. It's necessary to nd a solution that includes not only the modern technologies but also the already implemented ones. With the objective of nding a solution for the problems mentioned before, this dissertation has the objective of designing a Photonic Integrated Circuit(PIC) that aims to be a transceiver of a Multitech Network that will be composed by the following technologies: Video-Overlay, XG-PON e NG-PON2. This dissertation presents an approach on Passive Optical Networks( PON) and the standards of the said technologies as well as a study of the components needed to assemble the transceiver using the programs ASPIC and VPI Photonics . In the end, there will be presented an architecture for the transceiver to be used in a Optical Network Unit(ONU), and the respective mask Layout.
Vivemos numa época em que as comunicações se tornaram essenciais para grande parte da nossa vida, seja no mundo empresarial, seja nas nossas habitações. A crescente necessidade de aumento de largura de banda inviabiliza outras redes que não baseadas em braotica. Actualmente as comunicações são responsáveis por uma percentagem substancial dos nossos gastos energéticos, justamente por este facto Passive Optical Networks(PON) sao as principais candidatas ao próximo passo no desenvolvimento de redes. Estas apresentam menor consumo energético, pois entre o emissor e o receptor todo o sinal permanece no domínio óptico. Apesar da necessidade de largura de banda estar a aumentar de um modo transversal no mundo das telecomunicações, certos serviços/entidades necessitam de maiores velocidades tanto em termos de download como em termos de upload. E então fácil de perceber que consumidores diferentes têm necessidades diferentes. E necessário encontrar uma arquitectura que agrade a quem necessita de maiores larguras de banda mas também a quem não necessita de um aumento significativo e que, não está disposto a pagar por este. Existem neste momento tecnologias que ainda não foram implementadas em grandes escalas, como o caso de Next Generation Passive Optical Network (NG-PON2), porque não simbolizam um retorno financeiro para as grande operadores, uma vez que o número de potenciais consumidores de tais velocidades ainda não e substancialmente grande. E necessário encontrar uma solução que não so englobe as novas tecnologias como também as já existentes. Com o objectivo de se encontrar um solução para os problemas acima referidos, este trabalho assenta na elaboração de um Circuito integrado fotonico que visa ser um transrecetor de uma arquitetura multi-tecnologia em que irão ser incorporadas tecnologias como Video-Overlay, 10 Gigabit-capable Passive Optical Network (XG-PON) e NG-PON2. Esta dissertação apresenta uma abordagem as Redes Oticas Passivas e também um estudo feito aos componentes usados no transreceptor usando os programas Aspic e VPI Photonics . Porém ser a apresentado o desenho final do transreceptor que ser a usado numa Optical Network Unit(ONU).
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Books on the topic "Photonic integrated circuits"

1

Osgood, Richard, and Xiang Meng. Principles of Photonic Integrated Circuits. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-65193-0.

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Lacoursiere, Catherine. Photonic integrated circuits: New directions. Norwalk, CT: Business Communications Co., 2005.

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Lacoursiere, Catherine. Photonic integrated circuits: New directions. Norwalk, CT: Business Communications Co., 2002.

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Coldren, Larry A., Scott W. Corzine, and Milan L. Mašanović. Diode Lasers and Photonic Integrated Circuits. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118148167.

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Corzine, S. W. (Scott W.) and Mashanovitch Milan 1974-, eds. Diode lasers and photonic integrated circuits. 2nd ed. Hoboken, N.J: Wiley, 2012.

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W, Corzine S., ed. Diode lasers and photonic integrated circuits. New York: Wiley, 1995.

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C, Righini Giancarlo, SPIE Europe, Bas-Rhin (France) Conseil général, and Society of Photo-optical Instrumentation Engineers., eds. Integrated optics, silicon photonics, and photonic integrated circuits: 3-5 April 2006, Strasbourg, France. Bellingham, Wash: SPIE, 2006.

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1932-, Suematsu Yasuharu, and Adams A. R, eds. Handbook of semiconductor lasers and photonic integrated circuits. Tokyo: Chapman & Hall, 1994.

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Righini, Giancarlo C. Silicon photonics and photonic integrated circuits: 7-10 April 2008, Strasbourg, France. Bellingham, Wash: SPIE, 2008.

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Righini, Giancarlo C. Silicon photonics and photonic integrated circuits: 7-10 April 2008, Strasbourg, France. Edited by SPIE Europe, Alsace international, Association française des industries de l'optique et de la photonique, and SPIE (Society). Bellingham, Wash: SPIE, 2008.

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Book chapters on the topic "Photonic integrated circuits"

1

Bergman, Keren, Luca P. Carloni, Aleksandr Biberman, Johnnie Chan, and Gilbert Hendry. "Photonic Interconnects." In Integrated Circuits and Systems, 11–26. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4419-9335-9_2.

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Bergman, Keren, Luca P. Carloni, Aleksandr Biberman, Johnnie Chan, and Gilbert Hendry. "Photonic Network Architectures III: Advanced Photonic Architectures." In Integrated Circuits and Systems, 173–202. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4419-9335-9_7.

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Muller, Paul, and Yusuf Leblebici. "Integrated Photonic Systems." In Analog Circuits and Signal Processing, 5–11. Dordrecht: Springer Netherlands, 2007. http://dx.doi.org/10.1007/978-1-4020-5912-4_2.

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Baets, Roel, Wim Bogaerts, Bart Kuyken, Abdul Rahim, Günther Roelkens, Thijs Spuesens, Joris Van Campenhout, and Dries Van Thourhout. "Silicon Photonic Integrated Circuits." In Springer Series in Optical Sciences, 673–737. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-42367-8_14.

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Zimmermann, Horst. "Circuits for Electronic-Photonic Integration." In Silicon Optoelectronic Integrated Circuits, 407–33. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-030-05822-7_7.

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Bergman, Keren, Luca P. Carloni, Aleksandr Biberman, Johnnie Chan, and Gilbert Hendry. "Photonic Simulation and Design Space." In Integrated Circuits and Systems, 79–99. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4419-9335-9_4.

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Asakawa, K., and K. Inoue. "Application to Ultrafast Optical Planar Integrated Circuits." In Photonic Crystals, 261–84. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-540-40032-5_12.

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Wakao, Kiyohide. "Optoelectronic and Photonic Integrated Circuits." In Waveguide Optoelectronics, 205–23. Dordrecht: Springer Netherlands, 1992. http://dx.doi.org/10.1007/978-94-011-1834-7_10.

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Agrawal, Govind P., and Niloy K. Dutta. "Photonic and Optoelectronic Integrated Circuits." In Semiconductor Lasers, 530–46. Boston, MA: Springer US, 1993. http://dx.doi.org/10.1007/978-1-4613-0481-4_12.

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Koren, Uziel. "Waveguide Based Photonic Integrated Circuits." In Optoelectronic Integration: Physics, Technology and Applications, 233–72. Boston, MA: Springer US, 1994. http://dx.doi.org/10.1007/978-1-4615-2686-5_7.

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Conference papers on the topic "Photonic integrated circuits"

1

Yao, Jianping. "Photonic integrated circuits for microwave photonics." In 2017 IEEE Photonics Conference (IPC). IEEE, 2017. http://dx.doi.org/10.1109/pc2.2017.8283405.

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Yao, Jianping. "Photonic Integrated Circuits for Microwave Photonics." In Conference on Lasers and Electro-Optics/Pacific Rim. Washington, D.C.: OSA, 2018. http://dx.doi.org/10.1364/cleopr.2018.w1l.1.

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Coldren, Larry A. "Photonic Integrated Circuits for microwave photonics." In 2010 IEEE Topical Meeting on Microwave Photonics (MWP 2010). IEEE, 2010. http://dx.doi.org/10.1109/mwp.2010.5664249.

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Moore, Kaitlin R. "Photonics in quantum: Photonic integrated circuits." In Quantum West, edited by Conference Chair. SPIE, 2021. http://dx.doi.org/10.1117/12.2593561.

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KOCH, THOMAS L., and U. KOREN. "Photonic integrated circuits." In Optical Fiber Communication Conference. Washington, D.C.: OSA, 1990. http://dx.doi.org/10.1364/ofc.1990.thi1.

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Koren, Uziel. "Photonic integrated circuits." In Semiconductors '92, edited by John E. Bowers and Umesh K. Mishra. SPIE, 1992. http://dx.doi.org/10.1117/12.137705.

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Domenech, J. David, Marco A. G. Porcel, Hilde Jans, Romano Hoofman, Douwe Geuzebroek, Pieter Dumon, Marcel van der Vliet, et al. "PIX4life: photonic integrated circuits for bio-photonics." In Integrated Photonics Research, Silicon and Nanophotonics. Washington, D.C.: OSA, 2018. http://dx.doi.org/10.1364/iprsn.2018.ith3b.1.

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Koch, T. L., and U. Koren. "Semiconductor photonic integrated circuits." In Integrated Photonics Research. Washington, D.C.: Optica Publishing Group, 1990. http://dx.doi.org/10.1364/ipr.1990.ma3.

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Photonic integrated circuits (PICs) are that subset of optoelectronic integrated circuits (OEICs) that focus primarily on the integration of interconnected guided-wave optical devices. A good example of a simple but potentially important PIC is the butt-coupled integration of a distributed feedback (DFB) laser with an electroabsorption modulator to provide a low-chirp high-speed modulated source.1 Many researchers have also pointed out that three-section continuously tunable distributed Bragg reflector (DBR) lasers are also PICs, with an integrated multielement resonator composed of a separately controlled gain medium, phase shifter, and tunable Bragg mirror.2-4
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Chen, Lawrence R., Reza Ashrafi, Junjia Wang, Mohammad Rezagholipour Dizaji, M. Shafiqul Hai, Odile Liboiron-Ladouceur, and Rhys Adams. "Photonic integrated circuits for microwave photonics applications." In 2014 International Topical Meeting on Microwave Photonics (MWP) jointly held with the 2014 9th Asia-Pacific Microwave Photonics Conference (APMP). IEEE, 2014. http://dx.doi.org/10.1109/mwp.2014.6994482.

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Faurby, Carlos F. D., Ying Wang, Stefano Paesani, Fabian Ruf, Nicolas Volet, Martijn J. R. Heck, Andreas D. Wieck, Arne Ludwig, Leonardo Midolo, and Peter Lodahl. "Quantum-Dot Single-Photon Sources Processed on Silicon-Nitride Integrated Circuits." In CLEO: Fundamental Science. Washington, D.C.: Optica Publishing Group, 2023. http://dx.doi.org/10.1364/cleo_fs.2023.fth4j.4.

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We couple single photons from a quantum dot source to Silicon Nitride integrated photonic circuits and show several applications: multiphoton interfence, entanglement generation and quantum error mitigation. The results open new paths for heteroge-neous integrated quantum photonics at scale.
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Reports on the topic "Photonic integrated circuits"

1

Shakouri, Ali, Bin Liu, Patrick Abraham, and John E. Bowers. 3D Photonic Integrated Circuits for WDM Applications. Fort Belvoir, VA: Defense Technical Information Center, January 1998. http://dx.doi.org/10.21236/ada461796.

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Yang, Guosong. Applications of photonic integrated circuits in biomedicine. ResearchHub Technologies, Inc., May 2024. http://dx.doi.org/10.55277/researchhub.qqgg5z6j.

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Adibi, Ali. PECASE: All-Optical Photonic Integrated Circuits in Silicon. Fort Belvoir, VA: Defense Technical Information Center, January 2011. http://dx.doi.org/10.21236/ada559908.

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Englund, Dirk, Karl Berggren, Jeffrey Shapiro, Chee W. Wong, Franco Wong, and Gregory Wornell. High-Speed Quantum Key Distribution Using Photonic Integrated Circuits. Fort Belvoir, VA: Defense Technical Information Center, January 2013. http://dx.doi.org/10.21236/ada606948.

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Englund, Dirk, Karl Berggren, Jeffrey Shapiro, Chee W. Wong, Franco Wong, and Gregory Wornell. High-Speed Large-Alphabet Quantum Key Distribution Using Photonic Integrated Circuits. Fort Belvoir, VA: Defense Technical Information Center, January 2014. http://dx.doi.org/10.21236/ada603763.

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Christodoulou, Christos. (DCT) A Reconfigurable RF Photonics Unit Cell For Integrated Circuits. Fort Belvoir, VA: Defense Technical Information Center, August 2012. http://dx.doi.org/10.21236/ada578997.

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Vawter, G. A., A. Mar, J. Zolper, and V. Hietala. Photonic integrated circuit for all-optical millimeter-wave signal generation. Office of Scientific and Technical Information (OSTI), March 1997. http://dx.doi.org/10.2172/469141.

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Sullivan, C. T. GaAs Photonic Integrated Circuit (PIC) development for high performance communications. Office of Scientific and Technical Information (OSTI), March 1998. http://dx.doi.org/10.2172/607505.

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