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Journal articles on the topic 'Semiconductor equipment manufacturer'

Author: Grafiati

Published: 4 June 2021

Last updated: 5 February 2022

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1

Yang, Yi-Hsuan, and Chen-Yang Cheng. "Tool Planning Model with Calibration for Semiconductor Equipment Manufacturer." Procedia Manufacturing 11 (2017): 2001–8. http://dx.doi.org/10.1016/j.promfg.2017.07.351.

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2

Edziah, Raymond. "Cost Effective Profiling of Neodymium-Doped Vanadate Laser Pulses." Applied Physics Research 10, no. 2 (2018): 39. http://dx.doi.org/10.5539/apr.v10n2p39.

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As environmental conditions and component degradation and failure are known to affect the performance of ultrafast lasers, it is important to monitor their state in any nonlinear optical study. This may be achieved by measuring the temporal width of the laser pulses using an autocorrelator. In this work, an autocorrelator for measuring the pulsewidth of mode-locked lasers was custom-built using pieces of equipment usually found in a typical ultrafast optics laboratory. The assembled equipment was tested using SESAM (Saturable Semiconductor Absorber Mirror) mode-locked neodymium-doped vanadate

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3

Gastasini, Enrico, Niccolò Capecci, Francesco Lupi, Alessio Gagliardi, Sergio Saponara, and Michele Lanzetta. "An Instrument for the Characterization and Calibration of Optical Sensors." Sensors 21, no. 15 (2021): 5141. http://dx.doi.org/10.3390/s21155141.

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This paper presents the development of a hardware/software system for the characterization of the electronic response of optical (camera) sensors such as matrix and linear color and monochrome Charge Coupled Device (CCD) or Complementary Metal Oxide Semiconductor (CMOS). The electronic response of a sensor is required for inspection purposes. It also allows the design and calibration of the integrating device to achieve the desired performance. The proposed instrument equipment fulfills the most recent European Machine Vision Association (EMVA) 1288 standard ver. 3.1: the spatial non uniformit

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Blinov, V. V., V. M. Vladimirov, S. N. Kulinich, et al. "Equipment for growing semiconductor heterostructures in outer space." Spacecrafts & Technologies 5, no. 2 (2021): 110–15. http://dx.doi.org/10.26732/j.st.2021.2.06.

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This article describes the features of the equipment developed at the Rzhanov Institute of Semiconductor Physics for conducting experiments on growing semiconductor heterostructures from molecular beams in outer space under the conditions of an orbital flight of the International Space Station. Working out the processes of epitaxy of semiconductor films in outer space will allow us to grow complex semiconductor structures with sharp boundaries, which serve as the basis for the creation of solar cells, as well as devices of modern microwave, optoand microelectronics. Cascade photovoltaic conver

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Keller, William W., and Louis W. Pauly. "Crisis and Adaptation in East Asian Innovation Systems: The Case of the Semiconductor Industry in Taiwan and South Korea." Business and Politics 2, no. 3 (2000): 327–52. http://dx.doi.org/10.2202/1469-3569.1014.

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In recent decades, both South Korea and Taiwan have made remarkable leaps in the development and production of semiconductors-the core element in burgeoning global telecommunications, computer, and computer equipment industries. Although many aspects of their sectoral industrial strategies have differed, both countries are now moving aggressively to adapt their semiconductor industries to turbulent global markets. In the wake of the severe regional financial crisis that began in 1997, this case study compares and contrasts continuing processes of adaptation among primary semiconductor manufact

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Kern, Frederick. "Integration of Numerical Simulation and Flow Visualization in the Design of Equipment for the Manufacture of Submicron Semiconductor Devices." Journal of the IEST 32, no. 3 (1989): 19–24. http://dx.doi.org/10.17764/jiet.1.32.3.j2q861606775j7n7.

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Improved room and equipment aerodynamics can have a significant impact on the ability to obtain acceptable yields on high density semiconductor products.1 Goals for the equipment engineer/vendor are presented here, a set of design guidelines is established, and a design and test regimen formulated to achieve aerodynamically acceptable equipment designs is proposed.

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Hickey, Patrick, and Eugene Kozlovski. "E-strategies for aftermarket facilitation in the global semiconductor manufacturing industry." Journal of Enterprise Information Management 33, no. 3 (2020): 457–81. http://dx.doi.org/10.1108/jeim-05-2019-0124.

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PurposeThe paper presents one of the first attempts to identify and categorise the fundamental barriers currently preventing the multibillion semiconductor equipment manufacturing industry from implementing existing B2B e-trading models for its secondary market. It furthermore proposes a global e-business strategy supporting aftermarket integration with the industry's supply chain.Design/methodology/approachBecause of the global nature of the industry, the research employs a multiple case-study design to explore the state-of-the-art in semiconductor excess management. The data for this analysi

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Jensen, David, and Susan Goldsmith. "Evaluation of Critical Gas-Line Filters." Journal of the IEST 30, no. 6 (1987): 39–43. http://dx.doi.org/10.17764/jiet.1.30.6.d218744692jk0t27.

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Gas-line filters are in widespread use in critical semiconductor manufacturing equipment and process lines. In this study, we developed accurate test methods for evaluation of these filters for particulate cleanliness during both steady flow and mechanical shock. Each test method and apparatus is described, and choice of testing conditions are discussed. Filters from four major manufacturers were evaluated and the data are shown and compared.

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Henning, Stephan W., Luke Jenkins, Sidni Hale, et al. "Manual Assembly of 400um Bumped-Die GaN Power Semiconductor Devices." International Symposium on Microelectronics 2012, no. 1 (2012): 000514–23. http://dx.doi.org/10.4071/isom-2012-poster_hale.

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Until recently, power semiconductors were usually produced as TO, power-PAK, and D-PAK style packaging, due to die size, thermal dissipation requirements, and the vertical flow of current through the devices. The introduction of GaN to power semiconductors has allowed manufactures to produce devices with approximately 9% the footprint of similar rated D-PAK Si MOSFETs. In addition, GaN semiconductors have much better theoretical limits of specific on-resistance to breakdown voltage, when compared to Si and SiC. As of now, GaN devices offer very good performance at much less the cost of SiC, ve

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10

Chen, Song, Zu Rong Ni, and Fen Xiao. "Nonequilibrium Charge Carrier Lifetime Testing Equipment for Semiconductor Materials by a Contactless Microwave Phase Method." Advanced Materials Research 655-657 (January 2013): 830–33. http://dx.doi.org/10.4028/www.scientific.net/amr.655-657.830.

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The accurate measurement of nonequilibrium charge carrier lifetime is of vital significance in research and manufacture of crystalline silicon solar cells. A testing equipment based on a contactless microwave phase method was implemented by being embedded with GPIB, FPGA and a lock-in analyzer. A friendly operation interface was developed, based on the graphic programming language LabVIEW. The virtue of the equipment is achieved by automatic data acquisition and processing, which improves the automatization, efficiency and accuracy of the measurement.

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11

Fam, Soo-Fen, Ser Lee Loh, M. Haslinda, Heri Yanto, Linda Mei Sui Khoo, and Diana Hwa Yieng Yong. "Overall Equipment Efficiency (OEE) Enhancement in Manufacture of Electronic Components & Boards Industry through Total Productive Maintenance Practices." MATEC Web of Conferences 150 (2018): 05037. http://dx.doi.org/10.1051/matecconf/201815005037.

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In an environment of intense global competition, both creative and proven strategies need to be considered in order to bring about the effectiveness and efficiency in manufacturing operation. Total Productive Maintenance (TPM) is one of the effective maintenance strategy in enhancing the equipment effectiveness and to achieve a significant competitive advantage. This research paper addresses the impact of three TPM pillars namely planned maintenance (PM), autonomous maintenance (AM) and focused maintenance (FM) on overall equipment effectiveness (OEE) of die attach equipment in the production

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Rothrock, Stephen M. "Semiconductor manufacturing strategy: Where in the world to locate a fab or cleanroom?" International Symposium on Microelectronics 2019, no. 1 (2019): 000454–62. http://dx.doi.org/10.4071/2380-4505-2019.1.000454.

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Abstract The global market for advanced technology manufacturing assets is becoming ever tighter, compelling semiconductor companies, including OSATs (outsourced semiconductor assembly and test), IDMs (integrated device manufacturers), and foundries, to carefully explore all available options when planning manufacturing operations relating to fabs, tools, and cleanrooms. Despite the semiconductor industry's optimistic growth forecasts, global uncertainty generated by the continuing trade wars between the U.S. and China is causing anxiety among advanced technology companies and forcing them to

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Robson, Mark, Kristin A. Fletcher, Ping Jiang, et al. "Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage." Solid State Phenomena 145-146 (January 2009): 339–42. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.339.

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In semiconductor processing, test wafers are used as particle monitors, film thickness monitors for deposition and oxide growth measurements, dry/wet etch rate monitors, CMP monitors, as well as characterizing new and existing equipment and processes. Depending on fab size and capacity, monthly test wafer usage can be tens of thousands or more. Due to the ever increasing demand for silicon between the IC and solar markets and the high cost of 300mm wafers, chip manufacturers are increasing their efforts to reduce overall spending on silicon - currently by far the largest non equipment related

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Srikanth Kamath, H., Sreelakshmi ., Muthyala Siri Chandana Reddy, and Chelsea Camilo Monteiro. "Overview of Device-to-Device Communication and Vehicle-to-Vehicle Communication." International Journal of Engineering & Technology 7, no. 4.36 (2018): 859. http://dx.doi.org/10.14419/ijet.v7i4.36.24546.

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5G (5th generation mobile networks or 5th generation wireless systems) is the next major phase of mobile telecommunications standards beyond the current 4G LTE (Long-Term Evolution) standards. 5G technology needs to be specified, developed, and deployed by a variety of industry players including network equipment vendors, network operators, semiconductor vendors, and device manufacturers. The scope of 5G will range from mobile phones to next-generation automobiles. Device to Device (D2D) Communication is regarded as a promising technology in 5G to provide low power, high data rate and low late

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Zhao, Jian Wei, Xin Chun Lu, and Yong Yong He. "The Model of Transfer Robot in Chemical Mechanical Polishing." Advanced Materials Research 647 (January 2013): 867–74. http://dx.doi.org/10.4028/www.scientific.net/amr.647.867.

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Transfer robot of chemical mechanical polishing (TRCMP) has some joints. For an important kind of special transfer robot, it is used as automatic material processing equipment in the semiconductor manufacture. The TRCMP has nonlinear, strongly coupled, multi-joints and under actuated, and these characteristics brought some difficulties to model and control. A dynamic model of the TRCMP was based on Lagrange equation and Newton dynamics theory. Then linearization of the dynamics model was done and its state-space equations were established. This structure of the model established is very simple

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Tseng, Hsien Wei, Yang Han Lee, Chao Chung Huang, Liang Yu Yen, and Yih Guang Jan. "Implemented LDO Chip With Output Capacitors Free." Applied Mechanics and Materials 284-287 (January 2013): 2521–25. http://dx.doi.org/10.4028/www.scientific.net/amm.284-287.2521.

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In this paper the process of implementing a low dropout regulator (LDO) chip is presented; it is using uses Taiwan Semiconductor TSMC’s Manufacture Inc. 0.35um 2P4M process. The circuit designed with the described process can be is operated at 3-5V input voltage to generate 2.5V output voltage. Maximum output current can be running up to 200mA. This LDO is implemented without placing output capacitors to reduce BOM (Bill of Material) cost and stable between 0~200mA loading current and the chip is stable when the loading current is in the range 0~200mA. [8] The new proposed LDO chip can be impl

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Emorhokpor, Ejiro, E. P. Carlson, Jian Wei Wan, et al. "Comparison between Measurement Techniques Used for Determination of the Micropipe Density in SiC Substrates." Materials Science Forum 527-529 (October 2006): 443–46. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.443.

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Micropipe density (MPD) is a crucial parameter for silicon carbide (SiC) substrates that determines the quality, stability and yield of the semiconductor devices built on these substrates. The importance of MPD is underscored by the fact that all existing specifications for 6H- and 4H-SiC substrates set upper limits for it. Several methods for measuring the MPD are known, however, their reliability and applicability to various types of substrates (e.g. semiinsulating, conducting, etc.) has not been systematically studied. The subject of this paper is a comparative study of various techniques u

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Kukurudziak, M. S., and Yu G. Dobrovolsky. "Silicon p-i-n photodiode with increased pulse sensitivity." Технология и конструирование в электронной аппаратуре, no. 1-2 (2021): 61–67. http://dx.doi.org/10.15222/tkea2021.1-2.61.

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P-n junction semiconductor photodetectors are widely used in various fields of science and technology, including automation and telecontrol, instrumentation equipment, tracking systems, guidance, etc. The most demanded photoelectronic devices are silicon p-i-n photodiodes (PD). Their main field of application are installations using laser beams of near IR optical radiation spectrum, λ = 1060 nm, in particular. The article provides considerations and limit requirements for production of high-responsivity silicon p-i-n photodiodes and making theoretical parameters consistent with real photodiode

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Zhang, A. Z., S. A. Reshanov, Adolf Schöner, et al. "Planarization of Epitaxial SiC Trench Structures by Plasma Ion Etching." Materials Science Forum 821-823 (June 2015): 549–52. http://dx.doi.org/10.4028/www.scientific.net/msf.821-823.549.

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In this work, we present a planarization concept for epitaxial SiC trench structures involving reactive ion etching (RIE) and inductive coupled plasma (ICP) dry etching. The general idea is to transfer the flat surface from spun-on BCB/photo-resist layers to deposited silicon dioxide and finally to bulk SiC by applying process conditions with the same etch rate for the different materials. In this way several microns of unwanted material can be removed and planar SiC surfaces are obtained. With this method trench structures filled by epitaxial re-growth can be planarized with smooth surfaces a

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SHELEKHOV, IGOR’ YU, IGOR V. ALTUKHOV, and OCHIROV VADIM. "ENERGY-EFFICIENT DESIGN OF AN INSTANTANEOUS WATER HEATER." Elektrotekhnologii i elektrooborudovanie v APK 4, no. 41 (2020): 3–8. http://dx.doi.org/10.22314/2658-4859-2020-67-4-3-8.

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Water supply for agricultural enterprises differs from water supply for industrial enterprises. Depending on the technological process, it is necessary to provide water of the appropriate quality with the required temperature. Because agricultural production consumes a large amount of heated water and it has a periodic nature, the use of classical water heating devices is impractical due to low efficiency. (Research purpose) The research purpose is in studying the energy efficiency of a flow-through water heaters of various designs. (Materials and methods) Authors reviewed the heating elements

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Chen, Kuen Ren, and Hong Tsu Young. "Estimation of Dressing Effects in Chemical Mechanical Polishing with Sorts of Diamond Dressers." Advanced Materials Research 76-78 (June 2009): 175–80. http://dx.doi.org/10.4028/www.scientific.net/amr.76-78.175.

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Chemical mechanical polishing (CMP) is a semiconductor process that is used to achieve global planarization. To maintain the stability and the throughput of CMP, the polishing pad needs to be dressed by a diamond dresser. By calculating the distribution of the scratch numbers of diamond grits in the pad, the effect of dressing can be estimated and the pad profile can be predicted. All the parameters of dressing motion were taken into account. The target equipment of this study is Mirra Mesa, which is manufactured by Applied Materials. Different types of dressers, including ring-types and full-

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De Oliveira, Marcus Vinicius Linhares, Wilson Otto Gomes Batista, Maria Rosângela Soares, and Paulo Sergio Flores Campos. "Air kerma area product in cone beam computed tomography." Revista de Ciências Médicas e Biológicas 13, no. 3 (2015): 309. http://dx.doi.org/10.9771/cmbio.v13i3.12936.

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<p class="MsoNormal" style="margin-bottom: 0.0001pt; text-align: justify;"><strong><em><span style="font-size: 12.0pt; font-family: &quot;Times New Roman&quot;,&quot;serif&quot;; mso-ansi-language: EN-US;" lang="EN-US">Objective:</span></em></strong><em><span style="font-size: 12.0pt; font-family: &quot;Times New Roman&quot;,&quot;serif&quot;; mso-ansi-language: EN-US;" lang="EN-US"> to evaluate the influence of FOV in air kerma-area product (KAP) and the constancy of exposure parameters on cone beam computed

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Sutherland, Ewan. "The strange case of US v. ZTE: a prosecution, a ban, a fine and a presidential intervention." Digital Policy, Regulation and Governance 21, no. 6 (2019): 550–73. http://dx.doi.org/10.1108/dprg-04-2019-0029.

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Purpose The purpose of this paper is to review the prosecution by US authorities of Zhongxing Telecommunication Equipment (ZTE) Corporation for its violation of sanctions against the sale of systems to Iran and North Korea; the violation of the plea agreement; and, following presidential intervention, the imposition of a further fine and restructuring of its management. Design/methodology/approach An analysis of the materials used in court proceedings and speeches by officials in the case against ZTE Findings The US president intervened in a quasi-judicial matter in which a foreign firm had vi

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Yi, Anning, and Hongtao Guo. "Research and design of grid connection and waste heat utilization of marine generating units." E3S Web of Conferences 165 (2020): 06003. http://dx.doi.org/10.1051/e3sconf/202016506003.

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This work is based on the use of waste heat from the temperature difference semiconductor heat exchanger, which can effectively use the waste heat in the exhaust gas, and convert it into electrical energy output through the temperature difference semiconductor material, which can increase engine efficiency and reduce energy consumption; at the same time, it can reduce engine noise and vibration. Extended service life. Due to the strong electromagnetic interference and severe vibration of the generator, there are few remote control devices on the market for the generator. This project uses a 2.

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Zängle, Clara, Markus Pfeffer, Peter Franze, Germar Schneider, and Anton Bauer. "Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines." Solid State Phenomena 314 (February 2021): 34–40. http://dx.doi.org/10.4028/www.scientific.net/ssp.314.34.

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Contamination control is essential in semiconductor manufacturing to ensure high yield and product quality. Latest power electronic devices are manufactured in fully automated 300 mm production lines, which utilize closed wafer containers called Front Opening Unified Pods (FOUPs). It has been observed, that FOUPs capture airborne molecular contaminants (AMC) outgassing from processed wafers or being transferred from the equipment minienvironment. These AMC might be released afterwards and can lead to defects causing yield and/or reliability issues of the power devices. Specific FOUP cleaning a

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Hrihorenko, I., S. Hrihorenko, and I. Nosova. "Development and Research of the System for Control of Parameters of Manufacture of Halva Technological Process." Metrology and instruments, no. 5 (October 24, 2019): 41–48. http://dx.doi.org/10.33955/2307-2180(5)2019.41-48.

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The paper considers the solution of the scientific and practical problem of improving the system of control of the parameters of the technological process of halva production from the creation of the structural scheme to the development of the electrical circuit diagram. The results of direct multiple measurements obtained from the control system, namely the humidity and temperature sensor (SHT21), have been processed. The equations of direct and inverse regression were constructed and the nature of the relationship between temperature and humidity was established using the pair correlatio

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Et. al., Wan Faizal Mohamed-Hassan. "Assessment Of Cl 2 /CHF 3 Mixture For Plasma Etching Process On Barc And Tin Layer For 0.21 µm Metal Line: Silterra Case Study." Turkish Journal of Computer and Mathematics Education (TURCOMAT) 12, no. 4 (2021): 231–39. http://dx.doi.org/10.17762/turcomat.v12i4.499.

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In wafer fabrication manufacturing, aluminum etching process is a dry plasma etching process used as main process for construction of aluminum (Al) interconnects structures. As customer requirement changed for faster, more reliable and lower cost chips, chip manufacturers have learned to reduce the size of component on a chip in order to achieve those requirements(Ibrahim, Chik, & Hashim, 2016). As the geometry of the chip getting smaller, the width of Al line wiring specification also shrinking. To print the smaller geometry pattern requirement, the thickness in masking process also has t

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Sohn, Jea-Il, Su-Han Woo, and Taek-Won Kim. "Assessment of logistics service quality using the Kano model in a logistics-triadic relationship." International Journal of Logistics Management 28, no. 2 (2017): 680–98. http://dx.doi.org/10.1108/ijlm-09-2015-0172.

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Purpose The purpose of this paper is to evaluate logistics service quality using the Kano’s service quality model in the logistics-triadic context. Design/methodology/approach This study undertakes a survey research in semiconductor manufacturing equipment (SME) industry. Logistics service quality is categorized using Kano’s classification and a comparison is made of the perception of three sample groups who are SME firms, semiconductor manufacturers (SMs) and third-party logistics (TPL) providers. Findings Several attributes of logistics service quality are evaluated as “Must-be” quality whic

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Jin, Howard (Hwail), Kewei Xu, Loreto Naungayan, and Jose Quinones. "High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package." International Symposium on Microelectronics 2016, no. 1 (2016): 000326–31. http://dx.doi.org/10.4071/isom-2016-wp41.

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Abstract Power semiconductor package manufactures and electronic device suppliers have been looking for Pb-free alternative to traditional high Pb solder die attach adhesives. Lead solders have high thermal conductivity, 30–50W/mK, and known process with some difficulties in high volume mass production such as void, bond line control, and requiring reducing atmosphere such as forming gas. Lead is now categorized as hazardous substance to human body and environment and its products are scheduled to be banned within a few years. Standard silver epoxy pastes and Electrically Conductive Adhesives

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Stephan, Dominik. "Glass-Insulated Bonding Wire Scales to Support advances in Miniaturization." International Symposium on Microelectronics 2012, no. 1 (2012): 000414–18. http://dx.doi.org/10.4071/isom-2012-tp45.

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The semiconductor industry is facing a major challenge today – it must adapt to the constant need to miniaturize, and in order to accommodate this major trend the entire ecosystem must adapt and evolve. While the current standard materials and tools make it possible to scale down to a certain level, it is simply not enough. Although there are efforts to make smaller wires, wire makers, wire drawing equipment and tool makers are working toward a boundary of existing methods. When wire diameter is successfully reduced, more issues correlated with wire uniformity and production control of the low

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Takeuchi, Yoshimi. "Message from Editor-in-Chief." International Journal of Automation Technology 1, no. 1 (2007): 3. http://dx.doi.org/10.20965/ijat.2007.p0003.

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On behalf of the editorial committee of International Journal of Automation Technology, I would like to sincerely ask all of you a favour of me to activate this journal since I am convinced that the automation technology is indispensable to the convenience and prosperity of human being. The automation technology began with the development and introduction of numerical control (NC) machine tools in the latter of 1950s. In 1960s, the technology was applied to assemble electric goods and automobiles together with the development of a wide variety of automationrelated methods such as industrial ro

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Wu, Hou Ya, Tie Niu Yang, and Xiao Jun Wang. "Researches of Pressure Measurement Method in Vacuum Environment." Applied Mechanics and Materials 347-350 (August 2013): 19–23. http://dx.doi.org/10.4028/www.scientific.net/amm.347-350.19.

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wafer processing is one process of the IC industry which is a booming area nowadays, the quality of the production of this course depends on the performance of the film which is formed by deposition. And one of the most important factors influencing the performance is working pressure. Variable structure chamber for flowing experiment and testing which is a multifunction testing platform with changeable structure and sufficient measurement points all-covered the chamber, a device has been designed and manufactured to measure and research vacuum flow filed. By using this equipment, the pressure

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"Air Products acquires majority interest in Korea's leading specialty gas equipment manufacturer for the semiconductor industry." Microelectronics International 16, no. 2 (1999). http://dx.doi.org/10.1108/mi.1999.21816bab.008.

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Abu-Samah, Asma, Muhammad Kashif Shahzad, Eric Zama¨ı, and St´ephane Hubac. "Effective Maintenance by Reducing Failure-Cause Misdiagnosis in Semiconductor Industry (SI)." International Journal of Prognostics and Health Management 6, no. 1 (2020). http://dx.doi.org/10.36001/ijphm.2015.v6i1.2241.

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Increasing demand diversity and volume in semiconductor industry (SI) have resulted in shorter product life cycles. This competitive environment, with high-mix low-volume production,requires sustainable production capacities that can be achieved by reducing unscheduled equipment breakdowns. The fault detection and classification (FDC) is a well-known approach, used in the SI, to improve and stabilize the production capacities. This approach models equipment as a single unit and uses sensors data to identify equipment failures against product and process drifts. Besides its successful deploymen

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Sunday, Daniel F., Wen-li Wu, Scott Barton, and R. Joseph Kline. "X-ray Metrology for the SemiconductorIndustry Tutorial." Journal of Research of the National Institute of Standards and Technology 124 (February 1, 2019). http://dx.doi.org/10.6028/jres.124.003.

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The semiconductor industry is in need of new, in-line dimensional metrology methods with higherspatial resolution for characterizing their next generation nanodevices. The purpose of this short course is to train the semiconductor industry on the NIST-developed critical dimension small angle X-ray scattering (CDSAXS) method. The topics will include both data processing and instrumentation. The short course will also provide an opportunity for discussion of the requirements for CDSAXS and the necessary improvements in X-ray source technology. Expected audience include semiconductor manufacturer

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"Compound semiconductor equipment manufacturers perform well in VLSI survey." III-Vs Review 16, no. 6 (2003): 31. http://dx.doi.org/10.1016/s0961-1290(03)00777-4.

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Reid, Kimberly G., and A. R. Sitaram. "High Temperature Thermal Processing for Ulsi Applications." MRS Proceedings 387 (1995). http://dx.doi.org/10.1557/proc-387-201.

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AbstractThe diversity of semiconductor manufacturing as well as the decreasing thermal budget for ULSI devices has driven semiconductor equipment manufacturers to develop and improve thermal processing solutions. Recent advances include new temperature measurement systems for rapid thermal processors (RTP), the development of the small batch fast ramp furnace (SBFR), as well as improved capability and load size in the conventional vertical batch furnace (BF). This paper will review the RTP, SBFR, and batch furnace for typical atmospheric front end of the line applications. Throughput and cycle

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Fury, Michael A. "Interconnection Challenges of the 1990'8." MRS Proceedings 260 (1992). http://dx.doi.org/10.1557/proc-260-703.

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ABSTRACTSilicon device performance has improved dramatically over the past two decades. During that time, the portion of total circuit delay attributable to interconnect wiring has increased to nearly half. Changes in the use of aluminum wiring and silicon oxide insulators must be considered to further improve performance.The generation of ULSI circuitry now under development in the industry depends heavily on innovations in materials and processes to achieve significant improvements in wiring density and circuit performance. The subsequent generation places even greater demands on materials i

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"Estimation of Residual Lifetime of Electrolytic Capacitor using Analytical Techniques." International Journal of Recent Technology and Engineering 8, no. 2 (2019): 2015–19. http://dx.doi.org/10.35940/ijrte.b2082.078219.

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Abstract:

In the fast-evolving era of digital electronics, reliability has become a critical issue. Due to failure and faults, the component manufacturers face market reputation degradation as well as financial set back. The condition monitoring for power electronics are based on basic principles; however, by analyzing failure modes of semiconductor devices and exploring appropriate techniques, situation has been improved a lot. From toy to satellite, an electrolytic capacitor is mostly used as an important component. This paper enlightens the estimation of residual lifetime of electrolytic capacitor us

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