Journal articles: 'Sensor microsystems'

1

Popovic, R. S., and J. A. Flanagan. "Sensor microsystems." Microelectronics Reliability 37, no. 9 (September 1997): 1401–9. http://dx.doi.org/10.1016/s0026-2714(97)00012-7.

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MOKWA, WILFRIED. "ADVANCED SENSORS AND MICROSYSTEMS ON SOI." International Journal of High Speed Electronics and Systems 10, no. 01 (March 2000): 147–53. http://dx.doi.org/10.1142/s0129156400000180.

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In the recent decade microsystem technologies (MST) have become a very important field. A lot of miniaturized sensors and microsystems based on silicon technologies have been developed and are in production now. Airbag control for example is mostly based on silicon acceleration sensors. Besides the existing products new products are emerging like drug delivery systems, labs on chip for DNA-analysis or electronic noses. Using SOI new sensor and actuator concepts have become possible. Dielectric insulation offers new possibilities concerning mechanical, thermal or electrical behavior. Microsensors for high temperature application including CMOS electronics are under development. This paper concentrates on SOI with silicon dioxide as insulating material. It will give examples of sensing and actuating devices based on SIMOX and on bonded wafer technology. In addition an example of a more complex microsystem, a retina implant system, will be given.

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Esashi, Masayoshi, and Shuji Tanaka. "Integrated Microsystems." Advances in Science and Technology 81 (September 2012): 55–64. http://dx.doi.org/10.4028/www.scientific.net/ast.81.55.

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Technology called MEMS (Micro Electro Mechanical Systems) or microsystems are heterogeneous integration on silicon chips and play important roles as sensors. MEMS as switches and resonators fabricated on LSI are needed for future multi-band wireless systems. MEMS for safety systems as event driven tactile sensor network for nursing robot are developed. Wafer level packaging for MEMS and open collaboration to reduce the cost for the development are discussed.

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Reutskaya, O. G., and Y. M. Pleskachevsky. "MEASUREMENT OF CO AND NO2 GAS CONCENTRATION'S BY MULTISENSOR MICROSYSTEM IN THE MODE OF PULSE HEATING." Devices and Methods of Measurements 8, no. 2 (June 9, 2017): 160–67. http://dx.doi.org/10.21122/2220-9506-2017-8-2-160-167.

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The most promising for mass use in gas analysis equipment are semiconductor gas sensors due to their high reliability, easy operation and relatively low cost. Power consumption in the single-sensor mode, constant heating is from 250 to 600 W average and in pulsed mode heating – ≤ 20 W. The aim of this work was to study the effectiveness of the pulsed heating for multisensor microsystems consisting of two sensors on the substrate of the nanostructured aluminum oxide, compared with the mode of constant heating.For sensitive layers were chosen compositions: SnO2+Pt+Pd at the first sensor of the microsystem and In2O3+Al2O3+Pt on the second. Measuring the sensor response in the pulse heating mode was carried out as follows. Power on each sensor microsystem was installed 1.3 mW. Then the short-term heating (theat.. = 5 s) was performed at the power 61 mW. The detected gases CO and NO2 with the concentration 200 ppm and 4 ppm, correspondingly, were submitted to the microsystem after 15 minutes. The resistance values for each of the sensor were fixed. According to the results determine the sensitivity (sensor response) the maximum value is after 60 s for the sensor with a sensing layer SnO2+Pt+Pd when exposed to CO was 670 %, and for the sensor with In2O3+Al2O3+Pt – 380 %.Advantages of using pulsed heating from the point of view of a power consumption multisensor microsystem mW-range and high performance sensors on substrates of nanostructured alumina were established.

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Peterson, K. A., K. D. Patel, C. K. Ho, B. R. Rohrer, C. D. Nordquist, B. D. Wroblewski, and K. B. Pfeifer. "LTCC Microsystems and Microsystem Packaging and Integration Applications." Journal of Microelectronics and Electronic Packaging 3, no. 3 (July 1, 2006): 109–20. http://dx.doi.org/10.4071/1551-4897-3.3.109.

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Low Temperature Cofired Ceramic (LTCC) has proven to be an enabling medium for microsystem technologies, because of its desirable electrical, physical, and chemical properties coupled with its capability for rapid prototyping and scalable manufacturing of components. LTCC is viewed as an extension of hybrid microcircuits, and in that function it enables development, testing, and deployment of silicon microsystems. However, its versatility has allowed it to succeed as a microsystem medium in its own right, with applications in non-microelectronic meso-scale devices and in a range of sensor devices. Applications include silicon microfluidic ‘chip-and-wire’ systems and fluid grid array (FGA)/microfluidic multichip modules using embedded channels in LTCC, and cofired electro-mechanical systems with moving parts. Both the microfluidic and mechanical system applications are enabled by sacrificial volume materials (SVM), which serve to create and maintain cavities and separation gaps during the lamination and cofiring process. SVMs consisting of thermally fugitive or partially inert materials are easily incorporated. Screeding is an incorporation technique we describe that improves uniformity and eliminates processing steps. Recognizing the premium on devices that are cofired rather than assembled, we report on functional-as-released and functional-as-fired moving parts, including an impeller that has been exercised over thirty million cycles, and a cofired pressure sensor that requires only pressure source and electrical connections. Additional applications for cofired transparent windows, some as small as an optical fiber, are also described. The applications described help pave the way for widespread application of LTCC to biomedical, control, analysis, characterization, and radio frequency (RF) functions for macro-meso-microsystems.

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Wu, H., A. Emadi, G. de Graaf, J. Leijtens, and R. F. Wolffenbuttel. "Self-Powered Sun Sensor Microsystems." Procedia Chemistry 1, no. 1 (September 2009): 1363–66. http://dx.doi.org/10.1016/j.proche.2009.07.340.

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Kayal, M., and M. Pastre. "Automatic calibration of Hall sensor microsystems." Microelectronics Journal 37, no. 12 (December 2006): 1569–75. http://dx.doi.org/10.1016/j.mejo.2006.04.013.

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Bermudez, Juliette F., Juan F. Saldarriaga, and Johann F. Osma. "Portable and Low-Cost Respirometric Microsystem for the Static and Dynamic Respirometry Monitoring of Compost." Sensors 19, no. 19 (September 24, 2019): 4132. http://dx.doi.org/10.3390/s19194132.

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Composting is considered an option for the disposal of organic waste; however, the development of portable and low-cost systems for its monitoring is of high interest. Therefore, in this study, respirometric microsystems were designed and tested including two integrated oxygen sensors for the measurement of compost samples under static and dynamic conditions with high portability and ease of use. The cost of each sensor was calculated as 2 USD, while the cost of the whole respirometric microsystem was calculated as 6 USD. The electronic system for real-time monitoring was also designed and implemented. The designed systems were tested for over 6 weeks for the determination of compost quality using real samples. The respirometric microsystem was compared to a commercial respirometry system and a standard laboratory test using hierarchical analysis which included costs, portability accuracy, analysis time, and integration of new technologies. The analysis showed a global score of 6.87 for the respirometric microsystem compared to 6.70 for the standard laboratory test and 3.26 for the commercial system.

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French, Paddy. "In-Vivo Microsystems: A Review." Sensors 20, no. 17 (September 1, 2020): 4953. http://dx.doi.org/10.3390/s20174953.

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In-vivo sensors yield valuable medical information by measuring directly on the living tissue of a patient. These devices can be surface or implant devices. Electrical activity in the body, from organs or muscles can be measured using surface electrodes. For short term internal devices, catheters are used. These include cardiac catheter (in blood vessels) and bladder catheters. Due to the size and shape of the catheters, silicon devices provided an excellent solution for sensors. Since many cardiac catheters are disposable, the high volume has led to lower prices of the silicon sensors. Many catheters use a single sensor, but silicon offers the opportunity to have multi sensors in a single catheter, while maintaining small size. The cardiac catheter is usually inserted for a maximum of 72 h. Some devices may be used for a short-to-medium period to monitor parameters after an operation or injury (1–4 weeks). Increasingly, sensing, and actuating, devices are being applied to longer term implants for monitoring a range of parameters for chronic conditions. Devices for longer term implantation presented additional challenges due to the harshness of the environment and the stricter regulations for biocompatibility and safety. This paper will examine the three main areas of application for in-vivo devices: surface devices and short/medium-term and long-term implants. The issues of biocompatibility and safety will be discussed.

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Bartsch de Torres, H., C. Rensch, M. Fischer, A. Schober, M. Hoffmann, and J. Müller. "Thick film flow sensor for biological microsystems." Sensors and Actuators A: Physical 160, no. 1-2 (May 2010): 109–15. http://dx.doi.org/10.1016/j.sna.2010.04.010.

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Barrettino, D., M. Graf, S. Taschini, S. Hafizovic, C. Hagleitner, and A. Hierlemann. "CMOS Monolithic Metal–Oxide Gas Sensor Microsystems." IEEE Sensors Journal 6, no. 2 (April 2006): 276–86. http://dx.doi.org/10.1109/jsen.2006.870156.

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12

Daniel, M., M. Janicki, W. Wroblewski, A. Dybko, Z. Brzozka, and A. Napieralski. "Ion selective transistor modelling for behavioural simulations." Water Science and Technology 50, no. 11 (December 1, 2004): 115–23. http://dx.doi.org/10.2166/wst.2004.0679.

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Computer aided design and simulation of complex silicon microsystems oriented for environment monitoring requires efficient and accurate models of ion selective sensors, compatible with the existing behavioural simulators. This paper concerns sensors based on the back-side contact Ion Sensitive Field Effect Transistors (ISFETs). The ISFETs with silicon nitride gate are sensitive to hydrogen ion concentration. When the transistor gate is additionally covered with a special ion selective membrane, selectivity to other than hydrogen ions can be achieved. Such sensors are especially suitable for flow analysis of solutions containing various ions. The problem of ion selective sensor modelling is illustrated here on a practical example of an ammonium sensitive membrane. The membrane is investigated in the presence of some interfering ions and appropriate selectivity coefficients are determined. Then, the model of the whole sensor is created and used in subsequent electrical simulations. Providing that appropriate selectivity coefficients are known, the proposed model is applicable for any membrane, and can be straightforwardly implemented for behavioural simulation of water monitoring microsystems. The model has been already applied in a real on-line water pollution monitoring system for detection of various contaminants.

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13

Puers, Robert. "Sensor, sensor interfacing and front-end data management for stand-alone microsystems." Journal of Micromechanics and Microengineering 9, no. 2 (January 1, 1999): R1—R7. http://dx.doi.org/10.1088/0960-1317/9/2/201.

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14

Islam, Akm Anwarul, Frank Li, and Phaneendra K. Kolli. "Structural Health Monitoring of Bridges Using Wireless Sensor Network." Applied Mechanics and Materials 82 (July 2011): 796–803. http://dx.doi.org/10.4028/www.scientific.net/amm.82.796.

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The objective of this research is to monitor the structural health of an urban bridge real-time in the City of Youngstown, OH, by applying new technologies involving acceleration sensors, wireless networks, internet web services, Java SunSPOTs and embedded systems. The research was aimed to assessing the current structural health and future performance of the bridge with any immediate repair or replacement needs. A total of 8 wireless accelerometer Java SunSPOT Sensors, developed by Sun Microsystems (now part of Oracle), were customized and deployed at structurally critical locations on the bridge. Acceleration data were collected via real-time wireless sensor network. Later the acceleration data were analyzed to assess the structural condition of the bridge.

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Althainz, P., A. Dahlke, M. Frietsch-Klarhof, J. Goschnick, and H. J. Ache. "Reception tuning of gas-sensor microsystems by selective coatings." Sensors and Actuators B: Chemical 25, no. 1-3 (April 1995): 366–69. http://dx.doi.org/10.1016/0925-4005(95)85082-1.

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Schönecker, Andreas, and Sylvia Gebhardt. "Microsystems Technologies for Use in Structures and Integrated Systems." Advances in Science and Technology 56 (September 2008): 76–83. http://dx.doi.org/10.4028/www.scientific.net/ast.56.76.

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Piezoceramics are considered as key functional material in micro systems and smart structure technology. Showing superior mechanical, dielectric, pyroelectric, ferroelectric and piezoelectric properties they introduce improved functionality, e.g. sensing, actuation, energy harvesting, health monitoring or shape control. Various applications such as micro integrated valves, drives, voltage converter, piezoelectric, pyroelectric and ultrasound sensors are expected. Another field of application concerns active structures in space, automotive or machine building industry. Progress was achieved by combining flexible board and piezo technology which opens up a new class of reliable ready to use actuator and sensor modules. Tailored design and packaging are seen as key factors for progress in custom applications. Load carrying structures with embedded actuators, sensors and electronics, which are usually pre-integrated in modules, offer the opportunity for noise reduction, vibration and shape control and health monitoring. The present paper summarizes the potential of advanced, microsystems compatible piezotechnology for active structures and systems. The focus will be given to PZT film and fibre processing and the integration in silicon wafer, ceramic multilayer and polymer matrix architectures. Finally, forward-looking applications are highlighted.

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Vigna, Benedetto. "Sensor Integration: Feynman or Moore?" Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (January 1, 2019): 000001–51. http://dx.doi.org/10.4071/2380-4491-2019-dpc-keynote1_vigna.

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Sensors are all around us: they are in cars, in smartphones, in factories, in pacemakers, in drones, in smart speakers and in many other places with the ultimate goal to sense and to monitor parameters of importance and interest in our daily environment. They play an essential bridge between electronic systems and the user or environment. Today they already enable a multibillion dollar industry and they continue to create new business opportunities in many markets, such as automotive, consumer and personal electronics. Most importantly they are the enablers of emerging applications in Healthcare Industry and Industrial Internet of Things. There is no doubt that sensors will leave a sign in the new generation of home and factory robots, the autonomous cars, enabled by Artificial Intelligence. Thanks to their high reliability, high performances and low manufacturing cost, the most commercially successfull sensors available today are realized in silicon (i.e. Image Sensors and MEMS) and they use the same manufacturing techniques of the CMOS industry, whose evolution has been dictated by the famous G. Moore's law. Since the market for silicon sensors has been much smaller than overall semiconductor industry, sensors have been always classified as part of the so called “More than Moore” world. There are many books, article and publications on “More than Moore” subject, but considering the strong contribution to the sector given by the visionary Nobel Prize P. R. Feynman, envisioning the possibility to miniaturize the microsystems and to stack specialized silicon wafers to realize a complex versatile microsystem, time is come to see the Sensors as part of the “Feynman Roadmap” instead of “More than Moore” roadmap. After an extensive look-back over the current situation, this talk will address the future challenges of “Feynman Roadmap.”

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Slosarčík, Stanislav, Igor Vehec, Alexander Gmiterko, Pavol Cabúk, and Michal Jurčišin. "Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and Microsystems." Journal of Microelectronics and Electronic Packaging 6, no. 3 (July 1, 2009): 158–63. http://dx.doi.org/10.4071/1551-4897-6.3.158.

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This paper deals with shaping technology of LTCC (low temperature cofired ceramics) and as well on analysis of the possibilities of sensors in 3D shaped modules. Analysis of marginal possibilities of LTCC ceramic shaping was realized on a sample with various bending angles and various layer numbers, where thick-film conductive paths were present. The applicability of the obtained results was demonstrated by the development of a 3D shaped module with a thick-film pressure sensor.

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Panas, Robert M., Michael A. Cullinan, and Martin L. Culpepper. "Design of piezoresistive-based MEMS sensor systems for precision microsystems." Precision Engineering 36, no. 1 (January 2012): 44–54. http://dx.doi.org/10.1016/j.precisioneng.2011.07.004.

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20

Burian, E., D. Pogany, T. Lalinský, N. Seliger, and E. Gornik. "Thermal simulation and characterization of gaas micromachined power-sensor microsystems." Sensors and Actuators A: Physical 68, no. 1-3 (June 1998): 372–77. http://dx.doi.org/10.1016/s0924-4247(98)00072-7.

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Stockmann, M., J. Naumann, J. Schumann, and I. Mönch. "Differential Strain Gauge: A Sensor Device for Macro- and Microsystems." Strain 47 (December 30, 2008): e104-e112. http://dx.doi.org/10.1111/j.1475-1305.2008.00557.x.

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Dai, Keren, Xiaofeng Wang, Zheng You, and He Zhang. "Pressure Sensitivity Enhancement of Porous Carbon Electrode and Its Application in Self-Powered Mechanical Sensors." Micromachines 10, no. 1 (January 16, 2019): 58. http://dx.doi.org/10.3390/mi10010058.

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Microsystems with limited power supplies, such as electronic skin and smart fuzes, have a strong demand for self-powered pressure and impact sensors. In recent years, new self-powered mechanical sensors based on the piezoresistive characteristics of porous electrodes have been rapidly developed, and have unique advantages compared to conventional piezoelectric sensors. In this paper, in order to optimize the mechanical sensitivity of porous electrodes, a material preparation process that can enhance the piezoresistive characteristics is proposed. A flexible porous electrode with superior piezoresistive characteristics and elasticity was prepared by modifying the microstructure of the porous electrode material and adding an elastic rubber component. Furthermore, based on the porous electrode, a self-powered pressure sensor and an impact sensor were fabricated. Through experimental results, the response signals of the sensors present a voltage peak under such mechanical effects and the sensitive signal has less clutter, making it easy to identify the features of the mechanical effects.

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Arney, Susanne. "Designing for MEMS Reliability." MRS Bulletin 26, no. 4 (April 2001): 296–99. http://dx.doi.org/10.1557/mrs2001.63.

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Microelectromechanical systems (MEMS) devices are being manufactured in the hundreds of millions and are widely deployed for pressure sensor, accelerometer, display, and printing applications. This suggests customer confidence in the longterm reliability of MEMS (also known as microsystems or micromachines) under diverse stringent conditions.

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Fries, David, Liesl Hotaling, Geran Barton, Stan Ivanov, Michelle Janowiak, and Matt Smith. "PCBMEMS as a Flexible Path to Devices and Systems across Spatial Scales." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (January 1, 2011): 000597–634. http://dx.doi.org/10.4071/2011dpc-ta24.

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PCB technology based on both rigid and flexible laminates is desirable for miniaturization of mobile devices and systems. The technology provides substantial flexibility in systems design. The ability to use flexible microsystems allows new sensing systems for mobile applications. Using this design, fabrication and construction approach allows lightweight, complex, and space efficient systems. Flex microsystems based on structurable, non-fiber filled laminates permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday objects. The macro scale systems further allows ultra large systems with high resolution features permitting novel sensor systems. Examples will be given where the technology has enabled devices, systems and packaging innovation across several spatial scales. Mobile (environmental, medical, portable, embedded) sensor systems all can be realized using this design and fabrication toolbox.

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Mujeeb-U-Rahman, Muhammad, Dvin Adalian, and Axel Scherer. "Fabrication of Patterned Integrated Electrochemical Sensors." Journal of Nanotechnology 2015 (2015): 1–13. http://dx.doi.org/10.1155/2015/467190.

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Fabrication of integrated electrochemical sensors is an important step towards realizing fully integrated and truly wireless platforms for many local, real-time sensing applications. Micro/nanoscale patterning of small area electrochemical sensor surfaces enhances the sensor performance to overcome the limitations resulting from their small surface area and thus is the key to the successful miniaturization of integrated platforms. We have demonstrated the microfabrication of electrochemical sensors utilizing top-down lithography and etching techniques on silicon and CMOS substrates. This choice of fabrication avoids the need of bottom-up techniques that are not compatible with established methods for fabricating electronics (e.g., CMOS) which form the industrial basis of most integrated microsystems. We present the results of applying microfabricated sensors to various measurement problems, with special attention to their use for continuous DNA and glucose sensing. Our results demonstrate the advantages of using micro- and nanofabrication techniques for the miniaturization and optimization of modern sensing platforms that employ well-established electronic measurement techniques.

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Boehme, Christian, Andreas Ostmann, and Martin Schneider-Ramelow. "Modular Microsystems with Embedded Components." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000735–39. http://dx.doi.org/10.4071/isom-2013-wp52.

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Each system is designed to fulfill the desired purpose. It is defined by its inputs, outputs, structure, environment, boundary, and the including elements (subsystems). Due to the ongoing miniaturization and integration the complexity of subsystems increases continuously. This paper is intended to demonstrate the build-up of modular Microsystems. By using the embedding technology, each subsystem (module) is interchangeable and stackable. Therefore, the functionality of the entire system depends solely on the selected modules. Moreover, the enhancement, expansion or redesign can be accomplished by replacing existing or adding new modules. The communication between the individual modules is based on the standardized I2C bus. Additionally, a USB interface has been implemented to manage the data transmission between the embedded camera module and a computer. The whole system recognizes each module and performs accordingly. The user can access sensor values, watch the video stream, and change the parameters of each module via a Graphical User Interface (GUI) on his computer. To achieve the build-up of the modular Microsystems we only used packaged active and passive components. Depending on the complexity of each module a core of up to eight layers is build up. The components are then soldered onto both sides of the core. At this point the components are embedded using a laminating press. The afterwards even surface is then structured again, to enable the stacking of the modules. Each step of the entire assembly process is done via state of the art circuit board processing technologies, including laser drill and laser-direct imaging.

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Kotyk, M. V., V. V. Dovgyi, I. T. Kogut, and V. I. Holota. "Schematic-Topological Modeling of the SOI CMOS Ring Oscillators for Sensor Microsystems on Chip." Фізика і хімія твердого тіла 19, no. 4 (December 25, 2018): 358–62. http://dx.doi.org/10.15330/pcss.19.4.358-362.

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The paper presents the results of research of frequency and energy characteristics of ring generators on the basis of siliconon-isolator of the CMOS transistor structures, depending on their circuit design and constructive and technological implementation, design and modeling of the schemes of the primary transformation of information from integral sensitive elements for sensor microsystems-on-crystal

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Nikitin, P. I., M. V. Valeiko, A. Yu Toporov, A. M. Ghorbanzadeh, and A. A. Beloglazov. "Deposition of thin ferromagnetic films for application in magnetic sensor microsystems." Sensors and Actuators A: Physical 68, no. 1-3 (June 1998): 442–46. http://dx.doi.org/10.1016/s0924-4247(98)00084-3.

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Llobet, E., P. Ivanov, X. Vilanova, J. Brezmes, J. Hubalek, K. Malysz, I. Gràcia, C. Cané, and X. Correig. "Screen-printed nanoparticle tin oxide films for high-yield sensor microsystems." Sensors and Actuators B: Chemical 96, no. 1-2 (November 2003): 94–104. http://dx.doi.org/10.1016/s0925-4005(03)00491-x.

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Aydin, N., T. Arslan, and D. R. S. Cumming. "A direct-sequence spread-spectrum communication system for integrated sensor microsystems." IEEE Transactions on Information Technology in Biomedicine 9, no. 1 (March 2005): 4–12. http://dx.doi.org/10.1109/titb.2004.837825.

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Yang, Chao, Sachin R. Jadhav, R. Mark Worden, and Andrew J. Mason. "Compact Low-Power Impedance-to-Digital Converter for Sensor Array Microsystems." IEEE Journal of Solid-State Circuits 44, no. 10 (October 2009): 2844–55. http://dx.doi.org/10.1109/jssc.2009.2028054.

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Fries, David, and Chase StarrGeran Barton. "2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURES." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 001012–45. http://dx.doi.org/10.4071/2014dpc-tp33.

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Macro sensor systems typically measure a localized space above a single sensor element. Expanding these single sensor elements into arrays permits spatial distribution measurements of a particular parameter and allow flux visualizations. Furthermore, applying microsystems technology to macro sensor systems yields imaging arrays and high resolution spatial/temporal sensing functions. Extending the high spatial resolution imaging over large areas is a desirable feature for new “vision” modes on autonomous robotic systems and for deployable environmental sensors. Rigid-flexible PCB's are desirable for miniaturization and integration of systems for mobile technology. The hybrid substrates provide substantial flexibility in systems design and integration of multiple functions into limited spaces. Using this design and construction approach allows lightweight, complex, and space efficient systems. Flex microsystems based on structured, fiber or non-fiber filled PCB laminates permits packaging to occur at two levels, at the local (micro) substrate scale and at the macro scale with the ability to flex the system across millimeter to centimeter lengths on real everyday systems. We continue to explore the use of PCB and PCBMEMS technology for new sensing concepts. In order to create rigid-conformal, large area imaging “camera” systems we have merged flexible PCB substrates with rigid constructions from 3D printing. This approach merges the 2D flexible electronics world of printed circuits with the 3D printed packaging world. Furthermore employing architectures used by biology as a basis for our imaging systems we explored naturally and biologically inspired designs, and their relationships to non-visible imagery, and alternate mechanical systems of perception. Radiolaria are extremely tiny ocean organisms that utilize a similar additive construction process to 3D printing. Their cell bodies secrete a substance mainly composed of silica to form intricate exoskeletons used as a system of protection. A correlation can be made between the radiolaria's construction process and the plastic extrusion system of the 3D fused deposition model printer. The benefits of additive construction are efficient use of materials, reduced cost and energy, and ability to customize forms. Through the use of bio-inspiration, a framework is laid out to base further research on (DFP)-design for packaging. Radiolarian exoskeletons take on a grid-like pattern while creating a cage around each microsensor interior and producing strong scaffolding. Using the 3D printed exoskeleton's form and function with flexible printed circuits one can create systems that are both rigid and form fitting with three-dimensional shape and enable new camera systems for various sensory applications.

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Hesselbach, J., K. Schöttler, R. Tutsch, and M. Berndt. "Assembly of Hybrid Microsystems Using an Assembly System with 3D Optical Sensor." CIRP Annals 55, no. 1 (2006): 11–14. http://dx.doi.org/10.1016/s0007-8506(07)60355-2.

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Arshak, K., E. Jafer, G. Lyons, D. Morris, and O. Korostynska. "A review of low‐power wireless sensor microsystems for biomedical capsule diagnosis." Microelectronics International 21, no. 3 (December 2004): 8–19. http://dx.doi.org/10.1108/13565360410549675.

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La Malfa, Francesco, Salvatore Puce, Francesco Rizzi, and Massimo De Vittorio. "A Flexible Carbon Nanotubes-Based Auxetic Sponge Electrode for Strain Sensors." Nanomaterials 10, no. 12 (November 27, 2020): 2365. http://dx.doi.org/10.3390/nano10122365.

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Soft compliant strain gauges are key devices for wearable applications such as body health sensor systems, exoskeletons, or robotics. Other than traditional piezoresistive materials, such as metals and doped semiconductors placed on strain-sensitive microsystems, a class of soft porous materials with exotic mechanical properties, called auxetics, can be employed in strain gauges in order to boost their performance and add functionalities. For strain electronic read-outs, their polymeric structure needs to be made conductive. Herein, we present the fabrication process of an auxetic electrode based on a polymeric nanocomposite. A multiwalled carbon nanotube/polydimethylsiloxane (MWCNT/PDMS) is fabricated on an open-cell polyurethane (PU) auxetic foam and its effective usability as an electrode for strain-gauge sensors is assessed.

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Mehmood, Zahid, Ibraheem Haneef, and Florin Udrea. "Material selection for optimum design of MEMS pressure sensors." Microsystem Technologies 26, no. 9 (October 30, 2019): 2751–66. http://dx.doi.org/10.1007/s00542-019-04601-1.

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Abstract Choice of the most suitable material out of the universe of engineering materials available to the designers is a complex task. It often requires a compromise, involving conflicts between different design objectives. Materials selection for optimum design of a Micro-Electro-Mechanical-Systems (MEMS) pressure sensor is one such case. For optimum performance, simultaneous maximization of deflection of a MEMS pressure sensor diaphragm and maximization of its resonance frequency are two key but totally conflicting requirements. Another limitation in material selection of MEMS/Microsystems is the lack of availability of data containing accurate micro-scale properties of MEMS materials. This paper therefore, presents a material selection case study addressing these two challenges in optimum design of MEMS pressure sensors, individually as well as simultaneously, using Ashby’s method. First, data pertaining to micro-scale properties of MEMS materials has been consolidated and then the Performance and Material Indices that address the MEMS pressure sensor’s conflicting design requirements are formulated. Subsequently, by using the micro-scale materials properties data, candidate materials for optimum performance of MEMS pressure sensors have been determined. Manufacturability of pressure sensor diaphragm using the candidate materials, pointed out by this study, has been discussed with reference to the reported devices. Supported by the previous literature, our analysis re-emphasizes that silicon with 110 crystal orientation [Si (110)], which has been extensively used in a number of micro-scale devices and applications, is also a promising material for MEMS pressure sensor diaphragm. This paper hence identifies an unexplored opportunity to use Si (110) diaphragm to improve the performance of diaphragm based MEMS pressure sensors.

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Debeda, Helene, Riadh Lakhmi, Valerie Pommier-Budinger, and Claude Lucat. "Study of Free-Standing Electroded PZT Thick-Films: From Materials to Microsystems." Key Engineering Materials 605 (April 2014): 55–58. http://dx.doi.org/10.4028/www.scientific.net/kem.605.55.

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Free-standing electroded piezoelectric PZT thick-lms are straightforward fabricatedthanks to the association of the low-cost screen-printing technology with the sacricial layermethod. Au/PZT/Au bridges are directly attached onto the alumina substrate on top of it theyare processed. In addition, completely released disks are also processed. A study of the behaviourof these components shows the inuence of both the releasing process and the densicationon the piezoelectric properties of the PZT layer. From the electromechanical measurements,electroded PZT cantilevers and disks are promising for actuator, sensor or SHM applications.

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Monti, Donato, Sara Nardis, Manuela Stefanelli, Roberto Paolesse, Corrado Di Natale, and Arnaldo D'Amico. "Porphyrin-Based Nanostructures for Sensing Applications." Journal of Sensors 2009 (2009): 1–10. http://dx.doi.org/10.1155/2009/856053.

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The construction of nanosized supramolecular hosts via self-assembly of molecular components is a fascinating field of research. Such intriguing class of architectures, beside their intrinsic intellectual stimuli, is of importance in many fields of chemistry and technology, such as material chemistry, catalysis, and sensor applications. Within this wide scenario, tailored solid films of porphyrin derivatives are structures of great potential for, among others, chemical sensor applications. The formation ofsupramoleculesrelays on noncovalent interactions (electrostatic, hydrogen bond, , or coordinative interactions) driven by the chemical information stored on the assembling molecules, such as shape and functional groups. This allows, for example, the formation of large well-defined porphyrin aggregates in solution that can be spontaneously transferred onto a solid surface, so achieving a solid system with tailored features. These films have been used, covering the bridge between nanostructures and microsystems, for the construction of solid-state sensors for volatiles and metal ion recognition and detection. Moreover, the variation of peripheral substituents of porphyrins, such as, for example, chiral appended functionalities, can result in the formation of porphyrin aggregates featuring high supramolecular chirality. This would allow the achievement of porphyrin layers characterised by different chiroptical and molecular recognition properties.

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Vykoukal, Daynene M, Gregory P Stone, Peter R C. Gascoyne, Eckhard U Alt, and Jody Vykoukal. "Quantitative Detection of Bioassays with a Low-Cost Image-Sensor Array for Integrated Microsystems." Angewandte Chemie International Edition 48, no. 41 (September 28, 2009): 7649–54. http://dx.doi.org/10.1002/anie.200901814.

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Vykoukal, Daynene M, Gregory P Stone, Peter R C. Gascoyne, Eckhard U Alt, and Jody Vykoukal. "Quantitative Detection of Bioassays with a Low-Cost Image-Sensor Array for Integrated Microsystems." Angewandte Chemie 121, no. 41 (September 28, 2009): 7785–90. http://dx.doi.org/10.1002/ange.200901814.

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Gebhardt, Sylvia, Dörthe Ernst, Bernhard Bramlage, Markus Flössel, and Andreas Schönecker. "Integrated Piezoelectrics for Smart Microsystems - A Teamwork of Substrate and Piezo." Advances in Science and Technology 77 (September 2012): 1–10. http://dx.doi.org/10.4028/www.scientific.net/ast.77.1.

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Microelectronic substrates like silicon, alumina and LTCC (Low Temperature Cofired Ceramics) allow for high robustness and reliability, 3D packaging (electrical connection, channels, cavities and membranes) as well as integration and application of electronic components whereas piezoceramic materials offer sensor and actuator operations. To combine the advantages of both, integrated solutions are of great interest. This paper deals with two approaches of monolithic integration, (i) screen printing of piezoceramic thick films on microelectronic substrates and subsequent post firing and (ii) integration of pre-fired piezoceramic components into green LTCC multilayer packages and subsequent sintering. Functionality of smart microsystems not only depends on the outer design and construction but to a great part on interaction of substrate and piezoceramic material properties. A thorough choice of materials as well as the understanding and prevention of chemical reactions are necessary to build effective systems.

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Zheng, Zongwei, Pengfei Niu, Xiaohe Wang, César Fernández-Sánchez, Yuan Ning, Lei Zhao, Menglun Zhang, Xuexin Duan, and Wei Pang. "Miniature Gigahertz Acoustic Resonator and On-Chip Electrochemical Sensor: An Emerging Combination for Electroanalytical Microsystems." Analytical Chemistry 91, no. 24 (November 21, 2019): 15959–66. http://dx.doi.org/10.1021/acs.analchem.9b04508.

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Pogany, D., N. Seliger, T. Lalinský, J. Kuzmík, P. Habaš, P. Hrkút, and E. Gornik. "Study of thermal effects in GaAs micromachined power sensor microsystems by an optical interferometer technique." Microelectronics Journal 29, no. 4-5 (April 1998): 191–98. http://dx.doi.org/10.1016/s0026-2692(97)00057-8.

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Qiu, Bin, Guangyong Li, Jianke Du, Aibing Zhang, and Yuan Jin. "A Numerical Model of a Perforated Microcantilever Covered with Cardiomyocytes to Improve the Performance of the Microcantilever Sensor." Materials 14, no. 1 (December 28, 2020): 95. http://dx.doi.org/10.3390/ma14010095.

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A few simple polymeric microsystems, such as microcantilever sensors, have recently been developed for the preliminary screening of cardiac toxicity. The microcantilever deflection produced by a change in the cardiomyocyte (CM) contraction force is important for understanding the mechanism of heart failure. In this study, a new numerical model is proposed to analyze the contractile behavior of CMs cultured on a perforated microcantilever surface for improving the performance of the microcantilever sensor. First, the surface traction model is used to investigate the bending displacement of the plain microcantilever. In order to improve the bending effect, a new numerical model is developed to analyze the bending behavior of the perforated microcantilever covered with CMs. Compared with the designed molds, the latter yields better results. Finally, a simulation analysis is proposed based on a finite element method to verify the presence of a preformed mold. Moreover, the effects of various factors on the bending displacement, including microcantilever size, Young’s modulus, and porosity factor, are investigated. Both the simulation and numerical results have good consistency, and the maximum error between the numerical and simulation results is not more than 3.4%, even though the porosity factor reaches 0.147. The results show that the developed mold opens new avenues for CM microcantilever sensors to detect cardiac toxicity.

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Bartsch de Torres, Heike, Christian Rensch, Torsten Thelemann, J. Müller, and M. Hoffmann. "Fully Integrated Bridge-Type Anemometer in LTCC-Based Microfluidic Systems." Advances in Science and Technology 54 (September 2008): 401–4. http://dx.doi.org/10.4028/www.scientific.net/ast.54.401.

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A thick film anemometer for in situ control of the flow rate in fluidic systems was designed, manufactured and characterized. The sensor is integrated in a retention modulus consisting of Low Temperature Cofired Ceramics (LTCC). These materials allow the cost-effective realisation of fluidic microsystems with integrated electronics. The challenge of the work is to design an anemometer under the exclusive use of thick film technologies. The necessity to trim resistors causes the external use of relevant pastes. Therefore, the use inside of a closed fluidic system requires the leak of process gases and, at the same time, a maximal heat-insulating of the sensor element from the substrate. Free-standing elements necessitate the control of stress due to shrinking mismatch, TCE mismatch, density gradients and deformation during the lamination. In the presented solution, embossed flue channels prevent blow forming on a free-standing bridge. The anemometer has a linear sensor characteristic for flow rates up to 0.1 ml/min. The layout guarantees that the fluid gets only in contact with the basic ceramic material, which is compatible with a wide range of biological substances. Therefore the sensor is applicable in contact with cell fluids or PCRreagents.

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Rouzaud, A., and G. Pares. "Interposers: A Central Generic Technology for IoT." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000014–19. http://dx.doi.org/10.4071/isom-2015-tp13.

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Also sometimes referred to as 2.5D integration, interposers are now a true and important component of the “3D world” based on die stacking technologies. Considered as an intermediate step in the field of high density die stacking (memory on logic, logic on logic, etc) this technology is on the other hand fully generic to manufacture heterogeneous systems which will constitute the basic of IoT (sensor with simple logic, RF capabilities and even energy harvesting). This paper presents first a short overview of the core technologies needed in this field. The versatility of these technical blocks, allowing to efficiently manufacture a large variety of interposer based devices, is then demonstrated through different subsystems related to IoT: sensors, passives, energy harvesters, RF communication. Some recent achievements in smart systems based on interposers mixing together passive components, microsystems and RF functions are then presented, and more particularly a system dedicated to short range high bandwidth communication for wireless HDMI and a system for implanted medical applications. In both cases, the gain in surface area is particularly important, making such solutions highly attractive.

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Koppert, Ralf. "NiC: a highly sensitive functional layer based on a nickel/graphene thin film for pressure and force sensors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (September 1, 2015): 000208–12. http://dx.doi.org/10.4071/cicmt-wp11.

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A functional layer based on nickel and graphene called NiC was developed with the goal of a high strain sensitivity in combination with an adjustable temperature coefficient of resistance (TCR). A gauge factor up to 30 and TCR values of approximately 0±25 ppm/K can be achieved by variation of the film composition. Based on the increased sensitivity the important pressure range of below 2.5 bar is opened up for steel membrane pressure sensors without the need of a sophisticated technical effort. First pressure and force sensors with NiC functional layers were realized in order to demonstrate the high performance of this new material. The enlarged sensitivity of the film leads to a complex re-development of the microsystems “pressure and force sensors” in order to take the advantage of the high linearity, low hysteresis, high overload protection and stability. Due to the high sensitivity, it is possible to produce sensors with significantly increased stability values in the overload region. Using the same output voltage range as usual with NiCr thin film elements, the overload capability of the sensors with the new functional layer is about twenty times the characteristic value of NiCr sensors. On the other hand, the low pressure range is opened up since the membrane needs to be deformed only one tenth of its usual value. Because of this low stress the load cycle stability increases accordingly. Additionally base body materials like 1.4435 (316L), which are not very suitable for the production of pressure sensor membranes, can be used for example for hydrogen applications.

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Sureshkannan, G., G. Mohan Kumar, and M. P. Saravanan. "Characterization and Experimental Investigation of Tin Micro Tubular Coil Heater Using Raman Spectroscopy." Archives of Metallurgy and Materials 58, no. 2 (June 1, 2013): 641–45. http://dx.doi.org/10.2478/amm-2013-0036.

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Raman spectroscopy is a commonly used tool in bio-diagnostics and micro sensor technology. Surface-enhanced Raman scattering provides high signal enhancements especially at micro and nanostructured metallic surfaces. Micro tubular coil heaters have been widely investigated because of their extensive applications in PET Preformed Moulds, Hot Runner Nozzles & Bushings and Thin Walled Container Moulds and other Microsystems. This paper describes the characterization, experimental investigation and analysis of Titanium Nitride (TiN) micro tubular coil heater using Raman spectroscopy and Comsol multiphysics. The material characterization was performed using Raman spectrometer and the geometric optimization for the micro tubular coil heater was performed by simulating a wide range of possible geometries using COMSOLTM, a commercial Finite Element Analysis (FEA) package. The characteristic dimensions of the microstructures are varied and the results are discussed and compared to each other. The simulated results of micro tubular heaters having an improved temperature distribution over the sensing area and a higher density of integration is presented in this paper.

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Gao, Zhiqiang, Ruixuan Wu, Yuteng Wang, Yuan Gao, Xiaowei Liu, and Jiaqi Zhu. "A low temperature drift coefficient crystal-less frequency reference clock compensated by temperature sensor for microsystem." International Journal of Modern Physics B 32, no. 12 (May 3, 2018): 1850146. http://dx.doi.org/10.1142/s0217979218501461.

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Quartz oscillator has been widely used as reference clock source in the microsystems due to its good performance. But a good crystal oscillator costs too much and its bulky size is not desired. This paper aims at designing an alternative integrated oscillator to replace the external quartz oscillator. The proposed circuit used maneatis delay cell to construct a ring oscillator for its superior linear I–V characteristic. As for a frequency reference clock, its frequency stability over temperature is required at first. After detailed mathematical deducing and careful analysis, a formula is proposed to describe the relationship between desired control voltage and temperature by assuming the frequency as constant. This paper utilized bipolar transistor as the temperature sensor, combining it with CTAT current source and resistor to create a first-order temperature compensation control voltage. The chip with typical frequency of 10 MHz was fabricated in a 0.35 [Formula: see text]m CMOS technology and occupied 0.45 mm2. The measured results show that the frequency variation is ±0.2% for supply changes from 4.8 V to 5 V, and frequency variation is 48 ppm when the temperature change is from −40[Formula: see text]C to 85[Formula: see text]C, while the average current of the tested chip consumes 50 [Formula: see text]A from 5 V.

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Pouchairet, Jean-Laurent, and Carole Rossi. "PyroMEMS as Future Technological Building Blocks for Advanced Microenergetic Systems." Micromachines 12, no. 2 (January 23, 2021): 118. http://dx.doi.org/10.3390/mi12020118.

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For the past two decades, many research groups have investigated new methods for reducing the size and cost of safe and arm-fire systems, while also improving their safety and reliability, through batch processing. Simultaneously, micro- and nanotechnology advancements regarding nanothermite materials have enabled the production of a key technological building block: pyrotechnical microsystems (pyroMEMS). This building block simply consists of microscale electric initiators with a thin thermite layer as the ignition charge. This microscale to millimeter-scale addressable pyroMEMS enables the integration of intelligence into centimeter-scale pyrotechnical systems. To illustrate this technological evolution, we hereby present the development of a smart infrared (IR) electronically controllable flare consisting of three distinct components: (1) a controllable pyrotechnical ejection block comprising three independently addressable small-scale propellers, all integrated into a one-piece molded and interconnected device, (2) a terminal function block comprising a structured IR pyrotechnical loaf coupled with a microinitiation stage integrating low-energy addressable pyroMEMS, and (3) a connected, autonomous, STANAG 4187 compliant, electronic sensor arming and firing block.

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Journal articles on the topic 'Sensor microsystems'

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