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Journal articles on the topic 'RF Front-ends'

Author: Grafiati
Published: 4 June 2021
Last updated: 5 February 2022

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1

Dempster, A. G., and E. Cetin. "QBPS in RF front‐ends." Electronics Letters 52, no. 23 (2016): 1965–67. http://dx.doi.org/10.1049/el.2016.3100.

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2

Clark, Thomas, and Rodney Waterhouse. "Photonics for RF Front Ends." IEEE Microwave Magazine 12, no. 3 (2011): 87–95. http://dx.doi.org/10.1109/mmm.2011.940319.

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3

Das, Tejasvi, Anand Gopalan, Clyde Washburn, and P. R. Mukund. "Towards Fault-Tolerant RF Front Ends." Journal of Electronic Testing 22, no. 4-6 (2006): 371–86. http://dx.doi.org/10.1007/s10836-006-9443-4.

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4

Baltus, P. G. M., and R. Dekker. "Optimizing RF front ends for low power." Proceedings of the IEEE 88, no. 10 (2000): 1546–59. http://dx.doi.org/10.1109/5.888994.

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5

Lupea, D., U. Pursche, and H. J. Jentschel. "Spectral Signature Analysis – BIST for RF Front-Ends." Advances in Radio Science 1 (May 5, 2003): 155–60. http://dx.doi.org/10.5194/ars-1-155-2003.

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Abstract. In this paper, the Spectral Signature Analysis is presented as a concept for an integrable self-test system (Built-In Self-Test – BIST) for RF front-ends is presented. It is based on modelling the whole RF front-end (transmitter and receiver) on system level, on generating of a Spectral Signature and of evaluating of the Signature Response. Because of using multi-carrier signal as the test signature, the concept is especially useful for tests of linearity and frequency response of front-ends. Due to the presented method of signature response evaluation, this concept can be used for Built-In Self-Correction (BISC) at critical building blocks.
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6

Solomko, Valentyn, Winfried Bakalski, Andrea Cattaneo, et al. "RF Impedance Sensor for Antenna-Tuning Front Ends." IEEE Transactions on Microwave Theory and Techniques 68, no. 3 (2020): 1095–102. http://dx.doi.org/10.1109/tmtt.2019.2951104.

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7

Al-Husseini, Mohammed, Ali El-Hajj, Mario Bkassiny, Said El-Khamy, and Amor Nafkha. "Antennas and RF Front Ends for Cognitive Radio." International Journal of Antennas and Propagation 2014 (2014): 1–2. http://dx.doi.org/10.1155/2014/231027.

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8

Martorell, Alexandre, Jeremy Raoult, Robin Marijon, and Laurent Chusseau. "RF Front-Ends Nonlinearity Characterization Using Reflected Power." IEEE Transactions on Electromagnetic Compatibility 59, no. 6 (2017): 1925–31. http://dx.doi.org/10.1109/temc.2017.2666549.

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9

Dang, Jonathan Huynh, Ryan Corroone Gough, Andy Masahiro Morishita, Aaron T. Ohta, and Wayne A. Shiroma. "Liquid-Metal-Based Reconfigurable Components for RF Front Ends." IEEE Potentials 34, no. 4 (2015): 24–30. http://dx.doi.org/10.1109/mpot.2014.2360938.

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10

Zhang, Qingfeng, Sai Wai Wong, Cheng Jin, et al. "LTE Technology: Antenna, RF Front-Ends, and Channel Modeling." International Journal of Antennas and Propagation 2015 (2015): 1–2. http://dx.doi.org/10.1155/2015/764178.

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11

Yu, Yuan, Qing Chang, and Yuan Chen. "Design and Simulation of a Fully Digitized GNSS Receiver Front-End." Discrete Dynamics in Nature and Society 2011 (2011): 1–11. http://dx.doi.org/10.1155/2011/329535.

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In the near future, RF front-ends of GNSS receivers may become very complicated when multifrequency signals are available from at least four global navigation systems. Based on the direct RF sampling technique, fully digitized receiver front-ends may solve the problem. In this paper, a direct digitization RF front-end scheme is presented. At first, a simplified sampling rate selection method is adopted to determine the optimal value. Then, the entire spectrum of GNSS signal is directly digitized through RF sampling at a very fast sampling rate. After that, the decimation and filtering network is designed to lower the sampling rate efficiently. It also realizes the digital downconversion of the signal of interest and the separation of narrow band signals from different navigation systems. The scheme can be flexibly implemented in software. Its effectiveness is proved through the experiment using simulated and true signals.
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12

Gomez-Garcia, Roberto, Dimitra Psychogiou, Jose-Maria Munoz-Ferreras, and Li Yang. "Avoiding RF Isolators: Reflectionless Microwave Bandpass Filtering Components for Advanced RF Front Ends." IEEE Microwave Magazine 21, no. 12 (2020): 68–86. http://dx.doi.org/10.1109/mmm.2020.3023222.

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13

Psiaki, M. L., S. P. Powell, Hee Jung, and P. M. Kintner. "Design and practical implementation of multifrequency RF front ends using direct RF sampling." IEEE Transactions on Microwave Theory and Techniques 53, no. 10 (2005): 3082–89. http://dx.doi.org/10.1109/tmtt.2005.855127.

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14

Ding, Ji Cheng, Lin Zhao, Shuai He Gao, Li Xiong Xia, and Jun Ling Zhang. "Design and Implementation of RF Front-End for GPS Receiver Utilizing Discrete Components." Applied Mechanics and Materials 44-47 (December 2010): 1330–34. http://dx.doi.org/10.4028/www.scientific.net/amm.44-47.1330.

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A GPS radio frequency (RF) front-end based on discrete components is designed and implemented in this paper. Research on the structures of RF front-ends for GPS receivers, and an intermediate frequency (IF) digitalization front-end is expounded in details. Analyze the design considerations of filter bandwidth, sampling frequency, quantization bits, and automatic gain control, which would effect on the whole performance of RF front-end. Then, appropriate discrete components are selected, and a low IF RF front-end hardware platform with orthogonal structure is implemented. Test results indicate that the hardware platform combined with base-band module could effectively complete signals acquisition.
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15

Nguyen, Clark T. C. "MEMS Technologies and Devices for Single-Chip RF Front-Ends." Journal of Microelectronics and Electronic Packaging 3, no. 4 (2006): 160–68. http://dx.doi.org/10.4071/1551-4897-3.4.160.

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Micromechanical (or “μmechanical”) components for communication applications fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to not only miniaturize and lower the parts counts of wireless front-ends via higher levels of integration, but also to eventually raise robustness (against interferers) and lower power consumption when used in alternative architectures that take advantage of the abundant frequency control enabled by RF MEMS devices. Among the devices described are vibrating micromechanical resonators with Q's exceeding 10,000 at GHz frequencies; mechanical circuits comprised of such vibrating resonators; tunable MEMS-based capacitors and inductors with much higher Q than achievable by conventional IC counterparts; and RF MEMS switches with insertion losses and linearity superior to those attainable by present-day semiconductor switches.
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16

Safarian, A., A. Shameli, A. Rofougaran, M. Rofougaran, and F. De Flaviis. "RF Identification (RFID) Reader Front Ends With Active Blocker Rejection." IEEE Transactions on Microwave Theory and Techniques 57, no. 5 (2009): 1320–29. http://dx.doi.org/10.1109/tmtt.2009.2017300.

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17

Li, Liang, Taijun Liu, Yan Ye, et al. "Novel electronic tuner using varactors for tunable RF front-ends." Journal of Electronics (China) 30, no. 3 (2013): 268–74. http://dx.doi.org/10.1007/s11767-013-3007-4.

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18

Attar, Sara S., Sormeh Setoodeh, Raafat R. Mansour, and Deepnarayan Gupta. "Low-Temperature Superconducting DC-Contact RF MEMS Switch for Cryogenic Reconfigurable RF Front-Ends." IEEE Transactions on Microwave Theory and Techniques 62, no. 7 (2014): 1437–47. http://dx.doi.org/10.1109/tmtt.2014.2327205.

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19

Wu, Wanghua, Mihai A. T. Sanduleanu, Xia Li, and John R. Long. "17 GHz RF Front-Ends for Low-Power Wireless Sensor Networks." IEEE Journal of Solid-State Circuits 43, no. 9 (2008): 1909–19. http://dx.doi.org/10.1109/jssc.2008.2002336.

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20

Gottardo, Giuseppe, Giovanni Donati, Christian Musolff, Georg Fischer, and Tilman Felgentreff. "Hybrid recursive active filters for duplexing in RF transmitter front-ends." Radio Science 51, no. 8 (2016): 1363–76. http://dx.doi.org/10.1002/2016rs005969.

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21

Iqbal, Amjad, Jun Jiat Tiang, Sew Kin Wong, Sai Wai Wong, and Nazih Khaddaj Mallat. "SIW Cavity-Backed Self-Quadruplexing Antenna for Compact RF Front Ends." IEEE Antennas and Wireless Propagation Letters 20, no. 4 (2021): 562–66. http://dx.doi.org/10.1109/lawp.2021.3056765.

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22

Sadhu, Bodhisatwa, Martin Sturm, Brian M. Sadler, and Ramesh Harjani. "Passive Switched Capacitor RF Front Ends for Spectrum Sensing in Cognitive Radios." International Journal of Antennas and Propagation 2014 (2014): 1–20. http://dx.doi.org/10.1155/2014/947373.

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This paper explores passive switched capacitor based RF receiver front ends for spectrum sensing. Wideband spectrum sensors remain the most challenging block in the software defined radio hardware design. The use of passive switched capacitors provides a very low power signal conditioning front end that enables parallel digitization and software control and cognitive capabilities in the digital domain. In this paper, existing architectures are reviewed followed by a discussion of high speed passive switched capacitor designs. A passive analog FFT front end design is presented as an example analog conditioning circuit. Design methodology, modeling, and optimization techniques are outlined. Measurements are presented demonstrating a 5 GHz broadband front end that consumes only 4 mW power.
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23

Martínez-Vázquez, Marta, Christos Oikonomopoulos-Zachos, Kai Maulwurf, et al. "Highly integrated antennas and front-ends for 60 GHz WLAN applications." International Journal of Microwave and Wireless Technologies 3, no. 2 (2011): 157–70. http://dx.doi.org/10.1017/s1759078711000298.

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This paper provides an overview of the research carried on in the EASY-A project concerning the design of antennas for different applications in the unlicensed band around 60 GHz, and their integration into compact RF front-ends. Different antenna configurations, in conventional microwave substrate and low-temperature co-fired ceramics (LTCC), were studied and fabricated. The results comply with the requirements established for various scenarios.
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24

Ozdemir, Ozgur. "Baseband DSP for dirty RF front-ends: Theory, algorithms, and test bed." Qatar Foundation Annual Research Forum Proceedings, no. 2013 (November 2013): ICTO 04. http://dx.doi.org/10.5339/qfarf.2013.icto-04.

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25

Payet, P., M. Guery, J. Raoult, and L. Chusseau. "Out-of-band disturbance of mm-wave EMI on RF front-ends." Microelectronics Reliability 76-77 (September 2017): 670–73. http://dx.doi.org/10.1016/j.microrel.2017.07.073.

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26

Munir, Achmad, and Biru Tutur Ranum. "Single Stage RF Amplifier with High Gain for 2.4GHz Receiver Front-Ends." TELKOMNIKA (Telecommunication Computing Electronics and Control) 12, no. 3 (2014): 711. http://dx.doi.org/10.12928/telkomnika.v12i3.100.

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27

Zhiqiang Gao, Jianguo Ma, Mingyan Yu, and Yizheng Ye. "A Fully Integrated CMOS Active Bandpass Filter for Multiband RF Front-Ends." IEEE Transactions on Circuits and Systems II: Express Briefs 55, no. 8 (2008): 718–22. http://dx.doi.org/10.1109/tcsii.2008.922392.

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28

Munir, Achmad, and Biru Tutur Ranum. "Single Stage RF Amplifier with High Gain for 2.4GHz Receiver Front-Ends." TELKOMNIKA (Telecommunication Computing Electronics and Control) 12, no. 3 (2014): 711. http://dx.doi.org/10.12928/v12i3.100.

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29

Natarajan, V., Hyun Woo Choi, A. Banerjee, et al. "Low Cost EVM Testing of Wireless RF SoC Front-Ends Using Multitones." IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 31, no. 7 (2012): 1088–101. http://dx.doi.org/10.1109/tcad.2012.2187652.

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30

van Liempd, Barend, Akshay Visweswaran, Saneaki Ariumi, Shinya Hitomi, Piet Wambacq, and Jan Craninckx. "Adaptive RF Front-Ends Using Electrical-Balance Duplexers and Tuned SAW Resonators." IEEE Transactions on Microwave Theory and Techniques 65, no. 11 (2017): 4621–28. http://dx.doi.org/10.1109/tmtt.2017.2728039.

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31

Gomes, Rodolfo, Luis Sismeiro, Carlos Ribeiro, et al. "Will COTS RF Front-Ends Really Cope With 5G Requirements at mmWave?" IEEE Access 6 (2018): 38745–69. http://dx.doi.org/10.1109/access.2018.2851781.

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32

Biedka, Mathew, Yuanxun Ethan Wang, Qiang Mark Xu, and Yuexing Li. "Full-Duplex RF Front Ends : From Antennas and Circulators to Leakage Cancellation." IEEE Microwave Magazine 20, no. 2 (2019): 44–55. http://dx.doi.org/10.1109/mmm.2018.2880496.

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33

Rizzoli, Vittorio, Diego Masotti, and Franco Mastri. "Computation of near-carrier phase noise in large RF/microwave front ends." Microwave and Optical Technology Letters 26, no. 1 (2000): 24–30. http://dx.doi.org/10.1002/(sici)1098-2760(20000705)26:1<24::aid-mop8>3.0.co;2-d.

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34

Papapolymerou, J., K. L. Lange, C. L. Goldsmith, A. Malczewski, and J. Kleber. "Reconfigurable double-stub tuners using MEMS switches for intelligent RF front-ends." IEEE Transactions on Microwave Theory and Techniques 51, no. 1 (2003): 271–78. http://dx.doi.org/10.1109/tmtt.2002.806513.

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35

Rehman, Saeed Ur, Shafiq Alam, and Iman T. Ardekani. "An Overview of Radio Frequency Fingerprinting for Low-End Devices." International Journal of Mobile Computing and Multimedia Communications 6, no. 3 (2014): 1–21. http://dx.doi.org/10.4018/ijmcmc.2014070101.

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RF fingerprinting is proposed as a means of providing an additional layer of security for wireless devices. A masquerading or impersonation attacks can be prevented by establishing the identity of wireless transmitter using unique transmitter RF fingerprint. Unique RF fingerprints are attributable to the analog components (digital-to-analog converters, band-pass filters, frequency mixers and power amplifiers) present in the RF front ends of transmitters. Most of the previous researches have reported promising results with an accuracy of up to 99% using high-end receivers (e.g. Giga-sampling rate oscilloscopes, spectrum and vector signal analysers) to validate the proposed techniques. However, practical implementation of RF fingerprinting would require validation with low-end (low-cost) devices that also suffers from impairments due to the presence of analog components in the front end of its receiver. This articles provides the analysis and implementation of RF fingerprinting using low-cost receivers and challenges associated with it.
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36

Hao Xin, J. B. Hacker, A. Sailer, et al. "Wave-front adaptive control structure (WACS) for quasi-optical power amplifiers in Intelligent RF front-ends." IEEE Microwave and Wireless Components Letters 14, no. 9 (2004): 404–6. http://dx.doi.org/10.1109/lmwc.2004.832053.

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37

Sorrentino, Roberto, Paola Farinelli, Alessandro Cazzorla, and Luca Pelliccia. "RF-MEMS Application to RF Tuneable Circuits." Advances in Science and Technology 100 (October 2016): 100–108. http://dx.doi.org/10.4028/www.scientific.net/ast.100.100.

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The bursting wireless communication market, including 5G, advanced satellite communication systems and COTM (Communication On The Move) terminals, require ever more sophisticated functions, from multi-band and multi-function operations to electronically steerable and reconfigurable antennas, pushing technological developments towards the use of tunable microwave components and circuits. Reconfigurability allows indeed for reduced complexity and cost of the apparatuses. In this context, RF MEMS (Micro-Electro-Mechanical-Systems) technology has emerged as a very attractive solution to realize both tunable devices (e.g. variable capacitors, inductors and micro-relays), as well as complex circuits (e.g. tunable filters, reconfigurable matching networks and reconfigurable beam forming networks for phased array antennas). High linearity, low loss and high miniaturization are the typical advantages of RF MEMS over conventional technologies. Micromechanical components fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, switching and frequency generation allow for miniaturized wireless front-ends via higher levels of integration. In addition, the inherent high linearity of the MEMS switches enables carrier aggregations without introducing intermodulation distortions. This paper will review the recent advances in the development of the RF MEMS to RF tunable circuits and systems.
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38

Cui, Yepu, Eui Min Jung, Ajibayo Adeyeye, Charles Lynch, Xuanke He, and Manos Tentzeris. "Additively Manufactured RF Devices for 5G, IoT, RFID, WSN, and Smart City Applications." International Journal of High Speed Electronics and Systems 29, no. 01n04 (2020): 2040016. http://dx.doi.org/10.1142/s0129156420400169.

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With the development of inkjet-/3D-/4D-printing additive manufacturing technologies, flexible 3D substrate with complex structures can be patterned with dielectric, conductive and semi-conductive materials to realize novel RF designs. This paper provides a review of state-of-the-art additively manufactured passive RF devices including antennas and frequency selective surfaces (FSS), couplers, where origami-inspired structure enables unprecedented capabilities of on-demand continuous frequency tunability and deployability. This paper also discusses additively manufactured active RF modules and systems such as inkjet printed RF energy harvester system with high sensitivity and efficiency for Internet of Things (IoT), smart cities and wireless sensor networks (WSN) applications, inkjet-printed RF front ends, and inkjet-printed mm-wave backscatter modules.
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39

Darabi, Hooman, Ahmad Mirzaei, and Mohyee Mikhemar. "Highly Integrated and Tunable RF Front Ends for Reconfigurable Multiband Transceivers: A Tutorial." IEEE Transactions on Circuits and Systems I: Regular Papers 58, no. 9 (2011): 2038–50. http://dx.doi.org/10.1109/tcsi.2011.2162460.

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40

Wang, S., and R. ‐H Chang. "Experimental 2.4 GHz CMOS RF front‐ends for non‐contact vital‐sign sensing." Electronics Letters 51, no. 23 (2015): 1846–48. http://dx.doi.org/10.1049/el.2015.3033.

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41

Zebiri, Sayad, Elfergani, et al. "A Compact Semi-Circular and Arc-Shaped Slot Antenna for Heterogeneous RF Front-Ends." Electronics 8, no. 10 (2019): 1123. http://dx.doi.org/10.3390/electronics8101123.

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In this paper, a new miniaturized compact dual-band microstrip slot antenna is presented. To achieve the dual-band characteristics, two adjunct partial arc-shaped small slots are joined to two main circular slots embedded in the ground of the antenna structure. With a reduced size of 30 × 28.5 × 0.8 mm3, the proposed antenna presents a dual-band characteristic. The design is optimized using a High Frequency Structure Simulator (HFSS) followed by experimental verifications. An impedance bandwidth, for S11≤10 dB, that covers the 1.8 GHz and 2.4 GHz bands is accomplished, which makes the proposed antenna basically suitable for hand-held devices and medical applications. More applications such as digital communication system (DCS) 1.71–1.88 GHz, personal communication services (PCS) 1.85–1.99 GHz, Universal and mobile telecommunications system UMTS 1.92–2.17 GHz, Bluetooth 2.4–2.5 GHz, and Wi-Fi 2.4–2.454 GHz, Industrial Scientific and Medical radio frequency (RF) band ISM-2.4 GHz, Wireless Local Area Network (WLAN-2.4)are possible by simply changing one of the geometrical antenna dimensions. The antenna is characterized by stable radiation patterns as well.
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42

Rida, Amin, Alexandros Margomeno, Jae Seung Lee, Paul Schmalenberg, Symeon Nikolaou, and Manos M. Tentzeris. "Integrated Wideband 2-D and 3-D Transitions for Millimeter-Wave RF Front-Ends." IEEE Antennas and Wireless Propagation Letters 9 (2010): 1080–83. http://dx.doi.org/10.1109/lawp.2010.2091714.

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43

Werth, Tobias D., Christoph Schmits, Ralf Wunderlich, and Stefan Heinen. "An Active Feedback Interference Cancellation Technique for Blocker Filtering in RF Receiver Front-Ends." IEEE Journal of Solid-State Circuits 45, no. 5 (2010): 989–97. http://dx.doi.org/10.1109/jssc.2010.2041405.

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44

Oppermann, Martin, Felix Thurow, and Ralf Rieger. "RF Sensor Modules – Needs for Multifunctional Architectures." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (2016): 000207–10. http://dx.doi.org/10.4071/2016cicmt-tha25.

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Abstract Next generation of RF sensor modules, mainly for airborne applications, will cover a variety of multifunction in terms of different operating modes, e.g. Radar, EW and Communications / Datalinks. The operating frequencies will cover a bandwidth of &amp;gt; 10 GHz and for realisation of modern Active Electronically Steered Antennas (AESA) the Transmit/Receive (T/R) modules have to match with challenging geometry demands, and RF requirements, like switching and filtering between different operational frequencies in transmit and receive mode. New GaN technology based MMICs, e.g. LNA, HPA are in development and multifunctional components (MFC MMICs) cover more than one RF function in one chip. Different front end demonstrators will be presented, based on multilayer ceramic (LTCC) and RF-PCB and associated assembly technologies, like chip&amp;wire and SMD reflow soldering. These TRM front ends include a Low Noise Amplifier with an integrated Switch (LNA/SW) and for characterisation the measured Noise Figure (NF), a key characteristic for receive performance, will be compared. The need for high integration on module level is obvious and therefore specific demands for low loss ceramic and PCB based modules, packages and housings exist.
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45

You, Bin, Bo Yang, Xuan Wen, and Liangyu Qu. "Implementation of Low-Cost UHF RFID Reader Front-Ends with Carrier Leakage Suppression Circuit." International Journal of Antennas and Propagation 2013 (2013): 1–8. http://dx.doi.org/10.1155/2013/135203.

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A new ultrahigh frequency radio frequency identification (UHF RFID) reader’s front-end circuit which is based on zero-IF, single antenna structure and composed of discrete components has been designed. The proposed design brings a significant improvement of the reading performance by adopting a carrier leakage suppression (CLS) circuit instead of a circulator which is utilized by most of the conventional RF front-end circuit. Experimental results show that the proposed design improves both the sensitivity and detection range compared to the conventional designs.
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46

Kraemer, Michael, Daniela Dragomirescu, and Robert Plana. "Design of a very low-power, low-cost 60 GHz receiver front-end implemented in 65 nm CMOS technology." International Journal of Microwave and Wireless Technologies 3, no. 2 (2011): 131–38. http://dx.doi.org/10.1017/s1759078711000067.

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The research on the design of receiver front-ends for very high data-rate communication in the 60 GHz band in nanoscale Complementary Metal Oxide Semiconductor (CMOS) technologies is going on for some time now. Although a multitude of 60 GHz front-ends have been published in recent years, they are not consequently optimized for low power consumption. Thus, these front-ends dissipate too much power for battery-powered applications like handheld devices, mobile phones, and wireless sensor networks. This article describes the design of a direct conversion receiver front-end that addresses the issue of power consumption, while at the same time permitting low cost (due to area minimization by the use of spiral inductors). It is implemented in a 65 nm CMOS technology. The realized front-end achieves a record power consumption of only 43 mW including low-noise amplifier (LNA), mixer, a voltage controlled oscillator (VCO), a local oscillator (LO) buffer, and a baseband buffer (without this latter buffer the power consumption is even lower, only 29 mW). Its pad-limited size is 0.55 × 1 mm2. At the same time, the front-end achieves state-of-the-art performance with respect to its other properties: Its maximum measured power conversion gain is 30 dB, the RF and IF bandwidths are 56.5–61.5 and 0–1.5 GHz, respectively, its measured minimum noise figure is 9.2 dB, and its measured IP−1 dB is −36 dBm.
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47

Parmar, Rajiv, Jay Zhang, and Chris Keimel. "Glass Packaging for RF MEMS." International Symposium on Microelectronics 2018, no. 1 (2018): 000680–84. http://dx.doi.org/10.4071/2380-4505-2018.1.000680.

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Abstract In recent years, advancements in High Performance Computing and Photonics are driving towards high density semiconductor packaging requirements that are creating a need for the adoption of novel material sets. Glass has many attractive properties that help address product level challenges such as low height, and smaller, packages. Glass also offers high resistivity, low dielectric constant, adjustable coefficient of thermal expansion (CTE), and low electrical loss. These properties can also be leveraged for RF and Mobile applications where battery life is paramount. To further utilize glass' material properties for interposers and compact substrates, it is necessary to form precision or Through Glass Vias (TGVs). Mobile cellular networks are rapidly evolving towards fifth generation (5G), which is set to exploit a wider spectrum of frequencies that range into millimeter wave (mmWave). RF MEMS technology is a promising approach to addressing RF Switches, which are key building blocks into Radio Frequency Front Ends (RFFE). In this paper, we show the usage of glass based packaging solutions and TGVs to offer low form factor, broadband RF MEMS switches.
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48

Liu, Kai, Billy Ahn, Tom Strothmann, Yeong Lee, and Flynn Carson. "RF System-in-Packages: History and Trend." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (2011): 001220–49. http://dx.doi.org/10.4071/2011dpc-keynote4_statschippac.

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Abstract:
In the last decade, people have seen tremendous increasing of data transmission speed and data storage capacity, which is mainly attributed to the Moore's law. However, this has little to do with RF devices and RF packages that are often used in the front-ends of wireless communication systems. Making components (e.g., width and spacing) smaller or closer does not necessarily help from RF perspectives, and as a result SoC (System on Chip) products for RF system do not really take off. The things that eventually make RF system evolution are from the concepts of System in Package, which may also include baseband chips and memory chips along with RF chips in a package. Substrate loss and metal loss are the key specifications to be considered for RF packaging. Several substrate technologies (e.g., laminate, LTCC, GaAs, glass, high-resistivity silicon, etc) that are typically used for RF packaging in the industry will be introduced. Some design challenges (e.g., impedance matching, minimizing coupling/cross-talk for high integration packages, etc) will be addressed. A trend for future RF packaging is drawn, based on successful examples of RF packaging in the industry.
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49

Iqbal, Amjad, Jun Jiat Tiang, Sew Kin Wong, Mohammad Alibakhshikenari, Francisco Falcone, and Ernesto Limiti. "Multimode HMSIW-Based Bandpass Filter with Improved Selectivity for Fifth-Generation (5G) RF Front-Ends." Sensors 20, no. 24 (2020): 7320. http://dx.doi.org/10.3390/s20247320.

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This article presents the detailed theoretical, simulation, and experimental analysis of a half-mode substrate integrated waveguide (HMSIW)-based multimode wideband filter. A third-order, semicircular HMSIW filter is developed in this paper. A semicircular HMSIW cavity resonator is adopted to achieve wide band characteristics. A U-shaped slot (acts as a λ/4 stub) in the center of a semicircular HMSIW cavity resonator and L-shaped open-circuited stubs are used to improve the out-of-band response by generating multiple transmission zeros (TZs) in the stop-band region of the filter. The TZs on either side of the passband can be controlled by adjusting dimensions of a U-shaped slot and L-shaped open-circuited stubs. The proposed filter covers a wide fractional bandwidth, has a lower insertion loss value, and has multiple TZs (which improves the selectivity). The simulated response of filter agrees well with the measured data. The proposed HMSIW bandpass filter can be integrated with any planar wideband communication system circuit, thanks to its planar structure.
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50

Li, Yun Shi, Xiao Peng Yu, and Zheng Hao Lu. "Nonreciprocal Time-Varying Transmission Line With Carrier Boosting Technique for Low-Noise RF Front Ends." IEEE Microwave and Wireless Components Letters 28, no. 11 (2018): 1011–13. http://dx.doi.org/10.1109/lmwc.2018.2868164.

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