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Journal articles on the topic 'Resiste SU-8'

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Published: 4 June 2021
Last updated: 5 February 2022

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1

Yoshihisa, Sensu, Sekiguchi Atsushi, Kondo Yoshiyuki, Mori Satoshi, Honda Nao, and Weber William D. "Profile Simulation of SU-8 Thick Film Resist." Journal of Photopolymer Science and Technology 18, no. 1 (2005): 125–32. http://dx.doi.org/10.2494/photopolymer.18.125.

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2

Jordan, A., and S. Büttgenbach. "Micromechanical force sensors based on SU-8 resist." Microsystem Technologies 18, no. 7-8 (2012): 1095–101. http://dx.doi.org/10.1007/s00542-012-1447-7.

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3

Lorenz, H., M. Despont, N. Fahrni, N. LaBianca, P. Renaud, and P. Vettiger. "SU-8: a low-cost negative resist for MEMS." Journal of Micromechanics and Microengineering 7, no. 3 (1997): 121–24. http://dx.doi.org/10.1088/0960-1317/7/3/010.

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4

Shew, Bor-Yuan, Jui-Tang Hung, Tai-Yuan Huang, Kun-Pei Liu, and Chang-Pin Chou. "High resolution x-ray micromachining using SU-8 resist." Journal of Micromechanics and Microengineering 13, no. 5 (2003): 708–13. http://dx.doi.org/10.1088/0960-1317/13/5/324.

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5

Lawes, Ronald A. "Manufacturing tolerances for UV LIGA using SU-8 resist." Journal of Micromechanics and Microengineering 15, no. 11 (2005): 2198–203. http://dx.doi.org/10.1088/0960-1317/15/11/029.

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6

Takamura, Makoto, Hiroki Hibino, and Hideki Yamamoto. "Applying strain into graphene by SU-8 resist shrinkage." Journal of Physics D: Applied Physics 49, no. 28 (2016): 285303. http://dx.doi.org/10.1088/0022-3727/49/28/285303.

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7

Reznikova, E. F., J. Mohr, and H. Hein. "Deep photo-lithography characterization of SU-8 resist layers." Microsystem Technologies 11, no. 4-5 (2005): 282–91. http://dx.doi.org/10.1007/s00542-004-0432-1.

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8

Kawai, Akira, and Shogo Ohtani. "Frequency Dispersion of Permittivity of SU-8 Resist Thin Film." Journal of Photopolymer Science and Technology 27, no. 6 (2014): 711–12. http://dx.doi.org/10.2494/photopolymer.27.711.

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9

Dey, P. K., B. Pramanick, A. RaviShankar, P. Ganguly, and S. Das. "MICROSTRUCTURING OF SU-8 RESIST FOR MEMS AND BIO-APPLICATIONS." International Journal on Smart Sensing and Intelligent Systems 3, no. 1 (2010): 118–29. http://dx.doi.org/10.21307/ijssis-2017-384.

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10

Agarwal, M., R. A. Gunasekaran, P. Coane, and K. Varahramyan. "Scum-free patterning of SU-8 resist for electroforming applications." Journal of Micromechanics and Microengineering 15, no. 1 (2004): 130–35. http://dx.doi.org/10.1088/0960-1317/15/1/020.

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11

Cremers, C., F. Bouamrane, L. Singleton, and R. Schenk. "SU-8 as resist material for deep X-ray lithography." Microsystem Technologies 7, no. 1 (2001): 11–16. http://dx.doi.org/10.1007/s005420000054.

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12

Shew, Bor-Yuan, Han-Chieh Li, Ci-Ling Pan, and Cheng-Hao Ko. "X-ray micromachining SU-8 resist for a terahertz photonic filter." Journal of Physics D: Applied Physics 38, no. 7 (2005): 1097–103. http://dx.doi.org/10.1088/0022-3727/38/7/020.

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13

Choi, Duk-Yong, Steve Madden, Douglas Bulla, Andrei Rode, Rongping Wang, and Barry Luther-Davies. "SU-8 protective layer in photo-resist patterning on As2S3 film." physica status solidi (c) 8, no. 11-12 (2011): 3183–86. http://dx.doi.org/10.1002/pssc.201000741.

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14

Oerke, A., S. Büttgenbach, and A. Dietzel. "Micro molding for double-sided micro structuring of SU-8 resist." Microsystem Technologies 20, no. 4-5 (2013): 593–98. http://dx.doi.org/10.1007/s00542-013-1994-6.

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15

van Kan, J. A., I. Rajta, K. Ansari, A. A. Bettiol, and F. Watt. "Nickel and copper electroplating of proton beam micromachined SU-8 resist." Microsystem Technologies 8, no. 6 (2002): 383–86. http://dx.doi.org/10.1007/s00542-001-0139-5.

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16

Liu, J., B. Cai, J. Zhu, et al. "Process research of high aspect ratio microstructure using SU-8 resist." Microsystem Technologies 10, no. 4 (2004): 265–68. http://dx.doi.org/10.1007/s00542-002-0242-2.

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17

Andok, Robert, Anna Benčurová, Pavol Nemec, et al. "The AZ 5214E Resist in EBDW Lithography and its Use as a RIE Etch–Mask in Etching Thin Ag Layers in N2 Plasma." Journal of Electrical Engineering 64, no. 6 (2013): 371–75. http://dx.doi.org/10.2478/jee-2013-0056.

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Abstract In this article we describe the electron-beam direct-write (EBDW) lithography process for the AZ 5214E photoresist which is, besides its sensitivity to UV radiation, sensitive also to electrons. An adapted process flow is provided. At the same time we examine the resistance of this resist to RIE and its suitability as an etch-mask for etching thin Ag layers in N2 plasma. A comparison with several chosen resists (PMMA, ma-2405, ma-N 1402, SU-8 2000) is provided.
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18

Singleton, Laurence, Maria Kufner, and Stephan Megtert. "Considerations for the Deep X-ray Lithography with the SU-8 Resist." Journal of Photopolymer Science and Technology 14, no. 4 (2001): 649–56. http://dx.doi.org/10.2494/photopolymer.14.649.

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19

Jin, Jian, Xiaojun Li, Xin Li, Si Di, and Xudi Wang. "Nano/microchannel fabrication based on SU-8 using sacrificial resist etching method." Micro & Nano Letters 7, no. 12 (2012): 1320–23. http://dx.doi.org/10.1049/mnl.2012.0775.

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20

Ono, Toshiyuki, Nao Honda, Satoshi Mori, Yoshihiko Kono, and Atsushi Sekiguchi. "Experimental Study of Improved Nano-imprint Process by using SU-8 3000NIL Resist." Journal of Photopolymer Science and Technology 19, no. 3 (2006): 393–96. http://dx.doi.org/10.2494/photopolymer.19.393.

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21

Bettiol, A. A., I. Rajta, E. J. Teo, J. A. van Kan, and F. Watt. "Proton beam micromachining: electron emission from SU-8 resist during ion beam irradiation." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 190, no. 1-4 (2002): 154–59. http://dx.doi.org/10.1016/s0168-583x(01)01276-9.

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22

Shew, Bor-Yuan, Tai-Yuan Huang, Kun-Pei Liu, and Chang-Pin Chou. "Oxygen quenching effect in ultra-deep x-ray lithography with SU-8 resist." Journal of Micromechanics and Microengineering 14, no. 3 (2003): 410–14. http://dx.doi.org/10.1088/0960-1317/14/3/014.

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23

Zhu, Jun, Ying Cao, Yigui Li, Xiang Chen, and Di Chen. "Integrating process and novel sacrificial layer fabricating technique based on diluted SU-8 resist." Microelectronic Engineering 93 (May 2012): 56–60. http://dx.doi.org/10.1016/j.mee.2011.12.013.

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24

PEPIN, A. "Exploring the high sensitivity of SU-8 resist for high resolution electron beam patterning." Microelectronic Engineering 73-74 (June 2004): 233–37. http://dx.doi.org/10.1016/s0167-9317(04)00104-2.

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25

Wouters, Kristof, and Robert Puers. "Accurate measurement of the steady-state swelling behavior of SU-8 negative photo resist." Procedia Chemistry 1, no. 1 (2009): 60–63. http://dx.doi.org/10.1016/j.proche.2009.07.015.

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26

Nazmov, V., E. Reznikova, J. Mohr, et al. "Fabrication and preliminary testing of X-ray lenses in thick SU-8 resist layers." Microsystem Technologies 10, no. 10 (2004): 716–21. http://dx.doi.org/10.1007/s00542-004-0433-0.

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27

Lorenz, H., M. Despont, P. Vettiger, and P. Renaud. "Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist." Microsystem Technologies 4, no. 3 (1998): 143–46. http://dx.doi.org/10.1007/s005420050118.

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28

Zhang, Jun, Mary B. Chan-Park, and Chang Ming Li. "Network properties and acid degradability of epoxy-based SU-8 resists containing reactive gamma-butyrolactone." Sensors and Actuators B: Chemical 131, no. 2 (2008): 609–20. http://dx.doi.org/10.1016/j.snb.2007.12.048.

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29

Geng, Zi-Chen, Zai-Fa Zhou, Hui Dai, and Qing-An Huang. "A 2D Waveguide Method for Lithography Simulation of Thick SU-8 Photoresist." Micromachines 11, no. 11 (2020): 972. http://dx.doi.org/10.3390/mi11110972.

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Due to the increasing complexity of microelectromechanical system (MEMS) devices, the accuracy and precision of two-dimensional microstructures of SU-8 negative thick photoresist have drawn more attention with the rapid development of UV lithography technology. This paper presents a high-precision lithography simulation model for thick SU-8 photoresist based on waveguide method to calculate light intensity in the photoresist and predict the profiles of developed SU-8 structures in two dimension. This method is based on rigorous electromagnetic field theory. The parameters that have significant
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30

Tang, Xionggui, Xiaoyu Yang, Fuhua Gao, and Yongkang Guo. "Simulation and analysis for microstructure profile of optical lithography based on SU-8 thick resist." Microelectronic Engineering 84, no. 5-8 (2007): 1100–1103. http://dx.doi.org/10.1016/j.mee.2007.01.147.

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31

Tian, X., G. Liu, Y. Tian, P. Zhang, and X. Zhang. "Simulation of deep UV lithography with SU-8 resist by using 365 nm light source." Microsystem Technologies 11, no. 4-5 (2005): 265–70. http://dx.doi.org/10.1007/s00542-004-0405-4.

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32

Kouba, J., R. Engelke, M. Bednarzik, et al. "SU-8: promising resist for advanced direct LIGA applications for high aspect ratio mechanical microparts." Microsystem Technologies 13, no. 3-4 (2006): 311–17. http://dx.doi.org/10.1007/s00542-006-0178-z.

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33

Li, Han Song, Yang Yang Hu, Guo Qian Wang, and Yong bin Zeng. "Fabrication of Micro Electrode Array by UV-LIGA and its Application in Micro ECM." Applied Mechanics and Materials 723 (January 2015): 839–47. http://dx.doi.org/10.4028/www.scientific.net/amm.723.839.

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In this paper, a fabrication process of ultra-high metal micro electrode array by means of UV-LIGA technology and its application in micro Electrochemical Machining (ECM) was investigated, and a new aided method, which can completely remove the ultra-thick cross-linked SU-8 resist without leaving remnants of the resist or destroying the electroplated microstructures, was advanced. During the lithography process, 1mm thick SU-8 moulds of different patterns were fabricated on the substrate. Before the electroforming process, a through-mask electrochemical micromachining (through-mask EMM) proced
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34

Leal-Sevillano, Carlos A., José R. Montejo-Garai, Maolong Ke, Michael J. Lancaster, Jorge A. Ruiz-Cruz, and Jesús M. Rebollar. "A Pseudo-Elliptical Response Filter at W-Band Fabricated With Thick SU-8 Photo-Resist Technology." IEEE Microwave and Wireless Components Letters 22, no. 3 (2012): 105–7. http://dx.doi.org/10.1109/lmwc.2012.2183861.

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35

Aktary, Mirwais, Martin O. Jensen, Kenneth L. Westra, Michael J. Brett, and Mark R. Freeman. "High-resolution pattern generation using the epoxy novolak SU-8 2000 resist by electron beam lithography." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 21, no. 4 (2003): L5. http://dx.doi.org/10.1116/1.1596216.

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36

Olziersky, Antonis, Pedro Barquinha, Anna Vilà, et al. "Insight on the SU-8 resist as passivation layer for transparent Ga2O3–In2O3–ZnO thin-film transistors." Journal of Applied Physics 108, no. 6 (2010): 064505. http://dx.doi.org/10.1063/1.3477192.

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37

Onoshima, Daisuke, Jun Wang, Michihiko Aki, et al. "A deep microfluidic absorbance detection cell replicated from a thickly stacked SU-8 dry film resist mold." Analytical Methods 4, no. 12 (2012): 4368. http://dx.doi.org/10.1039/c2ay26099a.

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38

Li, Jianjun, Weiwei Zhang, Yujun Song, Weiting Yin, and Tao Zhang. "Template Transfer Nanoimprint for Uniform Nanopores and Nanopoles." Journal of Nanomaterials 2016 (2016): 1–7. http://dx.doi.org/10.1155/2016/9354364.

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A new methodology is developed for the fabrication of nanostructures on substrate based on anodized Al2O3(AAO) porous template transfer process. It includes (1) forming amorphous alloy, negative UV-resist resin (i.e., SU-8), or PMMA (polymethylmethacrylate) plate nanorod arrays by hot-press molding amorphous alloy, negative UV-resist resin (i.e., SU-8), or PMMA plate into the anodized Al2O3porous substrates; (2) removing AAO templates by chemical etching process after suitable posttreatment (annealing and/or irradiation) to improve the mechanical strength of the nanorod arrays; (3) reforming n
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39

Kono, Akihiko, Yu Arai, Takeshi Maruoka, et al. "High removal rate of cross-linked SU-8 resist using hydrogen radicals generated by tungsten hot-wire catalyzer." Thin Solid Films 562 (July 2014): 632–37. http://dx.doi.org/10.1016/j.tsf.2014.04.062.

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40

Meier, Robert Ch, Vlad Badilita, Jens Brunne, Ulrike Wallrabe, and Jan G. Korvink. "Complex three-dimensional high aspect ratio microfluidic network manufactured in combined PerMX dry-resist and SU-8 technology." Biomicrofluidics 5, no. 3 (2011): 034111. http://dx.doi.org/10.1063/1.3613668.

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41

Ghantasala, Muralidhar K. "Study of stress and adhesion strength in SU-8 resist layers on silicon substrate with different seed layers." Journal of Micro/Nanolithography, MEMS, and MOEMS 6, no. 3 (2007): 033006. http://dx.doi.org/10.1117/1.2778644.

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42

Teh, W. H., U. Dürig, U. Drechsler, C. G. Smith, and H. J. Güntherodt. "Effect of low numerical-aperture femtosecond two-photon absorption on (SU-8) resist for ultrahigh-aspect-ratio microstereolithography." Journal of Applied Physics 97, no. 5 (2005): 054907. http://dx.doi.org/10.1063/1.1856214.

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43

Qian, Zhaohui, and Lorraine M. Albritton. "An Aromatic Side Chain Is Required at Residue 8 of SU for Fusion of Ecotropic Murine Leukemia Virus." Journal of Virology 78, no. 1 (2004): 508–12. http://dx.doi.org/10.1128/jvi.78.1.508-512.2004.

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ABSTRACT The surface glycoprotein (SU) of most gammaretroviruses contains a conserved histidine at its amino terminus. In ecotropic murine leukemia virus SU, replacement of histidine 8 with arginine (H8R) or deletion of H8 (H8del) abolishes infection and cell-cell fusion but has no effect on binding to the cellular receptor. We report here that an aromatic ring side chain is essential to the function of residue 8. The size of the aromatic ring appears to be important, as does its ability to form a hydrogen bond. In addition, infection by all of the nonaromatic amino acid substitutions could be
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44

Sukonrat, Patchara, Chanwut Sriphung, Watcharee Rattanasakulthong, and Chitnarong Sirisathitkul. "Characterization of Cobalt Films on X-Ray Lithographic Micropillars." Advanced Materials Research 335-336 (September 2011): 1000–1003. http://dx.doi.org/10.4028/www.scientific.net/amr.335-336.1000.

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Arrays of SU-8 photoresist pillars (10 μm ×10 μm × 50 μm) on copper substrates were fabricated by X-ray lithography. The photoresist-coated substrates were irradiated by X-ray from a synchrotron source through patterned silver dots on a graphite mask. After the resist development, the chemically stable and mechanically hardened SU-8 pillars exhibited smooth vertical sidewalls and cross section with up to 10 % dimensional errors from the designated pattern. Cobalt of thickness ranging from 50 to 80 nm was then deposited on these patterned substrates by RF sputtering. These cobalt films on SU-8
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45

López-Romero, D., C. A. Barrios, M. Holgado, M. F. Laguna, and R. Casquel. "High aspect-ratio SU-8 resist nano-pillar lattice by e-beam direct writing and its application for liquid trapping." Microelectronic Engineering 87, no. 4 (2010): 663–67. http://dx.doi.org/10.1016/j.mee.2009.09.007.

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46

Camps, Thierry, Sami Abada, Benjamin Reig, et al. "Uniform Fabrication of Moems Arrays Using Dry Thick Resist Films." Proceedings 1, no. 4 (2017): 551. http://dx.doi.org/10.3390/proceedings1040551.

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This study aims at focusing a laser beam at the center of a microfluidic channel for optical bio-sensing applications thanks to the collective integration of tunable microlens arrays on VCSELs devices. High aspect-ratio polymer-based MOEMS are successfully fabricated on small-sized samples using thick dry photoresist films. Such dry films are easier to use and less expensive than standard thick SU-8 and can be efficiently stacked on fragile GaAs samples using a soft-thermal-printing technique. By combining double UV exposure and planar metallization, uniform fabrication of MOEMS arrays is enab
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47

Schneider, A., B. Su, T. W. Button, et al. "Comparison of PMMA and SU-8 resist moulds for embossing of PZT to produce high-aspect-ratio microstructures using LIGA process." Microsystem Technologies 8, no. 2-3 (2002): 88–92. http://dx.doi.org/10.1007/s00542-001-0141-y.

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48

Alvankarian, Jafar, Mitra Damghanian, and Majlis Burhanuddin Yeop. "Thick-Film Deposition of High-Viscous Liquid Photopolymer." Advanced Materials Research 254 (May 2011): 5–8. http://dx.doi.org/10.4028/www.scientific.net/amr.254.5.

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There are high interests among the researchers and industries for effective deposition of thick layer liquid photo-resists with applications such as fabrication of microfluidics and polymeric membranes using lithography. In this paper, we study performance of different techniques of coating for thick layers of SU-8 using spin coating, self planarization and a technique of sandwiching the resin between two parallel solid plates. Deposition using spin coaters for SU-8 2075 is limited hardly to around 250 µm with some irregularities such as edge-beads. Self-planarization requires enough resting t
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49

Chen, Xiaolei, Ningsong Qu, Hansong Li, and Di Zhu. "The Fabrication and Application of a PDMS Micro Through-Holes Mask in Electrochemical Micromanufacturing." Advances in Mechanical Engineering 6 (January 1, 2014): 943092. http://dx.doi.org/10.1155/2014/943092.

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The electrochemical micromanufacturing process, as a key micromanufacturing technology, plays an important role in diverse industries. In this paper, polydimethylsiloxane (PDMS) is employed as a mask in the electrochemical micromanufacture of microstructures because of its chemical resistance, low cost, flexibility, and high molding capability. A new method for fabricating a PDMS micro through-holes mask is proposed. In this method, a thin resist film is employed to enhance the adhesion between the substrate and the SU-8 pillar array which is used as a mold. A vacuum-aided process is used to i
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50

Balslev, S., T. Rasmussen, P. Shi, and A. Kristensen. "Single mode solid state distributed feedback dye laser fabricated by gray scale electron beam lithography on a dye doped SU-8 resist." Journal of Micromechanics and Microengineering 15, no. 12 (2005): 2456–60. http://dx.doi.org/10.1088/0960-1317/15/12/030.

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