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Ištvánek, Jan. "Dispenzní tisk tlustovrstvých past." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2010. http://www.nusl.cz/ntk/nusl-218811.
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This work deals with the problem of the thick-film pastes and their printing. In the main chapter of this work, the realization of a workplace for thick-film pastes' printing is described. The construction of the realized plotter and the controlling electronics of the plotter is depicted in detail.In the following chapter, the console, through which the plotter is controlled via PC, and the CAD program, which serves for projecting of the motives printed, are described.In the final chapter of this work, the measured profiles of the paste printed for various settings of printing parameters and the photographs of the motives printed are stated.
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Braunstein, Daniel J. (Daniel Judah). "Real time process monitoring of solder paste stencil printing." Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/35374.
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Yu, Cheng-Lun. "Titanium dioxide thick film printing paste for dye sensitized solar cell." Case Western Reserve University School of Graduate Studies / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=case1291216520.
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Ostendorff, Saskia Friederike. ""Copy and Paste"." Doctoral thesis, Humboldt-Universität zu Berlin, 2019. http://dx.doi.org/10.18452/20484.
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Der 3D-Druck greift als Vervielfältigungsgerät in das Kernrecht des Urhebers ein. Der private Nutzer kann mit “Copy and Paste” alle Objekte drucken. Das Vervielfältigungsrecht des Urhebers wird durch eine private Nutzung von 3D-Druckern zu Hause, in FabLabs, Hackerspaces oder 3D-Druck Copyshops eingeschränkt werden. Das Urheberrecht als Eigentumsrecht aus Art. 14 GG wird mit dem Recht des Nutzers auf Information und Meinungsfreiheit nach Art. 5 GG abgewogen. Diese Abwägung ist in Zeiten der Digitalisierung, des Internets und der neuen Technologien eine der wichtigsten für das geistige Eigentum. Mit dem 3D-Druck steht und fällt die Frage nach der Vervielfältigungsfreiheit und der Suche nach alternativen Vergütungsmodellen. Schafft der § 53 Abs.1, Abs. 7 UrhG einen Interessenausgleich zwischen Urhebern und Nutzern? Die Arbeit untersucht die Vervielfältigung von Werken der angewandten Kunst unter dem Aspekt der Geburtstagszugentscheidung des BGH und macht die notwendige rechtlichen Änderungen deutlich.<br>3D printing is not only a technical topic but also a topic for creators. The 3D printer intervenes the core right of creators and makes copyright issues obvious. 3D printing is a new usage under section § 31 UrhG. The private user can "copy and paste" to reproduce any objects. The question is how the right of the creator can be restricted by private use of 3D printers at home, in FabLabs, hackerspaces or 3D printing copy shops. Copyright as a property right in Art. 14 GG faces the user's right to information and freedom of expression under Art. 5 GG. Balancing these two fundamental rights is one of the crucial questions for intellectual property in times of digitization, internet and new technologies, as 3D printing is also about freedom of reproduction and alternative compensation models. To what extent creates section § 53 para. 1, para. 7 UrhG a balance of interests for applied art? This present works examines the reproduction of applied art under the “Geburtstagszugentscheidung” and the necessity of reforming legislation in the age of 3D printers.
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Rodriguez, German Dario. "Analysis of the solder paste release in fine pitch stencil printing processes." Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/18867.
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Tanwilaisiri, Anan. "Design and fabrication of supercapacitors using 3D printing." Thesis, Brunel University, 2018. http://bura.brunel.ac.uk/handle/2438/16338.
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Supercapacitors, also known as electrochemical capacitors, have shown great potential as energy storage devices; and 3D printing likewise as a manufacturing technique. This research progressively investigates combining these two technologies to fabricate 3D-printed, electrochemical double-layer capacitors (EDLCs). Small EDLCs were designed in a sandwich structure with an FDM-printed plastic frame and carbon electrodes. Inkjet printing was initially combined with FDM printing to produce a pilot sample with a silver ink current collector, however this performed poorly (Cs = 6 mF/g). Henceforth a paste extrusion system was added to the FDM printer to deposit the current collectors and electrodes, fabricating the entire device in a single continuous process. This process was progressively developed and tested, ultimately attaining specific capacitances of 200 mF/g. The fully integrated 3D printing process used to manufacture the EDLCs was a novel approach. Combining the FDM printer with a paste extruder allowed for a high degree of dimensional accuracy, as well as simplifying the production process. This aspect of the design functioned successfully, without significant faults, and proved a reliable fabrication method. The later designs used in this study provided the EDLCs extendable by incorporating connection jacks. This was to create the possibility to increase capacitance simply by connecting multiple EDLCs together. Tests of this feature showed that it worked well, with the extendable EDLCs delivering outputs very close to the theoretical maximum efficiency of the unit. Carbon conductive paint was applied as a current collector and electrode for the 3D printed EDLCs in an exploration of metal-free 3D printed supercapacitors. These metal-free EDLCs were found to provide around 60% of the specific capacitance of the best performing EDLC variant produced (silver paint current collectors with activated carbon and carbon paint mixture electrodes). Although considerable improvement is required to produce EDLC samples with comparable capacitances to existing commercial manufacturing techniques, this study lays important groundwork in this area, and has introduces effective and innovative design ideas for supercapacitors and integrated 3D printing processes.
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Ismail, Ismarani. "Stencil printing of solder paste for reflow soldering of surface mount technology assembly." Thesis, University of Salford, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.426875.
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He, D. "Modelling and computer simulation of the behaviour of solder paste in stencil printing for surface mount assembly." Thesis, University of Salford, 1998. http://usir.salford.ac.uk/14676/.
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One of the main challenges facing the electronics manufacturing industry in solder paste printing for ultra-fine pitch surface mount and flip-chip assembly is the difficulty in achieving consistent paste deposit volumes from pad-to-pad. At the very small aperture geometries required for ultra-fine pitch and flip chip assembly, flow properties of the paste becomes one of the dominant factors in the printing process. It is widely accepted that over 60% of assembly defects originate from the solder paste printing stage, and hence the urgent need for a better understanding of solder paste rheology, its behaviour during printing, and its impact on defect generation. This understanding is essential for achieving proper control of the printing process. This thesis presents the result of work on the modelling and computer simulation of solder paste behaviour during printing, and consists of three main parts. The first part concerns the modelling of paste behaviour in stencil printing using a vibrating squeegee. The performance of the vibrating squeegee is analysed and process models developed for predicting the ideal printing conditions. In the second part, the random packing of solder powder and the microstructure of solder paste are numerically simulated by applying Monte Carlo method. The effect particle size distributions on the paste microstructure is studied in this part. Based on the simulation results of the second part, the third part concerns the study of the effect of particle size distribution on the paste viscosity and the hydrodynamic interaction between adjacent particles during paste flow. A theoretical enhanced model for predicting the viscosity of dense suspensions such as solder pastes has been developed. This correlates relative viscosity with particle size distribution and with solid volume fraction of dense suspensions. The results of the work have wide applicability: firstly for solder paste manufacturers in optimising paste printing performance at the development stage and for stencil printing equipment manufacturers in specifying the ideal conditions for defect free printing. The simulation algorithm and the viscosity model are also applicable for a wide range of industrial processing applications; in particular metal or ceramic powder compaction, material surface coating, chemical or food material transportation.
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Wilson, Antony R. "Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics." Thesis, Loughborough University, 2012. https://dspace.lboro.ac.uk/2134/10236.
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The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for 'power-by-the-hour' commercial aircraft operation business models.
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Schunemann, Esteban. "Paste deposition modelling : deconstructing the additive manufacturing process : development of novel multi-material tools and techniques for craft practitioners." Thesis, Brunel University, 2015. http://bura.brunel.ac.uk/handle/2438/13803.
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A novel paste deposition process was developed to widen the range of possible materials and applications. This experimental process developed an increasingly complex series of additive manufacturing machines, resulting in new combinations of novel materials and deposition paths without sacrificing many of the design freedoms inherit in the craft process. The investigation made use of open-source software together with an approach to programming user originated infill geometries to form structural parts, differing from the somewhat automated processing by 'closed' commercial RP systems. A series of experimental trials were conducted to test a range of candidate materials and machines which might be suitable for the PDM process. The combination of process and materials were trailed and validated using a series of themed case studies including medical, food industry and jewellery. Some of the object created great interest and even, in the case of the jewellery items, won awards. Further evidence of the commercial validity was evidenced through a collaborative partnership resulting in the development of a commercial version of the experimental system called Newton3D. A number of exciting potential future directions having been opened up by this project including silicone fabrics, bio material deposition and inclusive software development for user originated infills and structures.
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Jemai, Norchene. "Développement de la technique de sérigraphie pour la formation de billes de connexions inférieures a 100µm pour l'assemblage 3D : optimisation et étude de fiabilité." Thesis, Toulouse, INSA, 2010. http://www.theses.fr/2010ISAT0010/document.
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L’assemblage et le conditionnement en électronique représentent un enjeu de création de nouveaux systèmes électroniques hybrides rassemblant sur un même substrat des éléments électroniques, optiques, mécaniques… La technologie Flip-chip , introduite par IBM et baptisée C4 (Control Collapse Chip Connection), garantit une plus grande densité d’intégration tout en gardant les mêmes dimensions de puce. Au coeur de cette technologie, le « Bumping » est un procédé qui consiste en l’introduction d’une microbille conductrice entre deux plots de connexion des puces afin de réaliser une liaison électrique et mécanique avec le niveau de packaging suivant. La technique de dépôt par sérigraphie de pâte à braser est récemment devenue pratique en raison de son adaptation aux alliages sans plomb. Cette méthode présente l'avantage d'un faible coût et d'une possible production à grande échelle. Nous avons donc choisi de développer cette technique afin d’obtenir des matrices de connexions électriques de dimensions comprises entre 50 μm et 100 μm, pour une pâte à braser de type Sn3.0Ag0.5Cu. Nous avons déterminé les paramètres de sérigraphie afin d’obtenir un minimum d’étalement de pâte pour un remplissage maximum des ouvertures du masque choisi en Ni-électroformé d’épaisseur 50μm : une vitesse de racle de 20mm/s et une vitesse de démoulage de 4mm/s sont par exemple à retenir pour une pâte de type 5. L’étude du masque de sérigraphie a conduit au choix d’ouvertures circulaires. Des formes de billes circulaires ont été obtenues pour des UBM (Under Bump Metallurgy) également circulaires, de diamètre ¼ et ½ le diamètre de l’ouverture du masque. L’optimisation du profil de refusion a permis de déterminer qu’un palier à 180°C, un TAL de 90s ou plus et une température maximale à 250°C favorisaient l’obtention de billes circulaires avec absence de vides. Pour une pâte de type 6, des billes de 60à 70μm de diamètre ont été obtenues pour des ouvertures de masque de 100μm. Une étude de fiabilité de ces billes à partir de tests de cisaillement et de l’analyse des IMC (composés intermétalliques) formés après refusion a permis de montrer que des UBM en Cr-Cu-Au, de diamètre égal à la moitié de l’ouverture du masque, permettaient d’assurer un meilleur maintien mécanique des billes<br>The semiconductor industry has continuously improved its products by increasing the density of integration resulting in an increasing of the I/Os, always with a low cost requirement. To obtain high-density and high-speed packaging, the Flip-Chip interconnection technology was introduced by IBM also called C4 (Control Collapse Chip Connection). Solder bumps have been widely used in electronic industry and were generally based on the Sn-Pb alloy, for its low melting point and good wetting property. Containing highly toxic element (Pb), Pb-Sn solder alloy has been banned. The ternary alloy Sn-Ag-Cu seems to be the best compromise, in fact it as physical and chemical characteristics equivalent to that of Sn-Pb.In this study we are interested to optimize stencil printing process and adjust it with the flip-chip technology, in order to obtain solder bumps which height is between 50µm and 100µm associated to pitches less than or equal to 200µm, using Sn-3.0Ag-0.5Cu solder paste. We have optimized the stencil printing parameters machine, the stencil apertures shape and size (circular shape and 50µm height, for a Ni-electroformed stencil). Spherical solder balls have been achieved with circular UBM (Under Bump Metallurgy), which diameter is ¼ and ½ the diameter of the stencil aperture. The reflow thermal profile is the key to the formation of a reliable solder bump. It must allow a homogeneous reflow for all particles of the metallic solder paste. We define a thermal profile with a Time above liquidus (TAL) of 90s, a temperature in soaking zone (Ts) of 180°C and a maximum temperature (Tmax) of 250°C. For type 6 solder pastes, balls of 60-70µm diameter have been obtained for 100µm stencil apertures.The quality of a solder joint is directly related to the adhesion of the solder ball to the substrate. Among the various methods of mechanical testing, shear testing is the most widely used to assess the strength of the attachment of beads to the substrate and determine the fragility of the ball at the interface caused by the intermetallic layer compounds (IMC) formed after the reflow step. We have shown that Cr-Cu-Au UBM, with a diameter equal to the half of the stencil aperture, ensure the mechanical adhesion of the balls
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Tomašák, Lukáš. "Resinátové pasty." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2014. http://www.nusl.cz/ntk/nusl-221045.
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The work is dedicated to the production of a thick film with resinate paste on a ceramic substrate based on a proposal test motive. It introduced the optimization of the workflow leading to the successful realization of the layer. Using an electron microscope, it is performed evaluation of the quality of resultant layer and analysis of the composition of the paste. In the last part of the work it is carried out measurements of temperature and electrical properties of resinate paste.
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Xu, Chenhui [Verfasser], and N. [Akademischer Betreuer] Willenbacher. "Screen Printing and Rheology of Pastes / Chenhui Xu ; Betreuer: N. Willenbacher." Karlsruhe : KIT-Bibliothek, 2019. http://d-nb.info/1179963636/34.
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Wei, Yang. "Screen printable sacrificial and structural pastes and processes for textile printing." Thesis, University of Southampton, 2013. https://eprints.soton.ac.uk/360759/.
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This thesis presents a new approach for fabricating free standing structures on flexible substrates using the screen printing technique. The research addresses electronic textile applications and is intended to provide a new method for realising sensors and complex structures on fabrics. Conventional smart fabric fabrication methods, such as weaving and knitting, are only able to achieve planar structures with limited functionality. Packaged discrete sensors can also be attached directly to fabrics but this approach is unreliable and unsuitable for mass production. The reported materials and the fabrication processes enable free standing structures to be formed by printing functional layers directly on top of the fabric. This reduces the fabrication complexity and increases wearer comfort and the flexibility of the fabric. This research details an investigation into sacrificial materials suitable for use on fabrics. A plastic crystalline material (Trimetlylolethane (TME)) was identified as an appropriate sacrificial material because it sublimates which reduces the chance of stiction occurring. A screen printable TME paste has been achieved by dissolving TME powder in a solvent mixture of cyclohexanol (CH) and propylene glycol (PG). The TME sacrificial paste can be cured at 85 oC for 5 minutes providing a solid foundation for subsequent printed layers. This sacrificial layer can be removed in 30 minutes at 150 oC leaving no residue. EFV4/4965 UV curable dielectric material was identified as an appropriate structural material for use with TME. The feasibility of the sacrificial and structural materials has been demonstrated by the fabrication of free standing cantilevers and microfluidic pumps on fabrics and flexible plastic films. Printed cantilevers, with capacitive and piezoelectric sensing mechanisms, have been demonstrated as human motion sensors. A printed microfluidic pump with a maximum pumping rate of 68 μL/min at 3 kHz has also been demonstrated. Both the cantilever and micropump have been demonstrated, for the first time, on fabrics and polyimide substrates, respectively.
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Marks, Antony Edward. "Characterisation of lead-free solder pastes and their correlation with the stencil printing process performance." Thesis, University of Greenwich, 2012. http://gala.gre.ac.uk/9456/.
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Solder pastes are complex materials whose properties are governed by many factors. Variations exhibited in solder paste characteristics make it increasingly difficult to understand the correlations between solder paste properties and their printing process performance. The recent EU directives on RoHS (Restriction of Hazardous Substances – enacted by UK regulations) and WEEE (Waste from Electrical and Electronic Equipment) has led to the use of lead-free soldering in the SMA (surface mount assembly) process, and an urgent need for better understanding of the characteristics and printing performance of new solder paste formulations. Equally, as the miniaturisation of hand-held and consumer electronic products continues apace, the solder paste printing process remains a real challenge to the electronics assembly industry. This is because the successful assembly of electronic devices at the ultra-fine pitch and flip-chip geometry requires the deposition of small and consistent paste deposits from pad to pad and from board to board. The paste printing process at this chip-scale geometry depends on conditions such as good paste roll, complete aperture filling and paste release from the apertures onto the substrate pads. This means that the paste flow and deformation behaviour, i.e. the paste rheology, is very important in defining the printing performance of any solder paste. Rheological measurements can be used as a tool to study the deformation or flow experienced by the pastes during the stencil printing process. In addition, the rheological measurements can also be used as a quality control tool in the paste production process for identifying batch-to-batch variation, and to reduce the associated printing defects in the paste printing process. The work reported here on the characterisation of lead-free solder pastes and their correlation with the stencil printing process is divided into five main parts. The first part concerns the study of the effect of variations in flux and particle size distribution (PSD) on the creep recovery performance of lead-free solder pastes used for flip-chip assembly. For this study, a novel technique was calculating the extent of paste recovery and hence characterising the slumping tendency in solder pastes. The second part of the study concerns the influence of long-term ageing on the rheology and print quality of lead-free solder pastes used for flip-chip assembly, and the main focus of the work was to develop methodologies for benchmarking new formulations in terms of shelf life, rheological deterioration and print performance. The third part of the work deals with a rheological simulation study of the effect of variation in applied temperature on the slumping behaviour of lead-free solder pastes, and the fourth part considers the rheological correlation between print performance and abandon time for lead-free solder paste used for flip-chip assembly. The final part of the study concerns the influence of applied stress, application time and recurrence on the rheological creep recovery behaviour of lead-free solder pastes. The research work was funded through the PRIME Faraday EPSRC CASE Studentship grant, and was carried out in collaboration with Henkel Technologies, Hemel Hempstead, UK. The extensive set of results from the experimental programme, in particular relating to the aspect of key paste performance indicators, has been adapted by the industrial partner for implementation as part of a quality assurance (QA) tool in its production plant, and the results have also been disseminated widely through journal publications and presentations at international conferences.
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Fritz, Susanne [Verfasser]. "Contact Formation of Ag/Al Screen-Printing Pastes to Heavily B-Doped c-Si / Susanne Fritz." Konstanz : Bibliothek der Universität Konstanz, 2016. http://d-nb.info/1115667432/34.
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Schneider, Monica [Verfasser]. "Novel concept for the formulation of printing pastes for printable electronics based on the capillary suspension phenomenon / Monica Schneider." Karlsruhe : KIT-Bibliothek, 2017. http://d-nb.info/1133020542/34.
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Ramasubramanian, Arun Shrrivats. "Advanced process window design for 01005 assemblies." Diss., Online access via UMI:, 2008.
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Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008.<br>Includes bibliographical references.
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Feber, Václav. "Impedanční metody v detekci toxických látek." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2009. http://www.nusl.cz/ntk/nusl-217903.
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The aim of this work was focused on the determination of pesticides concentration in water solution. Pesticides are indissoluble in aqueous solutions and impedance or voltametric/amperometric response of the pure water and water with pesticides is identical. Therefore was necessary find a way how rapidly, effectively and economically measure the pesticides concentration. One way is measurement of conductivity with electrochemical microsensors after enzymatic reaction.
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Michaud, Thomas. "Développement de nouvelles pâtes à base de nanoparticules métalliques pour du frittage basse température." Thesis, Université Grenoble Alpes (ComUE), 2019. http://www.theses.fr/2019GREAI050.
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Les nanoparticules métalliques ont la particularité de fritter à des températures bien inférieures que les microparticules. Les pâtes de frittage à base de nanoparticules d'argent (Ag) sont commercialisées pour assembler des puces d'électronique de puissance à leur substrat. L’assemblage se fait classiquement entre 200 et 300°C, sous contrainte. Le joint métallique final obtenu possède d’excellentes propriétés de conductivités électrique et thermique. La température de fusion théorique du joint, une fois densifié, est égale à la température de fusion de l’Ag massif (962°C). Cette propriété fait de ce nanomatériau une excellente alternative dans l’électronique de puissance « haute température ». Le coût de l’argent, qui est un métal précieux, reste un frein à l’utilisation de ces pâtes de frittage. Une alternative pour baisser les coûts est de remplacer les nanoparticules d’argent par des nanoparticules de cuivre. Le cuivre possède des propriétés de conductivités très proches de celles de l’argent. Un obstacle majeur à l’intégration de nanoparticules de cuivre dans des pâtes de frittage est la propension du cuivre à s’oxyder. L’oxydation des nanoparticules empêche le frittage et diminue fortement les propriétés mécaniques ainsi que la conductivité du joint métallique final. En plus de cela, le cuivre, même non oxydé, est moins réactif lors du frittage et nécessite des températures plus élevées pour une bonne densification que l’argent. La stratégie choisie pour protéger les nanoparticules de cuivre de l’oxydation a été de les encapsuler dans un polymère ou avec une fine couche d’argent. L’obtention de systèmes cœur-coquille Cu@Ag, en plus d’augmenter la résistance face à l’oxydation, permet d’améliorer le frittage des joints. Une fois densifiés, les joints à base de nanoparticules Cu@Ag sont capables de résister à des contraintes mécaniques élevées<br>Metallic nanoparticles have the particularity to sinter at lower temperatures compared to microparticles. Silver (Ag) nanoparticles based sintering pastes are commercially available for assembling power electronics chips to their substrates. The assembly is performed between 200 and 300°C, generally under pressure (Hot Pressing) and the resulting metallic joint has excellent thermal and electrical conductivity properties. The theoretical melting temperature of the resulting densified joint corresponds to the melting temperature of bulk silver (962°C), making the silver nanoparticles an alternative for "high temperature" power electronics compared to traditional solder. Nevertheless, the cost of Ag, which is a precious metal, remains a barrier to the use of these sintering pastes. The cost can be reduced by replacing the silver nanoparticles with copper (Cu) nanoparticles. Copper has conductive properties very close to silver. The major hurdle to the integration of copper nanoparticles in sintering pastes is the proneness of copper to oxidation. The oxidation of Cu nanoparticles prevents sintering and greatly reduces the mechanical properties and conductivity of the final metallic joint. Moreover, copper is less reactive during sintering and requires higher temperatures to densify. We chose to protect copper nanoparticles by encapsulation. In a first step copper nanoparticles were synthetized at laboratory scale and semi-industrial scale. In a second step the copper nanoparticles were encapsulated either with a polymer or very thin layer of Ag. The oxidation properties of the core-shell nanoparticles were studied. In a third step the Cu@Ag nanoparticles were formulated in a paste in order to obtain metallic joints. The sintering and density properties of the metallic joints were evaluated and positively compared to the joints obtained with a commercial Ag based paste. The Cu@Ag core-shell system prevents oxidation but also improves the sintering process
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Yüce, Ceren [Verfasser], and N. [Akademischer Betreuer] Willenbacher. "Development of Highly Concentrated Conductive Silver Pastes for Front-Side Metallization of Silicon Solar Cells - Their Flow Properties and Printing Behavior / Ceren Yüce ; Betreuer: N. Willenbacher." Karlsruhe : KIT-Bibliothek, 2019. http://d-nb.info/119312669X/34.
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Gajdoš, Jiří. "Elektrické vlastnosti tlustovrstvých past měřené v širokém rozsahu teplot." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2016. http://www.nusl.cz/ntk/nusl-242183.
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The aim of this master’s thesis is to investigate the electrical properties of various thick-film resistor pastes in a wider temperature range. The thesis mainly focuses on a change in electrical resistance depending on temperatures, which extend to the cryogenic region. To achieve this, there is an overview of the thick-film technology properties, major technological procedures, principles of resistive pastes conductivity, methods of electrical resistance measuring, possible errors in measurement and methods of their minimization. The content of this work is also familiar with the characteristics of a cryogenic station, on this foundation was proposed the measurement procedure and created thick-film circuits for this station. After measurement in the interval 10 K to 350 K, there are subsequently evaluated the data and explains the principles of the conductivity of used pastes.
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Agut, Philippe. "Valorisation des bois feuillus en mélange : possibilités de préparation de pâtes chimiques à haut rendement pour papiers impression-écriture." Grenoble INPG, 1986. http://www.theses.fr/1986INPG0084.
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Mise au point d'une chaine experimentale de preparation de pates a haut rendement pour papiers impression-ecriture a partir d'un melange de chene, chataignier et bouleau. La destructuration des copeaux et la delignification par l'hydrogenosulfite de magnesium constituent les etapes principales de la chaine experimentale retenue et font l'objet d'etudes detaillees, ce qui debouche sur l'optimisation des parametres essentiels. Plusieurs pates chimiques a haut rendement ont ete preparees. Leurs caracteristiques optiques, mecaniques et leur aptitude a l'eclaircissement par le peroxyde d'hydrogene ont ete determinees
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Jian, Zih-Jie, and 簡子傑. "Synthesis of Nano Silver Paste for Ink-jet Printing." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/28858140617141429416.
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碩士<br>大同大學<br>材料工程學系(所)<br>96<br>Silver paste has been widely used for thin-film circuit fabrication process, especially for thin-film transistor and flat panel display. The usage of silver paste in traditional semiconductor fabrication process is including screen-printing, coating, and UV-curing. It was denounced with the consuming of time and cost. Ink-jet technology is a noncontact, quiet, and computerized high-speed technique. By using this technology, we can efficiently use the material to make lower cost and more environmentally-friendly.
The purpose of this research is to develop an ink-jet printable nano silver paste which can be printed on glass substrate and form a well-adhesion conducting wire. The research points are the synthesis of printable silver paste and the patterning ability of it on glass substrate. The higher concentration and lower particle size is on purpose to synthesis in order to get better electric conductivity. Viscosity and surface tension is adjusted for the piezoelectric printing head to make printable paste. Finally, the nano silver paste is printing on different substrates to examine the properties of adhesion and electric conductivity.
The result indicate that tannic acid is not only considered as a reducer but also effect dispersion, viscosity and surface tension of silver ink. Silver particles can be totally reduced from AgNO3 when 15.79g/L tannic acid is added. A well shape and adhesion of silver conducting wire which has 100μm width and 6.7 x 10-6Ω/cm2 sheet resistance can be printed on SnCl2 treated glass.
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Liao, Shiue Kuan, and 廖學寬. "The analysis of solder paste printing process and inspection specification." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/03181661892377556803.
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碩士<br>華梵大學<br>工業工程與經營資訊學系碩士班<br>98<br>60% of the defects in the electronics assembly process come from the solder paste stencil printing process. The stencil aperture and process parameters are the two primary factors. Data collected from the solder paste inspection (SPI) and the corresponding inspection specifications are used to make decision if the rework process needed. The industry typically employs the same specifications for various types of components. However, the amounts of the solder volume to cause the defects are different across various types of components. This study determines the solder volume needed for capacitors, resistors and leaded components based on the component characteristics and PCB pad designs. The ratio of the solder paste volume and the resulted solder volume after reflow soldering is calculated. Considering the industry standard IPC 610-E, the formulas to calculate the required solder paste volume for various types of components are suggested. Restrictions on the aspect ratio and the area ratio per IPC-7525 are also taken into consideration to judge the effectiveness of the proposed stencil aperture designs. Finally, the SPI apparatus was assessed through the technique of MSA. As the inspection capability of the SPI system is verified, we investigated the influences of the process parameters, PCB design and stencil aperture design on the solder paste deposition using the realistic data for the manufacturing process.
This research reviews the data collected from SPI system and the corresponding specifications. The inspection specifications of the solder deposits for bonding pads with irregular stencil aperture design are adjusted to diminish the occurrence of SPI false alarm. In additions, the SPI spec will have major influences on the probability of the occurrences of escape ratio (deceives) and false alarm (acceptable). The above mentioned two scenarios will both result in the quality cost. Therefore, this study considers the SPI data and occurrence of defect after reflow soldering. The SPI specification is suggested by minimizing the total quality cost. For the 0.4mm pitch, the SPI upper specification limit is 0.043mm3. The expected escape ratio and false alarm are 0.133 and 0.664, respectively.
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LEE, HSUN-CHENG, and 李訓政. "Rheological Investigations of Silver Paste Performance for Screen-Printing Application." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/5u67sr.
Full textAbstract:
碩士<br>國立中正大學<br>化學工程研究所<br>105<br>Rheological properties of conductive silver pastes play an important role in fabricating high-performance conducting fine lines (or patterns) for front-side metallization of multi-crystalline silicon solar cells via the screen-printing process. Still, correlating the paste composition and printing performance with its rheological properties remains a challenging task in general. In this study, detailed rheological characterizations, which include oscillatory stress/strain sweep, control-stress/strain frequency sweep, and 3-step (printing) simulation test, were employed to systematically reveal the rheological properties of four representative series of silver paste samples with varying composition of polymer binder (B), thixotropic agent (T), and their blending (B/T) ratio. The impacts on the screen-printing performances, as systematically characterized by Zeta finger profile, electroluminescence (EL) imaging, I-V characterization, and scanning electron microscopy (SEM) imaging, were also explored. Particular emphasis was put on exploring the individual effects of polymer binder, thixotropic agent, and their blending ratio. In this way, we showed that the correlation between paste rheology and screen-printing performance can be readily discerned, paving the way to optimal designs of paste samples for future screen-printing applications.
Keywords: Rheology, Silver pastes, Polymer binder, Thixotropic agent, Screen-printing, Solar cells
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Pan, Yung-Chih, and 潘永智. "Improve SMT solder-paste printing process quality through Six Sigma Approach." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/65036676926693594436.
Full textAbstract:
碩士<br>逢甲大學<br>工業工程與系統管理學研究所<br>94<br>For following the light, thin, short, and small tendency of the consumption electronic products, the electronic assembly technology is also improving. The Surface Mount Technology (SMT) becomes the mainstream of the modern electron assembly industry. It reduces the production cost and makes high quality products. However, in the complex SMT manufacturing environment, many uncertainties appear during the process. It becomes a big issue in the electron assembling industry, especially at the high-density of the electrical components assembling process. If we can’t control the process parameter properly, it will cause the bad soldering ability induce the poor quality, and add a additional production cost.
This article use Six-Sigma method DMAIC to improve the process quality of SMT solder-paste print. Firstly, we find out the key factor of the quality characteristic and evaluate the repeatability and reproducibility of the measurement system. After confirming the process of the capability, we find out the key factor, which affects the process, and then use “Design of Experiments (DOE)” to get the ultimate process parameter.
The specification of the solder-paste printing thickness is 150±20μm. After using DOE to find the best process parameters (scrapper angle: 75°, scrapper speed: 5rpm, scrapper pressure: 0.11 Mpa), the average of the solder-paste printing thickness is increased from 137.95μm to144.98μm, standard deviation is reduced from 2.22 to 1.31, and Cpk is improved from 1.16 to 3.16. From the shown experiment data, it means the new process parameter can improve the ability of the process effectively.
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Huang, Chun-Yuan, and 黃俊淵. "Application of DMAIC to Improve the Quality of SMT Solder Paste Printing." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/dn6qns.
Full textAbstract:
碩士<br>國立屏東科技大學<br>工業管理系所<br>106<br>Based on consumers' requirements for the reliability of electronic products, how to control and improve the quality of SMT has also become an important issue in the electronics industry. The purpose of this study is to prove the rationality of parameter setting and to seek the optimization of process parameters to effectively control the quality of products to meet customer needs and enhance customer satisfaction. In this study, the DMAIC improvement process of six standard deviations will be combined with the "multi-stage two-level" full factorial experiment to optimize the process parameters. The experimental results show that the process capability of solder paste printing is obviously improved. The optimization method of "multi-level two-level" parameter is more streamlined than traditional full factor experiments. When the interaction between factors is significant, the improvement effect is better than Taguchi method.
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陳彥彰. "The Relationship Between Stencil Features and Paste Deposition in Surface Mounted Printing Processes." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/86147174305683282881.
Full textAbstract:
碩士<br>明新科技大學<br>工程管理研究所<br>96<br>Following by the highly development of the consuming electronic products and the trend toward the miniatureel size and user-friendly interfaces, the well-implementation of Surface Mount Technology (SMT) in today’s printed circuit board (PCB) assemblies is becoming more crucial during the processes. With the increasing difficulties and complexity of surface mounted techniques due to the miniature of electronic devices, the process yield descends and the extra cost increases. Therefore the improvement of the producing process is becoming more and more urgent now. According to the related research, 52%~71% of the SMT process’ defects come from stencil printing process; so, if we can effectively eliminate the printing process defects, we can largely improve the yield of the SMT.
DOE and Regression techniques are applied in this research to explore the relations between geometric features of stencil aperture and amount of solder paste deposition. With the experiment analysis conducted the solder paste deposition models were derived. First, we consider the significant factors that impact the process of stencil printing. Then, we use ANOVA to find out the factors that influence the solder paste deposition. Next, we use RSM to build up the models and optimize the parameters. The result of this research is to develop the regression models of the round and square aperture in the paste deposition, find out the optimal solutions of stable paste deposition and develop the quality control chart of the paste. The goal is to offer the performance evaluation of solder paste deposition for the process engineers when they attempt to design the appropriate stencil at the very first beginning of process development.
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Wu, Jeong-Heron, and 吳炯宏. "Using Taguchi Method to Determine the Optimal Parameters for Solder Paste Printing Process." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/8qpyvj.
Full textAbstract:
碩士<br>國立虎尾科技大學<br>工業工程與管理研究所在職專班<br>99<br>Due to the advances in surface mount technology (SMT) in recent years, DRAM module has trended to become lighter, thinner, shorter, smaller, and have large capacity and fast processing speed. In the face of advanced SMT technology, requirements for the circuit board solder paste printing process have become increasingly strict.
Currently the industry uses rule of thumb to determine the printing parameters which is time-consuming and expensive. Therefore, this study applies Taguchi method in determining the optimal parameters for solder paste printing process. The parameters including scraping speed, pad spacing, hole-opening ratio, scraping pressure, stripping speed, solder paste type, plate thickness, and paste viscosity are used as control factors. Solder paste thickness, volume, and based-area data are inputted into the XML Watcher software for analysis with related category parts, then the Process Insight process capability analysis software is used to determine process capability of the best printing parameter combination.
The optimal parameters combination has found for 0.30mm, 0.35mm and 0.40mm pad printing process. In addition, a validation experiment has been performed. The result shows that 0.30mm printing process capability increases from current value of Cpk = 1.456 to Cpk = 1.698.
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Chuan-Chia-Hsieh and 謝全家. "Using Six Sigma approach to improve the quality of SMT solder paste printing." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/pukyj3.
Full textAbstract:
碩士<br>元智大學<br>工業工程與管理學系<br>107<br>This study is based on five major steps of six Sigma (6σ)-DMAIC. Improve the quality of Surface Mount Technology (SMT) solder paste printing process, First find out the key quality characteristics, First find out the key quality characteristics, and use the Solder Paste Inspection (SPI) to measurement height of solder to confirm the capability by solder paste printing process currently. Use the Cause-and-Effect diagram (fishbone diagram) to find out the key factors affecting the solder paste printing process. Use the Cause-and-Effect diagram (fishbone diagram) to find out the key factors affecting the solder paste printing process, and then using Design of Experiments (DOE) to experiment to find the best solution for the parameters currently used. Finally, use Central Composite Design (CCD) to find out the best combination of solder paste printing. Reduce the soldering issues caused by soldering print process: excessive solder; Solder insufficient; Solder empty; Solder Bridge; Solder open...etc. Lead to Quality go down and addition unnecessary costs spent.
The SMT solder paste printing process specification is 0.15±0.03mm.The solder paste printing equipment using optimum parameter: scraper pressure: 12Kg, scraper speed: 40 mm/s, and stripping speed: 1.67 mm/s for tracking and confirmation. Found that after using optimum parameter of solder printing equipment. The average solder paste height is reduced from 0.1570mm to 0.1506mm. The standard deviation is reduced from 0.0100mm to 0.0043mm, and the CPK of solder paste printing has also increased from 0.75 to 2.01. Also, SMT production yield rate is increased from 93.3 to 98.6%. More importantly, the production power consumption is reduced from 18,188.28 to 17,158.41 (degrees/month), and the monthly carbon emissions are reduced by 570.55 (Kg-Coe/month), which not only saves the cost of the case company. To achieve environmental benefits, the direction of this research and its improvement methods are effective.
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Kao, Yung-Chih, and 高永智. "Application of Response Surface Methodology in the Solder Paste Printing Process of SMT." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/18950212948916394815.
Full textAbstract:
碩士<br>龍華科技大學<br>機械工程系碩士班<br>103<br>Nowadays, most of the electronic products put their emphasis on beneficial functionality and diversity. Also, the size of products tends to lighter and thinner. Therefore, the surface mount technology (SMT) plays an important role in the process of production. There are three major steps in SMT: the screen printer, the component placement and the reflow oven. Among the entire SMT process, Screen Printer is the most important key for the quality and stability of the entire production.
Four process parameters: the printing pressure paste printing process, the printing speed, printing snap-off distance and printing snap-off speed were used in this study.The response surface methodology was applied to 30 different combinations of process parameters experimental analysis. A predict equation for the solder paste printing process parameters with constituted height, area and volume was found.In order to understand and predict printing process parameters associated with the printing of tin, the ANOVA showed that the printing pressure and printing speed wasthe most important influencing parameters.Thelast optimal parameters printing pressure 86.67N, printing speed 225.76mm/s, printing snap-off distance 0.15mm,printing snap-off speed 1.82mm/s predicted value and the actual measurement error may be less than 0.3%, the result shows the optimization of process parameters in the predict equations for the standard value of the height, area and volume were agree with the target predict equation from the actual measurement results.
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Liu, Meng-Hsin, and 劉孟鑫. "The Use of MTS in the Selection of Inspection Area for Solder Paste Printing." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/00577058322130085155.
Full textAbstract:
碩士<br>華梵大學<br>工業工程與經營資訊學系碩士班<br>96<br>Surface Mount Technology(SMT) helps achieve miniaturation of end product and lower production cost in the electronics packaging and assembly. SMT includes the solder paste printing, chip mounting, and reflow soldering process. Amount of solder paste deposited during the printing process plays important role to the assembly yield. Therefore, the selection of locations to be inspected for solder volume/height is critical in the assembly process.
This research applies Mahalanobis-Taguchi System (MTS) in determining solder joints for Solder Paste Inspection(SPI) after printing process. We evaluate the necessity of inspection from signal to noise ratio gain of all solder joints. The number of solder joint to be inspected can be reduced concurrently ensure desired the quality level. The Chebyshev’s theorem is then employed to forecast a probabilistic threshold to identify the printing failure.
The result indicates that within a total of 203 solder joints, 121 solder joints are found to be critical and suggested for inspection based on the signal to noise ratio gain. The optimal scenario is with a reduction ratio of 40.4%. The reliability is confirmed and the probabilistic threshold is 5.046. This can be uses as a threshold for determining failure or pass in to printing process.
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Wu, Hsiao-Kun, and 吳曉坤. "A Case Study of Parameter Optimization of Solder Paste Printing Quality with the Six Sigma Approach." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/20983937041519082578.
Full textAbstract:
碩士<br>國立雲林科技大學<br>工業工程與管理研究所碩士班<br>100<br>The process of today''s electronics industry trend toward the various components of light, thin, short, small, and this way only the minimum area fit in more integrated circuits, modern life is increasingly inseparable from the PC. DRAM production need to rely on the SMT technology, within a length of 132mm wide and 32mm, you must fill in more than one hundred pieces by the volleyball Resistors, capacitance, IC and other electronic components, SMT technology to become an important indicator. Affect the SMT process factors have many, poor SMT process will cause product Non-Soldering, short circuit, missing components additional component ..., etc., and result in product yield decline, poor quality, rising costs, etc., so the good SMT process is all electronics industry to discuss exploration project
This study to identify the elements that affect the SMT process using Six Sigma DMAIC mode to collect measurement data and the review and improvement, the use of experimental design (Design of Experiments, DOE) way to find out the best solder paste print parameters
The best solder paste print parameters found by the experimental results of this study were: squeegee pressure 60N, squeegee speed of 20mm / s, the squeegee angle of 60°, Cpk values enhance from the original 0.95 to 2.64, in accordance with the experimental results to improve be effectively improved, relatively lower cost of production, has been successfully imported production lines and perform.
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Chen, Jai-Qing, and 陳佳慶. "Application of grey relation method and Taguchi's methodology in the solder paste printing process of SMT." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/49353039886049729608.
Full textAbstract:
碩士<br>龍華科技大學<br>機械工程系碩士班<br>102<br>Nowadays, most electronic products put their emphasis on outstanding functionality and diversity. Also, the size of products tends to lighter and thinner. Therefore, SMT ( Surfance Mount Technology) plays an important role in production. There are three major stpes in SMT: (1) Screen printer (2) Component placement and (3) Reflow oven. Among the entire SMT production process, Screen Printer is the most important key at quality and stability of the entire production.
This study does analysis on several process parameters with a little experiment data, adopted table orthogonal experimental design and simple ANOVA from Taguchi Methods to get the optimal height parameter A3B2C1D1 and the optimal area parameter A2B1C2D1, then brought the height and area results from Taguchi Methods into these in order to carry grey relation. It compared the situation and correlation from changes of two factors, and found the optimal print parameter, which is A2B2C1D1 ( printing pressure 80N, printing speed 100 mm/sec, printing snap-off distance 0.2mm and printing snap-off speed 2mm/sec). The results accord with those states from thories and also conform to the goal vales.
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Lu, Po-Jen, and 盧柏任. "Application of Taguchi's method and response surface methodology in the solder paste printing process of SMT." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/41138400733458754055.
Full textAbstract:
碩士<br>龍華科技大學<br>機械工程系碩士班<br>102<br>In today’s electronics industry, consumers are increasingly demanding higher quality 3C products, including products with slimmer designs. This trend highlights the importance of surface mount technology. This technology can be roughly divided into three steps: stencil printing, component placement, and solder reflow. The first step, stencil printing, is especially crucial because it may cause the failure of subsequent processing if the printing quality is low. In addition to having to spend more time, redoing the work would also mean spending more money.
This study used a combination of the Taguchi and response surface methods for the solder paste printing process’ technical volume, choosing four parameters (squeegee pressure、squeegee speed、snap-off height and snap-off speed), with each parameter containing three levels. Then the study used L9(34) orthogonal array, followed by Taguchi’s nominal-the-best method to analyze, with the target value set at 2073600 μm3. The optimum parameters achieved were: squeegee pressure 80 N, squeegee speed 50 mm/s, snap-off height 0.2 mm, and snap-off speed 2 mm/s. In the end, the results from the response surface regression analysis were used to deduce the predicted volume of solder paste and the optimum parameters. This method allowed us to achieve a paste volume predicted value of 1899124 μm3. The result showed that the predicted values are closer to our target values.
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TSAI, HAN-WEI, and 蔡瀚緯. "Developing the prediction models of solder paste volume for stencil printing process in surface mount assembly-A case study of stencil printing for TQFP package." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/r974z2.
Full textAbstract:
碩士<br>國立高雄科技大學<br>工業工程與管理系<br>108<br>Surface mount technology (SMT) is the main process to produce many types of modern electronics products in electronics assembly industry. SMT consists of three sub-processes: (1) solder paste stencil printing, (2) component placement, and (3) solder reflow. Based on literatures and industrial reports, a poor solder paste printing performance can lead to an averaged 60% of soldering defect, which increases manufacturing costs and jeopardizes product quality. Generally, engineers integrate their working experience with a variety of trial-and-error approaches to resolve stencil printing problems. However, this process troubleshooting approach also induces a lot of nonproductive production time and costs. The thin quad plat package (TQFP) is with the highest stencil printing defect rate in SMT process. In this research, three solder paste volume prediction models include multiple regression, regression tree, and neural network were developed using the experimental data, the parameter settings of stencil printer, and solder paste inspection data, to quickly predict the solder paste volume of a TQFP package. These three prediction models were validated and evaluated using empirical data collected from production line. The evaluation result shows that regression tree model exhibits a superior prediction accuracy and dynamic changes of printing parameters. This research results can be used as the basis of smart manufacturing and as a reference and application in the electronics assembly industry.
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Nguyen, Hoang-Nam, and 阮皇南. "Using Six-Sigma and Taguchi Method to Improve the Quality of Solder Paste Printing in PCB Processing." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/63710457675995441932.
Full textAbstract:
碩士<br>國立高雄應用科技大學<br>精密模具與機械產研碩士外國專班<br>99<br>As from1990s, a Six Sigma approach has been popularly used as techniques and statistical analysis tools in commercial, industrial environment, business and service quality. A Six Sigma has demonstrated to be effective in increasing customers’ satisfaction, decreasing costs, reducing defects and profitable warranty. Using statistic quality method is special significant in the manufacture of PCB (printed circuit board). Experience in this process has shown that over 60% of all circuit failures are related with the printed process which is perceived as the most critical process in the PCB manufacture. According to the present process capability, the sigma level of the printed process is not very satisfying. Therefore, the aim of this research is to apply the Six-Sigma DMAIC (Define, Measure, Analyze, Improve and Control) approach to reducing the defects and improving the quality of PCB. At the beginning steps, process capability analysis (PCA) is used to inspect and analyze the present printing operation. Afterwards, Taguchi method is used to design experiment, analyze the significant factors and determine the optimum settings. By applying the optimal settings, the printing process can be improved and a higher Six Sigma level can be attained.
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Chung, Ming-Ching, and 鍾明錦. "The Process and Reliability of Ta/CuTa/Cu/Ni/Au/Solder Bump Produced with Solder Paste Printing." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/65840956306212272614.
Full textAbstract:
碩士<br>國立成功大學<br>材料科學及工程學系<br>89<br>The objective of this research was to fabricate Ta/CuTa/Cu/Ni/Au/Solder solder bumps using solder paste printing. It was focused on the fabrication of solder bumps, reliability analysis and the printing process of solder paste. In this research, the copper thin film is the conductor layer, the electroless Ni-P layer was prepared as the diffusion barrier layer and electroless gold layer was applied as wetting layer. A lithography process was applied to produce the desired bumping pads.
The Cu pad was activated by ultrasonic vibrating in the 7.5wt﹪dimethylamine borane solution for 3min. Then the 5μm crystal Ni-P layer that containing 5.58wt﹪phosphorus was produced by pumping in the electroless nickel solution at 83℃ for 30min. The positive photosensitive polyimide was applied as a passivation layer. The experimental results revealed that the solder bumps were achievable with 30μm negative photosensitive polyimide, 150μm diameter circular openings, and at a squeegee speed 35mm/sec, squeegee angle 0°and squeegee pressure 2 kgf/cm2. The best reflow result was achieved by a temperature ramp of 0.5℃/sec and holding at 230℃ for 30sec. The shear strength of solder bumps tended to increase after testing at 85℃RH85﹪ for 1000hours, while the fracture occurred at the solder. The SEM line scanning results revealed that the Cu atoms did not penetrate through the Ni-P layer after aging at 150℃ or under 85℃RH85﹪ for 1000hours. It only forms the Ni3Sn4 compound at Ni-P/63Sn-37Pb after reflow or reliability tests.
英文摘要…………………………………………………………… II
總目錄……………………………………………………………… III
圖目錄……………………………………………………………… VI
表目錄……………………………………………………………… X
第壹章 簡介………………………………………………………… 1
1-1電子構裝技術………………………………………………… 1
1-2覆晶接合技術………………………………………………… 1
1-2-1網版印刷製程…………………………………………… 4
1-3銲錫隆點材料………………………………………………… 6
1-4錫膏…………………………………………………………… 8
1-4-1銲錫粉…………………………………………………… 8
1-4-2助熔劑…………………………………………………… 9
1-5無電鍍（化學析鍍）………………………………………… 13
1-5-1無電鍍鎳之性質與其在電子構裝上之應用…………… 13
1-5-2二甲胺硼烷活化（Dimethylamine Borane）…………… 15
1-6聚亞醯胺…………………………………………………… 18
1-6-1聚亞醯胺的應用與分類………………………………… 18
1-6-2趕光行聚亞醯胺特性的影響因素……………………… 21
1-7研究目的…………………………………………………… 21
第貳章 實驗方法與步驟…………………………………………… 26
2-1實驗構想……………………………………………………… 26
2-2試片的製備…………………………………………………… 26
2-2-1矽晶片前處理…………………………………………… 26
2-2-2微影製程………………………………………………… 30
2-2-3濺鍍製程………………………………………………… 33
2-2-4剝膜製程………………………………………………… 33
2-3無電鍍析鍍…………………………………………………… 33
2-3-1二甲胺硼烷（DMAB）活化……………………………… 33
2-3-2無電鍍鎳………………………………………………… 37
2-3-3無電鍍金………………………………………………… 37
2-4 錫膏與感光型聚亞醯胺之特性分析……………………… 37
2-4-1錫膏特性分析………………………………………… 37
2-4-1-1表面觀察與成份分析……………………………… 41
2-4-1-2錫膏之示差掃描熱量分析………………………… 41
2-4-1-3錫膏之熱重分析…………………………………… 41
2-4-2 感光型聚亞醯胺之熱重分析………………………… 42
2-5感光型聚亞醯胺之微影製程………………………………… 42
2-5-1正型感光型聚亞醯胺的塗佈微影製程………………… 42
2-5-2負型感光型聚亞醯胺的塗佈微影製程………………… 43
2-6錫膏網印製程………………………………………………… 43
2-7可靠度試驗………………………………………………… 48
2-7-1 恆溫恆濕試驗………………………………………… 48
2-7-2 高溫時效試驗………………………………………… 48
第參章 結果與討論…………………………………………………49
3-1無電鍍析鍍…………………………………………………… 49
3-1-1二甲胺硼烷（DMAB）活化機制……………………… 49
3-1-2無電鍍鎳鍍層之析鍍速率、結構與成份分析………… 49
3-1-3無電鍍金………………………………………………… 53
3-2感光型聚亞醯胺與錫膏之材料分析與參數設定…………… 55
3-2-1正型感光型聚亞醯胺…………………………………… 55
3-2-2負型感光型聚亞醯胺…………………………………… 55
3-2-3錫膏……………………………………………………… 61
3-3 錫膏印製…………………………………………………… 66
3-3-1負型感光型聚亞醯胺厚度對錫膏印製結果之影響…… 66
3-3-2印製條件對錫膏印製結果之影響……………………… 66
3-3-3負型感光型聚亞醯胺開孔形狀對錫膏印製與迴銲結果之
影響…………………………………………………… 66
3-3-4迴銲曲線對銲錫隆點微結構之影響…………………… 77
3-4擴散障礙效果與界面反應分析……………………………… 84
3-4-1擴散障礙效果…………………………………………… 84
3-4-2介金屬化合物的表面形態與結晶相分析……………… 84
3-5剪力強度試驗………………………………………………… 95
第肆章 結論…………………………………………………… 102
第伍章 未來研究方向之建議………………………………… 103
參考資料………………………………………………………… 104
附錄一 銲錫隆點直徑、高度與底層接觸面積公式之推導…… 111
附錄二 銲錫隆點剪力強度單位換算………………………… 113
致謝……………………………………………………………… 115
自述…………………………………………………………… 116
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Lin, Chih-Ming, and 林志明. "The Effect of Organic Binder on the Screen Printing Features of Conducting Paste on the Solar Cell." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/87c7u3.
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碩士<br>國立高雄應用科技大學<br>化學工程與材料工程系碩士在職專班<br>103<br>This study investigates the different structure and different molecular weight resin, configure the conductive paste in different circumstances solid content ratio and a thixotropic agent added, with network printer parameters conductive paste coating on the solar silicon chip via sintering after observe the solar cell front finger width and cell conversion efficiency, in order to understand the impact of the relevant parameters.
From the results, the difference of organic carrier resin structure, solids content change and thixotropic agent added, it indeed affects the appearance of the finger and therefore affects cell efficiency. In both ethylcellulose resin formulations, because of ethylcellulose molecular size, it leads to the narrow finger screen printing. Nevertheless the high viscosity results in the pasteloss of finger, so that the average battery efficiency is 13.5%. The use of conductive paste acrylic resin, due to their different structures, so that the low viscosity, the finger width is wide, and has better integrity of finger, so the efficiency is the best, the average cell efficiency is 18.9%. In addition, the thixotropic agent added not only changes the rheological properties of paste, but also narrows down finger to enhance efficiency. to acrylic resin as an example, its efficiency can be further increased to about 0.1% . First, choose a direction from the organic carrier, and then the viscosity of the thixotropic agent or other functional trimming to do, and thus enhance the efficiency of solar cells.
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Wen-YenChang and 張文嚴. "Promotion of Paste Screen Printing Poly Crystalline Silicon Solar Cell Convert Efficiency with the Novel Firing Technology." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/90713252829167043858.
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Pan, Jianbiao. "Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly /." Diss., 2000. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:9982874.
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Lin, Terng, and 林籐. "Integration of Taguchi Method and Artificial Neural Network for Determining Optimal Solder-paste Printing Process Parameters at SMT line." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/35401121488652739720.
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碩士<br>國立臺北科技大學<br>生產系統工程與管理研究所<br>90<br>The solder printing is the crucial process at the SMT line in the PC main logic board assembly factory. A deficient solder printing may result in the defective solder joint between the chip’s lead and solder pad (or print foot) over the PCB. Variable and complicated factors have controlled the solder printing process simultaneously when the printing is being operated. Therefore, selecting suitable factors with optimum parameter settings is the most one way to get a sound solders printing quality. Furthermore, the tinier the stencil’s opening size, the more the deficient solder printing. So, the controllable factors with parameter setting will play the major roles during the solder printing process, e.g., print speed, total force, down stop, solder quality etc.
In this thesis, under the condition of specific stencil’s thickness and openings with fixed solder paste type, using the integration of Taguchi Method and Artificial Neural Network to determine the Optimal Solder-paste Printing Process Parameters at SMT line. The purpose of the thesis is to provide the reliable and practicable “Optimal Solder-paste Printing Process Parameters” prediction. Based on Taguchi Method, the network structure of ANN’s Back-Propagation Network was determined that solder printing parameter play as the input data and the solder coverage rate as the output data. By the training process of BPN, the network could make a prediction of the output of solder coverage rate. Besides, BPN’s has demonstrated a superior prediction capability than the regression predictions.
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Chang, Po-Min, and 張博閔. "Study on Optimization Controllable Factors of the SMT Solder Paste Printing Process by Using Taguchi Method and Artificial Neural Networks." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/52858304174637240827.
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碩士<br>中興大學<br>機械工程學系所<br>95<br>Due to its low cost and high production quality essences, the surface mount technology (SMT) has replaced the conventional wave soldering as the key technology in the attachment of electronic components to a printed circuit board. The SMT process includes solder paste printing, component mounting, and reflow solder. Among them, the solder paste printing is the most critical stage and counts for 52%~71% of the overall soldering defects. However, the dependency of the printing results on the process parameters is highly nonlinear and not well understood.
In this research, the Taguchi method was implemented to investigate the dependency of the deposited solder paste’ volume on the five key process parameters: material of the scraper, tilting angle of the scraper, feed rate of the scraper, down force of the scraper, and clearance between the substrate and the steel plate. The relatively optimal parameter set to minimize the product variation was obtained. An implicit process model using the Taguchi experimental data was then formulated by a feedforward neural network such that the relatively optimal parameter set can be further well tuned.
The validation experiment using the well tuned parameter set confirmed that both the Cp and Cpk values can be increased by 5.5-fold.
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Chih, Chun-Chang, and 張智鈞. "Improving the Lead-Free Solder-Paste Quality in Printing Process using Design of Experiments–A case Study of D Company." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/b6g6sf.
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碩士<br>國立交通大學<br>管理學院工業工程與管理學程<br>103<br>Due to the market demand of high speed computing, saving energy and size thinning in network production, the circuit design becomes complicated. This causes increasing density of devices. Accordingly, the size of SMD and the pitch of IC become smaller than before. The Printed Circuit Board Assembly (PCBA) manufacturer needs to improve the quality of the solder printing process. Therefore, the main objective of this study is to enhance the solder thickness to its target by utilizing Design of Experiments (DOE) to find out the optimal parameter setting for solder printing machine. A Case study of D company is utilized to demonstrate the effectiveness of the proposed optimal parameter setting.
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Wen-HsienWang and 王文賢. "Studies of Novel Color MIC Poly-Si Thin Film and Paste Screen Printing Poly-Si Solar Cells for BIPV Applications." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/80086769147848197161.
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Wang, Jian-Hung, and 王健鴻. "Combining Taguchi Methods, Neural Networks Desirability Function and Meta-Heuristic Algorithm for Optimizing the Parameter Design of Solder Paste Printing Process." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/58385624249541543804.
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碩士<br>國立清華大學<br>工業工程與工程管理學系<br>101<br>With the demand for various types of electronic products tend to be light, thin, short and small. The precision of parts and the density between the parts of the printed circuit board will increase. In order to control product cost effectively and enhance production quality and efficiency, the manufacturers must find the advanced manufacturing technology to improve surface mount technology. Most surface mount technology problems are correlated to solder paste printing (Pan et al. 1999 , Huang 2010, Tsai 2008), and solder paste volume is an important quality measure of solder paste printing process. Therefore, controlling the solder paste volume is a key production technologies to obtain high–yield rate and maintain production effectiveness.
Controlling the solder paste volume is an operating window problem, plenty of parameters will affect the output; if we only rely on engineer’s experiences to determine the values, the defect rate may increase owing to the unstable manufacturing process. This study proposes a systematic procedure for parameter optimization of the solder paste printing process. First, historical data and engineering knowledge are used to determine the significant factors. Second, the ideal squeegee pressure and optimal parameter settings are determined by using Taguchi methods. Also, we propose utilizing back-propagation neural network and desirability function and integrating genetic algorithm, particle swarm optimization, and simulate anneal to obtain the optimal parameter combination. A real case was implemented and analyzed to demonstrate the proposed approach’s effectiveness. The results show that our proposed method can reduce the waste of solder paste volume and substantially increase the operation window width in order to improve product quality.
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Yan-WeiLiou та 劉晏維. "Effects of Anti-Reflection Coating on α-Si:H/nc-Si Composite Thin Film and Paste Screen Printing Poly Crystalline Silicon Solar Cell Efficiency". Thesis, 2011. http://ndltd.ncl.edu.tw/handle/11264205766977851680.
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Silva, Patrícia Liliana Oliveira da. "Estudo da reprodutibilidade do estampado com pigmentos atendendo às variáveis da pasta e do processo." Master's thesis, 2016. http://hdl.handle.net/1822/46792.
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Dissertação de mestrado integrado em Engenharia Têxtil<br>O tema proposto a ser desenvolvido na presente dissertação foi:” Estudo da reprodutibilidade do estampado com pigmentos atendendo às variáveis da pasta e do processo “
Inicialmente o objetivo desta dissertação era a alteração dos injetores de uma máquina de pipetar automática, mas no decorrer do estudo verificou-se que tal não era possível sem antes ser feito o devido estudo sobre a viscosidade das pastas pigmentárias, e de que forma esta tem influência na elaboração de uma receita de pasta pigmentária. .
Assim foi feito um estudo exaustivo sobre a viscosidade das pastas pigmentárias no processo utilizado na mesa de estampar amostras e no processo utilizado na máquina de estampar a rolo na produção.
O estudo consiste em fazer uma análise das viscosidade nas pastas pigmentárias, tendo em conta a influência de cada produto auxiliar e pigmento utilizado na preparação da pasta mãe.
Foram feitos estudos sobre a viscosidade, o grau de cobertura, e o rendimento colorístico obtido para cada desenho..
Realizaram-se ainda ensaios de reprodutibilidade entre o processo de estampar amostras, e o processo de estampar utilizado na produção.<br>The theme proposed to be developed in this dissertation was: "Study of the reproducibility of the pigments printing, concerning variables of the process and paste “
Initially, the aim of this work was to change the injectors of an automatic pipetting machine but during the study it was found that this was not possible without first being made proper study on the viscosity of the pigment pastes, and how this has influence in developing a revenue printing paste.
Thus, an exhaustive study on the viscosity of the pigment pastes in the process of printing samples, and process to printing machine production process was done.
The study consists to make an analysis of the viscosity pigment pastes. taking into account an influence of pod auxiliary product and pigment used in the preparation of the mother dough. Studies were done on the viscosity and degree of coverage of each design, as well as the color yield. Reproducibility tests were also carried out between the printing process and the stamping process
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Campos, Tatiana Vilaça. "Exploração da utilização de pasta de papel na fabricação aditiva em arquitetura." Master's thesis, 2019. http://hdl.handle.net/1822/59881.
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Dissertação de mestrado em Construção e Tecnologia<br>Considerando uma abordagem transformadora na indústria, as técnicas de fabrico aditivo (FA) transformaram várias áreas ao longo das últimas décadas, como a arquitetura e a engenharia, no que toca à produção de sistemas e revestimentos mais complexos. Estes fatores foram executáveis devido à constante evolução tecnológica, conseguida através da alteração do paradigma do pensamento analógico-digital. O ‘fabrico aditivo’ é um processo de transformação que advém de um desenho digital e rematasse num modelo físico, culminando a capacidade de criação de um modelo tridimensional por meio da adição do próprio material - Aditivo. Denominar este processo de ‘impressão 3D’ ou ‘prototipagem rápida’ é incorreto, uma vez que estes dois termos na realidade são duas vertentes que surgiram do FA. Cada objeto produzido para prototipagem é digitalmente definido pela utilização de softwares Computer Aided Design (CAD), onde, através da geração de um código é possível “fatiar” o objeto para a sua produção. Embora as técnicas de FA possam suscitar surpresas para alguns utilizadores, a sua existência remota à várias décadas, sofrendo assim constantes evoluções transversalmente ao desenvolvimento tecnológico. Quando aplicadas em determinados contextos oferecem elevadas vantagens, maiormente na obtenção de modelos com um elevado rigor e detalhe.
A pesquisa de ‘novos’ materiais é possível, se se constatar que ao longo desta investigação, é pretendido aumentar o conhecimento, adquirido até à data, para possíveis misturas compósitas oportunas para utilização em arquitetura. Graças às tecnologias de fabrico aditivo e à integração de processos de modelação tridimensional, a celulose, efetivamente pode ser considerada uma nova possibilidade para a produção de elementos arquitetónicos quando adicionada estrategicamente com determinados materiais. O desenvolvimento de variadas misturas poderá beneficiar o campo tecnológico, mais concretamente a impressão 3D e prototipagem rápida, através da laboração de uma pasta possível de utilizar para a personalização de componentes arquitetónicos, com baixos custos de produção.
O principal caso de estudo desta investigação centra-se no desenvolvimento de uma parede modular, que utiliza como base blocos hexagonais regulares. Será desenvolvida com o intuito de compilar todos os resultados obtidos com o estudo da celulose e a possibilidade de união a outros materiais. Toda a parede será engendrada através de razões paramétricas, recorrendo a programas computacionais, fazendo-se variar a geometria de cada bloco segundo parâmetros definidos.<br>Considering a transformative approach in the industry, additive manufacturing (AM) techniques have been transforming several areas in the past decades, such as architecture and engineering, regarding systems productions and complex coatings. These factors were executable due to the constant technological evolution, achieved through the alteration of the paradigm of analogical-digital thinking. The ‘additive manufacturing’ is a process of transformation that accrues from a digital design and comes into a physical model, culminating the ability to create a three - dimensional model through the addition of the material itself - Additive. To name this process of ‘3D printing’ or ‘rapid prototyping’ is incorrect, since these two terms are actually two strands that arose from the AM. Each object produced for prototyping is digitally defined by the use of Computer Aided Design (CAD) software, where, through the generation of a code, it is possible to “slice” the object for its production. Although the AM techniques can cause surprises for some users, their existence is remote for several decades, thus suffering constant changes across technology development. When applied in certain contexts they might offer high advantages, mainly by obtaining models with high rigor and detail.
The research of ‘new’ materials is possible, has it has been verified throughout this investigation, it is intended to increase the knowledge, acquired so far, for possible composite mixtures suitable for architecture use. Thanks to the technologies of additive manufacturing and the integration of three-dimensional modeling processes, cellulose can effectively be considered as a new possibility at the production of architectural elements when added strategically with certain materials. The development of various mixes could benefit the technological field, namely 3D printing and rapid prototyping, by working with a paste that can be used for personal customization in architectural components, regarding low cost production.
The main case on this research focuses on the development of a modular wall, which uses regular hexagonal blocks as base. It will be developed with the purpose of compiling all the results obtained with the study of cellulose and the possibility of union with other materials. The entire wall will be generated through parametric reasons, using computational programs, by making the geometry of each block vary according to defined parameters.