Relevant bibliographies by topics / Silicon etching, self alignment, polymer deposition

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Conference papers

Academic literature on the topic 'Silicon etching, self alignment, polymer deposition'

Author: Grafiati
Published: 30 June 2021
Last updated: 29 July 2025

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Silicon etching, self alignment, polymer deposition.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Silicon etching, self alignment, polymer deposition"

1

Potejanasak, Potejana, Masahiko Yoshino, and Motoki Terano. "Fabrication of Metallic Nanodot Arrays Using Nano-Chemical Stamping Technique with a Polymer Stamp." International Journal of Automation Technology 10, no. 5 (2016): 794–803. http://dx.doi.org/10.20965/ijat.2016.p0794.

Full text
Abstract:
The aim of this study is to develop metallic nanodot arrays with controlled morphology and alignment. To produce gold nanodot arrays with high throughput, the authors propose a new efficient fabrication process based on the templated thermal dewetting method, using a nano-chemical stamping technique with a polymer mold. This process comprises four steps: sputter etching on a quartz glass substrate, patterning of micrometer size by printing with acetone on the substrate by stamping with a polymer film stamp, deposition of a thin Au film on the substrate, and self-organization of the metal nanod
APA, Harvard, Vancouver, ISO, and other styles
2

Potejanasak, Potejana, Masahiko Yoshino, Motoki Terano, and Masahiro Mita. "Efficient Fabrication Process of Metal Nanodot Arrays Using Direct Nanoimprinting Method with a Polymer Mold." International Journal of Automation Technology 9, no. 6 (2015): 629–35. http://dx.doi.org/10.20965/ijat.2015.p0629.

Full text
Abstract:
A new fabrication process of metal nanodot arrays using the thermal dewetting method was developed in this study. This process was comprised of three steps: thin Au film deposition on a quartz glass substrate, groove patterning by direct nanoimprinting, and self-organization of metal nanodot arrays by thermal dewetting. A new idea to utilize a polymer film mold for groove patterning by direct nanoimprinting was examined. The polymer film mold was prepared by hot-embossing groove patterns of a mother mold on a cyclo olefin polymer (COP) film. The mother mold was prepared from a silicon wafer. T
APA, Harvard, Vancouver, ISO, and other styles
3

Gopalan, Padma, Stephanie Oliveras Santos, Songying (Frederick) Li, and Michael Scott Arnold. "(Invited) Designer Polymer Dispersants for Sorting, and Assembly of Carbon Nanotube Arrays." ECS Meeting Abstracts MA2023-01, no. 10 (2023): 1212. http://dx.doi.org/10.1149/ma2023-01101212mtgabs.

Full text
Abstract:
Conjugated polymers have been extensively utilized to isolate semiconducting single walled carbon nanotubes (s-CNTs) in organic solvents creating a high-purity s-CNT “ink”. To overcome inter-CNT π–π interactions to individualize and disaggregate s-CNTs, typically dispersing agents are necessary. Solution deposition of s-CNTs from these inks onto target substrates to create a monolayer of CNT arrays is actively being explored to fabricate FETs with superior performance compared to conventional silicon and gallium arsenide-based FETs. A wide range of deposition and alignment of s-CNTs on substra
APA, Harvard, Vancouver, ISO, and other styles
4

Montméat, Pierre, Thierry Enot, Alice Bond, Adele Thiolon, Emilie Bourjot, and Frank Fournel. "High Cleanliness and High Hydrophobic/Hydrophilic Contrast Done by Direct Wafer Bonding for Die-to-Wafer Self-Assembly." ECS Meeting Abstracts MA2023-02, no. 33 (2023): 1609. http://dx.doi.org/10.1149/ma2023-02331609mtgabs.

Full text
Abstract:
Die-to-wafer assembly is a promising technology for 3D-integration in terms of yield. However, it is difficult to combine high placement accuracy and high throughput with a pick and place process. To overcome these issues, self-assembly and collective transfer for die-to-wafer were proposed [1]. With the self-assembly technology, direct bonding is used for the assembly and the surface tension of liquid droplets drives the chips and precisely aligns them to predetermined assembly areas on carrier wafers. A good water containment on the bonding site is needed to ensure a precise alignment. It is
APA, Harvard, Vancouver, ISO, and other styles
5

Ponoth, Shom, Navnit Agarwal, Peter Persans, and Joel Plawsky. "Silicon CMOS BEOL Compatible Optical Waveguide Micro-mirrors." MRS Proceedings 744 (2002). http://dx.doi.org/10.1557/proc-744-m8.17.

Full text
Abstract:
ABSTRACTOptical waveguides are being explored for on-chip purposes to overcome the speed limitations of electrical interconnects. Passive optical components like waveguides and vertical outcouplers are important components in such schemes. In this study we fabricate planar waveguides with integrated vertical micro-mirrors using standard Back End of the Line silicon (BEOL) CMOS based processes. Around 1.6 μm of a hybrid alkoxy siloxane polymer with a refractive index of ∼ 1.50 at the intended wavelength of 830 nm is used as the core and plasma deposited silicon oxide with a refractive index of
APA, Harvard, Vancouver, ISO, and other styles
6

Borsa, Tomoko, and Bart Van Zeghbroeck. "Self-aligned Process for SiC Power Devices." MRS Proceedings 1246 (2010). http://dx.doi.org/10.1557/proc-1246-b06-05.

Full text
Abstract:
AbstractSilicon carbide is a semiconductor with desirable material properties, such as a wide bandgap and high thermal conductivity. It is an excellent material for constructing power switching devices operating in harsh environments where conventional semiconductors cannot adequately perform. One example of such a power device is a bipolar junction transistor (BJT). While the potential of the SiC BJT is recognized, appropriate techniques for producing devices is lacking due to its difficulty.For example, in order to achieve a high voltage 4H-SiC BJT switch with nanosecond switching time, the
APA, Harvard, Vancouver, ISO, and other styles
7

Ramanathan, Muruganathan, Seth B. Darling, Anirudha V. Sumant, and Orlando Auciello. "Self-Assembly of Cylinder-Forming Block Copolymers on Ultrananocrystalline Diamond (UNCD) Thin Films for Lithographic Applications." MRS Proceedings 1203 (2009). http://dx.doi.org/10.1557/proc-1203-j17-15.

Full text
Abstract:
AbstractBlock copolymers (BCPs) consist of two or more chemically distinct and incompatible polymer chains (or blocks) covalently bonded. Due to the incompatibility and connectivity constraints between the two blocks, diblock copolymers spontaneously self-assemble into microphase-separated nanoscale domains that exhibit ordered 0, 1, 2 or 3 dimensional morphologies at equilibrium. Commonly observed microdomain morphologies in bulk samples are periodic arrangements of lamellae, cylinders, or spheres. Block copolymer lithography refers to the use of these ordered structures in the form of thin f
APA, Harvard, Vancouver, ISO, and other styles
8

sprotocols. "Adhesive Micropatterns for Cells: A Microcontact Printing Protocol." December 30, 2014. https://doi.org/10.5281/zenodo.13592.

Full text
Abstract:
Authors: Manuel Théry and Matthieu Piel Corresponding authors ([manuel.thery@cea.fr](manuel.thery@cea.fr); [matthieu.piel@curie.fr](matthieu.piel@curie.fr)) ### INTRODUCTION This protocol describes a simple, fast, and efficient method for making adhesive micropatterns that can be used to control individual cell shape and adhesion patterns. It is based on the use of an elastomeric stamp containing microfeatures to print proteins on the substrate of choice. The process can be subdivided into three parts. First, a silicon master is fabricated, which contains the microfeatures of interest. Once fa
APA, Harvard, Vancouver, ISO, and other styles

Dissertations / Theses on the topic "Silicon etching, self alignment, polymer deposition"

1

Schutzeichel, Christopher. "A Novel Method for the Bottom-Up Microstructuring of Silicon and Patterning of Polymers." 2021. https://tud.qucosa.de/id/qucosa%3A75226.

Full text
Abstract:
The aim of this work was the development of a method for the generation of surface features on n-type silicon samples with deeply buried p-implants, in the form of heterogeneities aligned directly above the buried implants. This task was motivated by the realisation of a simpler process for the formation of superjunction transistors, which currently require the repeated creation of the same implantation structure over multiple steps of photolithography These lithography steps can be potentially replaced, if a suitable process for the self-alignment in accordance to the buried implants can be f
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Silicon etching, self alignment, polymer deposition"

1

Chen, Antao, Mehrdad Ziari, and William H. Steier. "Passive alignment of optic fiber array using silicon V-grooves monolithically integrated with polymer waveguide devices." In Organic Thin Films for Photonic Applications. Optica Publishing Group, 1997. http://dx.doi.org/10.1364/otfa.1997.the.21.

Full text
Abstract:
Packaging is the crucial link between a laboratory demonstrated device and a reliable component in a practical system. To achieve and maintain the sub-micron alignment tolerances between fiber and waveguide is the major factor that makes the packaging of photonic devices labor intensive, time consuming, and costly[1, 2]. Fiber arrays are important in WDM multiplexers and demultiplexers where multiple fiber attachment is essential. To avoid the complexity of the active alignment and attachment of individual fiber to each waveguide, we experimented with the passive alignment of fiber arrays with
APA, Harvard, Vancouver, ISO, and other styles
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography