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Relevant bibliographies by topics / Semiconductor equipment manufacturer

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Journal articles
Dissertations / Theses
Conference papers

Academic literature on the topic 'Semiconductor equipment manufacturer'

Author: Grafiati

Published: 4 June 2021

Last updated: 5 February 2022

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Journal articles on the topic "Semiconductor equipment manufacturer"

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Yang, Yi-Hsuan, and Chen-Yang Cheng. "Tool Planning Model with Calibration for Semiconductor Equipment Manufacturer." Procedia Manufacturing 11 (2017): 2001–8. http://dx.doi.org/10.1016/j.promfg.2017.07.351.

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Edziah, Raymond. "Cost Effective Profiling of Neodymium-Doped Vanadate Laser Pulses." Applied Physics Research 10, no. 2 (2018): 39. http://dx.doi.org/10.5539/apr.v10n2p39.

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As environmental conditions and component degradation and failure are known to affect the performance of ultrafast lasers, it is important to monitor their state in any nonlinear optical study. This may be achieved by measuring the temporal width of the laser pulses using an autocorrelator. In this work, an autocorrelator for measuring the pulsewidth of mode-locked lasers was custom-built using pieces of equipment usually found in a typical ultrafast optics laboratory. The assembled equipment was tested using SESAM (Saturable Semiconductor Absorber Mirror) mode-locked neodymium-doped vanadate

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Gastasini, Enrico, Niccolò Capecci, Francesco Lupi, Alessio Gagliardi, Sergio Saponara, and Michele Lanzetta. "An Instrument for the Characterization and Calibration of Optical Sensors." Sensors 21, no. 15 (2021): 5141. http://dx.doi.org/10.3390/s21155141.

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This paper presents the development of a hardware/software system for the characterization of the electronic response of optical (camera) sensors such as matrix and linear color and monochrome Charge Coupled Device (CCD) or Complementary Metal Oxide Semiconductor (CMOS). The electronic response of a sensor is required for inspection purposes. It also allows the design and calibration of the integrating device to achieve the desired performance. The proposed instrument equipment fulfills the most recent European Machine Vision Association (EMVA) 1288 standard ver. 3.1: the spatial non uniformit

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Blinov, V. V., V. M. Vladimirov, S. N. Kulinich, et al. "Equipment for growing semiconductor heterostructures in outer space." Spacecrafts & Technologies 5, no. 2 (2021): 110–15. http://dx.doi.org/10.26732/j.st.2021.2.06.

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This article describes the features of the equipment developed at the Rzhanov Institute of Semiconductor Physics for conducting experiments on growing semiconductor heterostructures from molecular beams in outer space under the conditions of an orbital flight of the International Space Station. Working out the processes of epitaxy of semiconductor films in outer space will allow us to grow complex semiconductor structures with sharp boundaries, which serve as the basis for the creation of solar cells, as well as devices of modern microwave, optoand microelectronics. Cascade photovoltaic conver

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Keller, William W., and Louis W. Pauly. "Crisis and Adaptation in East Asian Innovation Systems: The Case of the Semiconductor Industry in Taiwan and South Korea." Business and Politics 2, no. 3 (2000): 327–52. http://dx.doi.org/10.2202/1469-3569.1014.

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In recent decades, both South Korea and Taiwan have made remarkable leaps in the development and production of semiconductors-the core element in burgeoning global telecommunications, computer, and computer equipment industries. Although many aspects of their sectoral industrial strategies have differed, both countries are now moving aggressively to adapt their semiconductor industries to turbulent global markets. In the wake of the severe regional financial crisis that began in 1997, this case study compares and contrasts continuing processes of adaptation among primary semiconductor manufact

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Kern, Frederick. "Integration of Numerical Simulation and Flow Visualization in the Design of Equipment for the Manufacture of Submicron Semiconductor Devices." Journal of the IEST 32, no. 3 (1989): 19–24. http://dx.doi.org/10.17764/jiet.1.32.3.j2q861606775j7n7.

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Improved room and equipment aerodynamics can have a significant impact on the ability to obtain acceptable yields on high density semiconductor products.1 Goals for the equipment engineer/vendor are presented here, a set of design guidelines is established, and a design and test regimen formulated to achieve aerodynamically acceptable equipment designs is proposed.

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Hickey, Patrick, and Eugene Kozlovski. "E-strategies for aftermarket facilitation in the global semiconductor manufacturing industry." Journal of Enterprise Information Management 33, no. 3 (2020): 457–81. http://dx.doi.org/10.1108/jeim-05-2019-0124.

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PurposeThe paper presents one of the first attempts to identify and categorise the fundamental barriers currently preventing the multibillion semiconductor equipment manufacturing industry from implementing existing B2B e-trading models for its secondary market. It furthermore proposes a global e-business strategy supporting aftermarket integration with the industry's supply chain.Design/methodology/approachBecause of the global nature of the industry, the research employs a multiple case-study design to explore the state-of-the-art in semiconductor excess management. The data for this analysi

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Jensen, David, and Susan Goldsmith. "Evaluation of Critical Gas-Line Filters." Journal of the IEST 30, no. 6 (1987): 39–43. http://dx.doi.org/10.17764/jiet.1.30.6.d218744692jk0t27.

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Gas-line filters are in widespread use in critical semiconductor manufacturing equipment and process lines. In this study, we developed accurate test methods for evaluation of these filters for particulate cleanliness during both steady flow and mechanical shock. Each test method and apparatus is described, and choice of testing conditions are discussed. Filters from four major manufacturers were evaluated and the data are shown and compared.

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Henning, Stephan W., Luke Jenkins, Sidni Hale, et al. "Manual Assembly of 400um Bumped-Die GaN Power Semiconductor Devices." International Symposium on Microelectronics 2012, no. 1 (2012): 000514–23. http://dx.doi.org/10.4071/isom-2012-poster_hale.

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Until recently, power semiconductors were usually produced as TO, power-PAK, and D-PAK style packaging, due to die size, thermal dissipation requirements, and the vertical flow of current through the devices. The introduction of GaN to power semiconductors has allowed manufactures to produce devices with approximately 9% the footprint of similar rated D-PAK Si MOSFETs. In addition, GaN semiconductors have much better theoretical limits of specific on-resistance to breakdown voltage, when compared to Si and SiC. As of now, GaN devices offer very good performance at much less the cost of SiC, ve

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Chen, Song, Zu Rong Ni, and Fen Xiao. "Nonequilibrium Charge Carrier Lifetime Testing Equipment for Semiconductor Materials by a Contactless Microwave Phase Method." Advanced Materials Research 655-657 (January 2013): 830–33. http://dx.doi.org/10.4028/www.scientific.net/amr.655-657.830.

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The accurate measurement of nonequilibrium charge carrier lifetime is of vital significance in research and manufacture of crystalline silicon solar cells. A testing equipment based on a contactless microwave phase method was implemented by being embedded with GPIB, FPGA and a lock-in analyzer. A friendly operation interface was developed, based on the graphic programming language LabVIEW. The virtue of the equipment is achieved by automatic data acquisition and processing, which improves the automatization, efficiency and accuracy of the measurement.

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Dissertations / Theses on the topic "Semiconductor equipment manufacturer"

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Pieczulewski, Charles N. (Charles Nicholas). "Benchmarking semiconductor lithography equipment development & sourcing practices among leading-edge U.S. manufacturers." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/32171.

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Yeh, Shih-Hao, and 葉士豪. "The Criteria of Supplier Selection - A Case study of Semiconductor Equipment Manufacturer." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/10801925589264541758.

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碩士<br>開南管理學院<br>航運與物流管理系碩士班<br>94<br>Semiconductor equipment is a high-tech and capital-intensive industry; it also has characteristics which having a short booming cycle period and requiring various-materials for finished product. The first section equipment plays an extremely important role in the semiconductor industry; therefore, equipment suppliers must have some capabilities, such as the prompt reaction capacity, the well production technology ability, yield of the high quality and on time delivery. This research focuses on analyzing the selection criteria which the first section equipme

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Chang, Chao-Jung, and 張肇榮. "A Study of Selection Criteria of Semiconductor Equipment Supplier by Manufacturer in Taiwan." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/11336691503520001279.

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碩士<br>國立交通大學<br>經營管理研究所<br>90<br>With the dawn of the 21st century, the challenges confronting semiconductor industries on the technology level include size reduction of devices, speed acceleration and use of new materials. As a new production processes and a new material need to be supported by new generation equipment. The question on whether semiconductor industries would be able to achieve new breakthroughs in the development of technology for semiconductor equipment, or whether there would be smooth development for next generation advanced semiconductor process is an area of great concern

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Lin, Mu Wei, and 林沐葦. "The Innovation Strategy of Semiconductor Firm: The Case of Equipment Manufacturer Company W." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/244h4z.

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碩士<br>國立清華大學<br>經營管理碩士在職專班<br>104<br>Since the 1st transistor was published, the innovation in semiconductor industry was continuing for fifty years. It was always following “the Moore’s Law”－The number of transistors on chip will be doubled every 18-24 months. Nowadays, the technology node of CD is approaching 10nm. Shall this be the end? When will the innovation be stopped by the physical constraint? In 2008, it was considered to be 30nm. Today, it’s just announced that TSMC is targeting to move into HVM at 10nm node in 2017. Although there’re some new technologies, like immersion, double-pa

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LI, HUI-CHUAN, and 李惠娟. "Semiconductor Back-End Packaging Equipment Manufacturer Competition Strategy - G Companys as an Example." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/b6gs37.

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碩士<br>逢甲大學<br>經營管理碩士在職學位學程<br>107<br>Wafer processing equipment will rise 11.7% in 2018 to $50.8 billion. Fab facilities equipment, wafer manufacturing, and mask/reticle equipment, are expected to grow 12.3% to $2.8 billion this year. The assembly and packaging equipment segment is projected to grow 8% to $4.2 billion in 2018, while semiconductor test equipment is forecast to increase 3.5% to $4.9 billion this year. South Korea will remain the largest equipment market for the second year in a row. China will be second biggest and Taiwan will be third. In 2019, equipment sales in China will sur

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Wang, Yu-Yang, and 王玉揚. "The Evaluation of Cooperate Strategies of A Semiconductor Equipment Manufacturer, ASM International Co. Ltd." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/21011608711584526891.

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碩士<br>國立交通大學<br>高階主管管理碩士學程<br>98<br>When ASM (Advanced Semiconductor Materials), a semiconductor equipments manufacturer, founded in the early 1980, the company was motivated by the founder to involve both Front End (so-called Wafer Processing) and Back End (so-called Packaging process) equipments manufacturing to diverse it’s business risk, and intend to become a great company to provide a complete IC manufacturing solution in the industry. However, the comprehensive semiconductor processes evolved, the differentiation of innovative technology and lack of the ability to manage a multinational

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Yang, Sheng-An, and 楊聖安. "A case study of mergers and acquisitions on semiconductor equipment manufacturer Lam Research and Novellus Systems Merger." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/58039591480520124236.

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碩士<br>國立清華大學<br>高階經營管理碩士在職專班<br>100<br>For enterprises, Mergers and Acquisitions are the way of external growth to achieve the expansion. December 14, 2011, semiconductor equipment manufacturers Lam Research and Novellus Systems, both announced a statement of M&;A agreement, Lam Research will merge Novellus Systems at the price of $ 44.42 per share, amounting to $ 3.3 billion. These two companies agreed to the convertible way completed the acquisition. The conversion ratio is 1.125 shares of ordinary shares of Lam Research to a share of ordinary shares of Novellus Systems at Nasdaq closing sto

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Lin, Kuang-Long, and 林光龍. "The strategy as manufacturer of electronic equipment selects the business partner of semiconductor distributor: from the viewpoints of 4C strategic aspect." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/7e5zek.

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碩士<br>國立政治大學<br>經營管理碩士學程(EMBA)<br>108<br>Since 1985, the first Department of Electronics Engineering has been established in National Chiao Tung University, the Taiwan electronic industry has been started, after 50 years developing history, Taiwan become the role with integrated supply chain for global electronic industry, the supply chain include from the semiconductor manufacturer to electronic manufacturer service, the yearly revenue is also reached to six trillions NT dollars, besides, because the current requested function and applications of electronic system become diversity and more co

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HONG, ANG YEN, and 洪燕芳. "The Study of Applying Balanced Scorecard to Investigate Key Performance Indices of the Internal Supply Chain for Semiconductor Equipment Manufacturer-A Case Study." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/51719365287199950116.

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碩士<br>明新科技大學<br>工業工程與管理研究所<br>99<br>In this study, we adopt a domestic semiconductor equipment company as the example, and using the Balanced Scorecard theory which includes financial, customer, internal processes, leaning and grow to develop a key indicator for customer and internal supplies, provide case company to set performance measures for reference. This study begins from the aspect of “internal supply chain”, to help the company to identify cases of performance measurement indicators, from this indicator to uphold the company’s competitiveness. This study conducted a questionnaire surv

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LEE, HSUAN-MING, and 李軒銘. "The Impact of Leadership Behaviors on the Working Willingness and Job Burnout in Employee of Semiconductor Equipment Manufacturer - M Co. as an Example." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/y9sg2b.

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碩士<br>中華大學<br>科技管理學系<br>105<br>With such specific working environment of semiconductor equipment manufacturer industry.How much of the employee’s working willingness will impact the working performance and productivity of Company.And the negative factor that contingencies of job burnout affected the employee’s physiological healthly and mental pressure and even caused the unexpected productivity result.This research intended to investigate the affective of working willingness and influence of job burnout in employees within different leadership behaviors to approach the optimum productivity an

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Conference papers on the topic "Semiconductor equipment manufacturer"

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Chong, K. E., K. C. Ng, and G. G. G. Goh. "Improving Overall Equipment Effectiveness (OEE) through integration of Maintenance Failure Mode and Effect Analysis (maintenance-FMEA) in a semiconductor manufacturer: A case study." In 2015 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM). IEEE, 2015. http://dx.doi.org/10.1109/ieem.2015.7385883.

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Bleakie, Alexander, and Dragan Djurdjanovic. "Dynamic Feature Monitoring Technique Applied to Thin Film Deposition Processes in an Industrial PECVD Tool." In ASME 2011 International Manufacturing Science and Engineering Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/msec2011-50041.

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In semiconductor fabrication processes, reliable feature extraction and condition monitoring is critical to understanding equipment degradation and implementing the proper maintenance decisions. This paper presents an integrated feature extraction and equipment monitoring approach based on standard built-in sensors from a modern 300mm-technology industrial Plasma Enhanced Chemical Vapor Deposition (PECVD) tool. Linear Discriminant Analysis was utilized to determine the set of dynamic features that are the most sensitive to different tool conditions brought about by chamber cleaning. Gaussian M

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Pfeffer, Markus, Richard Oechsner, Lothar Pfitzner, Heiner Ryssel, Berthold Ocker, and Patrick Verdonck. "Performance Optimization of Semiconductor Manufacturing Equipment by the Application of Discrete Event Simulation." In ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2008. http://dx.doi.org/10.1115/detc2008-49274.

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Semiconductor wafer fabrication facilities (wafer fabs) are amongst the most complex production facilities. State-of-the-art wafer fabs comprise a large product variety, hundreds of processing steps per product, almost hundreds of machines of different types, and automated transportation systems combined with reentrant flows throughout the fab. In addition to the high complexity, wafer fabs require very high capital investment and an undisturbed operation. Semiconductor manufacturers are facing fierce competition as more global capacity is being added. Through this intense competition, semicon

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Jin, X., P. Woytowitz, and T. Tan. "On Determination of Sample Size to Evaluate Reliability Growth Plans." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-62189.

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The reliability performance of Semiconductor Manufacturing Equipments (SME) is very important for both equipment manufacturers and customers. However, the response variables are random in nature and can significantly change due to many factors. In order to track the equipment reliability performance with certain confidence, this paper proposes an efficient methodology to calculate the number of samples needed to measure the reliability performance of the SME tools. This paper presents a frequency-based Statistics methodology to calculate the number of sampled tools to evaluate the SME reliabil

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Maydan. "Keeping Both Sides Winning: Wafer Fabrication Equipment Suppliers And Semiconductor Manufacturers In The Year 2000 And Beyond." In Symposium on VLSI Technology. IEEE, 1997. http://dx.doi.org/10.1109/vlsit.1997.623668.

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Joo, Kang-Woo, Suyeon Lee, Jiyoung Hwang, and Kwang-Sun Kim. "A Study on the Fluid Flow for Effective Polishing Process in CMP Equipment." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-87213.

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The CMP (Chemical Mechanical Polishing) process is an essential process in the semiconductor manufacturing for MLM (Multilevel metal) with high-integration of devices. The targets of CMP process are such as: obtaining the uniform polishing rate on the wafer surface and high-grade flatness in each chip and removing the foreign substances with uniform cleaning. However, as the wiring density increases and the wafer size becomes larger for MLM structuring, some problems have been encountered such as: size of the CMP equipment, non-uniformity of the slurry distribution. The CMP in this research su

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Mungekar, Hemant, Young S. Lee, and Shankar Venkataraman. "Feature Evolution During Sub 100NM Gap-Fill and Etch." In ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. ASMEDC, 2005. http://dx.doi.org/10.1115/ht2005-72326.

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Inductively coupled plasma (ICP) reactors are being used at low gas pressure (&lt;100mTorr) and high plasma density ([e] &gt; 1013/cm2) processes in semiconductor fabrication. In these reactors plasma is generated by inductively coupled electric field while positive ions are accelerated anisotropically by applying a negative bias RF to the substrate. Semiconductor manufacturers face many challenges as wafer size increases while device geometries decrease. Two key challenges for both process design and electronics processing equipment design are (a) scale up of process from 200mm to 300

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Chagny, Marie-Pascale, and John A. Naoum. "A Methodology for Characterizing System-Level ESD Sensitivity." In ISTFA 2004. ASM International, 2004. http://dx.doi.org/10.31399/asm.cp.istfa2004p0277.

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Abstract Over the years, failures induced by an electrostatic discharge (ESD) have become a major concern for semiconductor manufacturers and electronic equipment makers. The ESD events that cause destructive failures have been studied extensively [1, 2]. However, not all ESD events cause permanent damage. Some events lead to recoverable failures that disrupt system functionality only temporarily (e.g. reboot, lockup, and loss of data). These recoverable failures are not as well understood as the ones causing permanent damage and tend to be ignored in the ESD literature [3, 4]. This paper anal

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Cader, Tahir, Levi Westra, and Andres Marquez. "Technologies for the Energy-Efficient Data Center." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33463.

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Although semiconductor manufacturers have provided temporary relief with lower-power multi-core microprocessors, OEMs and data center operators continue to push the limits for individual rack power densities. It is not uncommon today for data center operators to deploy multiple 20 kW racks in a facility. Such rack densities are exacerbating the major issues of power and cooling in data centers. Data center operators are now forced to take a hard look at the efficiencies of their data centers. Malone and Belady (2006) have proposed three metrics, i.e., Power Usage Effectiveness (PUE), Data Cent

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