Relevant bibliographies by topics / Room-temperature bonding

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Room-temperature bonding'

Author: Grafiati
Published: 4 June 2021
Last updated: 4 February 2022

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Journal articles on the topic "Room-temperature bonding"

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Suga, Tadatomo. "Room temperature bonding." Bulletin of the Japan Institute of Metals 29, no. 11 (1990): 944–47. http://dx.doi.org/10.2320/materia1962.29.944.

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SUGA, Tadatomo. "Room Temperature Bonding." Journal of the Society of Mechanical Engineers 110, no. 1066 (2007): 684–85. http://dx.doi.org/10.1299/jsmemag.110.1066_684.

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TAKAGI, Hideki. "Room-temperature Wafer Bonding." Hyomen Kagaku 26, no. 2 (2005): 82–87. http://dx.doi.org/10.1380/jsssj.26.82.

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Tong, Q. Y. "Room temperature metal direct bonding." Applied Physics Letters 89, no. 18 (2006): 182101. http://dx.doi.org/10.1063/1.2367663.

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Shi, F., G. Elssner, Manfred Reiche, and U. M. Gösele. "Room Temperature UHV Silicon Direct Bonding." Solid State Phenomena 47-48 (July 1995): 143–52. http://dx.doi.org/10.4028/www.scientific.net/ssp.47-48.143.

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Tong, Q. Y., G. Fountain, and P. Enquist. "Room temperature SiO2∕SiO2 covalent bonding." Applied Physics Letters 89, no. 4 (2006): 042110. http://dx.doi.org/10.1063/1.2240232.

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Howlader, M. M. R., Satoru Suehara, and Tadatomo Suga. "Room temperature wafer level glass/glass bonding." Sensors and Actuators A: Physical 127, no. 1 (2006): 31–36. http://dx.doi.org/10.1016/j.sna.2005.11.003.

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Weinert, A., P. Amirfeiz, and S. Bengtsson. "Plasma assisted room temperature bonding for MST." Sensors and Actuators A: Physical 92, no. 1-3 (2001): 214–22. http://dx.doi.org/10.1016/s0924-4247(01)00579-9.

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Plach, T., K. Hingerl, S. Tollabimazraehno, G. Hesser, V. Dragoi, and M. Wimplinger. "Mechanisms for room temperature direct wafer bonding." Journal of Applied Physics 113, no. 9 (2013): 094905. http://dx.doi.org/10.1063/1.4794319.

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Wang, Weizhou, Yu Zhang, and Wei Jun Jin. "Halogen bonding in room-temperature phosphorescent materials." Coordination Chemistry Reviews 404 (February 2020): 213107. http://dx.doi.org/10.1016/j.ccr.2019.213107.

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Dissertations / Theses on the topic "Room-temperature bonding"

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DIVAKAR, RAMGOPAL. "ROOM TEMPERATURE ADHESIVE BONDING TECHNIQUE FOR MICROFLUIDIC BIOCHIPS." University of Cincinnati / OhioLINK, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1027950500.

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Keshavarzi, Shervin [Verfasser], Holger [Akademischer Betreuer] Reinecke, and Ulrich [Akademischer Betreuer] Mescheder. "Silicon needle-like surfaces for room temperature si-si bonding applications." Freiburg : Universität, 2019. http://d-nb.info/1202010865/34.

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Froemel, Joerg. "Gallium-based Solid Liquid Interdiffusion Bonding of Semiconductor Substrates near room temperature." Doctoral thesis, Universitätsbibliothek Chemnitz, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-167981.

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Within this work, bonding technologies based upon the alloying of gallium with other metals to assemble semiconductor substrates for the possible application of encapsulation and 3D-integration of micro systems and devices have been researched. Motivated by the important demand to achieve low temperature processes, methods with bonding temperatures below 200°C were investigated. Necessary technologies like the deposition of gallium as thin film and subsequent micro structuring have been developed. The alloying between gallium and gold as well as gallium and copper was analysed in detail. A goo
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Froemel, Joerg [Verfasser], Thomas [Akademischer Betreuer] Geßner, Thomas [Gutachter] Geßner, and Masayoshi [Gutachter] Esashi. "Gallium-based Solid Liquid Interdiffusion Bonding of Semiconductor Substrates near room temperature / Joerg Froemel ; Gutachter: Thomas Geßner, Masayoshi Esashi ; Betreuer: Thomas Geßner." Chemnitz : Universitätsbibliothek Chemnitz, 2015. http://d-nb.info/1213812771/34.

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Bräuer, Jörg. "Erarbeitung eines Raumtemperatur-Waferbondverfahrens basierend auf integrierten und reaktiven nanoskaligen Multilagensystemen." Doctoral thesis, Universitätsbibliothek Chemnitz, 2014. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-132820.

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Die vorliegende Arbeit beschreibt einen neuartigen Fügeprozess, das sogenannte reaktive Fügen bzw. Bonden. Hierbei werden sich selbsterhaltene exotherme Reaktionen in nanoskaligen Schichtsystemen als lokale Wärmequelle für das Fügen unterschiedlichster Substrate der Mikrosystemtechnik verwendet. Das Bonden mit den reaktiven Systemen unterscheidet sich von herkömmlichen Verfahren der Aufbau- und Verbindungstechnik primär dadurch, dass durch die rasche Reaktionsausbreitung bei gleichzeitig kleinem Reaktionsvolumen die Fügetemperaturen unmittelbar auf die Fügefläche beschränkt bleiben. Entgegen d
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王, 鵬., and Peng WANG. "Development of Nanowire Surface Fastener for Room-Temperature Electrical Bonding." Thesis, 2014. http://hdl.handle.net/2237/19719.

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Lai, Jia-Jing, and 賴佳靖. "Room-Temperature Rolling and rolled-bonding of ZrCuNbPdAl Metallic Glasses." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/yf3v47.

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碩士<br>義守大學<br>材料科學與工程學系<br>103<br>Zr-based bulk metallic glasses have excellent mechanical properties, higher attrition resistance characteristics, but its plastic deformation and toughness at room temperature are poor than crystalline materials, so the studies often through varieties of methods to improve its mechanical properties or thermal properties, such as adding trace elements, heat treatment, warm rolling, rolling at room temperature and so on, are to be used to improve the performance of the material can be used more easily in life. Therefore the ZrCuNbPdAl bulk metallic glasses have
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Bräuer, Jörg. "Erarbeitung eines Raumtemperatur-Waferbondverfahrens basierend auf integrierten und reaktiven nanoskaligen Multilagensystemen." Doctoral thesis, 2013. https://monarch.qucosa.de/id/qucosa%3A19994.

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Die vorliegende Arbeit beschreibt einen neuartigen Fügeprozess, das sogenannte reaktive Fügen bzw. Bonden. Hierbei werden sich selbsterhaltene exotherme Reaktionen in nanoskaligen Schichtsystemen als lokale Wärmequelle für das Fügen unterschiedlichster Substrate der Mikrosystemtechnik verwendet. Das Bonden mit den reaktiven Systemen unterscheidet sich von herkömmlichen Verfahren der Aufbau- und Verbindungstechnik primär dadurch, dass durch die rasche Reaktionsausbreitung bei gleichzeitig kleinem Reaktionsvolumen die Fügetemperaturen unmittelbar auf die Fügefläche beschränkt bleiben. Entgegen d
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Book chapters on the topic "Room-temperature bonding"

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Cui, Yanbin, and Yang Ju. "Composite Nanowires for Room-Temperature Mechanical and Electrical Bonding." In Advances in Nanocomposites. Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-31662-8_6.

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Takahashi, Yasuo, Masakatsu Maeda, Takehisa Doki, and Souta Matsusaka. "Room Temperature Micro-Bonding of Fine Wires to Foils." In Solid State Phenomena. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-33-7.277.

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Cho, Han Chul, Suk Hoon Jeong, Jae Hong Park, et al. "Experimental Analysis in Lithium Niobate CMP for Room Temperature Bonding." In Eco-Materials Processing and Design IX. Trans Tech Publications Ltd., 2008. http://dx.doi.org/10.4028/0-87849-472-3.129.

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Sarkar, Souravi, Rajib Pramanik, and Nilmoni Sarkar. "Chemical Dynamics in Room-Temperature Ionic Liquids: The Role of Hydrogen Bonding." In Hydrogen Bonding and Transfer in the Excited State. John Wiley & Sons, Ltd, 2010. http://dx.doi.org/10.1002/9780470669143.ch15.

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Divakar, Ramgopal, David Butler, and Ian Papautsky. "Room Temperature Low-Cost UV-Cured Adhesive Bonding for Microfluidic Biochips." In Micro Total Analysis Systems 2001. Springer Netherlands, 2001. http://dx.doi.org/10.1007/978-94-010-1015-3_168.

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Matthias, Thorsten, Jürgen Burggraf, Daniel Burgstaller, Markus Wimplinger, and Paul Lindner. "ZoneBOND®: Recent Developments in Temporary Bonding and Room-Temperature Debonding." In Handbook of 3D Integration. Wiley-VCH Verlag GmbH & Co. KGaA, 2014. http://dx.doi.org/10.1002/9783527670109.ch11.

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Sethi, Alick R., and Tom Welton. "Dynamic Supramolecular Chemistry: The Role of Hydrogen Bonding in Controlling the Selectivity of Diels-Alder Reactions in Room-Temperature Ionic Liquids." In ACS Symposium Series. American Chemical Society, 2002. http://dx.doi.org/10.1021/bk-2002-0818.ch019.

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Matsusaka, Souta, and Yasuo Takahashi. "INFLUENCE OF SURFACE ROUGHNESS ON ROOM TEMPERATURE ADHESIONAL BONDING." In Novel Materials Processing by Advanced Electromagnetic Energy Sources. Elsevier, 2005. http://dx.doi.org/10.1016/b978-008044504-5/50085-4.

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Irinah Omar, Noor, Motohiro Yamada, Toshiaki Yasui, and Masahiro Fukumoto. "Influence of Annealed Aluminum Properties on Adhesion Bonding of Cold Sprayed Titanium Dioxide Coating." In Plastic Deformation in Materials [Working Title]. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.94097.

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It is well known that cold spraying ceramic materials can be difficult because cold spraying requires plastic deformation of the feedstock particles for adhesion to the substrate. The challenge lies in the difficulty of plastically deforming hard and brittle ceramic materials, such as TiO2. Previous studies have reported the possibility of cold spraying thick pure TiO2 but the bonding mechanism of cold sprayed TiO2 is not fully understood. The factor like substrate condition as oxide film thickness and mechanical properties may also affect cold spray deposition but not fully understood in cold spraying ceramic. The aim of the present research is to investigate the correlation between the oxide thickness and substrate deformation with the adhesion strength of cold-sprayed TiO2 coatings toward the bonding mechanism involved. Relevant experiments were executed using Al 1050, subjected to various annealing temperatures and cold-sprayed with TiO2 powder. The results indicate a decreasing trend of coating adhesion strength with increasing annealed substrate temperature from room temperature to 400°C annealed. Metallurgical bonding is pronounced as bonding mechanism involved between TiO2 particle and annealed 1050 substrate.
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Alves, Luis M. M., and Paulo A. F. Martins. "Joining Sheets to Tubular Profiles by Tube Forming." In Computational Methods for Optimizing Manufacturing Technology. IGI Global, 2012. http://dx.doi.org/10.4018/978-1-4666-0128-4.ch013.

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This chapter presents an innovative forming process for joining sheet panels to tubular profiles at room temperature. Finite element analysis and experimentation are utilized to understand the deformation mechanics of the process, to identify the operational feasibility window, and to discuss the capabilities across the useful range of working conditions. The feasibility of the proposed joining process is demonstrated by presenting conceptual applications and industrial prototypes comprising a seat-back bottom frame and an automotive hand-brake system. Results show that joining sheets to tubular profiles by means of tube forming can successfully replace conventional joining technologies based on mechanical fixing with fasteners, welding, or structural adhesive bonding.
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Conference papers on the topic "Room-temperature bonding"

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Mu, Fengwen, and Tadatomo Suga. "Room temperature GaN bonding by surface activated bonding methods." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480574.

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Shingo Taniyama, Ying-Hui Wang, Masahisa Fujino, and Tadatomo Suga. "Room temperature wafer bonding using surface activated bonding method." In 2008 IEEE 9th VLSI Packaging Workshop of Japan. IEEE, 2008. http://dx.doi.org/10.1109/vpwj.2008.4762236.

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Mu, F., and T. Suga. "Room Temperature GaN Bonding by Surface Activated Bonding Method." In 2018 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2018. http://dx.doi.org/10.7567/ssdm.2018.ps-4-01.

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Ang, X. F., Q. H. Foo, J. Wei, Z. Chen, and C. C. Wong. "Organic Monolayers for Room Temperature Copper Bonding." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-10557.

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Wafer level bonding process is a key fabrication step in several integration systems including microelectromechanical (MEMs) and nanoelectromechanical (NEMs). Often, harsh bonding conditions used result in large thermomechanical stresses built-up which leads to undesired degradation in device performance. Our recent study revealed the capability of nanostructured organic coatings (NSOCs) in reducing the bonding temperature needed to bond copper surfaces from 300°C to 60°C. In this study, room temperature copper bonding is demonstrated successfully with the help of the organic layers. Further i
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Marion, F., B. Goubault de Brugiere, A. Bedoin, et al. "Aluminum to Aluminum bonding at room temperature." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575565.

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Matsumae, Takashi, and Tadatomo Suga. "2D material transfer using room temperature bonding." In 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2017. http://dx.doi.org/10.23919/ltb-3d.2017.7947451.

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Razek, N., C. Flotgen, V. Dragoi, and M. Wimplinger. "Room temperature fabrication of semiconductor interfaces." In 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2017. http://dx.doi.org/10.23919/ltb-3d.2017.7947419.

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Mu, Fengwen, Yinghui Wang, Kenichi Iguchi, Haruo Nakazawa, and Tadatomo Suga. "Room temperature SiC wafer bonding using SAB methods." In 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735211.

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Ryohei Takei, Kenji Abe, and Tetsuya Mizumoto. "Room-temperature direct bonding for integrated optical devices." In 2008 International Nano-Optoelectronics Workshop. IEEE, 2008. http://dx.doi.org/10.1109/inow.2008.4634511.

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Takei, R., K. Abe, and T. Mizumoto. "Room-Temperature Direct Bonding for Integrated Optical Devices." In LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting. IEEE, 2007. http://dx.doi.org/10.1109/leos.2007.4382337.

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