Academic literature on the topic 'PIP Package'
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Journal articles on the topic "PIP Package"
Das, Rabindra N., Frank D. Egitto, Barry Bonitz, Erich Kopp, Mark D. Poliks, and Voya R. Markovich. "Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration." International Symposium on Microelectronics 2012, no. 1 (2012): 000561–67. http://dx.doi.org/10.4071/isom-2012-wa15.
Full textPettersen, Claire, Larry F. Bliven, Mark S. Kulie, et al. "The Precipitation Imaging Package: Phase Partitioning Capabilities." Remote Sensing 13, no. 11 (2021): 2183. http://dx.doi.org/10.3390/rs13112183.
Full textWinarsih, Murni. "PENINGKATAN KEMAMPUAN GURU DALAM PEMBELAJARAN TUNARUNGU MELALUI PELATIHAN CONTEXTUAL LEARNING DI SEKOLAH INKLUSIF." Perspektif Ilmu Pendidikan 28, no. 2 (2014): 114. http://dx.doi.org/10.21009/pip.282.5.
Full textDas, Rabindra N., Frank D. Egitto, Steven G. Rosser, Erich Kopp, Barry Bonitz, and Raj Rai. "3D Integration of System-in-Package (SiP) Using Organic Interposer: Toward SiP-Interposer-SiP for High-End Electronics." International Symposium on Microelectronics 2013, no. 1 (2013): 000531–37. http://dx.doi.org/10.4071/isom-2013-wa43.
Full textDas, Rabindra, Frank D. Egitto, Steven G. Rosser, Erich Kopp, and Barry Bonitz. "3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 000618–34. http://dx.doi.org/10.4071/2013dpc-tp12.
Full textPettersen, Claire, Larry F. Bliven, Annakaisa von Lerber, et al. "The Precipitation Imaging Package: Assessment of Microphysical and Bulk Characteristics of Snow." Atmosphere 11, no. 8 (2020): 785. http://dx.doi.org/10.3390/atmos11080785.
Full textSukawati, Rina. "PENYUSUNAN PAKET PELATIHAN PENGEMBANGAN KECERDASAN INTRAPERSONAL UNTUK MAHASISWA." Perspektif Ilmu Pendidikan 16, no. VIII (2007): 22–31. http://dx.doi.org/10.21009/pip.162.3.
Full textAdeniran, S. A. Adedeji I. O. &. Ajayi O. "Assessment, Development and Validation of Programmed-Instructional-Package for Teaching Basic-Technology among upper Basic School Students in Gusau Metropolis, Zamfara State." Zamfara International Journal of Education 5, no. 1 (2025): 50–57. https://doi.org/10.5281/zenodo.15296274.
Full textTakefuji, Yoshiyasu. "Python Programming in PyPI for Translational Medicine." International Journal of Translational Medicine 1, no. 3 (2021): 323–31. http://dx.doi.org/10.3390/ijtm1030019.
Full textArini, Ira. "MENINGKATKAN HASIL BELAJAR IPS KELAS VIII SMP DENGAN PAKET PEMBELAJARAN BERBASIS MASALAH." Perspektif Ilmu Pendidikan 30, no. 1 (2016): 11. http://dx.doi.org/10.21009/pip.301.2.
Full textDissertations / Theses on the topic "PIP Package"
Wang, Anru. "Area-IO DRAM/Logic integration with system-in-a-package /." Diss., Digital Dissertations Database. Restricted to UC campuses, 2005. http://uclibs.org/PID/11984.
Full textZhang, Lihong Carleton University Dissertation Engineering Electronics. "Optimal pin-assignment for signal integrity optimization in IC packages and connectors." Ottawa, 1996.
Find full textRasheed, Adamu Abubakar. "Advances in the use of aerobic sequencing batch reactors for biological wastewater treatment." Thesis, University of Aberdeen, 2017. http://digitool.abdn.ac.uk:80/webclient/DeliveryManager?pid=233113.
Full textLiang, Hongwei. "Development of microwave and millimeter-wave pin grid array and ball grid array packages." Diss., Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/14867.
Full textPark, Je-Hyoung. "East chip-level static and transient thermal analysis method for thermal management of VLSI ICs in packages /." Diss., Digital Dissertations Database. Restricted to UC campuses, 2009. http://uclibs.org/PID/11984.
Full textSehnoutka, Martin. "Automatické ověřování softwarových balíků za pomocí DNS." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2018. http://www.nusl.cz/ntk/nusl-377064.
Full textPetřík, Radek. "Informační systém pro evidenci a tisk zásilek." Master's thesis, Vysoké učení technické v Brně. Fakulta informačních technologií, 2008. http://www.nusl.cz/ntk/nusl-235436.
Full textTecklenburg, Gerhard. "Design of body assemblies with distributed tasks under the support of parametric associative design (PAD)." Thesis, University of Hertfordshire, 2011. http://hdl.handle.net/2299/5809.
Full textWeng, Chia-Lun, and 翁嘉倫. "Wire Length Driven Flip-Chip Pin-Out Designation by Range Constrained Pin-Block Floorplanning in Package-Board Codesign." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/00116203163626550252.
Full textSchrank, Michael. "Development of a P2P Java package for a discrete-event simulation of a virtual future home environment /." 2008. http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&doc_number=017186827&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA.
Full textBooks on the topic "PIP Package"
Houston, Stewart. Pig management package, personnel management. Agricola and Bishop Burton College of Agriculture, 1989.
Find full textMinns, Peter David. Programmed learning package on the PIA programmable interface adaptor and programmed learning package on interrupts. University of Northumbria at Newcastle, School of Engineering, 1996.
Find full textChow, L. C. Safety review package for University of Central Florida flat-plate heat pipe experiment. National Aeronautics and Space Administration, 1998.
Find full textStern, S. Alan. Principal investigators data package for project initiation conference (PIC): EUVS sounding rocket #36.117CL : target, Venus. Southwest Research Institute, 1993.
Find full textUnited States. National Aeronautics and Space Administration., ed. Principal investigators data package for project initiation conference (PIC): EUVS sounding rocket #36.117CL : target, Venus. Southwest Research Institute, 1993.
Find full textProgram Implementation Profile: Assessment Form/Package of 25 (Pip Administration Manual). High/Scope Pr, 1989.
Find full textBursten, Bruce E., Julia R. Burdge, and Jr Brown. Chemistry Package Pie and Pin Card Chemistry. Pearson Education, Limited, 2003.
Find full textInc, Bergwall Productions. Basic Plumbing: Plastic Pipe Package. Delmar Thomson Learning, 1985.
Find full textSPACK. Blair Handbook Paperback Pin Code Package. Pearson Education dump list, 2000.
Find full textBook chapters on the topic "PIP Package"
DuBose, Ben. "Underground Radar Detects Infrastructure Damage." In Technology in Action: Robotics, Volume 1. NACE International, The Worldwide Corrosion Authority15835 Park Ten Place, Houston, TX 77084, 2020. https://doi.org/10.5006/37655-ch02.
Full textEl Borji, Yassine, and Mohammed Khaldi. "Indexing Serious Games to Meet Adaptive E-Learning System Needs." In Research Anthology on Developments in Gamification and Game-Based Learning. IGI Global, 2022. http://dx.doi.org/10.4018/978-1-6684-3710-0.ch046.
Full textEl Borji, Yassine, and Mohammed Khaldi. "Indexing Serious Games to Meet Adaptive E-Learning System Needs." In Personalization and Collaboration in Adaptive E-Learning. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-1492-4.ch014.
Full textSingh, Rajesh, Anita Gehlot, and Bhupendra Singh. "PID Controller for Heater with Arduino_1.1 Package." In Arduino and SCILAB based Projects. BENTHAM SCIENCE PUBLISHERS, 2019. http://dx.doi.org/10.2174/9789811410925119010012.
Full textBaker, Jason D. "Open Source Survey Software." In Software Applications. IGI Global, 2009. http://dx.doi.org/10.4018/978-1-60566-060-8.ch008.
Full textBaker, J. "Open Source Survey Software." In Handbook of Research on Electronic Surveys and Measurements. IGI Global, 2007. http://dx.doi.org/10.4018/978-1-59140-792-8.ch030.
Full textPrice, Max D. "Out of the Cradle." In Evolution of a Taboo. Oxford University Press, 2020. http://dx.doi.org/10.1093/oso/9780197543276.003.0004.
Full textHawkins, Dawn. "Describing a single sample." In Biomeasurement. Oxford University Press, 2019. http://dx.doi.org/10.1093/hesc/9780198807483.003.0003.
Full textAl-Bahadili, Hussein, and Haitham Y. Adarbah. "Modeling of TCP Reno with Packet-Loss and Long Delay Cycles." In Simulation in Computer Network Design and Modeling. IGI Global, 2012. http://dx.doi.org/10.4018/978-1-4666-0191-8.ch012.
Full textKehinde-Dada, Oluwabunmi V., Olusola Obisanya, and Gbenga Adewale. "Effects of Data-Driven Instructional Strategy on Pre-Service Teachers' Mathematics Lesson Preparation in College of Education Ikere-Ekiti." In Globalized Curriculum Methods for Modern Mathematics Education. IGI Global, 2019. http://dx.doi.org/10.4018/978-1-5225-6158-3.ch006.
Full textConference papers on the topic "PIP Package"
Noriki, Akihiro, Hirotaka Uemura, Haruhiko Kuwatsuka, et al. "Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with 2.3D RDL Interposer for Co-Packaged Optics." In 2024 International 3D Systems Integration Conference (3DIC). IEEE, 2024. https://doi.org/10.1109/3dic63395.2024.10830043.
Full textZhou, Xin, Lu Cui, Shuai Liu, and HengGuo You. "Design and Implementation of a Leadless Packaged SPDT PIN Switch." In 2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE). IEEE, 2024. https://doi.org/10.1109/mape62875.2024.10813941.
Full textDas, Rabindra N., Frank D. Egitto, Barry Bonitz, Mark D. Poliks, and Voya R. Markovich. "Package-Interposer-Package (PIP): A breakthrough Package-on-Package (PoP) technology for high end electronics." In 2011 IEEE 61st Electronic Components and Technology Conference (ECTC). IEEE, 2011. http://dx.doi.org/10.1109/ectc.2011.5898577.
Full textWang, Facheng, Zhigang Liu, and Xinshuai Liu. "Full-History Finite Element Modelling of Pipe-in-Pipe Flowline System: From Installation to Operation." In ASME 2013 32nd International Conference on Ocean, Offshore and Arctic Engineering. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/omae2013-10197.
Full textMalandri, Lorenzo, Fabio Mercorio, Mario Mezzanzanica, Navid Nobani, and Andrea Seveso. "The Good, the Bad, and the Explainer: A Tool for Contrastive Explanations of Text Classifiers." In Thirty-First International Joint Conference on Artificial Intelligence {IJCAI-22}. International Joint Conferences on Artificial Intelligence Organization, 2022. http://dx.doi.org/10.24963/ijcai.2022/858.
Full textGoruganthu, Rama R., Shawn McBride, Mike Santana, and Mehrdad Mahanpour. "Microprobing on Sub-Micron Features on ICs Using an AFM Based Technique." In ISTFA 2002. ASM International, 2002. http://dx.doi.org/10.31399/asm.cp.istfa2002p0461.
Full textBaumann, Joachim, Alessandro Castelnovo, Andrea Cosentini, Riccardo Crupi, Nicole Inverardi, and Daniele Regoli. "Bias On Demand: Investigating Bias with a Synthetic Data Generator." In Thirty-Second International Joint Conference on Artificial Intelligence {IJCAI-23}. International Joint Conferences on Artificial Intelligence Organization, 2023. http://dx.doi.org/10.24963/ijcai.2023/828.
Full textArjomandi, Kaveh, and Farid Taheri. "Influence of the Material Plasticity on the Characteristic Behavior of Sandwich Pipes." In 2010 8th International Pipeline Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ipc2010-31518.
Full textMcKeel, Charles A. "Effects of Package Content Position on Slap-Down Angle." In ASME 2010 Pressure Vessels and Piping Division/K-PVP Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/pvp2010-26067.
Full textKlymyshyn, Nicholas A., Harold E. Adkins, Christopher S. Bajwa, and Jason M. Piotter. "Package Impact Models as a Precursor to Cladding Analysis." In ASME 2010 Pressure Vessels and Piping Division/K-PVP Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/pvp2010-25773.
Full textReports on the topic "PIP Package"
Reynolds, R. Michael. Portable Radiation Package (PRP) Instrument Handbook. Office of Scientific and Technical Information (OSTI), 2017. http://dx.doi.org/10.2172/1377886.
Full textTyler, Craig. Fast Spectrum Experiment Fuel Pin Payload Specification for Package 9330. Office of Scientific and Technical Information (OSTI), 2014. http://dx.doi.org/10.2172/1172403.
Full textL. D. Habel. Cleanup Verification Package for the 118-F-5 PNL Sawdust Pit. Office of Scientific and Technical Information (OSTI), 2008. http://dx.doi.org/10.2172/945226.
Full textS. W. Clark and H. M Sulloway. Cleanup Verification Package for the 126-F-1, 184-F Powerhouse Ash Pit. Office of Scientific and Technical Information (OSTI), 2007. http://dx.doi.org/10.2172/945317.
Full textS. W. Clark and H. M. Sulloway. Cleanup Verification Package for the 126-F-1, 184-F Powerhouse Ash Pit. Office of Scientific and Technical Information (OSTI), 2007. http://dx.doi.org/10.2172/945318.
Full textFrazier, Marvin J., Nick Simeakis, and Alan D. Zdunek. PR-208-9116-R01 Investigation of Cased-Carrier-Pipe External Corrosion. Pipeline Research Council International, Inc. (PRCI), 1994. http://dx.doi.org/10.55274/r0011922.
Full textReynolds, R. M., and S. Smith. The R/V Discoverer cruise to Manus Island. The BNL Portable Radiometer Package (PRP) evaluation. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/481570.
Full textPartridge, Paul E. L51798 Effects of Phosphoric Acid Treatment on the Performance of Fusion-Bonded Epoxy Coatings. Pipeline Research Council International, Inc. (PRCI), 1998. http://dx.doi.org/10.55274/r0010267.
Full textL. M. Dittmer. Remaining Sites Verification Package for the 128-F-3 PNL Burn Pit, Waste Site Reclassification Form 2006-042. Office of Scientific and Technical Information (OSTI), 2006. http://dx.doi.org/10.2172/944155.
Full textL. M. Dittmer. Remaining Sites Verification Package for the 128-B-3 Burn Pit Site, Waste Site Reclassification Form 2006-058. Office of Scientific and Technical Information (OSTI), 2006. http://dx.doi.org/10.2172/944160.
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