Academic literature on the topic 'SAC405'
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Journal articles on the topic "SAC405"
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Kumar, P. Manoj, G. Gergely, D. K. Horváth, and Z. Gácsi. "Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)." Powder Metallurgy Progress 18, no. 1 (June 1, 2018): 49–57. http://dx.doi.org/10.1515/pmp-2018-0006.
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Abstract The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and microstructural investigation of SAC305 and SAC405. In this chapter, we study the composition, mechanical properties of SAC solder alloys and microstructure were examined by optical microscope and SEM and mechanical properties such as tensile tests, hardness test and density test of the lead solder alloys were explored. SAC305 and SAC405 alloys with different Ag content and constant Cu content under investigation and compare the value of SAC305 and SAC405. From this investigation, it was reported that tensile strength is increased, with an increase of Ag content and hardness and density were also increases in the same manner.
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Pal, Manoj Kumar, Gréta Gergely, Dániel Koncz Horváth, and Zoltán Gácsi. "Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy." Metallurgical and Materials Engineering 24, no. 1 (April 2, 2018): 27–36. http://dx.doi.org/10.30544/344.
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The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.
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Nguyen, T. T., D. Yu, and S. B. Park. "Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation." Journal of Electronic Materials 40, no. 6 (February 12, 2011): 1409–15. http://dx.doi.org/10.1007/s11664-011-1534-z.
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Depiver, Joshua A., Sabuj Mallik, and Emeka H. Amalu. "Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)." Journal of Electronic Materials 50, no. 1 (November 5, 2020): 263–82. http://dx.doi.org/10.1007/s11664-020-08525-9.
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AbstractBall grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints challenges the device functionality amidst component and system miniaturisation as well as wider adoption of lead-free solders. This investigation determines the effective BGA solders for improved thermo-mechanical reliability of the devices. It utilised a conducted study on creep response of a lead-based eutectic Sn63Pb37 and four lead-free Tin–Silver–Copper (SnAgCu) [SAC305, SAC387, SAC396 and SAC405] solders subjected to thermal cycling loadings and isothermal ageing. The solders form the joints between the BGAs and printed circuit boards (PCBs). ANSYS R19.0 package is used to simulate isothermal ageing of some of the assemblies at − 40°C, 25°C, 75°C and 150°C for 45 days and model the thermal cycling history of the other assemblies from 22°C ambient temperature for six cycles. The response of the solders is simulated using the Garofalo-Arrhenius creep model. Under thermal ageing, SAC396 solder joints demonstrate possession of least strain energy density, deformation and von Mises stress in comparison to the other solders. Under thermal cycle loading conditions, SAC405 acquired the lowest amount of the damage parameters in comparison. Lead-free SAC405 and SAC387 joints accumulated the lowest and highest energy dissipation per cycle, respectively. It is concluded that SAC405 and SAC396 are the most effective solders for BGA in devices experiencing isothermal ageing and temperature cycling during operation, respectively. They are proposed as the suitable replacement of eutectic Sn63Pb37 solder for the various conditions.
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Koleňák, Roman, Robert Augustin, Maroš Martinkovič, and Michal Chachula. "Comparison study of SAC405 and SAC405+0.1%Al lead free solders." Soldering & Surface Mount Technology 25, no. 3 (June 21, 2013): 175–83. http://dx.doi.org/10.1108/ssmt-aug-2012-0018.
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Li, Ying Mei, Tian Yu Zhao, Jun Liu, and Bao Zong Huang. "Research for Viscoplastic Behaviors of SAC405 Pb-Free Solder." Advanced Materials Research 690-693 (May 2013): 2686–89. http://dx.doi.org/10.4028/www.scientific.net/amr.690-693.2686.
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Aiming at Pbfree solder Sn4.0Ag0.5Cu (in short, SAC405), the uniaxial tensile tests are accomplished with constant strain-rate under different temperature and strain-rate load conditions. The elastic-viscoplastic behaviors of SAC405 solders are studied. The rate-dependent material main properties are analyzed, such ad yield limit, tensile strength, saturation stress, etc. Partitioned constitutive model is accepted to describe the constitutive behavior of SAC405 solder. The seven parameters in partitioned model are determined by experiment data. The results of numerical simulation are fitted with the experimental values.
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Hsu, Hsiang Chen, Shen Wen Ju, Jie Rong Lu, and Yue Min Wan. "Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)." Advanced Materials Research 126-128 (August 2010): 929–34. http://dx.doi.org/10.4028/www.scientific.net/amr.126-128.929.
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An electro-thermo coupling finite element model is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging. Sn4.0Ag0.6Cu (SAC405) solder ball are commonly used on POP package in this research. Current density arising in the Copper trace above SAC405 solder ball implies the hot spot where results in an electromigration along the current direction. Finite element predictions reveal the peak electro-thermo-mechanical effective stress is located at the regions where electromigration potentially occurred. Current crowding, temperature distribution and electro-thermo induced effective stress distribution are predicted. A submodel scheme is applied for evaluation of equivalent life time of solder ball. Reliability analysis on electro-thermo-mechanical for SAC405 solder ball is evaluated.
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Kamarul Asri, Asma, and Esah Hamzah. "Corrosion Behaviour of Lead-Free and Sn-Pb Solders in 3.5wt% NaCl." Advanced Materials Research 686 (April 2013): 250–60. http://dx.doi.org/10.4028/www.scientific.net/amr.686.250.
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The current need to produce lead-free solders in the electronic industries makes it necessary for the replacing solders to have properties which are comparable if not better than the conventional Sn-Pb solders. Thus this research was conducted to compare the corrosion behaviour of lead-free solders with composition Sn-4.0Ag-0.5Cu (SAC405), and Sn-3.0Ag-0.5Cu (SAC305) with conventional Sn-37Pb solders. Corrosion tests were conducted using salt spray tests with 3.5% sodium chloride (NaCl) solutions. The samples were characterized after corrosion tests by using SEM, EDS and XRD. The results showed that the elements present in the solders contributed to galvanic corrosion mechanism that affected the overall corrosion behaviour of the solders.
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Soares, Delfim, Manuel Sarmento, Daniel Barros, Helder Peixoto, Hugo Figueiredo, Ricardo Alves, Isabel Delgado, José C. Teixeira, and Fátima Cerqueira. "The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure." Soldering & Surface Mount Technology 33, no. 1 (April 3, 2020): 19–25. http://dx.doi.org/10.1108/ssmt-10-2019-0029.
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Purpose This study aims to investigate the effect of bismuth addition (up to 30 Wt%) on the microstructure and electrical conductivity of a commercial lead-free alloy (SAC405) near the solder/substrate soldered joint. The system under study is referred in this work as (SAC405 + xBi)/Cu, as Cu is the selected substrate in which the solder was casted. The electrical resistivity of this system was investigated, considering Bi addition effect on the local microstructure and chemical composition gradients within that zone. Design/methodology/approach Solder joints between Cu substrate and SAC405 alloy with different levels of Bi were produced. The electrical conductivity along the obtained solder/substrate interface was measured by four-point probe method. The microstructure and chemical compositions were evaluated by scanning electron microscopy/energy dispersive spectroscopy analysis. Findings Two different electrical resistivity zones were identified within the solder interface copper substrate/solder alloy. At the first zone (from intermetallic compound [IMC] until approximately 100 μm) the increase of the electrical resistivity is gradual from the substrate to the solder side. This is because of the copper substrate diffusion, which established a chemical composition gradient near the IMC layer. At the second zone, electrical resistivity becomes much higher and is mainly dependent on the Bi content of the solder alloy. In both identified zones, electrical resistivity is affected by its microstructure, which is dependent on Cu and Bi content and solidification characteristics. Originality/value A detailed characterization of the solder/substrate zone, in terms of electrical conductivity, was done with the definition of two variation zones. With this knowledge, a better definition of processing parameters and in-service soldered electronic devices behavior can be achieved.
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Shaffiar, N. M., Z. B. Lai, and Mohd Nasir Tamin. "Damage Mechanics Model for Solder/Intermetallics Interface Fracture Process in Solder Joints." Key Engineering Materials 462-463 (January 2011): 1409–14. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.1409.
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The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fracture event. Reflowed Sn-4Ag-0.5Cu (SAC405) solder ball on OSP copper pad and orthotropic FR4 substrate under ball shear push test condition at 3000 mm/sec is simulated. Unified inelastic strain constitutive model describes the strain rate-response of the SAC405 solder. Comparable simulated and measured load-displacement values during solder ball shear push test serve as validation of the damage-based FE model. Results indicate a nonlinear damage evolution at each material point of the solder/IMC interface during the ball shear push test. The normal-to-shear traction ratio at the onset of the interface fracture is 1.59 indicating significant induced bending effect due to shear tool clearance. Rapid interface crack propagation is predicted following crack initiation event with the average crack speed up to 24.6 times the applied shear tool speed. The high stress concentration along the edge of the solder/IMC interface facilitates local crack initiation and dictates the shape of the predicted dynamic crack front.
Dissertations / Theses on the topic "SAC405"
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Tunga, Krishna Rajaram. "Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/24805.
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Mach, Ladislav. "Vliv množství pájky a izotermálního stárnutí na vodivost pájeného spoje." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2012. http://www.nusl.cz/ntk/nusl-219521.
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The master thesis analyses electrical conductivity of lead-free solder joints. The test method design for monitoring the electrical conductivity of the soldered joint is described in the practical part. Simulated BGA package with four pin (BGA4) is used for experiments. Tested PCBs are subjected to isothermal aging and current load. During isothermal aging is measured electrical conductivity and optical microscope is used for intermetallic layer (IMC) growth observation. Two types of surface finish (OSP and ENIG) are used for tests and three diameters of solder terminal balls (solder alloy SAC405). The influence of the ratio area connection / solder volume (ratio S / V) on lead-free solder joints conductivity was evaluated.
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Slavík, Pavel. "Nastavení výrobního procesu za účelem minimalizace tvorby voidů v pájce při použití slitiny SAC305." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2018. http://www.nusl.cz/ntk/nusl-377344.
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The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.
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Chen, Guang. "An investigation into nano-particulates reinforced SAC305-based composite solders under electro- and thermo-migration conditions." Thesis, Loughborough University, 2017. https://dspace.lboro.ac.uk/2134/27576.
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With the rapid development in electronic packaging due to product miniaturisation, the size of solder joints is decreasing considerably, thus the failure of solder interconnects induced by electro-migration (EM) and thermo-migration (TM) became a reliability concern. The incorporation of foreign reinforcement can effectively improve properties of the solder alloys. However, this presents an imperative need for a further investigation to elaborate the underlying fundamentals associated with the reliability of reinforced solders. In this study, the Sn-Ag-Cu (SAC) based solder alloy powders as matrix were incorporated with Fullerene (FNS), TiC and Ni-coated graphene (NG) reinforcements to form composite solders through powder metallurgical method. These composite solders were then characterised in terms of their microstructure, physical property, solderability, followed by a systematic investigation of their performance under isothermal ageing, current stressing and large thermal gradient, respectively. The results showed that three types of reinforcements were successfully incorporated into the solder matrix; with all reinforcements added being embedded in the solder matrix or around the intermetallic compounds (IMC). The average loss of FNS and TiC particles in the solders was approximately 80% after the initial reflow, while this was only 40% for NG particles. It has been observed that β-Sn and Ag3Sn in the SAC solder alloys can be refined by adding appropriate amount of FNS and TiC, which is beneficial to the wettability with a reduced coefficient of thermal expansion (CTE) with the minimal influence on the melting point and electrical resistivity of solder alloys. For the SAC alloys without reinforcements, obvious extrusion of interfacial IMC at the anode was present after 360 hours of current (1.5×104 A/cm2) stressing, while the changes of surface profiles of all reinforced solders were unnoticeable. Under the current stressing regimes, a continuous increase of interfacial IMCs at the anode of the original SAC alloys was observed, but decreased at the cathode with stressing time. For the composite solders, both anode and cathode showed a continuous growth of interfacial IMCs; the growth rates of IMCs at the anode were greater than that at cathode. In addition, NG and TiC were found to be most effective to retard the growth of Cu3Sn IMC under current stressing. A gradient in hardness across the stressed SAC joints was present, where it was harder at anode. However, no such obvious gradient was found in SAC/FNS and SAC/NG solder joints. FNS and NG were proven to be beneficial to prolong the service life of solder joints up to approximately 7.6% and 10.4% improvements, respectively. Thermal stressing made the interfacial IMC in the original SAC joints to grow at the cold end considerably; causing serious damage at the hot end after 600 hours under temperature gradient of 1240K/cm stressing; a large number of IMCs, cracks and voids appeared in the SAC solder joints. However, a uniform increase of IMCs at both sides in the composite solders was observed without apparent damages at the interfaces under the same thermal stressing conditions, indicating an effective reduction of the elemental migration in the reinforced solders. Although there were also some voids and IMCs formed in the composite solder joints after a long-term thermal stressing, the integrity of the composite solder joints was enhanced compared with the SAC alloys. During thermal stressing, the dissolution rate of Cu atom into the SAC solder joints was estimated to be 3.1×10-6 g/h, while the values for SAC/FNS, SAC/NG and SAC/TiC were only 1.22×10-6 g/h, 1.09×10-6 g/h and 1.67×10-6 g/h, respectively.
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Matras, Jan. "Aplikace reaktivních nanočástic do SAC pájecí pasty." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2018. http://www.nusl.cz/ntk/nusl-377074.
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This work is a research on the topic of reactive nanoparticles and their agitation into the solder paste, which it also describes. It describes in detail the properties of each solder alloys. It explains the creation of intermetallic layers in the soldering process and examines their structure. It also focuses on the evaluation and methodology of testing the properties of solder pastes. In the practical part, individual tests are performed with PF606 and PF610 solder paste.
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Lu, Chieh-Jung, and 呂杰融. "Electromigration Analysis and Electro-Thermo-Mechanical Design for SAC405 Alloy." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/23287664760496525838.
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碩士義守大學
機械與自動化工程學系碩士班
98
The objective of this research is focused on an advanced electro-thermo coupling model which is developed to investigate the electromigration and electro-thermo-mechanical effects for SAC405 alloy on electronic packaging, especially on Package-on-Package (POP). POP packaging involves in Sn4.0Ag0.6Cu (SAC405) solder ball on package. For the past two decades, electromigration on Integrated Circuit (IC) packaging has been a serious reliability issue, which drives many researchers and engineers concentrated on this study. The current density arising in the Copper trace above SAC405 solder ball imply the hot spot where results in an electromigration along the current direction. Previous studies experimentally demonstrated that electromigration on the solder bump/solder ball is the most tenacious cause affected reliability. Copper ionic corrosion always occurs under high current density at leveled temperature. Working temperature and current density are the main factors which directly impact electromigration behaviors. Higher thermal resistance and lower resistivity implies higher anti-eletromigration capability. Current crowding is reported on the corner where geometry dramatically changes. In this research, electric analysis is first performed to evaluate the current density and current crowding and follow-by electro-thermo coupled design on the POP package. Because the current is crowded due to complex geometry of structure, a single solder ball and an entire bond wire are modeled to simply the problem. As electricity analysis is continued, the selected solder ball is electrified to observe the current crowding. Black’s equation is employed to determine the predicted equivalent life time for SAC405 solder ball. Material properties, such as electrical resistivity and temperature coefficient of resistance are crucial and vary from working temperature. Mesh density is required to evaluate the convergence for structure integrity. Finite element analysis reveal the maximum electro-thermo-mechanical stress is located at the regions where electromigration potentially occurs. Reliability on SAC405 solder ball is evaluated. Current crowding, temperature distribution and electro-thermo induced effective stress distribution are predicted. A series of comprehensive parametric studies were conducted in this research.
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Liu, Kuang-Ting, and 劉光庭. "Geometric Shape Prediction for a Sn/4.0Ag/0.5Cu (SAC405) Solder Joint After Reflows." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/r2ebem.
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碩士國立中山大學
機械與機電工程學系研究所
96
The fatigue-induced solder joint failure of surface mounted electronic devices has become one of the most critical reliability issues in electronic packaging industry. Prediction of the shape of solder joints has drawn special attention to the related development and engineering applications. Numerous solder joint models, based on energy minimization principle and analytical methods, have been proposed and developed. The methods are extensively utilized to the shape design of solder joint. However, it is important to find a suitable method to real applications. Herein, a series of experiments with different geometric parameters of SAC405 solder joints were carried out and the results were compared with the prediction by Surface Evolver Program. The changes of geometric shape with respect to different parameters of solder joint were also discussed. The influence of the geometric parameters, such as volume of solder joint, package weight, solder surface tension, and gravity force to the shape of solder joint were investigated. Two experiments with SAC405 solder balls were carried out. One is to observe the different reflowed geometry shape of solder balls with various volumes, and another is to observe the different reflowed geometry shape of solder balls with various loadings on them. The results show that the models made by Surface Evolver program are very similar to the real shapes observed by experiments, and the differences are between -3% ~ 6.5%. Thus, the results show that the predicted shapes are satisfactorily suitable. Finally, the predicted models by Surface Evolver program were also put into the ANSYS program, and preceded the fatigue life prediction due to thermal cycling tests. The comparison of the effect on fatigue life with respect to different geometry shapes is illustrated. The results show the shape of solder ball due to high loadings is better than that in thermal cycling tests.
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Yeh, Ya-Ching, and 葉雅靜. "Investigation of SAC305 and SAC105 soldering with ENEPIG." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/19627329207271272863.
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碩士國立交通大學
工學院精密與自動化工程學程
100
This study concentrates on the soldering reactions and the mechanical response between Sn-1.0Ag-0.5 and Sn-3.0Ag-0.5Cu lead-free solders and ENEPIG surface finish. In order to investigate mechanical property of this two different alloy, the samples are firstly stored in high temperature condition then tested with two difference shear rate, i.e., ball shear test(0.0001 m/s) and high speed ball shear test(1 m/s). The results indicated that both shear strength in difference shear rate of Sn-1.0Ag-0.5Cu joints lower than Sn-3.0Ag-0.5Cu, however, the fracture resistance ability is better at high speed ball shear test. Keywords: ENEPIG, Ball shear test, High speed ball shear test.
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Lo, Shao-cheng, and 羅紹誠. "Interfacial Reactions and Mechanism Properties between SAC405 and SACNG Lead-free Solders with Au/Ni(P)/Cu Substrates Reflowed by CO2 laser." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/81050508453179976536.
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碩士國立臺灣科技大學
材料科技研究所
97
The BGA package is an important electronic connecting technology in electronic packaging industry. Due to the hurt of lead (Pb), the lead-free solders have become an important issue now. Sn-Ag-Cu (SAC) alloys are popular lead-free solders and widely use in electronic packaging industry, then Ni and Ge have been added into SAC solders in order to improve its wettability and oxidation resistivity. In the soldering process, because of the chemical potential gradient and the local equilibrium between solders and substrates, intermetallic compounds (IMCs) were formed at the interface. IMC formation can enhance bonding between the electronic device and substrate, but excessive growth of IMC can have detrimental effects on the long-term reliability of soldered points. However, the microelectronic industry is moving toward small size which requires local heating reflow methods like laser reflow. This study investigate the interfacial reactions and mechanical property between Sn-4.0Ag-0.5Cu (wt%) and Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (wt%) lead free solders with Au/Ni(P)/Cu substrate by CO2 laser reflow. These results would compare with the same systems under a conventional hot-air reflowing method in the oven. After reflow, the samples were aged at 150℃ for up to 1000 hours. Under CO2 laser reflowing, mixtures of the (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 phases and (Ni, P, Cu) solid solution were formed at the interface. After taking a long period of heat-treatment, the (Cu,Ni)6Sn5 + (Ni,Cu)3Sn4 were still observed at the interface. But, the (Ni, P, Cu) solid solution disappeared as increasing reaction times. The experimental results compared with the same couples by conventional hot-air reflowing at 240℃, two layer structures, the (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 phases, were formed at the interface. The IMCs spalling off the interface could be observed in SACNG/Au/Ni/Cu reaction couple. In addition, the grain morphology of the IMC reaction couples by hot-air reflowing was a polyhedron-type structure. This is due to long solidification process providing the enough time to make the IMC grain grow and ripen. Because of rapidly solidification of alloys in the reaction couples by CO2 laser, elements did not have enough time to diffuse then to form distinct IMC grain. Thus, the indistinct IMC grains formed at the interface. The result indicated their grain morphology were strongly dependent on the reflowing methods. The mechanical property test indicated that the shear strength is independent to annealing time. The mechanical strength of solder joints by the laser reflowing technique is very similar to that by the hot-air reflowing method.
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Tsai, Ming-Ching, and 蔡明錦. "Interfacial Reactions Between Thermoelectric Materials and Solders (SAC105, SAC305, LF35)之界面反應." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/66368892721614021481.
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碩士國立中興大學
化學工程學系所
102
The main trend for the world is looking for environmentally friendly material and saving energy in order to preserve the limited resources on Earth. Thermoelectric materials have the characteristic of converting heat and electricity back and forth, so it has already been widely used in our life. The good Z value (figure of merit) of bismuth telluride has made it the most popular choice in low temperature usage, but the concern is that the formation of intermetallic compound SnTe during the reaction of bismuth telluride with solder Sn will affect the electrical property and reliability. The problem can be solved by either adding some metals into the solder or electroplating a Ni diffusion barrier layer between solder and bismuth telluride in order to suppress the formation of intermetallic compound SnTe. This study investigates the interfacial reactions of three different solders (SAC105, SAC305, and LF35) with N (Bi2Te2.7Se0.3) type and P (Bi0.5Sb1.5Te3) type substrates. The experiment runs with different reflow times under the constant temperature of 250oC and obtains the relationship between reaction time and the thickness of intermetallic compound for further exploring the growth mechanism. The result shows the combination of N type substrate with LF35 solder has higher intermetallic compound thickness and the main diffusion elements are Bi and Te for forming SnTe and BiTe intermetallic compounds. On the other hand, P type substrate with SAC305 solder has the lowest intermetallic compound thickness and the main diffusion elements are Sb and Te for forming SnTe and SbSn intermetallic compounds. Hence, the kinetic n value can be derived from the thickness of intermetallic compound to assume the reaction mechanism.
Book chapters on the topic "SAC405"
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Depiver, Joshua A., Sabuj Mallik, Yiling Lu, and Emeka H. Amalu. "Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications." In Advances in Transdisciplinary Engineering. IOS Press, 2021. http://dx.doi.org/10.3233/atde210035.
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Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly’s heart lies the ‘soldering technology’ and the ‘solder joints’ between electronic components and substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40°C to 150°C, and isothermal ageing was done at −40, 25, 75 and 150°C temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders’ strain energy density. The SAC405 and SAC396 have the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.
Conference papers on the topic "SAC405"
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Chheda, Bankeem V., Sathishkumar Sakthivelan, S. Manian Ramkumar, and Reza Ghaffarian. "Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89321.
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With lead-free implementation it is important to examine the behaviour of the solder joint at the component level and at the board level. Assembly related issues along with component reliability are the main focus of this experimental research. This experimental study aims to evaluate the mechanical integrity of solder joints comprising of both lead-free and SnPb alloys. Lead-free and SnPb solder pastes were used to assemble the components. This will allow us to check the forward and the backward compatibility of the solder alloys. The test vehicle considered for this study contained a variety of components such as ultra chip scale package (UCSP192), package on package (PoP), plastic ball grid array (PBGA-676 & 1156), very thin chip array BGA (CVBGA432), thin small outline package (TSOP-40 & 48), dual row micro-lead frame (DRMLF), micro-lead frame (MLF-36 & 72), and chip resistors (0201, 0402, 0603). The scope of this paper is limited to the performance evaluation for area array packages only. Solder ball alloy for the area array packages included SAC 305, SAC405, SAC105, SnAg and SnPb. Three different PCB surface finishes, electroless nickel immersion gold (ENIG), SnPb hot air solder level (HASL), and immersion silver (ImAg) were used. Different solder ball alloys and surface finish combinations provided good comparison data for investigating the assembly performance. The PCB assemblies were subjected to mechanical shock test in the as-soldered condition and also after 200 and 500 thermal shock cycles at −55 to 125°C. For the mechanical shock test, the assemblies were subjected to 30 drops from a height of 3 ft, generating an average G force of 485N. After each drop the components were checked for the continuity of the total daisy chain. The number of drops for the first failure was used in analyzing the performance of the components for various combinations. Since each component had many independent daisy chains, the failure of the individual daisy chains was later used in determining the location of the failure and how it progressed. Two sets of test vehicles were assembled. One set comprised of components with lead-free solder balls of different composition (SAC305, SAC405, SAC105, SnAg) and the other set comprised of components with lead-free solder balls and SnPb solder balls (SAC305, SAC405, SnPb). This mix of alloy composition provided adequate data for comparison. It was critical to optimize the process in order to enable the melting of the mix of alloys. The area array package performance was evaluated when assembled with lead-free and SnPb solder paste. Some of the assemblies were cross-sectioned after the tests and the microstructure of the solder joint was analyzed to study the possible cause for assembly failure.
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Zhang, Yifei, Zijie Cai, Jeffrey C. Suhling, and Pradeep Lall. "Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89373.
Full textAbstract:
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25°C) and elevated temperature aging (125°C) were unexpectedly large and universally detrimental to reliability. Such effects for lead free solder materials are especially important for the harsh applications environments present in high performance computing and in automotive, aerospace, and defense applications. However, there has been little work in the literature, and the work that has been done has concentrated on the degradation of solder ball shear strength (e.g. Dage Shear Tester). Current finite element models for solder joint reliability during thermal cycling accelerated life testing are based on traditional solder constitutive and failure models that do not evolve with material aging. Thus, there will be significant errors in the calculations with the new lead free SAC alloys that illustrate dramatic aging phenomena. In the current work, we have extended our previous studies to include a full test matrix of aging temperatures and solder alloys. The effects of aging on mechanical behavior have been examined by performing stress-strain and creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) that were aged for various durations (0–6 months) at room temperature (25°C), and several elevated temperatures (50, 75, 100, and 125°C). Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Variations of the mechanical and creep properties (elastic modulus, yield stress, ultimate strength, creep compliance, etc.) were observed and modeled as a function of aging time and aging temperature. In this paper, we report on the creep results. The chosen selection of SAC alloys has allowed us to explore the effects of silver content on aging behavior (we have examined SACN05 with N = 1%, 2%, 3%, and 4% silver; with all alloys containing 0.5% copper). In order to reduce the aging induced degradation of the material behavior of the SAC alloys, we are testing several doped SAC alloys in our ongoing work. These materials include SAC0307-X, SAC105-X, and SAC305-X; where the standard SAC alloys have been modified by the addition of small percentages of one or more additional elements (X). Using dopants (e.g. Bi, In, Ni, La, Mg, Mn, Ce, Co, Ti, etc.) has become widespread to enhance shock/drop reliability, and we have extended this approach to examine the ability of dopants to reduce the effects of aging and extend thermal cycling reliability.
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Hasnine, Md, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, and Pradeep Lall. "Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48623.
Full textAbstract:
In the current study, we have extended our previous work on nanoindentation of joints to examine a full test matrix of SAC solder alloys. The effects of silver content on SAC solder aging has been evaluated by testing joints from SACN05 (SAC105, SAC205, SAC305, and SAC405) test boards assembled with the same reflow profile. In all cases, the tested joints were extracted from 14 × 14 mm PBGA assemblies (0.8 mm ball pitch, 0.46 mm ball diameter) that are part of the iNEMI Characterization of Pb-Free Alloy Alternatives Project (16 different solder joint alloys available). After extraction, the joints were subjected to various aging conditions (0 to 12 months of aging at T = 125 C), and then tested via nanoindentation techniques to evaluate the stress-strain and creep behavior of the four aged SAC solder alloy materials at the joint scale. The observed aging effects in the SACN05 solder joints have been quantified and correlated with the magnitudes observed in tensile testing of miniature bulk specimens performed in prior studies. The results show that the aging induced degradations of the mechanical properties (modulus, hardness) in the SAC joints were of similar order (30–40%) as those seen previously in the testing of larger “bulk” uniaxial solder specimens. The creep rates of the various tested SACN05 joints were found to increase by 8–50X due to aging. These degradations, while significant, were much less than those observed in larger bulk solder uniaxial tensile specimens with several hundred grains, where the increases ranged from 200X to 10000X for the various SACN05 alloys. Additional testing has been performed on very small tensile specimens with approximately 10 grains, and the aging-induced creep rate degradations found in these specimens were on the same order of magnitude as those observed in the single grain joints. Thus, the lack of the grain boundary sliding creep mechanism in the single grain joints is an important factor in avoiding the extremely large creep rate degradations (up to 10,000X) occurring in larger bulk SAC samples. All of the aging effects observed in the SACN05 joints were found to be exacerbated as the silver content in the alloy was reduced. In addition, the test results for all of the alloys show that the elastic, plastic, and creep properties of the solder joints and their sensitivities to aging are highly dependent on the crystal orientation. Due to the variety of crystal orientations realized during solidification, it was important to identify the grain structure and crystal orientations in the tested joints. Cross-polarized light microscopy and Electron Back Scattered Diffraction (EBSD) techniques have been utilized for this purpose. The test results show that the elastic, plastic, and creep properties of the solder joints and their sensitivities to aging are highly dependent on the crystal orientation. In addition, an approach has been developed to predict tensile creep strain rates for low stress levels using nanoindentation creep data measured at very high compressive stress levels.
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Cai, Zijie, Jeffrey C. Suhling, Pradeep Lall, and Michael J. Bozack. "The Effects of Dopants on the Aging Behavior of Lead Free Solders." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52184.
Full textAbstract:
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. Over the past several years, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25 C) and elevated temperature aging (50, 75, 100, 125, and 150 C) were unexpectedly large and universally detrimental to reliability. The measured stress-strain data demonstrated large reductions in stiffness, yield stress, ultimate strength, and strain to failure (up to 50%) during the first 6 months after reflow solidification. In addition, even more dramatic evolution was observed in the creep response of aged solders, where up to 100X increases were found in the steady state (secondary) creep strain rate (creep compliance) of lead free solders that were simply aged at room temperature. For elevated temperature aging at 125 C, the creep strain rate was observed to change even more dramatically (up to 10,000X increase). There is much interest in the industry on establishing optimal SAC-based lead free solder alloys that minimize aging effects and thus enhance thermal cycling and elevated temperature reliability. During the past year, we have extended our previous studies to include several doped SAC alloys (SAC-X) where the standard SAC alloys have been modified with small percentages of one or two additional elements (X). Materials under consideration include SAC0307-X, Sn-.7Cu-X, SAC305-X, SAC3595-X and SAC3810-X. Using dopants (e.g. Bi, In, Ni, La, Mg, Mn, Ce, Co, Ti, etc.) has become widespread to enhance shock/drop reliability, and we have extended this approach to examine the ability of dopants reduce the effects of aging and extend thermal cycling reliability. In the current paper, we concentrate on showing results for SACX™, which has the composition Sn-0.3Ag-0.7Cu-X with X = 0.1Bi. We have performed aging under 5 different conditions including room temperature (25 C), and four elevated temperatures (50, 75, 100 and 125). We have also extended the duration of aging considered in our experiments to up to 12 months of aging on selected alloys. Variations of the mechanical and creep properties (elastic modulus, yield stress, ultimate strength, creep compliance, etc.) have been observed. We have correlated the aging results for the doped SAX-X alloy with our prior data for the “standard” lead free alloys SACN05 (SAC105, SAC205, SAC305, SAC405). The doped SAC-X alloy shows improvements (reductions) in the aging-induced degradation in stiffness, strength, and creep rate when compared to SAC105, even though it has lower silver content. In addition, the doped SAC-X alloy has been observed to reach a stabilized microstructure more rapidly when aged. Mathematical models for the observed aging variations have been established so that the variation of the stress-strain and creep properties can be predicted as a function of aging time and aging temperature.
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Yao, Wei, and Cemal Basaran. "Damage of SAC405 solder joint under PDC." In 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2012. http://dx.doi.org/10.1109/itherm.2012.6231458.
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Toh, C. H., Hao Liu, C. T. Tu, T. D. Chen, and Jessica Yeo. "Interfacial Reactions in Ni-doped SAC105 and SAC405 Solders on Ni-Au Finish during Multiple Reflows." In 2007 8th International Conference on Electronic Packaging Technology. IEEE, 2007. http://dx.doi.org/10.1109/icept.2007.4441458.
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Siti Rabiatull Aisha, A. Ourdjini, N. M. Wah, H. C. How, and Y. T. Chin. "Interfacial reactions of SAC305 and SAC405 solders on electroless Ni(P)/immersion Au and electroless Ni(B)/immersion Au finishes." In 2010 34th International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2010. http://dx.doi.org/10.1109/iemt.2010.5746712.
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Ahmed, Sudan, Munshi Basit, Jeffrey C. Suhling, and Pradeep Lall. "Characterization of Doped SAC Solder Materials and Determination of Anand Parameters." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48624.
Full textAbstract:
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In present work, three new doped lead free solder materials recommended for high reliability applications have been chemically analyzed and then mechanically tested in order to determine the nine Anand parameters. The alloys are referred to as Ecolloy (SAC_R), CYCLOMAX (SAC_Q), and Innolot by their vendors. The first two doped alloys (SAC_R and SAC_Q) were found to be composed of Sn, Ag, Cu, and a single X-element dopant. Such solders are commonly referred to as SAC-X in the literature. For the third material (Innolot), three different dopants are present along with Sn, Ag and Cu. The EDX method was used to determine the approximate chemical composition of the materials, and Bismuth (Bi) was found to be the X-additive for both SAC_R and SAC_Q. In addition, the SAC_R material was found to have no silver (Ag), which is the reason it is marketed as a low cost (economy) material. The nine Anand parameters were determined for each unique solder alloy from a set of uniaxial tensile tests performed at several strain rates and temperatures. Testing conditions included strain rates of 0.001, 0.0001, and 0.00001 (sec−1), and temperatures of 25, 50, 75, 100, and 125 C. The Anand parameters were calculated from each set of stress-strain data using an established procedure that is described in detail in the paper. The mechanical properties and the values of Anand parameters for these new doped alloys were compared with those for standard SAC105 and SAC405 lead free alloys. Although the SAC_R material does not have any silver, it was shown to have better mechanical behavior than SAC105 due to the presence of Bismuth (Bi) along with a little higher percentage of Copper (Cu). The SAC_Q and Innolot materials were shown to have significantly higher strength than SAC405. After deriving the Anand parameters for each alloy, the stress-strain curves have been calculated for various conditions, and excellent agreement was found between the predicted results and experimental stress-strain curves.
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Ma, Hongtao, Jeffrey C. Suhling, Yifei Zhang, Pradeep Lall, and Michael J. Bozack. "Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33545.
Full textAbstract:
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects (Ma, et al., ECTC 2006), we demonstrated that the observed material behavior variations of SAC405 and SAC305 lead free solders during room temperature aging (25 °C) were unexpectedly large and universally detrimental to reliability. Such effects for lead free solder materials are much more dramatic at the higher aging temperatures (e.g. 100–150 °C) typical of the harsh environments present in high performance computing and in automotive, aerospace, and defense applications. However, there has been little work in the literature, and the work that has been done has concentrated on the degradation of solder ball shear strength (e.g. Dage Shear Tester). Current finite element models for solder joint reliability during thermal cycling accelerated life testing are based on traditional solder constitutive and failure models that do not evolve with material aging. Thus, there will be significant errors in the calculations with the new lead free SAC alloys that illustrate dramatic aging phenomena. In the current work, we have explored the effects of elevated temperature isothermal aging on the mechanical behavior and reliability of lead free solders. The effects of aging on mechanical behavior have been examined by performing stress-strain and creep tests on SAC405 and SAC305 samples that were aged for various durations (0–6 months) at several elevated temperatures (80, 100, 125, and 150 °C). Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Variations of the temperature dependent mechanical properties (elastic modulus, yield stress, ultimate strength, creep compliance, etc.) were observed and modeled as a function of aging time and temperature. In this paper, we have concentrated our efforts on presenting the results for samples aged at 125 °C. In addition, the new elevated temperature aging data were correlated with our room temperature results from last year’s investigation. The results obtained in this work have demonstrated the significant effects of elevated temperature exposure on solder joints. As expected, the mechanical properties evolved at a higher rate and experienced larger changes during elevated temperature aging (compared to room temperature aging). After approximately 200 hours of aging, the lead free solder joint material properties were observed to degrade at a nearly constant rate. We have developed a mathematical model to predict the variation of the properties with aging time and aging temperature. Our data for the evolution of the creep response of solders with elevated temperature aging show that the creep behavior of lead free and tin-lead solders experience a “crossover point” where lead free solders begin to creep at higher rates than standard 63Sn-37Pb solder for the same stress level. Such an effect is not observed for solder joints aged at room temperature, where SAC alloys always creep at lower rates than Sn-Pb solder.
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Shen, Chaobo, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, and John L. Evans. "Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48009.
Full textAbstract:
This study illustrates test results and comparative literature data on the influence of isothermal aging and thermal cycling associated with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ball grid array (BGA) solder joints on three board finishes (ImAg, ENIG, ENEPIG). The resulting degradation shows that the characteristic lifetimes for both SAC105 and SAC305 decrease in the order ENIG > ENEPIG > ImAg. SAC305, with a higher relative fraction of Ag3Sn IMC within the solder, performs better than SAC105. SEM and EDX analysis shows continuous growth of Cu-Sn intermetallic compounds (IMC) on SAC/ImAg systems and Cu-Ni-Sn IMC on SAC/ENIG/ENEPIG systems at board side solder joints, which eventually cause fatigue failures.