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Journal articles on the topic 'Power Electronics Reliability'

Author: Grafiati

Published: 14 March 2023

Last updated: 31 July 2025

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1

Iannuzzo, Francesco, and Mauro Ciappa. "Reliability issues in power electronics." Microelectronics Reliability 58 (March 2016): 1–2. http://dx.doi.org/10.1016/j.microrel.2016.01.012.

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Zhdanov, I. Y., and M. A. Ostapchuk. "Stand for passive thermal cycling tests of power semiconductor components in complex temperature." Superconductivity: Fundamental and Applied Research 6, no. 1 (2025): 74–81. https://doi.org/10.62539/2949-5644-2024-6-1-74-81.

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Cryogenic cooling of power electronics is a promising direction, which in the future can become an alternative to other types of cooling in systems with superconducting devices. At the same time, the increase in the specific power and efficiency of power electronic converters is associated with unexplored reliability. This manuscript contains approaches for studying the reliability of power electronics, as well as experimental data from passive thermal cycling tests.

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White, Robert V. "Advancing Power Electronics Reliability [White Hot]." IEEE Power Electronics Magazine 8, no. 2 (2021): 100–99. http://dx.doi.org/10.1109/mpel.2021.3075786.

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4

Scheuermann, U. "Reliability challenges of automotive power electronics." Microelectronics Reliability 49, no. 9-11 (2009): 1319–25. http://dx.doi.org/10.1016/j.microrel.2009.06.045.

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Jiao, Chaoqun, Juan Zhang, Zhibin Zhao, Zuoming Zhang, and Yuanliang Fan. "Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices." Sensors 19, no. 19 (2019): 4176. http://dx.doi.org/10.3390/s19194176.

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With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of th

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Pires, Igor Amariz, Rafael Atila Silva, Anderson Vagner Rocha, Matheus Pereira Porto, Thales Alexandre Carvalho Maia, and Braz de Jesus Cardoso Filho. "Oil Immersed Power Electronics and Reliability Enhancement." IEEE Transactions on Industry Applications 55, no. 4 (2019): 4407–16. http://dx.doi.org/10.1109/tia.2019.2915276.

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Lu, Hua, Chris Bailey, and Chunyan Yin. "Design for reliability of power electronics modules." Microelectronics Reliability 49, no. 9-11 (2009): 1250–55. http://dx.doi.org/10.1016/j.microrel.2009.07.055.

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Zeng, Jia Si, Yi Bo Gao, Feng Yang, et al. "Reliability Evaluation of Mid-Voltage DC Distribution Network with Multiple Topologies." Applied Mechanics and Materials 666 (October 2014): 112–18. http://dx.doi.org/10.4028/www.scientific.net/amm.666.112.

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With the development of power electronics, DC distribution network has advantages in power supplying for DC loads, saving transmission loss of reactive power and improving power quality, when compared with traditional AC distribution network. Since DC distribution network has several multiple topologies, lots of power electronic components and DGs, the traditional reliability evaluation methods aren’t applicable any more. Hence, the reliability models of power electronics and DGs are built in this paper, and a hybrid method combining minimum-cut with non-sequential Monte Carlo is presented. Mo

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9

Hossein Rahimighazvini, Zeyad Khashroum, Maryam Bahrami, and Milad Hadizadeh Masali. "Power electronics anomaly detection and diagnosis with machine learning and deep learning methods: A survey." International Journal of Science and Research Archive 11, no. 2 (2024): 730–39. http://dx.doi.org/10.30574/ijsra.2024.11.2.0428.

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Power electronics pertains to the conception, regulation, and utilization of electronic power circuits to proficiently administer and transform electrical energy. Power electronics play a crucial role in maintaining the reliability, efficiency, and security of complex production systems. Also, increasingly important in various applications such as renewable energy systems, electric vehicles, and industrial automation. However, modern power electronics systems are vulnerable to both cyber and physical anomalies due to the integration of information and communication technologies. So far, differ

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10

Zacharias, Peter. "Design and Applications of Controllable Magnetic Devices in Power Electronic Circuits and Power Systems." Journal of Electronics and Advanced Electrical Engineering 1, no. 2 (2021): 6–14. http://dx.doi.org/10.47890/jeaee/2020/peterzacharias/11120007.

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Magnetic components are characterized by high robustness and reliability. Controllable magnetic components, which used to dominate, have been out of fashion for about 50 years. However, they have great advantages in terms of longevity, radiation resistance and overload capacity and become smaller and smaller with increasing operating frequency. This makes them interesting in modern power electronics applications with the increasing use of WGB semiconductors. The article shows how the performance of power electronic converters can be improved with modern power electronics and with field-control

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Freitas, Luiz Carlos Gomes, Marcelo Godoy Simoes, and Paulo Peixoto Praça. "Power Electronics Converters for On-Board Electric Power Systems." Energies 16, no. 9 (2023): 3771. http://dx.doi.org/10.3390/en16093771.

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12

Hozoji, Hiroshi, Fumiki Kato, So Tanaka, Jiro Shinkai, and Hiroshi Sato. "Power Electronics Packaging Materials for High Heat Reliability." Journal of The Japan Institute of Electronics Packaging 24, no. 3 (2021): 233–40. http://dx.doi.org/10.5104/jiep.24.233.

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13

Gurav, Abhijit, John Bultitude, John McConnell, and Reggie Phillips. "Robust Reliability of Ceramic Capacitors for Power Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (2018): 000138–42. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000138.

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Abstract For applications using Wide Band Gap (WBG) semiconductors, and for electronics for down-hole drilling, oil exploration, geothermal energy generation and power electronics, there is a growing need for capacitors that have robust reliability at temperatures of 125°C, 150°C or above. The development of more energy efficient power converters and inverters based on WBG semiconductors is driving the adoption of higher temperatures in a growing number of power electronics and automotive circuits since these operate at higher junction temperatures than traditional silicon. This has led to a g

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14

Folayan G.B, Folayan G. B. "Reliability-Centric Review of FaultTolerant Control Systems in Power Electronics Applications." International Journal of Advances in Engineering and Management 7, no. 6 (2025): 299–305. https://doi.org/10.35629/5252-0706299305.

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The reliability of power electronics systems is crucial for the stable operation of modern technological infrastructures like renewable energy systems, electric vehicles, and smart grids. However, these systems are increasingly vulnerable to faults like semiconductor failures, sensor errors, and actuator malfunctions, which can degrade performance or cause system breakdowns. Faulttolerant control (FTC) strategies have emerged as a solution to enhance the resilience and operational continuity of power electronics applications. This paper reviews FTC techniques, categorizing them into passive an

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15

Mestha, Soumya Rani, and Pinto Pius A.J. "Investigation of reliability assessement in power electronics circuits using machine learning." International Journal of Power Electronics and Drive Systems (IJPEDS) 12, no. 1 (2021): 558. http://dx.doi.org/10.11591/ijpeds.v12.i1.pp558-566.

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<p>Recent advances in power electronics (PE) and machine learning (ML) have prompted the technologists to adapt these new technologies to improve the reliability of PE systems. During the process, a lot of investigations on the performance and reliability of PE systems is carried out. The intention of this paper is to present a comprehensive study of advances in the field of reliability of PE systems using machine learning. Recent publications in this regard are analysed and findings are tabulated. In addition to this, literatures published in the prediction of remaining useful life (RUL

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Soumya, Rani Mestha, and Pius A.J. Pinto. "Investigation of reliability assessement in power electronics circuits using machine learning." International Journal of Power Electronics and Drive System (IJPEDS) 12, no. 1 (2021): 558–66. https://doi.org/10.11591/ijpeds.v12.i1.pp558-566.

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Recent advances in power electronics (PE) and machine learning (ML) have prompted the technologists to adapt these new technologies to improve the reliability of PE systems. During the process, a lot of investigations on the performance and reliability of PE systems is carried out. The intention of this paper is to present a comprehensive study of advances in the field of reliability of PE systems using machine learning. Recent publications in this regard are analysed and findings are tabulated. In addition to this, literatures published in the prediction of remaining useful life (RUL) of powe

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17

V., Bharatidevi. "Applications of Transformers in Electronics: Advancements and Innovations." Recent Trends in Thermodynamics and Thermal Energy System 1, no. 1 (2025): 1–4. https://doi.org/10.5281/zenodo.14849668.

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<em>Transformers play a pivotal role in modern electronics, facilitating efficient power distribution, signal processing, and voltage regulation across various applications. This paper explores the diverse applications of transformers in electronics, including power supply design, impedance matching, isolation, and noise reduction. Special emphasis is given to recent advancements in high-frequency transformers, planar transformers, and AI-driven optimization of transformer performance. The study also discusses the role of transformers in emerging technologies such as renewable energy systems,

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18

Brewer, Roger. "High Reliability Electronics for Demanding Aircraft Applications – An Overview." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (2016): 000011–17. http://dx.doi.org/10.4071/2016-hitec-11.

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Abstract The primary form of generated power on any typical aircraft (Tactical, Airlift, Commercial) requires conversion in multiple different forms (voltage levels, aircraft compliant frequency) and at various power levels to meet the total needs of the vehicle. DC:AC Power Conversion (Inverters), AC-DC Generator (conditioning) electronics, AC-AC frequency conditioning and DC:DC Power Conversion are all forms of conversion within the power system (primary, secondary tiers) typical of any aircraft. Additionally, within the power distribution network often solid state power switches in later ge

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19

Kirti, Jawalbankar*, and obula Reddy Prof.K.Chandra. "DIFFERENT METHODS FOR DG ANTI-ISLANDING PROTECTION." INTERNATIONAL JOURNAL OF ENGINEERING SCIENCES & RESEARCH TECHNOLOGY 5, no. 4 (2016): 772–76. https://doi.org/10.5281/zenodo.50406.

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For better power quality and reliability, the power industry are focusing to distributed generations i.e. DG. New technology like photo voltaic  (PV), fuel cell, wind turbine, and new innovation in power electronics generating powers but cannot provide quality and reliability and customer required both. Hence distributed generation (DG) is advance research area in the power industry due to market deregulations and environmental concerns. This paper provides the overview on existing Different methods for DG anti-islanding Protection.  

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20

Calleja, Hugo, and Freddy Chan. "Reliability: A Neglected Topic in the Power Electronics Curricula." Journal of Power Electronics 10, no. 6 (2010): 660–66. http://dx.doi.org/10.6113/jpe.2010.10.6.660.

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21

Dababneh, Amer B., Ben Goerdt, Timothy Marler, and Ibrahim T. Ozbolat. "A Virtual Prognostic Tool for Nuclear Power Electronics Reliability." Computer-Aided Design and Applications 11, no. 2 (2013): 228–38. http://dx.doi.org/10.1080/16864360.2014.846097.

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22

Jyotsana, Kaiwart, and Huddar Anupama. "Power quality improvement in power electronics systems using machine learning." i-manager's Journal on Circuits and Systems 11, no. 1 (2023): 34. http://dx.doi.org/10.26634/jcir.11.1.19492.

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This study focuses on improving power electronic components and devices, which have gained popularity due to their compact size and precise control over the output voltage and current. They are widely used in renewable energy systems, such as converters and inverters, and in industrial drives as control devices. However, the switching process in power electronic components introduces nonlinear behavior, leading to the generation of harmonics and power quality problems. To address these issues, various methods and techniques recommended by industry standards have been proposed to mitigate or el

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23

Persons, Ryan, and Paul Gundel. "Print Copper on Ceramic for High Reliability Electronics." International Symposium on Microelectronics 2015, no. 1 (2015): 000330–35. http://dx.doi.org/10.4071/isom-2015-wp12.

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In the power electronics world, Direct Bonded Copper (DBC) is the primary substrate technology. In this paper, we will discuss an alternative technology utilizing screen printable copper pastes (Thick Printed Copper - TPC) on a variety of substrate technologies including Alumina (Al2O3) and Aluminum Nitride (AlN). These materials when processed, look and perform similar to DBC, but exhibit superior reliability and excellent design flexibility. DBC has drawbacks when it comes to thermal mechanical reliability and lacks the flexibility to have multiple copper thicknesses for power and signal cir

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24

Yan, Haowei. "Recent Advancements and Application Of Z-Source Inverters." Highlights in Science, Engineering and Technology 81 (January 26, 2024): 1–13. http://dx.doi.org/10.54097/q2bks263.

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With the imminent energy crisis, mankind's demand for clean energy is increasing. Electricity, as the foundation of today's social development, its industry is developing at a high speed, and there is an urgent need for more efficient, stable and flexible power conversion solutions in the field of power electronics. However, traditional power electronics topologies encounter limitations, especially when confronted with wide-ranging input voltage fluctuations, posing challenges for meeting practical requirements. The Z-source inverter addresses issues inherent in conventional power electronic t

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25

Blaabjerg, Frede, and Michael M. Pecht. "Special Issue on Robust Design and Reliability of Power Electronics, IEEE Transactions on Power Electronics, May 2015." IEEE Transactions on Power Electronics 30, no. 5 (2015): 2373–74. http://dx.doi.org/10.1109/tpel.2014.2376271.

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26

OKABE, Nagatoshi, Mitsuyoshi TSUTSUMI, and Xia ZHU. "Testing Method and Reliability Design of Reliability Estimation in Mounting Power Electronics Semiconductor." Proceedings of the 1992 Annual Meeting of JSME/MMD 2002 (2002): 253–54. http://dx.doi.org/10.1299/jsmezairiki.2002.0_253.

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27

Pang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (2006): 1–8. http://dx.doi.org/10.1115/1.2429703.

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The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal c

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28

Tan, Yangyang, Jun Liu, Sichang Xu, Peng Zhong, Qi Zhang, and Lin Hu. "Operational reliability evaluation of PV inverter considering relative humidity and its application on power system." E3S Web of Conferences 185 (2020): 01050. http://dx.doi.org/10.1051/e3sconf/202018501050.

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With the penetration of renewable energy in the power system gradually increases, the importance of power electronics is growing up. The reliability of the power electronics should be taken seriously. This paper focuses on the operational reliability of photovoltaic (PV) inverters which is the most vulnerable in grid-connected PV systems and its application on the reliability evaluation of power systems. According to the field data, the effect of relative humidity is nonnegligible to the reliability of PV inverters. First, the real-time failure rate of components in PV inverters calculation me

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29

Wassick, Thomas A. "Electromigration in Lead – Free Solder: A Power IC Perspective." International Symposium on Microelectronics 2013, no. 1 (2013): 000753–57. http://dx.doi.org/10.4071/isom-2013-wp61.

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Over the past few years, lead - free solder interconnects have been significantly incorporated into electronic products, and are increasingly found in high performance computing systems and in their associated power electronics. As power and current levels increase within these products, the overall reliability of a lead-free solder based system can be impacted by an increasing risk of finding electromigration (EM) degradation during the product lifetime, especially if the product is operating at higher temperatures and with very high current densities. This paper provides a high-level technic

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30

Gupta, Priyanka, Gurulakshmi A.B, Ginni Nijhawan, Praveen, Lalit Kumar Tyagi, and Raghad Ahmed Hussien. "A review on Machine Learning Enhanced Predictive Maintenance for Electric Vehicle Power Electronics: A Pathway to Improved Reliability and Longevity." E3S Web of Conferences 505 (2024): 03017. http://dx.doi.org/10.1051/e3sconf/202450503017.

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The emergence of electric vehicles (EVs) as a mainstream mode of transportation presents new challenges in the realm of power electronics, particularly concerning reliability and longevity. Power electronics are the cornerstone of EV performance, dictating efficiency, durability, and overall vehicle health. Traditional maintenance strategies fall short in addressing the dynamic operational demands and complex failure mechanisms inherent in EV power systems. This paper introduces a machine learning (ML)-enhanced predictive maintenance framework designed to revolutionize the upkeep of EV power e

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31

Drobnik, Joe, and Praveen Jain. "Electric and Hybrid Vehicle Power Electronics Efficiency, Testing and Reliability." World Electric Vehicle Journal 6, no. 3 (2013): 719–30. http://dx.doi.org/10.3390/wevj6030719.

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32

Khazaka, R., L. Mendizabal, D. Henry, and R. Hanna. "Survey of High-Temperature Reliability of Power Electronics Packaging Components." IEEE Transactions on Power Electronics 30, no. 5 (2015): 2456–64. http://dx.doi.org/10.1109/tpel.2014.2357836.

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33

Teixeira, Tiago M. L., and Juan Bevan. "Product Development of High Power Electronics for High Reliability Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (2017): 000213–17. http://dx.doi.org/10.4071/2380-4491.2017.hiten.213.

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Abstract: The goal of this study was to achieve an improvement on power conversion based on SiC High Power Electronic devices at high temperature (+220°C). Two different devices (a SiC Schottky Diode & a Schottky Diode Bridge Rectifier) were studied using different substrates, die attach materials and die. Positive results were achieved; it was found a strong relationship between wire bond strength and die attach material; it was evident the two different die chosen for the study resulted in different electrical performance on the devices; and that, from the arrays of tests, there was no e

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34

Bayerer, Reinhold. "Advanced packaging yields higher performance and reliability in power electronics." Microelectronics Reliability 50, no. 9-11 (2010): 1715–19. http://dx.doi.org/10.1016/j.microrel.2010.07.016.

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35

Ishizaki, T., A. Kuno, A. Tane, et al. "Reliability of Cu nanoparticle joint for high temperature power electronics." Microelectronics Reliability 54, no. 9-10 (2014): 1867–71. http://dx.doi.org/10.1016/j.microrel.2014.07.113.

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36

Arifujjaman, Md, M. T. Iqbal, and J. E. Quaicoe. "Reliability analysis of grid connected small wind turbine power electronics." Applied Energy 86, no. 9 (2009): 1617–23. http://dx.doi.org/10.1016/j.apenergy.2009.01.009.

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37

Novak, M., A. Sangwongwanich, and F. Blaabjerg. "Monte Carlo-Based Reliability Estimation Methods for Power Devices in Power Electronics Systems." IEEE Open Journal of Power Electronics 2 (2021): 523–34. http://dx.doi.org/10.1109/ojpel.2021.3116070.

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38

Paul, Arun Kumar. "Experimental exploration of functional integrity, functional reliability and reliability of modern power electronics equipments." International Journal of Power Electronics 3, no. 4 (2011): 374. http://dx.doi.org/10.1504/ijpelec.2011.040803.

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39

Fan, Guangyu, Christine Labarbera, Ning-Cheng Lee, and Colin Clark. "Shear Strength and Thermomechanical Reliability of Sintered Ag Joints Containing low CTE Non-metal Additives for Die Attach." International Symposium on Microelectronics 2018, no. 1 (2018): 000167–72. http://dx.doi.org/10.4071/2380-4505-2018.1.000167.

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Abstract Ag sintering has been paid attention as an alternative to soldering in die attach for decades, especially for high temperature power electronics packages because of its high melting temperature, highly thermal and electrical conductivity of the sintered silver joints, and low process temperature less than 275°C. The coefficient of thermal expansion (CTE) of silver (19.1ppm/°C), however, is much higher than the silicon die (2.6ppm/°C) and the commonly used alumina substrate (7.2ppm/°C). CTE mismatch of the different materials in the various components in a power electronics package lea

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40

Xiao, Mingxin. "Application of Power Electronics Technology in Renewable Energy Systems." Studies in Social Science Research 5, no. 2 (2024): p157. http://dx.doi.org/10.22158/sssr.v5n2p157.

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This paper primarily studies the application of power electronics technology in renewable energy systems. Firstly, it introduces the current development status and challenges of renewable energy, then focuses on the application of power electronics technology in wind power generation systems, solar power generation systems, and other renewable energy systems. Through the analysis of related literature and case studies, the important role of power electronics technology in improving the efficiency, stability, and reliability of renewable energy systems is summarized. In wind power generation sy

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Kaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." Journal of Microelectronics and Electronic Packaging 15, no. 3 (2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved becau

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Kaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge, and K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." International Symposium on Microelectronics 2018, no. 1 (2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved becau

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43

Chow, T. Paul. "SiC Bipolar Power Devices." MRS Bulletin 30, no. 4 (2005): 299–304. http://dx.doi.org/10.1557/mrs2005.77.

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AbstractThe successful commercialization of unipolar Schottky rectifiers in the 4H polytype of silicon carbide has resulted in a market demand for SiC high-power switching devices. This article reviews recent progress in the development of high-voltage 4H-SiC bipolar power electronics devices.We also present the outstanding material and processing challenges, reliability concerns, and future trends in device commercialization.

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44

Bouchetob, Elaid, and Bouchra Nadji. "Boosting Reliability." International journal of electrical and computer engineering systems 15, no. 4 (2024): 313–20. http://dx.doi.org/10.32985/ijeces.15.4.2.

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Reliability is very important in the world of electronic device design and production, particularly in applications where continuous and flawless performance is a necessity. This directs our attention to the boost converter, which forms the foundation of power electronics, renewable energy systems, and electric vehicles. However, as technology progresses, the choice of materials for these converters is a big challenge. For that, in this paper, the impact of using Silicon Carbide (SiC) devices, with their promising material properties, on the reliability of boost converters is presented. Becaus

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45

Yuan, Cadmus, René Kregting, Willem van Driel, Sander Gielen, An Xiao, and G. Q. (Kouchi) Zhang. "Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging." International Symposium on Microelectronics 2011, no. 1 (2011): 000418–29. http://dx.doi.org/10.4071/isom-2011-tp6-paper4.

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High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital-analog mixed circuit design, high power IC manufacturing technologies, and high power packaging design/process, in order to guarantee their performance and lifetime. In this paper, we overviewed our works on the packaging/assembly development of high power p

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46

Zhou, Gangyi. "Research on the Reliability Methods of SiC MOSFET Power Devices." Applied and Computational Engineering 140, no. 1 (2025): 90–99. https://doi.org/10.54254/2755-2721/2025.21535.

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This paper addresses the application of SiC MOSFET devices in the field of power electronics, focusing on two key issues: short-circuit failure and avalanche failure. Corresponding solutions are proposed. SiC devices, with their high thermal stability and wide bandgap, have great potential in high-temperature environments such as new energy vehicles and high-speed trains. However, their reliability and stability remain challenges in research and application. This paper first analyzes the mechanisms of short-circuit failure and avalanche failure of SiC MOSFETs, then proposes a novel structure t

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47

Sawan, Mohamad, B. Gosselin, J. Coulombe, A. E. Ayoub, A. Chaudhuri, and F. Leporé. "Implantable Electronics for the Recovery of Neuromuscular Functions." Advances in Science and Technology 57 (September 2008): 204–9. http://dx.doi.org/10.4028/www.scientific.net/ast.57.204.

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This paper covers circuits and systems techniques for the construction of high reliability biosensing and stimulation medical devices. Such microsystems are dedicated for interconnections through either the central or the peripheral nervous systems. Low-power high-reliability wireless links are used to power up the implanted devices while data are exchanged bidirectionaly between these implants and external controllers. A global view of main devices is given, case studies related to applications such as bladder control, intracortical monitoring and microstimulation are discussed, altogether wi

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SHENAI, KRISHNA. "THE PERFECT POWER SEMICONDUCTOR SWITCH FOR 21st CENTURY GLOBAL ENERGY ECONOMY." Journal of Circuits, Systems and Computers 22, no. 10 (2013): 1340020. http://dx.doi.org/10.1142/s0218126613400203.

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A critical evaluation of high-power electronics switching in semiconductor materials is made from the standpoint of performance, reliability, and commercial viability. This study takes into account recent experimental results obtained from the field-reliability study of silicon power MOSFETs in high-density power supplies where residual material defects present in the space charge region of the device were found to generate local micro plasma that eventually caused power MOSFETs to fail. Based on these results and commercial progress made to date in wide bandgap semiconductor technologies, it

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Dhameliya, Niravkumar. "Power Electronics Innovations: Improving Efficiency and Sustainability in Energy Systems." Asia Pacific Journal of Energy and Environment 9, no. 2 (2022): 71–80. http://dx.doi.org/10.18034/apjee.v9i2.752.

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This study examines how power electronics advancements might alter energy system efficiency and sustainability. The main goals were to study wide bandgap (WBG) semiconductor materials, control algorithms, renewable energy integration, and future trends and problems. Synthesizing current knowledge and trends from peer-reviewed literature, conference papers, and industry reports was done using secondary data. Significant discoveries show that WBG semiconductors like SiC and GaN have superior electrical characteristics, improving power electronic device efficiency and reliability. Model predictiv

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Palmer, David W. "Test Structures as a Way to Evaluate Packaging Reliability." MRS Bulletin 18, no. 12 (1993): 55–58. http://dx.doi.org/10.1557/s0883769400039105.

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Electronics packaging has always accounted for about 50% of reliability shortcomings in electronics systems. Materials, processes, and geometries used in microelectronics packaging are quickly evolving to meet the commercial challenge for more reliable, lighter, smaller, cheaper devices, and lower power consumption. Amid the rapid evolution, methodology and metrology to measure package reliability and materials aging properties must be standardized to allow quantitative technology comparisons.What Is Packaging?For most purposes packaging can be thought of as everything involved in making an el

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