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Tipton, Lee James. "Scribing place : textured transformation across the prison(er) canvas." Thesis, Lancaster University, 2011. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.618808.
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'Scribing place' Is a qualitative study set In one prison for eighteen months, and one probation hostel for one month that responds to three core questions about how and where. why and with what effect male prisoners write, mark, scratch and texture carceral and semi-carceral space. This research was born from an Interest in prisoners' writings as activities that mediate the soda-cultural interrelationships and spaces of a prison community commonly considered illiterate. However. this Is not the kind of writing that passes exams or gets published as novels or short stories, but the tags, messages, notes, letters and body marks that characterise and mediate the 'of course' aspect of our social landscapes. These are the writings that are often ignored, or at least dismissed as sociocultural footnotes, rather than material for 'main text' interpretation. This work draws from ethnographic methodologies such as participant observation and conversations, while developing a more novel form of focussed workshop, in order to engage in an Intersubjectlve dialogue with prisoners. Having developed a geo-sociolinguistic framework this research explores prisoners' writings through posing and responding to questions about the relationship between writing/texts, people and space. The findings were that the prison Is subject to a series of textured transformations that create two forms of change• firstly, the transformation of unsafe carceral space Into various pockets of safe place, and secondly, numerous changes . some successful, other not - to a prisoner's sense of self. The hostel was found to be a deeply liminal, anti-place where. In order to secure release, prisoners struggled to comply with the demands of 'residency', in particular constant threshold crossing between the seml-carceral (hostel) and the freedom of the outside world.
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Love, Bryan Matthew. "Mechanical and Laser Scribing For Use As Precision Shaping Techniques." NCSU, 2001. http://www.lib.ncsu.edu/theses/available/etd-20010511-103227.
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The purpose of this research has been to develop a model for mechanical and laser scribing processes used in the manufacture of hard disk drive heads. The scribing techniques are used to create small distortions on thin plates, allowing control over the shape of the plate. Analytical models for the scribing techniques allow more accurate control over the shape of the hard drive head, therefore increasing the performance of the drive. Using finite element techniques, prior models of mechanical scribing were extended to the three-dimensional case, allowing varying scribe length and placement. A force model for laser scribes was developed using similar finite element techniques and calibrated using experimental results. The laser scribing force model was parameterized, allowing the distortions by wide variety of scribes to be computed using simple equations. Consideration was given to modeling multiple scribes and complicated scribing geometries. Experimental results indicate that the model has a high degree of accuracy over a wide range of scribing geometries.
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Cannon, Bennion R. "Design and analysis of end-effector systems for scribing on silicon /." Diss., CLICK HERE for online access, 2003. http://contentdm.lib.byu.edu/ETD/image/etd259.pdf.
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Cannon, Bennion Rhead. "Design and Analysis of End-Effector Systems for Scribing on Silicon." BYU ScholarsArchive, 2003. https://scholarsarchive.byu.edu/etd/95.
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This thesis investigates end-effector systems used in a chemomechanical scribing process. Chemomechanical scribing is a method of patterning silicon to selectively deposit a monolayer of material on the surface of the silicon. This thesis details the development of a unique end-effector for chemomechanical scribing using a compliant mechanism solution. The end-effector is developed to scribe lines that have uniform geometry and produce less chipping on the surface of the silicon. The resulting scribing mechanism is passively controlled, has high lateral stiffness, and low axial stiffness. The mechanism is analyzed using the pseudo-rigid-body model and linear-elastic beam method to determine the axial stiffness, finite element methods to determine the lateral stiffness, and fatigue analysis to determine mechanism cycle life. This thesis also investigates the significance of mechanical factors on the chemomechanical scribing process using the compliant end-effector. The factors examined are scribing force, scribing speed, tip geometry, wafer orientation, and wetting liquid. The factors are analyzed using a two-step approach: first, an analysis of the influence of the mechanical factors on line characteristics and second, an analysis of the influence of line characteristics on line performance.
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Козловська, Ганна Борисівна, Анна Борисовна Козловская, and Hanna Borysivna Kozlovska. "Scribing as innovative means of teaching in the foreign language classroom." Thesis, Національний авіаційний університет, 2019. http://essuir.sumdu.edu.ua/handle/123456789/74989.
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Скрайбінг – це інноваційна технологія аудіовізуальної підтримки навчального процесу. Головним у змістовій інтерпретації поняття скрайбінг є візуалізація інформації, а його головним завданням – відтворення інформації у привабливій для слухача і глядача формі для кращого її запам’ятовування і засвоєння. Використання скрайбінгу надає роботі привабливості, творчого характеру, сприяє зацікавленню студентів у набутті нових предметних знань і технологічних умінь.Скрайбинг – новейшая техника презентации (от английского ‘scribe’ – набрасывать эскизы или рисунки), графический способ привлечь внимание аудитории и обеспечить ее дополнительной информацией. Скрайбинг превращает тезисы презентации в слова и образы, обрисовывает связи и подчеркивает ключевые моменты.
Scribing is a graphic means of attracting audience’s attention and providing students with additional information. Scribing turns the presentation or lecture into words and images, identifying connections and key moments. Teachers using innovative technologies in the foreign language classroom make students think creatively, make unusual decisions and promote student’s self-development.
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Jamshidi, Gohari Ebrahim. "Buried screen-printed contacts for silicon solar cells." Thesis, Högskolan Dalarna, Energi och miljöteknik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:du-13593.
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A Simple way to improve solar cell efficiency is to enhance the absorption of light and reduce the shading losses. One of the main objectives for the photovoltaic roadmap is the reduction of metalized area on the front side of solar cell by fin lines. Industrial solar cell production uses screen-printing of metal pastes with a limit in line width of 70-80 μm. This paper will show a combination of the technique of laser grooved buried contact (LGBC) and Screen-printing is able to improve in fine lines and higher aspect ratio. Laser grooving is a technique to bury the contact into the surface of silicon wafer. Metallization is normally done with electroless or electrolytic plating method, which a high cost. To decrease the relative cost, more complex manufacturing process was needed, therefore in this project the standard process of buried contact solar cells has been optimized in order to gain a laser grooved buried contact solar cell concept with less processing steps. The laser scribing process is set at the first step on raw mono-crystalline silicon wafer. And then the texturing etch; phosphorus diffusion and SiNx passivation process was needed once. While simultaneously optimizing the laser scribing process did to get better results on screen-printing process with fewer difficulties to fill the laser groove. This project has been done to make the whole production of buried contact solar cell with fewer steps and could present a cost effective opportunity to solar cell industries.In collaboration with Institute for Photovoltaics IPV, University of Stuttgart.
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Riley, Bradley Elkins. "Evaporative Etching for Non-Contact Glass Scribing using a Single-Mode Ytterbium Fiber Laser." NCSU, 2007. http://www.lib.ncsu.edu/theses/available/etd-04192007-093539/.
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Laser glass cutting is a process which involves using a laser to either scribe or completely cut glass in place of using a mechanical cutter. The concept of using a laser to cut glass has been established for quite some time however, it wasn?t sought after for industrial application until just recently. With the increase in demand for flat screen televisions, PDA?s, MP3 players and the like, so increased the demand for an efficient non-contact glass cutting method. The two most common types of laser glass cutting processes are short pulsed ablation and thermal shock. While each of these techniques has its own advantages, they have yet to be a complete solution to the demand. Short pulsed ablation tends to create a rough, jagged edge not unlike the defects created by the conventional mechanical glass cutting methods. Thermal shock has successfully separated glass, however, this process requires a trigger crack for glass separation, and as such, the process is unable to perform small precise cuts. A relatively new laser glass processing technique has been established, where, a pulsed laser is used to effectively ablate the surface of glass by focusing through the glass substrate and onto the surface of either silver or copper. As the laser collides with the surface of the metal it vaporizes a small portion of the material, the vapor and plasma particles are sent at high speed toward the lower surface of glass, where it creates a mark in the surface. While this process has successfully marked the surface of glass, attempts at through ablation resulted in damage to the glass surface due to a high absorption after the first few pulses. This paper presents the fundamental application of LIPAA through the use of a low power, continuous wave laser. During the process, a continuous wave laser vaporizes a portion of the aluminum, where, the vapor is then used to thermally etch a scribe in the surface of glass. This new form of scribe generation has the potential to separate glass with little to no defects, thereby, reducing wasted material and strengthening the glass edge.
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Ord, Jennifer. "De-scribing the Timaeus: a transgression of the (phal) logocentric convention that discourse has only one form, language." Thesis, Port Elizabeth Technikon, 2002. http://hdl.handle.net/10948/115.
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Like writing, art making is primarily a means of human expression, a means of communication – both “allow us to categorize our (inner and outer) environment as represented by symbols” (Appignanesi, 1999: 7). Yet it is language in the traditional Western garb of rational, philosophical discourse that has been perceived as the primary means of manifesting knowledge and positing truth, not only regarding the character of human existence, but also the nature of art. This infers the acceptance of both works as literally “truth of things”, and of “a language of reason” that “perfectly represents the real world” (Appignanesi, 1999: 77). Going against the grain of this traditional bias, Jacques Derrida holds that, firstly, “human knowledge is not as controllable or as cogent as Western thinkers would have it”: secondly, that language functions in “subtle and often contradictory ways” thus rendering certainty, truth, and perfect representation ever elusive to us (Lye, 1997: 2); and, thirdly, that “practices of interpretation which include art but are not limited to language, are extended discourses” (Appignanesi, 1999: 79). So, the “work of reason” (or rationalism) in this sense, is no longer the definitive “voice” of authority when it comes to ascribing meaning, proclaiming a message, defining truth, etc. Having the grip of its authority loosened and thus its rigid, imposing borders opened up, the communication of knowledge as a form of “aesthetic fiction” (Megill, 1987: 265) is allowed entry into the rarefied field of philosophical discourse. Moreover, if visual art (one such “aesthetic fiction”) is a process of sign-making, as is written and spoken language; if it therefore constitutes a signifying system, as does written and spoken language (Bal and Bryson in Preziosi, 1998: 242); and, if art is not just about autonomous, in-house formalism, then can it not, in any case, validly offer a form for discourse, albeit a different kind of discourse, a discourse that is not “truth seeking” (Sim, 1992: 33)? Here, the maker of the proposed artwork-asdiscourse would not be attempting to establish the truth or falsity of a philosophical position, but, as Derrida would have it, create a form which, without mimicry, would evocatively allude to Plato, his “deconstructor” and the maker of the proposed artwork. Discourse in this sense, then, would generate “active interpretation… infinite free association” (Megill, 1987: 283), because, as in Derrida’s writing, interpretation no longer aims at “the reconciliation or unification of warring truths (Sim, 1992: 10); in other words, it breaks with the (phal)logocentric tradition of discourse as dialectical and becomes questioning without closure. For visual art to enter the exalted arena of philosophical discourse, it cannot be selfreflexive in the Greenbergian or formalist sense – it has to be about something philosophical and this ‘something’ will be a deconstructive response to Plato’s doctrine of the two worlds in the Timaeus. What I propose presenting, then, is an imagographic rather than (phal)logocentric exposition of philosophical content where the aim is not to shape a certainty or to infer an absolute presence or essence of anything, but rather to suggest traces of the maker of the artwork reading Derrida, reading Plato. The proposed artwork as a response to texts will thus be a “pre-text” of my own endeavour.
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Gardner, Paul. "Scribing the writer : implications of the social construction of writer identity for pedagogy and paradigms of written composition." Thesis, University of Bedfordshire, 2014. http://hdl.handle.net/10547/345674.
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A reflexive analysis of five peer reviewed published papers reveals how socio-cultural and political discourses and individual agency compete to shape the identity of the learner-writer. It is posited that although hegemonic political discourses construct ‘schooling literacy’ (Meek 1988 ) which frame the socio-cultural contexts in which texts, authors, teachers and leaners develop; the socio-cultural standpoint of the individual makes possible conscious construction of counter discourses. Writer identity is integral to the compositional process. However, writer identity is mediated by, on the one hand, dominant discourses of literacy that inform current pedagogies of writing (Paper One) and on the other by socio-cultural narratives that shape identity (Paper Three). A synthesis of Gramsci’s notion of cultural hegemony and Bronfenbrenner’s ecological systems theory is used to explain the constraining function of dominant discourses in literacy education. These works largely fall within a qualitative paradigm, although a mixed-method approach was adopted for the data collection of Papers Four and Five. The methods these papers had in common were the use of survey and documentary analysis of reflective journals. A semi-structured interview with a focus group was the third method used to collect data for Paper Five. Individual semi-structured interviews were used to collect partial life-histories for Paper Two and textual analysis of pupils’ narrative writing was the main method used for Paper One. Paper Three involved a rhizotextual auto-ethnographic analysis of original poetry. Findings suggest pedagogies which minimise or negate the identity of the writer are counter-productive in facilitating writer efficacy. It is suggested, the teaching of writing should be premised on approaches that encourage the writer to draw upon personal, inherited and secondary narratives. In this conceptualisation of writing, the writer is simultaneously composing and exploring aspects of self. However, the self is not a fixed entity and writing is viewed as a process by which identity emerges through reflexive engagement with the compositional process. The corollary is that pedagogy of writing needs to embrace the identity of the writer, whilst also allowing space for the writer’s ‘becoming’.
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Asogan, Dhinesh. "A non-contact laser ablation cell for mass spectrometry." Thesis, Loughborough University, 2011. https://dspace.lboro.ac.uk/2134/11014.
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A common analytical problem in applying LA sampling concerns dealing with large planar samples, e.g. gel plates, Si wafers, tissue sections or geological samples. As the current state of the art stands, there are two solutions to this problem: either sub-sample the substrate or build a custom cell. Both have their inherent drawbacks. With sub-sampling, the main issue is to ensure that a representative is sample taken to correctly determine the analytes of interest. Constructing custom cells can be time consuming, even for research groups that are experienced or skilled, as they have to be validated before data can be published. There are various published designs and ideas that attempt to deal with the issue of large samples, all of which ultimately enclose the sample in a box. The work presented in this thesis shows a viable alternative to enclosed sampling chambers. The non-contact cell is an open cell that uses novel gas dynamics to remove the necessity for an enclosed box and, therefore, enables samples of any arbitrary size to be sampled. The upper size limit of a sample is set by the travel of the XY stages on the laser ablation system, not the dimensions of the ablation cell.
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Bahl, Shashi [Verfasser], Roland [Akademischer Betreuer] Scheer, Jörg [Akademischer Betreuer] Bagdahn, and Hans Joachim [Akademischer Betreuer] Möller. "Numerical simulation and experimental investigations for mechanical scribing of Cu(In;Ga)Se2 thin-film solar cells / Shashi Bahl. Betreuer: Roland Scheer ; Jörg Bagdahn ; Hans Joachim Möller." Halle, Saale : Universitäts- und Landesbibliothek Sachsen-Anhalt, 2016. http://d-nb.info/1090877579/34.
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Gečys, Paulius. "Plonasluoksnių saulės elementų apdirbimas ultratrumpais lazerių impulsais." Doctoral thesis, Lithuanian Academic Libraries Network (LABT), 2012. http://vddb.laba.lt/obj/LT-eLABa-0001:E.02~2012~D_20121001_093544-75615.
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Disertacijos darbo tikslas buvo, modeliuojant bei vykdant eksperimentus, suprasti plonų sluoksnių, naudojamų Saulės elementuose, abliacijos procesus ultratrumpais impulsais, siekiant juos pritaikyti integruotų jungčių fotovoltiniuose moduliuose formavimui. Eksperimento rezultatams pagrysti buvo vykdomas lazerio spinduliuotės sklidimo bei pasiskirstymo plonasluoksnėje Saulės elemento struktūroje modeliavimas. Sugerta lazerio energija lokaliai užkaitiną medžiagą. Kadangi lazerinio proceso selektyvumas priklauso nuo medžiagos optinių savybių, todėl yra itin svarbu parinkti tinkamą lazerio spinduliuotės bangos ilgį, norint sukaupti spinduliuotę reikiamame plonasluoksnės struktūros sluoksnyje. Nustatyta, kad fundamentinė pikosekundinio lazerio spinduliuotė (1064 nm) yra optimaliausia P3 tipo rėžio formavimui CIGS Saulės elemente. Pramonės taikymams tai yra itin svarbu, nes tokiu atveju mažėja industrinės lazerinės sistemos sudėtingumas bei kaina. Saulės elementų efektyvumo tyrimai parodė nežymų fotoelektrinio efektyvumo sumažėjimą po lazerinio apdirbimo ultra trumpais impulsais, tačiau nebuvo užfiksuota defektų generacijos lazeriais paveiktose kanalo kraštų zonose. Disertacijoje pasiūlyti ir išbandyti pluošto formavimo ir lygiagretaus sluoksnių raižymo metodai, didinantys proceso našumą ir raižymo kokybę. Pikosekundiniai, didelio impulsų pasikartojimo dažnio lazeriai gali būti panaudoti didelės spartos bei aukštos kokybės Saulės elementų raižymo procesuose.Present PhD thesis is the experimental and theoretical analysis of thin layer ultrashort pulsed laser ablation processes for photovoltaic devices. Experimental work was supported by modeling and simulation of energy coupling and dissipation inside the layers. The absorbed laser energy was transformed to localized transient heating inside the structure. Selectiveness of the ablation process was defined by optical and mechanical properties of the materials, and selection of the laser wavelength facilitated control of the structuring process. The 1064 nm wavelength was found optimal for the CIGS solar cell scribing in terms of quality and process speed. It is very positive result for industrial applications as the cost and the system complexity are decreased. The solar cell efficiency test revealed minor degradation in photo-electrical efficiency after the laser scribing was applied to the solar cell samples. Lock-in thermography measurements did not revealed any internal shunt formation during laser scribing with picosecond pulse duration. Picosecond lasers with fundamental harmonics and high repetition rates can be used to accomplish efficient and fast scribing process which is able to fit the demands for industrial solar cell scribing applications.
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Gečys, Paulius. "Ultrashort pulsed laser processing of thin-films for solar cells." Doctoral thesis, Lithuanian Academic Libraries Network (LABT), 2012. http://vddb.laba.lt/obj/LT-eLABa-0001:E.02~2012~D_20121001_093555-45841.
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Present PhD thesis is the experimental and theoretical analysis of thin layer ultrashort pulsed laser ablation processes for photovoltaic devices. Experimental work was supported by modeling and simulation of energy coupling and dissipation inside the layers. The absorbed laser energy was transformed to localized transient heating inside the structure. Selectiveness of the ablation process was defined by optical and mechanical properties of the materials, and selection of the laser wavelength facilitated control of the structuring process. The 1064 nm wavelength was found optimal for the CIGS solar cell scribing in terms of quality and process speed. It is very positive result for industrial applications as the cost and the system complexity are decreased. The solar cell efficiency test revealed minor degradation in photo-electrical efficiency after the laser scribing was applied to the solar cell samples. Lock-in thermography measurements did not revealed any internal shunt formation during laser scribing with picosecond pulse duration. Picosecond lasers with fundamental harmonics and high repetition rates can be used to accomplish efficient and fast scribing process which is able to fit the demands for industrial solar cell scribing applications.Disertacijos darbo tikslas buvo, modeliuojant bei vykdant eksperimentus, suprasti plonų sluoksnių, naudojamų Saulės elementuose, abliacijos procesus ultratrumpais impulsais, siekiant juos pritaikyti integruotų jungčių fotovoltiniuose moduliuose formavimui. Eksperimento rezultatams pagrysti buvo vykdomas lazerio spinduliuotės sklidimo bei pasiskirstymo plonasluoksnėje Saulės elemento struktūroje modeliavimas. Sugerta lazerio energija lokaliai užkaitiną medžiagą. Kadangi lazerinio proceso selektyvumas priklauso nuo medžiagos optinių savybių, todėl yra itin svarbu parinkti tinkamą lazerio spinduliuotės bangos ilgį, norint sukaupti spinduliuotę reikiamame plonasluoksnės struktūros sluoksnyje. Nustatyta, kad fundamentinė pikosekundinio lazerio spinduliuotė (1064 nm) yra optimaliausia P3 tipo rėžio formavimui CIGS Saulės elemente. Pramonės taikymams tai yra itin svarbu, nes tokiu atveju mažėja industrinės lazerinės sistemos sudėtingumas bei kaina. Saulės elementų efektyvumo tyrimai parodė nežymų fotoelektrinio efektyvumo sumažėjimą po lazerinio apdirbimo ultra trumpais impulsais, tačiau nebuvo užfiksuota defektų generacijos lazeriais paveiktose kanalo kraštų zonose. Disertacijoje pasiūlyti ir išbandyti pluošto formavimo ir lygiagretaus sluoksnių raižymo metodai, didinantys proceso našumą ir raižymo kokybę. Pikosekundiniai, didelio impulsų pasikartojimo dažnio lazeriai gali būti panaudoti didelės spartos bei aukštos kokybės Saulės elementų raižymo procesuose.
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Blakeley, John Paul. "'This scribling generation' : the writing careers of Thomas Nashe and Robert Greene." Thesis, University of Newcastle upon Tyne, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.391975.
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Kopke, Henrique Moraes. "Anima Scribens: possibilidades para o desenvolvimento de partituras do movimento animado." Universidade Federal de Juiz de Fora (UFJF), 2015. https://repositorio.ufjf.br/jspui/handle/ufjf/4064.
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CAPES - Coordenação de Aperfeiçoamento de Pessoal de Nível Superior
Tendo em vista as iniciativas governamentais de fomento para a criação de um parque industrial, aliando o conteúdo independente e canais da televisão-paga, a produção nacional de series de animação e longas-metragens alcançou um patamar sólido, propiciando uma demanda por conteúdo animado capaz de gerar empregos e posicionar o produto audiovisual brasileiro de forma competitiva no mercado nacional e internacional. Frente a esta recente configuração do setor do cinema de animação no Brasil e tomando como base as peculiaridades de uma produção animada em detrimento aquela que utiliza atores reais, buscou-se investigar e conciliar os diferentes princípios e métodos que regem a criação e a escrita do movimento. No campo da dança/teatro, pesquisaram-se os estudos de Rudolph Laban na criação de seu sistema de análise do movimento e labanotação, como também as características da expressão corporal animada presente no cinema de animação de Richard Williams, que delimita e exemplifica conceitos teóricos e práticos. Esta pesquisa, portanto, centrou-se em investigar as possibilidades de dinamização da produção de conteúdo animado nacional em escala industrial.
In view of the government initiatives to promote the creation of an industrial park, combining the independent content and television-paid channels, the domestic production of animated series and feature films reached a solid level, providing a demand for animated content can to create jobs and position the Brazilian audiovisual product competitive in the national and international market. Faced with this latest animated film industry configuration in Brazil and building on the peculiarities of an animated production over one that uses real actors, we sought to investigate and reconcile the different principles and methods governing the creation and writing movement. In the field of dance / theater, Rudolph Laban studies were researched on creating your movement analisys system and labanotation, as well as the characteristics of the animated body language present in the Richard Williams animation film, which defines and exemplifies theoretical concepts and practical. This research therefore focused on investigating the dynamic possibilities of the national animated content production on an industrial scale.
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Graham, Jennifer H. "Scribbling Women: Female Historians in the Early American Republic, 1790-1814." Oberlin College Honors Theses / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=oberlin1336064751.
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Nigro, Carol A. "Scribbling across continents Cold War humanism and phenomenology in Cy Twombly's early works /." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file, 341 p, 2009. http://proquest.umi.com/pqdweb?did=1892017001&sid=4&Fmt=2&clientId=8331&RQT=309&VName=PQD.
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Skaris, Katherine. "'A damned mob of scribbling women' : affective labour in British and American fiction, 1848-1915." Thesis, Durham University, 2015. http://etheses.dur.ac.uk/11342/.
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This thesis examines literary representations of women’s work in British and American fiction written and published between 1848 and 1915. It introduces and explores the concept of affective labour to bring to light and evaluate the previously overlooked labours of women in fiction. Adopting the lens of affective labour, the study seeks to focus on the ways in which women strive for self-fulfilment through forms of emotional, mental and creative endeavour that have not always been fully appreciated as ‘work’ in critical accounts of nineteenth-century and twentieth-century fiction. The thesis both reconsiders some well-established and well-known novels by Elizabeth Gaskell, George Gissing, and Arnold Bennett, and introduces some less familiar work by women writers of the time. Many critical studies of nineteenth-century fiction have concentrated on American fiction or British fiction exclusively. This thesis has a strong transatlantic emphasis, as well as a determination to look at both canonical and non-canonical writings. It has two main objectives. Firstly, it seeks to demonstrate the aim of women’s affective labours in the struggle for self-fulfilment. Secondly, in showing how powerful narratives are generated by a persistent concern with affective labour, the thesis seeks to re-evaluate and re-establish some valuable but largely forgotten or neglected works of female British and American writers. Accordingly, the thesis also attempts, where possible, to record significant changes in the reception history of each novel. The thesis is separated into two sections, Section One (Chapters 1-5) examines British fiction, and Section Two (Chapters 6-9) explores the work of American woman writers of antebellum and post-bellum fiction.
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Verweij, Sebastiaan Johan. ""The inlegebill scribling of my imprompt pen" : the production and circulation of literary miscellany manuscripts in Jacobean Scotland, c.1580-c.1630." Thesis, Thesis restricted. Connect to e-thesis to view abstract, 2008. http://theses.gla.ac.uk/329/.
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James, Anna. "'The Scribbler's Tales', and, Scribbling, talking and jangling : Ned Ward's 'The London Spy' in the discursive spaces of late seventeenth-century London." Thesis, University of East Anglia, 2017. https://ueaeprints.uea.ac.uk/63980/.
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The creative component of this thesis is a novel, The Scribbler’s Tales, set in late seventeenth-century London. My narrator, Nathaniel Spicer, writes from Marshalsea Prison, where he is held for seditious libel. The tales he tells mix history, fiction and myth to narrate London’s rise out of the ashes of the Great Fire, as well as Nathaniel’s involvement in the rise of professional journalism and partisan politics. My narrative is inspired by Robert Mayer’s argument that: ‘in the seventeenth century historical discourse embraced not only “history” in its modern sense, but also fiction, polemic, gossip, and marvels’. The Scribbler’s Tales experiments with this ambivalent mode of narration, seeking a modern style of storytelling to match the ambiguity that critics such as Kate Loveman have identified in late seventeenth- and early eighteenth-century fictions. I refer to these theories in the critical part of my thesis, which examines Ned Ward’s periodical The London Spy (1698-1700) within the discursive spaces of late seventeenth-century London. Unlike critics who have either dismissed or re-evaluated Ward in relation to aesthetic or social value criteria, I seek to explore, not ignore, his inherent ambivalence. I relate this ambivalence to his identity as a professional writer or ‘scribbler’, portrayed by contemporaries as a hybrid figure straddling the commercial and literary realms. To approach Ward’s work in a fresh way, I treat him as part of an evolving commercialised literary culture. I place The London Spy within the context of the London print trade, and analyse Ward’s rhetorical and narrative strategies in relation to satire, the grotesque and the blurring of fiction and fact. I anchor these discussions in my analysis of Ward’s representation of discourse – the words spoken, written and performed by his narrator and characters – which he locates in the public spaces of his fictionalised London.
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Oulion, Rémi. ""Nam contra legem non scribant" Notaires et scriptores face à la norme dans la Toscane du haut Moyen Âge (VIIe-XIe siècles)." Thesis, Clermont-Ferrand 1, 2012. http://www.theses.fr/2012CLF10393.
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La question de la « place du juriste face à la norme », sujet d’actualité en droit positif, peut-Être posée pour l’Europe occidentale du haut Moyen Âge. La Toscane, intégrée politiquement au royaume lombard mais située au carrefour des traditions juridiques d’une péninsule italique fragmentée, constitue un terrain propice à une étude des rapports entre les praticiens du droit et le tissu de normes haut-Médiéval. En effet l’Italie, berceau de la romanité et du notariat public moderne, est le creuset d’un droit atypique où cohabitent et s’entremêlent les substrats législatifs et coutumiers romains et germaniques.Dans ce cadre, la Toscane apparaît comme une région périphérique vierge de toute initiative juridique,réceptionnant simplement les innovations légales lombardes, carolingiennes puis romanistes. Mais au-Delà du respect de textes législatifs peu à peu figés, les notaires doivent composer avec des modèles formulaires, des pratiques coutumières,des besoins sociaux et des volontés individuelles sans cesse en mouvement. L’association de ces règles, régaliennes et coutumières, constitue l’ordre normatif valable au jour de rédaction d’un acte.Au long de ces cinq siècles d’histoire, le notariat doit donc être bien plus souple et inventif que ne le laisse supposer le formalisme a priori rigide des actes haut-Médiévaux, et chaque scribe dispose de son propre savoir-Faire juridique, graphique et linguistique. Dans l’imposante masse documentaire toscane, on distingue des trames formulaires infra-Régionales mais aussi de nettes singularités, au niveau local et à l’échelle même de l’individu, dénotant une véritable culture en symbiose avec son temps, son espace et les hommesThe question of « the place of the jurist before the norm » a current subject in positive law, can possibly be posed for western Europe in the Early Middle Ages. Tuscany, politically integrated into the Lombard kingdom but situated at the crossroad of the juridical traditions of a fragmented Italian peninsula, constitutes a favorable terrain for the study of the relationship between the practitioners of law and the normative fabric of the early medieval period. In effect, Italy,the cradle of Roman culture and of modern public notaries, was the melting pot for atypical or mixed law and mingledRoman and German legislative foundations and customs.In this framework, Tuscany appears as a peripheral region, devoid of any juridical initiative, simply receiving Lombard, Carolingian, and Roman legal innovations. However, beyond compliance with gradually fixed legislative texts,the notaries had to deal with constantly changing formulary models, customary practices, social needs, and individual desires. The association of these factors, sovereign and customary, constituted the valid normative order of the day in thecreation of legal documents.Throughout these five centuries of history, notaries thus had to be much more flexible and inventive than issuggested by the rigid, a priori formalism of early medieval legal documents, and each scribe disposed of his ownjuridical, graphical, and linguistic expertise. Within the imposing mass of Tuscan documents, one finds sub-Regionalforms but also clear peculiarities, on both the local and individual levels, denoting a culture in symbiosis with time, space,and man
Il problema del « posto del giurista di fronte alla norma », argomento di attualità in diritto positivo, si può affrontare anche per l'Europa occidentale dell'alto Medioevo. La Toscana, integrata politicamente nel regno longobardo ma situata all'incrocio delle tradizioni giuridiche di una penisola italica frammentata, costituisce un campo favorevole peruno studio dei rapporti tra i tecnici del diritto e il tessuto delle norme alto-medievali. Infatti l'Italia, culla della romanità edel notariato pubblico moderno, è il crogiolo di un diritto atipico in cui coabitano e si intrecciano i fondamenti legislativie consuetudinari romani e germanici.In questo ambito, la Toscana appare come una regione periferica e vergine per ogni iniziativa giuridica, che silimita ad accogliare le novità giuridiche longobarde, carolingie e romaniche. Comunque, al di là del rispetto dei testilegislativi poco a poco fossilizzati, i notai devono misurarsi con i modelli dei formulari, con le pratiche consuetudinarie, ibisogni sociali e le volontà individuali sempre in movimento. Il complesso di queste regole, regie e consuetudinarie,costituisce l'ordine normativo valido nel giorno della redazione di un atto.Quindi, nel corso di questi cinque secoli di storia, il notariato deve essere molto più flessibile e inventivo diquanto lascia supporre il formalismo a priori rigido degli atti alto-medievali, ed ogni scriba utilizza la sua personaleabilità giuridica, grafica e linguistica. Nell'imponente massa documentaria toscana, si distingono delle trame di formulariinfra-regionali ma anche delle chiare peculiarità, a livello locale e a quello dell'individuo singolo, rivelando una veracultura in simbiosi col suo tempo, il suo spazio e gli uomini
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Pao, Ting-Kuang, and 包庭光. "The Study of Vibration-Assisted Scribing Process in Circular Path Scribing of LCD Glass Substrate." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/29210941705265059694.
Full textAbstract:
碩士國立臺灣大學
機械工程學研究所
99
Wheel scribing is considered one of the most common glass substrate separation techniques nowadays. However, there is only a few applications referring to circular scribing paths, and currently, there is no relative studies in such functions. The primary subject of this study is to reach the quality similar to the ones acquired in linear paths, and the automatic separation mechanism with vibration assistant for both thinner and thicker glasses. In this study, the effects of scribing speed on different diameters were examined, and followed by how vibration assistant effects upon circular paths. The surface conditions after scribing were examined by observing the growth of radial crack, lateral crack and chippings on the sections of the glass substrate. For thicker glass substrate, circular path constant was proposed to identify the elastic component median crack depth changes; for thinner glass substrate, a custom bending test were introduced to identify the relative bending strengths under different vibration assistant amplitudes. The results show that the radial and lateral cracks would tend to grow more drastically with higher scribing speed due to the forces caused by turning moment. Generally, reducing the scribing speed could reach better surface conditions. The path overlapping rate increases with smaller diameters, and the overlaid residual fields will invoke the adjunct flaws or faults, those were formed by previously scribing process, grow into cracks. This outcome is especially obvious in thinner glass substrates. Lowering the magnitude of vibration assistant amplitude to reduce the energy transmits into the glass can effectively suppress the induction of these undesirable cracks and channel the energy to the growth of median cracks. The median cracks will then be more regular, and the surface conditions will become better and the possibility of automatic separation will thusly increase.
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Chi, Mya Saw, and 楊光美. "Mechanism of Wheel Tip Geometry in Scribing LCD Glass Substrates and an Innovative Assisted Scribing Method." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/52973435673056482697.
Full textAbstract:
博士臺灣大學
機械工程學研究所
98
Scribing followed by a breaking method has been applied to separate the individual Liquid Crystal Display (LCD) glass panels from the mother cells. In some special occasions, especially for compact mobile devices, the bending strength of the glass substrates after breakage is the most important concern. In this study, the effect of the geometrical characteristics of the scribing wheel on the bending strength of LCD glass substrates was investigated. A volume-crack effective coefficient was defined to estimate the effect of different geometrical characteristics of the scribing wheels. It is found that there is a strong correlation between the bending strength and the coefficient before chipping appears as the scribing load is increased. Thus, the coefficient could be used for the assessment of the geometrical effect of scribing wheels on the bending strength of glass substrates. According to the experiment result, the bending strength is strongly related to the geometrical conditions of scribing wheel tip. A scribing wheel with a large tip angle, a small nose radius and a good surface condition would be an optimum choice for good bending strength. Nevertheless, in reality it is hardly able to manufacture an optimum scribing wheel with capability of large tip angle, small nose radius and good surface polishing at the same time. A technique of vibration assisted scribing of LCD glass substrate was developed to reduce the sensitiveness of wheel tip to the bending strength. A fundamental theory of vibration assisted scribing process was manifested. It was proposed that the rapidly varying periodical scribing load does not lead to as much an increase of the plastic deformation as that due to the servo controlled constant scribing load. Instead it mainly results in an increase of the elastic deformation. The induced elastic component would increase the median crack depth of the glass substrate. To verify the proposed theory, an additional piezoelectric actuator was implemented on the servo controlled loading mechanism of the scribing machine, and a periodically varying load superposed on the constant load was provided to the standard scribing wheel. Experimental results show that under a proper vibration frequency condition the median crack depth is significantly increased to about twice of that without vibration assisted scribing. Thus, the automatic separation of the glass without the need of breaking process similar to the case with the use of toothed wheel (Penett) could take place. On the other hand, while the bending strength of the glass panel after scribing by toothed wheel is merely about half of that resulting from scribing by standard wheel, it remains almost unchanged by the developed technique. The difference of the effect of the frequencies in vibration assisted scribing process for different thickness of LCD glass panels is explained. Median crack depth is increased and scribed glass panels are automatically separable in vibration assisted scribing of 0.5mm glass for some frequencies by elastic component. For 0.7mm glass it is not automatically separable because the value failure moment is not small enough. But the separable condition for 0.21mm glass is due to the tensile stress inside induced by the additional imposed vibration. The most noteworthy fact is the significant increment of bending strength which is better than in scribing of 0.5mm thick glass substrate. The largest bending force increment in vibration assisted scribing process is about 65% of normal scribing process. Experiment results show that the contribution of elastic component of 0.21mm glass becomes less and median crack depth does not increase as much as 0.5mm glass with increasing frequency. A simple way to estimate the optimal frequency based on a known experiment value as a criterion was also proposed. The criterion is based on the condition of crack growth of 0.5mm glass at frequency of 800Hz as an area saturation rate. A method to calculate the initial frequency which would be effective to increase median crack depth was proposed. Knowing the initial frequency, experiment could be conducted with a higher frequency to obtain the larger median crack depth.
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Tan, Yih-Chiu, and 譚義九. "Study of Scribing Chemically Strengthened Glass." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/67696694873396400543.
Full textAbstract:
碩士國立臺灣大學
機械工程學研究所
101
Ion-exchange processing produce a compressive stress profile in glass surface and this kind of glass is called chemically strengthened glass or ion-exchanged glass. Residual compressive stress increase the glass strength, crack and scratch resistance, but also cause chemically strengthened glass is more difficult to scribe, especially the glass with depth of layer more than 23 μm. In this study, scribing three different kinds of chemically strengthened glass (depth of layer 10 μm, 23 μm, 40 μm) are discussed. For chemically strengthened glass with depth of layer 10 μm, glass can be successfully separated with standard scribing wheel and still maintain good surface and cross-section condition after scribing. On scribing depth of layer 23 μm glass, traditional scribing is unable to effectively separate the glass. By adding vibration assisted, glass can be successfully separated and with good surface and cross-section condition in the case of square wave form, low frequency and low amplitude. Scribing chemically strengthened glass with depth of layer 40 μm, lateral crack will generate very easily, causing seriously chipping. Scribing with wheel angle 115˚ and high loading can successfully induce the glass separated because heavily chipping cause compressive layer in the glass surface dropping off. Vibration assisted scribing can successfully improve surface chipping on the condition of square wave form, low amplitude, and frequency of 400 Hz.
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Weng, Tzu-Shian, and 翁祖賢. "Laser scribing and cutting techniques for brittle substrates." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/86879079494566949202.
Full textAbstract:
碩士華梵大學
機電工程學系博碩專班
96
The aim of this paper is to study the laser scribing and cutting techniques for LCD glass and alumina substrates. A point diamond was used to generate a groove-crack along the cutting path in a substrate surface. The glass substrate was then separated by applying a defocused CO2 laser beam along the grooved line to drive the crack extending through the thickness of the substrate. If the laser scanning speed is higher, the crack extending will not penetrate the thickness of the substrate and a blinded-crack will be formed. If the laser scanning speed is slower, the crack will extend throughout the thickness of the substrate. The diamond-grooving can enhance the scribing speed that can be attained. The relationships between the diamond force, groove depth, laser power, scribing depth, and scribing speed that can be attained were obtained from experimental analyses. The SEM photographs of the scribing surface and breaking surface were obtained to analyze the mechanism during the laser scribing and cutting process. The acoustic emission signals generated during the fracture process were analyzed to obtain crack propagating process. Finally, the finite element software ANSYS was employed to calculate the temperature and stress distributions to explain the mechanism of the fracture extension.
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Huang, Po-Ching, and 黃博靖. "Laser scribing of thin-film solar cell module." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/25310325722730778863.
Full textAbstract:
碩士元智大學
先進能源研究所
99
In this study, we fabricate amorphous silicon thin-film solar cell module by laser system with wavelength of 1064 nm and 532 nm. The basic fabrication of the solar cell module has three steps. First step is laser scribing of TCO layer, we called this process “Pattern 1 (P1)”, and in this process should be avoid damage to glass. Then second step a laser pattern (P2) is scribed removing the a-Si film in parallel to the first scribe in the TCO, and avoid hurt TCO. In P2 process, recrystallization occurred at high laser power. That will be increase of leakage current lead to decrease of module efficiency. Third laser scribe (P3) is performed beside the other two scribes. Here the a-Si film and the back contact are removed which gives the final interconnection structure between the different solar cells. We controlling Laser parameters in this research are laser power, velocity of motion stage and defocusing distance. In addition, the patterns of scribes were studied using optical microscope, scanning electron microscope, alpha-step and EDS. Finally we found parameters of P1, P2, P3, and fabrication of module. The module with Voc of 2.49 V, Jsc of 4.83 mA/cm2, F.F. of 0.57 and the maximum efficiency of 7.1 % has been achieved.
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Huang, Bo-Wen, and 黃柏文. "Scribing and Laser Breaking Technique for LCD Glasses." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/27199090962508072645.
Full textAbstract:
碩士華梵大學
機電工程研究所
93
The diamond scribing and laser breaking technique for LCD glasses were investigated in this paper. A point diamond or diamond wheel is used to generate a groove-crack along the cutting path in a glass surface. The glass substrate is then separated by applying a defocused CO2 laser beam throughout the scribed line for driving the groove-crack through the glass thickness. The diamond scribing will generate a groove and median crack. The relationships between the scribing force, groove depth, crack depth, and the breaking speed that can be attained were obtained. The scribing can enhance the cutting speed that can be attained during the cutting process, and improve the straightness of the breaking surface. The material separation is similar to crack propagation. For the large laser spot, the extension of the crack tip lags behind the laser spot. On the other hand, the extension of the crack tip overtakes the laser spot for the small laser spot. The crack extends top-down from the groove bottom and will extend throughout the substrate. Because the initiated groove-crack will propagate exactly along the scribed line, the straightness of the breaking trajectory is very good. The SEM photographs of the breaking surface and the acoustic emission data were obtained to analyze the fracture mechanism during the laser cutting process. Finally, the finite element software ANSYS was employed to calculate the temperature and stress distributions.
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Liu, Jia-Hsin, and 劉佳欣. "Study On Thin TFT-LCD Substrate Scribing Process." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/57104009399112670853.
Full textAbstract:
碩士國立中興大學
機械工程學系所
100
This study intends to identify appropriate conditions to cut thin TFT-LCD to improve the production. The MPX cutting machines, from MDI company, is adopted in the experiment. The material of glass which is as thin as 0.5mm is ASAHI AN100. The variables of experiment are cutting pressure, cutting speed, angles of wheel, the number of teeth in cutting wheel. These variables are proved to be important factors to affect the length of vertical crack by hypotheses test. Furthermore, an empirical equation to relate the experiment variables and length of vertical crack is generated by it. This equation is able to estimate the length of vertical crack in alternative conditions. The result reveals that the value of better cutting pressure is from 8.5N to 9.0N. The median length of vertical crack is approximately one-fourth of the value conducted by Tanaka. The better cutting speed is from 250mm/s to 300mm/s. It’s recommended that angles of wheel and the number of teeth in wheel are 110° and 140 number.
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Chen, Hung-Hsin, and 陳宏信. "A Study on Dicing and Scribing Processes of Glasses." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/13789790174295539049.
Full textAbstract:
碩士中興大學
機械工程學系所
94
Glasses have good optical properties which can be applied to various optical devices such as optical lens and liquid crystal display. The demand of glasses is vast while still increasing year by year. As glasses are brittle materials with high hardness and extremely high fragility, it is common to damage the material, such as breakage, breach and crack, in the machining process. This research is aimed to investigate machining schemes for cutting glasses to reduce the damage in the processes. Ductile machining and brittle machining of glasses are first analyzed based on fracture mechanics. Experiments with different schemes including scribing-then-breaking, dicing-then-breaking, direct-dicing and two-step-dicing processes for soda lime glass and borosilicate glass are then conducted. Major results of this study include the followings. (i) Results by scribing experiments showed that critical depth of cut (DOC) for soda lime glass is between 0.4μm to 0.8μm and between 0.3μm to 0.5μm for borosilicate glass. The results match theoretical predictions based on fracture analysis that DOC for the soda lime glass and for the borosilicate glass are 0.78μm and 0.47μm respectively. (ii) The best machining scheme that results in least damage is the scribing-then-breaking process. The DOC of scribing, however, must be in the ductile-brittle region to generate a middle crack while avoiding lateral crack. (iii) Least damage can be achieved by reducing feed, increasing spindle speed in two-step-dicing process. (iv) Although back-surface defect can be avoided by dicing-then-breaking process, direction of crack generated in the process is not regular. Furthermore, size error can be induced as dicing width is higher than cracking width, not to mention that post grinding and lapping process must be employed to eliminate the scratches and burs.
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Xu, Shao-Huang, and 徐少皇. "Laser scribing the absorption layer of CIGS solar cells." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/78677917607487321453.
Full textAbstract:
碩士國防大學中正理工學院
材料科學碩士班
99
Thin-film CIGS solar cells have the highest energy conversion efficiency among second-generation solar cells. In addition, they can be manufactured by the roll to roll process and therefore flexible modules can be fabricated. They are very promising thin film solar cells. In order to increase the output voltage of solar modules, sub-cells must be connected in series, so laser patterning processes are very important. In this study, we use three Nd:YVO4 lasers with different parameters to scribe the absorption layer of CIGS solar cells. The patterns of laser scribing were characterized using optical microscope, scanning electron microscope Alpha-Step Profilometer, and 3D surface Profilometer. The effects of laser scribing processing variables we studies by comparing the scrbe results. Finally, the processing parameters were optimized.
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SHIH-HENGLIU and 柳世恆. "An Investigation of Vibration-Assisted Scribing for Brittle Materials." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/99990864568988698930.
Full textAbstract:
碩士國立成功大學
機械工程學系碩博士班
98
This thesis combines the elliptical tool vibration and brittle materials scribing process to generate vibration-assisted scribing. We use the vibration that is produced by the piezoelectric actuator to make the elliptical vibration on the tool. In this thesis, we select diamond tool to scribe silicon. This thesis also investigates the difference of brittle-ductile transition depth and surface roughness Ra, Rmax on finished silicon in both brittle and ductile regime between vibration-assisted scribing and traditional scribing. The critical depth of cut (CDC) depends on material properties and tool geometry. The CDC is 0.17 μm as using the diamond tool we choose to scribe silicon, and CDC increase as feed rate decrease or cut depth vibration increase in vibration-assisted scribing. At feed rate 10 μm/s and cut depth vibration 5μm condition, CDC is 2 μm as 10 times than traditional scribing. Compared with vibration-assisted scribing and traditional scribing in brittle zone, the surface roughness Ra is 0.3 μm and 0.9 μm respectively, and Rmax? is 4 μm~10 μm and 1 0μm~14 μm respectively by vibration-assisted scribing, the surface will be smoother than traditional scribing process in brittle zone because vibration-assisted scribing reduce the crack growth. keywords:vibration-assisted scribing;brittle-ductile transition depth;brittle material;critical depth of cut (CDC)
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PENG, TE-YUAN, and 彭德元. "Study on Laser Scribing for Low-k Wafer Dicing." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/37297689920620801831.
Full textAbstract:
碩士國立臺灣科技大學
機械工程系
103
The trend of semiconductor IC packaging demanding for higher I/O density with smaller and thinner chip scale or package form factor in order to keep up with Moore’s Law. The increase of transistor density introduces performance challenges such as electron charge build-up or cross-talk when increasing processing speed. It’s a mandatory when wafer fabrication node size downscaling to 90nm or below, Low-k dielectrics material is required in order to enhance the dielectric property, the Low-k dielectric materials are typically porosity with weaker adhesion and lower mechanical strength which have a tendency to chip, crack and edge peel with traditional mechanical dicing method. Laser grooving process is developed to remove Low-k material prior to dicing saw to avoid such mechanical damage. Experimental study was conducted in this thesis on various critical parameters of laser grooving and blade-dicing to improve low-k wafer die cracking problem. Failure modes were analyzed using optical microscope, IR scope, SEM(Scanning Electron Microscopy) and FIB(Focus-Ion Beam). The study result concluded a preventative solution for die-cracking problem and enhanced IC packaging yield and reliability.
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Dube, Christopher. "Spirit scribing: textual sensitivities of writing and reading spirituality." Thesis, 2002. http://hdl.handle.net/10500/16718.
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peng, Shin-kuang, and 彭馨寬. "The Analysis of Scribing Phenomenon under Different Cutting Parameters." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/58440154686270252371.
Full textAbstract:
碩士國立成功大學
機械工程學系專班
94
This thesis will discuss the influences of scribing force, specific energy, and surface geometry on the tool geometry, rake angle, material, and cutting velocity of scribing process. The influences of cutting geometry on the rake angle are analyzed to observe the variation of the area contacted between tool flank and machined surface for different rake angles in the same cutting depth, and radial cutting coefficient changed with the rake angle. The results of experiments show that scribing leading by edge, the smaller the rake angle is, the greater the specific energy is. While scribing leading by face, the smaller the rake angle is, the smaller the specific energy is. After separating friction from cutting force, the variation trend of the rake angle and the specific energy which does not consider friction is the same with the case that friction is considered. By observing the specific energy which does not consider friction, size effect makes higher specific energy in lower cutting depth in scribing ductile material. While scribing brittle material, the transformation of cutting mechanism makes the specific energy become lower. From relationship between friction coefficient and the material area contacted with tool, the smaller the area is, the lower the friction coefficient is. This phenomenon can be used to decide the optimal rake angle of cut. It also can be observed that the promotion of the cutting velocity makes specific energy is reduced and groove geometry is more complete.
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Lee, You-Chang, and 李祐昌. "Laser scribing with beam shaping technology on silver flexible substrate." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/w4nday.
Full textAbstract:
碩士國立臺北科技大學
機電整合研究所
101
The profile of laser beam is generally a function of Gaussian distribution. The most laser energy concentrates in the middle of the beam. Therefore many studies are concerning on the laser beam shaping technology nowadays. In this study we presents the laser scribing experiments on Ag/PET film and a green nanosecond laser is used to make a cross-sectional U-type profile on the substrate. However, if a picosecond laser is used for scribing experiments, it causes a V-type profile under the same conditions due to the differences between the pulse widths of laser beam. To achieve cross-sectional U-type profile on the substrate by using a green picosecond laser, a beam shaper is used in this study. The Gaussian beam of the laser is changed the Top-hat beam based on the diffraction effect. In test, the laser beam is analyzed by a laser beam profiler and the cross-sectional profiles of samples are observed through a metallurgical microscope. The scribed samples are also measured by a confocal laser scanning microscope. Finally, a cross-sectional U-type profile on the Ag/PET substrate is successfully scribed a picosecond laser with a beam shaper, and thus reduces the material removing of PET and increases strength of silver.
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Hsu, Ching-Feng, and 許清鋒. "Investigation of the fracture behavior involved in the Dicing/Scribing processes." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/62579453959263531415.
Full textAbstract:
碩士淡江大學
機械與機電工程學系
91
Glasses such as ITO glass, BK7 and other optical-electronic materials like silicon, Zerodur and gallium-arsenide have (classically) been categorized as "brittle" materials. This means that when subjected to increasing stress, fracture occurs before appreciable plastic deformation takes place. Although such effects make the machining of these materials extremely difficult, the demand for precision parts made from them has risen (and continues to rise) primarily because of their superior physical, mechanical, optical or electronic properties. Advances in manufacturing processes are therefore important for the economic production of these parts. It has been found in ruling, single point diamond turning and diamond grinding that for cut depths below some critical value together with matched machining conditions (tool shape, cutting speed, coolant..) brittle materials can be machined in a restricted ductile-mode in which material is removed by plastic deformation process rather than brittle fracture processes. However, different approaches are required when dealing with dicing process where cracks are allowed as long as it is in a controllable manner. This means that median crack is generated during dicing to make path for the subsequent break while all the other cracks (lateral, radial… cracks) are to be minimized to ensure the damage zone staying within the streets. In this study, ITO glass, single crystal silicon and GaAs were selected materials to perform the dicing/scribing tests. The crack patterns on and beneath the scribed surface were studied and the influences of scribing speed, tool shapes and normal loads had on the initiation and propagation of cracks were also investigated. It was found that both median and lateral cracks propagated longer when subjected to a higher load. A tool with shaper and narrower indentation impression normally serves better in obtaining higher median crack length to lateral crack length ratio.
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Wang, Chih-Yang, and 王智揚. "Laser-scribing Technology Applied To Si-based Thin Film Solar Cell." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/24877549612059776441.
Full textAbstract:
碩士明道大學
材料科學與工程學系碩士班
101
This thesis applied laser scribing (P1, P2 and P3) technology to fabricate the hydrogenated amorphous silicon (a-Si:H) thin film solar modules. Two types of laser sources are used. Nd:YAG pulse laser with a wavelength of 1064 nm with a frequency of 20 kHz is used for P1 laser process, and Nd:YVO4 pulse laser with a wavelength of 532 nm with a frequency of 25 kHz for both P2 and P3 laser processes. Effects of laser energy density, focusing distance, scribing speed and pulse frequency on properties of transparent conducting oxide and hydrogenated amorphous silicon films are investigated. In addition, the morphology and the scribe depth of the ablated films are observed by optical microscope, thermal field emission scanning electron microscopy and alpha-step profiler. In this thesis, the parameters of the laser processes are optimized according to the experimental results. Finally, a-Si:H thin film solar modules with conversion efficiency of 5.1% can be successfully obtained
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Kuo, I.-Hsin, and 郭益信. "Investigation of the semiconductor fracture behavior during the Dicing/Scribing processes." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/09250070873729192942.
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碩士淡江大學
機械與機電工程學系碩士班
93
Owing to the fast development in semiconductor and opto-electronic industry, demands for precision devices/components made of brittle materials such as single crystal silicon, various glasses, and III-V group based compounds (GaAs, GaP…) are increasing rapidly for their advanced physical and/or optical properties. However, it is always a difficult task to grind, polish, turn and dice these hard and brittle materials to the specified roughness and/or dimension accuracy. Dicing operation is normally carried out when all the circuits are in place on the wafer and used to separate individual dies for packaging. This study aimed to investigate the fracture behavior during dicing silicon wafer by a diamond tool. Effect of dicing parameters such as rake angle, vertical load and dicing speed on the resulted crack propagation and chipping were studied. Finite element method was also adopted in this research to simulate the tool/wafer interaction during the dicing/scratching operation and the results were used to correlate to the experimental results. It was found that both median and lateral cracks introduced by the dicing operation increased with the tool tilt angle and vertical load. The lateral cracks would increase with the dicing speed while median cracks decreased.
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Jung, Po-Chun, and 榮伯鈞. "An Investigation on Scribing Process on Semiconductor Using Advanced Laser Technology." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/dmdzsf.
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碩士義守大學
機械與自動化工程學系
102
In this research, an advanced picosecond Laser machine is applied to different materials used on semiconductor. Based on beam path, speed, repetition rate, power and focus position, a series of comprehensive experiments has been performed in this paper. In the first, experimental works is conducted on Si wafer and follow by low-k wafer for different repetition rate. Secondary, hard material such as LED wafer is also studied for understanding the knowledge the Laser scribing process. 3D micro images profile from KEYENCE demonstrated that kerf width, depth, burnt, crack, peeling and other thermal affected defects for these three materials. The insight of Laser technology applied to scribe Si wafer, low-k wafer and LED sapphire substrate is reported in this work.
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Sheng-Feng, Lu, and 呂昇峰. "The Research of Thin-Film Solar Cell Scribing Processing by Pulse Laser." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/65998560252533918640.
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碩士逢甲大學
資訊電機工程碩士在職專班
102
According to the back contact layer process of CIGS thin-film solar cell, this experiment focuses on coherence contact status of the Molybdenum layer with glass/ CIGS layer. The condition of Moly thickness fixed at 300nm by three kinds of sputtering conditions. Afterward using the 1064 wavelength laser scribes the sputtered Molybdenum laser. The purpose of scribing process mainly increases the amounts of cell. The related high voltage/ current can cause the maximum power by increase the cell number. Base on the characteristic of Moly film, sputtering with the high flow Argon process air can cause a good coherence contact with glass substrate. On the other hand, the low flow Argon can let the Moly has fine contact with CIGS layer[1]. Considering the cost of actual production, the experiment can reach the good contact both side with glass and CIGS layer, and also the result of 49µm line width and 2MΩ isolated resistance by used the 30 sccm low flow Argon together with 13W IR laser isolation scribing process.
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Lin, Chun-Cheng, and 林俊成. "Research on Ant Colony Optimization applied on Scheduling of LED Scribing Process." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/38929668033040884082.
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碩士國立成功大學
工學院工程管理專班
96
This study presents an effective approach for the scheduling of scribing process in the Lighting Emitting Diode (LED) chip OEM. The production environment is the type of flexible flow shop (FFS). The complicated specifications of OEM products result in huge quantities of run cards. Although using priority rules is simple for some evaluated objects, the optimal solution may be not reachable. As far as we know, Genetic Algorithm (GA) has been applied widely to scheduling problems, but it is not guaranteed to find a global optimal solution by wasting much computed time. Ant Colony Optimization (ACO) can find global optimal solution more easily due to the combination of pheromone and random path selection. It can converge to a global optimal solution more quickly than GA. To optimize the scheduling in the industry, this study uses ACO to find an operation sequence of run cards with the criterion to minimize complete time, average flow time and average tardiness time. Based on the understanding in real-world situation, we performed many experiments including a few and numerous run cards. The results indicate that the performance of proposed algorithm is more effective than that of priority rules. In the future, it can be applied by the production department in this industry field.
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Hsu, Yu-Sheng, and 許又升. "Technique and Theory of Vibration Assistant Scribing Process on LCD Glass Substrate." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/40330214400937000083.
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碩士國立臺灣大學
機械工程學研究所
96
A technique of vibration assisted scribing of LCD glass substrate is developed in this thesis. An additional piezoelectric actuator is implemented on the servo controlled loading mechanism of the scribing machine, and a periodically varying load superposed on the constant load is provided to the standard scribing wheel. It is found that under a proper vibration frequency condition the median crack depth is significantly increased to about twice of that without vibration assisted scribing. As a result, automatic separation of the glass without the need of breaking process similar to the case with the use of toothed wheel (penett) can take place. On the other hand, while the bending strength of the glass panel after scribing by toothed wheel is merely about half of that resulting from scribing by standard wheel, it remains almost unchanged by the developed technique. Hence the cost of wheels and scribing machine can be reduced since toothed wheels can be replaced and the proposed technique can be applied by any commercially available machine. A fundamental theory of vibration assisted scribing process is also manifested. It is proposed that the rapidly varying periodical scribing load does not lead to as much an increase of the plastic deformation as that due to the servo controlled constant scribing load. Instead it mainly results in an increase of elastic deformation. The increase of median crack depth through elastic deformation can avoid the lateral and radial cracks induced by large plastic deformation which are usually observed under an increasing constant load condition. The noticeable elastic component of the increased median crack depth was confirmed by experiments, and the proposed theory is verified.
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Huang, Wan-Chun, and 黃琬淳. "High efficiency Nitride Optoelectronics by using Laser Scribing and Electrochemical Etching Processes." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/xz8u98.
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博士國立中興大學
材料科學與工程學系所
103
The dissertation consisted of the backside roughing process and the embedded nanoporous structure in the InGaN-based light-emitting diodes (LEDs) to increase the external quantum efficiency. The first part isthe InGaN-based with a roughened patterned backside on the N-ace GaN surface were fabricated through a crystallographic etching process to increase light extraction efficiency. After laser decomposition, laser scribing, and a lateral crystallographic wet etching process at the GaN/Al2O3 interface, stable crystallographic etching planes were formed as the GaN {101 ̅1 ̅ } planes that included an angle with the top GaN (0001) plane measured at 58o. The GaN buffer layer acted as the sacrificial layer for the laser decomposition process and the lateral wet etching process with a 26μm/min etching rate. The LED with the inverted pyramidal N-face GaN surface close to the GaN/Al2O3 interface has a larger light scattering process than the conventional LED. The light output power of the LED with the backside roughened surface had a 47% enhancement when measured in LED chip form.Next, the different backside roughened-area ratios were fabricated through the sametechniqueon different laser-scribe spacing. By increasing the backside roughened area, the cutoff wavelength of the transmittance spectra and the wavelength of the peak photovoltaic efficiency had a redshift phenomenon that could be caused by increasing the light absorption at InGaN active layer.Then, the LED with overall backside roughened-area was realized in the InGaN LED structure.The light output power of the treated LED structure had a 70% enhancement. The peak external quantum efficiency (EQE) and peak wavelengths of the photovoltaic properties were measured at 38.3% (at 392 nm) and 70.5% (at 396 nm) for the conventional and the treated structures, respectively. Final, this technique was used on the InGaN-based LED structure grown on a patterned-sapphire substrate (PS-LED) to form the hexagonal inverted pyramid structures. The light output power of the BRPS-LED with the backside roughened surface had a 21.4% enhancement compared to aconventional PS-LED in chip form. The larger divergent angle of BRPS-LED could be caused by light-scattering process from the inverted pyramidal-shaped structures on the roughened patterned backside surface at the GaN/Al2O3 interface. The high light intensity at the normal direction of the PS-LED caused by the higher light scattering process on the triangle-shaped patterned sapphire structure. In the BRPS-LED structure, the high light intensity was observed at the normal direction and the backside direction that was caused by the higher light scattering process on the inversed cone-shaped structure and the patterned sapphire substrate. The second part, InGaN light-emitting diodes (LEDs) with directional nano-pipe GaN structures were fabricated through a selectively electrochemical (EC) etching process. A 0.85μm-thick n+-GaN:Si epitaxial layer inserted between LED structure and sapphire substrate was transformed into the nano-pipe structure in diluted nitric acid solution with +10V bias voltage. The directional nano-pipe structure was perpendicular to the laser scribing lines and guided by the external bias electric field. Wide etching width (560μm) and high lateral etching rate (9.3μm/min) were achieved in the middle size of InGaN LED chip (560×910 μm2). High light emission intensity and clear Fabry-Pérot interferences were observed in the treated LED structure, caused by low effective refractive index in the nano-pipe GaN structure. Embedded nano-pipe GaN structure with high light extraction property has been demonstrated with one step epitaxial growth process and the selective EC etching process that have a potential for the large-size high efficiency nitride-based LED applications.
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Ku, Chun-Han, and 古浚翰. "Improvement of light extraction for UV LEDs by laser scribing sapphire substrates." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/ne7nhm.
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碩士國立中興大學
精密工程學系所
105
In this paper, we use the diode pump solid state laser to scribe UV LEDs which can enhance the light extraction efficiency. The concept of laser scribing to enhance the brightness is derived from the pattern sapphire substrate surface. The micro-structure can improve the light extraction efficiency, so the purpose of this paper is using laser to scribe pyramid pattern which can enhance the light extraction efficiency. The relations between spacing of different checkerboard structure and light extraction efficiency also dicussed. In order to fabricate micro-pyramid structures, the machine parameters is adjusted to a extreme condition of low energy (0.3 W) and high scribing speed (120 mm / s). But in this condition, the sapphire substrate is hard to absorb energy. According to paper, focus of the short focal lens has the advantage of focusing energy on the substrate.The high temperature will cause black slag residual at the edge of the patterns, and the black slag will affect the brightness of the flip-chip LED. Black slag can not be removed by ACE, IPA and other organic solvents, and can only be removed by phosphoric acid with high temperature. Before the process of cleaning slag, the thick SiO2 was deposited to protect the epitaxial layer. We used the laser to scribe horizontal substrate and pattern substrate, and discuss three kinds of checkerboard spacing on these two substrates which are 50 μm, 30 μm and reference. After the processes are completed, the brightness of different samples were investigated. According to I-V curve, laser scribing techonology on sapphire surface does not damage the UV LEDs electrical properties. After laser scribing horizontal substrate, light output power of spacing 30 μm, 50 μm increase 28.7% and 16.7%; pattern sapphire substrate of spacing 30 μm, 50 μm increase 7.2% and 5.9%, compared with reference.The result is similar with the Tracepro simulation software.
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CHENG, CHANG-WEI, and 鄭昶維. "Scribing-assisted laser breaking and edge trimming techniques for ultra-thin glass." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/9g872q.
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碩士華梵大學
機電工程學系
107
The aim of this thesis is to study the laser cutting and edge trimming techniques for ultrathin glass. Glass substrates made of 0.1- and 0.2-mm-thick Corning Willow glass were used for cutting with a CO2 laser. A diamond scriber was used to create a groove crack along the cutting path on the glass surface. The glass substrates were then separated by applying a defocused laser beam along the desired cutting path to drive the groove crack through the thickness of the glass. During the diamond scribing process, quite a few of crack-defects exist in the glass cutting edge needed to be removed. More chips will be produced under higher scribing load. The defect layer in the cutting edge can be removed by edge trimming. A shallow groove was generated close to the laser breaking surface, and then applying a defocused laser beam along the groove to remove the defect layer. The relationships between laser power, laser scanning speed, and scribing load were obtained from the laser breaking and edge trimming experiments. The maximum obtainable breaking speed for 0.1 mm thickness was approximately 300 mm/s when the laser power of 20 W and scribing load of 10 g were used. The maximum obtainable breaking speed for 0.2 mm thickness was approximately 90 mm/s when the laser power of 50 W and scribing load of 30 g were used. The surface obtained was very smooth and exhibited no notable microcracks. The edge trimming methodology employed in this study has no remarkable improvement of the laser breaking surface that obtained from the small scribing load. Because the surface quality along the breaking path, even without edge trimming, was excellent when the scribing load was very small.
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Huang, Dao-Wei, and 黃道暐. "Finite Element Analysis of Scribing and Breaking Process for TFT-LCD Mother Glass." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/22938954220948860029.
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碩士中國文化大學
材料科學與奈米科技研究所
94
The thin film transistor (TFT) glass and the color filter (C/F) glass are attached to form the mother glass with heat pressure and keeping the cell gap by the spacers. Subsequently, the mother glass is broken into the screen panel through the scribing and breaking process. The key engineering issues for the scribing and breaking process include the cutting precision, cutting speed and cutting depth of the cutting wheel and the applied pressure by the breaker as well as the breaking precision. In the same time, the process should avoid to produce glass particles and chipping and avoid electrical static deposition (ESD). The present paper will perform the finite element analysis (FEA) of scribing and breaking process for TFT-LCD. The model will investigate the parameters of the number of element, the cutting depth, width, the applied pressure and the aliment precision between the cutting groove and the breaker by simulating the cutting grave as a sharp north and an arch notch. In addition, technique of laser cutting on the scribing and breaking process will be briefly studied. The objective of the present analysis is to understand the influences of those parameters on the scribing and breaking process through the systematic FEM numerical analysis. Through those analyses, the influence of modeling geometry and meshing number on FEM is investigated. The relationships between the cutting notch depth and width as well as the aliment precision and the largest stress and deflection are gained. This understanding can short the time to set up the parameters traditionally done by the try and error process such that preventing the process failure and elevating the product passing ratio.
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Wang, Hongliang. "Laser Surface Texturing, Crystallization and Scribing of Thin Films in Solar Cell Applications." Thesis, 2013. https://doi.org/10.7916/D8D50V9V.
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Thin films have been considered for use in terrestrial solar cell applications because of their significantly reduced cost compared with bulk crystalline silicon. However, their overall efficiency and stability are less than that of their bulk crystalline counterpart. The work presented in this thesis seeks to investigate these issues via a series of experimental and numerical analysis of the influences of laser processing on microstructure, optical and electrical properties of two absorber materials, a-Si:H (hydrogenated amorphous silicon) and CdTe (cadmium telluride). a-Si:H thin film solar cells suffer from disadvantages of low efficiencies and light induced degradation. A one-step laser processing is investigated for introducing light-trapping structure and crystallization on a-Si:H thin films, which can potentially simultaneously alleviate the two weaknesses of a-Si:H. The nanoscale conical and pillar-shaped spikes formed on the surface of a-Si:H films by irradiation of both femtosecond (fs) infrared and nanosecond (ns) excimer lasers enhanced light absorption, while the formation of a mixture of hydrogenated nanocrystalline silicon (nc-Si:H) and a-Si:H after crystallization suggests that the overall material stability can potentially improve. It is shown that growth is a more dominant spike formation mechanism in excimer laser processing, rather than ablation which is dominant during fs laser texturing. Experimental and analytical approaches are also developed revealing the effect of hydrogen on texturing behavior and crystallization during excimer laser irradiation, and a step-by-step crystallization process is proposed to prevent the hydrogen from diffusing out in order to reduce the defect density. In addition, a comparison of absorptance spectra for various surface morphologies and crystallinity is developed and the absorptance across the solar spectrum shows that the combination of surface texturing and crystallization induced by laser processing is very promising for a-Si:H thin film solar cell applications. CdTe thin-film solar cells are the basis of a significant technology with major commercial impact on terrestrial photovoltaic production, since CdTe leads to substantial cost reduction. Laser scribing is a key process used to increase thin-film solar panel efficiency through the formation of serial interconnections to reduce photocurrent and resistance losses. Currently, scribing is performed using glass-side laser processes which have led to increased scribe quality. Defects formed during scribing such as micro cracks, film delamination, thermal effect and tapered sidewall geometries, however, still keep solar panels from reaching their theoretical efficiencies. In this study, a ns Nd:YAG laser operating at the fundamental (1064nm) or frequency-doubled (532nm) wavelengths is employed for pattern 1 (P1) and 2 (P2) scribing on CdTe thin-film solar cells. The experimental investigation shows that film removal mechanisms for different materials are due to laser-induced ablation, thermal stress and micro-explosion processes. The formation mechanisms and mitigation techniques of the defects during micro-explosion process are studied. A fully-coupled thermal and mechanical finite element model is developed to analyze the laser-induced spatio-temporal temperature and thermal stress distribution responsible for SnO2:F film removal, and a plasma expansion model is also investigated to simulate the film removal of CdTe/Cds multilayer due to the micro-explosion process. The characterization of removal qualities will enable the process optimization and design required to enhance solar module efficiency.
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Tsai, Chien-Lung, and 蔡健龍. "The Study of Optimum Design in Scribing and Breaking Process for LCD Glass." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/28651001157275635227.
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碩士國立屏東科技大學
工業管理系所
97
The glass is one in liquid-crystal display's main compose materials. Because the customer demand is different, so liquid-crystal display's size is also different. By the Scribe & Break process , the glass size will be cutting to customer size. The glass Scribe& Break process is necessary in the liquid-crystal display` manufactory process. The process is important influence in liquid-crystal display`s quality. Besides the size, also affects the glass intensity is very big. The good Scribe& Break parameter can enhance glass intensity, and improve quality too. The study is analyzed Scribe& Break process to improve glass intensity by response surface method of design of experiment.The best parameter should be that scribe size 0.0715mm, scribe pressure 0.0745Mpa, scribe rate 261.0534 mm/sec, break pressure 0.4187Mpa.The glass intensity is 15.05109kg. Keyword: glass Scribe & Break process, design of experiment, response surface method
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Yun-Han, Wang, and 王雲漢. "The study of Mo films scribing properties by IR laser and UV laser." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/20098988031763855010.
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碩士正修科技大學
電機工程研究所
100
The main experiment is the use of molybdenum in pulsed laser for solar cells (Mo) Conductive layer to be processed, is divided into two types of laser used, respectively, Fiber Laser 1064 As well as UV Laser 355 To conduct experiments, Fiber Laser 1064 Laser wavelength 1064nm , Pulse width 100ns , Pulse repetition rate 2k ～ 80kHz ， UV Laser 355 Laser wave is often the 355nm, pulse width 3ns, pulse repetition rate 1~50Hz, all of the film for laboratory use Mo thickness 2μm, bottom substrate Glass, Experiments of respectively under the control of parameters of laser output power laser output intensity, frequency, and characterization of the traverse, and at the end of the experiment by optical microscope, electron microscope observation of experimental morphology of dash.
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Chiu, Yi-Ting, and 邱怡婷. "The influences of scribing knife wheel on the glass strength of TFT-LCD." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/10035341188943305295.
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碩士元智大學
化學工程與材料科學學系
99
In TFT-LCD factory, which produce small size panel must thinning the thickness from 0.5mm to 0.4 or 0.3mm due to the demand for product from customers. However, some customers feedback that glass broken occurred due to the insufficient glass substrate strength during the manufacture or assembly process. Therefore, how to enhance the glass substrate strength during scribe process to fulfill customer’s criterion is important. This research is to choose different knife wheels which have higher contribution to anti-bending strength: (1) Half-permeation knife wheel can increase glass strength to 57.7% than high-permeation. (2) To analyze the influence of glass strength with different gear quantity of half-permeation knife wheel, the lowest quantity can increase to 64.8%, and product could reach over 70N in glass strength. It is effective increase in glass substrate strength of TFT-LCD during scribe process. Furthermore, not only avoid glass broken on shipment, but also fulfill the requirement for quality from customers.