Relevant bibliographies by topics / Printed circuit test

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Printed circuit test'

Author: Grafiati
Published: 4 June 2021
Last updated: 17 February 2022

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Journal articles on the topic "Printed circuit test"

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Kim, Ernest M., and Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice." International Journal of Electrical Engineering & Education 54, no. 3 (2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.

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Over a 2-year period, printed circuit board layout design and test were included in the laboratory portion of the second of two junior-level electronic circuits courses. Printed circuit board design using industry-accepted board specifications and standard industry Gerber file export experience was developed. The students’ printed circuit board design experience emulated real-world situations and cost criteria. The instructor served as the fabricator in this model of the industrial design situation. Students individually used industry standard schematic capture and layout software to develop a
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Kostin, M. S., D. S. Vorunichev, and D. A. Korzh. "COUNTERREENGINEERING OF ELECTRONIC DEVICES." Russian Technological Journal 7, no. 1 (2019): 57–79. http://dx.doi.org/10.32362/2500-316x-2019-7-1-57-79.

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The paper presents the main results of scientific and practical research in the field of special design reengineering and counterreengineering of radioelectronic devices. Methods and means of special design reengineering of functional modules of multilayer printed circuit boards and case microcircuits are presented. The basic process design for the reengineering of multilayer printed circuits of radioelectronic products is presented. The design is based on the physical principles of destructive and non-destructive decomposing test: mechanical processing and chemical etching, stereolaser struct
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Lawlor-Wright, Therese, and Charles Gallagher. "Development of a printed circuit board design for in-circuit test advisory system." Computers in Industry 33, no. 2-3 (1997): 253–59. http://dx.doi.org/10.1016/s0166-3615(97)00031-6.

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Myers, Sharon A., Troy D. Cognata, and Hugh Gotts. "FTIR analysis of printed-circuit board residue." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 264–65. http://dx.doi.org/10.1017/s0424820100163782.

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Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. The failure to boot was originally traced to a suspected bad microcontroller chip. Replacing this chip, or an oscillator tied to the microcontroller circuit, did not consistently solve the boot problem. With further testing, it was found the microcontroller circuit was very sensitive to resistance and was essentially shorted.A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resist
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Miles, J. J., C. R. Zelak, J. M. Kliman, and J. E. Sunderland. "Integrated Infrared Failure Analysis of Printed Circuit Boards." Journal of Electronic Packaging 117, no. 4 (1995): 288–93. http://dx.doi.org/10.1115/1.2792107.

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A method is presented to test automatically for latent faults, those which elude detection during conventional electronic testing, on printed circuit boards. Testing is intended for implementation in a volume manufacturing environment and involves the application of infrared imaging tools. Successful incorporation of infrared testing into existing test processes requires that: a procedure for handling variable radiation heat transfer properties across a printed circuit board be developed; a thermally-controlled test enclosure be provided; PASS/FAIL criteria be established. These tasks are addr
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ITO, Kenichi. "Necessity of the Immunity Test about the Printed Circuit Board." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, no. 7 (1995): 477–81. http://dx.doi.org/10.5104/jiep1995.10.477.

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Xu, Xianxin, Ping Yang, Haiqing Dong, et al. "Dynamic properties analysis and test of SMT printed circuit board assembly." International Journal of Materials and Structural Integrity 4, no. 2/3/4 (2010): 238. http://dx.doi.org/10.1504/ijmsi.2010.035208.

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CHOU, WEN-YANG, and MING-JONG TSAI. "FLEXIBLE WIRELESS MODULE FOR ELECTROCARDIOGRAM MONITORING." Biomedical Engineering: Applications, Basis and Communications 23, no. 04 (2011): 319–24. http://dx.doi.org/10.4015/s1016237211002670.

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The rigidity of printed circuit boards (PCB) constrains the assembly and utility of most existing electrocardiogram (ECG) circuits. Moreover, the literature seldom discusses electromagnetic compatibility (EMC) in the context of ECGs. This paper presents a wireless ECG module built on a flexible printed circuit board (FPCB) and EMC measurement. A flexible wireless module for ECG signals monitoring was designed with high input impedance, a high common-mode rejection ratio (CMRR), low-power consumption, and appropriate amplification and filtration, which automatically cancels offset voltage. The
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Frick, M., R. Eidher, and R. Weigel. "Coupling path influence on the conducted emission measurement results by the EMC semiconductor test board." Advances in Radio Science 9 (August 1, 2011): 303–8. http://dx.doi.org/10.5194/ars-9-303-2011.

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Abstract. The fact of reduced development time in the automotive sector requires a change in the electromagnetic compatibility (EMC) validation of electronic components. To increase the development time of automotive components, e.g. sensors or electronic control units (ECUs), it is mandatory to verify the EMC behavior of the integrated circuit (IC) itself in an early development stage simultaneous to the development process of the entire ECU into which it is embedded. The conducted IC EMC tests emission as well as immunity is realized with a specific test printed circuit board (PCB) which is
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Weller, S. D. T., I. P. Jones, Ian M. Fox, and Terry Hirst. "High Reliability Pb-Free Printed Circuit Board Assembly." Key Engineering Materials 450 (November 2010): 9–12. http://dx.doi.org/10.4028/www.scientific.net/kem.450.9.

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The solderability and reliability of SnAgCu and SnAgCuSbBiNi lead-free solders were assessed against SnPbAg solder on a range of PCB finishes. A novel solderability test has been developed to assess the solder system’s ability to realign when a deliberately inaccurate solder stencil printing process was applied. This has shown to be an excellent way to compare PCB finishes and solders, as well as define process parameters. Electroless Nickel Immersion Gold (ENIG) finish proved to give the best solderability and the optimum process parameters were also found. SnPbAg solder has shown superior th
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Dissertations / Theses on the topic "Printed circuit test"

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Kelly, Richard Thevenet. "DETERMINING COST EFFECTIVE TEST FLOWS FOR DIGITAL PRINTED CIRCUIT BOARDS." Thesis, The University of Arizona, 1985. http://hdl.handle.net/10150/275385.

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Gallagher, Charles. "The integrated design of printed circuit boards and their in-circuit test fixtures." Thesis, University of Salford, 1996. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.308112.

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Seremet, Slavko. "Electrostatic simulation of a contactless test system for printed circuit boards." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk2/tape17/PQDD_0012/MQ32245.pdf.

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Simlissi, Essossinam. "Modeling of delamination and interface strength in printed circuit boards." Electronic Thesis or Diss., Université de Lorraine, 2019. http://www.theses.fr/2019LORR0326.

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Dans cette thèse, la résistance des interfaces dans les circuits imprimés (PCB) est étudiée. Un PCB est un élément passif permettant d’interconnecter des composants électroniques soudés sur les couches externes. Un PCB est un assemblage multicouche, multi-matériaux fait de composites tissés et de feuillards de cuivre. Le cuivre joue un rôle majeur dans les circuits imprimés car il est le support de l’information électrique. Pendant son cycle de vie, le PCB subit un grand nombre de cycles thermiques pouvant entraîner la rupture des fûts de cuivre. Par ailleurs, l’utilisation de certaines combin
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Nguyen, Minh Tam Tran. "Reliability Assessment of Ion Contamination Residues on Printed Circuit Board." Scholar Commons, 2013. http://scholarcommons.usf.edu/etd/4551.

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Ion contaminants from Printed Circuit Board (PCB) assembly processes pose a high reliability risk because they result in damaged circuits. Therefore, it is essential to understand the level of ionic species on the electronic circuitry as well as the reliability risks caused by these contaminants. There are a number of approaches available in the industry to assess the reliability risks ; for example, the water drop test (WDT) is one of the techniques used to determine the propensity of an ionic contaminant to cause electrical short failures by dendrite formation. The objective of this research
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Dick, Jochen Helmut. "Cost modelling and concurrent engineering for testable design." Thesis, Brunel University, 1993. http://bura.brunel.ac.uk/handle/2438/5284.

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As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can
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Wegman, Kevin R. "Numerical Modeling of a Printed Circuit Heat Exchanger Based on Experimental Results from the High-Temperature Helium Test Facility." The Ohio State University, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=osu1461266010.

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Goad, Kenneth G. "Integration of an X-Y prober with CAD driven database and test generation software for the testing of printed circuit boards." Thesis, Virginia Tech, 1987. http://hdl.handle.net/10919/45664.

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<p>Guided probe testing of printed circuit boards is a technique that has been well developed by automatic test equipment manufacturers to pinpoint faults. Though the guided probe technique of testing printed circuit boards is a process capable of providing high diagnostic resolution, the technique is inefficient when it is performed manually. The throughput of board testing is bottlenecked because of the time required for an operator to manually move a probe to a specific location on the board under test in order to measure a stimulated response. Integration of a CAD driven X-Y prober i
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Aalto, Alve, and Ali Jafari. "Automatic Probing System for PCB : Analysis of an automatic probing system for design verification of printed circuit boards." Thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-174865.

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The purpose of this thesis is to conduct an analysis of whether the printed circuit boards from Ericsson can be tested using an automatic probing system or what changes in the design are required, to be a viable solution. The main instrument used for analyzing the printed circuit board was an oscilloscope. The oscilloscope was used to get the raw data for plotting the difference between the theoretical and actual signals. Connected to the oscilloscope was a 600A-AT probe from LeCroy. The programs used for interpreting the raw data extracted from the oscilloscope included Python, Matlab and Exc
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Rosenkvist, Daniel, and Johan Eriksson. "Design and test of SiC circuit board for MIST satellite : KTH Student Satellite MIST." Thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-210666.

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This paper describes work related to the “Miniature Student Satellite” (MIST) project and the ”SiC in Space” project, located at KTH, Stockholm, Sweden. The goal of the MIST project is to launch KTH’s first student satellite into space, carrying multiple scientific experiments where SiC in Space is included. This thesis contains a compilation of three MIST-related bachelor theses that were carried out at KTH in the spring of 2016, primarily consisting of constructing and testing circuits for power supply and measurements for the SiC in Space part of the satellite. A printed circuit board has b
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Books on the topic "Printed circuit test"

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Inc, Zehntel, ed. Strategies for electronics test. McGraw-Hill, 1986.

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Building a succesful board-test strategy. Butterworth-Heinemann, 1995.

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Scheiber, Stephen F. Building a successful board-test strategy. 2nd ed. Butterworth Heinemann, 2001.

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Scheiber, Stephen F. Building a successful board-test strategy. 2nd ed. Butterworth-Heinemann, 2001.

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Scheiber, Stephen F. Building a successful board-test strategy. Butterworth-Heinemann, 1995.

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Jellison, Jane. Evaluation of multilayer printed wiring boards by metallographic techniques: An illustrated guide to the preparation and inspection of plated-through hole test coupons based on the requirements of MIL-P-55110D. National Aeronautics and Space Administration, Scientific and Technical Information Branch, 1986.

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Management of electronics assembly: Design, development, production, test. Newnes, 1992.

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den, Eijnden Peter van, and Jong Frans de, eds. Boundary-scan test: A practical approach. Kluwer Academic Publishers, 1993.

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Standard for a Mixed Signal Test Bus. IEEE Standards Office, 2000.

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IEEE Computer Society. Test Technology Technical Committee., Institute of Electrical and Electronics Engineers., and IEEE-SA Standards Board, eds. IEEE standard for a mixed-signal test bus. Institute of Electrical and Electronics Engineers, 2000.

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Book chapters on the topic "Printed circuit test"

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Pradarelli, Beatrice, Pascal Nouet, and Laurent Latorre. "Problem-Based Learning Approach to Teach Printed Circuit Boards Test." In Interactive Collaborative Learning. Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-50337-0_4.

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Ju, Chengyu, Xiaohui Wang, Run Zhu, and Xiaoming Ren. "Comparative Analysis of Printed Circuit Board Coating on Corrosion Test." In Lecture Notes in Mechanical Engineering. Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-09507-3_115.

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Ju, Chengyu, Xiaohui Wang, Run Zhu, and Xiaoming Ren. "The Influence of Corrosion Test on Performances of Printed Circuit Board Coatings." In Lecture Notes in Mechanical Engineering. Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-09507-3_114.

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Bhunia, Swarup, and Mark Tehranipoor. "Printed Circuit Board (PCB): Design and Test." In Hardware Security. Elsevier, 2019. http://dx.doi.org/10.1016/b978-0-12-812477-2.00009-5.

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Brindley, Keith. "Test and inspection of printed circuit boards." In Newnes Electronics Assembly Pocket Book. Elsevier, 1991. http://dx.doi.org/10.1016/b978-0-7506-0222-8.50076-4.

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Hongbiao, Yu. "Noise Characteristic Analysis of Multi-Port Network in Phased Array Radar." In Modern Printed-Circuit Antennas. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.91198.

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Noise figure and noise power are detailedly analyzed and deduced in theory for multi-port network in active phased array radar. The mathematical expressions of output noise power and noise figure of network are given out under various conditions. Accordingly, this provides a basis of theories for multi-port network and radar receiver system design, the test method of array noise figure. Finally, two application examples are given to verify the accuracy of the formulae. Making use of these formulas, the designer can use to calculate the dynamic range of the radar receive system, and the designer can also constitute a measure scheme of the array noise figure for active phased array radar.
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Atanasov, Nikolay, Gabriela Atanasova, and Blagovest Atanasov. "Wearable Textile Antennas with High Body-Antenna Isolation: Design, Fabrication, and Characterization Aspects." In Modern Printed-Circuit Antennas. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.91143.

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This chapter provides a brief overview of the types of wearable antennas with high body-antenna isolation. The main parameters and characteristics of wearable antennas and their design requirements are discussed. Next, procedures (passive and active) to test the performance of wearable antennas are presented. The electromagnetic properties of the commercially available textiles used as antenna substrates are investigated and summarized here, followed by a more detailed examination of their effects on the performance of wearable antennas with high body-antenna isolation. A trade-off between substrate electromagnetic properties and resonant frequency, bandwidth, radiation efficiency, and maximum gain is presented. Finally, a case study is presented with detailed analyses and investigations of the low-profile all-textile wearable antennas with high body-antenna isolation and low SAR. Their interaction with a semisolid homogeneous human body phantom is discussed. The simulations and experimental results from different (in free-space and on-body) scenarios are presented.
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Xie, Li, Lirong Zheng, and Geng Yang. "Hybrid Integration Technology for Wearable Sensor Systems." In Biomedical Engineering. IGI Global, 2018. http://dx.doi.org/10.4018/978-1-5225-3158-6.ch028.

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Personalized and pervasive healthcare devices help seamlessly integrate healthcare and wellness into the daily life, independent of time and space. Silicon Integrated Circuit (IC) has been used in many advanced healthcare applications due to the compact size and ultra-low power consumption. Meanwhile, printed electronics (PE) is considered as a promising approach enabling cost-effective manufacturing of thin, flexible, and light-weight devices. A hybrid integration of IC and PE provides a new solution for the future wearable healthcare devices. In this chapter, firstly a customized bio-sensing IC is demonstrated, which can detect and process various bio-signals; secondly, the feasibility and performance of using inkjet printing technology as enabling technology has been examined for the fabrication of flexible bio-sensing devices. Finally, a wearable and flexible Bio-Patch is presented by leveraging hybrid integration of PE and bio-sensing IC. In-vivo test results show that the flexible Bio-Patch provides high quality ECG signal comparable with the one gained by bedside ECG machine.
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Xie, Li, Lirong Zheng, and Geng Yang. "Hybrid Integration Technology for Wearable Sensor Systems." In Internet of Things and Advanced Application in Healthcare. IGI Global, 2017. http://dx.doi.org/10.4018/978-1-5225-1820-4.ch004.

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Personalized and pervasive healthcare devices help seamlessly integrate healthcare and wellness into the daily life, independent of time and space. Silicon Integrated Circuit (IC) has been used in many advanced healthcare applications due to the compact size and ultra-low power consumption. Meanwhile, printed electronics (PE) is considered as a promising approach enabling cost-effective manufacturing of thin, flexible, and light-weight devices. A hybrid integration of IC and PE provides a new solution for the future wearable healthcare devices. In this chapter, firstly a customized bio-sensing IC is demonstrated, which can detect and process various bio-signals; secondly, the feasibility and performance of using inkjet printing technology as enabling technology has been examined for the fabrication of flexible bio-sensing devices. Finally, a wearable and flexible Bio-Patch is presented by leveraging hybrid integration of PE and bio-sensing IC. In-vivo test results show that the flexible Bio-Patch provides high quality ECG signal comparable with the one gained by bedside ECG machine.
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Xie, Li, Lirong Zheng, and Geng Yang. "Hybrid Integration Technology for Wearable Sensor Systems." In Wearable Technologies. IGI Global, 2018. http://dx.doi.org/10.4018/978-1-5225-5484-4.ch008.

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Personalized and pervasive healthcare devices help seamlessly integrate healthcare and wellness into the daily life, independent of time and space. Silicon Integrated Circuit (IC) has been used in many advanced healthcare applications due to the compact size and ultra-low power consumption. Meanwhile, printed electronics (PE) is considered as a promising approach enabling cost-effective manufacturing of thin, flexible, and light-weight devices. A hybrid integration of IC and PE provides a new solution for the future wearable healthcare devices. In this chapter, firstly a customized bio-sensing IC is demonstrated, which can detect and process various bio-signals; secondly, the feasibility and performance of using inkjet printing technology as enabling technology has been examined for the fabrication of flexible bio-sensing devices. Finally, a wearable and flexible Bio-Patch is presented by leveraging hybrid integration of PE and bio-sensing IC. In-vivo test results show that the flexible Bio-Patch provides high quality ECG signal comparable with the one gained by bedside ECG machine.
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Conference papers on the topic "Printed circuit test"

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Chu, B. "Solder Bead on High Density Interconnect Printed Circuit Board." In 2008 IEEE International Test Conference. IEEE, 2008. http://dx.doi.org/10.1109/test.2008.4700590.

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Arabi, F., A. Gracia, J. Y. Deletage, and H. Fremont. "Vibration test and simulation of printed circuit board." In 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2018. http://dx.doi.org/10.1109/eurosime.2018.8369909.

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Fattori, M., I. A. Fijn, L. Hu, E. Cantatore, F. Torricelli, and M. Charbonneau. "Circuit Design and Design Automation for Printed Electronics." In 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE, 2019. http://dx.doi.org/10.23919/date.2019.8715095.

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Embree, Todd, Deassy Novita, Gary Long, and Satish Parupalli. "Printed Circuit Board Pad Crater Test Methods and Sample Design." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-85562.

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The continual drive toward smaller second level interconnect dimensions, along with the introduction of Halogen-Free circuit board materials and increased process temperatures of Lead-Free solders, have all contributed to a more frequent occurrence of Pad Crater damage in circuit board materials during manufacturing and test processes. This paper addresses the methodology and test data of some common industry methods used to evaluate Pad Crater strength in circuit board materials. Pad Crater test data is highly sensitive to sample design; as a result a discussion of sample design criteria is a
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Nguyen, Thao, and Navid Rezvani. "Printed Circuit Board Assembly Test Process and Design for Testability." In 2008 9th International Symposium of Quality of Electronic Design (ISQED). IEEE, 2008. http://dx.doi.org/10.1109/isqed.2008.4479804.

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Yang, Ying. "Reliabilities and Failure Analysis of Printed Circuit Boards Interconnect Stress Test." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480543.

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Jones, Thomas D. A., David Flynn, and Marc P. Y. Desmulliez. "Megasound acoustic surface treatment process in the Printed Circuit Board industry." In 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE, 2016. http://dx.doi.org/10.1109/dtip.2016.7514855.

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Meza Escobar, J. H., J. SachBe, S. Ostendorff, and H. D. Wuttke. "Automatic generation of an FPGA based embedded test system for printed circuit board testing." In 2012 13th Latin American Test Workshop - LATW. IEEE, 2012. http://dx.doi.org/10.1109/latw.2012.6261241.

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Zhu, Run, Xiaohui Wang, and Xiaoming Ren. "The accelerated degradation test and evaluation methods for printed circuit board coatings." In 2014 Prognostics and System Health Management Conference (PHM-2014 Hunan). IEEE, 2014. http://dx.doi.org/10.1109/phm.2014.6988218.

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Mylavarapu, Sai K., Xiaodong Sun, Justin Figley, Noah J. Needler, and Richard N. Christensen. "Investigation of Printed Circuit Heat Exchangers for VHTRs." In Fourth International Topical Meeting on High Temperature Reactor Technology. ASMEDC, 2008. http://dx.doi.org/10.1115/htr2008-58097.

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Very High Temperature Reactors (VHTRs) require high temperature (900–950 °C), high integrity, and high efficiency heat exchangers during normal and off-normal conditions. A class of compact heat exchangers, namely, the Printed Circuit Heat Exchangers (PCHEs), made of high temperature materials, found to have the above characteristics, are being increasingly pursued for heavy duty applications. A high-temperature helium experimental test facility, primarily aimed at investigating the heat transfer and pressure drop characteristics of the PCHEs, was designed and is being built at the Ohio State
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