Academic literature on the topic 'Plating baths – Analysis'
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Journal articles on the topic "Plating baths – Analysis"
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KOJIMA, Kayoko. "Analysis of copper plating baths by isotachophoresis." Journal of the Metal Finishing Society of Japan 38, no. 11 (1987): 544–48. http://dx.doi.org/10.4139/sfj1950.38.544.
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KOJIMA, Kayoko, Takao YAGI, and Nagamasa SHINOHARA. "Analysis of electroless copper plating baths by isotachophoresis." Journal of the Metal Finishing Society of Japan 37, no. 4 (1986): 195–99. http://dx.doi.org/10.4139/sfj1950.37.195.
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Tench, Dennis, and John White. "Cyclic Pulse Voltammetric Stripping Analysis of Acid Copper Plating Baths." Journal of The Electrochemical Society 132, no. 4 (1985): 831–34. http://dx.doi.org/10.1149/1.2113967.
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Shohat, Shaul, Eli Grushka, and S. Glikberg. "Liquid chromatographic analysis of organic additives in copper plating baths." Journal of Chromatography A 452 (October 1988): 503–9. http://dx.doi.org/10.1016/s0021-9673(01)81473-4.
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Li, Wen Po, Xiu Li Zuo, Jin Hu Liang, Jia Hong He, and Sheng Tao Zhang. "Effect of Acetate on Electrodeposition of Manganese from Chloride Electrolyte with SeO2 Additives." Advanced Materials Research 937 (May 2014): 193–99. http://dx.doi.org/10.4028/www.scientific.net/amr.937.193.
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This paper deals with manganese electrodeposition from an chloride electrolyte without and with acetate and the resultant deposit properties. The addition of acetate to the plating bath reduces the rate of manganese deposition abserved under cyclic voltammetry and in situ Spectroscopic ellipsometry. The addition of acetate improves the corrosion resistance of the manganese deposits. The XRD pattern obtained for electrodeposited manganese show a pure α-Mn with polycrystalline nature no matter with or without acetate. A uniform and pore free surface was observed under SEM analysis in the two plating baths.
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AZIZI, A., A. SAHARI, G. SCHMERBER, and A. DINIA. "NUCLEATION AND STRUCTURAL PROPERTIES OF NICKEL FILMS ELECTRODEPOSITED FROM, CHLORIDE AND SULFATE BATHS." International Journal of Nanoscience 07, no. 06 (2008): 345–52. http://dx.doi.org/10.1142/s0219581x08005535.
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Nickel films electrodeposited from chloride and sulfate baths at pH 3.8 have been investigated. The influence of the plating baths on the electrochemical growth and the characteristics of nickel were studied by means of cyclic voltammetry, potentiostatic steps (chronoamperometry), atomic force microscopy (AFM) and X-ray diffraction (XRD) techniques. The electrocrystallization mechanism was analyzed using the Scharifker and Hills model. The nucleation mechanism was found to be progressive at -1.1 V versus SCE, while at elevated overpotentials (more negative than -1.2 V versus SCE) instantaneous nucleation behavior was obtained. AFM characterization of the deposits indicated that the baths composition influences greatly the morphology of the deposits. XRD analysis indicated polycrystalline growth of the Ni film with a preferred (111) orientation with the fcc structure for both baths. The Ni crystallite sizes are 19–31 nm for the sulfate bath and 14–33 nm for the chloride one.
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Pavlov, Michael, Danni Lin, and Eugene Shalyt. "Efficient Non-reagent Metrology for Modern TSV Baths." International Symposium on Microelectronics 2014, no. 1 (2014): 000189–93. http://dx.doi.org/10.4071/isom-tp14.
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Through-silicon via (TSV) technology is gaining popularity in 3D packaging and 3D integrated circuits. TSV baths are formulated with highly stable electrolytes that contain copper and sulfuric acid. Other components introduced into the bath in relatively small amounts are organic additives and chloride ions. This article will focus on a non-reagent metrology to efficiently monitor these components. The chloride concentration is determined from the chloride oxidation current using specific voltammetric parameters. Similar to analysis of suppressor, the measurement is made directly in the undiluted plating bath. Results for non-reagent analysis for acid and copper were reported earlier. Electrochemistry and spectroscopy are employed in on-line monitoring of various TSV baths. The concentrations of organic additives are determined from the rate of the copper deposition. The new techniques differ from conventional CVS procedures. The advantages of these newly developed electrochemical procedures are speed (results are obtained within one minute), accuracy and reproducibility. Our new non-reagent techniques do not use special reagents for analysis and require only standard solution used for automatic system calibration and validation.
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Nguyen, Anh, Kevin Fealey, Peter Reilly, et al. "Impact of Bath Stability on Electroplated Cu for TSVs in a Controlled Environment." Journal of Microelectronics and Electronic Packaging 12, no. 1 (2015): 43–48. http://dx.doi.org/10.4071/imaps.448.
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This study addresses the impact of bath stability on electroplated copper for through-silicon via (TSV) in a controlled manufacturing environment. Microstructure, impurities, and other properties of the copper produced were characterized using an array of techniques, including electron backscatter diffraction analysis, focused ion beam–secondary electron microscope, and time of flight–secondary ion mass spectrometry. Chemical analyses of the plating baths throughout their lives indicates that the process can be controlled. Overall, a manufacturing process was demonstrated that can create high-quality, TSV Cu fill interconnects for 3-D IC over the life of the bath. The process has enabled further development work at State University of New York Polytechnic Institute for downstream processes such as chemical mechanical planarization and Cu-Cu bonding.
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Islam, M. A. "ANOMALOUS ELECTRODEPOSITION OF Fe-Ni ALLOY COATING FROM SIMPLE AND COMPLEX BATHS AND ITS MAGNETIC PROPERTY." IIUM Engineering Journal 10, no. 2 (2010): 108–22. http://dx.doi.org/10.31436/iiumej.v10i2.10.
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Electrodeposition of Fe-Ni thin films has been carried on copper substrate under various electrodeposition conditions from two simple and six complex baths. Sulfate baths composing of NiSO4. 7H2O, FeSO4.7H2O, H3BO3 and Na2SO4KEYWORDS: Anomalous Electrodeposition, Fe-Ni Coating, Complexing agent, Current Density, Magnetic Property. 1. INTRODUCTION Alloy electrodeposition technologies can extend tremendously the potential of electrochemical deposition processes to provide coatings that require unique mechanical, chemical and physical properties [1]. There has been a great research interest in the development and characterization of iron-nickel (Fe-Ni) thin films due to their operational capacity, economic interest, magnetic and other properties [2]. Due to their unique low coefficient of thermal expansion (CTE) and soft magnetic properties, Fe-Ni alloys have been used in industrial applications for over 100 years [3]. Typical examples of applications that are based on the low CTE of Fe-Ni alloys include: thermostatic bimetals, glass sealing, integrated circuit packaging, cathode ray tube, shadow masks, membranes for liquid natural gas tankers; applications based on the soft magnetic properties include: read-write heads for magnetic storage, magnetic actuators, magnetic shielding, high performance transformer cores. comprise the simple baths whereas complex baths were prepared by adding ascorbic acid, saccharin and citric acid in simple baths. The effect of bath composition, pH and applied current density on coating appearance, composition, morphology and magnetic property were studied. Wet chemical analysis technique was used to analyze the coating composition whereas SEM and VSM were used to study the deposit morphology and magnetic property respectively. Addition of complexing agents in plating baths suppressed the anomalous nature of Fe-Ni alloy electrodeposition. Coatings obtained from simple baths were characterized by coarse grained non-smooth surface with/without microcracks onto it whereas those from complex baths were fine grained with smooth surfaces. Satisfactory saturation magnetization value of 131.13 emu/g in coating was obtained from simple bath. Coatings obtained from complex baths did not show normal magnetization behavior.
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Nguyen, Anh, Kevin Fealey, Peter Reilly, et al. "Impact of Bath Stability on Electroplated Cu for Through-Silicon-Vias (TSV) in a Controlled Manufacturing Environment." International Symposium on Microelectronics 2014, no. 1 (2014): 000013–18. http://dx.doi.org/10.4071/isom-ta13.
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This study addresses the impact of bath stability on electroplated copper for through silicon via (TSV) in a controlled manufacturing environment. Microstructure, impurities and other properties of the copper produced were characterized using an array of techniques, including Electron Backscatter Diffraction Analysis (EBSD), Focused Ion Beam – Secondary Electron Microscope (FIB-SEM) and Time of Flight - Secondary Ion Mass Spectrometry (ToF-SIMS). Chemical analyses of the plating baths throughout their lives indicates that the process can be controlled. Overall, a manufacturing process was demonstrated that can create high quality TSV Cu fill interconnects for 3D IC over the life of the bath. The process has enabled further development work at State University of New York Polytechnic Institute (SUNY Poly) for downstream processes such as chemical mechanical planarization (CMP) and Cu-Cu bonding.
Dissertations / Theses on the topic "Plating baths – Analysis"
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Chuang, Chin Huo, and 莊青浩. "Properties analysis of Cr-C-Al2O3 composite deposits prepared from Cr3+-based plating baths." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/9xgjwn.
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博士<br>長庚大學<br>機械工程學系<br>104<br>In this dissertation, the hardness values of Cr-C deposits with and without a Cu substrate were studied. Experimental results showed that the hardness of as-plated Cr-C deposit on a Cu substrate increased from 650 to 1600 Hv after flame heating for 2 s, while a low hardness value of 970 Hv was detected from the Cr-C deposit without a Cu substrate. This hardness difference is attributed to the constraint effect of the Cu substrate. The constraint effect of the Cu substrate increased the internal tension stress of the Cr-C deposit on the Cu substrate during flame heating, leading to widening through-deposit cracks. The internal tension stress increased the crystallization degree of the flame-heated Cr-C deposit as well as the hardening phase of C-related membranes in the deposit. To clarify the effect of the internal tensile stress and the thickness of Cu substrate, microstructures of Cr-C deposits with and without a Cu substrate were investigated. The hardness value of flame-heated Cr-C deposit depends strongly on the crystallization degree of C-related membranes, the more crystallization degree, and the higher hardness of the deposit.
Based on the results of XRD, an amorphous structure was detected from the matrix of as-plated Cr-C-Al2O3 composite deposit. However, from the results of FE-SEM and TEM observation, the matrix of as-plated Cr-C-Al2O3 composite deposit was partial crystalline. Some crystalline Cr particles in a size from 10 to 20 nm were detected in the amorphous matrix.
The Cr-C-Al2O3 deposits were prepared from Cr3+-based electroplating baths with different sizes of Al2O3 concentrations. The hardness values of the Cr-C-Al2O3 deposits increased with increasing concentrations of Al2O3 nanoparticles in the Cr3+-based electroplating bath. The crack density and crack width in the Cr-C deposit were obviously reduced by adding Al2O3 nanoparticles to the deposit, improving its anti-corrosion property. During the electroplating, the cracks and nodular structure in the Cr-C deposits were formed due to the evolution of H2 bubbles. The widths of surface cracks of a Cr-C deposit were efficiently reduced through adding Al2O3 nanoparticles in the deposit. The agglomerated Al2O3 particles in the size of 30 nm provided more surfaces for the nucleation of hydrogen bubbles, which lead to some cavities developed in the Cr-C-Al2O3 deposit.
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"HPLC method development for the analysis of electroplating baths used in the electronic industry." 2002. http://library.cuhk.edu.hk/record=b5891271.
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Sin Wai-Chu.<br>Thesis (M.Phil.)--Chinese University of Hong Kong, 2002.<br>Includes bibliographical references.<br>Abstracts in English and Chinese.<br>ABSTRACT --- p.i<br>論文摘要 --- p.ii<br>ACKNOWLEDGEMENT --- p.iii<br>Chapter Chapter 1 --- Introduction --- p.1<br>Chapter 1.1 --- Electroplating history --- p.1<br>Chapter 1.2 --- Electroplating bath --- p.7<br>Chapter 1.3 --- Electroplating analytical methods --- p.8<br>Chapter 1.3.1 --- Metal content and elemental impurities analysis --- p.10<br>Chapter 1.3.2 --- "Metal complex, inorganic anion and cation analysis" --- p.11<br>Chapter 1.3.3 --- Organic brighteners and levelers analysis --- p.12<br>Chapter 1.4 --- HPLC literature review --- p.15<br>Chapter 1.5 --- My research work --- p.16<br>Chapter 1.6 --- References for Chapter 1 --- p.19<br>Chapter Chapter 2 --- General Experimental --- p.23<br>Chapter 2.1 --- The HPLC System --- p.23<br>Chapter 2.2 --- The factors that affect the separation --- p.26<br>Chapter 2.2.1 --- The composition of the solvent system --- p.27<br>Chapter 2.2.2 --- The selection of column --- p.30<br>Chapter 2.2.3 --- The most suitable analytical wavelength for UV detection --- p.34<br>Chapter 2.3 --- Challenges in analyzing electroplating baths solution --- p.35<br>Chapter 2.3.1 --- High metal content --- p.36<br>Chapter 2.3.2 --- Strong ligand or complexing agent --- p.36<br>Chapter 2.3.3 --- Interference --- p.37<br>Chapter 2.3.4 --- Extreme pH --- p.37<br>Chapter 2.3.5 --- Other difficulties --- p.38<br>Chapter 2.3.6 --- Maintenance of HPLC instrument --- p.38<br>Chapter 2.4 --- References for Chapter 2 --- p.38<br>Chapter Chapter 3 --- Palladure 200 bath HPLC analysis --- p.41<br>Chapter 3.1 --- Introduction --- p.41<br>Chapter 3.2 --- Experimental --- p.43<br>Chapter 3.3 --- Problems in the existing UV analysis for monitoring Palladure200 process --- p.45<br>Chapter 3.4 --- HPLC method development for monitoring Palladure 200 process --- p.49<br>Chapter 3.5 --- Analysis of aged Palladure 200 plating bath from production line --- p.55<br>Chapter 3.6 --- Conclusion --- p.57<br>Chapter 3.7 --- References for Chapter 3 --- p.58<br>Chapter Chapter 4 --- Nickel PC3 bath HPLC analysis --- p.59<br>Chapter 4.1 --- Introduction --- p.59<br>Chapter 4.2 --- Experimental --- p.60<br>Chapter 4.3 --- Problems in the existing Titration method for monitoring Nickel PC3 process --- p.62<br>Chapter 4.4 --- HPLC method development for monitoring Nickel PC3 process --- p.63<br>Chapter 4.4.1 --- Identify individual component of Nickel PC3 process --- p.63<br>Chapter 4.4.2 --- Set up a calibration curve for the Nickel PC3 Additive --- p.67<br>Chapter 4.4.3 --- Analysis of aged Nickel PC3 plating bath from production line --- p.68<br>Chapter 4.5 --- Conclusion --- p.71<br>Chapter 4.6 --- References for Chapter 4 --- p.72<br>Chapter Chapter 5 --- Solderon SC bath HPLC analysis --- p.73<br>Chapter 5.1 --- Introduction --- p.73<br>Chapter 5.2 --- Experimental --- p.74<br>Chapter 5.3 --- Instability in the existing Cyclic Voltammetric Stripping (CVS) method for monitoring Solderon SC process --- p.76<br>Chapter 5.4 --- HPLC method development for monitoring Solderon SC process --- p.77<br>Chapter 5.4.1 --- Identify the individual components --- p.77<br>Chapter 5.4.2 --- Set up a calibration curve for the Solderon SC Primary --- p.82<br>Chapter 5.4.3 --- Analysis of aged Solderon SC plating bath from production line --- p.84<br>Chapter 5.5 --- Conclusion --- p.86<br>Chapter 5.6 --- References for Chapter 5 --- p.86<br>Chapter Chapter 6 --- Copper Gleam PPR bath HPLC analysis --- p.87<br>Chapter 6.1 --- Introduction --- p.87<br>Chapter 6.2 --- Experimental --- p.89<br>Chapter 6.3 --- Problems in the existing Cyclic Voltammetric Stripping (CVS) method for monitoring Copper Gleam PPR process --- p.91<br>Chapter 6.4 --- HPLC method development for monitoring Copper Gleam PPR process --- p.92<br>Chapter 6.4.1 --- Identify Individual components and copper PPR additivein standard bath --- p.92<br>Chapter 6.4.2 --- Set up a calibration curve for the Copper Gleam PPR Additive --- p.95<br>Chapter 6.4.3 --- Analysis of aged Copper Gleam PPR plating bath from production line --- p.96<br>Chapter 6.4.5 --- Study of H202 effect --- p.101<br>Chapter 6.4.6 --- Study of air agitation effect --- p.104<br>Chapter 6.4.7 --- Study of Copper anode effect --- p.105<br>Chapter 6.5 --- Conclusion --- p.107<br>Chapter 6.6 --- References for Chapter 6 --- p.107<br>Chapter Chapter 7 --- Silverjet220 bath HPLC analysis --- p.109<br>Chapter 7.1 --- Introduction --- p.109<br>Chapter 7.2 --- Experimental --- p.110<br>Chapter 7.3 --- HPLC method development for monitoring Silverjet 220 process --- p.112<br>Chapter 7.3.1 --- Identify individual components and Silverjet 220 Additive in the plating bath --- p.112<br>Chapter 7.3.2 --- Optimize the condition for HPLC analysis --- p.117<br>Chapter 7.3.3 --- Analysis of aged Silverjet 220 plating bath from production line --- p.119<br>Chapter 7.4 --- Conclusion --- p.122<br>Chapter 7.5 --- References for Chapter 7 --- p.123<br>Chapter Chapter 8 --- Conclusions and Further Studies --- p.124<br>Chapter 8.1 --- Conclusions --- p.124<br>Chapter 8.2 --- Further Studies --- p.126<br>APPENDIX --- p.128<br>The User guide for HPLC --- p.128<br>HPLC System Calibration Maintenance --- p.135<br>HPLC System Preventive Maintenance --- p.145
Books on the topic "Plating baths – Analysis"
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Jelinek, T. W., and Dietrich Bona. Prozessbegleitende Analytik in der Galvanotechnik. Leuze, 1999.
Find full textConference papers on the topic "Plating baths – Analysis"
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Lall, Pradeep, Amrit Abrol, Nakul Kothari, Ben Leever, and Scott Miller. "Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours." In ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/ipack2019-6569.
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Abstract Traditionally, the printed circuit assemblies have been fabricated through a combination of imaging and plating based subtractive processes involving use of photo-exposure followed by baths for plating and etching to form the needed circuitry on rigid and flexible laminates. Additive electronics is finding applications for fabrication of IoT sensors. The emergence of a number of additive technologies poses an opportunity for the development of processes for manufacture of flexible substrates using mainstream additive processes, which are now commercially available. Aerosol-Jet printing has shown the capability for printing lines and spaces below 10 μm in width. The Aerosol-Jet system supports a wide variety of materials, including nanoparticle inks and screen-printing pastes, conductive polymers, insulators, adhesives, and even biological matter. The adoption of additive manufacturing for high-volume commercial fabrication requires an understanding of the print consistency, electrical and mechanical properties. Little literature exists that addresses the effect of varying sintering time and temperature on the shear strength and resistivity of the printed lines. In this study, the effect of process parameters on the resultant line-consistency, mechanical and electrical properties has been studied. Print process parameters studied include the sheath rate, mass flow rate, nozzle size, substrate temperature and chiller temperature. Properties include resistance and shear load to failure of the printed electrical line as a function of varying sintering time and varying sintering temperature. Aerosol-Jet machine has been used to print interconnects. Printed samples have been exposed to different sintering times and temperatures. The resistance and shear load to failure of the printed lines has been measured. The underlying physics of the resultant trend was then investigated using elemental analysis and SEM. The effect of line-consistency driftover prolonged runtimes has been measured for up to 10-hours of runtime. Printing process efficiency has been gauged a function of process capability index (Cpk) and process capability ratio (Cp). Printed samples were studied offline using optical Profilometry to analyze the consistency within the line width, line height, line resistance and shear load to study the variance in the electrical and mechanical properties over time.
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Newton, Beverly. "Analysis And Control Of Copper Plating Bath Additives And By-Products." In CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY: 2003 International Conference on Characterization and Metrology for ULSI Technology. AIP, 2003. http://dx.doi.org/10.1063/1.1622520.
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Brown, J. Teye, Ajay M. Popat, Chad B. O’Neal, and Yixiang Xie. "Intermetallic Effects of Electroplated Lead-Free Solder Bumps Using a Novel Single Chamber Electroplating Process for Large Diameter Wafers." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33906.
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In this study solder bumps of various alloys and less than 100 microns in diameter were electroplated using a novel single chamber electroplating process in which the plating baths are exchanged between the different metal plating layers. This equipment is new to the manufacturing arena. The reflow profile and process was then optimized for the various alloys such as SnAg, and electroplated layered SnPb, and PbSn 95/5%, with PbSn 95/5% being the control leaded solder for comparison. Various fluxes were also used during the reflow of these bumps. The solder bumps were reflowed on a conduction reflow oven in a nitrogen environment such that the temperature profile could be carefully controlled. The bumps were analyzed by examining the bump diameter and height uniformity, surface quality, and elemental composition and distribution inside the bumps. These analyses were done by visual inspection by optical microscopy, scanning electron microscopy, and electron dispersive spectroscopy (EDS). The wafers were diced near a row of solder bumps, then podded and polished using a metallographic polishing system to the center of solder bumps. These bump cross-sections were then examined by EDS to perform elemental mapping of the alloy constituents.
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Stern, Margaret, Bob Melanson, Vadim Gektin, et al. "Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33629.
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We have evaluated a new Ag-filled silicone thermal interface material (TIM) for its sensitivity to lid finish and impact on imaging discontinuities in the die/lid (TIM1) layer, in conjunction with two high performance lid materials, as a part of our advanced packaging technology development effort. Thermal and mechanical (shear stress and lid pull) measurements have been carried out on a number of different lid finishes to optimize thermal performance and adhesion at the TIM1/lid interface. This silicone TIM1 is found to be sensitive to the type of Ni-plating and plating bath chemistry. Nondestructive and destructive metrology has been carried out on flip chip (FC) packages using Ag-filled silicone TIM1 and either Cu or AlSiC lids. A number of silicone formulations have been investigated to assess their impact on surface acoustic microscopy (SAM) and X-ray imaging. Nondestructive evaluation (NDE) by real time X-ray and SAM has identified artifacts that make it difficult to unambiguously detect voids and delamination in the TIM1 layer. A “dark ring” or “picture frame” artifact is observed at the die perimeter in acoustic microscope images of packages with the Ag-filled TIM1. Detailed SEM cross-section and thermal mapping analyses on a number of specially constructed FC packages have been correlated with TIM1/lid delamination and voiding observed in SAM and X-ray images. Results of these studies point to changes in the TIM1 modulus during cure and post cure thermal excursions as the cause of the “dark ring” observed in the transmission SAM images rather than delamination at the TIM1/lid or TIM1/die interfaces. However, in the event that delamination is present at the edges it cannot be unambiguously deconvoluted from the “dark ring” artifact in the SAM images.
Reports on the topic "Plating baths – Analysis"
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Smith, R. Phosphorus-31 NMR analysis of gold plating baths. Office of Scientific and Technical Information (OSTI), 1992. http://dx.doi.org/10.2172/5740821.
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Smith, R. E. Phosphorus-31 NMR (nuclear magnetic resonance) analysis of gold plating baths. Office of Scientific and Technical Information (OSTI), 1990. http://dx.doi.org/10.2172/5098253.
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