Dissertations / Theses on the topic 'Piezoresistiv'
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Corten, Cathrin Carolin. "Synthese und Charakterisierung dünner Hydrogelschichten mit modulierbaren Eigenschaften." Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2008. http://nbn-resolving.de/urn:nbn:de:bsz:14-ds-1209463829168-95283.
Full textSavaris, Weslin Keven. "Caracterização do compósito piezoresistivo Cu-PDMS para uso como sensor de pressão /." Ilha Solteira, 2020. http://hdl.handle.net/11449/192135.
Full textResumo: Recentes estudos têm abordado o aprimoramento de sensores de pressão com a finalidade de reproduzir a sensibilidade da pele humana para ser utilizada em robôs. Dentre diversos materiais disponíveis na literatura, destaca-se o material piezoresistivo à base do elastômero Polidimetilsiloxano e Cobre Dendritico (Cu-PDMS), devido à tecnologia empregada na produção destes sensores. Este trabalho trata a síntese e a caracterizações de compósitos piezoresistivo Cu-PDMS para confecção de sensores de pressão, na forma matricial, para aplicações biomédicas, como palmilhas instrumentadas, sensor on/off, dentre outros. Com finalidade de análise do material atuando como sensor de pressão, foram fabricadas e testadas amostras com diferentes composições. Para o estudo das propriedades de cada amostra, foram realizadas caracterizações elétricas (resistência elétrica com pressão variável, condutividade ao longo do tempo e espectroscopia de impedância), mecânicas (caracterização mecânica do material, ensaio de tração e ensaio termogravimétrico) e Microscopia Eletrônica de Varredura (MEV). Os resultados obtidos mostram as faixas possíveis para utilização do material como sensor de pressão, e os fatores que podem influenciar o seu emprego.
Abstract: Recent studies have addressed the improvement of pressure sensors in order to reproduce the sensitivity of human skin to be used in robots. Among the various materials available in the literature, the piezoresistive material based on the polydimethylsiloxane and Dendritic Copper (Cu-PDMS) elastomer stands out, due to the technology used in the production of these sensors. This work deals with the synthesis and characterization of Cu-PDMS piezoresistive composites for making pressure sensors, in matrix form, for biomedical applications such as instrumented insoles, on / off sensor, among others. In order to analyze the material acting as a pressure sensor, samples with different compositions were manufactured and tested. For the study of the properties of each sample, electrical characterizations (electrical resistance with variable pressure, conductivity over time and impedance spectroscopy), mechanical characterizations (mechanical characterization of the material, tensile test and thermogravimetric test) and Scanning Electron Microscopy were performed (ME V). The results obtained show the possible ranges for using the material as a pressure sensor, and the factors that can influence its use.
Mestre
Gustavsson, Jimmy. "Mätning av dynamiskt tryck med piezoresistiva tryckgivare på roterande objekt." Thesis, Linköping University, Department of Science and Technology, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-2669.
Full textThe report handles the transmission of signals from piezoresistive pressuresensors and thermocouple from a rotating object.
This report also evaluates the possibility to collect data in a datalogger that rotates with the object. Telemetrics was previously used for signaltransmission in Finspång, therefore there has been no tests considering preassure measuring. One transmitting method handled in this report is transmission through a slipring connection.
One test with a slipring connection was performed for transmitting signals from a piezoresistive preassuresensor. All parts were mounted on a disc which rotated at 4000 rpm. Measurements were made of static and dynamic preassure. The report also contains a description of the equipment used for the test, and how it was constructed.
Rapporten tar upp överföring av signaler från piezoresistiva tryckgivare samt termoelement från ett roterande objekt.
I rapporten redovisas också om det är möjligt att samla in mätdata i en datalogger som roterar med objektet. Eftersom man, i Finspång, tidigare har använt telemetri för signalöverföring från termoelement så har tryckmätning inte provats. Därför har denna metod inte tagits med i rapporten. En överföringsmetod som tas upp i rapporten är överföring med släpring.
Ett prov genomfördes med en släpring för överföring av signaler från en piezoresistiv tryckgivare. Allt monterades på en skiva som roterades upp till 4 000 varv/min. Det som mättes var statiskt och dynamiskt tryck. I rapporten finns det beskrivet vilken utrustning som använts vid provet och hur den är konstruerad.
Trinh, Quang Thong. "Hydrogel based piezoresistive pH sensors." Dresden TUDpress, 2006. http://deposit.d-nb.de/cgi-bin/dokserv?id=2860048&prov=M&dok_var=1&dok_ext=htm.
Full textJohns, Gary Kenneth. "The piezoresistive effect In microflexures /." Diss., CLICK HERE for online access, 2007. http://contentdm.lib.byu.edu/ETD/image/etd1673.pdf.
Full textJohns, Gary K. "The Piezoresistive Effect In Microflexures." BYU ScholarsArchive, 2006. https://scholarsarchive.byu.edu/etd/1074.
Full textHoa, Phan Le Phuong. "Uncertainty in measurement of piezoresistive sensors /." Dresden : W.e.b.-Univ.-Verl, 2005. http://deposit.ddb.de/cgi-bin/dokserv?id=2660800&prov=M&dok_var=1&dok_ext=htm.
Full textLupien, Christian. "Piezoresistive torque magnetometry at low temperature." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp03/MQ37143.pdf.
Full textHyatt, Thomas B. "Piezoresistive Nano-Composites: Characterization and Applications." BYU ScholarsArchive, 2010. https://scholarsarchive.byu.edu/etd/2175.
Full textClayton, Marianne E. "Modeling Piezoresistive Effects in Flexible Sensors." BYU ScholarsArchive, 2019. https://scholarsarchive.byu.edu/etd/7396.
Full textVidhate, Shailesh. "Piezoresistive Polyvinylidene Fluoride/Carbon Filled Nanocomposites." Thesis, University of North Texas, 2011. https://digital.library.unt.edu/ark:/67531/metadc68059/.
Full textMartins, Alan. "Analysis of damage mechanisms in composite structures reinforced by tufting." Thesis, Compiègne, 2018. http://www.theses.fr/2018COMP2443/document.
Full textThis study focused mainly on the assessment of the mechanical performance and the failure mechanisms of tufted composites under divers loading conditions. Laminated plates and stiffened panels reinforced by tufting was manufactured with different tufting parameters to evaluate their effect in the properties of the composites. Multi-instrumented characterization carried out during the tests assisted the investigation. The tufted plates subjected to short-beam shear tests aided especially in the behavior analysis of tufting density and angle in mode Il loading condition, while impact and compression after impact (CAI) tests on the damage tolerance. Open-hole fatigue tests were also performed to evaluate the tufts response, especially regarding their position to the center hole, to the strain concentration factor generated by the hole. The following part of this work consisted of the mechanical tests on omega stiffened panel reinforced by tufting. The procedure optimized the tufting parameters employed for reinforcing the structures from the previous batch of specimens until reaching an optimal point that the main properties, primarily found in pull-off tests, are equal or superior to those of the control specimens. This improvement also considered the modifications in the shape of the stiffeners. Furthermore, a novel approach based on the piezoresistive effect of carbon tufts under loading of the composite specimens is performed. This may support the monitoring of the health status on the tufted threads and therefore of the composite because of the structural nature of the tufts. The results showed that tufting reinforcements are capable of increasing the interlaminar fracture toughness and damage tolerance of the composites considerably owing mainly to their crack bridging phenomena. The tufting parameters are decisive factors for achieving the best mechanical properties. However, this work reported that tuft threads are also responsible for generating cracks due to the strain concentration and defects caused by their insertion and consequently, can decrease the strength of the composites. The investigation concludes that the random insertion of the tufts is not ideal for the performance of the material and thus must be avoided. The development of the tufting insertion in the omega stiffeners was supported by the multi-instrumented characterization that led to optimizing reinforcement in the structure. Although the study achieved the goal of obtaining mechanical properties significantly superior to the omega panels reinforced by tufting, it is noticeable that the procedure employed is not optimal. The present work also proposes a preliminary finite element model to overcome the costly and time consuming of the experimental tests. It intends primarily optimizing the tufting parameters in the structure. The model developed was capable of predicting the same damage events as observed experimentally, but it still distant from the quantitative predictions of the results. The structural health monitoring of the tufted composite laminates by the carbon threads seems promising and could help in the future for supplying data about the tufts health status under loading that are not achieved by the conventional characterization methods employed in this work
Ostermay, Ina. "Selektive Si1-xCx-Epitaxie für den Einsatz in der CMOS-Technologie." Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2013. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-114059.
Full textAnderson, Jeffrey K. "Piezoresistive Sensing of Bistable Micro Mechansim State." Diss., CLICK HERE for online access, 2005. http://contentdm.lib.byu.edu/ETD/image/etd1074.pdf.
Full textSu, Yi. "Micromachined piezoresistive single crystal silicon cantilever sensors." Thesis, University of Southampton, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.242637.
Full textDieme, Robert. "Characterization of noise in MEMS piezoresistive microphones." [Gainesville, Fla.] : University of Florida, 2005. http://purl.fcla.edu/fcla/etd/UFE0010508.
Full textOlszacki, Michal. "Modelling and optimization of piezoresistive pressure sensors." Toulouse, INSA, 2009. http://eprint.insa-toulouse.fr/archive/00000297/.
Full textSince 1954, when the piezoresistive effect in semiconductors was discovered, the approach to the pressure measurement has changed dramatically and new devices with outstanding performances have appeared on the market. Along with the development of microtechnologies for integrated circuits, a new branch of MEMS called devices have stormed our world. One of the biggest branches of today’s microsystems are pressure transducers which use the synergy of the piezoresistivity phenomenon and microfabrication technologies. While the main idea of strain gauge-based pressure measurement has not changed over the last few decades, there has been always a need to develop the design methodology that allows the designer to deliver the optimized product in the shortest possible time at the lowest possible cost. Thus, a lot of work has been done in the field in order to create tools and develop the FTR (first time right) methodology. Obviously, the design of the device that best fulfills the project requirements needs an appropriate simulation that have to be performed at the highest possible details level. Such an approach requires the detailed model of the device and, in case of its high complexity, a lot of computing power. Although over the last decade the most popular approach is the FEM analysis, there are some bottlenecks in such an approach like the difficulty of the implanted layers modeling where the doping profile shape has to be taken into account especially in the coupled electromechanical analysis. In this thesis, we try to present the methodology of the pressure sensor design which uses the analytical model of such a sensor that takes into consideration the nonuniform doping profile of the strain gauge, deals with the basic membrane shapes as well as with thermal and noise issues. The model, despite its limitations in comparison to the FEM one, gives trustworthy results which may be used for the reliable pressure sensor design in an extremely short time. In order to be quantitative, the analysis showing the drawbacks and advantages of the presented method in comparison to the FEM analysis using specialized tools like ANSYS ® and SILVACO-ATHENA® packages is also presented. Then, the model is used in a multi-objective optimization procedure that semi-automatically generates the design of a sensor, taking into account project requirements and constraints. At the end, the statistical analysis that may be helpful to estimate the production yield is performed. All three steps are included in the dedicated design and optimization tool created in a MATLAB ® environment and successfully tested. In the last section, the experimental results of fabricated samples are compared to those obtained by the developed tool
Papakostas, Thomas. "Polymer thick-film sensors and their integration with silicon : a route to hybrid microsystems." Thesis, University of Southampton, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.342759.
Full textWaterfall, Tyler Lane. "Design of Piezoresistive MEMS Force and Displacement Sensors." Diss., CLICK HERE for online access, 2006. http://contentdm.lib.byu.edu/ETD/image/etd1549.pdf.
Full textLu, Junyong. "Micro fingerprint sensor based on piezoresistive nanocomposite polymers /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20LU.
Full textSimon, Todd R. "Microgripper force feedback integration using piezoresistive cantilever structure /." Online version of thesis, 2008. http://hdl.handle.net/1850/7855.
Full textChoudhury, Arnab. "A piezoresistive microcantilever array for chemical sensing applications." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/26623.
Full textCommittee Chair: Hesketh, Peter; Committee Member: Bottomley, Lawrence; Committee Member: Degertekin,Levent; Committee Member: Hu, Zhiyu; Committee Member: Janata, Jiri; Committee Member: Zhang, Zhoumin. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Barlian, Arnoldus Alvin. "Microfabricated piezoresistive shear stress sensors for underwater applications /." May be available electronically:, 2009. http://proquest.umi.com/login?COPT=REJTPTU1MTUmSU5UPTAmVkVSPTI=&clientId=12498.
Full textHenke, E. F. Markus, Samuel Schlatter, and Iain A. Anderson. "Soft dielectric elastomer oscillators driving bioinspired robots." Mary Ann Liebert, 2017. https://tud.qucosa.de/id/qucosa%3A32850.
Full textHussain, Fahad. "The design, manufacture and testing of a silicon multiple axis accelerometer." Thesis, University of Newcastle Upon Tyne, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.285402.
Full textNewton, Cory Nelson. "Design and Frequency Characterization of Dual-Piezoresponsive Foam Sensors." BYU ScholarsArchive, 2016. https://scholarsarchive.byu.edu/etd/9264.
Full textStockermans, Ron J. "Comparison calibration of piezoresistive microphones for acoustic power measurements." Thesis, Monterey, California. Naval Postgraduate School, 1992. http://hdl.handle.net/10945/23572.
Full textA calibration of two Endevco piezoresistive microphones was carried out under static and dynamics pressures. The dynamic pressure calibrations were done by comparison with a B&K condenser microphone. The calibration was carried out in a small closed volume in air and helium. In helium, the codes volume was pressurized to atmospheric pressure and then 10 Atm. The dynamic calibration would determine the "flatness" of the calibration curve, as well as determine a sensitivity value over the range of frequencies used. The results showed that the calibration curve for the piezoresistive microphones are flat from static pressures to about 300 Hz and then begin to fall off. The value of the sensitivity of the "flat" region of the calibration curve for one microphone was within 0.4% of the value for sensitivity calculated under the static pressure calibration. For the other microphone the static and dynamic sensitivities were within 1.3% of each other. Then, the static calibration of one microphone may be used under dynamic conditions with a less than 1% error while using the other microphone similarly will produce an error of greater than 1%.
Larsen, Gerrit T. "Piezoresistive Models for Polysilicon with Bending or Torsional Loads." Diss., CLICK HERE for online access, 2009. http://contentdm.lib.byu.edu/ETD/image/etd3165.pdf.
Full textMessenger, Robert K. "Integrated Piezoresistive Sensing for Feedback Control of Compliant MEMS." Diss., CLICK HERE for online access, 2007. http://contentdm.lib.byu.edu/ETD/image/etd2115.pdf.
Full textZhou, Zhijian. "Layer transferred single-crystal silicon piezoresistive aero-acoustic microphone /." View abstract or full-text, 2009. http://library.ust.hk/cgi/db/thesis.pl?ECED%202009%20ZHOUZ.
Full textPornnoppadol, Petcharin [Verfasser]. "3D-Mikrotaster mit piezoresistiven Elementen / Petcharin Pornnoppadol." Aachen : Shaker, 2004. http://d-nb.info/1172615071/34.
Full textVillanueva, Torrijo Luis Guillermo. "Development of cantilevers for biomolecular measurements." Doctoral thesis, Universitat Autònoma de Barcelona, 2006. http://hdl.handle.net/10803/5354.
Full textPer altra banda, amb l'objectiu de realitzar mesures de conducció en un ambient líquid, es van fabricar unes bigues conductores però aïllades. La capa conductora en aquestes bigues (una capa d'or) ha d'estar aïllada del exterior per una capa dielèctrica (nitrur de silici) per disminuir d'aquesta manera les capacitats paràsites. Al extrem lliure, s'ha de situar una punta de polisilici afilada per poder escanejar superfícies. La punta ha d'estar coberta per or i, sobre l'or, tenir nitrur a tot arreu menys al vèrtex. Per obtenir aquests dispositius, es va optimitzar el gravat de puntes de polisilici obtenint finalment puntes amb un diàmetre de vèrtex més petit que 20 nm (fent servir un atac sec en un equip DRIE seguit d'unes oxidacions per esmolar). A més, es va realitzar un estudi dels esforços interns per intentar obtenir bigues planes. A l'última part del treball, es va dur a terme la fabricació de sondes per AFM (bigues amb una punta esmolada al seu extrem lliure). Aquests dispositius es fan servir moltíssim actualment per caracteritzar superfícies i realitzar experiments que requereixen molta precisió i/o resolució. L'objectiu fonamental d'aquesta feina era el possibilitar la fabricació de sondes per AFM al nostre centre de manera que els dissenys poguessin ser triats pels investigadors d'acord amb les necessitats de cadascú d'ells. Per això, es van considerar diferents materials i processos de fabricació de puntes. La millor opció va ser el gravat sec amb un equip DRIE d'unes puntes "tipus coet" amb una part superior afilada, situada al cim d'una columna cilíndrica. Els processos de gravat es van optimitzar per així obtenir una alta uniformitat arreu de l'oblia, així com uns perfils de puntes apropiats per poder fer-les servir en un AFM. A continuació, es van fabricar sondes completes. Per comprovar com de bona era la tecnologia de fabricació que havíem dissenyat, es van fabricar dispositius de dos tipus diferents: per fer-les servir en mode contacte (constant elàstica baixa) i per fer-les servir en mode dinàmic (constant elàstica alta). Aquests dispositius es van utilitzar per escanejar unes mostres d'alumini i es van comparar amb els resultats obtinguts amb sondes comercials, obtenint resultats similars en ambdós casos.
Finalment, es van fabricar sondes per a aplicacions específiques: sondes amb puntes amb la part superior plana per l'estudi de la elasticitat de polímers i materials biològics (molt baix mòdul de Young) i sondes amb bigues d'una geometria especial per a que les freqüències de ressonància del mode fonamental i del primer harmònic transversal estiguessin més juntes, per així millorar la detecció del potencial de superfície en la tècnica KPFM. Amb la fabricació d'aquestes puntes, es va demostrar que el disposar d'una tecnologia que permetés la fabricació de sondes pot ser molt útil per al desenvolupament de noves aplicacions de l'AFM.
Este trabajo queda dividido en tres apartados, todos ellos relacionados con el diseño y fabricación de vigas en voladizo de tamaño micrométrico (micro-cantilevers en inglés) para diferentes aplicaciones. En el segundo capítulo se describe el trabajo realizado con vigas piezorresistivas. El objetivo fundamental de esa parte del trabajo consistía en la consecución de un elemento sensor capaz de detectar fuerzas en el rango de 10 a 100 pN. Para ello, en primer lugar, se realizó un detallado análisis teórico del comportamiento de estas estructuras mecánicas cuando se les aplica una fuerza en su extremo libre. Se estudió asimismo el ruido (tanto eléctrico como mecánico) presente en ellas. De esta manera se establecieron unos criterios para la maximización de la sensibilidad y la resolución del sensor. Los resultados analíticos se compararon con los resultados de simulaciones por elementos finitos, obteniendo divergencias muy bajas, lo cual fue interpretado como una validación de los primeros. Se diseñaron y fabricaron unas vigas piezorresistivas de polisilicio con forma de U. Las dimensiones y demás parámetros se fijaron mediante los criterios obtenidos para la optimización del comportamiento de las vigas. Las vigas se fabricaron tanto en la Sala Blanca del CNM como usando una tecnología CMOS comercial (0.8 m de AustriaMicroSystems). Los procesos de fabricación dentro de la Sala Blanca del CNM se optimizaron para aumentar el rendimiento de las obleas. De esta forma, finalmente, se alcanzó un rendimiento cercano al 95% (aproximadamente 95 de cada 100 dispositivos se obtuvieron correctamente). Se optimizó asimismo el post proceso de los chips CMOS en el CNM para obtener un alto rendimiento. En este caso, se consideró la supervivencia de las estructuras mecánicas así como de la circuitería CMOS integrada junto con las vigas. Esta circuitería, diseñada en el ETH de Zürich, consistía en un filtro y un amplificador para mejorar la resolución del sensor. Una vez fabricados, los dispositivos se caracterizaron. La parte central de esta caracterización englobó dos aspectos: la medida del ruido de la señal de salida del circuito y la determinación de la sensibilidad de los dispositivos. Teniendo en cuenta ambos resultados se calculó la resolución de nuestros sensores. Los mejores resultados obtenidos fueron de unos 30 nN para las vigas fabricadas en el CNM y de unos 30 pN para las provenientes de la tecnología CMOS. Esta diferencia de tres órdenes de magnitud en la resolución es debida a la circuitería adjunta a los dispositivos transductores (vigas) y nos permitiría medir fuerzas del orden de magnitud requerido.
Por otro lado, con el objetivo de realizar medidas de conducción en medio líquido, se fabricaron unas vigas conductoras pero aisladas. La capa conductora en dichas vigas (capa de oro) ha de estar aislada del exterior por medio de una capa dieléctrica (nitruro de silicio) para así disminuir las capacidades parásitas. En el extremo libre, se ha de situar una punta de polisilicio afilada para poder escanear superficies. Dicha punta ha de estar cubierta por oro y, sobre el oro, tener nitruro en todas partes salvo en el vértice. Para obtener estos dispositivos, se optimizó el grabado de puntas de polisilicio, obteniendo finalmente puntas con un diámetro de vértice menor que 20 nm (usando un ataque en un equipo DRIE seguido por unas oxidaciones para afilar). Además, se realizó un estudio de los esfuerzos internos para intentar obtener vigas lo más planas posible. En la última parte del trabajo, se llevó a cabo la fabricación de sondas para AFM (vigas con una punta afilada en su extremo libre). Estos dispositivos son ampliamente usados en la actualidad para caracterizar muestras y para realizar experimentos en los que se requiere una alta precisión y/o resolución. El objetivo fundamental de este trabajo era el posibilitar la fabricación de sondas para AFM en nuestro centro de manera que los diseños pudieran ser elegidos a voluntad y acordes con las necesidades de cada
investigador. Para ello se consideraron diferentes materiales y procesos de fabricación de puntas. La mejor opción fue la definición por medio de un equipo DRIE de puntas "tipo cohete" con una parte superior afilada, situada sobre una columna cilíndrica. Los procesos de grabado se optimizaron para así obtener una alta uniformidad a lo largo y ancho de la oblea así como unos perfiles de puntas apropiados para poder ser usadas después en un AFM. A continuación, se fabricaron sondas completas. Para comprobar cómo de buena era la tecnología de fabricación que habíamos diseñado, se fabricaron puntas de dos tipos diferentes: para ser usadas en modo contacto (constante elástica baja) y para ser usadas en modo dinámico (constante elástica alta). Dichos dispositivos se usaron para escanear algunas muestras y se compararon con algunos disponibles comercialmente, obteniendo resultados similares tanto para modo contacto como para dinámico.
Finalmente, se fabricaron sondas para aplicaciones específicas: sondas con puntas con la parte superior plana para el estudio de la elasticidad de polímeros y materiales biológicos (con bajo módulo de Young) y sondas con vigas de una geometría especial para que las frecuencias de resonancia del modo fundamental y del primer harmónico transversal estuvieran más juntas, para así mejorar la detección del potencial de superficie en la técnica KPFM. Con la fabricación de estas puntas, se demostró que el disponer de una tecnología que permita la consecución de puntas puede ser muy útil para el desarrollo de nuevas aplicaciones del AFM.
The main objective of this thesis has been the research in the design and fabrication of micro-cantilevers that are one of the most used mechanical transducers because of their versatility. The use of polysilicon piezoresistive cantilevers has been explored in order to detect binding forces between biomolecules. Force resolution under 100 pN was required. A detailed analytical study has been performed in order to calculate sensitivity and resolution when applying a force at their free end. The results obtained with this analysis have been confirmed by the use of FEM simulations and hence used to determine the optimum design of the piezoresistive sensor. U-shaped polysilicon cantilevers have been fabricated at CNM clean room facilities using a novel and dedicated technology. Designs were made following the criteria imposed by the previously obtained analytical results. The high force resolution required implied the fabrication of some cantilevers among the softest piezoresistive cantilevers reported up to date (elastic constants down to 0.5 mN/m). With the final optimized fabrication process, a yield of 95% has been achieved. Using a commercial CMOS technology (0.8 m from AustriaMicroSystems), polysilicon piezoresistive cantilevers have been designed and fabricated following again the criteria imposed by the theoretical analysis and, in this case, also design rules from the CMOS technology. Cantilevers were integrated with a filtering and amplifying circuitry to reduce noise. The softest piezoresistive CMOS integrated cantilevers have been obtained with a high yield and with an undamaged circuitry. In order to determine the actual sensitivity of such soft sensors and their gauge factor, a characterization method (consisting in AFM actuation) has been developed. Gauge factor for polysilicon deposited at CNM and at AustriaMicroSystems was -12 and -9 respectively. The maximum force sensitivity and force resolution obtained for CNM fabricated sensors have been 11 V/nN and 28 nN respectively. The maximum force sensitivity and force resolution obtained for CMOS fabricated sensors have been 11 V/pN and 27 pN respectively. In both cases, resolution is limited by the noise in the circuit, whose main contributions are Hooge noise (or 1/f) and Johnson noise (or thermoelectric). Conductive, but isolated, nitride cantilevers (with a wrapped gold layer) with a sharp tip (that has an opened contact) have been designed and fabricated to be used in conductive measurements in liquid environments. Polysilicon tips definition has been optimized to improve the whole probes fabrication process, achieving apex radii smaller than 20 nm using a dry etching by means of a DRIE equipment followed by sharpening oxidation.
A complete and novel technological process has been developed for the fabrication of AFM cantilevers. Different tip materials and machining processes have been analyzed, obtaining the best results for crystalline silicon tips defined using a DRIE equipment to machine rocket tips. Isotropic processes with low cross-wafer dispersion and anisotropic processes with low cross-wafer dispersion and low scalloping have been achieved. After a sharpening oxidation, apex radii smaller than 5 nm have been achieved. Complete AFM probes have been fabricated. In order to test the developed technology, probes with similar characteristics to commercial ones were fabricated and used to raster scan some samples (in contact and non-contact mode) yielding results similar to those obtained with commercial probes. In addition, some special probes have been fabricated for nanoindentation over polymers and also to improve Kelvin Probe Force Microscopy (KPFM) performance. Thus, the availability of a technology that allows
the fabrication of customized cantilevers is very useful for the development of new SPM applications.
Bsoul, Anas Amjad Mohammad. "A study of piezoresistive sensing based on carbon-nanotube forests." Thesis, University of British Columbia, 2011. http://hdl.handle.net/2429/37899.
Full textGore, Kapil Suhling J. C. Jaeger Richard C. "Vibration analysis of test chips with integrated piezoresistive stress sensors." Auburn, Ala., 2006. http://repo.lib.auburn.edu/2006%20Summer/Theses/GORE_KAPIL_36.pdf.
Full textGoericke, Fabian Thomas. "Simulation, fabrication and characterization of piezoresistive bio-/chemical sensing microcantilevers." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/24624.
Full textAiyar, Avishek R. "Microfabrication of a MEMS piezoresistive flow sensor - materials and processes." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/24696.
Full textNaeli, Kianoush. "Optimization of piezoresistive cantilevers for static and dynamic sensing applications." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/28247.
Full textCommittee Chair: Brand, Oliver; Committee Member: Adibi, Ali; Committee Member: Allen, Mark G.; Committee Member: Bottomley, Lawrence A.; Committee Member: Degertekin, F. Levent.
Ibarra, Alejandro Rafael Garcia. "Desenvolvimento de transmissores de pressão diferencial baseados em sensores piezoresistivos e saída analógica de 4-20 mA." Universidade de São Paulo, 2014. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-19032015-163304/.
Full textThis research project presents the prototypes development of piezoresistive differential pressure transmitters with analog two-wire output of 4-20 mA. The devices use a DSSP (Digital Signal Processor Sensor) to achieve temperature compensation at temperatures from 0°C to 80°C and differential pressure calibration range from 0 bard to 25 bard and line pressure range from 0 barg to 7 barg. The transmitters measure several industrial variables: differential pressure, relative pressure and absolute pressure at fluids. The transmitters have a TEB (total error band) less than 0.15 percent of full scale. The analog output of the differential pressure transmitters is characterized using British Standards-BS. The parameters evaluated in the pressure transmitters are: the accuracy, the thermal coefficient of the offset, the thermal coefficient of the span, the total error band, the start-up drift and long-term drift. This work is the result of the academic and technological partnership between the Laboratory of Integrated Systems of the Polytechnic School of the University of São Paulo (LSI / EPUSP) and the MEMS company - Microssistemas Integrados Híbridos de Pressão Ltda.
Rausch, Jacqueline [Verfasser]. "Entwicklung und Anwendung miniaturisierter piezoresistiver Dehnungsmesselemente / Jacqueline Rausch." München : Verlag Dr. Hut, 2012. http://d-nb.info/1025821432/34.
Full textCollado, Miguens Anna. "Un nou encapsulat multixip per a acceleròmetres piezoresistius." Doctoral thesis, Universitat Autònoma de Barcelona, 2003. http://hdl.handle.net/10803/5339.
Full textEn el camp dels Smarts Sensors existeixen dues aproximacions bàsiques: l'aproximació monolítica que integra el sensor i els circuits en el mateix xip, i la versió multixip, que integra de forma híbrida tant el sensor com els circuits, fabricats per separat. Les dues tecnologies emprades en aquest treball han estat, la dels acceleròmetres piezoresistius en oblies BESOI i la dels mòduls multixip, silici sobre silici, mitjançant la tècnica de muntatge flip-chip. Aquesta tècnica proporciona a l'encapsulat de sensors nivell d'integració més elevat, a la vegada que redueix els problemes termo-mecànics pel fet d'emprar un substrat de silici.
En aquest estudi s'ha treballat en el desenvolupament d'aquest Smart Sensor per tal, principalment, d'aconseguir un encapsulat robust i lliure d'estrès. En aquest sentit, s'ha dut a terme el disseny d'una cavitat hermètica per a la protecció de les parts mòbils de l'acceleròmetre. L'hermeticitat s'obté mitjançant la pasta de soldadura que s'aplica en el mateix moment en que es fan les connexions elèctriques o solder bumps. Aquest fet ha requerit d'una modificació en la tecnologia de pads del sensor. Per altra banda, s'han dut a terme una sèrie de simulacions per elements finits per tal d'avaluar en les etapes de disseny l'estrès que podia aportar l'encapsulat a aquests dispositius sensibles a esforços mecànics. Els resultats de les simulacions demostren que si bé es dóna un cert grau d'estrès, aquest no arriba a perjudicar el comportament del sensor.
Les caracteritzacions tant elèctriques com mecàniques realitzades a l'encapsulat multixip, demostren que aquest encapsulat no modifica els paràmetres elèctrics més importants, com ara la sensibilitat o la tensió d'offset. La caracterització dinàmica demostra, però, que l'encapsulat multixip afegeix un més elevat grau d'esmorteïment modificant així la resposta del sensor. Aquesta variació es tradueix en una disminució de la freqüència de ressonància i del guany del sensor a aquesta freqüència. Aquest fet, en aplicacions DC, és una característica apreciada doncs evita una eventual ruptura del sensor.
This work describes the development of a Smart Sensor system for piezoresistive accelerometers using Multi Chip Module type D (MCM-D) technology.
There are two main approaches in the Smart Sensors field: The monolithic integration of the process circuitry with the sensor itself in the same chip, and the multichip approach, where both parts are independently fabricated and connected using hybrid integration. Two technologies have been used in the present work: CNM's piezoresistive accelerometers technology based on BESOI wafers and silicon-on-silicon multichip module technology, based on the flip-chip interconnection. This technique provides higher levels of integration for the packaging of sensors. In addition, the inclusion of a silicon substrate reduces thermo-mechanical problems.
The development of the Smart Sensor has been mainly oriented to obtain a robust and unstressed package. In this sense, mobile parts of the accelerometer have been protected with an specifically designed hermetic cavity. This cavity is built using solder paste, and is defined simultaneously with the electrical connections or solder bumps. This point required modifications of the sensor's pad technology. Furthermore, finite element simulations have been performed in order to evaluate the package induced stresses on the sensor, which is extremely sensitive to mechanical efforts. The simulation results showed that even if small stress appear, they don't adversely affect the behaviour of the sensor.
Electrical and mechanical characterisation of the multichip Smart Sensor, showed that the packaging process doesn't modify the main electrical parameters, such as sensitivity and off-set voltage. Vibration tests showed that multichip package increases mechanical damping, modifying the dynamic response of the sensor. In this sense, the resonance frequency and the gain of the sensor at this frequency decrease. This behaviour is useful for DC applications, preventing the failure of the sensor.
Silva, Geferson Gustavo Wagner Mota da. "Modelagem matemática de encapsulamento para elementos sensores Piezoresistivos." reponame:Repositório Institucional da UNIJUI, 2017. http://bibliodigital.unijui.edu.br:8080/xmlui/handle/123456789/4405.
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Tosolini, Giordano. "Force sensors based on piezoresistive and MOSFET cantilevers for biomolecular sensing." Doctoral thesis, Universitat Autònoma de Barcelona, 2013. http://hdl.handle.net/10803/131408.
Full textBiorecognition processes between receptors and their conjugate ligands are very important in biology. These biomolecules can build up very specific complexes displaying a variety of functions such as genome replication and transcription, enzymatic activity, immune response, cellular signaling, etc. The unambiguous one-to-one complementarity exhibited by these biological partners is widely exploited also in biotechnology to develop biosensors. Depending on the nature of the transduction signals, biosensors can be classified in optical, electrical and mechanical. Among mechanical biosensors, the microcantilevers play a prominent role. They have been used as stress or mass transducers in biomolecules detection for already more than a decade. The binding of molecules to their functionalized surface is detected by measuring either the deflection in static mode or the resonant frequency shift in dynamic mode. The deflection of the cantilever is converted optically by a laser and a photodetector in order to have the highest possible resolution. This limits the measurements in transparent liquids, the portability of the instrument and increases the complexity for multiplexing. The development of self-sensing cantilevers by integrating piezoresistors or metal-oxide-semiconductor field effect transistors (MOSFET) into the cantilever solves this issue. However, at the same time, this decreases the bending and frequency shift resolution due to the higher transducer noise. On the other hand, the detection of a single molecule can be attained measuring the unbinding force between two molecules of a complex pulling them apart, using the atomic force spectroscopy (AFS) measuring approach. This technique is based on the atomic force microscope (AFM). Despite the high force resolution, AFM has still not become an analytical instrument and it is mainly due to the complexity of the instrument and of its use. A biosensor based on AFS and on self-sensing cantilever would allow single molecule resolution, working in opaque fluids, easy multiplexing capability, and relatively easy integration in microfluidics cells. In this perspective, we worked to obtain self sensing-probes endowed with pN resolution and compatible with liquid media. Cantilevers based on single crystalline silicon have been modeled and the fabrication process has been optimized to improve the force sensitivity and to obtain high fabrication yield. At the same time we worked also on the modeling, development and fabrication of cantilevers with embedded MOSFET piezoresistive transducers. It turned out that the probes with integrated piezoresistor offer a more straightforward solution, but also the MOSFET cantilever can offer a good alternative. Alongside the force sensors fabrication, new high-throughput set-ups and techniques have been developed and optimized to measure the electrical and electromechanical characteristics of micro-electro-mechanical systems (MEMS) in a precise and reliable way. This was of key importance to correctly validate the new technological processes involved in production as well as characterize the final devices. After achieving very good sensor performances (resolution < 10 pN in liquid environment) with high production yield, we used the force probes to investigate the biorecognition processes in the avidin-biotin complex. For this purpose we integrated the sensor into a commercial AFM to take advantage of the high mechanical stability of this equipment and the highly reliable displacement of the piezo actuator. We detected the forces related to the avidin-biotin complex formation, highlighting the possibility of biomolecule label-free recognition in nearly physiological conditions and at single molecule resolution. Beside the very high sensitivity attained, the sensor can be used with no restrictions in opaque media; it can be easily integrated in microfluidic cells and it displays a high multiplexing potentiality. This result opens new perspectives in highly sensitive label free biomarkers detectors in nearly physiological conditions.
Neber, Sascha [Verfasser]. "Piezoresistive Sensoren auf der Basis von III-V-Halbleitern / Sascha Neber." Kassel : Kassel Univ. Press, 2001. http://d-nb.info/967703603/34.
Full textMohansundaram, S. M. "Large Enhancement in Metal Film Piezoresistive Sensitivity with Local Inhomogenization for Nanoelectromechanical Systems." Thesis, 2013. http://etd.iisc.ernet.in/2005/3388.
Full textLin, Tzong-Shyan, and 林宗賢. "Development of a novel piezoresistive." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/70525131584702305916.
Full text國立清華大學
動力機械工程學系
87
Piezoresistors have been used widely for various microsensors, such as accerlerometers and pressure sensors. Conventionally, piezoresistive sensors are fabricated by placing the piezoresistors on the regions where largest strain would occur. In order to satisfy the measurement sensitivity as well as the fabrication processes, the substrate underneath the microstructures are usually removed through the back-sided etching. Hence, the fabrication processes are complex and time consuming. To solve this problem, this article intends to propose an alternative design for piezoresistive sensors. The approach is to form the piezoresistors behind the boundary of the microstructure by diffusion. Therefore this piezoresistive sensor is compatible with front-side etch process and without an additional polysilicon layer deposited. The proposed design also provides the capability of integrating with various microactuators. In this research, the concept is proved by both simulation and experiment. A finite element model was established to analyze the stress at the region 2 to 5 mm away from the microstructure and its boundary. According to the results from the finite element analysis, the stress at the studied region is approximate one order of magnitude smaller than that at the end of the microstructure. In other words, a reasonable signal is still available at this region. During the experiment, silicon dioxide microcantilevers were fabricated, and piezoresistors were formed by diffuse n+ on silicon substrate 3 mm away from the micorcantilever's fixed end. An experimental setup containing micropositioner and piezo actuator was constructed. The output of piezoresistors is then measured when microcatilevers bend or vibrate.
Chu, Huey-Chi, and 朱惠祺. "Surface micromachined piezoresistive pressure sensor." Thesis, 1996. http://ndltd.ncl.edu.tw/handle/58138727480873005145.
Full text國立臺灣大學
應用力學研究所
84
Surface micromachined piezoresistive pressure sensor has been designed, modeled, and fabricated. The optimal position, orientation, and length of effective resistors on circular and square plate have been found. The sensitivity of 0.15 mV/V/psi could be achieved by the optimization design. The linearity error of pressure sensor is dominated by the large deflection of plates. The strain under large deflection of circular and square plates could be solved by the methods of S. P. Timoshenko and A. Foppl respectively. Experimental measurements showed consistent agreement. Because the solutions are analytic, they could be used in the linearity compensation circuitry. The output voltage of pressure sensor and temperature relationships have been predicted by Y. Kanda's theory and verified by experimental measurements. It could be used in the temperature compensation circuitry. We conquer some difficulties to fabricate surface micromachined piezoresistive pressure sensor in the Semi Conductor Research Center, NCTU. It shows the possibility of fabricating surface micromachined pressure sensor in Taiwan.
Lin, Zi-Ping, and 林子平. "Design of Piezoresistive Stress Sensor." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/83567p.
Full textAzevedo, Marco Daniel da Costa. "Caracterização de um acelerómetro polimérico piezoresistivo." Master's thesis, 2013. http://hdl.handle.net/1822/41944.
Full textO principal material utilizado na construção dos acelerómetros é o silício, porém, o seu processo é bastante dispendioso quando produzido em pequenas quantidades. Assim, a utilização de polímeros na construção de acelerómetros pode ser uma opção interessante, pois os custos destes processos de produção são menores. Esta dissertação tem como principal objetivo a caracterização de um acelerómetro polimérico piezoresistivo. Foram testadas configurações com dois e quatro extensómetros, através da sua inserção em meia ponte e ponte completa de Wheatstone, respetivamente. Esta caracterização engloba a construção de uma bancada de testes automática, bem como, a instrumentação necessária para a leitura do sinal do acelerómetro. Os resultados obtidos do acelerómetro foram: uma frequência de ressonância de 270Hz, um ruído de 72.5µV/ Hz, uma sensibilidade a temperatura de 0.21mV/ºC e uma gama dinâmica de +-80g. O fator de qualidade deste acelerómetro é muito elevado, fazendo variar a sensibilidade ao longo da largura de banda. Do trabalho desenvolvido resultou uma bancada de testes que poderá ser utilizada para caracterizar outros sensores inercias.
The main material used in the construction of the accelerometers is silicon, however, the process is quite expensive when produced in small quantities. Thus, the use of polymers in the construction of accelerometers can be an interesting option, as the costs related to the production processes of this type of sensors are smaller. The main objective of this thesis is the characterization of a polymer piezoresistive accelerometer. Configurations with two and four strain gauges were tested through their inclusion in a half and full Wheatstone bridge, respectively. This characterization includes the construction of an automatic test bench, as well as the necessary instrumentation to read the the signal from the accelerometer. The tested accelerometer has the following characteristics: a resonant frequency of 270Hz, a noise of 72.5µV/ Hz, a temperature sensitivity of 0.21mV/ºC and a dynamic range of +-80g. The quality factor of the accelerometer is very high, varying the sensitivity over the bandwidth. The work resulted in a test bench which can be used to characterize other inertial sensors.
Lin, Rong-Sheng, and 林容生. "The Optimal Design of Piezoresistive Sensor." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/61817995465505291904.
Full text國立臺灣大學
機械工程學系研究所
86
The piezoresistor has been admired for the large effect of stresses on the resistivity since 1954. Traditionally, the size of piezoresistor with regular shape has to be kept small enough to preserve the assumption of uniform stress distribution. In general, the electric potential of a piezoresistor subject to a non-uniform stress field can not be determined algebraically. Moreover, the assumption of uniform stress distribution may be questionable due to the miniaturization of transducer. The electric potential of a piezoresistor is dependent on the geometric shape, boundary conditions and stress distribution. The governing equation of electric potential with coefficients of electric conductivity and its derivatives is developed in this thesis. The electric conductivity is also formulated as an explicit form of specific resistivity, piezoresistity and temperature coefficients of resistivity. In order to investigate the electric potential numerically, a piezoresistive finite element is developed by variational scheme. Then the finite-element method can be employed to calculate the distribution of electric potential for the determination of output electrodes location. Since the distribution of impurity concentration is not uniform along the thickness of a piezoresistor as a consequence of doping method, the concept of equivalent conductivity is presented. The equivalent conductivity is expressed as an integral combination of electric conductivity developed previously. Based on the equivalent conductivity, the complex 3-dimensional analysis can be simplified to 2-dimensional analysis under the proper assumptions. The sensitivity of pressure sensors similar to Motorola X-ducer is investigated as an example. It is found that the algebraic solutions overestimate the sensitivity up to 49% under uniform low-doped concentration. The case of different impurity distributions is also studied. Finally, the method of shape optimization is applied to increase the sensitivity by fully taking the advantage of stress distribution in the available location of microsensors. The result of analysis indicated that the optimal shape of the four-terminal p-type piezoresistor would follow the maximum shear stress contour with extrusive output electrodes.
Srijanto, Bernadeta Resti Widhiyatni. "Implantable Piezoresistive Microcantilever-based Wireless Cocaine Biosensors." 2008. http://trace.tennessee.edu/utk_graddiss/347.
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