Relevant bibliographies by topics / Shear bond strength test

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Academic literature on the topic 'Shear bond strength test'

Author: Grafiati
Published: 4 June 2021
Last updated: 4 February 2022

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Journal articles on the topic "Shear bond strength test"

1

Habib, Syed Rashid, Salwa Bajunaid, Abdulrahman Almansour, et al. "Shear Bond Strength of Veneered Zirconia Repaired Using Various Methods and Adhesive Systems: A Comparative Study." Polymers 13, no. 6 (2021): 910. http://dx.doi.org/10.3390/polym13060910.

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The aim of the present study was to investigate the shear bond strength of five different repair methods and adhesive systems for zirconia (Zr) cores layered with feldspathic porcelain. Seventy-five Zr specimens (10 × 10 × 4 mm3) were prepared, sintered, layered with 2 × 10 × 10 mm3 of feldspathic porcelain, and fired. The ceramic was fractured, and the load recorded using a shear-bond test. Specimens were thermocycled and randomly divided into 5 groups (n = 15/group) based on the repair methods. Composite repair blocks with similar dimensions to the layered ceramic (2 × 10 × 10 mm3) were built according to each repair method. Shear bond strength testing of the specimens with composite built up was carried out using a universal testing machine (Instron®5960, Massachusetts, USA). The shear bond strengths of the adhesive interface between repaired composite and the Zr were recorded for all the test groups. The fractured specimens’ surfaces were examined under a scanning electron microscope (Jeol, Musashino, Akishima, Tokyo, Japan) for evaluation of the type of failure and surface characteristics. Shear bond strength of the veneered ceramic bonded to the Zr for all the test groups was non-significant (ANOVA, p = 0.062). Shear bond strength after the repair revealed significant differences (ANOVA, p = 0.002). Group-C (13.79 ± 1.32) and Group-D (9.77 ± 4.77) showed the highest and lowest shear bond strength values, respectively. Paired Sample T-tests showed significantly lower values (p = 0.000) for the repaired (composite) Zr compared to the layered (ceramic) Zr. Multiple comparisons revealed differences (significant) between the shear bond strength of Group-D with Groups A (p = 0.010) and C (p = 0.003, Post Hoc Tukey test). The repair methods tested showed variations in their respective shear bond strengths. Complete ceramic/zirconia repair systems showed better bonding between the repaired composite and Zr core. The mean shear bond strength for the repaired fractured layered Zr showed acceptable outcomes in terms of clinical perspective, but was, however, unpredictable.
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Manoharan, Subramani, Chandradip Patel, Stevan Hunter, and Patrick McCluskey. "Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (2017): 000068–73. http://dx.doi.org/10.4071/2380-4491.2017.hiten.68.

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Abstract Copper (Cu) wire bonding is now widely accepted as a replacement for gold (Au), however, its use in high reliability applications is limited due to early failures in high temperature and humid conditions. The Au to Cu wire transition is mainly driven by cost savings though there are other advantages to Cu such as better electrical and thermal conductivity, slower intermetallic compound (IMC) formation and reduced wire sweep during transfer molding. Some automotive, industrial and aerospace industries are still reluctant to adopt Cu wire bonded products due to perceived risks of wire and bond pad cracks, the potential for corrosion, and some lack of understanding about its reliability in harsh conditions. A wire bond is considered good if destructive sampling qualification tests and periodic monitors pass for the batch. Tests include wire pull strength, wire bond shear, IMC coverage, and thickness of bond pad aluminum (Al) remaining beneath the bond. Nondestructive inspections also verify acceptable ball diameter and Al “splash”. This paper focuses on the bond shear test and its contribution to Cu ball bond reliability assessment, especially when changing Al bond pad thickness. A new revision of the JEDEC Wire Bond Shear Test Method, JESD22-B116B, has just been released, to include Cu wirebonds for the first time. It helps to clarify shear test failure modes for Cu ball bonds. However, there are still questions to be answered through research and experimentation, especially to learn the extent to which one may predict Cu ball bond reliability based on shear test results. Pad Al thickness is not considered in the current industry standards for shear test. Yet bond pad Al thickness varies widely among semiconductor products. This research is intended to contribute toward improved industry standards. In this study, power and time bonding parameters along with bond pad thickness are studied for bond strength. Several wire bonds are created at different conditions, evaluated by optical microscope and SEM, IMC% coverage and bond shear strength. Similar bonding conditions are repeated for bond pads of 4um, 1um and 0.5um thickness.
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Park, Joo-Eon, Soo-Keun Kang, Deok-Bo Lee, and Nak-Sam Choi. "OS14-2-6 Analysis of Interfacial Shear Strength of Fiber/Epoxy Composites by Microdroplet-bond Test." Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2007.6 (2007): _OS14–2–6——_OS14–2–6—. http://dx.doi.org/10.1299/jsmeatem.2007.6._os14-2-6-.

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4

Tandon, Raghav, Sanjeev Maharjan, and Suraj Gautam. "Shear and tensile bond strengths of autoclaved aerated concrete (AAC) masonry with different mortar mixtures and thicknesses." Journal of Engineering Issues and Solutions 1, no. 1 (2021): 20–31. http://dx.doi.org/10.3126/joeis.v1i1.36814.

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Autoclaved aerated concrete (AAC) blocks are commonly used for masonry walls. In order to understand the strength of AAC masonry, it is essential to assess the tensile and shear bond strengths of the AAC block-mortar interface for various mortar combinations. This research investigates the bond strength of AAC block mortar interface made up of a) polymer modified mortar (PMM) and b) ordinary cement sand mortar of 1:4 or 1:6 ratio with thickness of 10mm, 15mm or 20mm. A thin cement slurry coating was applied on the block surface before placing the cement sand mortar in the masonry. For all types of interface, shear bond strength of masonry was studied using a triplet test, while the tensile bond strength was determined through a cross-couplet test. Among the cement sand mortar used in this study, cement sand mortar of ratio 1:4 and thickness 15mm showed the maximum shear strength of 0.13MPa with the failure of blocks as the predominant failure while the PMM had shear bond strength of 0.12MPa with the failure of blocks as the predominant failure type. However, in case of the tensile bond strength testing, PMM showed the tensile bond strength of 0.19MPa, which was highest among all the test specimens used in this study. Considering both the tensile and shear bond strengths of the AAC masonry and based on the observed failure pattern, among all the combinations used in the experiment, either PMM or cement-sand mortar of ratio 1:4 and thickness of 15mm can be chosen for the AAC masonry.
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5

Hammad, Ihab A., Richard J. Goodkind, and William W. Gerberich. "A shear test for the bond strength of ceramometals." Journal of Prosthetic Dentistry 58, no. 4 (1987): 431–37. http://dx.doi.org/10.1016/0022-3913(87)90270-8.

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6

Placido, Eliane, Josete B. C. Meira, Raul González Lima, Antonio Muench, Roberto Martins de Souza, and Rafael Yagüe Ballester. "Shear versus micro-shear bond strength test: A finite element stress analysis." Dental Materials 23, no. 9 (2007): 1086–92. http://dx.doi.org/10.1016/j.dental.2006.10.002.

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7

Irie, Masao, Yukinori Maruo, Goro Nishigawa, Kumiko Yoshihara, and Takuya Matsumoto. "Flexural Strength of Resin Core Build-Up Materials: Correlation to Root Dentin Shear Bond Strength and Pull-Out Force." Polymers 12, no. 12 (2020): 2947. http://dx.doi.org/10.3390/polym12122947.

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The aims of this study were to investigate the effects of root dentin shear bond strength and pull-out force of resin core build-up materials on flexural strength immediately after setting, after one-day water storage, and after 20,000 thermocycles. Eight core build-up and three luting materials were investigated, using 10 specimens (n = 10) per subgroup. At three time periods—immediately after setting, after one-day water storage, and after 20,000 thermocycles, shear bond strengths to root dentin and pull-out forces were measured. Flexural strengths were measured using a 3-point bending test. For all core build-up and luting materials, the mean data of flexural strength, shear bond strength and pull-out force were the lowest immediately after setting. After one-day storage, almost all the materials yielded their highest results. A weak, but statistically significant, correlation was found between flexural strength and shear bond strength (r = 0.508, p = 0.0026, n = 33). As the pull-out force increased, the flexural strength of core build-up materials also increased (r = 0.398, p = 0.0218, n = 33). Multiple linear regression analyses were conducted using these three independent factors of flexural strength, pull-out force and root dentin shear bond strength, which showed this relationship: Flexural strength = 3.264 × Shear bond strength + 1.533 × Pull out force + 10.870, p = 0.002). For all the 11 core build-up and luting materials investigated immediately after setting, after one-day storage and after 20,000 thermocycles, their shear bond strengths to root dentin and pull-out forces were correlated to the flexural strength in core build-up materials. It was concluded that the flexural strength results of the core build-up material be used in research and quality control for the predictor of the shear bond strength to the root dentin and the retentive force of the post.
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8

Anil, Sukumaran, Farouk Ahmed Hussein, Mohammed Ibrahim Hashem, and Elna P. Chalisserry. "The Impact of Chlorhexidine Mouth Rinse on the Bond Strength of Polycarbonate Orthodontic Brackets." Journal of Contemporary Dental Practice 15, no. 6 (2014): 688–92. http://dx.doi.org/10.5005/jp-journals-10024-1600.

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ABSTRACT Objective The purpose of the current in-vivo study was to assess the effect of using 0.12% chlorhexidine (CHX) mouth rinse, before bonding, on shear bond strength of polycarbonate brackets bonded with composite adhesive. Subjects and methods Eighteen orthodontic patients with a mean age 21.41 ± 1.2 years, who were scheduled to have 2 or more first premolars extracted, were included in this study. Patients were referred for an oral prophylaxis program which included, in part, the use of a mouth rinse. Patients were divided into 2 groups, a test group of 9 patients who used 0.12% CHX gluconate mouth rinse twice daily and a control group of 9 patients who used a mouth rinse without CHX, but with same color. After 1 week, polycarbonate brackets were bonded to first premolars with Transbond XT composite adhesive. Premolars were extracted after 28 days and tested for shear bond strength on a universal testing machine. Student's t-test was used to compare shear bond strengths of both groups. Results No statistically significant difference was found in bond strengths’ values between both groups. The test group (with CHX) has mean shear bond strength of 14.21 ± 2.42 MPa whereas the control group (without CHX) revealed a mean strength of 14.52 ± 2.31 MPa. Conclusion The use of 0.12% CHX mouth rinse, for one week before bonding, did not affect the shear bond strength of polycarbonate brackets bonded with Transbond composite. Furthermore, these brackets showed clinically acceptable bond strength. How to cite this article Hussein FA, Hashem MI, Chalisserry EP, Anil S. The Impact of Chlorhexidine Mouth Rinse on the Bond Strength of Polycarbonate Orthodontic Brackets. J Contemp Dent Pract 2014;15(6):688-692.
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9

Manoharan, Subramani, Chandradip Patel, Stevan Hunter, and Patrick McCluskey. "Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (2018): 000032–38. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000032.

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Abstract Copper (Cu) wire bond is used in a majority of microelectronic devices but has not been fully accepted by all industries due to potential reliability issues. Good quality bond is believed to provide high reliability. Shear strength and intermetallic (IMC) coverage are being used as indicators, however there is no developed model. High shear strength is a result of large IMC coverage laterally under the ball, but the reliability of the bond is also related to IMC longitudinal growth (thickness). This work involves studying effect of shear strength on reliability of a variety of experimental Cu ball bonds by performing temperature aging experiments on test devices, in QFN packages. The ball bonds are made by altering ultrasonic power and time to obtain different IMC coverage. All test packages are monitored for resistance change at specific intervals by performing four point resistance measurement. Resistance increase is analyzed with initial shear strength to determine whether “good quality” bonds always lead to high reliability.
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10

Sauli, Z., V. Retnasamy, W. M. W. Norhaimi, J. Adnan, and M. Palianysamy. "Wire Bond Shear Test Simulation on Hemispherical Surface Bond Pad." Advanced Materials Research 622-623 (December 2012): 643–46. http://dx.doi.org/10.4028/www.scientific.net/amr.622-623.643.

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Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this study, simulation on wire bond shear test is done to evaluate the stress response of the bonded wire when sheared on a hemispherical surface bond pad. The contrast between three types of wire material:gold(Au), aluminum(Al) and copper(Cu) were carry out to examine the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.
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