Academic literature on the topic 'Post-Bond'
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Journal articles on the topic "Post-Bond"
Latta, Thomas J. "Assessing Bond Market Developments Post-Euro." CFA Digest 29, no. 3 (August 1999): 18–20. http://dx.doi.org/10.2469/dig.v29.n3.508.
Full textOh, Jungsub, Jihun Jung, and Sungju Park. "IEEE 1500 Wrapper Design Technique for Pre/Post Bond Testing of TSV based 3D IC." Journal of the Institute of Electronics and Information Engineers 50, no. 1 (January 25, 2013): 131–36. http://dx.doi.org/10.5573/ieek.2013.50.1.131.
Full textValandro, Luiz Felipe, César Dalmolin Bergoli, Carolina Ceolin Druck, and Gabriel Kalil Rocha Pereira. "Effect of two Resin Cements and two Fiber Post Surface Treatments on Push-out Bond Strength between Fiber Post and Root Dentin." Journal of Contemporary Dental Practice 16, no. 1 (January 2015): 7–12. http://dx.doi.org/10.5005/jp-journals-10024-1627.
Full textDas, Arunita, Josipa Bošnjak, and Akanshu Sharma. "Numerical investigations on post-fire bond behaviour of reinforcement in concrete." RILEM Technical Letters 4 (May 16, 2019): 1–8. http://dx.doi.org/10.21809/rilemtechlett.2019.88.
Full textGagné, Olivier Charles, and Frank Christopher Hawthorne. "Bond-length distributions for ions bonded to oxygen: metalloids and post-transition metals." Acta Crystallographica Section B Structural Science, Crystal Engineering and Materials 74, no. 1 (January 12, 2018): 63–78. http://dx.doi.org/10.1107/s2052520617017437.
Full textSchmage, P., P. Pfeiffer, E. Pinto, U. Platzer, and I. Nergiz. "Influence of Oversized Dowel Space Preparation on the Bond Strengths of FRC Posts." Operative Dentistry 34, no. 1 (January 1, 2009): 93–101. http://dx.doi.org/10.2341/08-53.
Full textSHIMA, Hiroshi, Lie-Liung CHOU, and Hajime OKAMURA. "Bond characteristics in post-yield range of deformed bars." Doboku Gakkai Ronbunshu, no. 378 (1987): 213–20. http://dx.doi.org/10.2208/jscej.1987.378_213.
Full textIp, Nathan, Atsushi Nagata, Norifumi Kohama, Norio Wada, and Kimio Motoda. "Investigation of Post-Bond Distortion in Direct Wafer Bonding." ECS Transactions 98, no. 4 (September 23, 2020): 47–52. http://dx.doi.org/10.1149/09804.0047ecst.
Full textScotti, N., A. Forniglia, E. Bergantin, D. S. Paolino, D. Pasqualini, and E. Berutti. "Fibre post adaptation and bond strength in oval canals." International Endodontic Journal 47, no. 4 (August 6, 2013): 366–72. http://dx.doi.org/10.1111/iej.12156.
Full textIp, Nathan, Atsushi Nagata, Norifumi Kohama, Norio Wada, and Kimio Motoda. "Investigation of Post-Bond Distortion in Direct Wafer Bonding." ECS Meeting Abstracts MA2020-02, no. 22 (November 23, 2020): 1642. http://dx.doi.org/10.1149/ma2020-02221642mtgabs.
Full textDissertations / Theses on the topic "Post-Bond"
Wagner, Andrew. "Municipal bond market efficiency post the implementation of RTRS transparency regulations /." [St. Lucia, Qld.], 2005. http://www.library.uq.edu.au/pdfserve.php?image=thesisabs/absthe18675.pdf.
Full textKupselaitis, Kurt. "Evaluation of Strand to Grout Bond in Post-Tensioned Tendons with Corrosion Inhibiting Penetrants." Scholar Commons, 2019. https://scholarcommons.usf.edu/etd/7834.
Full textIacono, Carole-Anne. "Le sujet de la folie contemporaine : de la croyance mythique au sacre de l'hyper techni-cité dans le discours post-traditionnel." Thesis, Université Côte d'Azur (ComUE), 2018. http://www.theses.fr/2018AZUR2027/document.
Full textThis research proposes to question the subject taken under the yoke of the discourses of the post-modernity, from what we see as the desecration of mythic belief. This symbolic remodeling shifts the social link towards a society of technology, a “techni-cité”, governed by new « GAFA » economic powers. The contemporary subject is thus subject to the a-parametric injunctions of a Father 2.0 which pushes him ever further into the subjective tumble of an absolute and massive enjoyment and « massifere ». This new social organization then gives rise to new representations of madness. This is what drives us to re-examine this notion that sheds light on our whole subject. This new social organization then gives rise to new representations of madness. This is what drives us to re-examine this notion that sheds light on our whole subject.The contemporary clinic shows some forms of resistance of the subject. The latter, needing to renew his relationship with the Other, turns to new forms of spirituality that he takes from other cultures .He hopes from the putting into practice of these traditions to be able to extract knowledge about his own condition. In doing so he technicizes these imported beliefs, which are immediately torn from their symbolic base, turn to the imaginary and take up capitalist logic. The new practices that emerge from it are part of a post-traditionalism that offers a compromise to the subject that seeks to renew itself subjectively.Since post-modernity knows no boundaries, we will put these issues at stake in other societies, particularly in the Amazon, Senegal and Vanuatu. We will find that madness is closely linked to social disorder and that the contamination of contemporary economic-techno-scientific discourses produces effects beyond occidental culture
Markus, Lundholm. "Factors affecting liquidity in the Nordic corporate bond market : A study on MiFiR required post trade transactions." Thesis, Umeå universitet, Institutionen för matematik och matematisk statistik, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-180532.
Full textDen Nordiska marknaden för företagsobliationer är en marknad vars betydelse för det finansiella universet ökar, dock är den förhållandevis dåligt undersökt på grund av dess dåliga insyn. Denna studie använde sig av den nya EU-regleringen MiFiR och dess krav på transaktionsrapportering för att kvantitativt mäta likviditeten i marknaden. I studien har 2817 transaktioner i Nordiska företagsobligationer samlats in och analyserats i en likviditetskontext på både obliagtions- och marknadsnivå. Obligationsattributen kupongstorlek, handelsfrekvens, handelsvolym, lågt kreditbetyg och pris påstogs vara relaterade till obligationens likviditet. Likviditeten på företagsobligationsmarknaden ansågs vara starkt beroende av VIX-indexet och volatiliteten för OMXS30-indexet. Vidare diskuterades också tillförlitligheten av tillvägagångssättet som används idag för att värdera obligationerna.
Zhang, Burong. "Experimental and theoretical investigations of a new bond-type anchorage system for post-tensioning applications with FRP tendons." Thèse, Université de Sherbrooke, 2001. http://savoirs.usherbrooke.ca/handle/11143/1732.
Full textPolo, Luz. "Caractérisation et optimisation de la performance des cartouches d'ancrage AMBEX sous chargement soutenu." Mémoire, Université de Sherbrooke, 2014. http://hdl.handle.net/11143/10138.
Full textAbstract : Adhesive anchoring systems are used in many civil engineering applications, including rehabilitation and repair of infrastructure such as bridge decks, roadways, tunnels, dams, walls, columns, and in some geological explorations and mining. An adhesive anchoring system consists of three components: the anchor: a reinforcing bar or a threaded rod; the adhesive material: polymeric, cementitious or hybrid; and a substrate of concrete or masonry. The loads applied on the anchor rods are transmitted by a chemical adhesion to the substrate (reactions) and mechanical interlock between the components mentioned. The design pattern of uniform adhesion establishes that the structural performance of an adhesive anchoring system is determined by the bond strength (τ) developed across the contact surface, between the components within the anchor hole. This project, in partnership with AMBEX, investigates and assesses the performance of an anchoring system, with an adhesive of cementitious material, related to the creep behaviour. To achieve this, steel rebars were anchored in a conventional concrete substrate. Two adhesives were evaluated: AAC and ARC cartridges. Geometrical and installation parameters were taken into account, to ensure bond failure during pullout tests. Two service conditions were studied: room temperature (21ºC) and high temperature (43ºC). Static tensile tests and creep tests were performed. The results are presented in graphs “load-displacement-time”, in order to make predictions of future behavior. The project shows the advantages of adhesive anchors made of cementitious material, as a feeble creep rate at sustained load, and also some limitations, as the variability of tension test results for anchors tested with AAC cartridge.
Cordeiro, Nara Pereira d'Abreu. "Resistencia ao cisalhamento por extrusão - "push out" - de pinos de fibra de vidro a dentina intra-radicular." [s.n.], 2003. http://repositorio.unicamp.br/jspui/handle/REPOSIP/288200.
Full textTese (doutorado) - Universidade Estadual de Campinas, Faculdade de Odontologia de Piracicaba
Made available in DSpace on 2018-08-03T15:59:52Z (GMT). No. of bitstreams: 1 Cordeiro_NaraPereirad'Abreu_D.pdf: 3561839 bytes, checksum: 125cbc91719d6a902ce59502debf7873 (MD5) Previous issue date: 2003
Resumo: o objetivo deste estudo foi avaliar a resistência ao cisalhamento por extrusão (push out) entre a dentina intra-radicular e pinos de fibra de vidro nas regiões cervical, média e apical de raízes utilizando dois sistemas de cimentação adesiva. Foram selecionados vinte pré-molares inferiores unirradiculares recém extraídos por motivos ortodônticos, hígidos e livres de trincas. As coroas dos dentes foram removidas na altura da junção cemento esmalte. As polpas dentais foram removidas através de limas endodônticas e os condutos radiculares foram preparados com brocas de largo nO 5, com 8,Omm de penetração. As raízes foram divididas em dois grupos de 10: Grupo 1- pino fixados com o sistema adesivo autocondicionante ED Primer e cimento resinoso Panavia F; Grupo 2- pinos fixados com o sistema adesivo de frasco único Single Bond e cimento resinoso Rely X. Após a fixação dos pinos, as raízes foram mantidas em estufa a 37°C, por 24 h. A porção mais apical das raízes foi seccionada até a altura em que a raiz apresentasse 8,Omm de comprimento. Em seguida, as raízes foram seccionadas transversalmente e 3 discos de 2,7mm de altura foram obtidas e classificadas segundo a região cervical, média e apical do pino. O ensaio de resistência de união por extrusão foi realizado em máquina de ensaio universal Instron 4411 onde uma haste metálica com ponta ativa de 1,Omm de diâmetro produziu a carga para efetuar o deslocamento do pino do conduto radicular. Os valores médios de resistência de união por extrusão não apresentaram diferenças estatísticas significantes no terço cervical da raiz entre os dois materiais de fixação avaliados. Nas regiões média e apical do conduto, os valores de resistência de união apresentados pelo Sing/e Bond + Re/y X foram superiores e estatisticamente diferentes em relação aos valores apresentados pelo sistema ED Primer + Panavia F (p< 0,05). Para os dois materiais em estudo, não houve diferença estatística quando comparadas as regiões média e cervical do pino, porém apresentaram diferença estatística em relação à região apical (p< 0,05). Após o ensaio de cisalhamento por extrusão, os espécimes foram seccionados no sentido longitudinal para análise em microscopia eletrônica de varredura. A zona de interdifusão adesivo/dentina produzida pelo adesivo de frasco único Sing/e Bond apresentou-se mais espessa do que a zona de interdifusão apresentada pelo adesivo autocondicionante ED Primer. Houve áreas desmineralizadas com presença de túbulos dentinários abertos porém parcialmente preenchidos pela resina em ambos os grupos. Também foram observadas bolhas que variaram de tamanho e forma na camada de cimento junto à área da interface de união e mais constantes no terço apical das raízes. Palavras-chave: pino de fibra de vidro; cimento resinoso; sistema adesivo; resistência de união; "push out
Abstract: The purpose of this study was to evaluate the bond strength between fiber posts cemented in root dentin considering different depths of the roots (cervical, median and apical) and two luting materiais, through push out tests and to examine the integration among these components through scanning electron microscopy. Twenty sound bicuspids, tree trom cracks, extracted for orthodontic reasons, were selected. The crowns were removed at the cement enamel junction. The pulps were removed with endodontic reamers and the first 8,Omm of the canais were shaped with number 5 largo burs. The roots were divided into two groups of 10 each. The roots trom group 1 received fiber posts cemented with the self etching primer ED Primer and the composite resin Panavia F., while the roots of Group 2 received fiber posts cemented with the one bottle adhesive Single Bond and the composite resin Rely X. After the posts cementation, the roots were kept in humidity at 3-,0 C for 24 hours. The most apical part of the roots were sectioned until they were 8.0mm long. After that, the roots were sectioned transversally and three 2.7mm thick sections were obtained: cervical, median and apical. The push out test that evaluated bond strength between luting material and root dentin was carried out on an Instron (4411) testing machine. The specimens were positioned on a steel support platform with the post centered over a 2.0mm hole in the platform. A steel probe 1.0mm in diameter was centered over the post and used to apply force to the test specimens. Data from the push out test revealed no statistically significant differences at the cervical portion of the root between the two cementation systems tested. At the median and apical portion of the root, the bond strength values presented by the Sing/e Bond and Re/y X were superior and statistically different from those presented by ED Primer and Panavia F (P
Dentística
Doutor em Clínica Odontológica
Mahindre, Prajakta Prakash. "Micro-push-out bond strength and the modes of failure for a fiber-reinforced resin-post system cemented using four adhesive lutingcements." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2009. http://hub.hku.hk/bib/B43224052.
Full textQuintero, Mayra Zamboni. "Avaliação in vitro da resistência de união à tração de três tipos de pinos de fibra cimentados a raízes bovinas com diferentes cimentos resinosos." Universidade de São Paulo, 2012. http://www.teses.usp.br/teses/disponiveis/23/23134/tde-15012013-164556/.
Full textThis study aimed to evaluate, through tensile test, the bond strength of prefabricated posts with different degrees of translucency, using three types of resin cements. Ninety bovine incisors were selected and sectioned at the cemento-enamel junction. The root canals were endodontically treated and the specimens were stored in distilled water at 37°C for 7 days. After this period, a 7-mm-deep post space was prepared for the cementation of three types of posts: Exacto (Angelus), translucent; Fiberglass Reforpost (Angelus), white; and Carbon Fiber Reforpost (Angelus), black and opaque. Three types of resin cements were used according to manufacturers\' instructions: the self-adhesive dual cement Rely X U100 (3M ESPE); the dual cement Rely X ARC (3M ESPE), associated with autopolymerized adhesive system Scotchbond Multi-Uso Plus (3M ESPE), and the self-cured cement Cement Post (Angelus), associated with the autopolymerized adhesive system Fusion Duralink (Angelus), constituting nine experimental groups (n = 10). After the storage of the specimens in distilled water at 37°C for 7 days, the tensile test was performed with a universal test machine at a crosshead speed of 0.5 mm/min. To determine the bond strength, the bonding area of each specimen was calculated. The data were statistically analyzed by ANOVA followed by Kruskal-Wallis test, with a significance level of 5%. The dislodged posts were examined microscopically (Olympus; Tokyo, Japan) at x20 magnification to determine the type of failure. Regarding the variables studied, it was found that: the Exacto post, more translucent and tapered, had significantly lower tensile bond strength than Fiberglass Reforpost and Carbon Fiber Reforpost when used the dual cement Rely X ARC; the dual self-adhesive cement Rely X U100 showed lower tensile bond strength than the dual cement Rely X ARC, when used Fiberglass Reforpost and Carbon Fiber Reforpost; regardless of the type of post tested, the self-cured cement Cement Post had lower tensile strength compared to dual cements. It was observed microscopically that resin cements adhered more to the posts than to the root dentin. Therefore, the translucency of the posts had not contributed to increase the tensile strength of dual-curing resin cements in all groups tested.
Almulhim, Khalid. "Effect of resin cement, aging process and root level on the bond strength of the resin-fiber posts." Thesis, NSUWorks, 2014. https://nsuworks.nova.edu/hpd_cdm_stuetd/16.
Full textBooks on the topic "Post-Bond"
Dalla, Ismail. The Korean bond market: Post Asian crisis and beyond. [Seoul, Korea]: Korea Stock Exchange, 2003.
Find full textLtd, Bond Corporation Holdings. Irises and five masterpieces. [Perth, W.A.]: Bond Corp., 1989.
Find full textKim, Yun-Hwan. Government Bond Market Development: A Post-Crisis Financial Agenda in Asia. Asian Development Bank, 2002.
Find full textPręgowski, Michał Piotr, and Justyna Włodarczyk. Free Market Dogs: The Human-Canine Bond in Post-Communist Poland. Purdue University Press, 2016.
Find full textPręgowski, Michał Piotr, and Justyna Włodarczyk. Free Market Dogs: The Human-Canine Bond in Post-Communist Poland. Purdue University Press, 2016.
Find full textFree Market Dogs: The Human-Canine Bond in Post-Communist Poland. Purdue University Press, 2016.
Find full textHines, Claire. The playboy and James Bond. Manchester University Press, 2018. http://dx.doi.org/10.7228/manchester/9780719082269.001.0001.
Full textPost-issuance bond compliance: A guide to practical strategies and procedures for 501(c) (3) borrowers. [Boston, Mass.]: Ropes & Gray, 2008.
Find full textHewitt, Nancy A. The Spiritual Journeys of an Abolitionist: Amy Kirby Post, 1802–1889. University of Illinois Press, 2017. http://dx.doi.org/10.5406/illinois/9780252038266.003.0006.
Full textBraun, Benjamin. Central Bank Planning. Oxford University Press, 2018. http://dx.doi.org/10.1093/oso/9780198820802.003.0009.
Full textBook chapters on the topic "Post-Bond"
Noia, Brandon, and Krishnendu Chakrabarty. "Post-Bond Test Wrappers and Emerging Test Standards." In Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs, 159–80. Cham: Springer International Publishing, 2013. http://dx.doi.org/10.1007/978-3-319-02378-6_7.
Full textRoy, Surajit Kumar, Dona Roy, Chandan Giri, and Hafizur Rahaman. "Post-bond Stack Testing for 3D Stacked IC." In Progress in VLSI Design and Test, 59–68. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-31494-0_8.
Full textWang, Ran, and Krishnendu Chakrabarty. "Post-bond Scan-Based Testing of Interposer Interconnects." In Testing of Interposer-Based 2.5D Integrated Circuits, 49–80. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-54714-5_3.
Full textTsarbopoulos, Anthony, and Fotini N. Bazoti. "Post-Translationally Modified Proteins: Glycosylation and Disulfide Bond Formation." In Characterization of Protein Therapeutics using Mass Spectrometry, 117–62. Boston, MA: Springer US, 2013. http://dx.doi.org/10.1007/978-1-4419-7862-2_4.
Full textLöffler, Kay, and Thomas Birckel. "High Tensile Bond Anchorage for Post-tensioning Bar Tendon Systems." In High Tech Concrete: Where Technology and Engineering Meet, 2451–57. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-59471-2_279.
Full textTsarbopoulos, Anthony, and Fotini N. Bazoti. "Post-Translationally Modified Proteins: Glycosylation, Phosphorylation, and Disulfide Bond Formation." In Protein and Peptide Mass Spectrometry in Drug Discovery, 321–69. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9781118116555.ch12.
Full textBühler, Wolfgang, and Michael Schulze. "Analysis of the Call Policy of Bund, Bahn, and Post in the German Bond Market." In Contributions to Management Science, 233–53. Heidelberg: Physica-Verlag HD, 1999. http://dx.doi.org/10.1007/978-3-642-58664-4_12.
Full textHines, Claire. "Before the bond." In The playboy and James Bond, 8–23. Manchester University Press, 2018. http://dx.doi.org/10.7228/manchester/9780719082269.003.0002.
Full textHines, Claire. "The bond beyond." In The playboy and James Bond, 159–98. Manchester University Press, 2018. http://dx.doi.org/10.7228/manchester/9780719082269.003.0007.
Full textGaine, Vincent M. "‘Not now that strength’: Embodiment and Globalisation in Post-9/11 James Bond." In American Cinema in the Shadow of 9/11. Edinburgh University Press, 2016. http://dx.doi.org/10.3366/edinburgh/9781474413817.003.0007.
Full textConference papers on the topic "Post-Bond"
Marinissen, Erik Jan, Chun-Chuan Chi, Jouke Verbree, and Mario Konijnenburg. "3D DfT architecture for pre-bond and post-bond testing." In 2010 IEEE International 3D Systems Integration Conference (3DIC). IEEE, 2010. http://dx.doi.org/10.1109/3dic.2010.5751450.
Full textHuang, Shi-Yu. "Pre-Bond and Post-Bond Testing of TSVs and Die-to-Die Interconnects." In 2016 IEEE 25th Asian Test Symposium (ATS). IEEE, 2016. http://dx.doi.org/10.1109/ats.2016.67.
Full textGerakis, Vasileios, Yiorgos Tsiatouhas, and Alkis Hatzopoulos. "An Alternative Post-bond Testing Method for TSVs." In 2020 9th International Conference on Modern Circuits and Systems Technologies (MOCAST). IEEE, 2020. http://dx.doi.org/10.1109/mocast49295.2020.9200295.
Full textJing, Bingqiang, Xiaole Cui, Yalin Ran, and Yufeng Jin. "Post-bond test for TSVs using voltage division." In 2015 IEEE 11th International Conference on ASIC (ASICON ). IEEE, 2015. http://dx.doi.org/10.1109/asicon.2015.7517145.
Full textShen, Kele, Dong Xiang, and Zhou Jiang. "Dual-Speed TAM Optimization of 3D SoCs for Mid-bond and Post-bond Testing." In 2014 IEEE 23rd Asian Test Symposium (ATS). IEEE, 2014. http://dx.doi.org/10.1109/ats.2014.14.
Full textLewis, Dean L., Shreepad Panth, Xin Zhao, Sung Kyu Lim, and Hsien-Hsin S. Lee. "Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores." In 2011 IEEE 29th International Conference on Computer Design (ICCD 2011). IEEE, 2011. http://dx.doi.org/10.1109/iccd.2011.6081381.
Full textYu, Yang, Zhiming Yang, and Kangkang Xu. "A Post-Bond TSVs Test Solution for Leakage Fault." In 2019 IEEE International Test Conference in Asia (ITC-Asia). IEEE, 2019. http://dx.doi.org/10.1109/itc-asia.2019.00035.
Full textPapadopoulos, Stylianos-Georgios, Vasileios Gerakis, and Alkis Hatzopoulos. "Oscillation-based technique for TSV post-bond test considerations." In 2017 6th International Conference on Modern Circuits and Systems Technologies (MOCAST). IEEE, 2017. http://dx.doi.org/10.1109/mocast.2017.7937671.
Full textHuang, Hantao, Hao Yu, Cheng Zhuo, and Fengbo Ren. "A Compressive-sensing based Testing Vehicle for 3D TSV Pre-bond and Post-bond Testing Data." In ISPD'16: International Symposium on Physical Design. New York, NY, USA: ACM, 2016. http://dx.doi.org/10.1145/2872334.2872351.
Full textRodriguez-Montanes, R., D. Arumi, and J. Figueras. "Post-bond test of Through-Silicon Vias with open defects." In 2014 19th IEEE European Test Symposium (ETS). IEEE, 2014. http://dx.doi.org/10.1109/ets.2014.6847816.
Full textReports on the topic "Post-Bond"
Anderson, Mike, and René Stulz. Is Post-Crisis Bond Liquidity Lower? Cambridge, MA: National Bureau of Economic Research, April 2017. http://dx.doi.org/10.3386/w23317.
Full textBrooks, Jordan, Michael Katz, and Hanno Lustig. Post-FOMC Announcement Drift in U.S. Bond Markets. Cambridge, MA: National Bureau of Economic Research, October 2018. http://dx.doi.org/10.3386/w25127.
Full textSmith, Janvier K. Affirming the Bond: U.S. - Japan Security in the Post-Cold War Age. Fort Belvoir, VA: Defense Technical Information Center, May 1994. http://dx.doi.org/10.21236/ada289054.
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