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Journal articles on the topic 'Plate-fin heat sink'

Author: Grafiati

Published: 3 June 2025

Last updated: 19 July 2025

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1

Shyu, Jin-Cherng, and Jhih-Zong Syu. "THERMAL PERFORMANCE OF VERTICAL HEAT SINKS WITH DIFFERENT PIEZOFAN ARRANGEMENTS." Transactions of the Canadian Society for Mechanical Engineering 37, no. 3 (2013): 895–903. http://dx.doi.org/10.1139/tcsme-2013-0076.

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This study examines various effects on the heat transfer enhancement of several vertical heat sinks with a running piezofan. Both plate-fin heat sink and pin-fin heat sink having a 10-mm-high or 30-mm-high fin array were tested with either a vertical or a horizontal piezofan. Results show that the piezofan tip located at x/L = 0.5 usually yielded the highest heat transfer enhancement. Besides, heat transfer enhancement factors ranged from 1.2 to 2.4 for the present 10-mm-high plate-fin heat sink, and from 1.1 to 2.6 for the 10-mm-high pin-fin heat sink.

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2

Pua, SW, KS Ong, KC Lai, and MS Naghavi. "Natural and forced convection heat transfer coefficients of various finned heat sinks for miniature electronic systems." Proceedings of the Institution of Mechanical Engineers, Part A: Journal of Power and Energy 233, no. 2 (2018): 249–61. http://dx.doi.org/10.1177/0957650918784420.

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Downward lighting light-emitting diodes require cooling with cylindrical fin heat sinks to be mounted on top and cooled under natural convection air cooling mode. Performance simulation would involve specification of the heat transfer coefficient. Numerous methods are available to simulate the performance of conventional plate fin heat sinks including computational fluid dynamics packages. It would be feasible to perform simulation based on conventional flat plate fin heat sinks. A cylindrical fin heat sinks could be simply treated as a plate fin heat sink, if we imagine it cut open and laid o

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3

Duan, Zhipeng, Xianghui Lv, Hao Ma, Liangbin Su, and Mengqiao Zhang. "Analysis of Flow Characteristics and Pressure Drop for an Impinging Plate Fin Heat Sink with Elliptic Bottom Profiles." Applied Sciences 10, no. 1 (2019): 225. http://dx.doi.org/10.3390/app10010225.

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The performance of impingement air cooled plate fin heat sinks differs significantly from that of parallel flow plate fin heat sinks. The impinging flow situations at the entrance and the right-angled bends of the plate fin heat sink are quite involved. Flow characteristics of a plate fin heat sink with elliptic bottom profiles cooled by a rectangular impinging jet with different inlet widths are studied by numerical simulations. The results of pressure drop of numerical simulations and experimental results match quite well. The numerical results show that at the same flow rate, the pressure d

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4

Rasangika, Ambagaha Hewage Dona Kalpani, Mohammad Shakir Nasif, and Rafat Al-Waked. "Comparison of Forced Convective Heat-Transfer Enhancement of Conventional and Thin Plate-Fin Heat Sinks under Sinusoidal Vibration." Applied Sciences 13, no. 21 (2023): 11909. http://dx.doi.org/10.3390/app132111909.

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Applying sinusoidal vibration to heat sinks has proven to be a promising technique for improving heat transfer by disrupting the thermal boundary layer. However, applying sinusoidal vibration to the base of thin plate-fin heat sinks can cause a flapping motion within the fins, further enhancing heat transfer. Therefore, the current study numerically investigates and compares the effects of sinusoidal vibrations on the thermal performance of conventional and thin plate-fin heat sinks. The study concludes that increased vibrational amplitude and frequency (f ˃ 30 Hz) increases the vibration-assi

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5

Nguyen, Tue Duy, An Van Vo, and Tam Thanh Bui. "Design Modeling and CFD Simulation of Parallel Plate–Fin Heat Sink Under Natural Convection." Makara Journal of Technology 28, no. 3 (2024): 96–104. https://doi.org/10.7454/mst.v28i3.1684.

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The lifetime of electronic devices strongly depends on the junction temperature. Heat sinks are a good choice for dissipating heat because of their enhanced heat transfer areas. Plate–fin heat sinks are commonly used for electronic components because of their simple construction. Recently, computational fluid dynamics (CFD) software, such as Ansys Fluent and OpenFOAM, has been widely used and has provided effective results. Autodesk CFD is a powerful simulation tool; however, its use in heat sink research remains relatively uncommon. In this study, two plate–fin heat sinks with heights of 30 a

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6

Richard Culham, J., Waqar A. Khan, M. Michael Yovanovich, and Yuri S. Muzychka. "The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks." Journal of Electronic Packaging 129, no. 1 (2006): 76–81. http://dx.doi.org/10.1115/1.2429713.

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The thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow characteristic possible. While a cursory review of the thermal network established between heat sources and sinks in typical plate fin heat sinks would indicate that the film resistance at the fluid-solid boundary dominates, it is shown that the effects of other resistance elements, such as the spreading resistance and the material resistance, although of lesser magnitude, play an important role in the optimiz

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7

SU, XIANGHUI, and SHUO XU. "STEADY-STATE THERMAL ANALYSIS OF A PLATE FIN HEAT SINK USING GREEN'S FUNCTION." Modern Physics Letters B 24, no. 13 (2010): 1495–98. http://dx.doi.org/10.1142/s0217984910023955.

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This paper presents a method for thermal simulation of a plate fin heat sink using an analytical solution of the three-dimensional heat equation resulting from an appropriate plate fin heat sink thermal model. The steady-state temperature map on the surface of the plate fin heat sink is computed analytically employing the Green's function method. The entire solution methodology is illustrated for the particular examples of the plate fin heat sink subjected to non-uniform heat density on the surfaces. The simulation results are validated with experimental measurements.

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8

Sathe, Anilkumar, Sudarshan Sanap, Sunil Dingare, and Narayan Sane. "Thermal Analysis of Vertical Plate Fin Heat Sink." E3S Web of Conferences 170 (2020): 01022. http://dx.doi.org/10.1051/e3sconf/202017001022.

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Heat Sinks are widely used to remove the heat from the components which are generating heat during their functioning. Overheating causes malfunctioning of the components as well as it is responsible for reducing their life. Free convection is very common way of heat transfer from the heat sink considering power requirement, pressure drop and cost of the forced convection. This paper presents the thermal analysis of vertical plate fin heat sink by theoretical and experimental method at variable heat input. The results are obtained by taking experimental observations and are validated with alrea

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9

Xu, Gaowei, Yingjun Cheng, and Le Luo. "Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array." Journal of Electronic Packaging 129, no. 4 (2007): 518–21. http://dx.doi.org/10.1115/1.2804102.

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The heat-transfer characteristics of 128 small-sized plate-fin heat sinks in a supercomputer chassis are investigated with CFD simulation. The V-shaped curves of the chip temperature versus fin pitch and fin thickness are derived and a thermal resistance model is built to explore the profile and obtain the convective heat-transfer coefficient of the heat sinks. It turns out that the V-shaped profile arises from the joint action of the thermal conduction and convection of heat sink, which can be attributed to the intricacy of the dependencies of thermal resistances on either fin pitch or thickn

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10

Lakshmanan, Periyannan, Saravanan Periyasamy, and Mohan Raman. "Experimental analysis of effect of base with different inner geometries filled nano PCM for the thermal performance of the plate fin heat sink." Thermal Science, no. 00 (2021): 243. http://dx.doi.org/10.2298/tsci201005243l.

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Experimental research demonstrates the performance of electronic devices on plate fin heat sinks in order to guarantee that operating temperatures are kept as low as possible for reliability. Paraffin wax (PCM) is a substance that is used to store energy and the aluminum plate fin cavity base is chosen as a Thermal Conductivity Enhancer (TCEs). The effects of PCM material (Phase shift material), cavity form base (Rectangular, Triangular, Concave and Convex) with PCM, Reynolds number (Re= 4000-20000) on heat transfer effectiveness of plate fin heat sinks were experimentally explored in this res

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11

Sathe, Anilkumar, and Sudarshan Sanap. "Augmentation of Thermal Performance of Plate Fin Heat Sink." International Journal of Engineering and Advanced Technology 8, no. 6s (2019): 1087–94. http://dx.doi.org/10.35940/ijeat.f1213.0886s19.

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Heat sinks are popularly used in various industrial applications to cool electrical, electronics and automobile components. They are useful in removing the heat from the surfaces at elevated temperatures. The life of such devices depends on their operating temperature. Heat sinks are important parts of thermal management systems of most of these devices eg: Diods, thyristers, high power semiconductor devices such as integrated circuits of inverters, audio amplifier, microprocessors, microcontrollers etc. In many situations where heat transfer is by free convection where convective heat transfe

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12

Saravanan.V*1, C.K.Umesh 2. "EXPERIMENTAL INVESTIGATION FOR FLOW AND HEAT TRANSFER OVER PIN FIN HEAT EXCHANGER." INTERNATIONAL JOURNAL OF ENGINEERING SCIENCES & RESEARCH TECHNOLOGY 6, no. 12 (2017): 511–18. https://doi.org/10.5281/zenodo.1130840.

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In the present work fluid flow and heat transfer characteristics of a micro pin fin heat sink were investigated both experimentally. The heat sink was fabricated from Aluminium and fitted with a polycarbonate plastic cover plate. The heat sink consist of staggered and inline arrangement of square pin fin of size 0.5mm X 0.5mm X 0.5mm. Water was employed as the working fluid subjected to heat flux 10W/cm<sup>2</sup>. The study was carried out for Reynolds number ranging 60 to 900. Later the performance of square pin fin heat sink was compared with parallel pin fin heat sink. Pressure drop, fric

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13

Park, Boo Seong, Hyun Jin Park, and Bo Hung Kim. "Optimal Design of a Plate-Fin Heat Sink with Slip Flow." Journal of the Korean Society for Precision Engineering 32, no. 2 (2015): 219–27. http://dx.doi.org/10.7736/kspe.2015.32.2.219.

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14

Chang, Yen-Tso, Han-Ching Lin, Chi-Jui Huang, Go-Long Tsai, and Jinn-Feng Jiang. "Numerical Study of Thermal and Flow Characteristics of Plate-Fin Heat Sink with Longitudinal Vortex Generator Installed on the Ground." Mathematical Problems in Engineering 2014 (2014): 1–9. http://dx.doi.org/10.1155/2014/245759.

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This study applied the commercial software ANSYS CFD (FLUENT), for simulating the transient flow field and investigating the influence of each parameter of longitudinal vortex generators (LVGs) on the thermal flux of a plate-fin heat sink. Vortex generator was set in front of plate-fin heat sink and under the channel, which was in common-flow-down (CFD) and common-flow-up (CFU) conditions, which have the result of vortex generator of delta winglet pair (DWP). In this study the parameters were varied, such as the minimum transverse distance between winglet pair, the attack angle of the vortex g

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15

Soloveva, Olga V., Sergei A. Solovev, and Rozalina Z. Shakurova. "Numerical Study of the Thermal and Hydraulic Characteristics of Plate-Fin Heat Sinks." Processes 12, no. 4 (2024): 744. http://dx.doi.org/10.3390/pr12040744.

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One of the main trends in the development of the modern electronics industry is the miniaturization of electronic devices and components. Miniature electronic devices require compact cooling systems that can dissipate large amounts of heat in a small space. Researchers are exploring ways to improve the design of the heat sink of the cooling system in such a way that it increases the heat flow while at the same time reducing the size of the heat sink. Researchers have previously proposed different designs for heat sinks with altered fin shapes, perforations, and configurations. However, this ap

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16

Wu, Hsin-Hsuan, Yuan-Yuan Hsiao, Hsiang-Sheng Huang, Ping-Huey Tang, and Sih-Li Chen. "A practical plate-fin heat sink model." Applied Thermal Engineering 31, no. 5 (2011): 984–92. http://dx.doi.org/10.1016/j.applthermaleng.2010.10.014.

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17

Yu, Xiaoling, Jianmei Feng, Quanke Feng, and Qiuwang Wang. "Development of a plate-pin fin heat sink and its performance comparisons with a plate fin heat sink." Applied Thermal Engineering 25, no. 2-3 (2005): 173–82. http://dx.doi.org/10.1016/j.applthermaleng.2004.06.016.

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18

Shyu, Jin Cherng, and Jhih Zong Syu. "Heat Transfer Enhancement of Vertical Heat Sinks with a Piezofan." Applied Mechanics and Materials 284-287 (January 2013): 773–77. http://dx.doi.org/10.4028/www.scientific.net/amm.284-287.773.

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This study examines several effects, including the piezofan positions, and piezofan arrangements, as well as piezofan height, on the heat transfer enhancement of two typical types of vertical heat sink. Either 30-mm-high or 10-mm-high heat sink having 11 plate-fins or 100 square pin-fins is tested with a running piezofan. The piezofan having Mylar blade is either vertically or horizontally placed above the heat sinks vibrating with resonant frequency of 31 Hz and tip mean-to-peak amplitude of 7.2 mm. The heat transfer coefficient is measured at five different fan locations with fan heights of

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19

Kuru, Muhammet Nasıf. "The effect of the triangular rib usage in the plate fin heat sinks on the pressure drop, base plate temperature, and entropy generation." European Mechanical Science 7, no. 2 (2023): 99–108. http://dx.doi.org/10.26701/ems.1276575.

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Improving the thermal efficiency in plate fin heat sinks (PFHS) results in a reduction in the weight, volume and cost of the heat sink. This ensures long life and reliable operation of the cooled equipment. In this study, the performances of triangular ribbed PFHSs, which are formed by placing a staggered array of triangular ribs between plate fins, were numerically investigated. Pressure drop, base plate temperature and entropy generation are used for performance comparisons. Numerical heat transfer and flow analysis were performed in three-dimensional models with the help of Ansys Fluent pro

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20

Irshad Wani, Manisa, and Abhishek Sanjay Shinde. "STEADY STATE THERMAL ANALYSIS OF PERFORATED HONEYCOMBPLATE FIN HEAT SINKS USING ANSYS." International Journal of Advanced Research 10, no. 07 (2022): 719–48. http://dx.doi.org/10.21474/ijar01/15091.

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Heat sink or heat exchanger is a passive cooling device used in electronic components to prolong their longevity, performance and reliability. All electronic components utilize current for the operational purposes and thus become prone to sharp increase in the temperature. The generated heat above the operating level becomes critical in-terms of failure component and hence, appropriate thermal management demands come into act. Finned or extended surface heat sinks are used to cool power electronic devices and components. The comparative results of plate-fin forms on the thermal performance of

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21

Abdelmohimen, Mostafa, Khalid Almutairi, Mohamed Elkotb, Hany Abdelrahman, and Salem Algarni. "Numerical investigation of using different arrangement of fin slides on the plate-fin heat sink performance." Thermal Science, no. 00 (2021): 65. http://dx.doi.org/10.2298/tsci201004065a.

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Cutting fins of the plate heat sinks into multi-numbers of slides instead of one slide fin is a technique to improve the performance of the heat sink. One, two, three, and four slides have been studied numerically. The slides have been arranged in staggered arrangement. The study has been carried out on two different flow directions (impinging and parallel). The performance of the heat sink under the studied conditions has been represented through calculation of heat sink effectiveness, thermal resistance, pressure drop, pumping power, and Nusselt number. The studied range of Reynolds number i

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22

Lyu, Bei-xuan, Yu-ren Chen, and Yong Li. "Graph Theory-Based Mathematical Calculation Modeling for Temperature Distribution of LED Lights’ Convective Cooled Heat Sinks under Moisture Environment." Mathematical Problems in Engineering 2020 (April 27, 2020): 1–12. http://dx.doi.org/10.1155/2020/2534238.

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In this paper, a mathematical model based on graph theory is proposed to calculate the heat distribution of LED lights’ convective cooled heat sink. First, the heat and mass transfer process of a single fin under moisture environment is analyzed. Then, the heat transfer process is characterized by a digraph, defining fins and joints of a heat sink as edges and vertices in graph theory. Finally, the whole heat transfer process is described by two criteria achieved based on graph theory. Therefore, the temperature-heat calculation equations of the whole heat sink are deduced. The accuracy of thi

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23

Sivasankaran, Harish, Godson Asirvatham, Jefferson Bose, and Bensely Albert. "Experimental analysis of parallel plate and crosscut pin fin heat sinks for electronic cooling applications." Thermal Science 14, no. 1 (2010): 147–56. http://dx.doi.org/10.2298/tsci1001147s.

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Experimental investigation of parallel plate fin and the crosscut pin fin heat sinks where the heating element placed asymmetrically is performed. Theoretical calculations were done and compared with the experimental results. A comparative study was made based on their efficiencies, heat transfer coefficient, and the thermal performance. From the experimental results it was found that the average heat transfer coefficient of parallel plate fins is higher than that of crosscut pin fins with many perforations. However the performance efficiency of both the crosscut pin fins and parallel plate fi

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24

Y. Taha, Dalmn, Dhamyaa S. Khudhur, and Layla M. Nassir. "THE BEHAVIOR OF HEAT SINK-IMPINGEMENT COOLING WITH FLAT PLATE AND ARCED FINS MODELS." Journal of Engineering and Sustainable Development 26, no. 1 (2022): 1–14. http://dx.doi.org/10.31272/jeasd.26.1.1.

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In this paper, a statistical analysis was applied to the numerical predictions of temperature distribution for the heat sinks. There are two types of heat sink with an array of impingement. The first type is a flat plate heat sink, and the second type is arcs-fins heat sinks. The second type category considers five models (A, B, C, D, and E). The shapes of fins were changed, but the thickness, distance between fins, and radius were held fixed for comparing and analyzing them depending upon the improvement of the fin geometry of heat sink. The heat sinks of the two types are subjected to multi

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25

Syed.Unees, Babu, Vijay Kumar Perumalla, and Lakshmi Prasad K. "Experimental and Cfd Analysis of Heat Transfer Rate in Multi Air Jet Impingement Over A Flat Plate and Pin-Fin Heat Sink." International Journal of Innovative Technology and Exploring Engineering (IJITEE) 9, no. 12 (2020): 329–37. https://doi.org/10.35940/ijitee.L7983.1091220.

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In this paper reports the results of investigation of heat transfer performance of in compression air jet impinging of heated surface over a flat plate & pin-fin heat sink. To mimic the computer processor of flat plate and pin fin dimensions are 120mm*75mm and pin height is 5cm and fin radius is 1cm and L/d ratios are 5,10,15respectively. By using this simulation in Ansys fluent software to perform the turbulent jet impingement on a surface. The bottom surface of the plate is supply constant heat flux and top surface of the plate is cooled by an impingement jet of air. It has two equations

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26

Bar-Cohen, Avram, Madhusudan Iyengar, and Allan D. Kraus. "Design of Optimum Plate-Fin Natural Convective Heat Sinks." Journal of Electronic Packaging 125, no. 2 (2003): 208–16. http://dx.doi.org/10.1115/1.1568361.

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The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is br

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27

S N, Sharath Kumar, Sathish S, and Purushothama H R. "Heat Transfer Analysis of Plate Fin Heat Sink with Dimples and Protrusions: Investigation of New Designs." International Journal of Heat and Technology 39, no. 6 (2021): 1861–70. http://dx.doi.org/10.18280/ijht.390621.

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Numerous works have been carried out in the design and analysis of Heat Sink, however hardly any work have been reported with studies on dimples and protrusions being added to the heat sink geometries. This paper aims to find the worthiness for addition of dimples and protrusions to the common plate fin heat sink geometries for heat transfer enhancement. Analysis was carried out in forced convention environment for 9 different velocities computationally for 12 heat sink geometries at constant heat flux boundary condition applied to base of heat sink. Decrease in base temperature and thermal re

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28

Wen, Mao Yu, and Cheng Hsiung Yeh. "Thermal Resistance of Perforated Heat Sinks with Circular Pin Fins Cooled by Natural Convection." Applied Mechanics and Materials 775 (July 2015): 88–92. http://dx.doi.org/10.4028/www.scientific.net/amm.775.88.

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This study examines thermal resistance under natural convection for two different types (Type A and Type B) of pin-fin heat sinks with/without a hollow in the heated base. The effects of the rate of heat transfer, the height of fin, the finning factor, the heat sink porosity and the perforated base plate on the thermal resistance were investigated and evaluated. Experimental results show that thermal resistance, using pin-fin heat sinks, is significantly different for Type A and Type B.

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29

Zhou, Li, and Yang Liu. "Optimization of Horizontal Plate Fin Heat Sink in Natural Convection for Electronics Cooling by Simulated Annealing Algorithm." Advanced Materials Research 1022 (August 2014): 91–95. http://dx.doi.org/10.4028/www.scientific.net/amr.1022.91.

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In this study, the simulated annealing (SA) algorithm was adopted to optimize the geometry of horizontal plate fin heat sink by the extreme entransy dissipation principle. The alculation of the entransy dissipation rate was presented in detail. Using the entransy dissipation rate as the objective condition, the geometry optimization of the fin heat sink was conducted. To verify the results, the heat source temperature and the entropy generation rate were also calculated in the procedure. It is found that the entrasy dissipation rate, entropy generation and heat source temperature have the simi

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30

Shah, Amit, Bahgat G. Sammakia, K. Srihari, and K. Ramakrishna. "Optimization Study for a Parallel Plate Impingement Heat Sink." Journal of Electronic Packaging 128, no. 4 (2006): 311–18. http://dx.doi.org/10.1115/1.2351893.

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A previous study by the authors on fin-shape optimization of a plate fin heat sink has concluded that a depopulated central zone, just under the center of the fan, provides a better thermal performance compared to the heat sink geometries with fin material under the fan. This study extends the previous work by investigating the effect of removal of fin material from the end fins, the total number of fins, and the reduction in the size of the hub fan. From this study, it is concluded that the removal of fin material from the end fins results in a better thermal and hydraulic performance of the

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31

Duan, Zhipeng, and Y. S. Muzychka. "Experimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat Sinks." Journal of Electronic Packaging 128, no. 4 (2005): 412–18. http://dx.doi.org/10.1115/1.2351906.

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Impingement cooling of plate fin heat sinks is examined. Experimental measurements of thermal performance were performed with four heat sinks of various impingement inlet widths, fin spacings, fin heights, and airflow velocities. The percent uncertainty in the measured thermal resistance was a maximum of 2.6% in the validation tests. Using a simple thermal resistance model based on developing laminar flow in rectangular channels, the actual mean heat transfer coefficients are obtained in order to develop a simple heat transfer model for the impingement plate fin heat sink system. The experimen

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32

Chen, Han-Taw, Shih-Ting Lai, and Li-Ying Haung. "Investigation of heat transfer characteristics in plate-fin heat sink." Applied Thermal Engineering 50, no. 1 (2013): 352–60. http://dx.doi.org/10.1016/j.applthermaleng.2012.08.040.

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Sasao, Keiji, Mitsuru Honma, Atsuo Nishihara, and Takayuki Atarashi. "Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks." Journal of Electronic Packaging 123, no. 3 (1999): 315–18. http://dx.doi.org/10.1115/1.1371924.

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A numerical method for simulating impinging air flow and heat transfer in plate-fin type heat sinks has been developed. In this method, all the fins of an individual heat sink and the air between them are replaced with a single, uniform element having an appropriate flow resistance and thermal conductivity. With this element, fine calculation meshes adapted to the shape of the actual heat sink are not needed, so the size of the calculation mesh is much smaller than that of conventional methods.

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34

Khattak, Zulfiqar, and Hafiz Ali. "Thermal analysis and parametric optimization of plate fin heat sinks under forced air convection." Thermal Science, no. 00 (2021): 81. http://dx.doi.org/10.2298/tsci201227081k.

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Heat dissipation is becoming more and more challenging with the preface of new electronic components having staggering heat generation levels. Present day solutions should have optimized outcomes with reference to the heat sink scenarios. The experimental and theoretical results for plate type heat sink based on mathematical models have been presented in the first part of the paper. Then the parametric optimization (topology optimization) of plate type heat sink using Levenberg-Marquardt technique employed in the COMSOL Multiphysics? software is discussed. Thermal resistance of heat sink is ta

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35

Lee, Kim, and Kim. "Experimental Study on Forced Convection Heat Transfer from Plate-Fin Heat Sinks with Partial Heating." Processes 7, no. 10 (2019): 772. http://dx.doi.org/10.3390/pr7100772.

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In this study, plate-fin heat sinks with partial heating under forced convection were experimentally investigated. The base temperature profiles of the plate-fin heat sinks were measured for various heating lengths, heating positions, flow rates, and channel widths. From the experimental data, the effects of heating length, heating position, and flow rate on the base temperature profile and the thermal performance were investigated. Finally, the characteristics of the optimal heating position were investigated. As a result, it was shown that the optimal heating position was on the upstream sid

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36

Markowski, Piotr Marek, Mirosław Gierczak, and Andrzej Dziedzic. "Modelling of the Temperature Difference Sensors to Control the Temperature Distribution in Processor Heat Sink." Micromachines 10, no. 9 (2019): 556. http://dx.doi.org/10.3390/mi10090556.

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This paper has three main purposes. The first is to investigate whether it is appropriate to use a planar thick-film thermoelectric sensor to monitor the temperature difference in a processor heat sink. The second is to compare the efficiency of two heat sink models. The third is to compare two kinds of sensors, differing in length. The model of the CPU heat sink sensor system was designed for numerical simulations. The relations between the CPU, heat sink, and the thermoelectric sensor were modelled because they are important for increasing the efficiency of fast processors without interferin

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37

Singh, Niranjan Ramendra, Singh Onkar, and Janakarajan Ramkumar. "Thermo-Hydraulic Performance of Square Micro Pin Fins under Forced Convection." International Journal of Heat and Technology 39, no. 1 (2021): 170–78. http://dx.doi.org/10.18280/ijht.390118.

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Thermal management of the new generation’s high performance electronic and mechanical devices is becoming important due to their miniaturization. Conventionally, the plate fin arrangement is widely used for removal of dissipated heat but, their effectiveness is not up to mark. Among different options, the most attractive and efficient alternative for overcoming this problem is micro pin fin heat sink. This paper presents the experimental investigation of square micro-pin fins heat sink for identifying the most suitable pin fin geometry for heat removal applications under forced convection. Twe

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38

Ozbalci, Oguzhan, Ayla Dogan, and Meltem Asilturk. "Heat Transfer Performance of Plate Fin and Pin Fin Heat Sinks Using Al2O3/H2O Nanofluid in Electronic Cooling." Processes 10, no. 8 (2022): 1644. http://dx.doi.org/10.3390/pr10081644.

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The thermal management of electronic devices has become a major problem in recent years. Therefore, there is a growing need for research on many new materials and innovative fluids due to the developing technology and increasing cooling need in electronic systems. In this paper, heat transfer from a plate fin and pin fin type heat sinks that were placed in a water block that are used in electronic systems was investigated. A base fluid (pure water) and 0.1% mass concentration Al2O3-H2O nanofluid were used as cooling fluids. The experiments were carried out for volumetric flow rates varying bet

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Jehhef, Kadhum Audaa. "Experimental and Numerical Study Effect of Using Nanofluids in Perforated Plate Fin Heat Sink for Electronics Cooling." Journal of Engineering 24, no. 8 (2018): 1. http://dx.doi.org/10.31026/j.eng.2018.08.01.

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An experimental and numerical investigation of the effect of using two types of nanofluids with suspending of (Al2O3 and CuO) nanoparticles in deionized water with a volume fraction of (0.1% vol.), in addition to use three types of fin plate configurations of (smooth, perforated, and dimple plate) to study the heat transfer enhancement characteristics of commercial fin plate heat sink for cooling computer processing unit. All experimental tests under simulated conditions by using heat flux heater element with input power range of (5, 16, 35, 70, and 100 W). The experimental parameters calculat

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Shyu, Jin-Cherng, and Jhao-Siang Jheng. "Heat Transfer Enhancement of Plate-Fin Heat Sinks with Different Types of Winglet Vortex Generators." Energies 13, no. 19 (2020): 5219. http://dx.doi.org/10.3390/en13195219.

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Because the delta winglet in common-flow-down configuration has been recognized as an excellent type of vortex generators (VGs), this study aims to experimentally and numerically investigate the thermo-hydraulic performance of four different forms of winglet VGs featuring sweptback delta winglets in the channel flow in the range 200 < Re < 1000. Both Nusselt number and friction factor of plate-fin heat sinks having different forms of winglets, including delta winglet pair (DWP), rectangular winglet pair (RWP), swept delta winglet pair (SDWP), and swept trapezoid winglet pair (STWP), were

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Khor, C. Y., M. U. Rosli, M. A. M. Nawi, W. C. Kee, and Dadan Ramdan. "Influence of inlet velocity and heat flux on the thermal characteristic of various heat sink designs using CFD analysis." Journal of Physics: Conference Series 2051, no. 1 (2021): 012013. http://dx.doi.org/10.1088/1742-6596/2051/1/012013.

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Abstract A heat sink is an important passive heat exchanger in the thermal management of electronic devices or systems. The study aims to analyze the influence of the inlet velocity and heat flux on the thermal characteristics (i.e., static temperature and heat transfer coefficient) of three heat sink designs. Computational fluid dynamics (CFD) analysis is carried out for the electronic cooling process. Three heat sink designs, namely, circular pin fin, plate fin, and rectangular fin are considered in this study. The influence of the inlet velocity and heat flux on the temperature distribution

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Liu, Jie, Ki-Yeol Shin, and Sung Chul Kim. "Comparison and Parametric Analysis of Thermoelectric Generator System for Industrial Waste Heat Recovery with Three Types of Heat Sinks: Numerical Study." Energies 15, no. 17 (2022): 6320. http://dx.doi.org/10.3390/en15176320.

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In this study, a fluid–thermal–electrical multiphysics numerical model was developed for the thermal and electrical analyses of a heat sink-based thermoelectric generator (TEG) in a waste heat recovery system used for casting a bronze ingot mold. Moreover, the model was validated based on experimental data. Heat sinks were installed on the hot side of the TEG module to recover the waste heat from the flue gas generated in the casting process. The numerical results of the thermal and electrical characteristics of a plate fin (PF)-based TEG showed good agreement with the experimental findings. N

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Chang, Yen-Tso, Han-Ching Lin, Chi-Jui Huang, Chun-Hsien Chen, Chien-Jen Lin, and Go-Long Tsai. "Heat Transfer Analysis of Plate-fin Heat Sink with Piezoelectric Fan." Universal Journal of Mechanical Engineering 3, no. 1 (2015): 12–20. http://dx.doi.org/10.13189/ujme.2015.030103.

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Khan, W. A., J. R. Culham, and M. M. Yovanovich. "The Role of Fin Geometry in Heat Sink Performance." Journal of Electronic Packaging 128, no. 4 (2006): 324–30. http://dx.doi.org/10.1115/1.2351896.

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The following study will examine the effect on overall thermal/fluid performance associated with different fin geometries, including, rectangular plate fins as well as square, circular, and elliptical pin fins. The use of entropy generation minimization, EGM, allows the combined effect of thermal resistance and pressure drop to be assessed through the simultaneous interaction with the heat sink. A general dimensionless expression for the entropy generation rate is obtained by considering a control volume around the pin fin including base plate and applying the conservations equations for mass

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Mohd Shawal, Mohd Syahar, Mohd Rosdzimin Abdul Rahman, Mohamad Mazwan Mahat, Juri Saedon, and Mohd Suhairil Meon. "Numerical Investigation on Thermal Performance of Plate-Fin Heat Sink Designs Subjected to Parallel and Impinging Flow." JOURNAL OF APPLIED ENGINEERING DESIGN AND SIMULATION 3, no. 1 (2023): 27–39. http://dx.doi.org/10.24191/jaeds.v3i1.54.

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The electronic industry has been working for decades to improve the cooling efficiency of heat sinks by creating more advanced, efficient cooling technologies. However, heat dissipation remains the major problem in this highly competitive sector. Plate-fin heat sinks with and without fillet profiles were investigated and two new proposed designs for plate-fin heat sinks with half-round pins attached to the fin were developed in this study. Numerical analysis was performed using ANSYS FLUENT R21 to evaluate the thermal performance of the proposed designs. For the element optimization, the grid

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KAYA, Murat, and Şükrü KAYA. "Optimum fin spacing of rectangular fins on aluminum heat sinks plates." Proceedings of the Romanian Academy, Series A: Mathematics, Physics, Technical Sciences, Information Science 24, no. 2 (2023): 151–57. http://dx.doi.org/10.59277/pra-ser.a.24.2.07.

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Aluminum heat sink cooling fin which are especially used for cooling electronic circuits, are directly related to their heat transfer capability and design. In heat transfer, the most important factors are the surface area where the heat is taken, the fin length, the distance between the fins, the airflow rate, and the thermal conductivity. In this study, the effects of the width between the fins on the heat transfer were investigated. In the study, the dimensions of the rectangular finned cooling plate were 200 mm in width, 200 mm in length, 25 mm in fin height, fin spacing between 4 and 2.5

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Jeng, Tzer Ming, Sheng Chung Tzeng, and Dong Jhen Lin. "Thermal Analysis on Finned Heat Sink with Thin Porous Layers." Applied Mechanics and Materials 764-765 (May 2015): 393–97. http://dx.doi.org/10.4028/www.scientific.net/amm.764-765.393.

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This work experimentally explored the free convection heat transfer characteristics of finned heat sink with sintered-metal-beads layers. It has been proven that the metallic porous media can enhance the forced convection heat transfer efficiently. This work sintered the metal beads to adhere onto the both side surfaces of each radial plate fin of the metallic heat sink, and investigated whether the sintered-metal-beads layers promote the free convection heat transfer or not. The 0.5~0.85mm-diameetr bronze beads were employed. They were sintered smooth with the radial plate fins of the copper

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Jou, Rong Yuan. "Convective Heat Transfer Measurements of Die-Casting Heat Sinks." Key Engineering Materials 419-420 (October 2009): 345–48. http://dx.doi.org/10.4028/www.scientific.net/kem.419-420.345.

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For applications of high-power LED illumination and advanced CPU electronic cooling, since the traditional plate heat sinks by aluminum extrusion are simple geometry only and with limited thermal performance, a new design and new fabrication process of heat sink for high-density heat flux applications is inevitable. In this study, a heat sink fabricated by vacuum die-casting is analyzed. To evaluate the thermal performance of this heat sink, two experiments, free convection measurements in an enclosure and forced convection measurements in a wind tunnel, are conducted by two experimental metho

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Yogeshkumar Jain, Vijay Kurkute, Sagar Mane Deshmukh, Khizar Ahmed Pathan, Ajaj Rashid Attar, and Sher Afghan Khan. "The Influence of Plate Fin Heat Sink Orientation under Natural Convection on Thermal Performance: An Experimental and Numerical Study." Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 114, no. 2 (2024): 118–29. http://dx.doi.org/10.37934/arfmts.114.2.118129.

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Many electronic gadgets now require more power as a result of technological advancements, and to prolong their lifespan, they must all be kept thermally stable. To prevent electronic equipment from operating above their safe operating temperature, numerous techniques are used. Due to its low cost and dependable manner of cooling, the naturally cooled heat sink is the most used technology. The goal of the current research is to improve the thermal efficiency of less dense heat sinks by modifying their design and orientation. The aluminium heat sink utilized for the experimental and numerical in

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Srinivas., D., Ramamurthy S., and Ansari Juhi. "Forced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for Cooling of ICs in CPU." International Journal of Engineering and Advanced Technology (IJEAT) 9, no. 2 (2019): 251–55. https://doi.org/10.35940/ijeat.A9867.129219.

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A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations, optimization of heat sink design was done. Then correlation and Validation foe both the specimen was done and were found

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