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Journal articles on the topic 'Printed electronic coating'

Author: Grafiati

Published: 7 July 2024

Last updated: 31 July 2025

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1

Lu, Taofeng, Gregory Reimonn, Gregory Morose, Evan Yu, and Wan-Ting Chen. "Removing Acrylic Conformal Coating with Safer Solvents for Re-Manufacturing Electronics." Polymers 13, no. 6 (2021): 937. http://dx.doi.org/10.3390/polym13060937.

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Conformal coating is typically composed of polymeric film and is used to protect delicate electronic components such as printed-circuit boards. Without removing conformal coating, it would be difficult to repair these complicated electronics. Methylene chloride, also called dichloromethane (DCM), has a widespread usage in conformal coating stripper products. The high toxicity of DCM increases human health risk when workers are exposed to DCM during the conformal coating removal processes. Therefore, the replacement of DCM would be beneficial to greatly improve the overall safety profile for wo

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2

Rajendran, Mohana, and Marto Giftlin. "Novel Development of Corrosion Resistant Paint Using Printed Circuit Board from Modern Electronic Wastes." Trends in Sciences 19, no. 6 (2022): 2901. http://dx.doi.org/10.48048/tis.2022.2901.

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The growth in the industrial technology and communication sectors has enhanced the usage of electronic gadgets exponentially. Thus, it becomes highly essential to find new solution to utilize or dispose these e-wastes, in order to reduce the e-waste generation. Various reports mentioned that the major component of these e-wastes is their Printed Circuit Boards. Therefore, a new ideology is proposed to use these boards to produce a new coating with good corrosion resistance. At first the boards were separated from the discarded electronic appliances and various electrical elements were separate

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3

Szocinski, Michal. "AFM-assisted investigation of conformal coatings in electronics." Anti-Corrosion Methods and Materials 63, no. 4 (2016): 289–94. http://dx.doi.org/10.1108/acmm-09-2014-1426.

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Purpose This paper aims to presents a new method of investigation of local properties of conformal coatings utilized in microelectronics. Design/methodology/approach It is based on atomic force microscopy (AFM) technique supplemented with the ability of local electrical measurements, which apart from topography acquisition allows recording of local impedance spectra, impedance imaging and dc current mapping. Potentialities of the proposed AFM-assisted approach have been demonstrated on commercially available epoxy-coated electronic printed boards in as-received state and after six-year service

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Lee, Sang, and Sangyoon Lee. "Fabrication and Characterization of Roll-to-Roll Printed Air-Gap Touch Sensors." Polymers 11, no. 2 (2019): 245. http://dx.doi.org/10.3390/polym11020245.

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Although printed electronics technology has been recently employed in the production of various devices, its use for the fabrication of electronic devices with air-gap structures remains challenging. This paper presents a productive roll-to-roll printed electronics method for the fabrication of capacitive touch sensors with air-gap structures. Each layer of the sensor was fabricated by printing or coating. The bottom electrode, and the dielectric and sacrificial layers were roll-to-roll slot-die coated on a flexible substrate. The top electrode was formed by roll-to-roll gravure printing, whil

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5

Pfeiffenberger, Neal T., and Saeid Biria. "Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards." International Symposium on Microelectronics 2021, no. 1 (2021): 000281–85. http://dx.doi.org/10.4071/1085-8024-2021.1.000281.

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Abstract Conformal coatings are thin polymeric layers applied on (RF)/microwave printed circuit boards, chips, dies and other electronic components to protect them from moisture and corrosion. Despite this protection, exposure to excessive humidity can cause delamination, increase dissipation factors and dielectric constants of the coating, and changing circuit switching-speed. In this paper, we will discuss dielectric performance of UVA LED-curable resin formulations with enhanced flexibility and adhesion as a new approach compared to traditional mercury UV curable conformal coatings. These a

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6

Tantrairatn, Suradet, Paphakorn Pitayachaval, Sirisak Rangklang, and Jiraphon Srisertpol. "A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength." Advanced Materials Research 421 (December 2011): 489–92. http://dx.doi.org/10.4028/www.scientific.net/amr.421.489.

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In electronic flexible printed circuit (E-FPC) manufacturing procedure, the cover laminating process in which the line circuit (copper wire) is covered with hot cover layer on the printed circuits is importance process. This process will help to increase elasticity, strength and corrosion protection to the product therefore this process can affect directly to quality of the printed circuit. The process for laminating printed circuits can be classified into two methods by coating with industry iron and hot bar machine. This article compares the quality of the electrical circuit between industry

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Kellomäki, Tiiti, Johanna Virkki, Sari Merilampi, and Leena Ukkonen. "Towards Washable Wearable Antennas: A Comparison of Coating Materials for Screen-Printed Textile-Based UHF RFID Tags." International Journal of Antennas and Propagation 2012 (2012): 1–11. http://dx.doi.org/10.1155/2012/476570.

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(Radio frequency identification) RFID tags integrated into clothing enable monitoring of people without their conscious effort. This requires tags to be an unnoticeable part of clothing and comfortable to wear. In this study, RFID antennas were screen printed on two different fabrics, six different coating materials for the (integrated circuits) ICs were applied, and the reliability of these RFID tags was tested with moisture and laundry tests. Generally, glue-type coating materials were easier to handle and could be spread precisely. All the tags were operational immediately after the coating

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8

Park, Won-Tae, and Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics." Journal of Materials Chemistry C 5, no. 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.

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9

Stephan, Harkema, A. Rensing Peter, M.D.C. Domensino Sanne, M. Vermeijlen Joris, E. Godoi Bizarro Diana, and van Schaik Antoinette. "Disassembly of in-plastic embedded printed electronics." Journal of Cleaner Production 450 (March 21, 2024): 141837. https://doi.org/10.1016/j.jclepro.2024.141837.

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We explored a novel design-for-recycling method for encapsulated printed electronics in an injection-moldedpackage that improves disassembly at End-of-Life (EoL). To this end, a non-adhering disassembly layer(NADL) was applied onto the printed circuitry and light-emitting diodes prior to injection molding. Surprisingly,the devices with a disassembly layer remained fully functional after injection molding, despite exposure to highshear forces and elevated temperatures. Facilitating the disassembly of an encapsulated electronic device using aweak link in the adhesion strength of the overmolded e

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10

Senophiyah-Mary, J., R. Loganath, and T. Meenambal. "A novel method for the removal of epoxy coating from waste printed circuit board." Waste Management & Research: The Journal for a Sustainable Circular Economy 36, no. 7 (2018): 645–52. http://dx.doi.org/10.1177/0734242x18782392.

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The printed circuit board, which is the heart of all electronic devices, is a rich source of metal, which could act as a future resource. Bioleaching, a biological treatment, would be an appropriate method for the environmentally sound management of e-waste. Various strippers are used to remove the epoxy coating and it is harmful to remove the epoxy coating with those solvents and salts in the open because of the presence of brominated flame retardants on the surface of the printed circuit board, which leads to serious health issues. An alternate process is required to remove the epoxy coating

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11

Nmadu, D., N. C. Eli-Chukwu, U. U. Uma, et al. "Using High Voltage Electrochemical Oxidation (HVEO) to obtain protective coatings, surface finishing on electronic materials." Digest Journal of Nanomaterials and Biostructures 17, no. 2 (2022): 569–77. http://dx.doi.org/10.15251/djnb.2022.172.569.

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Electronics and microelectronic components such as printed circuit board, capacitors, CPU heat sinks, hard drive, etc. commonly encounter harsh environmental conditions during their operational lifetime. To protect the electronics materials from conditions like corrosion, wear, humidity and contaminants, aluminium protective coating materials can be used. However, the behavior of materials in harsh environments and their effect on the reliability of electronics in industrial products has been studied only very little. Moreover, the changes in the parameters (current density, temperature and ti

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12

Wang, Wan Gang, Yong Peng, and Xiao Ping Wang. "Key Parameter Optimization in Wave Soldering." Advanced Materials Research 323 (August 2011): 84–88. http://dx.doi.org/10.4028/www.scientific.net/amr.323.84.

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Wave soldering is mainly used in electronic assembling process of traditional through-hole cartridge printed-circuit board and hybrid packaged process combining surface mounting with through-hole cartridge components. Compared with manual welding, wave soldering has advantages of high productive efficiency, good welding quality and high reliability. Wave soldering process is a complex and systematic project. During the practical productive process, flux coating quantity, preheat temperature of printed board, soldering temperature and time, uphill height of printed board and peak height should

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13

Kolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko, and Bohdan Vasylyshyn. "Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine." Computer Design Systems. Theory and Practice 4, no. 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.

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The article presents methods and means of 3D design of printed circuit boards in CAx. Automated placement of elements on the board is implemented by means of API SolidWorks using Visual Studio C#. The API application works by an algorithm that allows you to create a 3D layout of printed circuit boards. Each component of the library contains a conditional graphic notation of the element. With the help of the implemented algorithm, a comprehensive approach is provided, which consists in the fact that already at this stage the preparation of the strategy for tracing the conductors of the future p

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14

Dabert, Marine, Dorina T. Papanastasiou, Loïc Vidal, et al. "Enhancing the Properties of Photo-Generated Metallized Nanocomposite Coatings through Thermal Annealing." Nanomaterials 14, no. 2 (2024): 193. http://dx.doi.org/10.3390/nano14020193.

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In this work, the effect of thermal annealing on silver nanoparticles@polymer (AgNPs@polymer) nanocomposite coatings was investigated. These photo-generated metallized coatings have a spatial distribution of metal nanoparticles, with a depth-wise decrease in their concentration. During annealing, both structural and morphological variations, as well as a spatial reorganization of AgNPs, were observed, both at the surface and in the core of the AgNPs@polymer coating. Owing to their increased mobility, the polymer chains reorganize spontaneously, and, at the same time, a hopping diffusion proces

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15

Son, Ha Huu, Nguyen Phi Long, Nguyen Van Thanh, et al. "Polyalphaolefin Oil/MgO-20 Nanofluids Coating Shows Corrosion Resistance, High Moisture Resistance, and Water Resistance for Electrical and Electronic Equipment." Coatings 13, no. 9 (2023): 1576. http://dx.doi.org/10.3390/coatings13091576.

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The PAO/MgO nanofluids-based dielectric fluid DF(MgO-20) has significantly increased corrosion resistance as a coating. Electrochemical studies show that the DF(MgO-20) coating has protection efficiency of up to 99% for steel, copper, and aluminum. This coating is capable of providing corrosion protection for steel samples for up to 120 h in salt spray tests, and printed circuit boards (PCBs) for more than 20 days in salt spray tests in accordance with the ASTM B117 standard. The DF(MgO-20) coating fully meets the moisture resistance and fungal resistance standards required by the MIL-1-46058

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16

Pappas, Daphne, Sebastian Guist, and Dhia Ben Salem. "Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit Boards." International Symposium on Microelectronics 2020, no. 1 (2020): 000197–200. http://dx.doi.org/10.4071/2380-4505-2020.1.000197.

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Abstract Long term reliability and performance of printed circuit boards (PCBs) are strongly affected by the presence of surface contaminants from the manufacturing and assembly processes. Flux and solder residue, dust particles, oils and greases are often found on the assembled boards and can inhibit the successful application of conformal coatings that are used to protect the electronic components. Surface contaminants can cause coating delamination, dendritic growth, electromigration, corrosion and result in compromised coatings. In the first part of this paper, the fundamental mechanism of

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17

Xu, Jin Qiu, Jian Feng Bai, Jing Wei Wang, et al. "Microbial Leaching of Copper from Waste Electronic Scraps." Advanced Materials Research 508 (April 2012): 228–32. http://dx.doi.org/10.4028/www.scientific.net/amr.508.228.

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Microbial leaching was used to mobilize copper from two kinds of waste electronic scraps used as raw materials for printed wire boards. Both of Acidithiobacillus ferrooxidans and Acidithiobacillus thiooxidans used to solubilize copper from the samples. The experimental results demonstrated that the percentages of copper basically increased with decrease of sieve fraction of the samples. The green non-conductive coating of the waste electronic scraps was proved to have little effect on the leaching efficiency of both of the pure culture of Acidithiobacillus ferrooxidans and Acidithiobacil thioo

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18

Chen, Jihua, Yue Yuan, Qianshu Wang, Hanyu Wang, and Rigoberto C. Advincula. "Bridging Additive Manufacturing and Electronics Printing in the Age of AI." Nanomaterials 15, no. 11 (2025): 843. https://doi.org/10.3390/nano15110843.

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Printing techniques have been instrumental in developing flexible and stretchable electronics, including organic light-emitting diode displays, organic thin film transistor arrays, electronic skins, organic electrochemical transistors for biosensors and neuromorphic computing, as well as flexible solar cells with low-cost processes such as inkjet printing, ultrasonic nozzle, roll-to-roll coating. The rise of additive manufacturing provides even more opportunities to print electronics in automated and customizable ways. In this work, we will review the current technologies of printing electroni

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19

Li, Wei Wei, Li Xin Mo, Ji Lan Fu, et al. "Preparation of Water-Based Nano-Silver Gravure Conductive Ink Used for Printed Electronics." Applied Mechanics and Materials 262 (December 2012): 523–26. http://dx.doi.org/10.4028/www.scientific.net/amm.262.523.

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Printed electronic industry develops fast and has great potential. In order to prepare water-based nano-silver gravure conductive ink used for printed electronics, liquid chemical reduction method is used. Ag+(5.89M) at high concentration acting as the precursor is reduced by hydrazine hydrate with PVP as the protecting agent. For one time of reaction, silver content of 9.25% is obtained. After washing and centrifuging the silver colloids for three times to purity, some amount of deionized water, resin and additives are added to the silver paste to fabricated water-based nano-silver conductive

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20

Xu, Pingye, and Michael C. Hamilton. "Reduced-Loss Ink-Jet Printed Flexible CPW With Copper Coating." IEEE Microwave and Wireless Components Letters 23, no. 4 (2013): 178–80. http://dx.doi.org/10.1109/lmwc.2013.2248704.

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21

Ibrahim Zamkoye, Issoufou, Houda El Gbouri, Remi Antony, et al. "Characterization and Electronic Properties of Heptazine Layers: Towards Promising Interfacial Materials for Organic Optoelectronics." Materials 13, no. 17 (2020): 3826. http://dx.doi.org/10.3390/ma13173826.

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For the first time, an original compound belonging to the heptazine family has been deposited in the form of thin layers, both by thermal evaporation under vacuum and spin-coating techniques. In both cases, smooth and homogeneous layers have been obtained, and their properties evaluated for eventual applications in the field of organic electronics. The layers have been fully characterized by several concordant techniques, namely UV-visible spectroscopy, steady-state and transient fluorescence in the solid-state, as well as topographic and conductive atomic force microscopy (AFM) used in Kelvin

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22

Yang, Tong, Xinyu Li, Bo Yu, and Cheng Gong. "Design and Print Terahertz Metamaterials Based on Electrohydrodynamic Jet." Micromachines 14, no. 3 (2023): 659. http://dx.doi.org/10.3390/mi14030659.

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Terahertz metamaterials are some of the core components of the new generation of high-frequency optoelectronic devices, which have excellent properties that natural materials do not have. The unit structures are generally much smaller than the wavelength, so preparation is mainly based on semiconductor processes, such as coating, photolithography and etching. Although the processing resolution is high, it is also limited by complex processing, long cycles, and high cost. In this paper, a design method for dual-band terahertz metamaterials and a simple, rapid, low-cost metamaterial preparation

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23

Carlos, Emanuel, Rita Branquinho, Elina Jansson, et al. "Printed zinc tin oxide diodes: from combustion synthesis to large-scale manufacturing." Flexible and Printed Electronics 7, no. 1 (2022): 014005. http://dx.doi.org/10.1088/2058-8585/ac4bb1.

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Abstract Printed metal oxide devices have been widely desired in flexible electronic applications to allow direct integration on foils and to reduce electronic waste and associated costs. Especially, semiconductor devices made from non-critical raw materials, such as Zn, Sn (and not, for example, In), have gained significant interest. Despite considerable progress in the field, the upscale requirements from lab to fab scale to produce these materials and devices remain a challenge. In this work, we report the importance of solution combustion synthesis (SCS) when compared with sol–gel in the p

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24

Yoo, Young-Ran, Seokyeon Won, and Young-Sik Kim. "Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test." Coatings 14, no. 3 (2024): 359. http://dx.doi.org/10.3390/coatings14030359.

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A large amount of multi-layer ceramic capacitor (MLCC) is mounted inside a printed circuit board (PCB) constituting electronic components. The use of MLCC in electric vehicles and the latest mobile phones is rapidly increasing with the latest technology. Environments in which electronic components are used are becoming more diverse and conformal coatings are being applied to protect mounted components from these environments. In particular, MLCCs in electronic components mainly have voltage applied. They might be used in environments where humidity exists for various reasons. In a humid enviro

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25

Aziz, Shahid, Junaid Ali, Krishna Singh Bhandari, Wenning Chen, Sijia Li, and Dong Won Jung. "Reverse Offset Printed, Biocompatible Temperature Sensor Based on Dark Muscovado." Sensors 22, no. 22 (2022): 8726. http://dx.doi.org/10.3390/s22228726.

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A reverse-offset printed temperature sensor based on interdigitated electrodes (IDTs) has been investigated in this study. Silver nanoparticles (AgNPs) were printed on a glass slide in an IDT pattern by reverse-offset printer. The sensing layer consisted of a sucrose film obtained by spin coating the sucrose solution on the IDTs. The temperature sensor demonstrated a negative temperature coefficient (NTC) with an exponential decrease in resistance as the temperature increased. This trend is the characteristic of a NTC thermistor. There is an overall change of ~2800 kΩ for the temperature chang

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Yang, Xiaofan, Huang Li, Haiyang Lin, Yicong Chen, and Rongjie Ji. "Effect of Substrate Pretreatment Process on the Cutting Performance of Diamond-Coated PCB Micro-Milling Tools." Micromachines 14, no. 1 (2022): 73. http://dx.doi.org/10.3390/mi14010073.

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Diamond coatings were deposited on PCB (printed circuit board) carbide milling tool substrates under various schemes of acid and alkali pretreatment by hot filament chemical vapor deposition (HFCVD). Scanning electron microscopy and X-ray coating analysis were used to examine the surface morphology of the milling tools and the impact of de-cobalt from the substrate surface after pretreatment. Milling experiments were carried out to study the cutting performance of diamond-coated PCB micro-milling tools under various pretreatment processes. The results show that abrasive wear, coating flaking,

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27

Baek, Inwoo, Chul-Min Lim, Kyoung Youl Park, and Bong Ki Ryu. "Enhanced Metal Coating Adhesion by Surface Modification of 3D Printed PEKKs." Coatings 12, no. 6 (2022): 854. http://dx.doi.org/10.3390/coatings12060854.

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PEKK (polyether-ketone-ketone) polymer has been actively studied in applying electronic devices in satellites owing to its excellent light weight and thermal resistance. However, the limitation of metal coating to form on the PEKK surface is due to the high-volume resistivity and surface resistance. Here, we have investigated the correlations between the chemical treatment of the surface and adhesion strength between polymer–metal coating. Three-dimensional printed PEKK objects were manufactured and nickel was deposited on the surface by electroless plating. As the concentration of H2SO4 incre

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Diatezo, Léopold, Minh-Quyen Le, Christine Tonellato, Lluis Puig, Jean-Fabien Capsal, and Pierre-Jean Cottinet. "Development and Optimization of 3D-Printed Flexible Electronic Coatings: A New Generation of Smart Heating Fabrics for Automobile Applications." Micromachines 14, no. 4 (2023): 762. http://dx.doi.org/10.3390/mi14040762.

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Textile-based Joule heaters in combination with multifunctional materials, fabrication tactics, and optimized designs have changed the paradigm of futuristic intelligent clothing systems, particularly in the automobile field. In the design of heating systems integrated into a car seat, conductive coatings via 3D printing are expected to have further benefits over conventional rigid electrical elements such as a tailored shape and increased comfort, feasibility, stretchability, and compactness. In this regard, we report on a novel heating technique for car seat fabrics based on the use of smart

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Jo, Minho, Seongyong Kim, Gyoujin Cho, Taik-Min Lee, Jongsu Lee, and Changwoo Lee. "Achieving specified geometric quality in a fully printed flexible functional layer using process parameters in roll-to-roll printed electronics." Flexible and Printed Electronics 7, no. 1 (2022): 014007. http://dx.doi.org/10.1088/2058-8585/ac509a.

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Abstract Roll-to-roll (R2R) gravure printing is mainly used in the manufacture of conductive lines or electronic devices because complex patterns can be printed quickly and accurately on flexible substrates using an engraved pattern roll. Gravure printing has several advantages including multi-layer printing of large-area functional layers and continuous production of electronic devices such as thin-film transistors (TFTs) or complex electronic circuits. Existing studies have demonstrated that printing quality can be improved by determining the desired conditions of coating and printing machin

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Gholampour, Nadia, Dominikus Brian, and Morteza Eslamian. "Tailoring Characteristics of PEDOT:PSS Coated on Glass and Plastics by Ultrasonic Substrate Vibration Post Treatment." Coatings 8, no. 10 (2018): 337. http://dx.doi.org/10.3390/coatings8100337.

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In this work, we excited as-spun wet films of PEDOT:PSS by ultrasonic vibration with varying frequency and power. This is a low-cost and facile technique for tailoring the structural and surface characteristics of solution-processed thin films and coatings. We deposited the coatings on both rigid and flexible substrates and performed various characterization techniques, such as atomic force microscopy (AFM), scanning electronic microscopy (SEM), X-ray photoelectron spectroscopy (XPS), attenuated total reflection-Fourier transform infrared spectroscopy (ATR-FTIR), transmittance, electrical cond

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Nguyen, Van-Cuong, Minh-Quyen Le, Jean-François Mogniotte, Jean-Fabien Capsal, and Pierre-Jean Cottinet. "Extrusion-Based 3D Printing of Stretchable Electronic Coating for Condition Monitoring of Suction Cups." Micromachines 13, no. 10 (2022): 1606. http://dx.doi.org/10.3390/mi13101606.

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Suction cups (SCs) are used extensively by the industrial sector, particularly for a wide variety of automated material-handling applications. To enhance productivity and reduce maintenance costs, an online supervision system is essential to check the status of SCs. This paper thus proposes an innovative method for condition monitoring of SCs coated with printed electronics whose electrical resistance is supposed to be correlated with the mechanical strain. A simulation model is first examined to observe the deformation of SCs under vacuum compression, which is needed for the development of se

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Dill, Simone, and Volker Rößiger. "Coating thickness measurement of thin gold and palladium coatings on printed circuit boards using X‐ray fluorescence." Circuit World 37, no. 2 (2011): 20–26. http://dx.doi.org/10.1108/03056121111128288.

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Nguyen, Van-Cuong, Minh-Quyen Le, Sophie Bernadet, et al. "Design Rules of Bidirectional Smart Sensor Coating for Condition Monitoring of Bearings." Polymers 15, no. 4 (2023): 826. http://dx.doi.org/10.3390/polym15040826.

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This paper reports a novel monitoring technique of bearings’ bidirectional load (axial and radial) based on a smart sensor coating, which is screen printed onto the surface of a cross-shaped steel substrate. To ensure the accuracy and stability of measurement as well as the durability of the printed coating, the developed prototype is built according to design rules commonly used in electronic circuits. The finite element model (FEM) is used to predict the mechanical property of the tested substrate under either unidirectional or bidirectional loads. Regarding the output voltage of the piezoel

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Sloma, Marcin, Daniel Janczak, Grzegorz Wroblewski, Anna Mlozniak, and Malgorzata Jakubowska. "Electroluminescent structures printed on paper and textile elastic substrates." Circuit World 40, no. 1 (2014): 13–16. http://dx.doi.org/10.1108/cw-10-2013-0037.

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Purpose – New types of substrates were used for fabrication of printed electroluminescent structures. Polymer foils mainly used as substrates for such optoelectronic elements were replaced with paper and textiles. Printing on non-transparent substrate requires elaboration of printed transparent electrode, while usually polyester foils with sputtered ITO transparent electrodes are used. The paper aims to discuss these issues. Design/methodology/approach – Electroluminescent structures were fabricated with elaborated polymer compositions filled with nanomaterials, such as carbon nanotubes and gr

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Sulaya, Kavishma, Swapna B V, and Vaishnavi M. Nayak. "The science of printing and polishing 3D printed dentures." F1000Research 13 (January 6, 2025): 1266. https://doi.org/10.12688/f1000research.157596.2.

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Objective To analyze the effectiveness of various techniques available for printing, finishing and polishing of 3D printed prosthesis. Methods The articles were selected from electronic databases including PubMed and Scopus. Recently, lot of advancements have been observed in the field of 3D printing in dentistry. Results Numerous studies were found explaining the factors affecting the surface roughness such as printing speed, direction, layer thickness, post curing, etc., and the significance in achieving a smooth surface finish of a 3D printed prosthesis. The methods employed to achieve this

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Sulaya, Kavishma, Swapna B V, and Vaishnavi M. Nayak. "The science of printing and polishing 3D-printed dentures." F1000Research 13 (October 23, 2024): 1266. http://dx.doi.org/10.12688/f1000research.157596.1.

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Objective To analyze the effectiveness of various techniques available for printing, finishing and polishing of 3D printed prosthesis. Methods The articles were selected from electronic databases including PubMed and Scopus. Recently, lot of advancements have been observed in the field of 3D printing in dentistry. Results Numerous studies were found explaining the factors affecting the surface roughness such as printing speed, direction, layer thickness, post curing, etc., and the significance in achieving a smooth surface finish of a 3D printed prosthesis. The methods employed to achieve this

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NAGASHIMA, Yoshiyuki, Junpei BABA, Katsuhiko SYUTOH, and Eisuke MASADA. "Surge Dielectric Strength between Printed Circuit Board Conductive Foils with Solder Resist Coating." Journal of Japan Institute of Electronics Packaging 5, no. 6 (2002): 609–12. http://dx.doi.org/10.5104/jiep.5.609.

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Scholz, Bernd, Ismir Pekmic, Syed Sajid Ahmad, and Aaron Reinholz. "High via density thin metal-core PCB using electro-coated dielectric." International Symposium on Microelectronics 2010, no. 1 (2010): 000615–21. http://dx.doi.org/10.4071/isom-2010-wp3-paper2.

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Conventional printed circuit boards (PCBs) may be replaced by thinner metalcore boards for some applications, as well as for package substrates. Using thin, metalcore technology may provide advantages for radio frequency (RF) circuits and packages, and increase heat dissipation for high power applications. The metalcore technology has several layers including the metal core, electrocoated dielectric, sputtered metal layers, and electroplated copper. Especially for RF application and automotive electronics printed circuit boards with a metal core is gaining interest. The advantage of metal core

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Gogoi, Banashree, Carson Gockley, Sushmitha Venu, et al. "Ultrafast and Large-Scale Fabrication of PEDOT:PSS Nanofilms Using Electrical-Field-Assisted Direct Ink Deposition." Molecules 28, no. 16 (2023): 5989. http://dx.doi.org/10.3390/molecules28165989.

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The importance of conductive polymers has significantly increased over the decade due to their various applications, such as in electronic devices, sensors, and photovoltaics. Poly(3,4-ethylene dioxythiophene) polystyrene sulfonate (PEDOT:PSS) is one of the most successfully and widely used polymers in practical applications. Spin coating is extensively used to fabricate these conductive films; however, it has disadvantages. It is inherently a batch process with relatively low output and high solution wastage. To address these issues, we developed a novel printing process called electrical-fie

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Couble, E. C., O. B. Dutkewych, S. M. Florio, M. V. Marsh, and R. F. Staniunas. "Immersion, Non‐electrolytic Tin/lead Plating Process." Circuit World 19, no. 1 (1992): 63–70. http://dx.doi.org/10.1108/eb046192.

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The technological development and characteristics of an innovative process and composition for immersion plating and fusing of a solderable tin/lead deposit over copper are discussed. The process offers a viable alternative to hot air solder levelling, electrodeposition/selective stripping, or inhibitor coatings for maintaining solderability of printed wiring boards. A flat, uniform solderable tin/lead coating on all feature surfaces and edges is achieved. A number of important benefits are derived. The ability to coat any copper surface uniformly, including fine pitch features, is substantial

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Wassmer, Marcel, Waldemar Diel, and Klaus Krueger. "Inkjet Printing of Fine-Line Thick-Film Inductors." Journal of Microelectronics and Electronic Packaging 7, no. 4 (2010): 205–13. http://dx.doi.org/10.4071/imaps.258.

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Inkjet printing is the emerging technology for the deposition of a variety of particles. The reliable printing of nano-silver inks shows the possibilities of digital fabrication of microelectronic circuits and raises the question for further use with other particles. To compete with common thick-film screen printing as a production method it is consequential and necessary to investigate the inkjet printing of all passive electronic thick-film components. Inductors are frequently required in electronic circuits, yet they represent a main challenge for thick-film printing. With the development o

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Panahi, Masoud, Anthony Hanson, Dinesh Maddipatla, et al. "Condition Monitoring System: A Flexible Hybrid Electronics Approach for Sealed Container Applications." Journal of Surface Mount Technology 37, no. 2 (2024): 6–18. http://dx.doi.org/10.37665/631d5y77.

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A comparative study is presented between two advanced flexible hybrid electronics (FHE) systems designed for monitoring temperature within storage containers across various industries, including food, pharmaceuticals, agriculture, automotive, and defense. The first system, a copper-flex system (CFS), employs an 88.9 µm polyimide substrate with 35 µm thick copper traces, coated with a 12.5 µm polyimide solder mask. The second system, a printed-flex system (PFS), utilizes a 127 µm polyimide substrate with high-temperature resistance and tensile strength. Conductive silver ink was screen-printed

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Huang, Yunzhong, Chao Yang, Xiang Tan, et al. "Benzaldehyde derivatives on tin electroplating as corrosion resistance for fabricating copper circuit." Nanotechnology Reviews 11, no. 1 (2022): 3125–37. http://dx.doi.org/10.1515/ntrev-2022-0497.

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Abstract Electrodeposited tin is a crucial corrosion-resistant metal to protect electronic interconnection and copper circuits in the manufacturing process of electronic products. The corrosion-resistant properties of electrodeposited tin can be improved with the addition of additives in electrodeposition. Three benzaldehyde derivatives including vanillin, ethyl vanillin, and veratraldehyde as brighteners were investigated for tin electrodeposition. Computational and experimental analyses were conducted to investigate the relationship between coating properties and the chemical factors includi

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Son, Yeonho, Dongho Shin, Minkyu Kang, and Caroline Sunyong Lee. "Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices." Electronic Materials 1, no. 1 (2020): 28–39. http://dx.doi.org/10.3390/electronicmat1010004.

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Inkjet-printed patterns were formed on a paper substrate using anti-oxidant copper nano-ink for application to disposable electronic devices. To prevent substrate damage, the pattern was flash light sintered under ambient conditions using the multi-pulse technique. Pure copper nanoparticles were coated with 1-octanethiol for oxidation resistance using the dry-coating method. Mixing these with 1-octanol solvent at a concentration of 30 wt% produced the copper nano-ink. Photo paper was used as the substrate. The contact angle between the photo paper and copper nano-ink was 37.2° and the optimal

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Nguyen, Van-Cuong, Victor Oliva-Torres, Sophie Bernadet, et al. "Haptic Feedback Device Using 3D-Printed Flexible, Multilayered Piezoelectric Coating for In-Car Touchscreen Interface." Micromachines 14, no. 8 (2023): 1553. http://dx.doi.org/10.3390/mi14081553.

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This study focuses on the development of a piezoelectric device capable of generating feedback vibrations to the user who manipulates it. The objective here is to explore the possibility of developing a haptic system that can replace physical buttons on the tactile screen of in-car systems. The interaction between the user and the developed device allows completing the feedback loop, where the user’s action generates an input signal that is translated and outputted by the device, and then detected and interpreted by the user’s haptic sensors and brain. An FEM (finite element model) via ANSYS m

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Alam, Maksudul M., Bidyut Biswas, Alexi K. Nedeltchev, et al. "Phosphine Oxide Containing Poly(pyridinium salt)s as Fire Retardant Materials." Polymers 11, no. 7 (2019): 1141. http://dx.doi.org/10.3390/polym11071141.

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Six new rugged, high-temperature tolerant phosphine oxide-containing poly(4,4′-(p-phenylene)-bis(2,6-diphenylpyridinium)) polymers P-1, P-2, P-3, P-4, P-5, and P-6 are synthesized, characterized, and evaluated. Synthesis results in high yield and purity, as confirmed by elemental, proton (1H), and carbon 13 (13C) nuclear magnetic resonance (NMR) spectra analyses. High glass transition temperatures (Tg > 230 °C) and high char yields (>50% at 700 °C) are determined by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. These new ionic polymers exhibi

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Mo, Lixin, Jun Ran, Li Yang, Yi Fang, Qingbin Zhai, and Luhai Li. "Flexible transparent conductive films combining flexographic printed silver grids with CNT coating." Nanotechnology 27, no. 6 (2016): 065202. http://dx.doi.org/10.1088/0957-4484/27/6/065202.

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Dean, Robert N., Michael C. Hamilton, and Michael E. Baginski. "Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology." Journal of Microelectronics and Electronic Packaging 11, no. 3 (2014): 122–27. http://dx.doi.org/10.4071/imaps.415.

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Capacitive fringing field sensors are often used in applications where moisture is detected, since the dielectric constant of liquid water is approximately 80 times greater than the dielectric constant of air. Most of these sensors, however, are realized using rigid substrates. Some applications would benefit from using a flexible capacitive fringing field sensor that could be conformally mounted on a nonplanar surface. Flexible printed circuit board technology is a mature commercially available process for manufacturing flexible electronics. This same technology can also be used to realize fl

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Janek, Florian, Nadine Eichhorn, Sascha Weser, Kerstin Gläser, Wolfgang Eberhardt, and André Zimmermann. "Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist." Micromachines 12, no. 8 (2021): 856. http://dx.doi.org/10.3390/mi12080856.

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This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with a daisy chain layout. The contact pads are opened by photolithography using UV direct light exposure. Circular and rectangular openings of 90 µm and 130 µm diameter, respectively, edge length are realized. Commercial inks containing nanoparticular silver and gold are inkjet printed to form conductive tracks between daisy ch

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Petko, Joshua S., Philip A. Lovell, Jeremy D. Clifton, Alexander J. Bersani, and Karl F. Schoch. "RF Test Article Experiment on the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical Assemblies." International Symposium on Microelectronics 2018, no. 1 (2018): 000712–17. http://dx.doi.org/10.4071/2380-4505-2018.1.000712.

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Abstract Conversion coatings are treatments applied to aluminum structures to inhibit corrosion while maintaining electrical conductivity. In aerospace applications, the most common type of conversion coatings (MIL-DTL-5541 Type I) contain hexavalent chromium compounds as the corrosion-inhibiting agent. These Type I conversion coatings have a long pedigree and are highly effective in preventing corrosion; however, the hexavalent chromium compounds in these coatings are carcinogenic and water-soluble. Therefore, the use of these compounds is highly regulated in order to protect both workers and

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