Academic literature on the topic 'Property Packaging'
Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles
Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Property Packaging.'
Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.
You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.
Journal articles on the topic "Property Packaging"
Lu, Jian Dong, Wen Cai Xu, and Gai Mei Zhang. "The Dynamic Cushioning Property Analysis of Gasbag Packaging." Applied Mechanics and Materials 200 (October 2012): 37–41. http://dx.doi.org/10.4028/www.scientific.net/amm.200.37.
Full textAn, Xiao Hui, Peng Liu, Qiang Meng, Cheng Gong Su, and Shuang Zhao. "Research on Life Cycle Environmental Property of Biomass Biodegradable Packaging Material." Applied Mechanics and Materials 670-671 (October 2014): 1620–23. http://dx.doi.org/10.4028/www.scientific.net/amm.670-671.1620.
Full textZhang, Sheng, Wen Chao Gu, Zheng Yong Cheng, Wen Juan Gu, and Ying Li. "Permeability of Packaging Materials." Advanced Materials Research 904 (March 2014): 192–94. http://dx.doi.org/10.4028/www.scientific.net/amr.904.192.
Full textO'Dell, Eoin. "Property and Proportionality: Evaluating Ireland’s Tobacco Packaging Legislation." QUT Law Review 17, no. 2 (November 24, 2017): 46. http://dx.doi.org/10.5204/qutlr.v17i2.714.
Full textXing, Huai Nian, Xiao Peng Zhang, Zeng Li Liu, and Li Qiang Jin. "Mechanical Property Test Study on Composite Board Box." Advanced Materials Research 538-541 (June 2012): 1796–99. http://dx.doi.org/10.4028/www.scientific.net/amr.538-541.1796.
Full textLandon, M. D., and R. J. Balling. "Optimal Packaging of Complex Parametric Solids According to Mass Property Criteria." Journal of Mechanical Design 116, no. 2 (June 1, 1994): 375–81. http://dx.doi.org/10.1115/1.2919389.
Full textYAGI, Harumi, Osamu HIGASHI, Masayuki OCHIAI, Yoshihisa KAMIYA, Hitoshi HONMA, Masayuki KITAJIMA, and Tsuyoshi YAMAMOTO. "Lead-Free Solders Property and Reliability of Electronics Packaging." Proceedings of the 1992 Annual Meeting of JSME/MMD 2002 (2002): 225–26. http://dx.doi.org/10.1299/jsmezairiki.2002.0_225.
Full textHuang, Xiu Ling, Ya Feng Ding, Erwin Pasbrig, Zhi Wei Wang, and Mei Hong Li. "Study on Identification Method and Property for Packaging Plastic Materials." Applied Mechanics and Materials 200 (October 2012): 199–202. http://dx.doi.org/10.4028/www.scientific.net/amm.200.199.
Full textXing, Ya Ge, Qing Lian Xu, Ya Jun Sun, Xi Hong Li, and Wei Li Li. "Antibacterial Property of Active Packaging of Microencapsulated Cinnamon Oil Combined with ZnO-Coated PVC Film." Advanced Materials Research 239-242 (May 2011): 3119–22. http://dx.doi.org/10.4028/www.scientific.net/amr.239-242.3119.
Full textChiu, Hsien-Tang, and Jung-Sheng Chung. "Property and reliability of liquid underfill material for IC packaging." Journal of Applied Polymer Science 102, no. 4 (2006): 3504–9. http://dx.doi.org/10.1002/app.24664.
Full textDissertations / Theses on the topic "Property Packaging"
Zhang, Zhongbin. "Transport and mechanical property studies of barrier plastic food packaging materials." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp02/NQ40392.pdf.
Full textRodrigues, Maria do Livramento Linhares. "Tilapia skin Gelatin: Alternative for obtaining films with antimicrobial property by nanosilver incorporation." Universidade Federal do CearÃ, 2015. http://www.teses.ufc.br/tde_busca/arquivo.php?codArquivo=14546.
Full textAn alternative for the recovery of industrial fish waste is the production of films, which can be applied in food packaging. However, a major challenge is to obtain films with antimicrobial properties aiding in increased food shelf life as well as films with good mechanical properties and barriers. Therefore, in order to improve these limitations, silver nanoparticles were used due to its potential antimicrobial in food, and tannic acid (TA) as crosslinker in order to improve the mechanical and barrier properties. This study focuses in the extraction of gelatin from the Nile tilapia skin (Oreochromisniloticus) in order to produce gelatin films with embedded nanosilver (AgNPs) generated by green process and evaluate the addition of tannic acid (TA) in synthesis of AgNPs and mechanical properties of the films and barrier. A pre-treatment was conducted to obtain gelatin followed by a collagen denaturing. The characterization was done by gel strength, isoelectric point, electrophoretic analysis, fourier transform infrared (FTIR) and thermogravimetric analysis (TGA). The incorporation was performed by in situ method, the films were obtained with and without the presence of TA and AgNO3 concentrations were 0, 45, 90 and 180 mmol.L-1.The films were characterized by UV-Vis, FTIR, TGA, Mechanical properties (tensile strength and elongation at break), water vapor permeability (WVP), scanning electron microscopy (SEM) and antimicrobial analysis. It was possible to use gelatin as a reducing agent and stabilizer in the reduction of silver nanoparticles. Films produced with the addition of AT showed more suitable properties for the usage as packaging material for food, showing better WVP, water solubility and were more resistant to applied loads. In addition, they presented better antimicrobial activity. Therefore, it was possible to obtain the green AgNPs method through the incorporationof thegelatin matrix and to obtain films with excellent properties after the TA addition.
Uma alternativa de valorizaÃÃo de resÃduo de pescado produzidos por indÃstrias à a produÃÃo de filmes, que pode ser aplicados em embalagens para alimentos. PorÃm, um dos grandes desafios à obter filmes com propriedades antimicrobianas, auxiliando no aumento da vida de prateleira dos alimentos, bem como obter filmes com boas propriedades mecÃnicas e de barreiras. Para isso, a fim de melhorar essas limitaÃÃes, nanopartÃculas de prata foram utilizadas devido a sua potencial aÃÃo antimicrobiana em alimentos, e Ãcido tÃnico (AT) como agente reticulante a fim de melhorar as propriedades mecÃnicas e de barreiras. Nesse estudo objetivou-se fazer a extraÃÃo da gelatina a partir de pele de tilÃpia do Nilo (Oreochromis niloticus), visando a produÃÃo de filmes de gelatina incorporados com nanopartÃculas de prata (NPAg) geradas por processo verde e avaliar a adiÃÃo de Ãcido tÃnico (AT) na sÃntese das NPAg e nas propriedades mecÃnicas e de barreira dos filmes. Para a obtenÃÃo da gelatina foram feitos prÃ-tratamentos e em seguida a desnaturaÃÃo do colÃgeno. A caracterizaÃÃo foi feita por ForÃa de Gel, Ponto IsoelÃtrico, DistribuiÃÃo de Massa Molar, Espectroscopia no Infravermelho pro Transformada de Fourrier (FTIR) e AnÃlise TermogravimÃtrica (TGA). A incorporaÃÃo foi feita pelo mÃtodo in situ, Os filmes foram obtidos sem e com a presenÃa de AT e as concentraÃÃes de AgNO3 foram 0, 45, 90 e 180 mmol.L-1. Os filmes foram caracterizados por: UV-Vis, FTIR, TGA, Ensaios MecÃnicos, Permeabilidade ao Vapor de Ãgua (PVA), Microscopia EletrÃnica de Varredura (MEV) e AnÃlise Antimicrobiana. Foi possÃvel utilizar a gelatina como agente redutor e estabilizante na reduÃÃo de nanopartÃculas de prata. Os filmes produzidos com a adiÃÃo de AT apresentaram propriedades mais adequadas para uso como embalagem para alimentos, apresentando melhores PVA, solubilidade em Ãgua e mostraram-se mais resistentes a esforÃos aplicados. AlÃm de apresentarem melhor atividade antimicrobiana. Logo, foi possÃvel, obter pelo mÃtodo verde a incorporaÃÃo de NPAg na matriz de gelatina, alÃm, de se obter filmes com excelentes propriedades apÃs a adiÃÃo de AT.
Dias, Peter Simon. "Structure-Property Relationships in Some Novel Polyolefins." Case Western Reserve University School of Graduate Studies / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=case1213046882.
Full textFang, Xiaoyi. "Conception raisonnée de matériaux barrières incorporant des nano-adsorbants." Thesis, Paris, AgroParisTech, 2013. http://www.theses.fr/2013AGPT0055/document.
Full textA material is defined as “barrier” when it is able to delay the diffusion of a penetrant. There are few possibilities to modulate the barrier properties of a prescribed material (e.g. packaging material). Most of conventional technological strategies aim at increasing the tortuosity path of the penetrant by adding obstacles. Such obstacles could be obtained either by creating a crystalline morphology or by adding of nano-fillers. The gain in diffusion barrier depends on the shape factor of obstacles, their concentration and orientation according to the main direction of transfer. In this PhD work, a novel direction to improve the barrier property has been studied; its principles have been early formalized independently from theoretical considerations on random walk on heterogeneous energy surfaces and from modeling of reactivity in heterogeneous catalysis. The central idea relies on increasing retention times instead of diffusion path lengths by incorporating nano-adsorbents (i.e. active obstacles) in the material. In this case, the considered material becomes a barrier specific to one or a family of solutes. This new concept has been tested on organic solutes to develop new barrier materials (e.g. biobased food packaging, materials for fuel tank…). The results brought out the engineering principles of such materials and experimental evidences to support the concepts. In particular, an extended free-volume theory has been developed to separate interactions with active surfaces (i.e. montmorillonites (MMT) in this work) from free-volume related effects in the polymer. Sorption properties of pristine MMT and organo-modified ones have been characterized experimentally and by molecular simulation to derive conditions where the partition coefficient Kcontrast between the surface of MMT and tested polymers (i.e. polycaprolactone (PCL), polyvinyl alcohol (PVA)) could be much greater than unity. PVA materials containing pristine MMT exhibited the most promising barrier properties to studied model solutes, which can be activated by decreasing temperature and whose selectivity can be controlled by varying the relative humidity. The blocking effects were in good agreement with the proposed description of “trapping” of organic solutes by intercalation in MMT galleries and on its enthalpic and entropic control
Wang, Yin. "PET and MXD6 Montmorillonite Nanocomposites." University of Toledo / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1341326917.
Full textFeng, Jingxing. "Transport Phenomena in Polymeric Blends and Multilayer Films." Case Western Reserve University School of Graduate Studies / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=case1548202751756984.
Full textKaroumi, Maria. "Paketering av Fastigheter : Innebär paketeringsutredningen ett hot mot den svenska fastighetsmarknaden?" Thesis, KTH, Fastigheter och byggande, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-211437.
Full textThe Swedish real estate market is attractive. In recent years, the industry has experienced great success as well as managed to deliver good results. This is both a consequence of the generally low interest rates, and the fact that the industry is characterized by good profitability. Its attractiveness can also be confirmed by the number of completed property transactions, which seems to set new records year after year. Just in 2016, properties of a value of 200 billion kronor changed owners. The majority of the transactions between Swedish companies are in form of a property packaging, in which the property is placed within a holding company. There are several reasons for this choice of method, even though the most decisive one is due to taxation purposes. The packaging procedure can be done in several different ways, from which this master thesis has examined the most common one. The possibility to use this divestment method has existed since 2003. This year new tax legislation was introduced, which allowed for capital gains on shares that were held for business purposes to be tax exempt. This made it possible for any company, which intended to transfer a certain property and did this in form of packaging, to automatically avoid taxing the capital gain the transfer resulted in. The legislation was never solely intended for real estate transactions, yet the legislator whished to ease the transaction of any kind of asset. However, the legislation proved to be particularly beneficial for assets with a long depreciation period, of which real estate is one of these. The fact that a majority of all commercial property owners make use of this method results in, besides the tax benefits for them, also costs. However aren’t these anything they will be affected by directly, but will instead arise for society in the form of state tax losses. In June 2015 the Swedish government appointed an inquiry, which was referred to as the “packaging inquiry”. Its primary aim was to map the tax situation for companies in the real estate industry, as well as investigating whether the real estate industry could be considered tax-benefit or not. The government also had a plan for the investigators to examine whether real estate packaging has been used as a tool for tax planning. The results from the inquiry were presented on March 30, 2017. This master’s thesis has, based on the inquiry’s results, investigated how upcoming measures may affect the Swedish real estate market and its actors. It has also aimed at clarifying how real estate packaging is currently taking place, and how the method will be affected if the proposed measures will lead to constitutional changes. This by conducting an in-depth literature analysis and several interviews. The measures presented have so far only contributed to concern, uncertainty and an increased distrust. The criticism from the real estate industry has been huge, and according to interviewees does many market actors find it hard to know how to act in response to the possible upcoming changes. Some has also claimed that the inquiry has been conducted in a faulty way and thus contains several deficiencies. Similarly has some stated that it hasn’t been coordinated with the forthcoming interest rate deduction rules. Criticism has also been received regarding the fact that some of the proposals may imply increased housing costs and a decline in housing construction. This has been seen as very worrying. The report that the inquiry resulted in is currently (May 2017) submitted for comment. The answers must be submitted no later than August 14, and thereafter it remains to be seen how to proceed. Based on the conclusions this thesis has resulted in, the proposed measures will never be implemented in their present form. However is there still some uncertainty about this. Anyhow, the question that should determine how it all ends should mainly be based on whether or not the government dares to risk the attractiveness of the Swedish real estate market, and to some extent also the financial stability. The uncertainty that currently characterizes the market, while the transaction volumes are at record levels, is nothing we can manage in the long term. Not if we, at the same time, want to maintain a prosperous market. Change may in the long run be inevitable, but it’s important to remember that it should be implemented correctly and observe the interests of all involved parties. Actors in the real estate market have every right to be worried. We face a time of change, but it’s impossible to predict how it will end. However, we can be sure of that the market will definitely look different from how it is today.
王宇洋. "Preparation and Property Characterizations of UV-curable Nano-composite Sealing Resins for OLED Packaging." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/47364522978167414698.
Full text國立交通大學
材料科學與工程系所
95
Preparation and characterizations of the photo-curable organic/inorganic nano-hybrids for OLED packaging are carried out in this study. The experimental works can be classified into two portions: the first is relating to the polymer/clays nanocomposite resins. After clays-modification with synthesized surfactants, the modified clays, or called the acrylateclays were respectively added into photo-curable co-polyacrylate and epoxide resin matrices. The applicability to OLED packaging of epoxide/acrylateclays nanocomposite resin was evaluated by characterizing the lifetime of devices. The second part studies the preparation and characterizations of photo-curable co-polyacrylate/SiO2 nanocomposite material by in-situ sol-gel process. Reliability of OLEDs encapsulated by the co-polyacrylate/SiO2 was also investigated in this part of study so as to evaluate its applicability to OLED packaging. Experimental results revealed that the surfactant synthesis generated five different products. The products containing nitrogen atoms can be acidified and serve as the surfactants to intercalate into clay galleries. It was found that the synthesized surfactants may replace 71.4% of cations in clay lamellas and consequently form the acrylateclays. They effectively enlarged the d-spacing of clay lamellas from 13.6 to 33.2Å according to XRD analysis. The DTG analysis showed that the methylacrylate groups in the synthesized surfactants may react with acrylate/methylacrylate groups in monomers via photo-polymerization process. The photo-crosslinking subsequently promoted the compatibility between organic/inorganic portions. Such an effect led to the formation of nano-scale clay segments with thickness about 60 to 80 nm in co-polyacrylate/acrylateclays resin sample and an intercalated clay structure in epoxide/acrylateclays resin sample, as revealed by the TEM observation. The 5% weight loss temperature (Td) of co-polyacrylate/acrylateclays nanocomposite material was increased up to 16�aC when 5 wt.% of clay was added. The average optical transmittance of co-polyacrylate/acrylateclays resin sample reduced from 88.7% to 76.6% in visible-light wavelength range and the moisture absorption decreased from 3.44% to 1.31%. For epoxide/acrylateclays nanocomposite resin containing 5 wt.% intercalated segments, the Td increased from 149 to 213�aC, the coefficient of thermal expansion (CTE) reduced from 228.9 ppm/�aC to 80.5 ppm/�aC, the average optical transmittance slightly reduced from 86.0% to 83.7%, the moisture absorption decreased from 12.70% to 6.12% and the adhesion strength remained 43.8 kgf/cm2. For the epoxide/acrylateclays nanocomposite applied to OLED packaging, the lifetime of nanocomposite-sealed OLED is two-fold higher than that of acrylate resin-sealed OLEDs. The intercalated clay structure could sufficiently increase the permeation path of moisture, subsequently retarded the degradation of OLEDs. For the photo-curable co-polyacrylate/silica nanocomposite resin containing 10 wt.% nano-sized silica particles, the glass transition temperature (Tg) ascended from 86�aC to 107�aC, the CTE decreased from 99.2 ppm/�aC to 30.6 ppm/�aC, the Td remained 180�aC, the moisture permeability reduced from 13.59 g/m2��24 hrs to 10.41 g/m2��24 hrs, the Young’s modules increased from 9.5 GPa to 265.8 GPa, the adhesion strength improved from 20.2 kgf/cm2 to 42.8 kgf/cm2 and the average optical transmittance changed from 82.3% to 82.0%; besides, at 10 kV/cm its leakage current density greatly diminished from 235 nA/cm2 to 1.3 nA/cm2, the dielectric constant was as low as 3.93 and the tangent loss was 0.0472. By applying co-polyacrylate/silica nanocomposite resin to direct encapsulation of bottom-emitted OLEDs, it found that the curing process did not affect the luminance of encapsulated devices and the device driving voltage decreased from 6.77V to 6.09V due to improved insulation property. Moreover, the lifetime of nanocomposite-encapsulated OLED increased from 178 hrs for resin-encapsulated OLED to 350 hrs for nanocomposite-encapsulated OLED. Experimental analyses indicated that excess UV irradiation may degrade the physical properties of nanocomposite resin such as insulation property and thermal resistance so as to deteriorate the lifetime of devices. Finally, above studies indicate that the dispersion of inorganic fillers and adhesion properties of nanocomposite sealing resins played important roles on the reliability of OLEDs.
Chiang, Tzu-Hsuan, and 江姿萱. "A Study and Property Modification of UV-curable Epoxide Resins Applied to OLED Packaging." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/58124854363730343014.
Full text國立交通大學
材料科學與工程系所
94
This thesis studies the properties and modifications of UV-curable epoxide resins applied to the packaging of organic light-emitting devices (OLEDs). A hermetic packaging structure is essential to OLEDs since the light-emitting layer and highly active cathode electrode inside the devices are rather vulnerable to moisture attack. Since good adhesion is one of the key properties for sealing resins to achieve such a purpose, a thorough study on the UV-curable epoxide resins was hence carried out so that an in-depth understanding on the effects of resin constitution on adhesion and methods of property improvements could be obtained. The main topics included in this works are: (i) the effects of monomer types on adhesion strength of resins; (ii) the effects of organo-functional silanes on adhesion strength of resins; (iii) the effects of tertiary amines on UV/thermal curing, adhesion strength and etiolation of resins; (iv) epoxide resins containing hBN (hexagonal boron nitride) as inorganic filler for underfill of flip-chip interconnection. In part (i), epoxide resins containing polyol, vinyl ether and acrylate monomers were prepared and their effects on resin shrinkage, conversions and adhesion strength on glass substrate were investigated via a pull test. The polyol monomer was found to be the best since it provided the smallest shrinkage (1.72%) for cationic photopolymerization, the slowest rates of polymerization at 0.09 sec�{1 and the highest adhesion strength (153.35 kg/cm2). In part (ii), epoxide resins containing various organo-functional silanes including vinyl, epoxy, amino, methacrylic and acrylic groups were prepared and the adhesion strengths on indium tin oxide (ITO) substrate were studied. The vinyl silane was found to be able to promote the free-radical polymerization and the sample containing 1.0 wt.% of vinyl silane possessed the highest adhesion strength of 91.42 kg/cm2 on ITO glass and 153.35 kg/cm2 on glass substrate. In part (iii), various tertiary amines including imidazole, 1,2-dimethylimidazol, 2,4,6-tris(dimethylamino-methyl)phenol, 1-methylimidazole, and 2-methylimidazole were respectively added into the UV-curable epoxide resins. The addition of 2,4,6-tris(dimethylamino-methyl)phenol offered the highest glass transition temperature (Tg = 72.3�aC), the lowest coefficient of thermal expansion (CTE = 70.8 ppm/�aC) and the highest adhesion strengths on glass (> 199 kg/cm2), ITO (> 182 kg/cm2), PET (�� 115 kg/cm2), and stainless steel (�� 232 kg/cm2) substrates. 2,4,6-tris(dimethylamino-methyl)phenol also exhibited the highest UV reactivity and the best efficiency on the etiolation improvement that the values of �廊I and �媧*ab as low as 11.27 and 6.48 were achieved in the UV-curable epoxide resins. The knowledge acquired from the studies presented above was also applied to the preparation of underfill resin containing hBN filler for flip-chip interconnection. It was found that the hBN-resin possesses better dielectric properties in comparison with conventional underfill resins containing SiO2 filler. The hBN-resin also exhibited a lower CTE and a higher Tg and, for the resin containing 25.7 vol.% hBN, it possessed the largest thermal conductivity (1.08 W/m�aK). The adhesion strengths of the composite resins decreased with the increase of hBN content and the adhesion strengths on various substrates was found to be in the order of alumina (Al2O3) > Si wafer > eutectic PbSn solder.
YEH, YU-TE, and 葉裕德. "Influence of Viscoplastic Material Property and Finite Element Mesh on Thermal Reliability of Multilayer Laminate Ball Grid Array Packaging." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/72195441004100139839.
Full textBooks on the topic "Property Packaging"
Alemanno, Alberto, and Enrico Bonadio. New Intellectual Property of Health: Beyond Plain Packaging. Elgar Publishing Limited, Edward, 2016.
Find full textSingh, Jay, and S. Paul Singh. Packaging and Transportation Forensics: Reducing Risk and Liability. DEStech Publications, Inc, 2015.
Find full textGervais, Daniel. The WTO Appellate Body and the TRIPS Agreement. Oxford University Press, 2017. http://dx.doi.org/10.1093/oso/9780190848194.003.0012.
Full textZiccardi Capaldo, Giuliana, ed. The Global Community Yearbook of International Law and Jurisprudence 2018. Oxford University Press, 2019. http://dx.doi.org/10.1093/oso/9780190072506.001.0001.
Full textBook chapters on the topic "Property Packaging"
Cui, Yuzhu, Miaomiao Hu, Kun Hu, Jia Yan, Guijuan Yang, Chunyang Zhang, Xinyu Wang, et al. "Study on the Degradation Property of nHAC/PLA Composite Wire Material." In Advances in Graphic Communication, Printing and Packaging, 1016–21. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-3663-8_137.
Full textHan, Luolin, Feng Qin, Xiaoyu Li, and Haiqiao Wang. "The Effect of the Protective Colloid on the Property of Acrylic Emulsion." In Advanced Graphic Communications, Packaging Technology and Materials, 869–74. Singapore: Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_107.
Full textZhang, Wan, Xing Feng, Yuanyuan Zhu, and Xianfu Wei. "Study on the Stability and Color Property of Fluorescent Ink-jet Ink." In Advanced Graphic Communications, Packaging Technology and Materials, 919–25. Singapore: Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_113.
Full textZhou, Tengfei, Beiqing Huang, and Xianfu Wei. "Study of Effectors on the Dispersing Property of Water-Based Silver Ink." In Advanced Graphic Communications, Packaging Technology and Materials, 955–62. Singapore: Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_118.
Full textShi, Zhixiong, Xiaodong Wang, and Lujing Fu. "A Method of Color Inverse Halftoning Image Quality Assessment Based on Image Structural Property." In Advanced Graphic Communications, Packaging Technology and Materials, 257–62. Singapore: Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_33.
Full textLv, Yong, Ci Song, Qiuqian Xu, and Yusheng Yu. "Preparation of a Surface Sizing Agent of Dialdehyde Chitosan/Cationic Starch and Barrier Property." In Advances in Graphic Communication, Printing and Packaging, 704–9. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-3663-8_95.
Full textHölck, Ole, and Bernhard Wunderle. "Microelectronics Packaging Materials: Correlating Structure and Property Using Molecular Dynamics Simulations." In Molecular Modeling and Multiscaling Issues for Electronic Material Applications, 149–86. Boston, MA: Springer US, 2012. http://dx.doi.org/10.1007/978-1-4614-1728-6_10.
Full textZhang, Zhenzhen, Jilei Chao, and Fuqiang Chu. "Study on the Synthesis and Property of Water-Based UV-Curable Epoxy Acrylate with Low Viscosity." In Advanced Graphic Communications, Packaging Technology and Materials, 941–47. Singapore: Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_116.
Full textCui, Qingbin, and ShuBao Zhou. "Influence of Processing Parameters on the Impact Property of Polyethylene Hot Shrinkage Film." In Advances in Graphic Communication, Printing and Packaging Technology and Materials, 712–19. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-0503-1_101.
Full textDave, Purvi, Nisha Chandwani, S. K. Nema, and S. Mukherji. "Enhancement in Gas Diffusion Barrier Property of Polyethylene by Plasma Deposited SiOx Films for Food Packaging Applications." In Trends and Applications in Advanced Polymeric Materials, 255–73. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2017. http://dx.doi.org/10.1002/9781119364795.ch14.
Full textConference papers on the topic "Property Packaging"
Gui, Dayong, Jingfeng Hao, Deqin Si, Xin Miao, Wentao Zeng, and Jianhong Liu. "Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin." In High Density Packaging (ICEPT-HDP). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6066850.
Full textWenhu Yang, Shuhui Yu, Rong Sun, and Ruxu Du. "Dielectric property of nickel/calcium copper titanate/Polyvinylidene Fluoride composite." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5583799.
Full textHongjia Xi, Minyi Lou, Bing An, Fengshun Wu, and Yiping Wu. "Evaluate anti-shock property of solder bumps by impact test." In 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2008. http://dx.doi.org/10.1109/icept.2008.4607126.
Full textLiu Xiuzhonga, Yang Min, Liu Xinghong, and Dai Jiahuic. "Microstructure and property of Sn-Zn-Cu-Bi lead free solder." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582696.
Full textLandon, Mark D., and Richard J. Balling. "Optimal Packaging of Complex Parametric Solids According to Mass Property Criteria." In ASME 1990 Design Technical Conferences. American Society of Mechanical Engineers, 1990. http://dx.doi.org/10.1115/detc1990-0059.
Full textWenyan, Chen. "Researching on Testing Method for Dynamic Property of Buffer Packaging." In 2011 International Conference on Intelligent Computation Technology and Automation (ICICTA). IEEE, 2011. http://dx.doi.org/10.1109/icicta.2011.579.
Full textWang, Bo, Fengshun Wu, Jin Peng, Hui Liu, Yiping Wu, and Yuebo Fang. "Effect of miniaturization on the microstructure and mechanical property of solder joints." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270608.
Full textShan, Xiuyang, and Yun Chen. "Experimental study on the viscoelastic property of silicone." In 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017. http://dx.doi.org/10.1109/icept.2017.8046466.
Full textYanhong Tian, Ningning Wang, Chunqing Wang, and Shaowei Zhao. "Ultrasonic bondability and antioxidation property of Ti/Cu/Ag metallization on Si substrate." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582335.
Full textHuang, Yingzhuo, Mingliang Huang, and Ning Kang. "Mechanical property and electrochemical corrosion behavior of Al/Sn-9Zn-XNi/Cu joints." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582876.
Full text