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Relevant bibliographies by topics / Semiconductor Equipment Manufacturing

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Academic literature on the topic 'Semiconductor Equipment Manufacturing'

Author: Grafiati

Published: 7 June 2025

Last updated: 16 July 2025

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Journal articles on the topic "Semiconductor Equipment Manufacturing"

1

Wen, Yuan Lin, M. D. Jeng, and Yi Sheng Huang. "Diagnosability of Semiconductor Manufacturing Equipment." Materials Science Forum 505-507 (January 2006): 1135–40. http://dx.doi.org/10.4028/www.scientific.net/msf.505-507.1135.

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Katsuma, Takashi. "Vacuum manipulator for semiconductor manufacturing equipment." Industrial Robot: An International Journal 29, no. 4 (2002): 324–28. http://dx.doi.org/10.1108/01439910210441119.

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Munirathinam, Sathyan, and Balakrishnan Ramadoss. "Predictive Models for Equipment Fault Detection in the Semiconductor Manufacturing Process." International Journal of Engineering and Technology 8, no. 4 (2016): 273–85. http://dx.doi.org/10.7763/ijet.2016.v6.898.

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Munirathinam, Sathyan, and Balakrishnan Ramadoss. "Predictive Models for Equipment Fault Detection in the Semiconductor Manufacturing Process." International Journal of Engineering and Technology 8, no. 4 (2016): 273–85. http://dx.doi.org/10.7763/ijet.2016.v8.898.

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Saxena, S., and A. Unruh. "Diagnosis of semiconductor manufacturing equipment and processes." IEEE Transactions on Semiconductor Manufacturing 7, no. 2 (1994): 220–32. http://dx.doi.org/10.1109/66.286857.

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Subrahmanyam, Kommisetti, Scott Singlevich, Paul Ewing, and Michael Johnson. "Detecting Arcing Events in Semiconductor Manufacturing Equipment." IEEE Transactions on Semiconductor Manufacturing 26, no. 4 (2013): 488–92. http://dx.doi.org/10.1109/tsm.2013.2283053.

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Baudoin, C. R., and J. P. Kantor. "Software engineering for semiconductor manufacturing equipment suppliers." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 17, no. 2 (1994): 230–43. http://dx.doi.org/10.1109/95.296404.

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Ye, Jiahui, Ahmed El Desouky, and Alaa Elwany. "On the applications of additive manufacturing in semiconductor manufacturing equipment." Journal of Manufacturing Processes 124 (August 2024): 1065–79. http://dx.doi.org/10.1016/j.jmapro.2024.05.054.

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Park, Do-Joon, and Shuzhi Liu. "A Study on the Economic Effects of U.S. Export Controls on Semiconductors to China." Korea International Trade Research Institute 19, no. 1 (2023): 129–42. http://dx.doi.org/10.16980/jitc.19.1.202302.129.

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Purpose – This study addresses the development of China’s semiconductor industry in the context of the U.S.-China trade conflict, and analyzes the impact on other industries. Design/Methodology/Approach – Based on the multi-regional input-output table industry splitting method, the electrical and electronic equipment manufacturing industry in the Asian Development Bank’s multi-regional input-output table (ADB-MRIO, 2019) is split into semiconductor and non-semiconductor industries, and the impact of U.S. export controls on China’s semiconductor exports on domestic and foreign economies is simulated and analyzed using the hypothesis extraction and hypothesis expansion methods. Findings – The United States has suffered more than China from US export controls on semiconductors to China, and the impact of U.S. export controls on U.S. GDP decreasing by at most 0.0124‰, and China’s GDP decreasing by at most 0.00089‰. Since Japan, Korea, and European countries have become China’s semiconductor import substitutes, they all benefit from U.S. export controls on China. Second, the most affected industries in China are the chemical products, metal products, wholesale, financial, and non-semiconductor industries in the electrical and electronic equipment manufacturing industry. Research Implications – China should adopt coping strategies such as deepening international exchanges, enhancing communication between China and the U.S., and strengthening its scientific and technological strength.

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Espadinha-Cruz, Pedro, Radu Godina, and Eduardo M. G. Rodrigues. "A Review of Data Mining Applications in Semiconductor Manufacturing." Processes 9, no. 2 (2021): 305. http://dx.doi.org/10.3390/pr9020305.

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For decades, industrial companies have been collecting and storing high amounts of data with the aim of better controlling and managing their processes. However, this vast amount of information and hidden knowledge implicit in all of this data could be utilized more efficiently. With the help of data mining techniques unknown relationships can be systematically discovered. The production of semiconductors is a highly complex process, which entails several subprocesses that employ a diverse array of equipment. The size of the semiconductors signifies a high number of units can be produced, which require huge amounts of data in order to be able to control and improve the semiconductor manufacturing process. Therefore, in this paper a structured review is made through a sample of 137 papers of the published articles in the scientific community regarding data mining applications in semiconductor manufacturing. A detailed bibliometric analysis is also made. All data mining applications are classified in function of the application area. The results are then analyzed and conclusions are drawn.

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Dissertations / Theses on the topic "Semiconductor Equipment Manufacturing"

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Scrivens, Jevin E. (Jevin Eugene). "A wireless robotic manipulator for semiconductor manufacturing equipment." Thesis, Massachusetts Institute of Technology, 1997. http://hdl.handle.net/1721.1/44897.

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Xu, Ruolin M. Eng Massachusetts Institute of Technology. "Restructuring inventory location at semiconductor equipment manufacturing plant." Thesis, Massachusetts Institute of Technology, 2017. http://hdl.handle.net/1721.1/113728.

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Thesis: M. Eng. in Advanced Manufacturing and Design, Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.<br>This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.<br>Cataloged from student-submitted PDF version of thesis.<br>Includes bibliographical references (page 108).<br>This thesis tackles the Supermarket (SMKT) material shortage problem at Varian Semiconductor Equipment and Associates (Varian), in a bid to improve the SMKTs On-Time Delivery. The SMKT is a sub-assembly area that creates intermediate assemblies in a multi-stage ion implanter production process. However, many sub- assemblies made in the SMKT are delivered late. When juxtaposed with Varians external suppliers, which have On-Time Delivery records of over 90%, the SMKTs average of 61% pales in comparison. SMKTs poor On-Time Delivery has been tied to production delays and rework downstream on the Flowline. From a large amount of data collected on-site, a SMKT material shortage problem is found to be the root cause of its unsatisfactory On-Time Delivery. Random supply shocks have resulted in material shortages, which in turn lead to late deliveries. The majority (i.e. 64%) of shortages is the result of having two inventory storage locations: SMKT and Varians Warehouse. To resolve the material shortage problem, Varian can consider consolidating its SMKT inventory to one single storage location, such as the Warehouse. This is expected to save Varian $467,488 per annum in labor hours and rent, free up 3,000 ft2 of production floor space for capacity expansion, and decrease cycle time of an oft-late sub-assembly called the Profiler by 11%. This is on top of eliminating the aforementioned 64% of shortages. The consolidation strategy will put Varian in a productive and competitive position to capitalize on the fast-growing semiconductor industry in the years ahead.<br>by Ruolin Xu.<br>M. Eng. in Advanced Manufacturing and Design

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Hacking, Robert G. (Robert Grant) 1971. "Outsourcing engineering design in a semiconductor equipment manufacturing company." Thesis, Massachusetts Institute of Technology, 2003. http://hdl.handle.net/1721.1/84357.

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Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2003.<br>Includes bibliographical references (p. 97-98).<br>by Robert G. Hacking.<br>S.M.<br>M.B.A.

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Van, Doren Matthew J. 1967. "Precision machine design for the semiconductor equipment manufacturing industry." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/11496.

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Müller, Luis Antonio 1969. "Modular semiconductor test, assembly & packaging manufacturing equipment design." Thesis, Massachusetts Institute of Technology, 1998. http://hdl.handle.net/1721.1/9840.

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Fong, Hui Ni Grace. "Improving and maintaining the operational efficiency of a semiconductor equipment manufacturing warehouse." Thesis, Massachusetts Institute of Technology, 2015. http://hdl.handle.net/1721.1/101336.

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Thesis: M. Eng. in Manufacturing, Massachusetts Institute of Technology, Department of Mechanical Engineering, 2015.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (pages 85-86).<br>The present work addresses an operational inefficiency problem at a semiconductor equipment manufacturing warehouse, Varian Semiconductors Associates and Equipment (VSEA). This problem is important because if unresolved, the warehouse is unable to meet the part delivery time target of 24 hours during the busy period. The downstream effects of the late part delivery are delayed production schedules and in the worst case scenario, a missed shipment to the customer, which is very costly. In order to improve the efficiency of the warehouse so as to consistently deliver parts on time, the picking efficiency needs to be enhanced. Parts are primarily picked from two types of storage locations - GL shelves and Vertical Lift Modules (VLMs). The picking efficiency can be improved by the simultaneous reduction in workload on GL and improvement in the VLM picking efficiency. The first part of this thesis focuses on improving the picking inefficiency at the VLMs by employing a more efficient picking method. From our time study, we find that the pick-and-consolidate (parallel picking) is more efficient than pick-and-pass (sequential picking). The average makespan time savings per order by pick-and-consolidate is 8% (20 minutes). The second part of this paper discusses what is required to maintain a high VLM picking efficiency. New metrics to measure the workload distribution of the VLMs and the average flow time per order are proposed. Three dynamic slotting methods that maintain a balanced workload distribution across the VLMs without the need for periodic review are also examined. The methods are evaluated based on how balanced is the workload distribution across the VLMs and the cost of implementation.<br>by Hui Ni Grace Fong.<br>M. Eng. in Manufacturing

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Rostami, Hamideh. "Equipment Behavior Modelling for Fault Diagnosis and Deterioration Prognosis in Semiconductor Manufacturing." Thesis, Lyon, 2018. http://www.theses.fr/2018LYSEM028.

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Les défauts de production dus aux variations dans le processus de fabrication et aux pannes inattendues des équipements rendent difficile la conservation d'un rendement élevé de production dans l'industrie de fabrication de semi-conducteurs. l'objectif de ce travail de thèse est de proposer un pronostic efficace du comportement des équipements ainsi qu'un diagnostic des pannes dans le processus de fabrication de semi-conducteurs. avec des capteurs plus performants, des proches efficaces basées sur des données sont proposées pour le pronostic et le diagnostic. pour le diagnostic, cette recherche applique d'abord la méthode de machines `a vecteurs de support (support vector machine) pour détecter les anomalies constatées dans les observations. la dynamique du processus normale est ensuite décomposée en différentes groupes par la méthode de partitionnement `a k -moyennes. l'analyse en composantes principales (acp) est utilisée pour modéliser chaque partie de la dynamique du processus. les empreintes de défaut peuvent enfin être extraites en consolidant les scénarios hors contrôle après avoir projeté les anomalies dans les modèles acp. en pronostic, une approche de modélisation et de surveillance de la dégradation des équipements pour le processus de fabrication par lots est développée avec deux objectifs : exploiter les données temporelles de détection et classification des fautes (fdc) pour caractériser le comportement des équipements et modéliser la tendance de détérioration avec les causes potentielles. la transformation en ondelettes discrète (dwt) décompose les données temporelles en composantes d'approximation détaillées afin de détecter deux types de détérioration provoquée par des variations au niveau macro et micro. les résultats montrent que les approches proposées permettent de prédire efficacement le comportement des équipements et de diagnostiquer la défaillance avec les causes premières<br>Moving toward advanced technologies requires the modern industries, in particular, the semiconductor, to keep their equipment at a high utilization level and lowenvironmental risk. production deficiencies such as process variations and unexpected equipment breakdowns have made it difficult (if not impossible) to stay at high-grade product yield and significant equipment utilization. in this thesis, the aim is to propose efficient equipment behavior prognosis, and equipment failure diagnosis approaches in batch manufacturing processes that are pervasive modes in today's semiconductor fab. with the advancement of sensor information technology, efficient data-driven approaches are proposed for both prognostic and diagnostic purposes. in the fault diagnosis, this research firstly applies the support vector machine (svm) classifier to detect the abnormal observations. the normal process dynamics are then decomposed into different clusters by k-means clustering. principal component analysis (pca) is used to model each part of the process dynamics. fault fingerprints can be extracted finally by consolidating the out of control scenarios after projecting the abnormal observations into the pca models. in prognostics, an equipment deterioration modeling and monitoring approach for batch processes is developed with two aims: exploiting the temporal fdc (fault detection and classification) data to characterize the equipment behavior and modeling the deterioration trend with the potential causes. by using the discrete wavelet transformation (dwt), the temporal data are decomposed into approximation and detail components to detect two types of deterioration caused by macro- and micro-level variations. several scenarios of case studies are conducted based on the practical dataset provided by a local IC maker. the results show that the proposed approaches can effectively prognose the equipment behavior and diagnose the equipment failure with the correct causes

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Voges, Jens P. (Jens Peter) 1972. "Supply chain design in the volatile semiconductor capital equipment industry." Thesis, Massachusetts Institute of Technology, 2002. http://hdl.handle.net/1721.1/44609.

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Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2002.<br>Includes bibliographical references (leaf 69).<br>As companies outsource more manufacturing and design responsibilities to external vendors and therefore become less vertically integrated, the role of supply chain management becomes increasingly complex. Its role is particularly difficult when product generation follows a serial process flow, with the supply chain function residing at the end and where it inherits poorly defined supplier relationships. A more integrated approach that seeks to proactively design the supply chain during product generation is required. Central to this integrated approach is the timely exchange of information both within the company, between R&D and procurement, and external to the company, between procurement and its suppliers. The timing of the information flow is crucial. It needs to occur before the company is locked into a single supplier and when its bargaining power is the highest. It also needs to occur in a manner that does not slow down the product development process. In practice, that means that specific information needs to be exchanged and committed to prior to supplier selection. Ultimately, the information exchange described in this thesis leads to improved supplier relations that enable the company to shift its procurement practices from the tactical approach of buying materials to the strategic approach of buying supply services. The research for this thesis was conducted at a partner company of the Leaders for Manufacturing (LFM) program. The company manufactures test equipment used in the semiconductor industry. Due to the highly cyclical and unpredictable nature of this industry, supply chains that can guarantee responsiveness and availability are desirable. The supply chain design recommendations proposed in this thesis are based on an analysis of a recent product generation program at the company. By continuing to implement these recommendations, the company should benefit from shorter product development cycle times, smoother production ramps, improved customer service levels and lower sourcing costs.<br>by Jens P. Voges.<br>S.M.<br>M.B.A.

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Silber, Jacob B. (Jacob Bradley). "Improving reuse of semiconductor equipment through benchmarking, standardization, and automation." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/37235.

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Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2006.<br>Includes bibliographical references (p. 91-92).<br>The 6D program at Intel® Corporation was set up to improve operations around capital equipment reuse, primarily in their semiconductor manufacturing facilities. The company was faced with a number of challenges, including differing work flows across multiple locations, lack of centralized work flow management, discontinuous inventory information, and other opportunities for cost reduction. The internship was set up to benchmark and explore potential for integration of best known methods, accumulated both inside and outside the company. Based on interviews, research and quantitative analysis, opportunities were identified for reuse of equipment shipping crates, improvement in warehouse inventory management, and changes in labor models to facilitate better knowledge capture and dissemination. As a result of this study Intel® Corporation may realize significant improvement in the areas mentioned in terms of cost reduction, process improvement and knowledge management. By using a flexible approach to problem identification and generating organizational interest in the improvements, recommendations were well received and should lead to eventual adoption.<br>by Jacob Silber.<br>S.M.<br>M.B.A.

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Zhang, Yuwen M. Eng Massachusetts Institute of Technology. "Operational improvement at a mass customization semiconductor equipment manufacturing facility through inventory consolidation." Thesis, Massachusetts Institute of Technology, 2017. http://hdl.handle.net/1721.1/113730.

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Thesis: M. Eng. in Advanced Manufacturing and Design, Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.<br>This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.<br>Cataloged from student-submitted PDF version of thesis.<br>Includes bibliographical references (page 77).<br>This thesis addresses the operational improvement at Varian Semiconductor Equipment and Associates (Varian), a subsidiary of Applied Materials (AMAT), through material shortage reduction. Varian manufactures highly customized implantation equipment. Sub-assemblies that form an implantation tool are manufactured in the supermarket at Varian. The company is currently trying to increase the on-time delivery of sub-assemblies from the supermarket. Around 40% of sub-assemblies are delivered late to the tool production flow line or to the AMAT global parts banks and customers. This project focused on the improvement of supermarket on-time delivery. Impact analysis was conducted to assess the significance of the late delivery to the overall operation at Varian. Root causes of late delivery were identified through extensive data collection and three proposals were created: re-evaluation of inventory bin sizes, consolidation of inventory storage and assignment of priority based on real-time capacity. The second approach was further divided into two directions. This thesis emphasizes on one of the two directions, addressing the storage space required in the warehouse for inventory consolidation and the new material picking process. Various issues associated with the implementation were considered and solutions were proposed. Material shortages can be reduced by 64%, while pick-to-short kits are reduced by 50%. Supplier on-time delivery issues and purchase order placement should be investigated to further decrease material shortages.<br>by Yuwen Zhang.<br>M. Eng. in Advanced Manufacturing and Design

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Books on the topic "Semiconductor Equipment Manufacturing"

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United States. International Trade Administration. Assistant Secretary for Trade Development. Office of Microelectronics and Instrumentation. Science and Electronics., ed. A Competitive assessment of the U.S. semiconductor manufacturing equipment industry. Science and Electronics, Office of Microelectronics and Instrumentation, Assistant Secretary for Trade Development, 1985.

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Lane, Greg. Mr. Lean buys and transforms a manufacturing company: The true story of profitably growing an organization with lean principles. Productivity Press, 2010.

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Lane, Greg. Mr. Lean buys and transforms a manufacturing company: The true story of profitably growing an organization with lean principles. Productivity Press, 2010.

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B, Fletcher William, United States. Congress. Senate. Committee on Finance., and United States International Trade Commission., eds. Global competitiveness of U.S. advanced-technology manufacturing industries: Semiconductor manaufacturing and testing equipment : report to the Committee on Finance, United States Senate, on Investigation no. 332-303 under Section 332(g) of the Tariff Act of 1930. U.S. International Trade Commission, 1991.

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LEOS, Summer Topical Meetings (2000 Aventura Fla ). 2000 digest of the LEOS Summer Topical Meetings: Electronic-enhanced optics, optical sensing in semiconductor manufacturing, electro-optics in space, broadband optical networks, 24-28 July, 2000, Turnberry Isle Resort & Club, Aventura, FL. IEEE, 2000.

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Lane, Greg. Mr. Lean buys and transforms a manufacturing company: The true story of profitably growing an organization with lean principles. Productivity Press, 2010.

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Society, IEEE Computer, and Institute of Electrical and Electronics Engineers. Philadelphia Section, eds. Integration of test with design and manufacturing: International Test Conference, 1987, proceedings, September 1, 2, 3, 1987. IEEE Computer Society Press, 1987.

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International Test Conference (18th 1987 Washington, D.C.). Integration of test with design and manufacturing: Proceedings : International Test Conference, 1987, September 1,2,3, 1987, Sheraton Washington Hotel, Washington, D.C. Computer Society Press of the IEEE, 1987.

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IEEE/CPMT International Electronics Manufacturing Technology Symposium (22nd 1998 Berlin, Germany). Twenty second IEEE/CPMT International Electronics Manufacturing Technology Symposium: IEMT-Europe 1998 : electronics manufacturing and development for automotives, April 27th-29th, 1998, Berlin, Germany. IEEE, 1998.

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O, Barclay Rebecca, Kennedy John M, United States. National Aeronautics and Space Administration., and United States. Dept. of Defense., eds. NASA/DoD aerospace knowledge diffusion research project.: Results of the phase 1 mail survey--manufacturing and production perspective. National Aeronautics and Space Administration, 1996.

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Book chapters on the topic "Semiconductor Equipment Manufacturing"

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Wen, Yuan Lin, M. D. Jeng, and Yi Sheng Huang. "Diagnosability of Semiconductor Manufacturing Equipment." In Materials Science Forum. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-990-3.1135.

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Lv, Xin, Yeliang Wang, and Guangquan Lv. "Advanced Electromagnetic Compatibility Research for Semiconductor Manufacturing Equipment Based on a Multi-level Suppression Structure." In Lecture Notes in Electrical Engineering. Springer Nature Singapore, 2025. https://doi.org/10.1007/978-981-96-1395-3_20.

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Hidaka, Atsushi, Satoru Yamashita, Naoki Tanahashi, et al. "The Degradation Prevention of Resin Materials for Semiconductor Manufacturing Equipment by Applying the Ultra-High Purity Gas Supply Technology." In Solid State Phenomena. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/3-908451-06-x.255.

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Tatsumoto, Hirofumi. "Key Factors in the Success of Platform Strategy in Global Ecosystems: An Empirical Study on the Semiconductor Manufacturing Equipment Industry." In Platform Strategy for Global Markets. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-6789-0_4.

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Dhudshia, Vallabh H. "Equipment Reliability." In Handbook of Semiconductor Manufacturing Technology. CRC Press, 2017. http://dx.doi.org/10.1201/9781420017663-22.

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Dhudshia, Vallabh. "Equipment Reliability." In Handbook of Semiconductor Manufacturing Technology, Second Edition. CRC Press, 2007. http://dx.doi.org/10.1201/9781420017663.ch22.

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Fisher, Wayne G. "Equipment Cleaning to Minimize Particle Deposition." In Particle Control for Semiconductor Manufacturing. Routledge, 2018. http://dx.doi.org/10.1201/9780203744307-24.

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Donovan, R. P. "Measurement of Particle Emission Rates From Equipment." In Particle Control for Semiconductor Manufacturing. Routledge, 2018. http://dx.doi.org/10.1201/9780203744307-14.

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"Process and Equipment Diagnosis." In Fundamentals of Semiconductor Manufacturing and Process Control. John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/0471790281.ch10.

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Tullis, B. "Clean Equipment Design Rules and the Smif Isolation Concept." In Particle Control for Semiconductor Manufacturing. Routledge, 2018. http://dx.doi.org/10.1201/9780203744307-17.

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Conference papers on the topic "Semiconductor Equipment Manufacturing"

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Blue, Jakey, Dean Chu, and Stéphane Dauzère-Pérès. "Predictive Equipment State Based on Hidden Markov Model and Production Plan." In 2024 International Symposium on Semiconductor Manufacturing (ISSM). IEEE, 2024. https://doi.org/10.1109/issm64832.2024.10874870.

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Chen, Chieh-Yu, Shi-Chung Chang, and Da-Yin Liao. "Unsupervised and Spectral Feature-Based Sensor Relation Identification for Advanced Equipment Anomaly Detection *." In 2024 International Symposium on Semiconductor Manufacturing (ISSM). IEEE, 2024. https://doi.org/10.1109/issm64832.2024.10874987.

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Ye, Weiwen, Bingchun Jiang, Jing Feng, and Xianzhou Hou. "Research on precision machining technology of semiconductor testing equipment parts." In Third International Conference on Advanced Materials and Equipment Manufacturing (AMEM 2024), edited by Michele Penza and Shunli Wang. SPIE, 2025. https://doi.org/10.1117/12.3069422.

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Lin, Kuan-Chun, Yu-Chi Liao, Cheng-Wei Wu, and Shi-Chung Chang. "Proactive Control Setting of Real Time Equipment Monitoring for Raising End-of-Line Process Capability Performance^*." In 2024 International Symposium on Semiconductor Manufacturing (ISSM). IEEE, 2024. https://doi.org/10.1109/issm64832.2024.10874970.

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Korabi, T. E., G. Goossen, A. Kaushik, et al. "General Framework for Processing Time Prediction and Machine Availability for all Fab Equipment." In 2025 36th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2025. https://doi.org/10.1109/asmc64512.2025.11010438.

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Fujii, Hiromichi T., Shingo Matsumura, Naoki Sakaguchi, Haruyasu Ohno, and Kotaro Ona. "Exceptional dimensional stability of non-ferromagnetic Invar alloy for advanced semiconductor manufacturing equipment." In International Conference on Extreme Ultraviolet Lithography 2024, edited by Joern-Holger Franke, Kurt G. Ronse, Paolo A. Gargini, Patrick P. Naulleau, and Toshiro Itani. SPIE, 2024. http://dx.doi.org/10.1117/12.3034312.

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Harbison, D. R. "ISSM Equipment Standardization Panel." In International Symposium on Semiconductor Manufacturing. IEEE, 1993. http://dx.doi.org/10.1109/issm.1993.670302.

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Lemnios, Z. J. "Flexible Intelligent Process Equipment." In International Symposium on Semiconductor Manufacturing. IEEE, 1993. http://dx.doi.org/10.1109/issm.1993.670304.

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Gyurcsik, Ronald S., W. C. Lamb, and James R. Moyne. "Sensor bus control networks in semiconductor processing equipment." In Microelectronic Manufacturing, edited by Anant G. Sabnis. SPIE, 1994. http://dx.doi.org/10.1117/12.186781.

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Singlevich, S., and K. V. R. Subrahmanyam. "Detecting arcing events in semiconductor manufacturing equipment." In 2012 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2012. http://dx.doi.org/10.1109/asmc.2012.6212877.

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Reports on the topic "Semiconductor Equipment Manufacturing"

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Hunt, Will, Saif Khan, and Dahlia Peterson. China’s Progress in Semiconductor Manufacturing Equipment. Center for Security and Emerging Technology, 2021. http://dx.doi.org/10.51593/20190018.

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To reduce its dependence on the United States and its allies for semiconductors, China is building domestic semiconductor manufacturing facilities by importing U.S., Japanese, and Dutch semiconductor manufacturing equipment. In the longer term, it also hopes to indigenize this equipment to replace imports. U.S. and allied policy responses to China’s efforts will significantly affect its prospects for success in this challenging task.

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2

Khan, Saif M. U.S. Semiconductor Exports to China: Current Policies and Trends. Center for Security and Emerging Technology, 2020. http://dx.doi.org/10.51593/20200039.

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The United States has long used export controls to prevent the proliferation of advanced semiconductors and the inputs necessary to produce them. With Beijing building up its own chipmaking industry, the United States has begun tightening restrictions on exports of semiconductor manufacturing equipment to China. This brief provides an overview of U.S. semiconductor export control policies and analyzes the impacts of those policies on U.S.-China trade.

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3

Li, Ya-Shian, and Brad Van Eck. Semiconductor factory and equipment clock synchronization for e-manufacturing. National Institute of Standards and Technology, 2004. http://dx.doi.org/10.6028/nist.ir.7184.

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4

Barbe, Andre, and Will Hunt. Preserving the Chokepoints. Center for Security and Emerging Technology, 2022. http://dx.doi.org/10.51593/20210045.

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Offshoring the production of semiconductor manufacturing equipment would remove an important source of leverage over China and make the United States more dependent on other countries for some of the most important inputs to semiconductor manufacturing. This brief explores the factors driving U.S. SME firms to offshore production and what can be done to slow or reverse offshoring.

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5

Herbold, Eric, and Ajey Joshi. Simulating Properties of Metal Powder Beds Used for Additive Manufacturing of Parts in Semiconductor, Solar and Display Equipment, CRADA Final Report No. TC02261. Office of Scientific and Technical Information (OSTI), 2019. http://dx.doi.org/10.2172/1631830.

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6

Peck, H., and I. Gomez. Simulating Properties of Metal Powder Beds Used for Additive Manufacturing of Parts in Semiconductor, Solar and Display Equipment Final Report CRADA No. TC02261 Date Technical Work Ended: 7/31/19. Office of Scientific and Technical Information (OSTI), 2021. http://dx.doi.org/10.2172/1771433.

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