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Journal articles on the topic 'Photonic integrated circuits'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 June 2024

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1

Dong, Po, Young-Kai Chen, Guang-Hua Duan, and David T. Neilson. "Silicon photonic devices and integrated circuits." Nanophotonics 3, no. 4-5 (August 1, 2014): 215–28. http://dx.doi.org/10.1515/nanoph-2013-0023.

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AbstractSilicon photonic devices and integrated circuits have undergone rapid and significant progresses during the last decade, transitioning from research topics in universities to product development in corporations. Silicon photonics is anticipated to be a disruptive optical technology for data communications, with applications such as intra-chip interconnects, short-reach communications in datacenters and supercomputers, and long-haul optical transmissions. Bell Labs, as the research organization of Alcatel-Lucent, a network system vendor, has an optimal position to identify the full potential of silicon photonics both in the applications and in its technical merits. Additionally it has demonstrated novel and improved high-performance optical devices, and implemented multi-function photonic integrated circuits to fulfill various communication applications. In this paper, we review our silicon photonic programs and main achievements during recent years. For devices, we review high-performance single-drive push-pull silicon Mach-Zehnder modulators, hybrid silicon/III-V lasers and silicon nitride-assisted polarization rotators. For photonic circuits, we review silicon/silicon nitride integration platforms to implement wavelength-division multiplexing receivers and transmitters. In addition, we show silicon photonic circuits are well suited for dual-polarization optical coherent transmitters and receivers, geared for advanced modulation formats. We also discuss various applications in the field of communication which may benefit from implementation in silicon photonics.

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2

Xiang, Chao, Warren Jin, Osama Terra, Bozhang Dong, Heming Wang, Lue Wu, Joel Guo, et al. "3D integration enables ultralow-noise isolator-free lasers in silicon photonics." Nature 620, no. 7972 (August 2, 2023): 78–85. http://dx.doi.org/10.1038/s41586-023-06251-w.

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AbstractPhotonic integrated circuits are widely used in applications such as telecommunications and data-centre interconnects1–5. However, in optical systems such as microwave synthesizers6, optical gyroscopes7 and atomic clocks8, photonic integrated circuits are still considered inferior solutions despite their advantages in size, weight, power consumption and cost. Such high-precision and highly coherent applications favour ultralow-noise laser sources to be integrated with other photonic components in a compact and robustly aligned format—that is, on a single chip—for photonic integrated circuits to replace bulk optics and fibres. There are two major issues preventing the realization of such envisioned photonic integrated circuits: the high phase noise of semiconductor lasers and the difficulty of integrating optical isolators directly on-chip. Here we challenge this convention by leveraging three-dimensional integration that results in ultralow-noise lasers with isolator-free operation for silicon photonics. Through multiple monolithic and heterogeneous processing sequences, direct on-chip integration of III–V gain medium and ultralow-loss silicon nitride waveguides with optical loss around 0.5 decibels per metre are demonstrated. Consequently, the demonstrated photonic integrated circuit enters a regime that gives rise to ultralow-noise lasers and microwave synthesizers without the need for optical isolators, owing to the ultrahigh-quality-factor cavity. Such photonic integrated circuits also offer superior scalability for complex functionalities and volume production, as well as improved stability and reliability over time. The three-dimensional integration on ultralow-loss photonic integrated circuits thus marks a critical step towards complex systems and networks on silicon.

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3

Zhang, Chuang, Chang-Ling Zou, Yan Zhao, Chun-Hua Dong, Cong Wei, Hanlin Wang, Yunqi Liu, Guang-Can Guo, Jiannian Yao, and Yong Sheng Zhao. "Organic printed photonics: From microring lasers to integrated circuits." Science Advances 1, no. 8 (September 2015): e1500257. http://dx.doi.org/10.1126/sciadv.1500257.

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A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

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4

Yakushenkov, P. O. "Photonic Integrated Circuits." Photonics Russia 68, no. 8 (2017): 58–67. http://dx.doi.org/10.22184/1993-7296.2017.68.8.58.67.

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5

Koch, Thomas L., and Uziel Koren. "Photonic Integrated Circuits." AT&T Technical Journal 71, no. 1 (January 2, 1992): 63–74. http://dx.doi.org/10.1002/j.1538-7305.1992.tb00148.x.

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6

Matsuda, Nobuyuki, and Hiroki Takesue. "Generation and manipulation of entangled photons on silicon chips." Nanophotonics 5, no. 3 (August 1, 2016): 440–55. http://dx.doi.org/10.1515/nanoph-2015-0148.

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AbstractIntegrated quantum photonics is now seen as one of the promising approaches to realize scalable quantum information systems. With optical waveguides based on silicon photonics technologies, we can realize quantum optical circuits with a higher degree of integration than with silica waveguides. In addition, thanks to the large nonlinearity observed in silicon nanophotonic waveguides, we can implement active components such as entangled photon sources on a chip. In this paper, we report recent progress in integrated quantum photonic circuits based on silicon photonics. We review our work on correlated and entangled photon-pair sources on silicon chips, using nanoscale silicon waveguides and silicon photonic crystal waveguides. We also describe an on-chip quantum buffer realized using the slow-light effect in a silicon photonic crystal waveguide. As an approach to combine the merits of different waveguide platforms, a hybrid quantum circuit that integrates a silicon-based photon-pair source and a silica-based arrayed waveguide grating is also presented.

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7

Koch, T. L., and U. Koren. "Semiconductor photonic integrated circuits." IEEE Journal of Quantum Electronics 27, no. 3 (March 1991): 641–53. http://dx.doi.org/10.1109/3.81373.

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8

Nagarajan, R., M. Kato, J. Pleumeekers, P. Evans, S. Corzine, S. Hurtt, A. Dentai, et al. "InP Photonic Integrated Circuits." IEEE Journal of Selected Topics in Quantum Electronics 16, no. 5 (September 2010): 1113–25. http://dx.doi.org/10.1109/jstqe.2009.2037828.

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9

Peng, Hsuan-Tung, Mitchell A. Nahmias, Thomas Ferreira de Lima, Alexander N. Tait, and Bhavin J. Shastri. "Neuromorphic Photonic Integrated Circuits." IEEE Journal of Selected Topics in Quantum Electronics 24, no. 6 (November 2018): 1–15. http://dx.doi.org/10.1109/jstqe.2018.2840448.

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10

Liu, Yang, Zheru Qiu, Xinru Ji, Anton Lukashchuk, Jijun He, Johann Riemensberger, Martin Hafermann, et al. "A photonic integrated circuit–based erbium-doped amplifier." Science 376, no. 6599 (June 17, 2022): 1309–13. http://dx.doi.org/10.1126/science.abo2631.

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Erbium-doped fiber amplifiers revolutionized long-haul optical communications and laser technology. Erbium ions could provide a basis for efficient optical amplification in photonic integrated circuits but their use remains impractical as a result of insufficient output power. We demonstrate a photonic integrated circuit–based erbium amplifier reaching 145 milliwatts of output power and more than 30 decibels of small-signal gain—on par with commercial fiber amplifiers and surpassing state-of-the-art III-V heterogeneously integrated semiconductor amplifiers. We apply ion implantation to ultralow–loss silicon nitride (Si 3 N 4 ) photonic integrated circuits, which are able to increase the soliton microcomb output power by 100 times, achieving power requirements for low-noise photonic microwave generation and wavelength-division multiplexing optical communications. Endowing Si 3 N 4 photonic integrated circuits with gain enables the miniaturization of various fiber-based devices such as high–pulse-energy femtosecond mode-locked lasers.

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11

Soref, Richard. "The Achievements and Challenges of Silicon Photonics." Advances in Optical Technologies 2008 (July 2, 2008): 1–7. http://dx.doi.org/10.1155/2008/472305.

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A brief overview of silicon photonics is given here in order to provide a context for invited and contributed papers in this special issue. Recent progress on silicon-based photonic components, photonic integrated circuits, and optoelectronic integrated circuits is surveyed. Present and potential applications are identified along with the scientific and engineering challenges that must be met in order to actualize applications. Some on-going government-sponsored projects in silicon optoelectronics are also described.

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12

Soref, Richard. "Reconfigurable Integrated Optoelectronics." Advances in OptoElectronics 2011 (May 4, 2011): 1–15. http://dx.doi.org/10.1155/2011/627802.

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Integrated optics today is based upon chips of Si and InP. The future of this chip industry is probably contained in the thrust towards optoelectronic integrated circuits (OEICs) and photonic integrated circuits (PICs) manufactured in a high-volume foundry. We believe that reconfigurable OEICs and PICs, known as ROEICs and RPICs, constitute the ultimate embodiment of integrated photonics. This paper shows that any ROEIC-on-a-chip can be decomposed into photonic modules, some of them fixed and some of them changeable in function. Reconfiguration is provided by electrical control signals to the electro-optical building blocks. We illustrate these modules in detail and discuss 3D ROEIC chips for the highest-performance signal processing. We present examples of our module theory for RPIC optical lattice filters already constructed, and we propose new ROEICs for directed optical logic, large-scale matrix switching, and 2D beamsteering of a phased-array microwave antenna. In general, large-scale-integrated ROEICs will enable significant applications in computing, quantum computing, communications, learning, imaging, telepresence, sensing, RF/microwave photonics, information storage, cryptography, and data mining.

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13

Krochin-Yepez, Pedro-Andrei, Ulrike Scholz, and Andre Zimmermann. "CMOS-Compatible Measures for Thermal Management of Phase-Sensitive Silicon Photonic Systems." Photonics 7, no. 1 (January 1, 2020): 6. http://dx.doi.org/10.3390/photonics7010006.

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To date, several photonic applications have been demonstrated without considerable thermal management efforts. However, in phase-sensitive photonic applications, thermal management becomes of utmost importance. Thermal management of photonic systems requires not only efficient heat dissipation, but also reduction of on-chip temperature gradients. Particularly in highly integrated systems, in which several components are integrated within a single photonic integrated circuit, the reduction of on-chip temperature gradients is necessary to guarantee the correct functionality of the system. Due to their high integration density as well as their extreme temperature sensitivity, optical phased arrays are ideal examples of a system, where thermal management is required. Ideally, thermal management solutions of such systems should not require additional power for operation. Therefore, it is desired to improve the heat dissipation and to reduce temperature gradients by structural modifications of the photonic circuit. Furthermore, to cope with the advantages of silicon photonics, thermal management solutions must be compatible with series fabrication processes. In this work, complementary metal–oxide–semiconductor (CMOS)-compatible measures for thermal management of silicon photonic integrated circuits are proposed and validated by characterization of in-house fabricated thermal demonstrators. The proposed concepts are extremely efficient not only in reducing temperature gradients, but also in improving the heat dissipation from integrated heat sources.

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14

Nikitskiy, Ivan. "Advancements in hybrid photonics integration." PhotonicsViews 21, no. 1 (January 16, 2024): 60–63. http://dx.doi.org/10.1002/phvs.202400004.

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AbstractThis article examines the latest developments in hybrid photonics integration, with a focus on the European ecosystem. It discusses the transition from low‐cost prototyping of photonic integrated circuits to the pilot line production of photonic chips.

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15

Sun, Haoyang, Qifeng Qiao, Qingze Guan, and Guangya Zhou. "Silicon Photonic Phase Shifters and Their Applications: A Review." Micromachines 13, no. 9 (September 12, 2022): 1509. http://dx.doi.org/10.3390/mi13091509.

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With the development of silicon photonics, dense photonic integrated circuits play a significant role in applications such as light detection and ranging systems, photonic computing accelerators, miniaturized spectrometers, and so on. Recently, extensive research work has been carried out on the phase shifter, which acts as the fundamental building block in the photonic integrated circuit. In this review, we overview different types of silicon photonic phase shifters, including micro-electro-mechanical systems (MEMS), thermo-optics, and free-carrier depletion types, highlighting the MEMS-based ones. The major working principles of these phase shifters are introduced and analyzed. Additionally, the related works are summarized and compared. Moreover, some emerging applications utilizing phase shifters are introduced, such as neuromorphic computing systems, photonic accelerators, multi-purpose processing cores, etc. Finally, a discussion on each kind of phase shifter is given based on the figures of merit.

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16

Piramidowicz, R., S. Stopiński, K. Ławniczuk, K. Welikow, P. Szczepański, X. J. M. Leijtens, and M. K. Smit. "Photonic integrated circuits – a new approach to laser technology." Bulletin of the Polish Academy of Sciences: Technical Sciences 60, no. 4 (December 1, 2012): 683–89. http://dx.doi.org/10.2478/v10175-012-0079-5.

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Abstract In this work a brief review on photonic integrated circuits (PICs) is presented with a specific focus on integrated lasers and amplifiers. The work presents the history of development of the integration technology in photonics and its comparison to microelectronics. The major part of the review is focused on InP-based photonic integrated circuits, with a short description of the potential of the silicon technology. A completely new way of fabrication of PICs, called generic integration technology, is presented and discussed. The basic assumption of this approach is the very same as in the case of electronic circuits and states that a limited set of standard components, both active and passive, enables designing of a complex, multifunctional PIC of every type. As a result, functionally advanced, compact, energy efficient and cost-optimized photonic devices can be fabricated. The work presents also selected examples of active PICs like multiwavelength laser sources, discretely tunable lasers, WDM transmitters, ring lasers etc.

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17

T, Sridarshini, Geerthana S, Balaji V R, Arun Thirumurugan, Sitharthan R, Sivanantha Raja A, and Shanmuga Sundar Dhanabalan. "Ultra-compact all-optical logical circuits for photonic integrated circuits." Laser Physics 33, no. 7 (June 8, 2023): 076207. http://dx.doi.org/10.1088/1555-6611/acd7dd.

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Abstract In this paper, a photonic crystal based ultra-compact Optical XOR gate followed by an optical half-subtractor is proposed. Plane wave expansion is used to evaluate the photonic bandgap of the devised structure. The output and efficiency of logical circuits can be improved by maintaining distinct thresholds for the output logic states, thereby enabling the design to operate even in low power inputs. Reliability of the structure is enhanced by retaining a threshold for the output value. The performance of the proposed circuit is examined using the Finite Difference Time Domain method. The output is considered as logic 1 when the power level exceeds 0.7 μW and logic ‘0’ if it is below 0.35 μW. The proposed logical circuit has high contrast ratio. The XOR gate has a contrast ratio of about 12.55 dB, and the half subtractor has 7.78 dB and 11.76 dB for Difference and Borrow respectively. These devices work at 1550 nm wavelength and are ultra-compact in size. The proposed structure of logic gates will be suitable for photonic integrated circuits due to its ultra-small and simple design.

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18

Komljenovic, Tin, Michael Davenport, Jared Hulme, Alan Y. Liu, Christos T. Santis, Alexander Spott, Sudharsanan Srinivasan, Eric J. Stanton, Chong Zhang, and John E. Bowers. "Heterogeneous Silicon Photonic Integrated Circuits." Journal of Lightwave Technology 34, no. 1 (January 1, 2016): 20–35. http://dx.doi.org/10.1109/jlt.2015.2465382.

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19

Elshaari, Ali W., Wolfram Pernice, Kartik Srinivasan, Oliver Benson, and Val Zwiller. "Hybrid integrated quantum photonic circuits." Nature Photonics 14, no. 5 (April 13, 2020): 285–98. http://dx.doi.org/10.1038/s41566-020-0609-x.

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20

Nagarajan, R., C. H. Joyner, R. P. Schneider, J. S. Bostak, T. Butrie, A. G. Dentai, V. G. Dominic, et al. "Large-scale photonic integrated circuits." IEEE Journal of Selected Topics in Quantum Electronics 11, no. 1 (January 2005): 50–65. http://dx.doi.org/10.1109/jstqe.2004.841721.

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21

Koch, T. L., and U. Koren. "InP-based photonic integrated circuits." IEE Proceedings J Optoelectronics 138, no. 2 (1991): 139. http://dx.doi.org/10.1049/ip-j.1991.0025.

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22

Phillips, J. C. "Physics of photonic integrated circuits." Physica Scripta T66 (January 1, 1996): 151–53. http://dx.doi.org/10.1088/0031-8949/1996/t66/026.

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23

Errando-Herranz, Carlos, Alain Yuji Takabayashi, Pierre Edinger, Hamed Sattari, Kristinn B. Gylfason, and Niels Quack. "MEMS for Photonic Integrated Circuits." IEEE Journal of Selected Topics in Quantum Electronics 26, no. 2 (March 2020): 1–16. http://dx.doi.org/10.1109/jstqe.2019.2943384.

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24

Chen, R. T. "Polymer-based photonic integrated circuits." Optics & Laser Technology 25, no. 6 (December 1993): 347–65. http://dx.doi.org/10.1016/0030-3992(93)90001-v.

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25

Baier, Moritz, Axel Schoenau, Francisco M. Soares, and Martin Schell. "Polarimetry for Photonic Integrated Circuits." Applied Sciences 9, no. 15 (July 25, 2019): 2987. http://dx.doi.org/10.3390/app9152987.

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Photonic integrated circuits (PICs) play a key role in a wide range of applications. Very often, the performance of PICs depends strongly on the state of polarization of light. Classically, this is regarded as undesirable, but more and more applications emerge that make explicit use of polarization dependence. In either case, the characterization of the polarization properties of a PIC can be a nontrivial task. We present a way of characterizing PICs in terms of their full Müller matrix, yielding a complete picture of their polarization properties. The approach is demonstrated by carrying out measurements of fabricated PICs.

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26

Baumann, Frieder H., Brian Popielarski, Ryan Sweeney, Felix Beaudoin, and Ken Giewont. "Failure Analysis of Photonic Integrated Circuits." EDFA Technical Articles 25, no. 3 (August 1, 2023): 23–30. http://dx.doi.org/10.31399/asm.edfa.2023-3.p023.

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27

Mu, Xin, Sailong Wu, Lirong Cheng, and H. Y. Fu. "Edge Couplers in Silicon Photonic Integrated Circuits: A Review." Applied Sciences 10, no. 4 (February 24, 2020): 1538. http://dx.doi.org/10.3390/app10041538.

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Silicon photonics has drawn increasing attention in the past few decades and is a promising key technology for future daily applications due to its various merits including ultra-low cost, high integration density owing to the high refractive index of silicon, and compatibility with current semiconductor fabrication process. Optical interconnects is an important issue in silicon photonic integrated circuits for transmitting light, and fiber-to-chip optical interconnects is vital in application scenarios such as data centers and optical transmission systems. There are mainly two categories of fiber-to-chip optical coupling: off-plane coupling and in-plane coupling. Grating couplers work under the former category, while edge couplers function as in-plane coupling. In this paper, we mainly focus on edge couplers in silicon photonic integrated circuits. We deliver an introduction to the research background, operation mechanisms, and design principles of silicon photonic edge couplers. The state-of-the-art of edge couplers is reviewed according to the different structural configurations of the device, while identifying the performance, fabrication feasibility, and applications. In addition, a brief comparison between edge couplers and grating couplers is conducted. Packaging issues are also discussed, and several prospective techniques for further improvements of edge couplers are proposed.

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28

Thylén, Lars, Min Qiu, and Srinivasan Anand. "Photonic Crystals—A Step towards Integrated Circuits for Photonics." ChemPhysChem 5, no. 9 (September 20, 2004): 1268–83. http://dx.doi.org/10.1002/cphc.200301075.

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29

Liu, Qiang, Yinming Huang, Yongqiang Du, Zhengeng Zhao, Minming Geng, Zhenrong Zhang, and Kejin Wei. "Advances in Chip-Based Quantum Key Distribution." Entropy 24, no. 10 (September 22, 2022): 1334. http://dx.doi.org/10.3390/e24101334.

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Quantum key distribution (QKD), guaranteed by the principles of quantum mechanics, is one of the most promising solutions for the future of secure communication. Integrated quantum photonics provides a stable, compact, and robust platform for the implementation of complex photonic circuits amenable to mass manufacture, and also allows for the generation, detection, and processing of quantum states of light at a growing system’s scale, functionality, and complexity. Integrated quantum photonics provides a compelling technology for the integration of QKD systems. In this review, we summarize the advances in integrated QKD systems, including integrated photon sources, detectors, and encoding and decoding components for QKD implements. Complete demonstrations of various QKD schemes based on integrated photonic chips are also discussed.

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30

Amanti, Francesco, Greta Andrini, Fabrizio Armani, Fabrizio Barbato, Vittorio Bellani, Vincenzo Bonaiuto, Simone Cammarata, et al. "Integrated Photonic Passive Building Blocks on Silicon-On-Insulator Platform." Photonics 11, no. 6 (May 23, 2024): 494. http://dx.doi.org/10.3390/photonics11060494.

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Integrated photonics on Silicon-On-Insulator (SOI) substrates is a well developed research field that has already significantly impacted various fields, such as quantum computing, micro sensing devices, biosensing, and high-rate communications. Although quite complex circuits can be made with such technology, everything is based on a few ’building blocks’ which are then combined to form more complex circuits. This review article provides a detailed examination of the state of the art of integrated photonic building blocks focusing on passive elements, covering fundamental principles and design methodologies. Key components discussed include waveguides, fiber-to-chip couplers, edges and gratings, phase shifters, splitters and switches (including y-branch, MMI, and directional couplers), as well as subwavelength grating structures and ring resonators. Additionally, this review addresses challenges and future prospects in advancing integrated photonic circuits on SOI platforms, focusing on scalability, power efficiency, and fabrication issues. The objective of this review is to equip researchers and engineers in the field with a comprehensive understanding of the current landscape and future trajectories of integrated photonic components on SOI substrates with a 220 nm thick device layer of intrinsic silicon.

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Singh, Jagmeet, Hugh Morison, Zhimu Guo, Bicky A. Marquez, Omid Esmaeeli, Paul R. Prucnal, Lukas Chrostowski, Sudip Shekhar, and Bhavin J. Shastri. "Neuromorphic photonic circuit modeling in Verilog-A." APL Photonics 7, no. 4 (April 1, 2022): 046103. http://dx.doi.org/10.1063/5.0079984.

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One of the significant challenges in neuromorphic photonic architectures is the lack of good tools to simulate large-scale photonic integrated circuits. It is crucial to perform simulations on a single platform to capture the circuit’s behavior in the presence of both optical and electrical components. Here, we adopted a Verilog-A based approach to model neuromorphic photonic circuits by considering both the electrical and optical properties. Verilog-A models for the primary optical devices, such as lasers, couplers, waveguides, phase shifters, and photodetectors, are discussed, along with studying the composite devices such as microring resonators. Model parameters for different optical devices are extracted and tuned by analyzing the measured data. The simulated and experimental results are also compared for validation of Verilog-A models. Finally, a single photonic neuron circuit is simulated by implementing input, weight, and non-linear activation function by using lasers, microring resonators, and modulator, respectively. Electro-optical rapid co-simulation would significantly improve the efficiency of optimizing the devices and provide an accurate simulation of the circuit performance.

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32

Carroll, Lee, Jun-Su Lee, Carmelo Scarcella, Kamil Gradkowski, Matthieu Duperron, Huihui Lu, Yan Zhao, et al. "Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices." Applied Sciences 6, no. 12 (December 15, 2016): 426. http://dx.doi.org/10.3390/app6120426.

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33

Gostimirovic, Dusan, and Richard Soref. "An Integrated Optical Circuit Architecture for Inverse-Designed Silicon Photonic Components." Sensors 23, no. 2 (January 5, 2023): 626. http://dx.doi.org/10.3390/s23020626.

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In this work, we demonstrate a compact toolkit of inverse-designed, topologically optimized silicon photonic devices that are arranged in a “plug-and-play” fashion to realize many different photonic integrated circuits, both passive and active, each with a small footprint. The silicon-on-insulator 1550-nm toolkit contains a 2 × 2 3-dB splitter/combiner, a 2 × 2 waveguide crossover, and a 2 × 2 all-forward add–drop resonator. The resonator can become a 2 × 2 electro-optical crossbar switch by means of the thermo-optical effect, phase-change cladding, or free-carrier injection. For each of the ten circuits demonstrated in this work, the toolkit of photonic devices enables the compact circuit to achieve low insertion loss and low crosstalk. By adopting the sophisticated inverse-design approach, the design structure, shape, and sizing of each individual device can be made more flexible to better suit the architecture of the greater circuit. For a compact architecture, we present a unified, parallel waveguide circuit framework into which the devices are designed to fit seamlessly, thus enabling low-complexity circuit design.

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Yuan, Yuan, Bassem Tossoun, Zhihong Huang, Xiaoge Zeng, Geza Kurczveil, Marco Fiorentino, Di Liang, and Raymond G. Beausoleil. "Avalanche photodiodes on silicon photonics." Journal of Semiconductors 43, no. 2 (February 1, 2022): 021301. http://dx.doi.org/10.1088/1674-4926/43/2/021301.

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Abstract Silicon photonics technology has drawn significant interest due to its potential for compact and high-performance photonic integrated circuits. The Ge- or III–V material-based avalanche photodiodes integrated on silicon photonics provide ideal high sensitivity optical receivers for telecommunication wavelengths. Herein, the last advances of monolithic and heterogeneous avalanche photodiodes on silicon are reviewed, including different device structures and semiconductor systems.

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Seong, Yeolheon, Jinwook Kim, and Heedeuk Shin. "Grazing-Angle Fiber-to-Waveguide Coupler." Photonics 9, no. 11 (October 26, 2022): 799. http://dx.doi.org/10.3390/photonics9110799.

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The silicon photonics market has grown rapidly over recent decades due to the demand for high bandwidth and high data-transfer capabilities. Silicon photonics leverage well-developed semiconductor fabrication technologies to combine various photonic functionalities on the same chip. Complicated silicon photonic integrated circuits require a mass-producible packaging strategy with broadband, high coupling efficiency, and fiber-array fiber-to-chip couplers, which is a big challenge. In this paper, we propose a new approach to fiber-array fiber-to-chip couplers which have a complementary metal-oxide semiconductor-compatible silicon structure. An ultra-high numerical aperture fiber is polished at a grazing angle and positioned on a taper-in silicon waveguide. Our simulation results demonstrate a coupling efficiency of more than 90% over hundreds of nanometers and broad alignment tolerance ranges, supporting the use of a fiber array for the packaging. We anticipate that the proposed approach will be able to be used in commercialized systems and other photonic integrated circuit platforms, including those made from lithium niobate and silicon nitride.

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Popovskiy, N. I., V. V. Davydov, and V. Yu Rud. "Features of the construction of photonic integrated circuits for communication systems." Journal of Physics: Conference Series 2086, no. 1 (December 1, 2021): 012163. http://dx.doi.org/10.1088/1742-6596/2086/1/012163.

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Abstract The article discusses the main methods of signal processing in a coherent optical transport network based on a photonic integrated circuit to increase the speed and the onset of the terabit era in optical transport networks, cloud and high-performance computing systems. The properties and operational characteristics of the main material platforms of photonic integrated circuits and their future technological units are considered.

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Yi, Ailun, Chengli Wang, Liping Zhou, Yifan Zhu, Shibin Zhang, Tiangui You, Jiaxiang Zhang, and Xin Ou. "Silicon carbide for integrated photonics." Applied Physics Reviews 9, no. 3 (September 2022): 031302. http://dx.doi.org/10.1063/5.0079649.

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Photonic integrated circuits (PICs) based on lithographically patterned waveguides provide a scalable approach for manipulating photonic bits, enabling seminal demonstrations of a wide range of photonic technologies with desired complexity and stability. While the next generation of applications such as ultra-high speed optical transceivers, neuromorphic computing and terabit-scale communications demand further lower power consumption and higher operating frequency. Complementing the leading silicon-based material platforms, the third-generation semiconductor, silicon carbide (SiC), offers a significant opportunity toward the advanced development of PICs in terms of its broadest range of functionalities, including wide bandgap, high optical nonlinearities, high refractive index, controllable artificial spin defects and complementary metal oxide semiconductor-compatible fabrication process. The superior properties of SiC have enabled a plethora of nano-photonic explorations, such as waveguides, micro-cavities, nonlinear frequency converters and optically-active spin defects. This remarkable progress has prompted the rapid development of advanced SiC PICs for both classical and quantum applications. Here, we provide an overview of SiC-based integrated photonics, presenting the latest progress on investigating its basic optoelectronic properties, as well as the recent developments in the fabrication of several typical approaches for light confinement structures that form the basic building blocks for low-loss, multi-functional and industry-compatible integrated photonic platform. Moreover, recent works employing SiC as optically-readable spin hosts for quantum information applications are also summarized and highlighted. As a still-developing integrated photonic platform, prospects and challenges of utilizing SiC material platforms in the field of integrated photonics are also discussed.

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Takenaka, Mitsuru, Ziqiang Zhao, Chong Pei Ho, Takumi Fujigaki, Tipat Piyapatarakul, Yuto Miyatake, Rui Tang, Kasidit Toprasertpong, and Shinichi Takagi. "Ge-on-insulator Platform for Mid-infrared Photonic Integrated Circuits." ECS Transactions 109, no. 4 (September 30, 2022): 47–58. http://dx.doi.org/10.1149/10904.0047ecst.

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Since mid-infrared (MIR) wavelengths have a great potential for optical communication, sensing, and quantum information, Si-based MIR photonic integrated circuits (PICs) have been developed by leveraging Si photonics technology for near-infrared wavelengths. However, the transparency wavelength window of Si is from 1.2 μm to 8 μm, limiting the available wavelengths in the MIR spectrum. Ge is emerging as a waveguide material to overcome this difficulty because Ge is transparent in the entire MIR spectrum. We have developed a Ge-on-insulator (GeOI) platform for MIR integrated photonics. The strong optical confinement in a GeOI waveguide enables an ultracompact MIR PIC. Using wafer bonding and Smart-cut, a GeOI wafer was successfully fabricated. As a result, we have demonstrated various Ge passive devices, thermo-optic phase shifters, modulators, and photodetectors on a GeOI platform.

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Li, Jiang, Chaoyue Liu, Haitao Chen, Jingshu Guo, Ming Zhang, and Daoxin Dai. "Hybrid silicon photonic devices with two-dimensional materials." Nanophotonics 9, no. 8 (May 14, 2020): 2295–314. http://dx.doi.org/10.1515/nanoph-2020-0093.

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AbstractSilicon photonics is becoming more and more attractive in the applications of optical interconnections, optical computing, and optical sensing. Although various silicon photonic devices have been developed rapidly, it is still not easy to realize active photonic devices and circuits with silicon alone due to the intrinsic limitations of silicon. In recent years, two-dimensional (2D) materials have attracted extensive attentions due to their unique properties in electronics and photonics. 2D materials can be easily transferred onto silicon and thus provide a promising approach for realizing active photonic devices on silicon. In this paper, we give a review on recent progresses towards hybrid silicon photonics devices with 2D materials, including two parts. One is silicon-based photodetectors with 2D materials for the wavelength-bands from ultraviolet (UV) to mid-infrared (MIR). The other is silicon photonic switches/modulators with 2D materials, including high-speed electro-optical modulators, high-efficiency thermal-optical switches and low-threshold all-optical modulators, etc. These hybrid silicon photonic devices with 2D materials devices provide an alternative way for the realization of multifunctional silicon photonic integrated circuits in the future.

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Kutluyarov, Ruslan V., Aida G. Zakoyan, Grigory S. Voronkov, Elizaveta P. Grakhova, and Muhammad A. Butt. "Neuromorphic Photonics Circuits: Contemporary Review." Nanomaterials 13, no. 24 (December 14, 2023): 3139. http://dx.doi.org/10.3390/nano13243139.

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Neuromorphic photonics is a cutting-edge fusion of neuroscience-inspired computing and photonics technology to overcome the constraints of conventional computing architectures. Its significance lies in the potential to transform information processing by mimicking the parallelism and efficiency of the human brain. Using optics and photonics principles, neuromorphic devices can execute intricate computations swiftly and with impressive energy efficiency. This innovation holds promise for advancing artificial intelligence and machine learning while addressing the limitations of traditional silicon-based computing. Neuromorphic photonics could herald a new era of computing that is more potent and draws inspiration from cognitive processes, leading to advancements in robotics, pattern recognition, and advanced data processing. This paper reviews the recent developments in neuromorphic photonic integrated circuits, applications, and current challenges.

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Kolymagin, D. A., D. A. Chubich, D. A. Shcherbakov, R. M. Pattia, A. V. Gritsienko, A. V. Pisarenko, I. V. Dushkin, and A. G. Vitukhnovskiy. "Waveguide structures and photon splitters fabricated by direct (3 + 1)D laser writing." Известия Российской академии наук. Серия физическая 87, no. 12 (December 1, 2023): 1695–700. http://dx.doi.org/10.31857/s0367676523702927.

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The problem of high-performance systems for the big data transmission and processing fabrication determines the importance of creating hybrid photonic integrated circuits with complex architecture. We studied of three-dimensional photonic waveguide structures created by direct (3 + 1)D laser writing, with the aim of adding such structures to photonic integrated circuits.

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Pruessner, Marcel W., Dmitry A. Kozak, Nathan A. Tyndall, William S. Rabinovich, Venkatesh Deenadayalan, Michael Fanto, Stefan Preble, and Todd H. Stievater. "Foundry-processed optomechanical photonic integrated circuits." OSA Continuum 4, no. 4 (March 29, 2021): 1215. http://dx.doi.org/10.1364/osac.419410.

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Shimizu, Hiromasa, and Vadym Zayets. "Plasmonic isolator for photonic integrated circuits." MRS Bulletin 43, no. 6 (June 2018): 425–29. http://dx.doi.org/10.1557/mrs.2018.123.

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Xiao Ting-Hui, Yu Yang, and Li Zhi-Yuan. "Graphene-silicon hybrid photonic integrated circuits." Acta Physica Sinica 66, no. 21 (2017): 217802. http://dx.doi.org/10.7498/aps.66.217802.

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Melle, Serge. "Photonic integrated circuits: A technology update." IEEE Communications Magazine 46, no. 2 (2008): S14—S15. http://dx.doi.org/10.1109/mcom.2008.4476166.

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Coldren, Larry A. "Diode Lasers and Photonic Integrated Circuits." Optical Engineering 36, no. 2 (February 1, 1997): 616. http://dx.doi.org/10.1117/1.601191.

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Amemiya, Tomohiro, Toru Kanazawa, Takuo Hiratani, Daisuke Inoue, Zhichen Gu, Satoshi Yamasaki, Tatsuhiro Urakami, and Shigehisa Arai. "Organic membrane photonic integrated circuits (OMPICs)." Optics Express 25, no. 16 (July 24, 2017): 18537. http://dx.doi.org/10.1364/oe.25.018537.

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Chovan, J., and F. Uherek. "Photonic Integrated Circuits for Communication Systems." Radioengineering 27, no. 2 (June 15, 2018): 357–63. http://dx.doi.org/10.13164/re.2018.0357.

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Kish, Fred, Vikrant Lal, Peter Evans, Scott W. Corzine, Mehrdad Ziari, Tim Butrie, Mike Reffle, et al. "System-on-Chip Photonic Integrated Circuits." IEEE Journal of Selected Topics in Quantum Electronics 24, no. 1 (January 2018): 1–20. http://dx.doi.org/10.1109/jstqe.2017.2717863.

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Smith, Brian J., Dmytro Kundys, Nicholas Thomas-Peter, P. G. R. Smith, and I. A. Walmsley. "Phase-controlled integrated photonic quantum circuits." Optics Express 17, no. 16 (July 22, 2009): 13516. http://dx.doi.org/10.1364/oe.17.013516.

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