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Relevant bibliographies by topics / Printed Circuit Board (PCB)

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Books
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Academic literature on the topic 'Printed Circuit Board (PCB)'

Author: Grafiati

Published: 4 June 2021

Last updated: 26 July 2025

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Journal articles on the topic "Printed Circuit Board (PCB)"

1

Petkov, Nikolay, and Malinka Ivanova. "Printed circuit board and printed circuit board assembly methods for testing and visual inspection: a review." Bulletin of Electrical Engineering and Informatics 13, no. 4 (2024): 2566–85. http://dx.doi.org/10.11591/eei.v13i4.7601.

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Testing and visual inspection of printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) are important procedures in the manufacturing process of electronic modules and devices related to locating and identifying possible defects and failures. Earlier defects detection leads to decreasing expenses, time and used resources to produce high quality electronics. In this paper an exploration and analysis about the current research regarding methods for PCB and PCBA testing, techniques for defects detection and vusial inspection is performed. The impact of machine and deep learnin

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Hsia, Kuo-Hsien, and Jr-Hung Guo. "Estimation of the PCB Production Process Using a Neural Network." Proceedings of Engineering and Technology Innovation 15 (April 27, 2020): 01–07. http://dx.doi.org/10.46604/peti.2020.4265.

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Printed Circuit Boards (PCB) are an integral part of all electronic products, and the production process for printed circuit boards is quite complex. As the life cycle of electronic products becomes shorter and shorter, and the precision and signal bandwidth of electronic products become higher and higher, the manufacturing process of printed circuit boards is further complicated. Therefore, how to pre-evaluate the production difficulty before starting the production will effectively increase the efficiency and quality of printed circuit board production. Gerber file is the most commonly

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Khan, Noor Mohmmed, Shubhangi Patil, Tushar Diggewadi, and Anand Gudnavar. "Cinch and Sterling Analog Circuits for Laboratory." International Journal of Advanced Research in Electrical, Electronics and Instrumentation Engineering 6, no. 01 (2017): 51–58. http://dx.doi.org/10.15662/ijareeie.2017.0601007.

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As we know that there is ever increasing demand for compact circuits and less complex wirings over the board, a technological boon evolved for such demand is Printed Circuit Board (PCB). A PCB will mechanically supports and electrically connects electronic components using conductive tracks, pads. These boards will have minimal chances for short circuits, components on the board are fixed; another advantage is creation of multiple boards using single design. Taking this technology forward to our everyday life, we implemented analog communication laboratory circuit, Schmitt trigger.

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Pallavi, A. Gade, D. Wagh Ganesh, N. Sulakhe Vishal, D. Katkade Santosh, and Pravin Joshi Kaustubh. "PCB Cutting Machine." International Journal of Innovative Science and Research Technology 7, no. 9 (2022): 662–67. https://doi.org/10.5281/zenodo.7133876.

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The goal of this paper is about to assemble a printed circuit board-cutting machine. The contemporary evolution in digital technology particularly embedded systems have now enabled us to make designing and implementing an automatic printed circuit board-cutting machine. This machine takes Printed Circuit Board from one side and cut it into two separate pieces, in essential size and shape. This paper presents a simple way that will reduce human work and improves accuracy of cutting the printed circuit board. System will minimize PCB damage chances by blades using the fabrication and covering. C

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Noor Yulita Dwi Setyaningsih, Moh Rizal, and Budi Cahyo Wibowo. "CNC Plotter Printed Circuit Board." Jurnal Media Elektrik 21, no. 2 (2024): 116–22. http://dx.doi.org/10.59562/metrik.v21i2.2145.

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Prited Circuit Board is one part of the field of electronics that has many roles and benefits. This automatic PCB path manufacturing will provide many benefits to users that were previously still done manually. In this research, the PCB carving process will be operated using G-Code and GRBL controller to control the machine. The use of 3 stepper motors will provide a good carving composition in terms of x, y and Z axis movements, as well as the use of spindles for drill bit control that functions to carve PCB layouts. From the results, the PCB path manufacturing process is faster and has the a

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Wang, Qianyue. "A new frontier in electronics manufacturing: Optimized deep learning techniques for PCB image reconstruction." Applied and Computational Engineering 51, no. 1 (2024): 267–73. http://dx.doi.org/10.54254/2755-2721/51/20241591.

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In the rapidly evolving electronics manufacturing sector, maintaining quality control and conducting failure analysis of Printed Circuit Boards (PCBs) are critical yet challenging tasks. This study presents a groundbreaking self-supervised learning framework to address existing gaps in the reconstruction of encoded or blurred Printed Circuit Board images. By leveraging a customized DeepLabV3+ architecture with depth-wise separable convolutions, our model is engineered to autonomously learn intrinsic Printed Circuit Board features, eliminating the need for manual data labeling. This not only al

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Lambture, Rahul. "Printed Circuit Board (PCB) Fault Detection." International Journal for Research in Applied Science and Engineering Technology 12, no. 6 (2024): 542–48. http://dx.doi.org/10.22214/ijraset.2024.63142.

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Abstract: Nowadays many industries heavily depend on devices, those, with printed circuit boards (PCBs) to function properly. However issues like connections, damaged components or short circuits can cause malfunctions that result in downtime and financial losses. It is crucial to identify and resolve thesePCB faults to maintain the operation of electronic systems. On average businesses experience a 23% decrease in productivity due to PCB faults. One of the contributors to this problem is the lack of detection and resolution. To tackle this issue we propose an approach using machine learning t

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Myers, Sharon A., Troy D. Cognata, and Hugh Gotts. "FTIR analysis of printed-circuit board residue." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 264–65. http://dx.doi.org/10.1017/s0424820100163782.

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Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. The failure to boot was originally traced to a suspected bad microcontroller chip. Replacing this chip, or an oscillator tied to the microcontroller circuit, did not consistently solve the boot problem. With further testing, it was found the microcontroller circuit was very sensitive to resistance and was essentially shorted.A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resist

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Craven, Jeffery D., Ariel R. Oldag, and Robert N. Dean. "A Technique for Detecting Moisture Absorption in Printed Circuit Boards." Journal of Microelectronics and Electronic Packaging 17, no. 1 (2020): 28–33. http://dx.doi.org/10.4071/imaps.1014123.

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Abstract Most circuit boards operate in environments that have the potential to be exposed to moisture, either in vapor or liquid form. Because low-cost circuit boards can readily absorb moisture, this can lead to performance issues, reliability issues, and even catastrophic failure. However, it is difficult to detect if moisture absorption has occurred before the circuit board suffers a complete failure. To alleviate this issue, a fringing field capacitor was implemented in printed circuit board (PCB) technology and used to detect the absorption of moisture in the circuit board through the ac

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Jayasekar, Micheal. "PCB Advanced Via/Holes Technologies." PCB Advanced Via/Holes Technologies 9, no. 2 (2024): 12. https://doi.org/10.5281/zenodo.10656132.

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Printed Circuit Boards (PCBs) Via is the arrangement of different layers to make up a PCB. It involves determining the number of layers, their order, and the materials used for each layer. PCB Via is a plated hole in a circuit board that connects different layers of the board, allowing electrical signals and power to pass between them. They serve as electrical connections between different circuit board layers and help in efficiently routing signals and power. This article provides an in-depth understanding of PCB vias, discussing their types, design considerations, advanced Via technologies,

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Dissertations / Theses on the topic "Printed Circuit Board (PCB)"

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Chan, Ching-Yuen. "Cell controller for printed circuit board assembly rework." Thesis, University of Salford, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.386432.

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Wang, Lei. "Printed Circuit Board Design for Frequency Disturbance Recorder." Thesis, Virginia Tech, 2005. http://hdl.handle.net/10919/30917.

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<p>The FDR (Frequency Disturbance Recorder) is a data acquisition device for the power system. The device is portable and can be used with any residential wall outlet for frequency data collection. Furthermore, the FDR transmits calculated frequency data to the web for access by authorized users via Ethernet connection. As a result, Virginia Tech implemented Frequency Monitoring Network (FNET) with these FDR devices. FNET is a collection of identical FDRs placed in different measurement sites to allow for data integration and comparison. Frequency is an important factor for power system contro

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Sandron, Marco. "Mils - Stampante per la creazione di PCB (printed circuit board) con polimero." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2019. http://amslaurea.unibo.it/19757/.

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Nella mia carriera universitaria mi sono imbattuto in progetti che necessitavano di un circuito elettronico che in alcuni casi costituiva una parte fondamentale e che veniva valutata. Per la realizzazione di questi circuiti è stata utilizzata l’elettronica open source, di conseguenza è stato necessario collegare tra di loro varie schede e anche alcuni componenti. Questi collegamenti non potevano essere eseguiti solo con semplici cavi elettrici ma necessitavano si supporti fisici anche per posizionare in modo ordinato i componenti e sono state utilizzate perciò basette millefori. I collegament

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maamoun, Adam. "A SURROGATE MEASURE OF CUSTOMER SATISFACTION IN THE MANUFACTURE OF PRINTED WIRING BOARDS." Doctoral diss., University of Central Florida, 2008. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/2428.

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The objective of this research is to determine and develop a model that is capable of accurately measuring customer satisfaction for different industries and in particularly for the Printed Wiring Boards (PWB) Manufacturers. The new model will incorporate data not being collected or utilized by the survey method of determining customer satisfaction. The method used is a weighted average of satisfaction among several researched categories with percentages that accurately represent the relative importance of multiple facets of the PWB manufacturers customer satisfaction. A very common term in qu

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Rajagopal, Abhilash. "Printed circuit board (PCB) loss characterization up-to 20 GHz and modeling, analysis and validation." Diss., Rolla, Mo. : University of Missouri-Rolla, 2007. http://scholarsmine.umr.edu/thesis/pdf/Rajagopal_09007dcc803bf920.pdf.

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Thesis (M.S.)--University of Missouri--Rolla, 2007.<br>Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed November 26, 2007) Includes bibliographical references (p. 112-113).

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Subbarayan, Guhan. "A systematic approach for selection of best PB-free printed circuit board (PCB) surface finish." Diss., Online access via UMI:, 2007.

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Ahmed, Ahmed Sabry Eltaher. "High-performance cooling of power semiconductor devices embedded in a printed circuit board." Electronic Thesis or Diss., Lyon, INSA, 2024. http://www.theses.fr/2024ISAL0100.

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L'intégration de dispositifs semi-conducteurs de puissance dans un circuit imprimé (PCB) est une solution prometteuse pour réduire les éléments parasites des circuits, simplifier le packaging des dispositifs et réduire les coûts. Cependant, la réduction continue de la taille des puces semi-conductrices, combinée à la faible conductivité thermique des couches diélectriques des PCB nécessitent des solutions de gestion thermique plus efficaces. Les solutions de gestion thermique et de refroidissement doivent offrir une faible résistance thermique entre la jonction de la puce et son environnement,

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Caillaud, Rémy. "Integration of a 3.3 kW, AC/DC bidirectional converter using printed circuit board embedding technology." Thesis, Lyon, 2019. http://www.theses.fr/2019LYSEI001/document.

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Les énergies fossiles (Pétrole, Charbon, …) représentent 80 % des énergies consommés. Malheureusement pour l’environnement, elles sont les plus polluantes. Le remplacement actuel des énergies fossiles permet au marché de l’électronique de puissance de grandir d’année en année. L’électronique de puissance permet d’adapter l’énergie électrique à son utilisation finale. Dans la pratique, l’adaptation de l’énergie électrique utilise des convertisseurs. En plus de respecter le volume, l’efficacité et la fiabilité imposés par le cahier des charges pour chaque application, l’électronique de puissance

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Zhang, Jingbing. "On flexibly integrating machine vision inspection systems in PCB manufacture." Thesis, Loughborough University, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.314613.

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Machuca, Julían, and Thomas Tuvesson. "PCB design of Power Distributor Unit (PDU)." Thesis, Uppsala universitet, Institutionen för elektroteknik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-415474.

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The project idea was created from the demand of a renewal for a Power Distributor Unit also known as a PDU. The current product had successively turned in to a cable mess because of short term solutions. This made the product non user friendly, inconvenient and non-agile to handle troubleshooting. To develop this project, a PCB design was created by simplifying and improving circuit diagrams until satisfied. Once the final circuit diagram was obtained, a PCB layout design was created. The result of the project, due to limited time, was only theoretical. The finished product was not tested as t

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Books on the topic "Printed Circuit Board (PCB)"

1

Beaulieu, Dan. Printed circuit board basics: An introduction to the PCB industry. 4th ed. UP Media Group, 2003.

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Theresa, Kiko, ed. Printed circuit board basics: An introduction to the PCB industry. 2nd ed. Miller Freeman, 1992.

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Laura, Scholten, ed. PCB preproduction tooling: Preproduction automation and intelligent tooling for printed circuit board manufacturing. Miller Freeman Books, 1994.

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4

Hossain, Akram. Computer-aided electronic circuit board design and fabrication: Using OrCAD/SDT and OrCAD/PCB software tools. Prentice Hall, 1996.

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5

Stanton, Martin Gray. Printed circuit board manual: How to design, make and assemble top quality PCBs using inexpensive equipment. Frank Stanton, 1988.

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Noble, P. J. W. Printed circuit board assembly. Springer US, 1989. http://dx.doi.org/10.1007/978-1-4684-6234-0.

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W, Jawitz Martin, ed. Printed circuit board materials handbook. McGraw-Hill, 1997.

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Castrovilla, Joseph A. The printed circuit board industry. Business Communications Co., 1985.

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9

inc, International Resource Development, ed. Printed circuit board market opportunities. International Resource Development Inc., 1986.

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Montrose, Mark I. EMC and the Printed Circuit Board. John Wiley & Sons, Inc., 1998. http://dx.doi.org/10.1002/047172310x.

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Book chapters on the topic "Printed Circuit Board (PCB)"

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Archambeault, Bruce R. "Printed Circuit Board Layout." In PCB Design for Real-World EMI Control. Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-3640-3_11.

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Pau, L. F. "Printed Circuit Board (PCB) Inspection." In Computer Vision for Electronics Manufacturing. Springer US, 1990. http://dx.doi.org/10.1007/978-1-4613-0507-1_11.

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Tran, Thanh T. "Printed Circuit Board (PCB) Layout." In High-Speed DSP and Analog System Design. Springer US, 2010. http://dx.doi.org/10.1007/978-1-4419-6309-3_10.

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Tran, Thanh T. "Printed Circuit Board (PCB) Layout." In High-Speed System and Analog Input/Output Design. Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-04954-5_14.

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Ning, Chao, Carol Sze Ki Lin, David Chi Wai Hui, and Gordon McKay. "Waste Printed Circuit Board (PCB) Recycling Techniques." In Topics in Current Chemistry Collections. Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-90653-9_2.

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Dumpert, Dwight T. "Infrared Techniques for Printed Circuit Board (PCB) Evaluation." In Infrared Methodology and Technology. CRC Press, 2023. http://dx.doi.org/10.1201/9781003420200-9.

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Kaya, Muammer. "Printed Circuit Boards (PCBs)." In Electronic Waste and Printed Circuit Board Recycling Technologies. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-26593-9_2.

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Kamaruddin, Shafie, Saiffaqrullah Shamsulamri, Muhammad Haziq Fakhri Sharwazi, et al. "An Automated Printed Circuit Board (PCB) Defects Detection System." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2025. https://doi.org/10.1007/978-981-96-3814-7_41.

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Goosey, Martin. "Polymers in Printed Circuit Board (PCB) and Related Advanced Interconnect Applications." In Plastics for Electronics. Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-017-2700-6_9.

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Arumugam, M., G. Arun, R. Mekala, and K. Anusuya. "Detection of Printed Circuit Board (PCB) Defects Using Deep Learning Approach." In Lecture Notes in Networks and Systems. Springer Nature Singapore, 2024. https://doi.org/10.1007/978-981-97-7710-5_24.

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Conference papers on the topic "Printed Circuit Board (PCB)"

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Ju, Huafang, Jimmy Hsu, Meng Wang, et al. "Enhancing Printed Circuit Board (PCB) Electrical Characteristics under Immersion Cooling Condition." In 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2024. https://doi.org/10.1109/impact63555.2024.10818954.

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Zeng, Qi, Chongren Zhao, Pengfei He, and Hongchao Gao. "LSDM-PCB: A Lightweight Small Defect Detection Model for Printed Circuit Board." In 2024 IEEE International Conference on Image Processing (ICIP). IEEE, 2024. http://dx.doi.org/10.1109/icip51287.2024.10647590.

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Craig, Patrick, Jonathan Pearson, Shajib Ghosh, Nitin Varshney, Sanjeev J. Koppal, and Navid Asadizanjani. "Optical Automated Interconnect Inspection of Printed Circuit Boards." In ISTFA 2024. ASM International, 2024. http://dx.doi.org/10.31399/asm.cp.istfa2024p0022.

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Abstract In critical fields such as automotive, medicine, and defense, ensuring the reliability of microelectronics has been paramount given the extensive nature of their globalized supply chain. Automated visual inspection (AVI) of printed circuit boards (PCBs) offers a solution through computer vision and deep learning to automate defect detection, component verification, and quality assurance. In this paper, our research follows this precedent by introducing a novel dataset and annotations to train artificial intelligence (AI) models for extracting PCB connectivity components. Utilizing hig

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Park, Junyong, Chaofeng Li, Eddie Mok, Joe Dickson, Joan Tourné, and Donghyun Bill Kim. "Vertical Interconnect Technology in Silicon, Package, and Printed Circuit Board (PCB) with Coaxial Structure." In 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI). IEEE, 2024. http://dx.doi.org/10.1109/emcsipi49824.2024.10705593.

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Slee, Daren T. "Printed Circuit Board Propagating Faults." In ISTFA 2004. ASM International, 2004. http://dx.doi.org/10.31399/asm.cp.istfa2004p0436.

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Abstract This paper is a review of propagating faults in printed circuit boards (PCBs) from the perspective of using the resulting burn and melted copper patterns to identify likely locations of fault initiation. Visual examination and x-ray imaging are the main techniques for examining PCB propagating faults. Once the likely fault initiation location has been identified, fault tree analysis can be used to determine the root cause for fault initiation. The paper discusses the mechanisms by which PCB propagating faults occur. The method of determining the likely area of initiation of the fault

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Huang, Chien-Yi, Chen-Liang Ku, Hao-Chun Hsieh, Tzu-Min Chien, and Hui-Hua Huang. "Reliability Assessment for Printed Circuit Board in Lead-Free Process." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89253.

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This study aimed to explore Printed Circuit Board (PCB) failure mechanism and recommend appropriate material and handling process for the boards used in lead-free assembly process. In this study, the most stringent conditions in Printed Circuit Board Assembly (PCBA) process was used for various base-materials of PCB, such as Tg, and curing agent. In addition, thermal shock testing at 0∼100°C for 900 cycles was employed to simulate PCB performance during field service. Cross-section analysis was implemented to identify failure modes. Finally, the PCB moisture absorption property was evaluated b

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Iyengar, Anirudh, Nareen Vobilisetti, and Swaroop Ghosh. "Authentication of Printed Circuit Boards." In ISTFA 2016. ASM International, 2016. http://dx.doi.org/10.31399/asm.cp.istfa2016p0605.

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Abstract Printed Circuit Boards (PCBs) are easy target for reverse engineering and counterfeiting attacks due to the distributed supply chain. The integrated circuits (ICs) authentication techniques such as Physically Unclonable Function (PUF) are not easily extendible to PCBs. In this paper, we analyze various sources of variations in PCB and qualitatively study the quality metrics that can be used to quantify the PCB PUFs. We propose several flavors of PCB PUFs by exploiting the manufacture process variations. We also propose a multi-stage arbiter PUF with exponential challenge response pair

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Bachoo, Richard, Shurland Balliram, and Jacqueline Bridge. "EXPERIMENTAL AND NUMERICAL VIBRATION ANALYSIS OF PRINTED CIRCUIT BOARDS." In International Conference on Emerging Trends in Engineering & Technology (IConETech-2020). Faculty of Engineering, The University of the West Indies, St. Augustine, 2020. http://dx.doi.org/10.47412/umtw9840.

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Printed circuit boards (PCBs) are important modules which are incorporated in a wide range of industrial equipment and machinery for the purpose of control or signal manipulation applications. PCBs situated in dynamic environments may be prone to failure from excessive amounts of cyclical stresses arising from harmonic or random vibration sources. The ability to numerically model and predict the dynamic behaviour of PCBs and associated components is therefore a valuable tool for analysts concerned with PCB reliability. In this paper, experimental vibration analysis and the finite element metho

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Pargas Jr., Ricardo, Mariana Sigala, and Luis Alvarez. "Printed Circuit Board (PCB) Electrical Characterization." In Sponsor: University of Texas El Paso, El Paso, TX Name of Event: Senior Design Poster Session Date: May 9, 2025. US DOE, 2025. https://doi.org/10.2172/2565721.

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Wang, Mu-Chun, Zhen-Ying Hsieh, Ting-Yu Yang, Chia-Hao Tu, and Shuang-Yuan Chen. "Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70093.

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The semiconductor process technology and the circuit design concept are continuously improved at the recent era. The product cost is gradually decreased, too. The commercial electronic products generally cover ICs, external components and printed circuit board (PCB). After the circuit layout blueprints are completed, engineers will transfer them into PCB as a prototype. The next step is to integrate some contributed electronic components to form a functional product. This second step is called as PCB assembly (PCBA). However, the bigger copper area on PCB will provide a good thermal dissipatio

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Reports on the topic "Printed Circuit Board (PCB)"

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Booth, Janice C., Tracy Hudson, Brian A. English, Michael R. Whitley, and Michael S. Kranz. Integrated Printed Circuit Board (PCB) Active Cooling With Piezoelectric Actuator. Defense Technical Information Center, 2012. http://dx.doi.org/10.21236/ada567661.

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Bacon, L. D., and R. P. Toth. LineCAP (Line/Circuit Analysis Program): Cross-coupling on PC (printed circuit) board traces including discontinuities and circuit elements. Office of Scientific and Technical Information (OSTI), 1989. http://dx.doi.org/10.2172/6038898.

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Anderson, J. T. Document Template for Printed Circuit Board Layout. Office of Scientific and Technical Information (OSTI), 1998. http://dx.doi.org/10.2172/1032099.

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Holder, Darryl. Prototype and Short-Run Printed Circuit Board Creation. Defense Technical Information Center, 1993. http://dx.doi.org/10.21236/ada263245.

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Nestleroth. L52298 Augmenting MFL Tools With Sensors that Assess Coating Condition. Pipeline Research Council International, Inc. (PRCI), 2009. http://dx.doi.org/10.55274/r0010396.

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External coatings are routinely used to protect transmission pipelines from corrosion; however, coatings may degrade or disbond over time enabling corrosion to occur. Transmission pipeline operators often use magnetic flux leakage (MFL) in-line inspection tools to detect metal loss corrosion defects. Rather than finding the cause of a problem, failure of the coating within a corrosive environment, MFL corrosion surveys only find the result of the problem, corrosion defects that may permanently alter the pressure carrying capacity of the pipeline. Stress corrosion cracking (SCC) can be detected

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Edwards, H. W., M. F. Kostrzewa, and G. P. Looby. Pollution prevention assessment for a printed circuit board plant. Office of Scientific and Technical Information (OSTI), 1995. http://dx.doi.org/10.2172/125058.

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Neilsen, Michael K., Kevin N. Austin, Douglas Brian Adolf, Scott W. Spangler, Matthew Aaron Neidigk, and Robert S. Chambers. Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses. Office of Scientific and Technical Information (OSTI), 2011. http://dx.doi.org/10.2172/1022184.

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Holloway, Christopher, and Edward Kuester. Analysis and calculations of the ground plane inductance associated with a printed circuit board. Institute for Telecommunication Sciences, 1997. https://doi.org/10.70220/59xzbgt2.

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Oxley, J. E., and R. J. Smialek. Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Final report, August 1, 1995--October 31, 1996. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/510548.

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HEWITT AND ASSOCIATES INC ALBUQUERQUE NM. EM Visualization of Printed Circuit Board Assemblies. A Phase 1 SBIR on behalf of USAF; SA-ALC/LDAE. Defense Technical Information Center, 1994. http://dx.doi.org/10.21236/ada293355.

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