Relevant bibliographies by topics / Rugged electronics

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Rugged electronics'

Author: Grafiati
Published: 4 June 2021
Last updated: 3 February 2022

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Journal articles on the topic "Rugged electronics"

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Marcus, IraR. "4513064 Package for rugged electronics." Microelectronics Reliability 26, no. 2 (1986): 398–99. http://dx.doi.org/10.1016/0026-2714(86)90746-8.

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Beach, L. A., and G. W. Phillips. "Electronics Package for Rugged HPGE Detectors." IEEE Transactions on Nuclear Science 33, no. 1 (1986): 664–67. http://dx.doi.org/10.1109/tns.1986.4337189.

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Qian, You, Bo Woon Soon, Pushpapraj Singh, Humberto Campanella, and Chengkuo Lee. "All metal nanoelectromechanical switch working at 300 °C for rugged electronics applications." Nanoscale 6, no. 11 (2014): 5606. http://dx.doi.org/10.1039/c3nr05255a.

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Shenai, Krishna, Philip G. Neudeck, M. Dudley, and Robert F. Davis. "Material Defects and Rugged Electrical Power Switching in Semiconductors." Materials Science Forum 717-720 (May 2012): 1077–80. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1077.

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A paradigm shift in the development and utilization of power semiconductor switch technology is proposed. This new "top down" approach begins with the field-reliability of a power semiconductor switch in a power converter circuit is subjected to long-term repetitive-switching under stressful field-operating conditions. This approach is derived from extensive field-reliability data collected on state-of-the-art silicon power MOSFETs in compact computer/telecom power supplies that clearly suggests that power MOSFET field-failures were primarily caused by bulk material defects. A careful survey o
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Egan, Eric, and Cristina H. Amon. "Thermal Management Strategies for Embedded Electronic Components of Wearable Computers." Journal of Electronic Packaging 122, no. 2 (1999): 98–106. http://dx.doi.org/10.1115/1.483140.

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Wearable computers are rugged, portable computers that can be comfortably worn on the body and easily operated for maintenance applications. The recently developed process of Shape Deposition Manufacturing has created the opportunity to embed the electronics of wearable computers in a polymer composite substrate. As both a protective outer case and a conductive heat dissipating medium, the substrate satisfies two basic constraints of wearable computer design: ruggedness and cooling efficiency. One such application of embedded electronics is the VuMan3R, a wearable computer designed and manufac
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Shashidhar, Nagaraja, and Abhijit Rao. "Low thermal resistance packaging for high power electronics." International Symposium on Microelectronics 2019, no. 1 (2019): 000131–38. http://dx.doi.org/10.4071/2380-4505-2019.1.000131.

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Abstract Alumina and aluminum nitride substrates are routinely used in micro-electronic packaging where large quantity of heat needs to be dissipated, such as in LED packaging, high power electronics and laser packaging. Heat management in high power electronics or LED's is crucial for their lifespan and reliability. The ever-increasing need for higher power keeps challenging the packaging engineers to become more sophisticated in their packaging. With the availability of a 40 μm thick, high thermal conductivity ribbon alumina from Corning, the options available for packaging engineers has wid
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STOPA, PETER J., JOLANTA I. SOOS, RONALD G. ROSEMEIER, SUDHIR B. TRIVEDI, and SUSAN W. KUTCHER. "DEVELOPMENT OF MINIATURE ACOUSTO OPTIC TUNABLE FILTER (AOTF) SPECTROMETER FOR DETECTION OF TOXIC INDUSTRIAL CHEMICALS (TICS)." International Journal of High Speed Electronics and Systems 17, no. 04 (2007): 867–76. http://dx.doi.org/10.1142/s0129156407005041.

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This paper describes a remotely operable miniature spectrometer for the detection of Toxic Industrial Chemicals (TIC) using Near Infra-Red (NIR) spectroscopy. The spectrometer discussed here is compact, rugged and capable of operating on either as a handheld unit or on robotic platforms. The packaged unit consists of two modules: an optical head unit and an electronics unit. The optical head contains an infra-red light source, an Acousto-Optical Tunable Filter (AOTF) spectrometer, and associated electronics. The other module is contains the associated electronics assembly and cables connecting
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MacGugan, D. "DM300 - A 300°C Geothermal Directional Module Development." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (2012): 000293–300. http://dx.doi.org/10.4071/hitec-2012-tha11.

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Enhanced high-temperature geothermal drilling operations require accurate directional drilling measurements to efficiently configure the borehole. A rugged, 300°C capable directional drilling module, Honeywell's DM300, provides the geothermal drilling operator with accurate indications of tool-face angle, inclination, and heading of the down-hole assembly. The DM300 system incorporates two orthogonal arrays of accelerometers and magnetometers with their associated electronic circuitry as well as system level circuitry. The sensors and electronics are packaged in a sealed 1 ¼″ diameter titanium
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Smith, Tom, Phil Husbands, and Michael O'Shea. "Fitness Landscapes and Evolvability." Evolutionary Computation 10, no. 1 (2002): 1–34. http://dx.doi.org/10.1162/106365602317301754.

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In this paper, we develop techniques based on evolvability statistics of the fitness land-scape surrounding sampled solutions. Averaging the measures over a sample of equal fitness solutions allows us to build up fitness evolvability portraits of the fitness land-scape, which we show can be used to compare both the ruggedness and neutrality in a set of tunably rugged and tunably neutral landscapes. We further show that the tech-niques can be used with solution samples collected through both random sampling of the landscapes and online sampling during optimization. Finally, we apply the techniq
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MacGugan, Douglas C., Eric C. Abbott, and J. Chris Milne. "230°C Accelerometer with Digitized Output for Directional Drilling." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (2014): 000298–304. http://dx.doi.org/10.4071/hitec-tha14.

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Measurement-While-Drilling (MWD) technology for oil and gas, and geothermal directional drilling exploration is pushing into ever higher temperature environments - beyond 200°C. Orientation sensors supporting these high temperature environments need to provide highly accurate elevation and tool face measurements on the order of 0.1°. Honeywell has developed a new digital high temperature down-hole accelerometer, DHTA230, capable of providing the required accuracy at the elevated temperatures of 230°C, in the rugged MWD shock and vibration environment, with expected excellent reliability and li
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Dissertations / Theses on the topic "Rugged electronics"

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Torikai, Kleyton. "Transistores orgânicos ultracompactos produzidos por autoenrolamento de nanomembranas." Universidade Estadual Paulista (UNESP), 2018. http://hdl.handle.net/11449/180599.

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Submitted by Kleyton Torikai (kleyton.torikai@gmail.com) on 2019-01-28T20:34:40Z No. of bitstreams: 1 kleyton_dissertacao_finalv2.pdf: 9722270 bytes, checksum: 2a886af434c5689660841438b2412e23 (MD5)<br>Rejected by Lucilene Cordeiro da Silva Messias null (lubiblio@bauru.unesp.br), reason: Solicitamos que realize uma nova submissão seguindo as orientações abaixo: 1 - Inserir logo após a folha de rosto a ficha catalográfica, pois é um ítem obrigatório. Agradecemos a compreensão on 2019-01-29T10:56:24Z (GMT)<br>Submitted by Kleyton Torikai (kleyton.torikai@gmail.com) on 2019-01-29T14:41:
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Books on the topic "Rugged electronics"

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Wright, A. G. Environmental considerations. Oxford University Press, 2017. http://dx.doi.org/10.1093/oso/9780199565092.003.0012.

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Magnetic fields, with a magnitude comparable with that of the earth (10−4 tesla), affect trajectories of electrons and hence gain and collection efficiency. The inclusion of a high-permeability shield usually offers sufficient protection. Photomultiplier (PMT) performance is affected by electric field gradients generated by the proximity of a metal housing. The design criteria of such housings are discussed. Strong magnetic fields of the order of a tesla require special devices. Operation in harsh environments such as those encountered in oil well logging requires performance at high temperatu
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Book chapters on the topic "Rugged electronics"

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"Afterword: Anne Ruggles Gere." In Electronic Collaboration in the Humanities. Routledge, 2003. http://dx.doi.org/10.4324/9781410609304-34.

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Jackson, Charles. "Process to Product." In Knowledge Management and Business Model Innovation. IGI Global, 2001. http://dx.doi.org/10.4018/978-1-878289-98-8.ch023.

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Knowledge, a resource that was once hoarded and rare, is becoming a commodity with potential to dramatically change the world. While knowledge advances as the key strategic fuel powering an information economy, researchers and entrepreneurs race to create tools to meet needs of effective knowledge management. There is a growing urgency for new technology support structures to link organizations’ people and information worldwide in more effective and valuable ways (Kelly, 1998; Kosko, 1999; Tapscott, 1999). The development of innovative processes and supporting products directly impacts the ability of business and society to use information and knowledge for improvement (Ruggles, 1997; Davenport and Prusak, 1998). Forecasts are common for multi-billion dollar growth in knowledge management products during the next decade. Ernst &amp; Young predicts that knowledge management “has the potential to exceed ERP (enterprise resource planning) as an application opportunity. The principal driving force for this is a growing realization that effective management of knowledge can add real value to the organization (Landau, 1998; Koulopoulos, 1998). This, according to Dr. George Kozmetsky, “will continue well into the next century” (Kosmetsky, 1999). The objective of this chapter is to provide an outline of the general and specific technology issues relating to development of electronic knowledge management tools. Although it focuses particularly on the design of software systems, it provides a coherent overview of general technical aspects and considerations.
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Conference papers on the topic "Rugged electronics"

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Siemieniec, Ralf, Franz Hirler, Andreas Schlogl, et al. "A New Fast and Rugged 100 V Power MOSFET." In 2006 12th International Power Electronics and Motion Control Conference. IEEE, 2006. http://dx.doi.org/10.1109/epepemc.2006.283383.

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Siemieniec, R., F. Hirler, A. Schlogl, et al. "A New Fast and Rugged 100 V Power MOSFET." In 2006 12th International Power Electronics and Motion Control Conference. IEEE, 2006. http://dx.doi.org/10.1109/epepemc.2006.4778371.

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Odegard, Bjorn, David Weiss, Tobias Wikstrom, and Remo Baumann. "Rugged MMC converter cell for high power applications." In 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe). IEEE, 2016. http://dx.doi.org/10.1109/epe.2016.7695417.

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Lee, Yek Bing, Nadia Strusevich, Chun Yan-Yin, and Chris Bailey. "Analysis tools for thermal characterization, performance and reliability of rugged electronic displays." In 2009 32nd International Spring Seminar on Electronics Technology (ISSE). IEEE, 2009. http://dx.doi.org/10.1109/isse.2009.5206926.

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Keller, Jerry D. "Insertion of HDI and Grid Array Technologies Into Military/Space Applications." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35248.

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As with the commercial market, Military/Aerospace electronic packaging has similar needs to develop smaller/lighter/ higher performance electronics. This need has required the use of High Density Interconnect (HDI) circuit boards and Grid Array components (ball and column) in rugged environment applications such as military and space. This discussion will cover the technology study program conducted by Honeywell Defense and Space Electronics Systems on the mechanical durability of HDI (High Density Interconnect) and Grid Array component packaging and its application into “Hi Rel” aerospace pro
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Dobbs, Richard, Mark Hyttinen, Brian Steer, and Andrei Soukhov. "Rugged and Efficient Ka-Band Extended Interaction Klystrons for Satellite Communication Systems." In 2007 IEEE International Vacuum Electronics Conference. IEEE, 2007. http://dx.doi.org/10.1109/ivelec.2007.4283239.

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Patri, Sreehari R., Krishnaprasad K. S. R., Suresh Alapati, and Rajeshwar Rao. "Low-dropout regulator with modest ripple and rugged performance in 180nm." In International Conference on Communication and Electronics System Design, edited by Vijay Janyani, M. Salim, and K. K. Sharma. SPIE, 2013. http://dx.doi.org/10.1117/12.2012306.

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Knuttel, A., and F. Rammrath. "Spectral Coherence Interferometry (SCI) for fast and rugged industrial applications." In 2007 European Conference on Lasers and Electro-Optics and the International Quantum Electronics Conference. IEEE, 2007. http://dx.doi.org/10.1109/cleoe-iqec.2007.4387087.

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Ealy, Brandon, Jeffrey Van Anda, Dan Gallagher, and David Vos. "On Characterizing Air-Flow-Through Chassis: An Investigation of Manifold Flow in Rugged Electronics Enclosures." In 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm). IEEE, 2021. http://dx.doi.org/10.1109/itherm51669.2021.9503179.

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Morrison, R., and M. Egan. "A new rugged integrated AC/DC converter with optimised input current." In APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285). IEEE, 1999. http://dx.doi.org/10.1109/apec.1999.750504.

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