Relevant bibliographies by topics / QUALCOMM Inc

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  1. Journal articles
  2. Books
  3. Book chapters
  4. Conference papers
  5. Reports

Academic literature on the topic 'QUALCOMM Inc'

Author: Grafiati
Published: 4 June 2021
Last updated: 30 July 2024

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Journal articles on the topic "QUALCOMM Inc"

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Park, Jaeyoung, and Young Uk Yim. "Correction: Park, J.; et al. Fine-Grained Power Gating Using an MRAM-CMOS Non-Volatile Flip-Flop. Micromachines 2019, 10, 411." Micromachines 11, no. 1 (2019): 11. http://dx.doi.org/10.3390/mi11010011.

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Zhao, Wei, Mark Nakamoto, Karthikeyan Dhandapani, et al. "Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology." International Symposium on Microelectronics 2017, no. 1 (2017): 000325–30. http://dx.doi.org/10.4071/isom-2017-wp11_048.

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Abstract Electrical Chip Board Interaction (e-CBI) has emerged as a new risk in chip design as silicon die can directly interact with printed circuit board (PCB) in substrate-less wafer level packaging technology. To assess this risk Qualcomm Technologies, Inc. has converted an existing test chip to wafer level packaging technology. Both the measured data and simulation results show that e-CBI risk is significant and must be carefully managed.
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Kuechenmeister, Frank, Dirk Breuer, Holm Geisler, et al. "Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements." International Symposium on Microelectronics 2018, no. 1 (2018): 000173–79. http://dx.doi.org/10.4071/2380-4505-2018.1.000173.

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Abstract This paper describes major contributing factors to the CPI risk and reveals the mitigation strategy successfully applied jointly by GLOBALFOUNDRIES as the silicon supplier and Qualcomm Technologies, Inc., as the customer responsible for packaging. This strategy involves thermo-mechanical modelling, data collection on wafer level using shear test to assess the BEoL-stability, Cu Pillar process development and optimization. The qualification of these process changes had been completed and implemented in volume production. The paper also discusses mechanical wafer level and thermo-mechan
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Kelly, Elizabeth S., Verna Arnette, Scott Maring, Ken Thompson, and Chris Macintosh. "MSDGC, CH2M, and Qualcomm Technologies, Inc. Work Together to Create Step Change in Asset Management Technology." Proceedings of the Water Environment Federation 2016, no. 1 (2016): 722–33. http://dx.doi.org/10.2175/193864716821124278.

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Kelly, Elizabeth S., Verna Arnette, Scott Maring, Ken Thompson, and Chris Macintosh. "MSDGC, CH2M, and Qualcomm Technologies, Inc. Work Together to Create Step Change in Asset Management Technology." Proceedings of the Water Environment Federation 2015, no. 4 (2015): 1–12. http://dx.doi.org/10.2175/193864715819556480.

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Kraus, Kateryna, Nataliia Kraus, and Galyna Pochenchuk. "Principles, assessment and methods of risk management of investment activities of the enterprise." VUZF Review 6, no. 3 (2021): 45–58. http://dx.doi.org/10.38188/2534-9228.21.3.06.

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In the article, authors explored the essence and content of the concept of “investment risk”, as well as identified factors influencing investment risk. The classification of investment risks on various grounds is carried out and scientific approaches to understanding the essence of “investment risk management” are considered. It is reasonable to manage the risks of investment activities of the enterprise in three stages: risk identification, risk measurement and risk control. Two directions of risk management of investment activity of the enterprise are described, namely: the policy directed
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Bao, Zhongping, and James Burrell. "Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology." International Symposium on Microelectronics 2010, no. 1 (2010): 000170–75. http://dx.doi.org/10.4071/isom-2010-tp1-paper2.

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Mechanical reliability issues in electronic packages have drawn significant attention in semiconductor industry for decades and have increased product development cost significantly. Recent rapid growth of various portable electronic devices like smartphone and smartbook with increasing demand for more functionality in tighter space further challenges the limit of mechanical reliability. To reduce the product development cost and time-to-market, mechanical simulation has been extensively employed in semiconductor industry for the purpose of design optimization and reliability assessment. The i
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"Qualcomm Inc." Corporate Philanthropy Report 34, no. 5 (2019): 10–11. http://dx.doi.org/10.1002/cprt.30321.

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"Standalone-5G-Netz im industriellen Umfeld." VDI-Z 162, no. 04 (2020): 12–13. http://dx.doi.org/10.37544/0042-1766-2020-04-12.

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Siemens und Qualcomm Technologies, Inc. haben das erste eigenständige private 5G-Netz in einer realen industriellen Umgebung implementiert. Genutzt wird dazu das 3,7- bis 3,8-GHz-Frequenzband. Beide Unternehmen bündeln zudem ihre Kompetenzen: Siemens stellt die realen industriellen Testbedingungen und Endgeräte wie „Simatic“-Steuerungen und IO-Devices zur Verfügung. Der Partner liefert das 5G-Testnetz sowie die dazugehörigen Testgeräte.
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Books on the topic "QUALCOMM Inc"

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Kobau, Pietro. Essere qualcosa: Ontologia e psicologia in Wolff. Trauben, 2004.

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author, Orlandi Fernando, and Scudiero Maurizio author, eds. "Qualcosa di immane": L'arte e la grande guerra. Silvy edizioni, 2012.

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Carpinato, Caterina. Teaching Modern Languages on Ancient Roots. Edizioni Ca' Foscari, 2018. http://dx.doi.org/10.30687/978-88-6969-307-6.

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Possono le pietre raccontarci qualcosa? Si possono imparare le lingue osservando i resti archeologici di Verona, Tarragona e Kalamata? Perché le lingue hanno una storia? Perché abbiamo bisogno di rappresentare le parole? In questo volume poniamo anche altri interrogativi e cerchiamo alcune risposte.
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Paolo, Pagani, ed. Qualcosa precede lo Stato: Atti del Convegno di studi sul pensiero filosofico-politico di Antonio Rosmini ... Rubbettino, 2004.

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Mock, Dave. The Qualcomm Equation. Amacom, 2007.

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Magnuson, Jimmie Edward. Qualcomm: CDMA deployment in the commercial market. 1997.

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Ltd, ICON Group. QUALCOMM INC.: Labor Productivity Benchmarks and International Gap Analysis (Labor Productivity Series). 2nd ed. Icon Group International, Inc., 2000.

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Ltd, ICON Group. QUALCOMM INC.: International Competitive Benchmarks and Financial Gap Analysis (Financial Performance Series). 2nd ed. Icon Group International, Inc., 2000.

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9

Cowhey, Peter F., and Jonathan D. Aronson. Two Cases and Policy Implications. Oxford University Press, 2017. http://dx.doi.org/10.1093/acprof:oso/9780190657932.003.0003.

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This chapter examines how two major firms, Monsanto and Qualcomm, in two distinct sectors are innovating in response to information and production disruptions. The Monsanto example shows how these disruptions are transforming the management of the farm field. The Qualcomm example shows how a digital technology leader is adapting to the next generation of innovation. Their choices illuminate how governance and innovation strategies come up against critical challenges. Policy makers must modernize how they organize global economic governance regarding digital innovation, provide cross-border mar
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Blasi, Joseph R., and Douglas L. Kruse. An American Historical Perspective on Employee Ownership. Edited by Jonathan Michie, Joseph R. Blasi, and Carlo Borzaga. Oxford University Press, 2017. http://dx.doi.org/10.1093/oxfordhb/9780199684977.013.8.

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Worker ownership plays a significant role in the US economy today. This worker ownership takes on different forms. A large proportion of the US population (close to a fifth) owns stock in the company where they work. Meaningful worker holdings are ubiquitous in high-technology companies such as Google in the Internet area, Microsoft in the software area, Gilead Sciences in biotechnology, and Qualcomm in mobile technology. The most intensive sectors of worker ownership in the US are about 10,000 companies with about 15 million workers with Employee Stock Ownership Plans, where about 4,000 of th
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Book chapters on the topic "QUALCOMM Inc"

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GERSHO, ALLEN. "Advances in Speech and Audio Compression Manuscript received November 1. 1993: revised January 15. 1994. This work was supported in part by the National Science Foundation. Fujitsu Laboratories. Ltd. the UC Micro program. Rockwell International Corporation. Hughes Aircraft Company. Echo Speech Corporation. Signal Technology. Inc. and Qualcomm. Inc.IEEE Log Number 9401177." In Readings in Multimedia Computing and Networking. Elsevier, 2002. http://dx.doi.org/10.1016/b978-155860651-7/50089-9.

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Conference papers on the topic "QUALCOMM Inc"

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Vogt, Ivo, Christian Boit, Tomonori Nakamura, and Babak Motamedi. "Optical Investigations of Temperature Effects in 14/16 nm FinFETs." In ISTFA 2017. ASM International, 2017. http://dx.doi.org/10.31399/asm.cp.istfa2017p0109.

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Abstract This paper provides a detailed analysis on the optical detection of temperature effects in FinFETs via (spectral) photon emission microscopy (SPEM/PEM) with InGaAs detector and electro-optical frequency mapping (EOFM, similar to LVI) for 14/16 nm Qualcomm Inc. FinFETs. It analyzes physical parameters of the FinFETs such as electron temperature and the relation between signal curve and operating condition of the device by photon emission slopes and spectra. The paper also traces device self-heating effects within the FinFETs by means of EOFM signal courses. With EOFM it was possible to
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Reports on the topic "QUALCOMM Inc"

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Lazonick, William, and Matt Hopkins. Why the CHIPS Are Down: Stock Buybacks and Subsidies in the U.S. Semiconductor Industry. Institute for New Economic Thinking Working Paper Series, 2021. http://dx.doi.org/10.36687/inetwp165.

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The Semiconductor Industry Association (SIA) is promoting the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act, introduced in Congress in June 2020. An SIA press release describes the bill as “bipartisan legislation that would invest tens of billions of dollars in semiconductor manufacturing incentives and research initiatives over the next 5-10 years to strengthen and sustain American leadership in chip technology, which is essential to our country’s economy and national security.” On June 8, 2021, the Senate approved $52 billion for the CHIPS for America Act, ded
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