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Relevant bibliographies by topics / SEMI-CONDUCTORS CHIPS

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Journal articles
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Academic literature on the topic 'SEMI-CONDUCTORS CHIPS'

Author: Grafiati

Published: 11 September 2023

Last updated: 31 July 2025

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Journal articles on the topic "SEMI-CONDUCTORS CHIPS"

1

Marinov, Val R. "The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend Testing." International Symposium on Microelectronics 2017, no. 1 (2017): 000103–8. http://dx.doi.org/10.4071/isom-2017-tp42_064.

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Abstract Flexible Hybrid Electronics (FHE) can be described as thinned, flexible silicon chips packaged on flexible circuit board (FCB) with printed conductors and passives. The flexibility of ICs can be achieved only if the thickness of the silicon is reduced to 50μm or less. The bend testing of the ultra-thin dies is a critical issue in the FHE technology as it allows to establish the fundamental relationships between the die flexural strength, die geometry, and the methods for thinning and dicing the silicon. The conventional bend tests are not adequate for testing ultra-thin dies. Presente

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2

Aylapogu, Pramod Kumar, B. L. V. S. S. Aditya, G. Sony, et al. "Estimation of power and delay in CMOS circuits using LCT." Indonesian Journal of Electrical Engineering and Computer Science 14, no. 2 (2019): 990. http://dx.doi.org/10.11591/ijeecs.v14.i2.pp990-998.

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<p>With a rapid growth in semiconductor Industry, complex applications are being implemented using small size chips, with the use of Complementary Metal Oxide Semi-Conductors (CMOS). With the introduction of new Integrated Circuit (IC) technology, the speed of the circuits has been increased by around 30%. But it was observed that for every two years, the power dissipation of a circuit doubles. The main reason for this power dissipation is leakage currents in the circuit. To reduce these leakage currents, we can reduce the width of the device. In addition to this, we can use lector techn

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3

Kumar, Aylapogu Pramod, B. L. V. S. S. Aditya, G. Sony, Ch Prasanna, and A. Satish. "Estimation of Power and Delay in CMOS Circuits using Leakage Control Transistor." Carpathian Journal of Electronic and Computer Engineering 11, no. 2 (2018): 25–28. http://dx.doi.org/10.2478/cjece-2018-0014.

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Abstract With a rapid growth in semiconductor Industry, complex applications are being implemented using small size chips, with the use of Complementary Metal Oxide Semi-Conductors (CMOS). With the introduction of new Integrated Circuit (IC) technology, the speed of the circuits has been increased by around 30%. But it was observed that for every two years, the power dissipation of a circuit doubles. The main reason for this power dissipation is leakage currents in the circuit. To reduce these leakage currents, we can reduce the width of the device. In addition to this, we can use lector techn

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4

Hristova-Politikova, Maria Cvetanova. "The Discrepancy between Microchip Production and Automotive Industry born in Covid Pandemic Period 2019-2022." Asian Journal of Business and Management 10, no. 3 (2022). http://dx.doi.org/10.24203/ajbm.v10i3.6958.

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During the Covid-19 pandemic period the tiny particles - the microchips proved to be in high demand by various industries – from IT to the production of simple consumer goods. Main objective of this analysis is to explain the reasons for the shortage of chips and semi-conductors for the automotive industry as the auto maker resumed their activities after the lock downs. Haltering of orders by the major auto producer and rerouting of chip production towards supplies for the electronic industry which proved willing to pay more are the main reasons. Trade specialization and globalization which ar

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Dissertations / Theses on the topic "SEMI-CONDUCTORS CHIPS"

1

GUPTA, NITIN. "MACHINE LEARNING PREDICTIVE ANALYTIC MODEL TO REDUCE COST OF QUALITY FOR SOFTWARE PRODUCTS." Thesis, DELHI TECHNOLOGICAL UNIVERSITY, 2021. http://dspace.dtu.ac.in:8080/jspui/handle/repository/18484.

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In today’s world, high quality product are need of the time. The low-quality product results in the high cost. This can be explained from the quality graph below 1) Prevention cost can be define as the issue/bugs found out before the deployment/delivered to customer. This cost is initially very low but in the longer run goes up 2) Failure cost includes cost of losing customers, Root cause analysis and rectification. This cost is defiantly very huge Figure 11 : Cost of Quality Source: https://www.researchgate.net/ 5 If there can be any mechanism that can help to identify the exp

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Books on the topic "SEMI-CONDUCTORS CHIPS"

1

Ghafar-Zadeh, Ebrahim. CMOS capacitive sensors for lab-on-chip applications: A multidisciplinary approach. Springer, 2010.

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Ghafar-Zadeh, Ebrahim, and Mohamad Sawan. CMOS Capacitive Sensors for Lab-On-Chip Applications: A Multidisciplinary Approach. Springer Netherlands, 2012.

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Conference papers on the topic "SEMI-CONDUCTORS CHIPS"

1

Bhagavat, Milind, and Imin Kao. "Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw." In ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0913.

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Abstract The present paper deals with physics based computational modeling of the wiresaw Free Abrasive Machining (FAM). The wiresaw is used to slice large diameter wafers of predominantly brittle semi-conductors such as silicon. The wiresawing model proposed in the present paper involves cutting action by ‘floating’ abrasives. It is proposed that the abrasive carrying slurry forms a film in the cutting zone by an elasto-hydrodynamic action. Finite Element Analysis shows this film to be in general thicker than the average abrasive size. This signifies a ‘float’ machining condition, wherein the

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