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Relevant bibliographies by topics / Semiconductors; IC manufacture

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Academic literature on the topic 'Semiconductors; IC manufacture'

Author: Grafiati

Published: 4 June 2021

Last updated: 3 February 2022

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Journal articles on the topic "Semiconductors; IC manufacture"

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Zhang, Yuqian. "The Application of Third Generation Semiconductor in Power Industry." E3S Web of Conferences 198 (2020): 04011. http://dx.doi.org/10.1051/e3sconf/202019804011.

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With the rapid development of technologies, the third generation semiconductor is being studied, as it is leading to the significant change in industry like the manufacture of PC, mobile devices, lighting etc. Till now, due to its irreplaceable physical characteristics, third generation semiconductor is applied to lots of fields. This paper analyzes the application of third generation semiconductor, namely, GaN and SiC. Their characteristics including advantages as well as disadvantages will be discussed through reviewing the result of relevant researches. Meanwhile, comparison between the thi

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Roberts, Bob. "Technology Transfer for MEMS and Advanced Packaging: Precision Surface Preparation Innovatively Applied to Emerging Technologies." International Symposium on Microelectronics 2017, no. 1 (2017): 000231–41. http://dx.doi.org/10.4071/isom-2017-wa33_004.

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Abstract The purpose of this presentation is to examine how certain mainline silicon substrate and semiconductor wafer manufacturing processes, can be and are being applied to applications in the manufacture of some of the most advanced digital devices including advanced packaging applications. Periodically, the manufacturing steps and procedures of advanced semiconductor devices have changed dramatically enough that they are termed “paradigm shifts.” Two of the more dramatic manufacturing paradigm shifts in our professional lifetimes have been Precision Ultra-Thinning, and Chemical Mechanical

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Iwase, N., and J. Ewanich. "AIN LGAs for High Performance Packaging Applications." Microelectronics International 14, no. 3 (1997): 5–7. http://dx.doi.org/10.1108/13565369720195261.

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Because they offer many properties favourable for IC package construction, ceramics have been in widespread use as an electronic package material since the early 1960s. In recent years, with trends towards higher speed semiconductors generating up to 30‐40 watts power, packaging materials must possess excellent thermal, electrical and mechanical properties. Aluminium nitride, with a thermal conductivity of 170 W/m.K., high fracture strength and a thermal coefficient of expansion match with silicon, has been used to manufacture multilayer LGA (land grid array) packages for high performance appl

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Krylov, V. P., and A. M. Bogachev. "Deep Trapping Centers Relaxation in Transistors and Integrated Circuits." Proceedings of Universities. ELECTRONICS 25, no. 6 (2020): 568–72. http://dx.doi.org/10.24151/1561-5405-2020-25-6-568-572.

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For ensuring the efficiency of the semiconductor electronic component base for apparatus, responsible for application, an optimal combination of statistical (group) and physical-technological (individual) reliability assessments is required. In the paper a thermodynamic approach, based on the deep-level transient spectroscopy in semiconductors promising means of individual rejection of potentially unreliable electronic component base has been proposed. For transistors and integrated circuits, the dependences of the amplitude of capacitance transient, caused by the bulk and surface defects of v

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Kibarian, J. K., and A. Strojwas. "Using spatial information to analyze correlations between test structure data (semiconductor IC manufacture)." IEEE Transactions on Semiconductor Manufacturing 4, no. 3 (1991): 219–25. http://dx.doi.org/10.1109/66.85943.

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van Borkulo, Jeroen, Richard van der Stam, and Guido Knippels. "Multi Beam Full Cut Dicing of Thin Si IC Wafers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 001446–74. http://dx.doi.org/10.4071/2015dpc-wp21.

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The ongoing trend to thinner wafers which are needed for continuous miniaturization, 3D packaging and IC performance, inevitably means that sole blade dicing evolution is coming to an end. Over the last years several technologies to handle the separation process of thin Si wafer dicing have been evaluated (DBG, Stealth, Plasma, etc). Although they are capable for certain applications to meet the process specifications, they achieve this at expense of flexibility, productivity and process costs. ALSI, the inventor of multi beam dicing for semiconductor materials, has developed a technology usin

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Irmansyah, Muhammad. "PENGIMPLEMENTASIAN TEKNOLOGI PROGRAMMABLE LOGIC DEVICE (PLD) SEBAGAI BINER CODE DECIMAL (BCD) UNTUK SCANNING KEYPAD." Elektron : Jurnal Ilmiah 5, no. 1 (2018): 9–18. http://dx.doi.org/10.30630/eji.5.1.38.

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Industrial of electronics developed in many fields in the middle of 1990s. Base on this situation, the manufacturer produce the product by increased the function, display, low cost, low power consumption and small size. This kind of product must be supported by complex system, small number of integrated circuit and tiny printed circuit board (PCB). Many integrated technologies such as submicron semiconductor, PCB technology, and the using of PCB surface maximal. The market situation push the producer used modern technology in design and testing for example Programmable Logic Device (PLD). It i

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Richards, J. F., and R. J. Kline. "Applications of Scanned Probe Microscopy in the Integrated Circuit Fabrication Industry." Microscopy and Microanalysis 5, S2 (1999): 956–57. http://dx.doi.org/10.1017/s1431927600018109.

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Scanning Probe Microscopy (SPM), in particular Atomic Force Microscopy (AFM), has become well establish member of the IC metrology tool arsenal which few IC manufacturers are without. Although Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) remain the “workhorse” metrology techniques, SPM (standard AFM, as well as Scanning Capacitance Microscopy (SCM), Scanning Spreading Resistance Microscopy (SSRM), Scanning Kelvin probe, Nanoindentaion and others) are being increasingly called upon to help solve IC production problems and to aid in research and development for n

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Han, Kwonsang, Hyungseup Kim, Jaesung Kim, et al. "A 24.88 nV/√Hz Wheatstone Bridge Readout Integrated Circuit with Chopper-Stabilized Multipath Operational Amplifier." Applied Sciences 10, no. 1 (2020): 399. http://dx.doi.org/10.3390/app10010399.

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This paper proposes a low noise readout integrated circuit (IC) with a chopper-stabilized multipath operational amplifier suitable for a Wheatstone bridge sensor. The input voltage of the readout IC changes due to a change in input resistance, and is efficiently amplified using a three-operational amplifier instrumentation amplifier (IA) structure with high input impedance and adjustable gain. Furthermore, a chopper-stabilized multipath structure is applied to the operational amplifier, and a ripple reduction loop (RRL) in the low frequency path (LFP) is employed to attenuate the ripple genera

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De Souza, Rafael Navarenho, Marcilei A. Guazzelli, and Salvador P. Gimenez. "Mitigating MOSFET Radiation Effects by Using the Wave Layout in Analog ICs Applications." Journal of Integrated Circuits and Systems 10, no. 1 (2015): 30–37. http://dx.doi.org/10.29292/jics.v10i1.402.

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This paper presents an experimental comparative study of the Total Ionizing Dose (TID) effects between the Metal-Oxide-Semiconductor (MOS) Field Effect Transistors (MOSFET) manufactured with the Wave (S gate geometry) and the standard layout (CnM). Because of the special geometric characteristic of the gate, drain and source regions of the Wave MOSFET (WnM), this innovative layout proposal for transistors is able to mitigate the TID effects in order to implement in analog integrated circuits (IC) for space and medical applications without causing any additional cost to the Complementary MOS (C

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Dissertations / Theses on the topic "Semiconductors; IC manufacture"

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Khaleque, Ferdouse. "E-beam lithography and dry processing for submicron fabrication." Thesis, Imperial College London, 1990. http://hdl.handle.net/10044/1/46389.

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Yin, L., and 尹良. "Strategic Analysis of Semiconductor Alliance- One case with IC Manufacturer." Thesis, 1995. http://ndltd.ncl.edu.tw/handle/90493458694877822743.

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碩士<br>國立交通大學<br>工業工程研究所<br>83<br>In view of the development direction of our total economics in the future, the hi-tech industries will become the propellant in promoting the growth of manufacturing business. The integrated circuit industry is especially potential. The size of our integrated circuit industry is relatively smaller when compared to those major integrated manufacturers in U. S. A. or Japan, but through the assistance and

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Hsu, Han-Chi, and 徐漢圻. "The Research of Semiconductor Equipment Manufacturers Brand Loyalty – From the Perspective of Taiwan IC Suppliers." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/54jbpt.

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碩士<br>國立交通大學<br>管理學院科技管理學程<br>102<br>This research mainly focuses on the factors which affect the brand loyalty of semiconductor equipment manufacturers from the perspectives of Taiwan IC suppliers. Five major operational variables (service quality, product value, customer relationship management, brand image and brand trust) are created to investigate the research based on the studies of domestic and foreign journals. The Structural Equation Modeling (SEM) is implemented to identify the influence on the brand loyalty among these five major operational variables. The research questionnaires ar

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Lo, Mei Chen, and 羅美珍. "The Competitive Advantages of Semiconductor Industry In Taiwan ---A Study On Business Strategy of Integrated Circuit (IC) Manufacturers." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/63450708357372475770.

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碩士<br>國立交通大學<br>科技管理研究所<br>86<br>ABSTRACT: Taiwan has the fourth largest IC manufacturing industry in the world, it takes no more than two decades as Taiwan developed its own IC manufacturing industry from nothing. Though the IC industry faces the global downturn in 1996﹑1997, Taiwan keep growing fast with its outstanding competence in profitability and production capability. To study the business strategies of local IC manufacturers is a very interesting and important subj

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Book chapters on the topic "Semiconductors; IC manufacture"

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Shen, Pei-Di, Tsang-Hsiung Lee, Chia-Wen Tsai, and Yi-Fen Chen. "The Different Key Processes in the Implementation of Knowledge Management Among IC Designers, Distributors and Manufacturers." In E-Adoption and Socio-Economic Impacts. IGI Global, 2011. http://dx.doi.org/10.4018/978-1-60960-597-1.ch019.

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This study is an exploratory investigation of the enabling roles of knowledge management for integrated circuit (IC) Designers, Distributors, and Manufacturers. This study explores the different enabling roles in terms of knowledge creation, storage/retrieval, transfer and application when businesses implement knowledge management in upstream, midstream, and downstream firms in the IC industry. Three cases, Winbond, Worldpeace, and Taiwan Semiconductor Manufacturing Company (TSMC) were studied and analyzed systemically to illustrate the findings and insights in this study. The findings in this study point out that IC designers may focus more on knowledge storage, while IC distributors pay more attention to knowledge application and IC Manufacturers emphasize knowledge creation. The necessity to implement knowledge management in the distribution industry is also emphasized in this study. Moreover, the reasons for the different enabling roles are presented in the ‘Insights from Case Studies’ section of the paper.

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Conference papers on the topic "Semiconductors; IC manufacture"

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Hanming Wu, Jin Kang, Minhwa Chi, Xing Zhang, Tong Feng, and Poren. "The technology trend of IC manufacture during Post Moore's era." In 2017 China Semiconductor Technology International Conference (CSTIC). IEEE, 2017. http://dx.doi.org/10.1109/cstic.2017.7919812.

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Hung, Y. H., K. C. Yu, and C. P. Huang. "Management of Semiconductor Manufacture--A Discussion on Multi-class Classification of Imbalanced Structure of IC Package Database." In 2011 International Symposium on Computer Science and Society (ISCCS). IEEE, 2011. http://dx.doi.org/10.1109/isccs.2011.97.

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Hong, Yong. "Detection of a Counterfeit OTA Device and Certification of a Replacement Source." In ISTFA 2011. ASM International, 2011. http://dx.doi.org/10.31399/asm.cp.istfa2011p0234.

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Abstract The counterfeiting of semiconductor devices has become an important contributor as more components are used in the increasingly sophisticated audio and navigation systems while more suppliers are moving manufacturing plants off-shore. This paper presents a case study on how the authors were able to identify a counterfeit device and certify a replacement source. In this study, failed devices with Intersil CA3080 Operational Transductance Amplifier IC from factory testing and field returns in suspect lot codes were purchased from a second source, due to the unavailability of the obsolet

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Kim, Y. J., J. H. Yeo, J. I. Choi, C. S. Kim, and M. M. Jeong. "Effective Backside Circuit Edit Methods for CSP IC." In ISTFA 2018. ASM International, 2018. http://dx.doi.org/10.31399/asm.cp.istfa2018p0219.

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Abstract In the semiconductor chip manufacturing industry, a method of evaluating characteristics by applying a direct circuit edit at an already manufactured chip level is widely used in order to shorten the product development time and release the product to the market in a short time. [1] This is because, when the fab process is performed by modifying the mask to improve the characteristics as in the conventional method, it takes a lot of time and cost for feedback. Feedback of semiconductor characteristics through circuit edit can save 10-20 times in terms of cost and time. As the process

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Weiland, R., C. Boit, B. Ebersberger, et al. "Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on FIB/Dual Beam Inline Application." In ISTFA 2000. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.istfa2000p0393.

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Abstract The step into the production line environment is a quantum leap for physical failure analysis (PFA) and will change its work in the near future. Wafer sacrifice for analysis becomes obsolete. The main benefits are: 1. reduction of wafer costs, 2. more splits per development lot, 3. reduced cycle time of analysis and technology development. Machines needed for that purpose are dual beam SEM/FIB tools. In the following we present solutions how PFA in a broad range can be carried out inside of a production line. The analyzed wafers can be fed back into the production flow which results i

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Cai, Qingjun, Avijit Bhunia, and Yuan Zhao. "High Heat Flux Phase Change on Silicon Wick Structures." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-88302.

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Silicon is the major material in IC manufacture. It has high thermal conductivity and is compatible with precision micro-fabrication. It also has decent thermal expansion coefficient to most semiconductor materials. These characteristics make it an ideally underlying material for fabricating micro/mini heat pipes and their wick structures. In this paper, we focus our research investigations on high heat flux phase change capacity of the silicon wick structures. The experimental wick sample is composed of silicon pillars 320μm in height and 30 ∼ 100μm in diameter. In a stainless steel test cham

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