Dissertations / Theses on the topic 'PIP Package'
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Consult the top 17 dissertations / theses for your research on the topic 'PIP Package.'
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Wang, Anru. "Area-IO DRAM/Logic integration with system-in-a-package /." Diss., Digital Dissertations Database. Restricted to UC campuses, 2005. http://uclibs.org/PID/11984.
Full textZhang, Lihong Carleton University Dissertation Engineering Electronics. "Optimal pin-assignment for signal integrity optimization in IC packages and connectors." Ottawa, 1996.
Find full textRasheed, Adamu Abubakar. "Advances in the use of aerobic sequencing batch reactors for biological wastewater treatment." Thesis, University of Aberdeen, 2017. http://digitool.abdn.ac.uk:80/webclient/DeliveryManager?pid=233113.
Full textLiang, Hongwei. "Development of microwave and millimeter-wave pin grid array and ball grid array packages." Diss., Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/14867.
Full textPark, Je-Hyoung. "East chip-level static and transient thermal analysis method for thermal management of VLSI ICs in packages /." Diss., Digital Dissertations Database. Restricted to UC campuses, 2009. http://uclibs.org/PID/11984.
Full textSehnoutka, Martin. "Automatické ověřování softwarových balíků za pomocí DNS." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2018. http://www.nusl.cz/ntk/nusl-377064.
Full textPetřík, Radek. "Informační systém pro evidenci a tisk zásilek." Master's thesis, Vysoké učení technické v Brně. Fakulta informačních technologií, 2008. http://www.nusl.cz/ntk/nusl-235436.
Full textTecklenburg, Gerhard. "Design of body assemblies with distributed tasks under the support of parametric associative design (PAD)." Thesis, University of Hertfordshire, 2011. http://hdl.handle.net/2299/5809.
Full textWeng, Chia-Lun, and 翁嘉倫. "Wire Length Driven Flip-Chip Pin-Out Designation by Range Constrained Pin-Block Floorplanning in Package-Board Codesign." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/00116203163626550252.
Full textSchrank, Michael. "Development of a P2P Java package for a discrete-event simulation of a virtual future home environment /." 2008. http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&doc_number=017186827&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA.
Full textHUNG, RUI-TONG, and 洪睿彤. "Study on the Elements of Design Award in Tea Package : An Example of Golden Pin Design Award." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/3a7t2c.
Full textShiu, Jin-Rung, and 許晉榮. "To Apply Six-Sigma Steps and DOE Techniques in improving Delamination Deviations of PDIP Package of Semiconductor." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/37616052162363055709.
Full textTsai, Guo-Ding, and 蔡國鼎. "X-band Three-stub Filter Embedded SPDT/SP4T Switches Using Packaged PIN Diodes and Novel Resonators." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/jdk45j.
Full textTsao, hui-min, and 曹惠旻. "The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/43632260784491018711.
Full textAmiri, Mohammad Sadegh. "Robustness versus performance tradeoffs in PID tuning." Master's thesis, 2009. http://hdl.handle.net/10048/647.
Full textMolina, Homar. "Using the FRDPARRC design methodology to drive innovation in the HETDEX PFIP support adjustable strut assembly." Thesis, 2010. http://hdl.handle.net/2152/ETD-UT-2010-12-2034.
Full textHUANG, MEI-HUI, and 黃美惠. "The Rebuilding of Local Cultrue Industry of Chinese Medicine-The Design of Chinese Medicine Package in Pin-An Zhin Town of Big tile house Kampo Culture Square." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/85bxz8.
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