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1
Kumar, P. Manoj, G. Gergely, D. K. Horváth, and Z. Gácsi. "Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)." Powder Metallurgy Progress 18, no. 1 (June 1, 2018): 49–57. http://dx.doi.org/10.1515/pmp-2018-0006.
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Abstract The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and microstructural investigation of SAC305 and SAC405. In this chapter, we study the composition, mechanical properties of SAC solder alloys and microstructure were examined by optical microscope and SEM and mechanical properties such as tensile tests, hardness test and density test of the lead solder alloys were explored. SAC305 and SAC405 alloys with different Ag content and constant Cu content under investigation and compare the value of SAC305 and SAC405. From this investigation, it was reported that tensile strength is increased, with an increase of Ag content and hardness and density were also increases in the same manner.
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Pal, Manoj Kumar, Gréta Gergely, Dániel Koncz Horváth, and Zoltán Gácsi. "Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy." Metallurgical and Materials Engineering 24, no. 1 (April 2, 2018): 27–36. http://dx.doi.org/10.30544/344.
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The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.
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Nguyen, T. T., D. Yu, and S. B. Park. "Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation." Journal of Electronic Materials 40, no. 6 (February 12, 2011): 1409–15. http://dx.doi.org/10.1007/s11664-011-1534-z.
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Depiver, Joshua A., Sabuj Mallik, and Emeka H. Amalu. "Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)." Journal of Electronic Materials 50, no. 1 (November 5, 2020): 263–82. http://dx.doi.org/10.1007/s11664-020-08525-9.
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AbstractBall grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints challenges the device functionality amidst component and system miniaturisation as well as wider adoption of lead-free solders. This investigation determines the effective BGA solders for improved thermo-mechanical reliability of the devices. It utilised a conducted study on creep response of a lead-based eutectic Sn63Pb37 and four lead-free Tin–Silver–Copper (SnAgCu) [SAC305, SAC387, SAC396 and SAC405] solders subjected to thermal cycling loadings and isothermal ageing. The solders form the joints between the BGAs and printed circuit boards (PCBs). ANSYS R19.0 package is used to simulate isothermal ageing of some of the assemblies at − 40°C, 25°C, 75°C and 150°C for 45 days and model the thermal cycling history of the other assemblies from 22°C ambient temperature for six cycles. The response of the solders is simulated using the Garofalo-Arrhenius creep model. Under thermal ageing, SAC396 solder joints demonstrate possession of least strain energy density, deformation and von Mises stress in comparison to the other solders. Under thermal cycle loading conditions, SAC405 acquired the lowest amount of the damage parameters in comparison. Lead-free SAC405 and SAC387 joints accumulated the lowest and highest energy dissipation per cycle, respectively. It is concluded that SAC405 and SAC396 are the most effective solders for BGA in devices experiencing isothermal ageing and temperature cycling during operation, respectively. They are proposed as the suitable replacement of eutectic Sn63Pb37 solder for the various conditions.
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Koleňák, Roman, Robert Augustin, Maroš Martinkovič, and Michal Chachula. "Comparison study of SAC405 and SAC405+0.1%Al lead free solders." Soldering & Surface Mount Technology 25, no. 3 (June 21, 2013): 175–83. http://dx.doi.org/10.1108/ssmt-aug-2012-0018.
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Li, Ying Mei, Tian Yu Zhao, Jun Liu, and Bao Zong Huang. "Research for Viscoplastic Behaviors of SAC405 Pb-Free Solder." Advanced Materials Research 690-693 (May 2013): 2686–89. http://dx.doi.org/10.4028/www.scientific.net/amr.690-693.2686.
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Aiming at Pbfree solder Sn4.0Ag0.5Cu (in short, SAC405), the uniaxial tensile tests are accomplished with constant strain-rate under different temperature and strain-rate load conditions. The elastic-viscoplastic behaviors of SAC405 solders are studied. The rate-dependent material main properties are analyzed, such ad yield limit, tensile strength, saturation stress, etc. Partitioned constitutive model is accepted to describe the constitutive behavior of SAC405 solder. The seven parameters in partitioned model are determined by experiment data. The results of numerical simulation are fitted with the experimental values.
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Hsu, Hsiang Chen, Shen Wen Ju, Jie Rong Lu, and Yue Min Wan. "Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)." Advanced Materials Research 126-128 (August 2010): 929–34. http://dx.doi.org/10.4028/www.scientific.net/amr.126-128.929.
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An electro-thermo coupling finite element model is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging. Sn4.0Ag0.6Cu (SAC405) solder ball are commonly used on POP package in this research. Current density arising in the Copper trace above SAC405 solder ball implies the hot spot where results in an electromigration along the current direction. Finite element predictions reveal the peak electro-thermo-mechanical effective stress is located at the regions where electromigration potentially occurred. Current crowding, temperature distribution and electro-thermo induced effective stress distribution are predicted. A submodel scheme is applied for evaluation of equivalent life time of solder ball. Reliability analysis on electro-thermo-mechanical for SAC405 solder ball is evaluated.
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Kamarul Asri, Asma, and Esah Hamzah. "Corrosion Behaviour of Lead-Free and Sn-Pb Solders in 3.5wt% NaCl." Advanced Materials Research 686 (April 2013): 250–60. http://dx.doi.org/10.4028/www.scientific.net/amr.686.250.
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The current need to produce lead-free solders in the electronic industries makes it necessary for the replacing solders to have properties which are comparable if not better than the conventional Sn-Pb solders. Thus this research was conducted to compare the corrosion behaviour of lead-free solders with composition Sn-4.0Ag-0.5Cu (SAC405), and Sn-3.0Ag-0.5Cu (SAC305) with conventional Sn-37Pb solders. Corrosion tests were conducted using salt spray tests with 3.5% sodium chloride (NaCl) solutions. The samples were characterized after corrosion tests by using SEM, EDS and XRD. The results showed that the elements present in the solders contributed to galvanic corrosion mechanism that affected the overall corrosion behaviour of the solders.
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Soares, Delfim, Manuel Sarmento, Daniel Barros, Helder Peixoto, Hugo Figueiredo, Ricardo Alves, Isabel Delgado, José C. Teixeira, and Fátima Cerqueira. "The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure." Soldering & Surface Mount Technology 33, no. 1 (April 3, 2020): 19–25. http://dx.doi.org/10.1108/ssmt-10-2019-0029.
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Purpose This study aims to investigate the effect of bismuth addition (up to 30 Wt%) on the microstructure and electrical conductivity of a commercial lead-free alloy (SAC405) near the solder/substrate soldered joint. The system under study is referred in this work as (SAC405 + xBi)/Cu, as Cu is the selected substrate in which the solder was casted. The electrical resistivity of this system was investigated, considering Bi addition effect on the local microstructure and chemical composition gradients within that zone. Design/methodology/approach Solder joints between Cu substrate and SAC405 alloy with different levels of Bi were produced. The electrical conductivity along the obtained solder/substrate interface was measured by four-point probe method. The microstructure and chemical compositions were evaluated by scanning electron microscopy/energy dispersive spectroscopy analysis. Findings Two different electrical resistivity zones were identified within the solder interface copper substrate/solder alloy. At the first zone (from intermetallic compound [IMC] until approximately 100 μm) the increase of the electrical resistivity is gradual from the substrate to the solder side. This is because of the copper substrate diffusion, which established a chemical composition gradient near the IMC layer. At the second zone, electrical resistivity becomes much higher and is mainly dependent on the Bi content of the solder alloy. In both identified zones, electrical resistivity is affected by its microstructure, which is dependent on Cu and Bi content and solidification characteristics. Originality/value A detailed characterization of the solder/substrate zone, in terms of electrical conductivity, was done with the definition of two variation zones. With this knowledge, a better definition of processing parameters and in-service soldered electronic devices behavior can be achieved.
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Shaffiar, N. M., Z. B. Lai, and Mohd Nasir Tamin. "Damage Mechanics Model for Solder/Intermetallics Interface Fracture Process in Solder Joints." Key Engineering Materials 462-463 (January 2011): 1409–14. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.1409.
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The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fracture event. Reflowed Sn-4Ag-0.5Cu (SAC405) solder ball on OSP copper pad and orthotropic FR4 substrate under ball shear push test condition at 3000 mm/sec is simulated. Unified inelastic strain constitutive model describes the strain rate-response of the SAC405 solder. Comparable simulated and measured load-displacement values during solder ball shear push test serve as validation of the damage-based FE model. Results indicate a nonlinear damage evolution at each material point of the solder/IMC interface during the ball shear push test. The normal-to-shear traction ratio at the onset of the interface fracture is 1.59 indicating significant induced bending effect due to shear tool clearance. Rapid interface crack propagation is predicted following crack initiation event with the average crack speed up to 24.6 times the applied shear tool speed. The high stress concentration along the edge of the solder/IMC interface facilitates local crack initiation and dictates the shape of the predicted dynamic crack front.
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Hsu, Hsiang Chen, Yu Chia Hsu, Chan Lin Yeh, and Yi Shao Lai. "Finite Element Prediction of Stack-Die Packages under Board Level Drop Test." Materials Science Forum 594 (August 2008): 169–74. http://dx.doi.org/10.4028/www.scientific.net/msf.594.169.
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The objective of this research is to investigate the solder joint reliability of board-level drop test based on the support excitation scheme incorporated with the submodel technique for stacked-die packages. Three lead-free materials, SAC405 (Sn4Ag0.5Cu), SAC355(Sn3.5Ag0.5Cu) and Sn3.5Ag were used to demonstrate the transient dynamic response for solder balls subject to JEDEC pulse-controlled board-level drop test standard. In order to evaluate the structure of the interested area, a strip model sliced from the full test vehicle is used in this research. In addition, the submodel region is particularly chosen with strip model by performing the cut boundary interpolation. The envelope of equivalent stress for the outermost solder joint off the end of the strip model is plot to show the potential failure mode and mechanism. The cut boundary of submodel is verified and the mesh density of submodel is examined. For a refinery mesh of submodel, parametric studies for structure and material are carried out to investigate the reliability of the outermost solder joint, and the results are summarized as design rules for the development of stacked-die packages.
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Dasgupta, Arnab, Fengying Zhou, Christine LaBarbera, Weiping Liu, Paul Bachorik, and Ning-Cheng Lee. "Reliability of PCB Solder Joints Assembled with SACm™ Solder Paste." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000367–73. http://dx.doi.org/10.4071/isom-tp65.
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The solder alloy SACm™0510 has been reported to be a superior alloy when used as BGA balls, exhibiting not only an outstanding drop test performance when compared to SAC105, but also as having high thermal fatigue reliability when compared to high Ag SAC solders. In this study, SACm0510 solder was evaluated as a solder paste. The voiding behavior of SGA solder joints was comparable for SACm0510, SAC105, and SC305. When evaluating SGA assemblies on a customized drop test, SACm0510 outperformed SAC105 considerably, which in turn was much better than SAC305. The drop test performance was found to improve upon thermal aging at 150°C, and the difference between the alloys reduced significantly. This was explained by the speculated grain coarsening which resulted in a softened solder joint, and consequently, a shift of fracture mode from brittle failure toward ductile failure. This model was supported by the observation of the fractured surface moving away from the interface upon thermal aging. The improvement in drop test performance upon thermal aging can be further explained by the large solder joint size of the SGA employed in this study, where the bulk property of solder weighed more than a small solder joint. When the assembled chip resistors were evaluated with a −55°C/+125°C TCT test, no failure was observed after 369 cycles for all three alloys. SAC305 appeared to be the best in maintaining the integrity of the interfacial IMC layer. SACm0510 showed a few crack lines, but less than that of SAC105. SACm0510 solder paste was found to be very compatible with BGAs with SAC305 solder joints, and no abnormal microstructure was observed after thermal aging at 150°C for 1000 hours.
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Saliza Azlina, Osman, Ali Ourdjini, and Mohd Halim Irwan Ibrahim. "Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes." Applied Mechanics and Materials 773-774 (July 2015): 232–36. http://dx.doi.org/10.4028/www.scientific.net/amm.773-774.232.
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In electronics industries, most of them had to shifted their solder materials from leaded solders into lead-free solders due to the environmental concerns and follow the legislation of Restriction of use Hazardous Substances (RoHS). Thus, Sn-Ag-Cu solder is one of the choices that can replace the leaded solder and also offer better properties. This study investigates the comparison between Sn-4.0Ag-0.5Cu (SAC405) and EN(P)EPIG and EN(B)EPIG surface finishes. Reliability of solder joint has been assessed by performing solid state isothermal aging at 150oC for 250 up to 2000 hours. After reflow soldering process, (Cu,Ni)6Sn5intermetallic compound (IMC) is dominated at near centre of solder meanwhile (Ni,Cu)3Sn4IMC is dominated at near outside of solder ball.Moreover, aging time resulted in an increase in thickness and changed the morphology into more spherical, dense and large grain size. Analysis by optical microscope revealed that the IMC thickness of EN(B)EPIG produced thicker IMC compared to EN(P)EPIG surface finish during reflow as well as isothermal aging.
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Azlina, Osman Saliza, Ali Ourdjini, Astuty Amrin, and Idris Siti Rabiatull Aisha. "Effect of Solder Volume on Interfacial Reaction between SAC405 Solders and EN(B)EPIG Surface Finish." Advanced Materials Research 845 (December 2013): 76–80. http://dx.doi.org/10.4028/www.scientific.net/amr.845.76.
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The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405) and electroless nickel (boron)/ immersion palladium/immersion gold (EN(B)EPIG). Reliability of solder joint has also been investigated by performing solid state isothermal aging at 125 °C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time of solder joints resulted in an increase in IMC thickness and a change in morphology into more spherical, dense and with larger grain size. By using optical microscope, the average thickness of the intermetallics was measured and it found that the larger solder balls produced thicker IMC than the smaller solder balls during reflow soldering. However, after aging the smaller solders produced thicker IMC than the larger solders.
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Shen, Chaobo, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack, J. C. Suhling, and John L. Evans. "Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000135–40. http://dx.doi.org/10.4071/isom-2015-tp52.
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This study illustrates test results and comparative literature data on the influence of isothermal aging and thermal cycling associated with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ball grid array (BGA) solder joints finished with ImAg, ENIG and ENEPIG on board side. The resulting degradation data suggests that ENIG is the best surface finish for applications involving long-term isothermal aging. ENEPIG ranks second, followed by ImAg. SAC305, with a higher relative fraction of Ag3Sn IMC within the solder, performs better than SAC105. SEM and polarized light microscope analysis show most cracks happened at package side, propagated from corner to center or even to solder bulk, which eventually cause fatigue failures. Three factors are discussed: IMC, Grain Structure and Ag3Sn particle. The continuous growth of Cu-Sn intermetallic compounds (IMC) and grains increase the risk of failure, while Ag3Sn particle seems helpful to block the crack propagation.
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Liu, Weiping, Ning-Cheng Lee, Simin Bagheri, Polina Snugovesky, Jason Bragg, Russell Brush, and Blake Harper. "Superior Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000829–43. http://dx.doi.org/10.4071/isom-2012-wp25.
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Board-level drop test performance was evaluated and compared for the following four different solder combinations in BGA/CSP assembly: 1) SnPb paste with SnPb balls, 2) SnPb paste with SAC105Ti balls, 3) SAC305 paste with SAC105Ti balls, and 4) SAC305 paste with SAC105 balls. Presence of Ti improved the drop test performance significantly, despite the voiding side effect caused by its oxidation tendency. It is anticipated that the voiding can be prevented with the development of a more oxidation resistant flux. The consistently poor drop test performance of 105Ti/SnPb is caused by the wide pasty range resulted from mixing SAC105 with Sn63 solder paste. The effect of Ti in this system is overshadowed by the high voiding outcome due to this wide pasty range material. In view of this, use of SAC105 BGA with SnPb solder paste is not recommended, with or without Ti addition. High reflow temperature drove fracture shift to interface at package side, presumably through building up IMC thickness beyond the threshold value. A lower reflow temperature is recommended. Electrical response is consistent with complete fracture data. But, complete fracture trend is inconsistent with that of partial fracture trend, and neither data can provide a full understanding about the failure mode. By integrating complete fracture and partial fracture into “Virtual Fracture”, the failure mechanism becomes obvious and data sets become consistent with each other.
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Shahbazi, Samson, and Mark Challingsworth. "How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver Conductor." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000099–106. http://dx.doi.org/10.4071/isom-2011-ta3-paper4.
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With the implementation of RoHS (the Restriction of Hazardous Substance) Directive banning the use of Lead, Cadmium, Mercury and Hexavalent Chromium, hybrid microelectronic manufacturers are globally embracing the lead free movement. These manufacturers must not only understand the implications of their material choice but must be aware of the interaction between lead free solder alloys and their RoHS compliant thick film materials. It is commonly known that lead free solder alloys process at much higher reflow temperatures than lead containing solder which can directly impact the fired film leach resistance and the loss of adhesion. There are also other concerns; lead free solders alloys generally require a different organic flux system to promote wetting and reflow, but this change may cause a fired film conductor to leach more easily than the flux used in the lead containing solders. The use of lead free solders such as SAC305, SAC405 or 95/5 on a low firing (550–570 °C) pure silver conductor has the tendency of leaching the fired film more readily than conductors containing small amounts of palladium or platinum. Many of these situations provide new challenges for the hybrid circuit manufacturer. There is little information available regarding the effects of the lead free solders on low firing silver thick film conductors. This paper discusses the results of a newly developed Pb and Cd free silver thick film conductor paste with a modified silver powder metallurgy to improve the leach resistance, solder acceptance and adhesion using lead free solder. In addition, the pure silver conductor was fired on top of a low temperature dielectric paste. This conductor was evaluated by comparing lead free solder alloys to traditional tin-lead-silver solder alloys. This study included evaluations based on SEM photos, solderability, leach resistance, and initial and long term adhesions. Results are published describing the difference in behavior between the different solder alloys in conjunction with the different silver powder metallurgy.
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Fallah-Adl, Ali, Amaneh Tasooji, Ravi Mahajan, Nachiket Raravikar, Richard Harries, and Sandeep Sane. "Applicability of Existing Reliability Models: Focus on Finite Element Modeling of Various BGA Package Designs and Materials." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000223–31. http://dx.doi.org/10.4071/isom-2011-tp2-paper1.
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The work presented here is one of the key elements of an integrated methodology for predicting reliability in packaging systems (IMPRPK) developed by Arizona State University (ASU) and Intel. IMPRPK approach is based on a probabilistic methodology, focusing on three major tasks: (1) Finite Element analysis (FEM) to predict loading conditions, (2) Characterization of BGA solder joints to identify failure mechanisms and obtain statistical data, and (3) development of a probabilistic methodology to achieve an integrated reliability solution. The focus of this paper is on FEM (task 1), evaluating the effect of package design/form-factor and solder materials on the extent of deformation (e.g., inelastic stress/strain and strain energy density) experienced by BGA solder joints. Global and Local FEM results for two different package designs (Flip-chip and wire-bonded FLI) and two different BGA solder materials (lead-free SAC405 and lead-rich eutectic Sn37Pb) are discussed. The FEM results and the applicability of the existing reliability models (e.g., energy-based model) to the complex microelectronics packaging systems are validated through independent comparison with the accelerated thermal cycled (ATC) test data.
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Hong, Won Sik, Mi-Song KIm, and Myeongin Kim. "MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes." Journal of Welding and Joining 39, no. 4 (August 30, 2021): 349–58. http://dx.doi.org/10.5781/jwj.2021.39.4.2.
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After the joining of small 1005 and 0603 multilayer ceramic capacitor (MLCC) components for a semiconductor package using Type 4 (T4) and Type 7 (T7) Sn-3.0Ag-0.5Cu (SAC305), T4 Sn-1.0Ag-0.5Cu (SAC105), and T4 Sn-0.3Ag-0.7Cu (SAC0307) solder pastes, the differences between hot air reflow and vacuum soldering processes were compared in terms of void content, shear strength, and microstructure. Results showed that the hot air reflow soldering process exhibited a stable joint with a void content of 5% or less, and the vacuum soldering condition significantly reduced the void content of the solder joint as the soldering proceeded in a vacuum state. The shear strength of the SAC305 solder joint with the same powder particle size was measured to be greater for the shear strength of the vacuum soldered joint as compared to the reflow process. The vacuum soldering process was effective in removing voids during the void joining process and contributed to an improved joint strength of the solder joint by reducing the void content. When the same soldering process was applied using the 1005 MLCC chip component, the bonding strength of the T4 SAC305 solder was slightly higher than those of the SAC105 and SAC0307 solders. However, the overall initial bonding strengths were similar. The e ffects of Ag content within 0.3-3.0 wt% on the initial bonding strengths of the solders were judged to be the same. Diverse Cu6Sn5, Ag3Sn, (Ni,Cu,Pd)3Sn4, (Cu,Ni)6Sn5, NiP, and Ni3P intermetalli ccompounds (IMCs) were formed at the interfaces between the electroless nickel/electroless palladium/immersion gold finish substrate and SAC solder joint. The IMC types were constant regardless of Ag content and solder type, and the IMCs contributed to the initial solder joint strength.
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Shohji, Ikuo, and Yuichiro Toyama. "Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-Free Alloys." Materials Science Forum 783-786 (May 2014): 2810–15. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.2810.
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The effect of strain rate on tensile properties of several lead-free solder was investigated using miniature size specimens. High-temperature lead-free solder which are Sn-Cu and Sn-Sb alloys were prepared. Moreover, low-Ag lead-free solder which are Sn-1Ag-0.7Cu (SAC107, mass%) based alloys were prepared. Sn-3Ag-0.5Cu (SAC305) was also prepared for comparison. Tensile strength is proportion to the logarithm of strain rate in all solder investigated. Although 0.1% proof stress decreases at high strain rate in high-temperature solder, it scarcely changes in low-Ag solder. Elongation somewhat increases with increasing strain rate in high-temperature solder. It increases with increasing strain rate in low-Ag solder although it is lower than that of SAC305. Chisel point fracture mainly occurred except Sn-13Sb. In Sn-13Sb, brittle fracture occurred and thus elongation was lower than those of other solder. Sn-8.5Sb and Sn-1Ag-0.7Cu-1Bi-0.2In show mechanical properties similar to SAC305.
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Burke, Cillian, and Jeff Punch. "A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys." IEEE Transactions on Components, Packaging and Manufacturing Technology 4, no. 3 (March 2014): 516–27. http://dx.doi.org/10.1109/tcpmt.2014.2299400.
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Yen, Yee-Wen, Hsien-Ming Hsiao, Shao-Cheng Lo, and Shu-Mei Fu. "Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2laser and hot-air methods." International Journal of Materials Research 104, no. 7 (July 11, 2013): 637–42. http://dx.doi.org/10.3139/146.110914.
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Liu, Yan, Joanna Keck, Erin Page, and Ning-Cheng Lee. "Voiding and Reliability of Assembly of BGA with SAC and 57Bi42Sn1Ag Alloys." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000128–39. http://dx.doi.org/10.4071/isom-2013-ta46.
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Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study, BGAs with SAC105, SAC305, and BiSnAg balls were assembled with SAC105, SAC305 or 57Bi42Sn1Ag solder paste. Joint mechanical strength, drop test performance, and voiding performance were evaluated against the reflow profile. SnPb was included as a control. The findings are as follows: (1) The microstructure of solder joints showed that, among all of the combinations, only BiSnAg-105 LT and BiSnAg-305 LT exhibited well-distinguishable alloy regions. For SAC-BiSnAg systems, Sn-dendrites were noticeable at LT, while Ag3Sn needles developed at HT. The joints were homogeneous for the rest of the combinations. (2) In the shear test, combinations involving BiSnAg solder were brittle, regardless of the Bi alloy location and reflow profile, as evidenced by stress-strain curves and morphology of the ruptured surface. The strong influence of Bi on the rupture site may have been caused by the stiffening effect of solder due to the homogenized presence of Bi in the joint. With the stiffened solder, the brittle IMC interface became the weakest link upon shearing, although the brittle BiSn crystalline structure also contributed to the rupture. (3) In the drop test, all Bi-containing solder joints performed poorly compared with Bi-free systems, which was consistent with shear test results. Drop numbers increased with increasing elongation at break of solder bumps as measured in the shear test. (4) Voiding was affected by flux chemistry and reduced by low alloy homogenization temperatures and solid top factors, but was increased by low surface tension factor, melting sequence factor, overheating factor and wide pasty range factor. Compared to SAC or SnPb systems, the BiSnAg system is low in voiding if reflowed at LT. In this study, voiding had an insignificant effect on shear strength and drop test performance.
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George, Elviz, Michael Osterman, Michael Pecht, and Richard Coyle. "Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000127–35. http://dx.doi.org/10.4071/isom-2012-ta44.
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The understanding of the effects of temperature cycling parameters, such as dwell and ramp times, mean cyclic temperature, and temperature range, on the fatigue life of solder interconnects is critical for qualification and reliability testing. After the solder achieves complete stress relaxation, a further increase in dwell time does not decrease the fatigue life of solder interconnects. Studies have shown that an increase in dwell time beyond a certain limit (10–20 minutes) has no effect on the fatigue life of eutectic tin-lead solder when cycled at peak cycle temperatures at or above 100°C. The duration of stress relaxation is longer in SnAgCu and SnCu solders than in eutectic tin-lead solder, resulting in higher creep damage accumulation and thereby reducing the fatigue life of solder interconnects. Experimental data for modeling of the effects of extended dwell time (beyond 60 minutes) on the temperature cycling reliability of tin-silver-copper solders is limited. In this study, forty 2512 ceramic chip resistors soldered onto an FR4 board using SAC105, SAC305, SN100C, and eutectic SnPb solders were subjected to temperature cycling tests with dwell time durations of 10 and 120 minutes, respectively. Resistors soldered on standard and narrow pads were compared to study the effects of pad size on thermal fatigue reliability. In eutectic SnPb-soldered narrow pad resistors, the increase in dwell time to 120 minutes did not change the cycles to failure. However, SnPb-soldered standard pad resistors showed a decrease in fatigue life with the increase in dwell time. For SAC105- and SAC305-soldered narrow and standard pad resistors, the 120-min dwell decreased the thermal fatigue life, compared to the 10-min dwell. The thermal fatigue life of SN100C-soldered narrow pad resistors increased when the dwell time was increased to 120 minutes, while that of the standard pad decreased. In the case of narrow pad resistors, extended dwell may be have annealed the SN100C solder, making it more robust to solder fatigue.
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Lall, Pradeep, Di Zhang, Vikas Yadav, and David Locker. "High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature." Microelectronics Reliability 62 (July 2016): 4–17. http://dx.doi.org/10.1016/j.microrel.2016.03.014.
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Benson, Mollie, Burton Carpenter, and Andrew Mawer. "Solder-Joint Reliability of a Radar Processor for Semi-Autonomous Driving Applications." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000104–9. http://dx.doi.org/10.4071/2380-4505-2018.1.000104.
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Abstract Radar is currently employed in automotive applications to provide the range, angle, and velocity of objects using RF waves (77GHz). This paper outlines solder joint reliability of a specific micro-processor that processes data received from a SRR (short range radar operating from 0.2 to 30 meters). It is a powerful digital signal processing accelerator, which targets safety applications that require a high Automotive Safety Integrity Level (ASIL-B). The paper explores the package design and construction, SMT (surface mount technology) assembly, and board level reliability testing of various BGA pad surface finish and solder ball alloy materials on a 0.65 mm pitch, 10 × 10 mm body 141 MAPBGA (mold array process-ball grid array) package. The package configurations include two BGA pad surface finishes (Ni/Au and OSP [organic solderability protectant]) and three solder alloys (SnAg, SAC405, and SAC-Bi [a Bi containing SAC derivative]). Solder joint reliability analysis was performed through AATS (air-to-air thermal shock) between 40°C and +125°C and JEDEC Drop Testing at 1500G's. Thermal shock was extended until at least 75% of the populations failed, which was well past the points needed to qualify the packages for the intended end-use applications. The evaluations of the micro-processor indicate that the MAPBGA package can meet the ASIL-B specification requirements with optimized combinations of BGA pad surface finish and solder alloy. The focus of this paper was to determine the baseline solder-joint thermal shock and JEDEC drop performance with varied BGA pad surface finish and solder ball alloy materials.
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Jayesh, S., and Jacob Elias. "Experimental and finite element analysis on determining the fatigue life of pb-free solder joint (Sn-0.5Cu-3Bi-1Ag) used in electronic packages under harmonic loads." International Journal of Modeling, Simulation, and Scientific Computing 11, no. 03 (May 28, 2020): 2050020. http://dx.doi.org/10.1142/s1793962320500208.
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Electronic packages that are used these days are exposed to different types of vibration loadings in their usage environment. This vibration exposure can be categorized as harmonic and random vibrations. When reliability assessment of modern electronic systems is considered, vibration loading has an important role to play. One of the biggest challenges facing today is the accurate and rapid assessment of fatigue life under the vibration loading. Conventional solder joints were made of lead-tin alloy. According to many environment legislations and rules, lead is prohibited as an ingredient in the solder alloy. The reason for the prohibition of the usage of the lead is that it poisons the environment. In this study, Sn-0.5Cu-3Bi-1Ag is used as the lead-free solder alloy. Fatigue life prediction of electronic package containing SAC405 is conducted with the aid of vibration testing and Finite element analysis under harmonic vibration loading. A specially designed Plastic Ball Grid Array Package (PBGA) component is mounted on Printed Circuit Board (PCB). It is taken as a test vehicle for the vibration test. The test vehicle is excited by a sinusoidal vibration. The frequency of this excitation equals the fundamental frequency of the test vehicle and it is continued till the component fails. Since the solder balls are very small for direct measurement, Finite Element analysis (FEA) is used for noting down the stresses. The stress versus failures cycles (S-N) curve is made by relating both the stresses on the solder balls obtained and the number of failure cycles from vibration analysis. The fatigue life of the component can be estimated from the generated S-N curve. It is analyzed that the methodology is effective in predicting the component’s life. Hence, the reliability of electronic package can be improved.
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Erer, Ahmet Mustafa. "WETTING BEHAVIORS AND INTERFACIAL PROPERTIES OF SAC300, SAC305 AND SAC0307 TERNARY Pb-FREE SOLDER ALLOYS." e-Journal of New World Sciences Academy 12, no. 4 (October 28, 2017): 163–69. http://dx.doi.org/10.12739/nwsa.2017.12.4.2a0123.
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George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. "Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000120–27. http://dx.doi.org/10.4071/isom-2013-ta45.
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Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a continued search for alternative solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-Ag-Cu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. Moreover, conflicting results have been reported in literature on the effects of aging on Sn-Ag-Cu alloys. In 2008, International Electronics Manufacturing Initiative (iNEMI) started the “Characterization of Pb-Free Alloy Alternatives” project to provide a comprehensive study of fifteen tin-based solder interconnect compositions benchmarked against the eutectic tin-lead solder. For this study, temperature cycle durability was the primary focus and solders were selected to study the effect of varying silver content, microalloy additions, and aging. This paper reports the preliminary findings from one of the test conditions conducted under the iNEMI project. The cycles to failure for a temperature cycling test condition from −15°C to 125°C, with dwell times of 60 minutes at both extremes are presented. The test assembly consisted of sixteen 192 I/O BGAs and sixteen 84 I/O BGAs soldered on to LG451HR laminate. Preliminary findings revealed that the reduction of silver resulted in a reduction in cycles to failure. In all cases, the fifteen tin-based solders were more durable than the eutectic SnPb solder. Aging did not affect the cycles to failure in SAC105 solder; however, the cycles to failure decreased with aging in SAC305 solder. In addition, aging resulted in a wider distribution of cycles to failure in 192 I/O BGAs.
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George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. "Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders." Journal of Microelectronics and Electronic Packaging 11, no. 4 (October 1, 2014): 137–45. http://dx.doi.org/10.4071/imaps.424.
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Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a search for alternative lead-free solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-Ag-Cu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. In 2008, the International Electronics Manufacturing Initiative (iNEMI) started the “Characterization of Pb-Free Alloy Alternatives” project to provide a comprehensive study of 15 tin-based solder interconnect compositions benchmarked against the eutectic tin-lead solder. For this study, temperature cycle durability was the primary focus and solders were selected to study the effect of varying silver content, microalloy additions, and aging. This paper reports the findings from one of the test conditions conducted under the iNEMI project. The cycles to failure for a temperature cycling test condition from −15°C to 125°C, with dwell times of 60 min at both extremes, are presented. The test assembly consisted of 16 of the 192 I/O BGAs and 16 of the 84 I/O BGAs soldered onto an LG451HR laminate. Test results revealed that the reduction of silver resulted in a reduction in cycles to failure. In all cases, the 15 tin-based solders were more durable than the eutectic SnPb solder. Aging at 125°C for 10 d did not affect the cycles to failure in SAC105 solder; however, the cycles to failure decreased with aging in SAC305 solder. In addition, aging resulted in a wider distribution of cycles to failure in 192 I/O BGAs. Failure analysis was carried out on all solder materials to identify the failure site and failure mode.
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Carpenter, Burton, Andrew Mawer, Mollie Benson, John Arthur, and Betty Young. "Solder-Joint Reliability of BGA Packages in Automotive Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (January 1, 2019): 000236–57. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_ta3_040.
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The solder-joint interconnect between an IC component and the PCB (printed circuit board) is a critical link in the system overall reliability. Trends in the automotive market are driving increased focus on solder-joint performance: (1) increasing electronics content for new functions, especially for ADAS (advanced driver-assistance systems), (2) use in safety critical systems and sub-systems, (3) decreasing interconnect pitches which reduces the stand-off and available solder, (4) increasing industry reliability expectations, and (5) package variations (ex. multi-die). In particular, BGA (Ball Grid Array) packages are used throughout the vehicle across various systems including engine control, braking, communication, infotainment, and radar to name only a few. Among these, under-the-hood applications often require high sustained operating temperatures and many heating/cooling cycles during the vehicle lifetime. The reliability of these interconnects is routinely assessed by cyclical thermal stress (temperate cycling) of components mounted to boards. While AEC (Automotive Electronics Council) offers no standards for solder-joint testing (for example, board level reliability criteria is not included in the AEC Q100 “Failure Mechanism Based Stress Test Qualification for Integrated Circuits”), IPC 9701A “Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments” can be followed. For automotive under-the-hood the specified cycle range is 40°C to 125°C (TC3). This paper summarizes the BL-TC (board level temperature cycle) performance of various BGA packages used in automotive applications. In all cases the test vehicle packages were daisy-chain versions of production devices, while maintaining critical features such as BGA footprint, physical dimensions, BOM (bill of materials), die size and thickness and substrate layer metal densities. All used Pb-free solders for both the BGA solder ball and the paste printed onto the PCB. The PCB designs were complementary to the packages establishing daisy-chain connections winding through the PCB, the solder-joint and package substrate. Each chain (net) was continuously monitored in situ during cycling. An event detector logged a failure when a net resistance exceeded 300 ohms. Wirebonded and flip chip packages were studied, ranging in size from 10mm to 29mm with BGA pitches including 0.65mm, 0.80mm and 1.00mm. In addition to these primary attributes, various other factors were found to alter the solder-joint lifetimes. For example, increasing BGA pad and solder sphere diameters improved solder-joint lifetime, but increasing the PCB pad diameter often did not. Among solder materials, eutectic SnAg typically showed longer lifetimes than other high Ag SAC alloys such as SAC305 and SAC405. The addition of Bi to the SAC alloy showed promise for further improvements. Other factors that were studied include die thickness, die size, and BGA pad finish. Both mechanical cross-section and dye penetrant analysis (dye-and-pry) were employed for failure analysis, enabling study of crack propagation and crack location within the solder-joint. Additionally, failure location (failing solder-joint) was identified for each as package corner, under the die edge, or package center in a predictable pattern depending on the package type. Examined in total, two opposing trends will force future innovation. Industry reliability requirements continue to drive expectations (i.e. cycles to failure) higher, while increasing package size and decreasing pitch will naturally reduce the solder-joint lifetimes. Solutions will be found in package design, package material and solder selections.
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Shin, Yong Moo, Tae Jong Choi, Kyung Jin Cho, Seok Pil Jang, and Jong-Hyun Lee. "Wettability of SAC305-coated Cu Fabricated by Low Temperature Process Using Ultrafine SAC305 Nanoparticles." Journal of the Microelectronics and Packaging Society 22, no. 3 (September 30, 2015): 25–30. http://dx.doi.org/10.6117/kmeps.2015.22.3.025.
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Zhao, Cong, Thomas Sanders, Zhou Hai, Chaobo Shen, and John L. Evans. "Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000117–22. http://dx.doi.org/10.4071/isom-2016-tp54.
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Abstract This paper investigates the effect of long term isothermal aging and thermal cycling on the reliability of lead-free solder mixes with different solder compositions, PCB surface finishes, and isothermal aging conditions. A variety of surface mount components are considered, including ball grid arrays (BGAs), quad flat no-lead packages (QFNs) and 2512 Surface Mount Resistors (SMRs). 12 lead-free solder pastes are tested; for BGA packages these are reflowed with lead-free solder spheres of SAC105, SAC305 and matched doped solder spheres (“matched” solder paste and sphere composition). Three surface finishes are tested: Organic Solderability Preservative (OSP), Immersion Silver (ImAg), and Electroless Nickel Immersion Gold (ENIG). All test components are subjected to isothermal aging at 125°C for 0 or 12 months, followed by accelerated thermal cycle testing from −40°C to 125°C. Data from the first 1500 cycles is presented here, with a focus on the effect of surface finish on package reliability. Current results demonstrate that the choice of surface finish has a strong effect on reliability. However, different solder materials appear to show different reliability trends with respect to the surface finishes, and the reliability trends of BGA and SMR packages also diverge.
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Li, Shengli, Yang Liu, Hongming Cai, Hao Zhang, and Fenglian Sun. "Interfacial reaction, microstructure and hardness between graphene-coated Cu substrate and SAC305 solder doped with minor Ni during isothermal aging." Modern Physics Letters B 33, no. 06 (February 28, 2019): 1950060. http://dx.doi.org/10.1142/s021798491950060x.
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This study investigated the influences of Cu, high temperature-treated Cu (H-Cu) and graphene-coated Cu (G-Cu) substrates on interfacial reaction, microstructure and hardness of Sn-3.0g-0.5Cu (SAC305) solder alloy. Intermetallic compound (IMC) layer evolution and mechanical property of Sn-3.0g-0.5Cu-0.3Ni (SAC305-0.3Ni) solder joints were also studied under different aging duration. A continuous scallop-like IMC layer was observed at SAC305/Cu, SAC305/H-Cu, SAC305/G-Cu interfaces during reflow and isothermal aging. After adding Ni in the SAC305-0.3Ni solder alloy, the roughness of IMC layer on Cu, H-Cu substrates increased. In contrast, the addition of Ni had a limited impact on the roughness of IMC layer on G-Cu substrates. The total thickness of IMC layer grew as aging time increases, proportionated to the square root of aging duration. The addition of Ni in the solder alloy promoted the growth of IMC layer on Cu and H-Cu substrates, but it was restrained on G-Cu substrate. The amount of the IMC phases in SAC305 and SAC305-0.3Ni solder bulks on the three substrates increased significantly as aging time prolonged. Thus, the hardness of SAC305 and SAC305-0.3Ni solder bulks on the three substrates rose. The addition of Ni in the solder bulks on the three substrates sharply enhanced the formation of [Formula: see text]-Sn phases and increased the quantity of the IMCs. Consequently, the hardness of SAC305-0.3Ni solder bulks was higher than that of SAC305 solder bulk on the three substrates under same aging condition. In addition, the graphene-coated layer on G-Cu substrate could improve the hardness of SAC305 and SAC305-0.3Ni solder bulks.
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Hirai, Yukihiko, Kouki Oomori, Hayato Morofushi, and Ikuo Shohji. "Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Solder." Materials Science Forum 1016 (January 2021): 553–60. http://dx.doi.org/10.4028/www.scientific.net/msf.1016.553.
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Microstructures and tensile properties at 233 K, 300 K and 398 K of Sn-3.0 mass%Ag-0.5 mass%Cu (SAC305) and Sn-Ag-Cu-In-Sb solder were investigated by using miniature size specimens with 0.5 mm diameter, which can reproduce the microstructure of the real solder joint. In this study, three kinds of Sn-Ag-Cu-In-Sb solder (SAC305-6.0 mass%In-1.0, 2.0 and 3.0 mass%Sb) were used. The microstructure of SAC305 consisted of a single crystal grain. On the other hand, the microstructures of Sn-Ag-Cu-In-Sb solder consisted of polycrystalline. The number of crystal grains per the cross section of SAC305-6.0In-1.0Sb was stably several tens or more. The tensile strength of Sn-Ag-Cu-In-Sb was improved approximately 2 times that of SAC305. Also, the variation in tensile strength of SAC305 at 233 K was large due to anisotropy of the crystal grain. In contrast, the variation in tensile strength of Sn-Ag-Cu-In-Sb at 233 K was lower than that of SAC305. In particular, that of SAC305-6.0In-1.0Sb was reduced to approximately a sixth of that of SAC305. It seems that the effect of anisotropy of the crystal grain is decreased by polycrystallization in SAC305-6.0In-1.0Sb.
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Cheng, Fang Jie, Hiroshi Nishikawa, and Tadashi Takemoto. "Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder." Materials Science Forum 580-582 (June 2008): 239–42. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.239.
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Effects of isothermal aging on the microstructure and tensile behavior of Sn-3.0Ag-0.5Cu-0.2Co (SAC305-0.2Co) solder was explored, and compared with the standard Sn-3.0Ag-0.5Cu (SAC305) solder. The addition of Co resulted in the formation of CoSn2 phase in SAC305-0.2Co solder matrix. The isothermal aging treatment induced microstructural coarsening for both solders. With aging, the eutectic network has been translated into block or granular shape particles. Meanwhile, the outline of the primary Sn phase became less distinct. The tensile test results indicated, under as cast condition, the Co had little effect on the ultimate tensile strength (UTS) of SAC305-0.2Co solder, whereas it suppressed the ductility. After aging, the UTS of SAC305 was obviously decreased, whereas the elongation hardly changed. For the SAC305-0.2Co, the tensile behavior showed two trends: one was the decrease of the UTS, which was similar to that of SAC305; the other was the notable increase of elongation. The examination of the fracture surfaces indicated that isothermal aging could alter the fracture pattern of SAC305-0.2Co solder from brittle to ductile.
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Ismail, Norliza, Azman Jalar, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, and Ariffin Ismail. "Effect of Shock Wave on Constant Load Behaviour of Pb-Free/Cnt Solder Joint." Sains Malaysiana 49, no. 12 (December 31, 2020): 2991–98. http://dx.doi.org/10.17576/jsm-2020-4912-11.
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The constant load behaviour of SAC305 solder joint with addition of carbon nanotube (CNT), exposed to shock wave condition was investigated. Formulated SAC305-CNT solder pastes with 0.04 wt. % CNT were manually printed to the printed circuit board (PCB) with copper surface finish to form solder joint. The solder joint was exposed to the shock wave condition via open field blast air test using Trinitrotoluene (TNT) explosive. Nanoindentation approach was used to determine the constant load behavior of the SAC305-CNT solder joint under shock wave condition. The results showed that addition of CNT reduced the indentation depth of SAC305 solder joint at 10 mN peak load for blast test sample and control sample. Indentation depth displacement of SAC305-CNT solder joint for blast test sample and control sample were reduced about ~ 42 and ~56%, respectively, if compared to the SAC305 solder joint for blast test sample and control sample. SAC305-CNT solder joint was experienced minimal changes of stress exponent when exposed to the shock wave. The existence of CNT in the solder joint slows down the depth displacement due to constant load.
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Ismail, Norliza, Maria Abu Bakar, and Saiful Bahari Bakarudin. "Effect of Temperature on Strain-Induced Hardness of Lead-Free Solder Wire using Nanoindentation Approach." Sains Malaysiana 49, no. 12 (December 31, 2020): 3019–26. http://dx.doi.org/10.17576/jsm-2020-4912-14.
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Hardness properties of SAC305 solder wire under tensile test at varied temperature was investigated. Continuous multi-cycle (CMC) nanoindentation technique with ten cycle of indentation for each sample was performed to evaluate the hardness behaviour of SAC305 solder wire at different depth of indentation. As a result, all investigated SAC305 solder wire under constant strain rate of tensile test and at different temperature revealed the occurrence of indentation size effect (ISE). At initial cycle of indentation, SAC305 solder wire at room temperature (25 °C) have higher hardness value compared to the others sample which exposed to the varied temperature during tensile test. Besides, higher temperature causes the higher strain or elongation to the SAC305 solder wire. Applied of strain during the tensile test had generated the pre-dislocation activity in the SAC305 solder wire. Therefore, higher hardness values of SAC305 at room temperature is due to the existence of high dislocation density induced by the applied strain. Nevertheless, the existence of heat at 60, 90, 120 and 180 °C during the tensile test prompt the rearrangement of dislocation and reduce the dislocation activities, thus, allowing higher elongation of solder wire.
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Mei Lee, Liu, Muhammad Firdaus Mohd Nazeri, Habsah Haliman, and Ahmad Azmin Mohamad. "Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution." Soldering & Surface Mount Technology 26, no. 2 (April 1, 2014): 79–86. http://dx.doi.org/10.1108/ssmt-01-2013-0001.
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Purpose – The purpose of this paper is to examine the corrosion behaviors of SAC305 thin film solder alloy in 6 M KOH solution. Design/methodology/approach – The corrosion behavior of bare Cu, as-deposited SAC305/Cu and as-reflowed SAC305/Cu thin films at varying temperatures, was investigated by means of potentiodynamic polarization in a 6 M KOH solution. The microstructure, phase and thickness of the intermetallic compounds formed were determined before and after polarization. Findings – Bare Cu was found to possess the best corrosion resistance, whereas the as-deposited SAC305/Cu had the lowest corrosion resistance. As-reflowed SAC305/Cu with an exposed Cu3Sn layer exhibited better corrosion resistance than did Cu6Sn5. The Ag3Sn phase has the noblest characteristic because it was retained and did not dissolve in the KOH solution. All of the samples contained the corrosion products of oxide. Bare Cu obeys the well-known duplex structure of a Cu2O/CuO, Cu(OH)2 layer. For as-reflowed SAC305/Cu, the corroded surface was also mainly composed of SnO and SnO2. Originality/value – New analysis on the polarization of thin film characteristics of SAC305 lead-free solder in alkaline solution.
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Abu Bakar, Maria, Azman Jalar, Roslina Ismail, and Abdul Razak Daud. "Directional Growth Behaviour of Intermetallic Compound of Sn3.0Ag0.5Cu/ImSn Subjected to Thermal Cycling." Materials Science Forum 857 (May 2016): 36–39. http://dx.doi.org/10.4028/www.scientific.net/msf.857.36.
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Directional growth behavior of intermetallic compound (IMC) layer of Sn3.0Ag0.5Cu (SAC305) on immersion tin (ImSn) surface finished Cu substrate was investigated. The samples of SAC305 on ImSn/Cu substrate were subjected to thermal cycling at temperatures between 0 °C and 100 °C for 0 cycle up to 500 cycles. The cross-sectioned microstructures of soldered samples, SAC305 on ImSn/Cu were observed using optical microscope. The shape and orientation of IMC growth on the SAC305 on ImSn/Cu indicates that the orientation of IMC growth were observed to be non-uniform and dispersed throughout the solder joint with longer thermal cycling test.
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Zaimi, Nur Syahirah Mohamad, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Mohd Mustafa Al Bakri Abdullah, Norainiza Saud, Shayfull Zamree Abd Rahim, Petrica Vizureanu, Rita Mohd Said, and Mohd Izrul Izwan Ramli. "Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing." Materials 14, no. 4 (February 7, 2021): 776. http://dx.doi.org/10.3390/ma14040776.
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This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
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Chen, Jung-Hsuan, Shen-Chuan Lo, Shu-Chi Hsu, and Chun-Yao Hsu. "Fabrication and Characteristics of SnAgCu Alloy Nanowires for Electrical Connection Application." Micromachines 9, no. 12 (December 5, 2018): 644. http://dx.doi.org/10.3390/mi9120644.
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As electronic products become more functional, the devices are required to provide better performances and meet ever smaller form factor requirements. To achieve a higher I/O density within the smallest form factor package, applying nanotechniques to electronic packaging can be regarded as a possible approach in microelectronic technology. Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) is a common solder material of electrical connections in microelectronic devices. In this study, SAC305 alloy nanowire was fabricated in a porous alumina membrane with a pore diameter of 50 nm by the pressure casting method. The crystal structure and composition analyses of SAC305 nanowires show that the main structure of the nanowire is β-Sn, and the intermetallic compound, Ag3Sn, locates randomly but always appears on the top of the nanowire. Furthermore, differential scanning calorimetry (DSC) results indicate the melting point of SAC305 alloy nanowire is around 227.7 °C. The melting point of SAC305 alloy nanowire is significantly higher than that of SAC305 bulk alloy (219.4 °C). It is supposed that the non-uniform phase distribution and composite difference between the nanowires causes the change of melting temperature.
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Lis, Adrian, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, and Akio Hirose. "Novel solder-mesh interconnection design for power module applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000057–62. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000057.
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Abstract This study introduces a novel concept that uses composite structures of thin metallic meshes and Sn3.0Ag0.5Cu (SAC305) solder alloys to interconnect semiconductor chips to DBC substrates. The feasibility was proven by bonding Cu-to-Cu substrates. The averaged shear strength was measured as 44.1, 44.7 and 51.4 MPa for samples bonded with SAC305 (reference), Ni mesh/SAC305 and Cu mesh/SAC305 composites, respectively. The solder-mesh joints revealed a specific fracture behavior where crack propagation occurred partly within the solder and partly at the solder-mesh interface. Microstructural analyses confirmed that the metallic meshes were bonded by the formation of intermetallic compounds (IMC) while almost no (larger) defects were found. The solder-mesh concept was subsequently applied on Si-to-DBC assemblies. A very good resistance of Cu mesh/SAC305 composite joints against cyclic temperature between 80 and 200 °C was observed when the bonded area only reduced by 4.2 % after 8000 cycles. Thermal finite element (FE) simulations indicated that in particular Cu mesh/SAC305 composites can significantly reduce the thermal resistance of the interconnections which is equivalent to a better heat dissipation through the bonding layer. Thus, solder-mesh composite joints seem to be an attractive solution for high-temperature applications up to 200 °C.
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Han, Jing, Penghao Gu, Limin Ma, Fu Guo, and Jianping Liu. "Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock." Journal of Electronic Materials 47, no. 4 (December 29, 2017): 2479–87. http://dx.doi.org/10.1007/s11664-017-6032-5.
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Mohd Amin, Nur Aishah Aminah, Dhafer Abdul Ameer Shnawah, Mohd Faizul Mohd Sabri, and Suhana Binti Mohd Said. "Electrical Resistivity of Fe-Bearing Sn1Ag0.5Cu Lead-Free Solder Alloys." Advanced Materials Research 895 (February 2014): 575–79. http://dx.doi.org/10.4028/www.scientific.net/amr.895.575.
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This paper reports on the effect of Fe addition in the range of 0.1 wt.% to 0.5 wt.% on the electrical resistivity of the Sn-1Ag-0.5Cu (SAC105) solder alloy. The electrical resistivity is characterized by the four-point probe technique. Results showed that the Fe-bearing SAC105 solder alloys exhibit lower electrical resistivity compared with the standard SAC105 solder alloy. Moreover, the electrical resistivity further decreases with increasing the amount of Fe addition. As Fe is a low-cost and non-hazardous element, along with the high mechanical reliability, the Fe-bearing SAC105 solder alloys also demonstrate good electrical characteristics, and hence may be an attractive candidate for a low cost, reliable formulation for lead free solders in electronics packaging.
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Denmud, Nipon, and Thawatchai Plookphol. "Characteristics of SAC305 Lead-Free Powder Prepared by Centrifugal Atomization." Key Engineering Materials 777 (August 2018): 322–26. http://dx.doi.org/10.4028/www.scientific.net/kem.777.322.
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Centrifugal atomization apparatus was constructed to produce solder alloy powder with high quality. In this work, SAC305 alloy was atomized to study the effects of processing parameters, including atomizer disk surface condition and oxygen content in the atomizer chamber on the mean particle size, size distribution, production yield, and morphology of the produced SAC305 powder. The results showed that the atomizer disk surface coated with tin alloy gave the produced powder with smaller mean size, narrower size distribution and higher production yield, in comparison with the uncoated disk. This is due to a good wettability between the molten SAC305 and atomizer disk surface and the sufficient time for alloy droplets to be solidified. The shapes of SAC305 powder were sphere, teardrop, oval, and ligament, depending on the oxygen content in the atomizer chamber during atomization. The shape of produced powder was almost perfectly spherical when the oxygen content was decreased down to 0.5 vol.%. Moreover, with decreasing the oxygen content in the atomizer chamber, the produced SAC305 powder would contain oxygen content on its surface lower than 100 ppm.
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Chantaramanee, Suchart, Sirikul Wisutmethangoon, Lek Sikong, and Thawatchai Plookphol. "Wettability of Carbon Nanotubes with Molten Sn-Ag-Cu Solder Alloy." Applied Mechanics and Materials 372 (August 2013): 136–42. http://dx.doi.org/10.4028/www.scientific.net/amm.372.136.
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The purpose of this work was to study the wettability of single-walled carbon nanotube (SWCNTs) and molten 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloy. The SWCNTs was coated with silver (Ag) by using an electroless plating method in order to enhance its wettability. The wetting behavior of molten SAC305 alloy on three different substrates, alumina, un-coated SWCNTs and Ag-coated SWCNTs was investigated by employing a modified sessile drop technique. The wetting angle between the molten SAC305 and the three substrates was measured at temperature range of 250-550 °C. The average wetting angles between the molten SAC305 and the alumina, the un-coated SWCNTs and the Ag-coated SWCNTs substrates were 130.7±1.3°, 128.4±4.2° and 120.1±3.5°, respectively. The wettabilty of the SWCNTs was improved by coating it with silver. The wetting angle of the Ag-coated SWCNTs was decreased approx. 9° compared to that of the un-coated. Increasing temperature has slightly affected on the wettability of SWCNTs and the molten SAC305.
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Aamir, Muhammad, Izhar Izhar, Muhammad Waqas, Muhammad Iqbal, Muhammad Imran Hanif, and Riaz Muhammad. "Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy." Soldering & Surface Mount Technology 29, no. 4 (September 4, 2017): 191–98. http://dx.doi.org/10.1108/ssmt-02-2017-0005.
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Purpose This paper aims to develop a fuzzy logic-based algorithm to predict the intermetallic compound (IMC) size and mechanical properties of soldering material, Sn96.5-Ag3.0-Cu0.5 (SAC305) alloy, at different levels of temperature. The reliability of solder joint in materials selection is critical in terms of temperature, mechanical properties and environmental aspects. Owing to a wide range of soldering materials available, the selection space finds a fuzzy characteristic. Design/methodology/approach The developed algorithm takes thermal aging temperature for SAC305 alloy as input and converts it into fuzzy domain. These fuzzified values are then subjected to a fuzzy rule base, where a set of rules determines the IMC size and mechanical properties, such as yield strength (YS) and ultimate tensile strength (UTS) of SAC305 alloy. The algorithm is successfully simulated for various input thermal aging temperatures. To analyze and validate the developed algorithm, an SAC305 lead (Pb)-free solder alloy is developed and thermally aged at 40, 60 and 100°C temperature. Findings The experimental results indicate an average IMCs size of 5.967 (in Pixels), 19.850 N/mm2 YS and 22.740 N/mm2 UTS for SAC305 alloy when thermally aged at an elevated temperature of 140°C. In comparison, the simulation results predicted 5.895 (in Pixels) average IMCs size, 19.875 N/mm2 YS and 22.480 N/mm2 UTS for SAC305 alloy at 140°C thermally aged temperature. Originality/value From the experimental and simulated results, it is evident that the fuzzy-based developed algorithm can be used effectively to predict the IMCs size and mechanical properties of SAC305 at various aging temperatures, for the first time.
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Aamir, Muhammad, Majid Tolouei-Rad, Israr Ud Din, Khaled Giasin, and Ana Vafadar. "Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature." Soldering & Surface Mount Technology 31, no. 4 (September 2, 2019): 250–60. http://dx.doi.org/10.1108/ssmt-01-2019-0001.
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Purpose Tin-Silver-Copper is widely accepted as the best alternative to replace Tin-Lead solders in microelectronics packaging due to their acceptable properties. However, to overcome some of the shortcomings related to its microstructure and in turn, its mechanical properties at high temperature, the addition of different elements into Tin-Silver-Copper is important for investigations. The purpose of this paper is to analyse the effect of lanthanum doping on the microstructure, microhardness and tensile properties of Tin-Silver-Copper as a function of thermal aging time for 60, 120 and 180 h at a high temperature of 150°C and at high strain rates of 25, 35 and 45/s. Design/methodology/approach The microstructure of un-doped and Lanthanum-doped Tin-Silver-Copper after different thermal aging time is examined using scanning electron microscopy followed by digital image analyses using ImageJ. Brinell hardness is used to find out the microhardness properties. The tensile tests are performed using the universal testing machine. All the investigations are done after the above selected thermal aging time at high temperature. The tensile tests of the thermally aged specimens are further investigated at high strain rates of 25, 35 and 45/s. Findings According to the microstructural examination, Tin-Silver-Copper with 0.4 Wt.% Lanthanum is found to be more sensitive at high temperature as the aging time increases which resulted in coarse microstructure due to the non-uniform distribution of intermetallic compounds. Similarly, lower values of microhardness, yield strength and ultimate tensile strength come in favours of 0.4 Wt.% Lanthanum added Tin-Silver-Copper. Furthermore, when the thermally aged tensile specimen is tested at high strains, two trends in tensile curves of both the solder alloys are noted. The trends showed that yield strength and ultimate tensile strength increase as the strain rate increase and decrease when there is an increase in thermal aging. Originality/value The addition of higher supplement (0.4 Wt.%) of Lanthanum into Tin-Silver-Copper showed a lower hardness value, yield strength, ultimate tensile strength, ductility, toughness and fatigue in comparison to un-doped Tin-Silver-Copper at high temperature and at high strain rates. Finally, simplified material property models with minimum error are developed which will help when the actual test data are not available.
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Wang, Ruo Da, Shao Ming Zhang, Qiang Hu, and Fu Wen Zhang. "Effect of Boron on Microstructure and Properties of Sn-1.0Ag-0.5Cu Low-Silver Lead-Free Solder." Materials Science Forum 898 (June 2017): 908–16. http://dx.doi.org/10.4028/www.scientific.net/msf.898.908.
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In this work, B (boron) was added into Sn-1.0Ag-0.5Cu (SAC105) solder alloy using mechanical alloying method in order to develop a new low-silver lead-free solder, Sn-1.0Ag-0.5Cu-xB, where B ranges from 0wt% to 0.2wt%. The melting characteristics, wettability, mechanical properties of welded joints, and microstructure of this solder were studied. The results showed that with adding B into SAC105 alloy, the melting point and melting range was not obviously changed. Although the wettability decreases with the B content increasing, the solder joints exhibited higher shear strength. As a result, the shear strength was the highest at the B content of 0.2wt%. For example, the shear strength of the Sn-1.0Ag-0.5Cu-0.2B solder was 35.12MPa, while that of the B free SAC105 solder was only 28.94MPa. Furthermore, adding B had a significant effect on grain refinement on the SAC105 solder . Observations on solder matrix and weld joints by SEM showed that the IMC thickness of solder joints with the addition of B was less than the SAC105 lead-free solder. Moreover, with the addition of B, the solder grains were refined obviously which had the effect of refining straitening, and the growing rate of brittle IMC in solder joint could be effectively reduced during soldering and aging process. Thus solder joint performance can be improved significantly.