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Journal articles on the topic 'Resist film removal'

Author: Grafiati

Published: 7 July 2024

Last updated: 31 July 2025

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1

Mercadier, Thomas, Philippe Garnier, Virginie Loup, et al. "Evaluation and Optimization of Particle Removal with a Resist Peeling Method." Solid State Phenomena 346 (August 14, 2023): 268–74. http://dx.doi.org/10.4028/p-art4vs.

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The removal of particle contamination is key to maximize yield. Some common particle removal techniques are not relevant anymore when complex and fragile structures are present on the surface. This led to the development of new cleaning processes based on innovative concepts to improve particle removal efficiency without any pattern damage. Some of these processes rely on a resist film lift off. One of these particle removal processes is studied in this paper. The process consists in some resist spin-coating followed by a diluted ammonia dispense to remove this film, which results in particle

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2

Sobhian, Mani. "The Role of Extreme Agitation in Accelerating the Removal Rate of Advanced Packaging Photoresists." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 001389–416. http://dx.doi.org/10.4071/2013dpc-wp15.

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Negative Dry Film and Negative Spin-On photoresists are widely adopted as the prime choice in wafer-scale packaging processes such as bumping, TSV, and copper pillars. High transparency of negative resist produces vertical profiles with no footing at low exposure energy, resulting in a robust, high throughput lithography process (Doki, 2005). In plating applications, the 3-D cross-linking of negative resist provides good adhesion to wide range of substrates, enabling high-current ECD processes with high throughput. The main challenge of negative photoresist has always been its removal difficul

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3

Hollenbeck, J. L., and R. C. Buchanan. "Oxide thin films for nanometer scale electron beam lithography." Journal of Materials Research 5, no. 5 (1990): 1058–72. http://dx.doi.org/10.1557/jmr.1990.1058.

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The exposure response of high resolution oxide resist materials has been examined under high intensity irradiation conditions (∼1 ⊠ 105 A/cm2) to determine the relationships among film characteristics, exposure requirements, and ultimate resolution, and to explore further the processes responsible for ablative exposure. Amorphous films of Al2O3, Y2O3, Sc2O3, 3Al2O3·2SiO2, and MgO·Al2O3 were deposited by rf sputtering onto substrates cooled to –196°C and found to require an exposure dose of approximately 5 ⊠ 103 C/cm2 to complete exposure. Amorphous film structure was found to be necessary to a

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4

Lee, Jong Han, Sang Won Shin, Young Suk Kwon, et al. "Magnetic Patterning of the Ni/Cu Thin Film by 40 keV O Ion Irradiation." Solid State Phenomena 124-126 (June 2007): 867–70. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.867.

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Ni(60Å)/Cu film possessing perpendicular magnetic anisotropy (PMA) changes its easy direction into the plane by ion irradiation, due to the relaxation of the strain. By fixing our eyes upon this magnetic property, the magnetic patterning of Ni(60Å)/Cu film using 40 keV O ion irradiation was performed through the photo-resist (PR) mask having 10㎛ x 10 ㎛pattern sizes to pattern the magnetic film. After the PR mask removal of an irradiated film, the magnetic properties were investigated by the magneto-optic Kerr effect and the formation of magnetic pattern was observed by the magnetic force micro

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5

Jimbo, Sadayuki, Kouji Shimomura, Tokuhisa Ohiwa, et al. "Resist and Sidewall Film Removal after Al Reactive Ion Etching (RIE) Employing F+H2O Downstream Ashing." Japanese Journal of Applied Physics 32, Part 1, No. 6B (1993): 3045–50. http://dx.doi.org/10.1143/jjap.32.3045.

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6

Mikalsen Martinussen, Simen, Raimond N. Frentrop, Meindert Dijkstra, and Sonia Maria Garcia-Blanco. "Redeposition-Free Deep Etching in Small KY(WO4)2 Samples." Micromachines 11, no. 12 (2020): 1033. http://dx.doi.org/10.3390/mi11121033.

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KY(WO4)2 is a promising material for on-chip laser sources. Deep etching of small KY(WO4)2 samples in combination with various thin film deposition techniques is desirable for the manufacturing of such devices. There are, however, several difficulties that need to be overcome before deep etching of KY(WO4)2 can be realized in small samples in a reproducible manner. In this paper, we address the problems of (i) edge bead formation when using thick resist on small samples, (ii) sample damage during lithography mask touchdown, (iii) resist reticulation during prolonged argon-based inductively cou

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7

Tomita, Hiroshi, Minako Inukai, Kaori Umezawa, and Li Nan Ji. "Direct Observation of Single Bubble Cavitation Damage for MHz Cleaning." Solid State Phenomena 145-146 (January 2009): 3–6. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.3.

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It is well known that the physical force cleaning such as megasonic (MS) and ultrasonic (US) cleaning are used in FEOL (front-end-of-line) and BEOL (back-end-of-line). Recently, with scaling down below 43 nm, the influence of pattern damage by physical force methods such as MS and US irradiation has been reported. Hence, for the 2x and 3x nm node devices, it will be very difficult to apply MS cleaning for particle removal process without understanding the cavitation force. Cavitation is a complex phenomena based on bubble formation and explosion in the liquid. To control “MS cleaning” and “cav

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8

Muangtong, Piyanut, Righdan Mohsen Namus, and Russell Goodall. "Improved Tribocorrosion Resistance by Addition of Sn to CrFeCoNi High Entropy Alloy." Metals 11, no. 1 (2020): 13. http://dx.doi.org/10.3390/met11010013.

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Among the high entropy or complex concentrated alloys (HEAs/CCAs), one type of system is commonly based on CoCrFeNi, which as an equiatomic quaternary alloy that forms a single phase FCC structure. In this work, the effect of Sn in an equiatomic quinary system with CoCrFeNi is shown to lead to a great improvement in hardness and resistance to tribocorrosion. The addition causes a phase transition from a single FCC phase in CoCrFeNi to dual phase in CoCrFeNiSn with an Ni-Sn intermetallic phase, and a CoCrFeNi FCC phase. The presence of both the hard intermetallic and this ductile phase helps to

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9

Farahani, Emad, Andre C. Liberati, Amirhossein Mahdavi, Pantcho Stoyanov, Christian Moreau, and Ali Dolatabadi. "Ice Adhesion Evaluation of PTFE Solid Lubricant Film Applied on TiO2 Coatings." Coatings 13, no. 6 (2023): 1049. http://dx.doi.org/10.3390/coatings13061049.

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Ice formation affects the performance of many industrial components, including aircraft wings, spacecraft, and power transmission cables. In particular, ice build-up on airplane components increases drag and fuel consumption. A large number of studies have been carried out to reduce ice adhesion by developing passive methods such as icephobic coatings and active ice removal approaches such as mechanical vibrations or chemical-based solutions. Despite remarkable recent breakthroughs in the fabrication of icephobic coatings, passive ice removal solutions require higher durability to resist cycli

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10

Limcharoen, Alonggot, Pichet Limsuwan, Chupong Pakpum, and Krisda Siangchaew. "Characterisation of C–F Polymer Film Formation on the Air-Bearing Surface Etched Sidewall of Fluorine-Based Plasma Interacting with AL2O3–TiC Substrate." Journal of Nanomaterials 2013 (2013): 1–6. http://dx.doi.org/10.1155/2013/851489.

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C–F polymer redeposition is generated on the etched sidewall of the patterned air-bearing surface (ABS). This C–F polymer is a by-product from fluorine-based plasma using a Surface Technology Systems multiplex-pro air-bearing etch (ABE). The morphology of the re-deposition and the composite element was observed by a scanning electron microscope (SEM). The chemical bonding results were characterised via X-ray photoelectron spectroscopy, attenuated total reflected infrared spectroscopy and visible Raman spectroscopy. The purpose of this work is to demonstrate a modification of AlF3re-deposition

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11

Pfeiffer, P., X. D. Zhang, D. Stümmler, et al. "Backside Contacting for Uniform Luminance in Large-Area OLED." MRS Advances 2, no. 42 (2017): 2275–80. http://dx.doi.org/10.1557/adv.2017.175.

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ABSTRACTWe have investigated organic light emitting diode (OLED) backside contacting for the enhancement of luminance uniformity as a superior alternative to gridlines. In this approach, the low-conductivity OLED anode is supported by a high-conductivity auxiliary electrode and vertically contacted through via holes. Electrical simulations of large-area OLEDs have predicted that this method allows comparable luminance uniformity while sacrificing significantly less active area compared to the common gridline approach.The method for fabricating backside contacts is comprised of five steps: (1)

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12

Lin, Tsung-Ju, Yu Yamaguchi, Shuichi Shibata, Keigo Tamura, Naozumi Fujiwara, and Masaki Inaba. "Extreme Chemical Reduction on Photoresist Stripping Process by Using Sulfuric Acid Ozone Mixture in Liquid Film." ECS Meeting Abstracts MA2024-02, no. 31 (2024): 2285. https://doi.org/10.1149/ma2024-02312285mtgabs.

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Introduction Sulfuric peroxide mixture (SPM) has been widely used in the photoresist (PR) stripping process of semiconductor manufacturing. However, the consumption of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) increase environmental burden such as water pollution. To reduce the chemical consumption, one of the ideas is that chemicals are supplied to the wafer until liquid film is formed and stopped during PR stripping process instead of continuous dispensing. It is concerned that chemical species in SPM become inactive while chemicals are stopped. Therefore, in this work, H2SO4 liquid

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13

Sawada, Yasushi, Keiichi Yamazaki, Noriyuki Taguchi, and Tetsuji Shibata. "Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet." Journal of Microelectronics and Electronic Packaging 2, no. 3 (2005): 189–96. http://dx.doi.org/10.4071/1551-4897-2.3.189.

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The effectiveness of atmospheric pressure (AP) plasma preprocessing before Ni/Au or Cu plating has been examined by applying it to a build-up printed circuit board (FR-4 grade) and polyimide-based flexible circuit film, both with blind via-holes (BVHs). The AP plasma applied with a dielectric barrier discharge is generated inside a 56 mm wide quartz vessel by an RF power generator using Ar-O2 gas mixture. One side of the vessel is open and the plasma jet is blown on the sample substrate transported 5 mm downward from the outlet of the vessel. The deposit failure rate of Ni/Au electroless depos

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14

Ahner, Nicole, Sven Zimmermann, Matthias Schaller, and Stefan E. Schulz. "Determination of Surface Energy Characteristics of Plasma Processed Ultra Low-K Dielectrics for Optimized Wetting in Wet Chemical Plasma Etch Residue Removal." Solid State Phenomena 195 (December 2012): 110–13. http://dx.doi.org/10.4028/www.scientific.net/ssp.195.110.

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The integration of porous ultra low dielectric constant materials (ULK) for isolation within the interconnect system of integrated circuits is a promising approach to reduce RC-delays and crosstalk due to shrinking feature sizes [1]. Actually the focus is on porous CVD-SiCOH materials, which consist of a Si-O-Si backbone and organic species (e.g. CH3) to lower polarizability and prevent moisture uptake to remarkably decrease the k-value [2]. The integration of porous low-k materials is very challenging, especially looking at patterning, resist stripping and etch residue removal, where commonly

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15

Es-Souni, Mona, Martha Es-Souni, Hamzah Bakhti, et al. "A Bacteria and Cell Repellent Zwitterionic Polymer Coating on Titanium Base Substrates towards Smart Implant Devices." Polymers 13, no. 15 (2021): 2472. http://dx.doi.org/10.3390/polym13152472.

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Biofouling and biofilm formation on implant surfaces are serious issues that more than often lead to inflammatory reactions and the necessity of lengthy post-operation treatments or the removal of the implant, thus entailing a protracted healing process. This issue may be tackled with a biocompatible polymeric coating that at the same time prevents biofouling. In this work, oxygen plasma-activated silanized titanium substrates are coated with poly(sulfobetaine methacrylate), a zwitterionic antibiofouling polymer, using photopolymerization. The characterization of polymer films includes FT-IR,

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16

Moore, John, Jared Pettit, Alex Brewer, and Alman Law. "Temporary Bonding of Wafers, Displays, and Components." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 1–68. http://dx.doi.org/10.4071/2015dpc-tp13.

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Packaging practices are conducted on work unit substrates while they are temporarily held in place. This requires a simple adhesion process that enables easy removal without the burdens of complex cleaning. Substrates may be wafers, flexible displays, or components, organic or inorganic, and may contain topography such as solder bumps. The choice of a temporary bonding medium is dependent upon its ability to resist exposure to heat and chemicals. Thermal resistant materials as polyimide (PI), bisbenzocyclobutene (BCB, DOW CycloteneTM), or silicone can support processes that exceed 300°C, depen

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17

Molochkova, O. "INFLUENCE OF CALCIUM-STRONTIUM CARBONATE AND COOLING CONDITIONS DURING SOLIDIFICATION ON STRUCTURE AND PROPERTIES OF COMPLEX-ALLOYED WHITE CAST IRONS OF Fe–C–Cr–Mn–Ni–Ti–Al–Nb SYSTEM." Bulletin of the South Ural State University Series ‘Metallurgy’ 23, no. 4 (2023): 46–57. http://dx.doi.org/10.14529/met230404.

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Under severe operating conditions, such as aggressive abrasives, high temperatures and harmful working environments, machine and equipment parts are favoured that are made mainly of white cast irons. The structure and the amount of carbide phase in these cast irons influence their mechanical properties and their ability to resist wear at elevated temperatures. White cast irons owe their particular wear resistance to the high content of primary MC carbides and eutectic carbides such as M7C3 in the matrix, which is mainly composed of austenite or austenite and ferrite. There is a wide variety of

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18

Horibe, H., M. Yamamoto, T. Maruoka, et al. "Ion-implanted resist removal using atomic hydrogen." Thin Solid Films 519, no. 14 (2011): 4578–81. http://dx.doi.org/10.1016/j.tsf.2011.01.287.

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19

Chavez, K. L., and D. W. Hess. "Removal of Resist Materials Using Acetic Acid." Journal of The Electrochemical Society 150, no. 4 (2003): G284. http://dx.doi.org/10.1149/1.1557085.

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20

Horibe, Hideo, Masayuki Fujita, and Akira Yoshikado. "Acrylic-Type Resist Removal Using 532 nm Laser Pulses." Journal of The Electrochemical Society 153, no. 7 (2006): G609. http://dx.doi.org/10.1149/1.2197767.

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21

Gupta, Atul, Eric Snyder, Christiane Gottschalke, et al. "First Demonstration of Fine Line RDL Yield Enhancement using an Innovative Ozone Treatment Process for Panel Fan-out and Interposers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–19. http://dx.doi.org/10.4071/2017dpc-tp1_presentation2.

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As front end transistor scaling by Moore's law faces economic and technical challenges, interconnect scaling by advanced packaging technologies has started to add value at system level for a variety of electronics applications including consumer, high performance computing and automotive. The focus on yield improvement at every node that has enabled transistor scaling is now becoming a very critical need for high volume manufacturing of advanced packaging technologies such as 2.5D interposers and high density fanout [1]. This paper describes the first demonstration of a novel atmospheric appro

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22

Hollenbeck, J. L., and R. C. Buchanan. "Nanometer-scale structures produced in oxide films." Proceedings, annual meeting, Electron Microscopy Society of America 45 (August 1987): 396–97. http://dx.doi.org/10.1017/s0424820100126779.

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Rapid material removal has been found to occur in a number of metal halide and oxide films at the point of exposure to a high intensity electron beam. As a result, 3-dimensional, nanometer scale (1-100 nm) structures have been produced in these materials. Possible applications of these systems include substrates for high density E-beam data storage and E-beam resist materials for mask fabrication. Other potential applications would include processes where controlled patterning on a nanometer scale is desirable. In this study amorphous thin films of ZrO2, Y2O3 and AI2O3 were deposited onto coat

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23

Hossain, Sylvia D., and Michael F. Pas. "Heated SC1 Solution for Selective Etching and Resist Particulate Removal." Journal of The Electrochemical Society 140, no. 12 (1993): 3604–6. http://dx.doi.org/10.1149/1.2221133.

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24

Pavlova, T. V., V. M. Shevlyuga, B. V. Andryushechkin, G. M. Zhidomirov, and K. N. Eltsov. "Local removal of silicon layers on Si(1 0 0)-2 × 1 with chlorine-resist STM lithography." Applied Surface Science 509 (April 2020): 145235. http://dx.doi.org/10.1016/j.apsusc.2019.145235.

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25

Noda, Seiji, Kazumasa Kawase, Hideo Horibe, Masaki Kuzumoto, and Tatsuo Kataoka. "Development of a Method for Resist Removal by Ozone with Acetic Acid Vapor." Journal of The Electrochemical Society 152, no. 1 (2005): G73. http://dx.doi.org/10.1149/1.1833311.

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26

Furusawa, Takeshi, Noriyuki Sakuma, Daisuke Ryuzaki, et al. "Direct Resist Removal Process from Copper-Exposed Vias for Low-Parasitic-Capacitance Interconnects." Journal of The Electrochemical Society 148, no. 4 (2001): G190. http://dx.doi.org/10.1149/1.1353580.

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27

Chen, Y., D. S. Macintyre, and S. Thoms. "A non-destructive method for the removal of residual resist in imprinted patterns." Microelectronic Engineering 67-68 (June 2003): 245–51. http://dx.doi.org/10.1016/s0167-9317(03)00184-9.

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28

Kono, Akihiko, Yu Arai, Takeshi Maruoka, et al. "High removal rate of cross-linked SU-8 resist using hydrogen radicals generated by tungsten hot-wire catalyzer." Thin Solid Films 562 (July 2014): 632–37. http://dx.doi.org/10.1016/j.tsf.2014.04.062.

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29

Lu, Ming, and Shaozhang Niu. "A Detection Approach Using LSTM-CNN for Object Removal Caused by Exemplar-Based Image Inpainting." Electronics 9, no. 5 (2020): 858. http://dx.doi.org/10.3390/electronics9050858.

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Exemplar-based image inpainting technology is a “double-edged sword”. It can not only restore the integrity of image by inpainting damaged or removed regions, but can also tamper with the image by using the pixels around the object region to fill in the gaps left by object removal. Through the research and analysis, it is found that the existing exemplar-based image inpainting forensics methods generally have the following disadvantages: the abnormal similar patches are time-consuming and inaccurate to search, have a high false alarm rate and a lack of robustness to multiple post-processing co

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Li, X., H. Zhou, J. Abrokwah, et al. "Low damage ashing and etching processes for ion implanted resist and Si3N4 removal by ICP and RIE methods." Microelectronic Engineering 85, no. 5-6 (2008): 966–68. http://dx.doi.org/10.1016/j.mee.2007.12.056.

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31

Kalai, Amina, Fadila Malek, and Leila Bousmaha-Marroki. "Effect of Thymus ciliatus oil-based disinfectant solutions against bio-films formed by Bacillus cereus strains isolated from pasteurized-milk processing lines in Algeria." South Asian Journal of Experimental Biology 8, no. 1 (2018): 01–12. http://dx.doi.org/10.38150/sajeb.8(1).p01-12.

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Bacillus cereus is a foodborne pathogen that often persists in dairy environments and is associated with food poisoning and spoilage. This spore-forming bacterium has a high propensity to develop biofilms onto dairy processing equipment and resists to chemical cleaning and disinfecting. This study deals with the in vitro application of thyme oil-based sanitizer solutions against biofilms formed by B. cereus genotypes which persist in pasteurized-milk processing lines. The effect of Thymus ciliatus essential oil on B. cereus planktonic cells and biofilms was assessed. The oil was tested alone a

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32

P. Yu. Glagolev, G. D. Demin, N. A. Djuzhev, M. A. Makhiboroda, and N. A. Filippo. "Study of the dynamics of heating anode units in a maskless nanolithograph based on an array of microfocus X-ray tubes." Technical Physics 92, no. 13 (2022): 2125. http://dx.doi.org/10.21883/tp.2022.13.52233.132-21.

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In this paper, we study the dynamics of heating the matrix of anode nodes membrane with a transmission-type target under the action of a field emission current generated in the electronic system of a maskless X-ray nanolithograph. The promising membrane materials that provide the most efficient heat removal from the matrix have been determined, among which diamond-like films have shown the best thermal stability. At the calculated power of soft X-ray radiation P_X=2.5 nW, scattered by a pixel with a size of 20 nm and an X-ray resist irradiation dose D=100 J/m2, the exposure time was 25 μs. It

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33

Sun, Yong, та Richard Bailey. "Tribocorrosion Behavior of γ′-Fe4N Nitride Layer Formed on Mild Steel by Plasma Nitriding in Chloride-Containing Solution". Lubricants 11, № 7 (2023): 281. http://dx.doi.org/10.3390/lubricants11070281.

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Nitriding has long been used to engineer the surfaces of engineering steels to improve their surface and subsurface properties. The role of the surface compound layer (γ′-Fe4N and/or ε-Fe2-3N) in improving the tribological and corrosion-resistant properties of nitrided steels has been established. However, there have been very few studies on the response of the compound layer to tribocorrosion in corrosive environments. In this work, the tribocorrosion behavior of a 5 μm thick γ′-Fe4N nitride layer produced on mild steel (MS) by plasma nitriding has been studied in a NaCl- containing solution

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34

S. Shama Parveen. "Secure File Access for Consumer Storage Devices Using Biometric Security System." International Journal of Advanced Research and Interdisciplinary Scientific Endeavours 2, no. 4 (2025): 543–49. https://doi.org/10.61359/11.2206-2516.

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In order to resist unauthorized access, consumer storage devices are typically protected using a low entropy password. However, storage devices are not fully protected against an adversary because the adversary can utilize an off-line dictionary attack to find the correct password and/or run an existing algorithm for resetting the existing password. It can be used as a replacement for the username and password as a convenient log-in, or as a simple alternative to password re- sets. It can also be deployed for enhancing the boarding and KYC (Know Your Customer) methods. It has a tremendous adva

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Chang, Shih-Chia, and Jeffrey M. Kempisty. "Lift-off Methods for MEMS Devices." MRS Proceedings 729 (2002). http://dx.doi.org/10.1557/proc-729-u2.3.

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AbstractFive different methods were explored for the formation of the lift-off mold. In the first method, a tri-level resist scheme was used to generate a lift-off mold. The lift-off mold has a vertical wall slope. In the second method, an aluminum/photoresist double layer was used as the mold material. An overhang structure is obtained by undercutting the underlying aluminum layer. In the third method, a composite layer of two different photoresists (AZ 1811 and LOR 10A) was used to form the lift-off mold. With the fast dissolution rate of the underlying LOR 10A photoresist an overhanging mas

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36

Matsubara, Y., K. Endo, T. Tatsumi, and T. Horiuchi. "Adhesion of a-C:F during oxygen plasma annealing." MRS Proceedings 476 (1997). http://dx.doi.org/10.1557/proc-476-19.

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AbstractFluorinated amorphous carbon (a-C:F) films sandwiched between layers of SiO2 have been proposed as an interlayer dielectric (ILD) structure in order to enhance resistance to oxygen plasma. This study describes adhesion failure mechanisms for the sandwiched fluorinated amorphous carbon film (a-C:F) structure during oxygen plasma annealing. We have found 3 failure modes: 1) capping SiO2 layer peels off, 2) thickness reduction of a-C:F by decomposition, and 3) etching phenomena at the interface between SiO2 and a-C:F by CFx outgassing from a-C:F. The outgassed CFx radicals were stored at

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37

Premnath, Vijay Anirudh, and Chih-Hao Chang. "Investigation of polymer template removal techniques in three-dimensional thin-shell nanolattices." Journal of Vacuum Science & Technology B 41, no. 6 (2023). http://dx.doi.org/10.1116/6.0003036.

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Recent advanced in nanofabrication has enabled various opportunities for research and development in photonic crystals, integrated circuits, and nanostructured materials. One interesting class of emerging materials is nanolattices, which consist of hollow-core, thin-shell elements fabricated using thin-film deposition on three-dimensional polymer templates. While many applications of nanolattices have been demonstrated, the residual polymer in the nanolattice can be problematic and is not well understood. This research investigates the effectiveness of different template removal techniques, in

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38

Boumerzoug, Mohamed, Han Xu, Richard Bersin, Peter Mascher, and Ginutis Balcaitis. "Removal of Titanium Oxide Grown on Titanium Nitride and Reduction of VIA Contact Resistance using a Modern Plasma Asher." MRS Proceedings 495 (1997). http://dx.doi.org/10.1557/proc-495-345.

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ABSTRACTIn making multi-level interconnects, a via layer is generally made of a dielectric layer grown on a TiN/AlSiCu/TiN metal stack. The via contact hole to the lower level metal is first etched after metal patterning and intermetal oxide deposition, then the resist mask for via etch is stripped in an oxygen plasma at high temperature before filling the via with tungsten or aluminum. However, during the resist stripping process, the titanium nitride (TiN) is exposed to oxygen radicals and becomes oxidized. This oxidized surface leads to high via resistance and may cause yield loss and poor

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Adelung, Rainer, Mady Elbahri, Shiva Kumar Rudra, et al. "Employing Thin Film Failure Mechanisms to Form Templates for Nano-electronics." MRS Proceedings 863 (2005). http://dx.doi.org/10.1557/proc-863-b7.3/o11.3.

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AbstractRecently, we showed that thin film stresses can be used to form well aligned and complex nanowire structures [1]. Within this approach we used stress to introduce cracks in a thin film. Subsequent vacuum deposition of metal leads to the formation of a metal layer on the thin film and of metal nanowires in the cracks of the film. Removal of the thin film together with the excess metal cover finishes the nanowire fabrication on the substrate. As stress can be intentionally introduced by choosing an appropriate thin film geometry that leads to a stress concentration, the cracks and conseq

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40

Guo, Hanwen, Xiaoying Chu, Yishun Guo, et al. "A water transfer printing method for contact lenses surface 2D MXene modification to resist bacterial infection and inflammation." Science Advances 10, no. 15 (2024). http://dx.doi.org/10.1126/sciadv.adl3262.

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Contact lenses (CLs) are prone to adhesion and invasion by pollutants and pathogenic bacteria, leading to infection and inflammatory diseases. However, the functionalization of CL (biological functions such as anti-fouling, antibacterial, and anti-inflammatory) and maintaining its transparency still face great challenges. In this work, as a member of the MXenes family, vanadium carbide (V 2 C) is modified onto CL via a water transfer printing method after the formation of a tightly arranged uniform film at the water surface under the action of the Marangoni effect. The coating interface is sta

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Sandstrom, Clifford, and Tim Olson. "Mask-less Laser Direct Imaging & Adaptive Patterning for Fan-Out Heterogeneous Integration." IMAPSource Proceedings 2022, DPC (2023). http://dx.doi.org/10.4071/001c.90153.

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Rapid growth of advanced FOWLP (fan-out wafer level packaging) or simply fan-out, is upon us as the industry moves from historical monolithic SoC (system on chip) scaling to multi-die architectures using chiplets, tiles, dielets or whatever they’re called. The emerging multi-die devices can be either homogeneous or heterogeneous or combinations of both and are being driven by today’s most advanced applications including 5G, AI, autonomous driving as well as the Internet of Things. In this paper, we will explore the use of LDI (laser direct imaging) in combination with Adaptive Patterning® as a

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Borini, Stefano, Andrea M. Rossi, Luca Boarino, and Giampiero Amato. "Etching Silicon Through an Effective Nanomask: An Electrochemical Way to Nanomachining." MRS Proceedings 872 (2005). http://dx.doi.org/10.1557/proc-872-j13.9.

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AbstractWe present a novel approach to silicon nanomachining, based on the electrochemical etching of the material through a nanopatterned mask.Combining a porous silicon (PS) buffer layer with cross-linked poly(methyl methacrylate) (PMMA) we have obtained masks which show high resistance to the electrochemical etching. PMMA is normally dissolved in a HF/EtOH mixture, but it becomes resistant to such a solution after cross-linking of the polymer. This can be achieved by high-dose electron irradiation in a Scanning Electron Microscope (SEM), obtaining a mask for the subsequent etching. Anyway,

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Du, Zhiyuan, Qingda Xu, Ye Xi, et al. "Controllable tip exposure of ultramicroelectrodes coated by diamond-like carbon via direct microplasma jet for enhanced stability and fidelity in single-cell recording." Microsystems & Nanoengineering 11, no. 1 (2025). https://doi.org/10.1038/s41378-024-00819-w.

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Abstract Precise and long-term electroanalysis at the single-cell level is crucial for the accurate diagnosis and monitoring of brain diseases. The reliable protection in areas outside the signal acquisition points at sharp ultramicroelectrode (UME) tips has a significant impact on the sensitivity, fidelity, and stability of intracellular neural signal recording. However, it is difficult for existing UMEs to achieve controllable exposure of the tip functional structure, which affects their ability to resist environmental interference and shield noise, resulting in unsatisfactory signal-to-nois

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Hockett, R. S., M. H. Herman, X. C. Mu, and Li-Jia Ma. "Investigations of Residual Chlorine on Etched AlCu Metal Lines by Total Reflection X-Ray Fluorescence (TXRF)." MRS Proceedings 225 (1991). http://dx.doi.org/10.1557/proc-225-329.

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ABSTRACTThe present trend in the silicon IC industry is toward the replacement of AlSi metallization by AlCu(Si). However, the addition of Cu to Al(Si) increases the sensitivity of the metallization to moisture corrosion. Total reflection X-Ray Fluorescence (TXRF) with a detection limit in the 1012 atoms/cm2 range is used to measure the residual Cl on Al(Cu) as a function of processing. The results indicate that significant Cl can remain even after standard ash and chemical solvent resist removal. Furthermore, a need is identified to study some unexpected sources of Cl (e.g., air) and the chem

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Iverson, Ethan T., Hudson Legendre, Sourav Chakravarty, et al. "High Thermal Conductivity Polyelectrolyte Nanocomposite Electrical Insulation Thin Films." Advanced Functional Materials, November 26, 2024. http://dx.doi.org/10.1002/adfm.202420355.

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AbstractHigh‐power electronics require thin, conformal insulation that resists dielectric breakdown, while promoting removal of heat from the device. Recently, polyelectrolytes have shown promise in creating dielectric thin films, but their thermal conductivity remains relatively low (<1 W m−1 K−1). In this work, the layer‐by‐layer (LbL) assembly of polyethylenimine, mica clay, poly(acrylic acid), and hexagonal boron nitride is exploited to create a thin film dielectric material with relatively high thermal conductivity (through‐plane thermal conductivity of 1.87 ± 0.03 W m−1 K−1) and stron

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Tian, Xiaoli, Fu Li, Zhenyuan Tang, et al. "Crosslinking-induced patterning of MOFs by direct photo- and electron-beam lithography." Nature Communications 15, no. 1 (2024). http://dx.doi.org/10.1038/s41467-024-47293-6.

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AbstractMetal-organic frameworks (MOFs) with diverse chemistry, structures, and properties have emerged as appealing materials for miniaturized solid-state devices. The incorporation of MOF films in these devices, such as the integrated microelectronics and nanophotonics, requires robust patterning methods. However, existing MOF patterning methods suffer from some combinations of limited material adaptability, compromised patterning resolution and scalability, and degraded properties. Here we report a universal, crosslinking-induced patterning approach for various MOFs, termed as CLIP-MOF. Via

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sprotocols. "Adhesive Micropatterns for Cells: A Microcontact Printing Protocol." December 30, 2014. https://doi.org/10.5281/zenodo.13592.

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Authors: Manuel Théry and Matthieu Piel Corresponding authors ([manuel.thery@cea.fr](manuel.thery@cea.fr); [matthieu.piel@curie.fr](matthieu.piel@curie.fr)) ### INTRODUCTION This protocol describes a simple, fast, and efficient method for making adhesive micropatterns that can be used to control individual cell shape and adhesion patterns. It is based on the use of an elastomeric stamp containing microfeatures to print proteins on the substrate of choice. The process can be subdivided into three parts. First, a silicon master is fabricated, which contains the microfeatures of interest. Once fa

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Hampel, Nils Alexander, Marietta Seifert, Barbara Leszczynska, and Thomas Gemming. "Angle-dependent ion-beam etching of RuAl thin films for structuring GHz-frequency electronics." Engineering Research Express, September 10, 2024. http://dx.doi.org/10.1088/2631-8695/ad7936.

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Abstract The ruthenium aluminide (RuAl) alloy is a promising electrode material for wireless surface acoustic wave sensors working under harsh conditions at high temperatures. However, during the structuring of RuAl thin films using ion-beam etching, etched material can redeposit at the edges of the electrodes and form objects, so-called fences, on top of the structured features. These decrease the high-temperature stability and lead to an undesired alteration of the sensor performance. In this work, the angle-dependent ion-beam etching of RuAl thin-films was investigated to inhibit the format

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sprotocols. "Preparation of tools for lithographically controlled wetting and soft lithography." January 8, 2015. https://doi.org/10.5281/zenodo.13838.

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Authors: Massmiliano Cavallini, Denis Gentili, Pierpaolo Greco, Francesco Valle & Fabio Biscarini ### Abstract This protocol provides the instructions for designing and fabricating stamping tools with features ranging from nanometer to micrometer scale, including the fabrication using commercial tools such as compact disks or digital video disks. In particular the reported procedures are oriented towards the tools fabrication for lithographically controlled wetting and soft lithography. Because the versatility of these methods that has almost no restrictions concerning the materials used f

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Hanevelt, Julia, Jelle F. Huisman, Laura W. Leicher, et al. "Limited wedge resection for T1 colon cancer (LIMERIC-II trial) – rationale and study protocol of a prospective multicenter clinical trial." BMC Gastroenterology 23, no. 1 (2023). http://dx.doi.org/10.1186/s12876-023-02854-9.

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Abstract Background The sole presence of deep submucosal invasion is shown to be associated with a limited risk of lymph node metastasis. This justifies a local excision of suspected deep submucosal invasive colon carcinomas (T1 CCs) as a first step treatment strategy. Recently Colonoscopy-Assisted Laparoscopic Wedge Resection (CAL-WR) has been shown to be able to resect pT1 CRCs with a high R0 resection rate, but the long term outcomes are lacking. The aim of this study is to evaluate the safety, effectiveness and long-term oncological outcomes of CAL-WR as primary treatment for patients with

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