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Journal articles on the topic 'Plating baths – Analysis'

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Published: 4 June 2021

Last updated: 4 February 2022

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KOJIMA, Kayoko. "Analysis of copper plating baths by isotachophoresis." Journal of the Metal Finishing Society of Japan 38, no. 11 (1987): 544–48. http://dx.doi.org/10.4139/sfj1950.38.544.

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KOJIMA, Kayoko, Takao YAGI, and Nagamasa SHINOHARA. "Analysis of electroless copper plating baths by isotachophoresis." Journal of the Metal Finishing Society of Japan 37, no. 4 (1986): 195–99. http://dx.doi.org/10.4139/sfj1950.37.195.

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Tench, Dennis, and John White. "Cyclic Pulse Voltammetric Stripping Analysis of Acid Copper Plating Baths." Journal of The Electrochemical Society 132, no. 4 (1985): 831–34. http://dx.doi.org/10.1149/1.2113967.

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Shohat, Shaul, Eli Grushka, and S. Glikberg. "Liquid chromatographic analysis of organic additives in copper plating baths." Journal of Chromatography A 452 (October 1988): 503–9. http://dx.doi.org/10.1016/s0021-9673(01)81473-4.

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Li, Wen Po, Xiu Li Zuo, Jin Hu Liang, Jia Hong He, and Sheng Tao Zhang. "Effect of Acetate on Electrodeposition of Manganese from Chloride Electrolyte with SeO₂ Additives." Advanced Materials Research 937 (May 2014): 193–99. http://dx.doi.org/10.4028/www.scientific.net/amr.937.193.

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This paper deals with manganese electrodeposition from an chloride electrolyte without and with acetate and the resultant deposit properties. The addition of acetate to the plating bath reduces the rate of manganese deposition abserved under cyclic voltammetry and in situ Spectroscopic ellipsometry. The addition of acetate improves the corrosion resistance of the manganese deposits. The XRD pattern obtained for electrodeposited manganese show a pure α-Mn with polycrystalline nature no matter with or without acetate. A uniform and pore free surface was observed under SEM analysis in the two plating baths.

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AZIZI, A., A. SAHARI, G. SCHMERBER, and A. DINIA. "NUCLEATION AND STRUCTURAL PROPERTIES OF NICKEL FILMS ELECTRODEPOSITED FROM, CHLORIDE AND SULFATE BATHS." International Journal of Nanoscience 07, no. 06 (2008): 345–52. http://dx.doi.org/10.1142/s0219581x08005535.

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Nickel films electrodeposited from chloride and sulfate baths at pH 3.8 have been investigated. The influence of the plating baths on the electrochemical growth and the characteristics of nickel were studied by means of cyclic voltammetry, potentiostatic steps (chronoamperometry), atomic force microscopy (AFM) and X-ray diffraction (XRD) techniques. The electrocrystallization mechanism was analyzed using the Scharifker and Hills model. The nucleation mechanism was found to be progressive at -1.1 V versus SCE, while at elevated overpotentials (more negative than -1.2 V versus SCE) instantaneous nucleation behavior was obtained. AFM characterization of the deposits indicated that the baths composition influences greatly the morphology of the deposits. XRD analysis indicated polycrystalline growth of the Ni film with a preferred (111) orientation with the fcc structure for both baths. The Ni crystallite sizes are 19–31 nm for the sulfate bath and 14–33 nm for the chloride one.

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Pavlov, Michael, Danni Lin, and Eugene Shalyt. "Efficient Non-reagent Metrology for Modern TSV Baths." International Symposium on Microelectronics 2014, no. 1 (2014): 000189–93. http://dx.doi.org/10.4071/isom-tp14.

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Through-silicon via (TSV) technology is gaining popularity in 3D packaging and 3D integrated circuits. TSV baths are formulated with highly stable electrolytes that contain copper and sulfuric acid. Other components introduced into the bath in relatively small amounts are organic additives and chloride ions. This article will focus on a non-reagent metrology to efficiently monitor these components. The chloride concentration is determined from the chloride oxidation current using specific voltammetric parameters. Similar to analysis of suppressor, the measurement is made directly in the undiluted plating bath. Results for non-reagent analysis for acid and copper were reported earlier. Electrochemistry and spectroscopy are employed in on-line monitoring of various TSV baths. The concentrations of organic additives are determined from the rate of the copper deposition. The new techniques differ from conventional CVS procedures. The advantages of these newly developed electrochemical procedures are speed (results are obtained within one minute), accuracy and reproducibility. Our new non-reagent techniques do not use special reagents for analysis and require only standard solution used for automatic system calibration and validation.

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Nguyen, Anh, Kevin Fealey, Peter Reilly, et al. "Impact of Bath Stability on Electroplated Cu for TSVs in a Controlled Environment." Journal of Microelectronics and Electronic Packaging 12, no. 1 (2015): 43–48. http://dx.doi.org/10.4071/imaps.448.

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This study addresses the impact of bath stability on electroplated copper for through-silicon via (TSV) in a controlled manufacturing environment. Microstructure, impurities, and other properties of the copper produced were characterized using an array of techniques, including electron backscatter diffraction analysis, focused ion beam–secondary electron microscope, and time of flight–secondary ion mass spectrometry. Chemical analyses of the plating baths throughout their lives indicates that the process can be controlled. Overall, a manufacturing process was demonstrated that can create high-quality, TSV Cu fill interconnects for 3-D IC over the life of the bath. The process has enabled further development work at State University of New York Polytechnic Institute for downstream processes such as chemical mechanical planarization and Cu-Cu bonding.

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Islam, M. A. "ANOMALOUS ELECTRODEPOSITION OF Fe-Ni ALLOY COATING FROM SIMPLE AND COMPLEX BATHS AND ITS MAGNETIC PROPERTY." IIUM Engineering Journal 10, no. 2 (2010): 108–22. http://dx.doi.org/10.31436/iiumej.v10i2.10.

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Electrodeposition of Fe-Ni thin films has been carried on copper substrate under various electrodeposition conditions from two simple and six complex baths. Sulfate baths composing of NiSO4. 7H2O, FeSO4.7H2O, H3BO3 and Na2SO4KEYWORDS: Anomalous Electrodeposition, Fe-Ni Coating, Complexing agent, Current Density, Magnetic Property. 1. INTRODUCTION Alloy electrodeposition technologies can extend tremendously the potential of electrochemical deposition processes to provide coatings that require unique mechanical, chemical and physical properties [1]. There has been a great research interest in the development and characterization of iron-nickel (Fe-Ni) thin films due to their operational capacity, economic interest, magnetic and other properties [2]. Due to their unique low coefficient of thermal expansion (CTE) and soft magnetic properties, Fe-Ni alloys have been used in industrial applications for over 100 years [3]. Typical examples of applications that are based on the low CTE of Fe-Ni alloys include: thermostatic bimetals, glass sealing, integrated circuit packaging, cathode ray tube, shadow masks, membranes for liquid natural gas tankers; applications based on the soft magnetic properties include: read-write heads for magnetic storage, magnetic actuators, magnetic shielding, high performance transformer cores. comprise the simple baths whereas complex baths were prepared by adding ascorbic acid, saccharin and citric acid in simple baths. The effect of bath composition, pH and applied current density on coating appearance, composition, morphology and magnetic property were studied. Wet chemical analysis technique was used to analyze the coating composition whereas SEM and VSM were used to study the deposit morphology and magnetic property respectively. Addition of complexing agents in plating baths suppressed the anomalous nature of Fe-Ni alloy electrodeposition. Coatings obtained from simple baths were characterized by coarse grained non-smooth surface with/without microcracks onto it whereas those from complex baths were fine grained with smooth surfaces. Satisfactory saturation magnetization value of 131.13 emu/g in coating was obtained from simple bath. Coatings obtained from complex baths did not show normal magnetization behavior.

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Nguyen, Anh, Kevin Fealey, Peter Reilly, et al. "Impact of Bath Stability on Electroplated Cu for Through-Silicon-Vias (TSV) in a Controlled Manufacturing Environment." International Symposium on Microelectronics 2014, no. 1 (2014): 000013–18. http://dx.doi.org/10.4071/isom-ta13.

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This study addresses the impact of bath stability on electroplated copper for through silicon via (TSV) in a controlled manufacturing environment. Microstructure, impurities and other properties of the copper produced were characterized using an array of techniques, including Electron Backscatter Diffraction Analysis (EBSD), Focused Ion Beam – Secondary Electron Microscope (FIB-SEM) and Time of Flight - Secondary Ion Mass Spectrometry (ToF-SIMS). Chemical analyses of the plating baths throughout their lives indicates that the process can be controlled. Overall, a manufacturing process was demonstrated that can create high quality TSV Cu fill interconnects for 3D IC over the life of the bath. The process has enabled further development work at State University of New York Polytechnic Institute (SUNY Poly) for downstream processes such as chemical mechanical planarization (CMP) and Cu-Cu bonding.

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Choe, Seunghoe, Myung Jun Kim, Kwang Hwan Kim, et al. "Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths." Journal of The Electrochemical Society 162, no. 4 (2015): H294—H300. http://dx.doi.org/10.1149/2.0051506jes.

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Pavlov, Michael, Danni Lin, Eugene Shalyt, Isaak Tsimberg, and Zhi Liu. "Electrochemical Express Analysis of Organic Additives in Lead-Free Wafer Level Packaging Plating Baths." ECS Meeting Abstracts MA2020-01, no. 18 (2020): 1153. http://dx.doi.org/10.1149/ma2020-01181153mtgabs.

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Schroeder, Norbert, Fred Richter, Juerg Stahl, and Arnold Cziurlok. "A fully automated execution of complex DOE to characterize electroplating baths." International Symposium on Microelectronics 2013, no. 1 (2013): 000667–71. http://dx.doi.org/10.4071/isom-2013-wp26.

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A new tool has been invented that enables a fast and efficient execution of design of experiments (DOE) for the characterization of electroplating chemistries. This new procedure uses a commercially available analysis system (tool). It is fully automated and systematically handles up to four different additives in conjunction with basic electrolytes to evaluate the impact of these on the electrochemical behavior of the plating bath.

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Huang, Ying, and Mikiya Tanaka. "Analysis of continuous solvent extraction of nickel from spent electroless nickel plating baths by a mixer-settler." Journal of Hazardous Materials 164, no. 2-3 (2009): 1228–35. http://dx.doi.org/10.1016/j.jhazmat.2008.09.033.

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Whitman, David A., Gary D. Christian, and Jaromir Růžička. "Spectrophotometric determination of nickel(II), iron(II), boric acid and chloride in plating baths by flow injection analysis." Analyst 113, no. 12 (1988): 1821–26. http://dx.doi.org/10.1039/an9881301821.

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Murase, Kuniaki, Hisanori Ando, Eiichiro Matsubara, Tetsuji Hirato, and Yasuhiro Awakura. "Determination of Mo(VI) Species and Composition in Ni-Mo Alloy Plating Baths by Raman Spectra Factor Analysis." Journal of The Electrochemical Society 147, no. 6 (2000): 2210. http://dx.doi.org/10.1149/1.1393509.

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Uekawa, Eiji, Kuniaki Murase, Eiichiro Matsubara, Tetsuji Hirato, and Yasuhiro Awakura. "Determination of Chemical Species and Their Composition in Ni‐Mo Alloy Plating Baths by Factor Analysis of Visible Absorption Spectra." Journal of The Electrochemical Society 145, no. 2 (1998): 523–28. http://dx.doi.org/10.1149/1.1838297.

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Lewis, Brian J., Daniel F. Baldwin, Paul N. Houston, Le hang La, and Tim Spark. "Processing, Bumping and Assembly of Single Chip Plated Ni/Pd over ALCAP Bond Pads for Flip Chip Applications and Prototyping." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 001841–69. http://dx.doi.org/10.4071/2012dpc-wp23.

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For Designer and Engineers, it is common during the process development cycle for new products to have limitations on the materials that are available for the prototype work. Most SMT devices are readily available in different formats/solder alloys to satisfy most of the needs for passive needs. However, many times IC devices are limited to what is available from the fab or an IC broker. These limitations can mean that die only come in aluminum, wirebond ready I/O metallization or that the silicon wafers already sawn and in single die formats. For applications where advancement in performance or miniaturization is needed, and the benefits of flip chip technology are attractive, then it is not trivial to be able to use these die. In these cases, the process of adding solderable plating technologies to the I/O bond pads is very favorable. The technologies are currently run for wafer lever plating baths, but very little has been done to evaluate single chip plating. Work in plating Ni/Pd onto the ALCAP structure has been performed to evaluate the process and feasibility of processing groups of singulated die with aluminum bond pads. The work to be detailed in this paper will go through the chemistries used in the plating process onto an aluminum bond pad that makes it suitable for flip chip processes. Several bumping structures, such as solder bumping over this plating technology and plating over gold or copper stud bumps, are evaluated. A process for bumping the flip chips is also detailed. The data for shear testing of the 10 variations before and after 500 liquid thermal shock cycles is detailed. Finally, a comprehensive study for assembly of solder bumped flip chips, with the selective plating process, will be detailed as well as a detailed analysis of the TC reliability of this assembly approach. It will be shown that selective Ni/Pd plating onto single, ALCAP bare die can allow for these typical wirebond die can be used in a practical approach solder flip chip process and provide reasonable reliability results when compared to a mainstream, wafer processed, solder bumped flip chip die.

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Arvin, Charles L., Jurg Stahl, Wolfgang Sauter, et al. "Optimization of Lead Free Plating for Flip Chip Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (2014): 001553–602. http://dx.doi.org/10.4071/2014dpc-wp21.

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Traditional flip chip processes have consolidated to a SnAgCu (SAC) solder system. Each company based upon their own needs and application space has come to their own method to achieve the desired final composition of the interconnect. These have included different solder compositions for both the pre-solder and the C4. The various interconnect solutions can range from no solder on one side such as pure Cu or Ni to an interconnect that has identical solder composition for both the substrate and the C4. Decisions for the optimized solution include the need for reliability, cost and yield. Picking the right solution also enables the elimination of defects such as solder voids, interfacial voids, white bumps, micro-solder bumps and non-wets. The optimized solutions are dependent upon many factors that include the fragility of the silicon dielectric, the size of the die, type of flux used at assembly, the assembly process used, method by which SnAg is plated such as various layering techniques, final processes steps in C4, test probe concepts, DSP methods and many more. In order to pick the appropriate scheme for each product and for each industry, it is imperative to know the interaction of all of these factors. This paper provides concepts and data about how to optimize assembly and lead free plating for a particular process. In the plating process, this includes the importance of various layering steps and analysis of incoming chemicals, especially the acids, and in the assembly process, the knowledge and matching of solder hierarchy, warpage, flux characteristics and preparation / cleaning steps prior to underfill. In particular, we will provide the data and the scheme by which it is possible to produce void free solder processes without bleed and feed on SnAg baths that are over 100 amp-hr per liter and over 1 year old.

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YOSHIMURA, Chozo, and Takayosi HUZINO. "Simultanious determination of chromium (III), (VI) by differential atomic absorption spectrometry with the reductant and its application to the analysis of chromium plating baths." Journal of the Surface Finishing Society of Japan 41, no. 3 (1990): 318–22. http://dx.doi.org/10.4139/sfj.41.318.

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Abou-Krisha, Mortaga, Fawzi Assaf, Omar Alduaij, Abdulrahman G. Alshammari, and Fatma El-Sheref. "Electrochemical behavior and corrosion resistance of electrodeposited nano-particles Zn-Co-Fe alloy." Anti-Corrosion Methods and Materials 63, no. 1 (2015): 29–35. http://dx.doi.org/10.1108/acmm-04-2014-1378.

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Purpose – The purpose of this study was to compare the electrodeposition behavior and corrosion resistance of ternary and binary alloys. Design/methodology/approach – Potentiodynamic polarization resistance measurement and anodic linear sweep voltammetry techniques were used for the corrosion study. The surface morphology and chemical composition of the deposits were examined using scanning electron microscopy and atomic absorption spectroscopy, respectively. The phase structure was characterized by X-ray diffraction analysis. Electrodeposition behavior was carried out using cyclic voltammetry and galvanostatic techniques. Findings – It was found that the obtained ternary alloy exhibited better corrosion resistance and a more-preferred surface appearance compared to the binary alloys that were electrodeposited under similar conditions. Research limitations/implications – The ternary alloy showed better anticorrosion properties compared to binary deposits that were electroplated successfully from the plating baths. The Zn-Co-Fe alloy could be used advantageously in industry because the ternary alloy exhibits the collective properties of the binary alloys in one alloy via the electrodeposition of Zn-Ni-Co alloy. Social implications – Increasing the corrosion resistance implies to social economic increases. Originality/value – To date, the electrodeposition of Zn-Co-Fe alloy was studied in only a small number of articles. It was found that the presence of Co or Fe could provide a useful coating on the steel that would reduce its susceptibility to corrosion attack.

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Kim, K. H., and Jin Yu. "Electroless Ni plating solutions for reproducible black pad analyses." International Symposium on Microelectronics 2013, no. 1 (2013): 000397–401. http://dx.doi.org/10.4071/isom-2013-tp62.

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A large-scale black pad of electroless nickel (EN) plated films were reproduced using pure chemicals: NiCl2·6H2O as the Ni source, NaH2PO2·H2O as the reducing agent, CH3COONa·3H2O and aminoacetate as the complexing agent and the buffer, respectively, and thiourea as the stabilizer. Plating baths with varying constituent compositions were investigated, and chemical compositions most suitable to the black pad study were sought. Cross-sectional scanning electron microscopy (SEM) and transmission electron microscopy (TEM) analyses showed that the nickel-phosphorus (Ni-P) film made out of the #5 bath best demonstrated the typical characteristics of the black pad phenomenon after the immersion gold (IG) process. Additions of a low level of Thiourea (0.6mg/L), slightly larger amounts of glycine (1∼1.25x) and the complexing agent (1.25x) were suggested from the standpoint of the black pad formation of Ni-P films.

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Wanotayan, Thanyalux, Pongsakorn Kantichaimongkol, Viriyah Chobaomsup, et al. "Effects of Chemical Compositions on Plating Characteristics of Alkaline Non-Cyanide Electrogalvanized Coatings." Nanomaterials 10, no. 11 (2020): 2101. http://dx.doi.org/10.3390/nano10112101.

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The effects of zinc and sodium hydroxide concentrations in an alkaline non-cyanide zinc bath on the electrodeposition characteristics of zinc deposits are systematically investigated. Using microstructural and phase analyses of specimens with specifically designed geometries, the study indicates that the bath formulations critically control the electrogalvanizing characteristics and affect the coating surface morphology, deposition rate, throwing power, coating uniformity, and residual stresses developed during and after electrogalvanizing. The coatings produced from baths with a moderate Zn-to-NaOH ratio of 0.067–0.092 appear to provide uniform and compact deposits, moderately high deposition rate, and relatively low residual stresses.

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MEHRIZI, SAEED, M. HYDARZADEH SOHI, and S. A. SEYYED EBRAHIMI. "MICROSTRUCTURAL EVALUATION OF NANOCRYSTALLINE COBALT-IRON-NICKEL THIN FILMS ELECTRODEPOSITED FROM CITRATE-FREE AND CITRATE-ADDED BATHS." International Journal of Modern Physics: Conference Series 05 (January 2012): 712–19. http://dx.doi.org/10.1142/s2010194512002668.

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The microstructures of nanocrystalline CoFeNi thin films in direct current electrodeposition, under various processing conditions, have comparatively been investigated. Morphological studies by SEM showed that CoFeNi films plated from the sodium citrate-added baths were more uniform and denser than those deposited from the conventional citrate-free baths. Energy dispersive spectroscopy (EDS) showed the anomalous behaviors in electrodeposition of CoFeNi films from both citrate-added and citrate-free baths. It was also noticed that addition of 10g/L sodium citrate in the bath strongly decreases the iron content and increases nickel contents of the deposit. Addition of citrate up to 50g/L in the bath has reverse effect on the film composition. Further addition of sodium citrate appears to have no or little effect on the film composition. Addition of sodium citrate to the bath has no significant affect on the cobalt content of the deposit. XRD analyses showed that all CoFeNi films were nanocrystalline and their average grain sizes, estimated by Scherrer formula, were below 80nm. It was also noticed that FCC and BCC phases could be co-deposited in electroplated CoFeNi films by controlling the bath composition and/or the plating conditions.

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Vilarinho, Cândida, Fernando Castro, Filipa Carneiro, and André Ribeiro. "Development of a Process for Copper Recovering from Galvanic Sludges." Materials Science Forum 730-732 (November 2012): 575–80. http://dx.doi.org/10.4028/www.scientific.net/msf.730-732.575.

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Galvanic coating processes are based on metal plating baths and are responsible for the production of large amounts of wastewaters. Subsequent physical-chemical treatment of the wastewaters generates solid wastes called galvanic sludges. These sludges have a hazardous character and are often disposed, mainly on landfills, without any economical or environmental benefits. The development of alternatives and viable ways to reduce the environmental impact and recover the valuable metals contained in those sludges such as copper, chromium, nickel or zinc, which content might reach 30% (wt.%, dry weight) are of utmost importance. The present work has been developed in the aim of the project VALMETAIS and proposes a hydrometallurgical process for copper recovery from galvanic sludges produced by Ni/Cr plating plants. This procedure has been developed on laboratory scale and is based on leaching of sludges in sulphuric acid solution followed by copper cementation step, using iron scrap as a precipitating agent. The sludge has been characterized for its chemical and physical properties. Chemical analysis showed a copper concentration of more than 10% (dry base). Preliminary leaching tests in both sulphuric acid and ammoniacal media were performed in order to determine the best operating conditions for this step of the process and to assure the best metal recovery conditions in subsequent separation methods. Sulphuric acid yielded much higher metal ion dissolution when compared with ammoniacal leaching. Optimal experimental leaching parameters were defined as follows: sulphuric acid solution 100 g/l, a solid to liquid ratio of 1:10, stirring speed of 400 rpm at room temperature and under atmospheric pressure. It was found that metals dissolution was almost complete in 30 minutes of reaction time. Extraction rates of 99% for Cu and Ni were obtained under the leaching conditions above mentioned. The solid residue separated from the leaching solution is mostly constituted by gypsum (CaSO4), and presents a metal content below 1%. The subsequent extraction of cooper from the obtained solution is achieved by a cementation step with iron scrap. Copper precipitation was performed at a pH of 2 which was achieved through adding new sludge to the filtered leaching solution. Such pH level led to insignificant precipitation of other metals present in the leaching solution, namely chromium. The recovery rate of copper is about 90% and the purity grade of the resulting copper cement enables its application as a commercial product.

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KOJIMA, Kayoko, and Takao YAGI. "Analysis of electroless nickel plating bath by isotachophoresis." Journal of the Metal Finishing Society of Japan 36, no. 3 (1985): 104–9. http://dx.doi.org/10.4139/sfj1950.36.104.

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SATO, Yasuhiro. "Analysis Methods of Plating Bath by Capillary Electrophoresis." Journal of the Surface Finishing Society of Japan 67, no. 11 (2016): 589–93. http://dx.doi.org/10.4139/sfj.67.589.

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Kojima, Kayoko. "Analysis of plating bath for fiber by isotachophoresis." Sen'i Gakkaishi 45, no. 6 (1989): 265–71. http://dx.doi.org/10.2115/fiber.45.6_265.

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Tan, Yong. "Additives-Effects during Environmental Protection Methyl Sulfonic Acid Salt Bath of the Performance." Applied Mechanics and Materials 730 (January 2015): 178–82. http://dx.doi.org/10.4028/www.scientific.net/amm.730.178.

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Methyl sulfonate tin plating bath is a kind of high production efficiency,good environmental performance and excellent performance of the new type of tin plating bath.Research by electrochemical technology analysis an influence on electrochemical performance of the tin plating bath by adding methyl sulfonate in bath.The results show that it significantly improve the polarization properties of the bath after adding additives and the deposition potential of tin ion. The result is that polarization properties of bath perform the best when additive A is added to25mL/L,That the throwing power of the bath is 98 % and the cover ing power is 100 %.

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Nguyen, Vinh. "Control of Tin Silver Electroplating Bath." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–35. http://dx.doi.org/10.4071/2017dpc-wp2_presentation6.

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Tin Silver alloy (Lead-free) is currently the material of choice for bumping in WLP technology. The deposition of this material is accomplished with a selective electroplating method. The SnAg plating solution consists of several key components such as Ag, Sn, Acid and Organic additives. The concentrations of each of these components must be carefully controlled because an out of spec concentration will affect the plating deposition rate, uniformity, shape and/or void occurrence within the solder bumps. This paper describes the method of analyses for each of the plating components in the SnAg plating solution and their effects on the bumps when they are out of the specified control limits. The data obtained for actual electroplating process will be shown.

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URAZ, Canan. "Effect of Room Temperature Ionic Liquids for Electroless Nickel Plating on Acrylonitrile Butadiene Styrene Plastic." Materials Science 25, no. 3 (2019): 276–80. http://dx.doi.org/10.5755/j01.ms.25.3.20116.

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In this study, electroless nickel (EN) plating on acrylonitrile butadiene styrene (ABS) engineering plastic using room temperature ionic liquids (RTIL) was studied. Electroless plating is a fundamental step in metal plating on plastic. This step makes the plastic conductive and makes it possible to a homogeneous and hard plating without using any hazardous and unfriendly chemical such as palladium, tin, etc. In the industry there are many distinct chemical materials both catalysts and activation solutions for the electroless bath which is one of the most important parts of the process. In this study the effects of the ionic liquid, plating time, and sand paper size were investigated on electroless nickel plating. The etching and the plating processes were performed with environmentally friendly chemicals instead of the chromic and sulphuric acids used in the traditional processes. Experiments were carried out with and without ionic liquid, EMIC, 1-ethyl-3-methyl imidazolium chloride (C6H11N2Cl), and with 400, 500 and 800 grit sandpaper with the application of the sand attrition process and 70, 80, and 90 °C bath temperatures with 30, 60, and 90 minutes of deposition time. The surface morphology and the thickness of deposit analysis were performed using the Fischer scope X-Ray XDL-B System, X-ray Diffraction (XRD), and Scanning Electron Microscopy (SEM). Due to the results of the experiments and analysis, the electroless nickel plating on ABS plastic was a success. The best plating was obtained at 5.010 μm as the maximum plating thickness, at 90 min of plating time and 80 °C as the plating bath temperature for electroless nickel plating on ABS plastic whit the surface activated with 800 grit sandpaper using EMIC ionic liquid. DOI: http://dx.doi.org/10.5755/j01.ms.25.3.20116

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Lee, T. Y. T., and Jong-Kai Lin. "Design analysis of an electroless plating bath using CFD technique." IEEE Transactions on Electronics Packaging Manufacturing 23, no. 4 (2000): 237. http://dx.doi.org/10.1109/tepm.2000.895061.

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Tien-Yu Tom Lee and Jong-Kai Lin. "Design analysis of an electroless plating bath using CFD technique." IEEE Transactions on Electronics Packaging Manufacturing 23, no. 4 (2000): 306–13. http://dx.doi.org/10.1109/6104.895076.

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He, Xiang Zhu, Xin Li Zhou, and Xiao Wei Zhang. "Effect of Ni²⁺ on Chromium Electrodeposition in Cr(III) Plating Bath." Advanced Materials Research 150-151 (October 2010): 1555–59. http://dx.doi.org/10.4028/www.scientific.net/amr.150-151.1555.

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A small amount of nickel ions is added to trivalent chromium chloride plating bath to study effect of Ni ions on trivalent chromium electrodeposition. The obtained Cr-Ni alloy coatings and Cr coatings are characterized by means of EDS and SEM. Cathodic polarization curves of trivalent chromium chloride plating bath show that right amount of Ni ions contained in bath make the LSV more positive, exerting a catalytic effect on electrodeposition of Cr ( ) ions. EDS results of the obtained coatings also demonstrate the catalytic effect of Ni ions on trivalent chromium electrodeposition. Analysis of SEM indicate that the surface morphology of coatings obtained from Cr( ) bath containing 0.03g/L Ni2+ bath are similar to the ones obtained from pure Cr( ) ions bath.

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Pavlov, Michael, Danni Lin, and Eugene Shalyt. "Electrochemical Analysis of Aged Copper Plating Bath in Wafer Level Packaging (Part 1)." International Symposium on Microelectronics 2017, no. 1 (2017): 000513–16. http://dx.doi.org/10.4071/isom-2017-tha16_067.

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Abstract Copper electroplating processes are widely used in semiconductor manufacturing, particularly during the packaging stage [1]. Copper deposition is used to build various structures including TSV, RDL, Pillars, and Micro and Mega Bumps. Those processes utilize plating solutions that contain inorganic components and organic additives [2]. During the electroplating process, the additives can partially transform into compounds that are so-called breakdown products. The presence of such breakdown products can interfere with the electrochemical analysis of organic additives. This article presents results of plating tests that show the influence of freshly produced breakdown products on analysis of organic additives. In addition, several options to eliminate this effect are presented.

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YOON, JEONG-WON, HYUN-SUK CHUN, HAN-BYUL KANG, et al. "MORPHOLOGY, THERMAL STABILITY, AND SOLDERABILITY OF ELECTROLESS NICKEL–PHOSPHORUS PLATING LAYER." Surface Review and Letters 14, no. 04 (2007): 827–32. http://dx.doi.org/10.1142/s0218625x07010111.

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We studied the growth kinetics and characteristics of electroless nickel–phosphorus (EN–P) deposition layer on Cu substrate in an acid plating bath with sodium hypophosphite as the reducing agent. The individual nodules of the EN–P layer increased in size but decreased in number with increasing plating time and pH, i.e. the root-mean-square (RMS) roughness of the EN deposit decreased. In addition, the plating rate of the EN layer increased with increasing plating bath pH. X-ray diffraction (XRD) analyses revealed that the as-plated deposit was in an amorphous phase, while the heat-treated layer was composed of crystallized Ni and Ni 3 P compound. The solderability of the EN layer increased with decreasing P content. In addition, the wetting force increased with increasing surface roughness. The present study clearly showed that the solderability behavior of the EN layer is affected by both surface composition ( P content) and morphology.

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Benea, Lidia, Iulian Bounegru, and Alexandru Chiriac. "Characterization and Corrosion-Resistance Performance of Hybrid Co/UHMWPE Composite Biocoatings." Advanced Materials Research 1139 (July 2016): 69–73. http://dx.doi.org/10.4028/www.scientific.net/amr.1139.69.

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Novel hybrid Co/UHMWPE biocoatings were obtained by electrochemical deposition of cobalt from a cobalt sulfate plating bath with ultra high molecular weight polyethylene (UHMWPE - particle size of 10 μm) as dispersed particles in order to provide possible biomedical coatings applications. The surface morphology and topography, roughness and chemical composition were investigated, as a function of UHMWPE particles concentration in the plating bath by scanning electron microscopy (SEM), atomic force microscopy (AFM) and energy dispersive X-ray analysis (EDX). Electrochemical corrosion resistance investigations were carried out in simulating body fluid solution (SBF), using electrochemical impedance spectroscopy (EIS) method at different exposure times. The results proved a good corrosion resistance of the obtained hybrid Co/UHMWPE coatings.

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Wang, Xi Ran, Xin Gang Hu, and Wei Yuan Li. "Effect of Bath Compositions on the Properties of Electroless Ni-Cu-P Alloys on Aluminum." Applied Mechanics and Materials 117-119 (October 2011): 1276–79. http://dx.doi.org/10.4028/www.scientific.net/amm.117-119.1276.

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In this work, the electroless plating Ni-Cu-P on aluminium is obtained successfully by direct Ni-Cu-P plating method. The effect of bath compositions on the electroless plating rate and the properties of the electroless Ni-Cu-P deposits was studied by orthogonal test. The corrosion resistance, hardness, surface morphology and components of the coating were studied by using electrochemical workstation, digital micro-hardness SEM and EDS. The optimum bath formula obtained is 0.6g/L copper sulfate, 30g/L nickel sulfate, 35g/L sodium citrate, 25 g/L sodium hypophosphite, 20g/L acetic anhydride and right amount of self-made additive. The deposition rate, hardness and corrosion resistance are all good. The adhesion between the deposits and the matrix is better. The deposits is smooth and uniformity, smooth by SEM. The deposit contains Ni 78.90%, Cu 8.65%, P 12.46% by the analyses of energy disperse X-ray.

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Yoon, Young, Yu Seok Ham, Tae Young Kim, Seunghoe Choe, and Jae Jeong Kim. "Cyclic Voltammetry Stripping Analysis to Determine Iodide Ion Concentration in Cu Plating Bath." Journal of The Electrochemical Society 165, no. 5 (2018): H213—H218. http://dx.doi.org/10.1149/2.0471805jes.

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Resali, Nor Azrina, Koay Mei Hyie, Wan Normimi Roslini Abdullah, M. A. A. Ghani, and A. Kalam. "The Effect of Bath Ph on the Phase Formation of Ternary Co-Ni-Fe Nano-Coatings." Applied Mechanics and Materials 391 (September 2013): 9–13. http://dx.doi.org/10.4028/www.scientific.net/amm.391.9.

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This study describes how the control of bath pH allows different types of phase formation in the ternary Co-Ni-Fe nanocoating. The acidity of the plating bath has been known as a main factor to the properties of coatings. The Co-Ni-Fe coating was fabricated using a commercial electrodepostion process. Several pH solutions (3, 7 and 9) were employed to determine the optimum condition for Co-Ni-Fe synthesis. The bath pH was varied by using sodium hydroxide (NaOH) and sulphuric acid (H2SO4). Other parameters such as temperature, electrolyte composition, deposition time and current density were kept constant. The experiment was performed at 50°C. This temperature is commonly used in the industrial plating process. XRD analysis indicated the presence of both phases: body centred cubic (BCC) and face centred cubic (FCC) dependent on the pH value. Co-Ni-Fe nanocoatings obtained from the electrolyte of low pH showed the fine-grain morphology. The hardness of the Co-Ni-Fe nanocoatings was closely related to the obtained morphology.

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Xiao, Fa Xin, Xiao Ni Shen, Jing Pei Xie, Di Xin Yang, Feng Zhang Ren, and Ai Qin Wang. "Electroless Deposition of Nickel on the Surface of Silicon Carbide Crucible from Alkaline Bath." Advanced Materials Research 399-401 (November 2011): 2049–54. http://dx.doi.org/10.4028/www.scientific.net/amr.399-401.2049.

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This work aims to eliminate contamination of the surface of crucible with silicon carbide during fusion preparation sample of the X-ray fluorescence analysis used in relation to electroless Ni–P plating process on the surface of SiC crucible in the alkaline bath. The structure, morphology and component of the coated layers were clarified by means of XRD, SEM and EDAX. Also, the electrochemical measurements was carried out to characterize the reduction mechanism of Ni deposition. The bath compositions were nickel sulfate 20 g/L, sodium hypophosphite 30 g/L, sodium citrate 10 g/L，ammonium chloride 20 g/L, containing a mixed additives of thiourea, sodium lauryl sulfate and coumarin. The thickness of coating was 3.47 μm after plating for 15 min from this bath at 318 K. The coating is relatively dense and smooth and has a nodular surface morphology. The uniform Ni–P film is a mixture of microcrystalline of Ni5P4 and crystalline phases of Ni in the alkaline bath, with the components of 4.74%P and 95.26%Ni. The nickel deposition reaction occurs at -1.07 V appropriately with the peak current density of 32 mA/cm2 and the electrochemical deposition of nickel is mainly controlled by the electrochemical process.

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Ritzdorf, Tom, Sam Lee, and Ian Drucker. "Material Analysis of Lead Free Solder Deposited by Electrochemical Deposition." International Symposium on Microelectronics 2012, no. 1 (2012): 000136–42. http://dx.doi.org/10.4071/isom-2012-ta45.

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Lead-free solders have essentially replaced lead-tin solders for new microelectronic applications. At the same time, many products are continuing to go through miniaturization, so the behavior of the solder material is changing as a function of the connection size. As lead-tin solder has been replaced by lead-free alloys, electrodeposited SnAg has become the standard solder alloy used on wafers. Tin-based solders exhibit a complex material structure in the deposit, as recrystallization occurs in the deposit, and as intermetallic compounds form. Understanding the complex nature of these materials is becoming increasingly important to the performance of our electronic products. We have characterized ECD SnAg solder alloy deposits in terms of composition, grain size, phase, microstructure, and texture using EBSD analysis. We will discuss the effects of modifying the process parameters on the microstructure which could implications on the performance of the solder bump as a chip-level interconnect. We have seen that the metals deposit as β-tin with finely dispersed intermetallic grains. We have also seen evidence of recrystallization of the deposit subsequent to deposition, although the recrystallization behaviour is significantly different than the well-characterized copper recrystallization. Finally, the metal at the interface below the solder reacts with Sn to form intermetallic compounds, the compositions of which are dependent on the materials present. The effects of the process parameters on the deposit properties are becoming increasingly important to understand in order to control the properties of the interconnection, and how it changes over its lifetime. We have characterized the incorporation of trace organic materials in the deposit as a function of plating parameters. The deposition of SnAg from an MSA-based plating bath is very different from the deposition of copper from a copper sulfate plating bath. We have noticed that the incorporation of organic additive materials, as well as the grain size, increases as the deposition rate is increased in the deposition of SnAg.

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Allahkaram, Saeed Reza, N. Towhid, and M. Siadat Cheraghi. "Effects of Direct Current and Pulse Electrodeposition Parameters on the Properties of Nano Cobalt Coatings." Key Engineering Materials 471-472 (February 2011): 1010–15. http://dx.doi.org/10.4028/www.scientific.net/kem.471-472.1010.

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The aim of this study was to investigate the effects of direct current (DC) and pulse current (PC) parameters on the properties of cobalt (Co) coatings electrodeposited from a chloride acidic bath. The effects of peak current density, frequency and duty cycle on the surface morphology, crystal size, thickness, current efficiency, and preferred orientation of the deposits were investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The experimental thickness of the deposit was lower for pulse plating compared to that of DC plating. The current efficiency was comparatively higher for pulse plating. Less porosity and fine grains were formed by pulse plating. From XRD analysis, the calculated grain sizes of nano and micro Co coatings were around 65nm and 430nm, respectively. The results showed that, with an increase in duty cycle, grain sizes would increase, too. As pulse frequency was increased to 50Hz, grain sizes would also decrease. However, at higher frequencies, grain sizes would increase again.

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Ge, Pei Qi, Yu Fei Gao, Shao Jie Li, and Zhi Jian Hou. "Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis." Key Engineering Materials 416 (September 2009): 311–15. http://dx.doi.org/10.4028/www.scientific.net/kem.416.311.

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Development of high performance diamond impregnated wire is the key of application for fixed-abrasive wire sawing technology. In this paper, some experimental studies were done for development of electroplated diamond wire saw by employing the bright nickel bath. The wire saw electroplating process was developed, the effects of cathode current density and time at tack-on stage on diamond grits density and adhesion between saw matrix and plating coating were discussed. The wire saw cutting experiments were carried out for analysis the used wire wear using the scanning electron microscope (SEM). The experimental results show the optimum tack-on current density to obtain the wire saw with good abrasive distribution and adhesion is 1.5~2.0A/dm2, and the time of pre-plating, tack-on and buildup is 6, 8~10 and 18min in turn. Diamond wire saw wear includes coating wear and grain-abrasion, and the primary wear form is grits pulled-out.

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Hou, Kung Hsu, Yun Feng Chang, and Ming Der Ger. "Corrosion Resistance of Pulse-Electroplated Ni-W Alloys." Solid State Phenomena 185 (February 2012): 15–17. http://dx.doi.org/10.4028/www.scientific.net/ssp.185.15.

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Nickel-tungsten (Ni-W) plating process exhibited fewer environmental hazards and lower health hazards than conventional chromium bath processes did, because they had the potential to be substituted for certain future applications. This study attempted to develop Ni-W alloy coatings with different weight percentages of tungsten to produce by using nickel-tungsten citrate electrolyte baths that are deposited by pulse current power source techniques. The composition of the ratio of tungsten/nickel was controlled by the change from ion mass transfer rates for the interface between cathodes and electrolytes that were caused by adjustment by charging the over potential or rest that was regulated by the on-off time during pulse and reverse-pulse current. In this study, the corrosion resistance and the composition of the coatings related to the operating parameters were also discussed through the analyses of the experimental design method. Results were found that Ni-W alloy compositions governed through regulation of pulse and pulse-reverse parameters. The frequencies of electric current, Ton and Toff with pulse duty cycles had great impact on chemical composition and surface morphology for the deposits. Results of the electrochemical tests indicated the pulse plated Ni-W metal alloy coatings in which the corrosion resistance was superior to that of the alloy deposited by the direct current technique.

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Sauli, Zaliman, Vithyacharan Retnasamy, Fairul Afzal Ahmad Fuad, Phaklen Ehkan, and Steven Taniselass. "Bump Height at Low Temperature Analysis." Applied Mechanics and Materials 404 (September 2013): 77–81. http://dx.doi.org/10.4028/www.scientific.net/amm.404.77.

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The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold process time and the bump height. A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 70 °C. Electroless nickel time has more influence to the bump height compared to immersion gold time.

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Mohd Amin, Nurfatin Liyana, Muhamad Khairudin Rahim, Nor Akmal Fadil, and Astuty Amrin. "The Effect of Temperature on Nickel Deposited as an Underlayer Between Copper Filler and Silicon Wafer." Journal of Computational and Theoretical Nanoscience 17, no. 2 (2020): 1271–74. http://dx.doi.org/10.1166/jctn.2020.8800.

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Through silicon via (TSV) has garnered a lot of interest in the semiconductor industry due to its ability to provide the shortest interconnect path. The coefficient of thermal expansion (CTE) mismatch between the copper (Cu) interconnection filler and the silicon (Si) wafer result in reliability issues of the TSV system. This research proposed the introduction of an underlayer between the Cu filler and Si wafer in order to reduce the CTE mismatch in the TSV. The chosen underlayer is nickel (Ni) as it has a CTE value placed in between Cu and Si at 13 ppm/°C (Cu = 17 ppm/°C, Si = 2.8 ppm/°C). The Ni layer was deposited using the electroless deposition process at different temperature of plating bath (75 °C, 85 °C, and 95 °C) and deposition time (20, 40, and 60 minutes). The analysis of the microstructure of the Ni layer deposited on the Si wafer was characterized. The adhesion test was conducted using the ATM D3359 (Measuring Adhesion by Tape Test) Standard for coating adhesion test and the 4-Point Probe Test for the resistivity measurement. It was found that the optimum Ni plating temperature was at 85 °C based on its adhesion and high stability of plating bath. The resistivity test showed that the increased of Nickel underlayer thickness deposited between copper and Si wafer has slightly increased the resistivity.

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Chiang, Zhiwei. "Direct Observation of Crystal Facet Transformation During Gold-Tin Alloy Electroplating." Journal of Integrated Circuits and Systems 10, no. 3 (2015): 166–73. http://dx.doi.org/10.29292/jics.v10i3.419.

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Gold-Tin alloys are commonly used as solder materials in semiconductor industries. In this work, Au-Sn alloys have been electroplated with different bath conditions. For the first time, Au-Sn alloy single crystals have been observed. There are two kinds of single crystals were grown with the compositions of Au4Sn and Au2Sn, different from literature-stated Au5Sn and AuSn. The effects of bath composition and plating factors on crsytal facet development of Au-Sn deposits have been investigated. SEM/EDX analysis showed that only Au4Sn and Au2Sn phases are single crystals among all plated deposits. The growth of either Au4Sn or Au2Sn phases showed preferred orientation with plating conditions. We report on quantitative SEM/EDX characterizations used to study the facet transformation behavior of Au-Sn alloy at the nanometer scale. We have obtained direct evidence that the single crystals and crystal facet transformation of Au4Sn and Au2Sn does exist in Au-Sn alloy, and high Sn content enhanced the crystal growth through a spiral-like growth mechanism.

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Yermembetova, Aiganym, Raheleh M. Rahimi, Chang-Eun Kim, et al. "Nanomechanics and Testing of Core-Shell Composite Ligaments for High Strength, Light Weight Foams." MRS Advances 2, no. 58-59 (2017): 3577–83. http://dx.doi.org/10.1557/adv.2017.480.

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ABSTRACT Composite nanostructured foams consisting of a metallic shell deposited on a polymeric core were formed by plating copper via electroless deposition on electrospun polycaprolactone (PCL) fiber mats. The final structure consisted of 1000-nm scale PCL fibers coated with 100s of nm of copper, leading to final core-shell thicknesses on the order of 1000-3000 nm. The resulting open cell, core-shell foams had relative densities between 4 and 15 %. By controlling the composition of the adjuncts in the plating bath, particularly the composition of formaldehyde, the relative thickness of copper coating as the fiber diameter could be controlled. As-spun PCL mats had a nominal compressive modulus on the order of 0.1 MPa; adding a uniform metallic shell increased the modulus up to 2 MPa for sub-10 % relative density foams. A computational materials science analysis using density functional theory was used to explore the effects pre-treatment with Pd may have on the density of nuclei formed during electroless plating.

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Tientong, Jeerapan, Casey R. Thurber, Nandika D’Souza, Adel Mohamed, and Teresa D. Golden. "Influence of Bath Composition at Acidic pH on Electrodeposition of Nickel-Layered Silicate Nanocomposites for Corrosion Protection." International Journal of Electrochemistry 2013 (2013): 1–8. http://dx.doi.org/10.1155/2013/853869.

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Nickel-layered silicates were electrochemically deposited from acidic bath solutions. Citrate was used as a ligand to stabilize nickel (II) ions in the plating solution. The silicate, montmorillonite, was exfoliated by stirring in aqueous solution over 24 hours. The plating solutions were analyzed for zeta-potential, particle size, viscosity, and conductivity to investigate the effects of the composition at various pHs. The solution particles at pH 2.5 (−22.2 mV) and pH 3.0 (−21.9 mV) were more stable than at pH 1.6 (−10.1 mV) as shown by zeta-potential analysis of the nickel-citrate-montmorillonite plating solution.Ecorrfor the films ranged from −0.32 to −0.39 V with varying pH from 1.6 to 3.0. The films were immersed in 3.5% NaCl and the open circuit potential monitored for one month. The coatings deposited at pH 3.0 were stable 13 days longer in the salt solution than the other coatings. X-ray diffraction showed a change in the (111)/(200) ratio for the coatings at the various pHs. The scanning electron microscopy and hardness results also support that the electrodeposition of nickel-montmorillonite at pH 3.0 (234 GPa) had improved hardness and morphology compared to pH 2.5 (174 GPa) and pH 1.6 (147 GPa).

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