Relevant bibliographies by topics / RF/mmW reliability

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  1. Journal articles
  2. Dissertations / Theses
  3. Conference papers

Academic literature on the topic 'RF/mmW reliability'

Author: Grafiati
Published: 31 August 2024
Last updated: 31 July 2025

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Journal articles on the topic "RF/mmW reliability"

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EL BOUAYADI, Ossama, Yann LAMY, Laurent DUSSOPT, and Brigitte SOULIER. "A New Approach for Reliable and Compact 3D Integration of mmW Transceivers on Silicon Using High-Impedance Surface Antennas." International Symposium on Microelectronics 2014, no. 1 (2014): 000810–15. http://dx.doi.org/10.4071/isom-thp21.

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3D integration of heterogeneous modules including RF and millimeter-wave (mmW) functionalities is opening new challenges for packaging developers to conciliate between electrical performance, thermal behavior and mechanical reliability using cost-effective technologies. This paper deals with innovative integrated antenna solutions within the particular context of 3D heterogeneous integration on silicon interposer using a disruptive design approach. Novel integration schemes of antennas using a high-impedance surface (HIS) reflector are presented. Then, the design steps of a 60-GHz folded dipol
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Bunel, Catherine, and Laurent Lengignon. "Silicon Capacitors with extremely high stability and reliability ideal for high temperature applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (2012): 000273–77. http://dx.doi.org/10.4071/hitec-2012-wp25.

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With the wide range of existing capacitors, the end user's requirements are roughly met but most of the capacitors see their performances largely impacted when they are submitted to high temperature. In this paper we present the Silicon Capacitors highly recommended for applications in the geothermal, oil well logging, automotive and military. They can operate in a wide operating temperature range and they withstand temperature up to 250°C, with extremely high insulation resistance and very good stability. These capacitors, already extensively used for years in miniaturized equipment and compu
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Bunel, Catherine, and Laurent Lengignon. "Silicon Capacitors with extremely high stability and reliability ideal for high temperature applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (2013): 000008–12. http://dx.doi.org/10.4071/hiten-ma12.

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With the wide range of existing capacitors, the end user's requirements are roughly met but most of the capacitors see their performances largely impacted when they are submitted to high temperature. In this paper we present the Silicon Capacitors highly recommended for applications in the geothermal, oil well logging, automotive and military. They can operate in a wide operating temperature range and they withstand temperature up to 250°C, with extremely high insulation resistance and very good stability. These capacitors, already extensively used for years in miniaturized equipment and compu
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Hu, Jian-Guo, Wen-Zhuo Mei, Jin Wu, Jia-Wei Li, and De-Ming Wang. "A Fully Integrated RFID Reader SoC." Micromachines 14, no. 9 (2023): 1691. http://dx.doi.org/10.3390/mi14091691.

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The traditional RFID reader module relies on a discrete original design. This design integrates a microcontroller, high-frequency RFID reader IC and other multiple chips onto a PCB board, leading to bottlenecks in cost, power consumption, stability and reliability. To align with the trend towards high integration, miniaturization and low power consumption in RFID reader, this paper introduces a fully integrated RFID Reader SoC. The SoC employs the open-source Cortex-M0 core to integrate the RF transceiver, analog circuits, baseband protocol processing, memory and interface circuits into one ch
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Banno, Hiroki, Takaaki Hanai, Toru Asaka, Koji Kimoto, Hiromi Nakano, and Koichiro Fukuda. "Electron-density distribution and disordered crystal structure of 12H-SiAlON, SiAl5O2N5." Powder Diffraction 29, no. 4 (2014): 318–24. http://dx.doi.org/10.1017/s0885715614000396.

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The crystal structure of SiAl5O2N5 was characterized by laboratory X-ray powder diffraction (CuKα1). The title compound is hexagonal with space group P63/mmc (Z = 2). The unit-cell dimensions are a = 0.303153(3) nm, c = 3.28153(3) nm, and V = 0.261178(5) nm3. The initial structural model was successfully derived by the direct methods and further refined by the Rietveld method. The final structural model showed the positional disordering of two of the four (Si,Al) sites. The maximum-entropy method-based pattern fitting (MPF) method was used to confirm the validity of the split-atom model, in wh
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Nelson, Julia Louise, Connor Cobb, Joshua L. Keller, Miranda K. Traylor, David Arthur Nelson, and Christopher Michael Francis. "Millimeter wave radiation to measure blood flow in healthy human subjects." Physiological Measurement, September 10, 2024. http://dx.doi.org/10.1088/1361-6579/ad7931.

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Abstract Objective. Peripheral Artery Disease (PAD) is a progressive cardiovascular condition affecting 8-10 million adults in the United States. PAD elevates the risk of cardiovascular events, but up to 50% of people with PAD are asymptomatic and undiagnosed. In this study, we tested the ability of a device, REFLO (Rapid Electromagnetic FLOw), to identify low blood flow using electromagnetic radiation and dynamic thermography toward a non-invasive PAD diagnostic. Approach. During REFLO radio frequency (RF) irradiation, the rate of temperature increase is a function of the rate of energy absor
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Lakhera, Nishant, Burt Carpenter, Teck Beng Lau, and Andrew J. Mawer. "Automotive Grade WLCSP for Radar Applications." IMAPSource Proceedings 2023, Symposium (2024). http://dx.doi.org/10.4071/001c.94510.

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Wafer-Level Chip Scale Packages (WLCSPs) are becoming commonplace in the industry due to their small form factor. Applications include industrial and automotive which demand high reliability performance. Additionally, WLCSPs may be superior in some implementations to other package options for RF performance in the mmWave spectrum, which is desired for automotive radar application. In this study the industry’s first auto grade 1 capable large WLCSP package. (~ 72 mm2 body size, 18x15 BGA array, 0.5 mm pitch) will be presented. It will be demonstrated how extensive design enhancements, predictiv
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Das, Puja, and Anirban Karmakar. "A reconfigurable wideband MIMO antenna combines RF energy harvesting." International Journal of Communication Systems, December 10, 2023. http://dx.doi.org/10.1002/dac.5683.

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SummaryThis article introduces a novel and groundbreaking approach combining multiple‐input‐multiple‐output (MIMO) technology with radio frequency (RF) energy harvesting. The proposed antenna consists of two semi‐circular monopole antenna components, optimized with dimensions of 89 × 51.02 × 1.6 mm3, that share a common ground plane to achieve MIMO characteristics. A series of split‐ring resonators on the ground plane significantly enhances the isolation between the two radiating components. Band‐notched features are performed in the 3.5 GHz WiMAX and 5.5 GHz WLAN bands through modified C‐shap
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Trybulski, Robert, Adrian Kużdżał, Michał Wilk, Jakub Więckowski, Krzysztof Fostiak, and Jarosław Muracki. "Reliability of MyotonPro in measuring the biomechanical properties of the quadriceps femoris muscle in people with different levels and types of motor preparation." Frontiers in Sports and Active Living 6 (August 29, 2024). http://dx.doi.org/10.3389/fspor.2024.1453730.

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The aim of this research was to evaluate the reliability of the measurements of biomechanical parameters of the muscles of athletes representing different disciplines as well as untrained people. Ninety-four young, healthy male individuals participated in the study and were divided into five subgroups: footballers (n = 25), volleyballers (n = 14), handballers (n = 19), MMA fighters (n = 16), and undrained group (n = 20). All of the participants underwent measurements of stiffness (S), muscle tone (T) and elasticity (E) by two independent measurers using MyotonPro equipment. Analysis was conduc
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Tafciu, E., G. Granata, F. Ancona, et al. "1183 Three-dimensional echocardiographic paramenters for mitral valve quantification: a feasibility and validation study." European Heart Journal - Cardiovascular Imaging 21, Supplement_1 (2020). http://dx.doi.org/10.1093/ehjci/jez319.682.

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Abstract Introduction Mitral regurgitation (MR) severity affects prognosis and a correct quantification is key for surgical indication. A multiparametric approach (MPA) is recommended, as singular parameters suffer pitfalls. Recently suggested three-dimensional echocardiographic (3DE) parameters lack clear reference values. No studies have assessed the feasibility of regurgitant volume (RV) and fraction (RF) using the 3D planimetric area of the mitral annulus (MAA) and of the left ventricular outflow tract (LVOTA). Purpose To assess the feasibility and reliability of 3DE, RV and RF obtained by
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Dissertations / Theses on the topic "RF/mmW reliability"

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Hai, Joycelyn. "fiabilité rf en technologie soi cmos : modélisation et application à un amplificateur de puissance." Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALT033.

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Le développement de la technologie SOI CMOS a contribué à l'évolution rapide des systèmes de communication RF/mmW qui jouent un rôle critique dans le déploiement des réseaux 5G. Pour répondre aux objectifs de performance des spécifications 5G, des schémas de modulation complexes utilisent des niveaux de puissance crête sur puissance moyenne (PAPR) élevés générés par l'amplificateur de puissance (PA). Ces niveaux de puissance élevés ont un impact important sur la fiabilité du dispositif en raison des limites en tension de la technologie CMOS moderne. Dans les premières étapes de la conception,
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Ighilahriz, Salim. "Caractérisation et modélisation de la fiabilité des transistors et circuits millimétriques conçus en technologies BiCMOS et CMOS." Phd thesis, Université de Grenoble, 2014. http://tel.archives-ouvertes.fr/tel-01060162.

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De nos jours, l'industrie de la microélectronique développe des nouvelles technologies qui permettent l'obtention d'applications du quotidien alliant rapidité, basse consommation et hautes performances. Pour cela, le transistor, composant actif élémentaire et indispensable de l'électronique, voit ses dimensions miniaturisées à un rythme effréné suivant la loi de Moore de 1965. Cette réduction de dimensions permet l'implémentation de plusieurs milliards de transistors sur des surfaces de quelques millimètres carrés augmentant ainsi la densité d'intégration. Ceci conduit à une production à des c
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Lahbib, Insaf. "Contribution à l'analyse des effets de vieillissement de composants actifs et de circuits intégrés sous contraintes DC et RF en vue d'une approche prédictive." Thesis, Normandie, 2017. http://www.theses.fr/2017NORMC256.

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Les travaux de cette thèse portent sur la simulation de la dégradation des paramètres électriques des transistors MOS et bipolaires sous stress statiques et dynamiques. Cette étude a été menée à l’aide d’un outil de simulation de fiabilité développé en interne. Selon la technologie MOS ou bipolaire, les mécanismes étudiés ont été successivement : Hot Carrier Injection, Bias Temperature instability, Mixed Mode et Reverse base emitter bias. L’investigation a été aussi étendue au niveau circuit. Nous nous sommes ainsi intéressés à l’effet de la dégradation des transistors sur la fréquence d’un os
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Conference papers on the topic "RF/mmW reliability"

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Ighilahriz, S., F. Cacho, V. Huard, L. Moquillon, P. Benech, and J. M. Fournier. "HBT reliability modeling strategy for BICMOS RF and mmW applications." In 2012 IEEE International Integrated Reliability Workshop (IIRW). IEEE, 2012. http://dx.doi.org/10.1109/iirw.2012.6468931.

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Cressler, John D. "New Developments in SiGe HBT Reliability for RF Through mmW Circuits." In 2021 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2021. http://dx.doi.org/10.1109/irps46558.2021.9405171.

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Ganguly, Satyaki, Kyle M. Bothe, Alexandre Niyonzima, et al. "DC and RF Reliability Assessment of 5G-MMW capable GaN HEMT Process (Invited)." In 2022 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2022. http://dx.doi.org/10.1109/irps48227.2022.9764539.

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Divay, A., C. Dehos, I. Charlet, et al. "A Methodology to Address RF Aging of 40nm CMOS PA Cells Under 5G mmW Modulation Profiles." In 2024 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2024. http://dx.doi.org/10.1109/irps48228.2024.10529462.

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