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Journal articles on the topic 'Printed circuit test'

Author: Grafiati

Published: 4 June 2021

Last updated: 17 February 2022

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1

Kim, Ernest M., and Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice." International Journal of Electrical Engineering & Education 54, no. 3 (2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.

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Over a 2-year period, printed circuit board layout design and test were included in the laboratory portion of the second of two junior-level electronic circuits courses. Printed circuit board design using industry-accepted board specifications and standard industry Gerber file export experience was developed. The students’ printed circuit board design experience emulated real-world situations and cost criteria. The instructor served as the fabricator in this model of the industrial design situation. Students individually used industry standard schematic capture and layout software to develop a

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2

Kostin, M. S., D. S. Vorunichev, and D. A. Korzh. "COUNTERREENGINEERING OF ELECTRONIC DEVICES." Russian Technological Journal 7, no. 1 (2019): 57–79. http://dx.doi.org/10.32362/2500-316x-2019-7-1-57-79.

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The paper presents the main results of scientific and practical research in the field of special design reengineering and counterreengineering of radioelectronic devices. Methods and means of special design reengineering of functional modules of multilayer printed circuit boards and case microcircuits are presented. The basic process design for the reengineering of multilayer printed circuits of radioelectronic products is presented. The design is based on the physical principles of destructive and non-destructive decomposing test: mechanical processing and chemical etching, stereolaser struct

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3

Lawlor-Wright, Therese, and Charles Gallagher. "Development of a printed circuit board design for in-circuit test advisory system." Computers in Industry 33, no. 2-3 (1997): 253–59. http://dx.doi.org/10.1016/s0166-3615(97)00031-6.

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4

Myers, Sharon A., Troy D. Cognata, and Hugh Gotts. "FTIR analysis of printed-circuit board residue." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 264–65. http://dx.doi.org/10.1017/s0424820100163782.

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Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. The failure to boot was originally traced to a suspected bad microcontroller chip. Replacing this chip, or an oscillator tied to the microcontroller circuit, did not consistently solve the boot problem. With further testing, it was found the microcontroller circuit was very sensitive to resistance and was essentially shorted.A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resist

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Miles, J. J., C. R. Zelak, J. M. Kliman, and J. E. Sunderland. "Integrated Infrared Failure Analysis of Printed Circuit Boards." Journal of Electronic Packaging 117, no. 4 (1995): 288–93. http://dx.doi.org/10.1115/1.2792107.

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A method is presented to test automatically for latent faults, those which elude detection during conventional electronic testing, on printed circuit boards. Testing is intended for implementation in a volume manufacturing environment and involves the application of infrared imaging tools. Successful incorporation of infrared testing into existing test processes requires that: a procedure for handling variable radiation heat transfer properties across a printed circuit board be developed; a thermally-controlled test enclosure be provided; PASS/FAIL criteria be established. These tasks are addr

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6

ITO, Kenichi. "Necessity of the Immunity Test about the Printed Circuit Board." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, no. 7 (1995): 477–81. http://dx.doi.org/10.5104/jiep1995.10.477.

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Xu, Xianxin, Ping Yang, Haiqing Dong, et al. "Dynamic properties analysis and test of SMT printed circuit board assembly." International Journal of Materials and Structural Integrity 4, no. 2/3/4 (2010): 238. http://dx.doi.org/10.1504/ijmsi.2010.035208.

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CHOU, WEN-YANG, and MING-JONG TSAI. "FLEXIBLE WIRELESS MODULE FOR ELECTROCARDIOGRAM MONITORING." Biomedical Engineering: Applications, Basis and Communications 23, no. 04 (2011): 319–24. http://dx.doi.org/10.4015/s1016237211002670.

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The rigidity of printed circuit boards (PCB) constrains the assembly and utility of most existing electrocardiogram (ECG) circuits. Moreover, the literature seldom discusses electromagnetic compatibility (EMC) in the context of ECGs. This paper presents a wireless ECG module built on a flexible printed circuit board (FPCB) and EMC measurement. A flexible wireless module for ECG signals monitoring was designed with high input impedance, a high common-mode rejection ratio (CMRR), low-power consumption, and appropriate amplification and filtration, which automatically cancels offset voltage. The

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9

Frick, M., R. Eidher, and R. Weigel. "Coupling path influence on the conducted emission measurement results by the EMC semiconductor test board." Advances in Radio Science 9 (August 1, 2011): 303–8. http://dx.doi.org/10.5194/ars-9-303-2011.

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Abstract. The fact of reduced development time in the automotive sector requires a change in the electromagnetic compatibility (EMC) validation of electronic components. To increase the development time of automotive components, e.g. sensors or electronic control units (ECUs), it is mandatory to verify the EMC behavior of the integrated circuit (IC) itself in an early development stage simultaneous to the development process of the entire ECU into which it is embedded. The conducted IC EMC tests emission as well as immunity is realized with a specific test printed circuit board (PCB) which is

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10

Weller, S. D. T., I. P. Jones, Ian M. Fox, and Terry Hirst. "High Reliability Pb-Free Printed Circuit Board Assembly." Key Engineering Materials 450 (November 2010): 9–12. http://dx.doi.org/10.4028/www.scientific.net/kem.450.9.

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The solderability and reliability of SnAgCu and SnAgCuSbBiNi lead-free solders were assessed against SnPbAg solder on a range of PCB finishes. A novel solderability test has been developed to assess the solder system’s ability to realign when a deliberately inaccurate solder stencil printing process was applied. This has shown to be an excellent way to compare PCB finishes and solders, as well as define process parameters. Electroless Nickel Immersion Gold (ENIG) finish proved to give the best solderability and the optimum process parameters were also found. SnPbAg solder has shown superior th

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11

Korte, S., O. Döring, and H. Garbe. "Detection of transient disturbing signals on PC boards." Advances in Radio Science 6 (May 26, 2008): 279–84. http://dx.doi.org/10.5194/ars-6-279-2008.

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Abstract. This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of using various galvanic measurement points all over the circuit, a test method is shown which measures the radiated field of the printed circuit board. By use of a 2-dimensional positionable field probe it is possible to get an overview over the signals running on the different parts of the PCB. In order to measure transient disturbing signals and distinguish them from normal device operation, problems of probe design and triggering need to be discussed.

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12

Lee, Nai-Chi. "A hierarchical analog test bus framework for testing mixed-signal integrated circuits and printed circuit boards." Analog Integrated Circuits and Signal Processing 4, no. 3 (1993): 261–68. http://dx.doi.org/10.1007/bf01239078.

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13

Lee, Nai-Chi. "A hierarchical analog test bus framework for testing mixed-signal integrated circuits and printed circuit boards." Journal of Electronic Testing 4, no. 4 (1993): 361–68. http://dx.doi.org/10.1007/bf00972160.

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14

Noh, Bo In, Jong Bum Lee, Bo Young Lee, and Seung Boo Jung. "Characteristic of Electrochemical Migration on Flexible Printed Circuit Board." Materials Science Forum 580-582 (June 2008): 229–32. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.229.

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The electrochemical migration (ECM) with flexible printed circuit board (PCB) was affected by factors such as distance between the electrodes and bias voltage using water drop (WD) test. The rate of migration was increased by decreasing the distance between electrodes of the opposite polarity and increasing the bias voltage.

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15

Stęplewski, Wojciech, Andrzej Dziedzic, Adam Kłossowicz, et al. "Reactance components embedded in printed circuit boards." Circuit World 41, no. 3 (2015): 125–32. http://dx.doi.org/10.1108/cw-03-2015-0009.

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Purpose – This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts. Design/methodology/approach – The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made

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Seehase, Dirk, Christian Kohlen, Arne Neiser, Andrej Novikov, and Mathias Nowottnick. "Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors." Periodica Polytechnica Electrical Engineering and Computer Science 62, no. 4 (2018): 172–80. http://dx.doi.org/10.3311/ppee.13277.

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In this work, methods for the endogenous heating of printed circuit boards (PCBs) by means of inductive losses in built-in susceptors are presented. Two basic types of inductive heating were studied, the heating in the transversal field and the heating in the longitudinal field. Elementary test stands were constructed and characterized for both field geometries. These setups were then used to analyze various susceptor materials like copper and aluminum for the transversal field heating and nickel and iron for the longitudinal field heating. To demonstrate the soldering processes by means of in

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17

Assif, S., M. Agouzoul, A. El Hami, O. Bendaou, and Y. Gbati. "Numerical Model to Simulate the Drop Test of Printed Circuit Board (PCB)." Advanced Materials Research 423 (December 2011): 26–30. http://dx.doi.org/10.4028/www.scientific.net/amr.423.26.

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Increasing demand for smaller consumer electronic devices with multi-function capabilities has driven the packaging architectures trends for the finer-pitch interconnects, thus increasing chances of their failures. A simulation of the Board Level Drop-Test according to JEDEC (Joint Electron Device Council) is performed to evaluate the solder joint reliability under drop impact test. After good insights to the physics of the problem, the results of the numerical analysis on a simple Euler-Bernoulli beam were validated against analytical analysis. Since the simulation has to be performed on ANSY

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18

Klepach, Marko, Mykola Klepach,, and Leonid Kozak. "Analysis of Automation Processes of Printed Circuit Boards Manufacturing Equipment." Modeling, Control and Information Technologies, no. 3 (November 5, 2019): 110–11. http://dx.doi.org/10.31713/mcit.2019.36.

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In this article, the authors present a process of the printed circuit boards manufacturing equipment simulation model design. The model was used to create, optimize and test the movement control subsystem of the device.

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Egerer, Kai, Florian Brandl, Nahal Golzari, and Sabine Beuermann. "Recycling of Printed Circuit Boards Employing Supercritical Carbon Dioxide." Materials Science Forum 959 (June 2019): 100–106. http://dx.doi.org/10.4028/www.scientific.net/msf.959.100.

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Printed circuit boards are currently coated with Br-containing epoxy resins. With respect to recycling of the material removal of the halogen is important. Moreover, it appears important to test whether recycling of the coating is feasible. The resin from circuit board reference material was extracted with extraction media containing supercritical carbon dioxide. It is shown that ternary mixtures containing 2-propanol and water allow for the complete removal of the coating. In contrast to the original material the degraded coating is soluble in organic solvents and size-exclusion chromatograpy

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20

Xu, Fei, Chuan Ri Li, Tong Min Jiang, and Long Tao Liu. "Vibration Modeling and Sensitivity Analysis of Printed Circuit Board." Applied Mechanics and Materials 226-228 (November 2012): 345–50. http://dx.doi.org/10.4028/www.scientific.net/amm.226-228.345.

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Various failures in electronic systems, particularly in the connections between the printed circuit board (PCB) and components, are due to mechanical shock and vibration. The vibration characteristic of a plug-in PCB in an airborne electronic case (AEC) was studied first by finite element modeling (FEM) and experimental techniques. The coupling method and torsional spring elements were used in FEM to better simulate the PCB’s realistic boundary condition. A reasonable correlation between simulation and test results was obtained. Since the fundamental frequency is one of the most important dyna

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21

Mathew, Sony, Diganta Das, Michael Osterman, Michael Pecht, and Robin Ferebee. "Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board." Journal of Electronic Packaging 128, no. 4 (2006): 339–45. http://dx.doi.org/10.1115/1.2351897.

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This paper presents an analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an aluminum bracket used to mount a transistor and provide a path for heat transfer was damaged. Prognostic methods were employed to determine whether the bracket failure could have been predicted prior to the life test. Details of the analytical calculations and modeling results are described in this paper. Results show that the failure could have been predicted before actual testing.

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Tawadros, Peter, Mohamed Awadallah, Paul Walker, and Nong Zhang. "Using a low-cost bluetooth torque sensor for vehicle jerk and transient torque measurement." Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering 234, no. 2-3 (2019): 423–37. http://dx.doi.org/10.1177/0954407019861613.

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This paper presents the use and development of a specific wireless torque measurement system that is used to obtain the transient torque performance of vehicle transmissions. The torque sensor is strain-based, using surface-mounted strain gauges on a prop shaft. The gauges are connected to a compact printed circuit board, which is clamped to the shaft next to the strain gauges using a three-dimensional printed housing. The printed circuit board contains an amplifier, low-pass filter, analog-to-digital converter, microcontroller and bluetooth transceiver. The printed housing is impact resistant

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23

Arabi, F., A. Gracia, J. Y. Delétage, and H. Frémont. "Sequential combined thermal cycling and vibration test and simulation of printed circuit board." Microelectronics Reliability 88-90 (September 2018): 768–73. http://dx.doi.org/10.1016/j.microrel.2018.07.050.

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24

Akella, Ram, S. Rajagopalan, and Medini R. Singh. "Part Dispatch in Random Yield Multistage Flexible Test Systems for Printed Circuit Boards." Operations Research 40, no. 4 (1992): 776–89. http://dx.doi.org/10.1287/opre.40.4.776.

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Oh, Se-Jin, Young-Cheol Kim, and Chin-Wook Chung. "Electrical test method using high density plasmas for high-end printed circuit boards." Review of Scientific Instruments 83, no. 1 (2012): 013503. http://dx.doi.org/10.1063/1.3676162.

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Chen, Liangyu, Philip G. Neudeck, David J. Spry, Glenn M. Beheim, and Gary W. Hunter. "A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2021, HiTEC (2021): 000069–75. http://dx.doi.org/10.4071/2380-4491.2021.hitec.000069.

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Abstract Along with the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is a good electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic sub

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Dean, Robert N., Nathan B. Loden, Curtis J. Hartley, and Jeffery D. Craven. "An Integrated Sensor for Detecting Moisture Ingress in Printed Circuit Board Assemblies." International Symposium on Microelectronics 2016, no. 1 (2016): 000568–71. http://dx.doi.org/10.4071/isom-2016-thp14.

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Abstract Numerous applications exist where electronics must operate reliably in moist environments, and often for long periods of time. In these environments, the circuit board assemblies may experience moisture ingress, which can deleteriously affect the operation and life span of these systems. Detecting moisture ingress is therefore useful for improving system design, assembly techniques, packaging technologies and maintenance scheduling. Capacitive fringing field sensors are useful for measuring the moisture content of materials. Therefore, a capacitive fringing field sensor, implemented i

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Hunt, S., and L. A. Carlsson. "Debonding in Overmolded Integrated Circuit Packages." Journal of Electronic Packaging 115, no. 3 (1993): 249–55. http://dx.doi.org/10.1115/1.2909325.

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Recently introduced overmolded pad array chip carrier (OMPAC) electronic packages sometimes suffer from debonding between the overmold material and the printed circuit board. In this study, bond strength is characterized by a combination of experimental and analytical methods. Test specimens representative for OMPAC structures were designed, manufactured, and tested to failure in tension and torsion. Finite element stress analysis of the specimens was performed in conjunction with a combined interfacial stress failure criterion to determine interfacial tensile and shear strengths from the meas

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Illés, Balázs, Olivér Krammer, Attila Géczy, and Tamás Garami. "Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes." Soldering & Surface Mount Technology 28, no. 1 (2016): 2–6. http://dx.doi.org/10.1108/ssmt-10-2015-0030.

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Purpose – The purpose of this paper is to present a novel and alternative method for the characterization of isotropic conductive adhesive (ICA) joints’ conductivity by the calculation of the mean intercept length of conductive flakes in the cured joint. ICAs are widely used in the field of hybrid electronics or special printed circuit board applications, such as temperature sensitive or flexible circuits. The main quality parameters of the ICA joints are the conductivity and the mechanical strength. Design/methodology/approach – For the experiments, one-component Ag-filled thermoset ICA paste

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Her, Shiuh Chuan, Shien Chin Lan, Chun Yen Liu, and Bo Ren Yao. "Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test." Key Engineering Materials 419-420 (October 2009): 37–40. http://dx.doi.org/10.4028/www.scientific.net/kem.419-420.37.

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Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique. The test specimen of a printed circuit board is clamped at two edges on a test fixture and mounted on the drop test machine platform. The drop table is raised at the height of 50mm and dropped with free fall to impinge four half-spheres of Teflon. One accelerometer is mounted on the center of the specimen to measure the impact pulse. The commercial finite element software ANSYS/LS-D

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Lee, Choong-Jae, Bum-Geun Park, Kwang-Ho Jung, Yongil Kim, and Seung-Boo Jung. "Effects of Silane Coupling Agents on the Adhesion Strength of a Printed Cu Circuit on Polyimide." Science of Advanced Materials 12, no. 4 (2020): 594–99. http://dx.doi.org/10.1166/sam.2020.3672.

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It is difficult to maintain high adhesion strength between a printed metal circuit and polymer substrate due to the weak chemical bonding of metal and organic materials. Therefore, an additional process is necessary to improve the adhesion strength. Silane coupling agents (SCAs), which are capable of forming bonds with metals and organic materials, can provide a solution. Here, SCAs were placed on polyimide (PI) substrates and coated with various functional groups to compare the effects of various functionalized SCAs on the adhesion strength between a screen-printed copper (Cu) circuit and the

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32

Kahar, Hardinnawirda, Zetty Akhtar Abd Malek, Siti Rabiatull Aisha Idris, and Mahadzir Ishak. "Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish." Advanced Materials Research 1133 (January 2016): 391–95. http://dx.doi.org/10.4028/www.scientific.net/amr.1133.391.

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Electroless Nickel Boron had been appointed as potential coating in several applications in industry like aeronatics, petrochemical industry, electronics and firearms due to its desirable physical and mechanical properties such as high wear resistance and high hardness including provides uniformity in coating thickness. However, in semiconductor sector, the usage of Nickel Boron as coating layer still insufficient due to lack of study in term of its potential as coating on printed circuit board. This study aims to investigate the mechanical and physical properties of electroless Nickel Boron a

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Hwang, Ji-Soo, Jong-Dae Kim, Yu-Seop Kim, Hye-Jeong Song, and Chan-Young Park. "Black Printed Circuit Board-based Micro-Polymerase Chain ReactionChip Structure for Fluorescence Detection Test." International Journal of Control and Automation 8, no. 10 (2015): 15–24. http://dx.doi.org/10.14257/ijca.2015.8.10.02.

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Piumatti, Davide, Stefano Borlo, Matteo Quitadamo, Matteo Sonza Reorda, Eric Giacomo Armando, and Franco Fiori. "Test Solution for Heatsinks in Power Electronics Applications." Electronics 9, no. 6 (2020): 1020. http://dx.doi.org/10.3390/electronics9061020.

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Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover, numerous ageing effects are due to thermal stress, which causes mechanical issues. Therefore, the reliability of a circuit depends on its dissipation system, even if it consists of a simple passive heatsink mounted on the power devic

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35

Zhao, Shuai, and Rong Zhu. "Monolithic Integration of a Flexible Micro Thermal Flow Sensor." Applied Mechanics and Materials 748 (April 2015): 89–92. http://dx.doi.org/10.4028/www.scientific.net/amm.748.89.

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In this paper, a novel monolithically integrated flexible thermal flow sensor combining four resistors in a Wheatstone bridge including hot-film resistor, temperature-compensating resistor and two other balancing resistors on one chip is proposed in order to improve the system integration level and sensor performances, such as signal to noise ratio (SNR), power consumption and temperature compensation. Fabricating the sensor directly on a flexible polyimide printed circuit board (PCB) by incorporating printed circuit technique with micromachining sputter technique is adopted. A complete perfor

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Bao, Ming Dong, Xue Bo Xu, Jia Wen He, Hai Lin Sun, and Dennis G. Teer. "Wear and Cutting Performance of Microdrills Coated Hard Film Deposited Using Closed Field Unbalanced Magnetron Sputter Ion Plating." Advanced Materials Research 75 (June 2009): 25–29. http://dx.doi.org/10.4028/www.scientific.net/amr.75.25.

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Microdrills were deposited by Cr-N based and TiN coatings using a magnetron sputter technique. A flexible printed circuit board was used to evaluate the drilling lives. SEM observation was employed to reveal the wear and local welding. A special pin-on-disc tester was designed to assess the interaction between coatings and against materials. Drilling test indicated that the number of drilling holes increased significantly when the minidrill was coated Cr-N based film than TiN. Failure model of microdrill was studied for cutting this copper rich printed circuit board. Results demonstrated that

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Pirogov, A. A., Yu A. Pirogova, D. E. Lukyanenko, S. A. Gvozdenko, and E. V. Semka. "Development of methods for modeling digital signals when designing printed units." Issues of radio electronics, no. 10 (December 16, 2020): 23–30. http://dx.doi.org/10.21778/2218-5453-2020-10-23-30.

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In the production of printed circuit assemblies, one of the important stages is to carry out various forms of product control. Control of the electrical parameters of signals for various modes of operation of the device is one of the key tasks, since possible deviations can lead to malfunctions in the operation of the product or inconsistency of its output characteristics with the limitations set in the technical specifications. Electrical control is carried out using test samples of products and in a number of cases the methods used are quite costly both in time and in terms of the cost of th

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Zhou, Jingzhi, Keyong Cheng, Huzhong Zhang, et al. "Test platform and experimental test on 100 kW class Printed Circuit Heat Exchanger for Supercritical CO2 Brayton Cycle." International Journal of Heat and Mass Transfer 148 (February 2020): 118540. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2019.118540.

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Mandhare, M. M., S. A. Gangal, M. S. Setty, and R. N. Karekar. "Performance Comparison of Thin and Thick Film Microstrip Rejection Filters." Active and Passive Electronic Components 13, no. 1 (1988): 45–54. http://dx.doi.org/10.1155/1988/62434.

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A performance comparison of microstripline circuits using thin and thick film techniques has been studied, in which a Microstrip rejection filter, in the X-band of microwaves, is used as test circuit. A thick film technique is capable of giving good adhesive films with comparable d.c. sheet resistivity, but other parameters such as open area (porosity), particle size, and edge definition are inferior to thin-film microstrip filters. Despite this drawback, the average value of transmission, transmission loss, reflection coefficient, resonant rejection frequency, and quality factor for thick-fil

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Paul, Shubhra Deb, and Swarup Bhunia. "SILVerIn: Systematic Integrity Verification of Printed Circuit Board Using JTAG Infrastructure." ACM Journal on Emerging Technologies in Computing Systems 17, no. 3 (2021): 1–28. http://dx.doi.org/10.1145/3460232.

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A printed circuit board (PCB) provides necessary mechanical support to an electronic system and acts as a platform for connecting electronic components. Counterfeiting and in-field tampering of PCBs have become significant security concerns in the semiconductor industry as a result of increasing untrusted entities in the supply chain. These counterfeit components may result in performance degradation, profit reduction, and reputation risk for the manufacturers. While Integrated Circuit (IC) level authentication using physical unclonable functions (PUFs) has been widely investigated, countermea

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Hwang, Ji-Soo, Yu-Seop Kim, Hye-Jeong Song, Jong-Dae Kim, and Chan-Young Park. "Fluorescence detection test by black printed circuit board based microfluidic channel for polymerase chain reaction." Technology and Health Care 24, s1 (2015): S139—S146. http://dx.doi.org/10.3233/thc-151061.

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Du, B., L. Gu, and Yong Liu. "Application of nonlinear methods in tracking failure test of printed circuit boards under reduced pressure." IEEE Transactions on Dielectrics and Electrical Insulation 17, no. 2 (2010): 548–54. http://dx.doi.org/10.1109/tdei.2010.5448111.

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Tzong-Lin Wu, Yen-Hui Lin, Jiuun-Nan Hwang, and Jig-Jong Lin. "The effect of test system impedance on measurements of ground bounce in printed circuit boards." IEEE Transactions on Electromagnetic Compatibility 43, no. 4 (2001): 600–607. http://dx.doi.org/10.1109/15.974640.

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Elger, Gordon, Shri Vishnu Kandaswamy, Robert Derix, and Jürgen Wilde. "Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests." Journal of Microelectronics and Electronic Packaging 11, no. 2 (2014): 51–56. http://dx.doi.org/10.4071/imaps.407.

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Light emitting diodes (LEDs) are today standard and mature light sources. They have several key advantages such as small size, low energy consumption, and long lifetime. However, high reliability of the LED system is required to achieve long lifetime of the light source. Thermomechanical stress due to temperature cycling causes failure of electronic systems. The electronic component itself or the interconnect device, for example, the printed circuit board (PCB), might fail. In many cases, the weakest link is found to be the solder interconnect between the package and the board. Cracking of the

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Lin, Shin Chieh, C. T. Chen, and C. H. Chou. "A Comparison of Image Registration Methods Used for Printed Circuit Board Inspection." Key Engineering Materials 381-382 (June 2008): 295–98. http://dx.doi.org/10.4028/www.scientific.net/kem.381-382.295.

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In this study, registration methods used to estimate both position and orientation differences between two images had been evaluated. This is an important issue since that there are always some position and orientation differences when loading test samples on the inspection machine. These differences should be calculated and compensated before further analysis. Registration methods tested including one area method and three feature based method. It was shown that the area method had better performance than other feature based method in these cases studied. And it is shown that it is much easy

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Liang, Zhen Guang, and Xue Gu. "Waveform Analysis of a Transmission Line Pulse Generator by Use of Wavelet Transform." Applied Mechanics and Materials 668-669 (October 2014): 1166–69. http://dx.doi.org/10.4028/www.scientific.net/amm.668-669.1166.

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With good repeatability and simple structure, transmission line pulse (TLP) has been used in immunity test of integrated circuit and printed circuit board. A TLP generator is first manufactured and its output waveform is presented. By using wavelet transform, the waveform is denoised and discriminated to components inherent to system function and parasitic parameters. Frequency spectrum changed with time is also obtained by continuous wavelet transform of complex morlet. Decomposed damping oscillation component and high frequency component in instant frequency spectrum show influence of induct

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Kumar, Amit, Maria E. Holuszko, and Travis Janke. "Determination of loss on ignition test conditions for nonmetal fraction from processed waste printed circuit boards." Resources, Conservation and Recycling 163 (December 2020): 105105. http://dx.doi.org/10.1016/j.resconrec.2020.105105.

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Chang, Hung-Jen, Tao-Chih Chang, Chau-Jie Zhan, and Jung-Hua Chou. "Evaluation of Various Surface Finished Halogen-Free Printed Circuit Board Assembly Under Four-Point Bending Test." IEEE Transactions on Components, Packaging and Manufacturing Technology 1, no. 11 (2011): 1747–54. http://dx.doi.org/10.1109/tcpmt.2011.2163799.

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Mylavarapu, Sai K., Xiaodong Sun, Richard E. Glosup, Richard N. Christensen, and Michael W. Patterson. "Thermal hydraulic performance testing of printed circuit heat exchangers in a high-temperature helium test facility." Applied Thermal Engineering 65, no. 1-2 (2014): 605–14. http://dx.doi.org/10.1016/j.applthermaleng.2014.01.025.

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Conseil, Helene, Morten Stendahl Jellesen, and Rajan Ambat. "Contamination profile on typical printed circuit board assemblies vs soldering process." Soldering & Surface Mount Technology 26, no. 4 (2014): 194–202. http://dx.doi.org/10.1108/ssmt-03-2014-0007.

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Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue distribution pattern, composition and concentration are profiled and reported. The effect of such contaminants on conformal coating was tested. Design/methodology/approach – Presence of localized flux residues was visualized using a commercial residue reliability assessment testing gel test and chemical

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